FCCL Web Coater (Roll to Roll)

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    VTS  Sputter Roll Coater 

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    VTS ’s Web/Roll Systems for the Converting Industry are individually

     designed to meet each customer’s specific requirements.

    The system presented in this brochure allos the user to develop

    a process using state!of!the!art components and then go into

    production.VTS ’s multi!process high vacuum Web/Roll Coating system is designed

    to coat "olyimide #ilm$ %ylar$ foil and other thin plastic or metallicmaterials

    stored in continuous roll form.

    Typical process stations ithin the high vacuum chamber can include

    sputter sources$ electron beam guns$ thermal sources$ substrate heat$

    ion beam sources and "lasma "rocess &ar.

    VTS ’s Sputter Roll Coater

    Introduction

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      'WC!(() Sputter Roll Coater

    "roduct Information

    Technology

    &y 'WC!(()$ metals ill be deposited to one side of the film to form a multi! layer at high rate.

    Ion beam source is equipped ith gas inletsystem for argon and reactive gases.

    *quipment Technique%ulti!Chamber!System consisting of chambers forinding$ pretreatment$ coating$ intermediate pumping

    +ne coating drum to cool the film duringthe coating process

    Cooling/heating equipment for coating drum

    "ump equipment for short pump don ithturbomolecular pumps

    "re!treatment by Ion beam source 

    ,p to four standard -C magnetrons for

    metallic sputter processes

    *lectronically controlled inding system ith driving motors

    Technical -ata

    Substrate %aterial "lastic film "*T$ "I$ etc.0

    Roll diameter ma1. 2)mm

    Width up to (() mm

    Thic3ness 4(  to

    4)) #ilm Speed ).5 to ( %/min

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      6inear Ion &eam Source

    "roduct Information

    0 10 20 30 40 50 60 70

    0

    10

    20

    30

    40

    50

    60

    70

       C   u   r   r   e   n   t   D   e   n   s   i   t   y   (

       m   A   /   C   m   2   )

    Probe Position (Cm)

     120 sccm

     80 sccm

     40 sccm

    VTS ’s 6inear Ion &eam Source #eatures / &enefits

    7o #ilaments or 8rids

    Truly production Worthy!lo maintenance$no consumables$ lo cost

    Reactive gas compatible ! I.e.5))9 o1ygen 6o temperature

    +perates at %agnetron "ressures).5!(mTorr0

    Si:e #ree

    7o need for multiple poer supplies!hence easy integration

    ;igh *nergy

    ;igh Current -ensity

    Stability of &eam ,niformity 

    Current -ensity -istribution "rofile

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     -C magnetrons Sutter Source

    "roduct Information

    4 6 8 10 12 14 16 18 20 22

    0!4

    0!6

    0!8

    1!0

    1!2

    1!4

    1!6

    1!8

    2!0

    2!2

       C   u

       "   #   i   c   $   n   e   s   s   (

       )

    Po%er (&%)

    "oer vs -eposition Rate

    "osition vs -eposition Profile

    0 10 20 30 40 50 60

    0

    500

    1000

    1500

    2000

    2500

    3000

    3500

       C   u

       "   #   i   c   $   n   e   s   s   (

       )

    Position (Cm)

        Å

       ㎛

       /  m   i  n

    VTS ’s 6inear Sputter Source #eatures / &enefits

    Truly production Worthy!lo maintenance$ noconsumables$ lo cost

    6o temperature

    +perates at %agnetron "ressures).2! (mTorr0

    Si:e #ree

    ;igh "oer compatible

    ;igh -eposition Rate

    Stability of Coating ,niformity

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    PI film Tielayer  DepositionPretreatment Electro-Plating Patterning

    Web coating

    PRODUCTION PROCESS OF FCC

    Fine Pitch

    "olyimide#ilm 

    Copper 

      VTS ’s Technical -ata for #CC6

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      VTS ’s Technical -ata for #CC6

    ! "!"#

    "!"$

    "!"%

    !

    "!

    &!

    '!

    (!

    )!

    #!

    $!

    %!

    *!

    +as C

    +as ,

    +as -

     

       W   e   t   t   i   n   g   a   n

       g   l   e   ( 

       )

    Ion dose ( /cm2)

    0 1016

    1017

    1018

    40

    50

    60

    70

    80

    '0

    ()s C

    ()s *

    ()s A

     

       S  u  r   f  a  c  e   E  n  e  r  g  y

       (  m   N   /  m   )

    Ion Dose ( /cm2 )

    Wetting angle of polyimide ith various-oses by irradiated at ions

    Surface energy of polyimide ith various-oses by irradiated at ions

    Surface %odification of "olyimide film by  ATEC ’s 6inear Ion &eam Source

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    0 1016

    1017

    1018

    0

    20

    40

    60

    80

     

       W  e   t   t   i  n  g  a  n  g   l  e   .

           θ   /

    Ion Dose .0cm&/

      VTS ’s Technical -ata for #CC6

    0!0

    0!1

    0!2

    0!3

    0!4

    0!5

    0!6

    0!7

    0!8

    0!'

    ()s C

    ()s *

    ()s A

     

       ,   1   2  e  s   i  o  n  s   t  r  e  n  g   t   2   .   3  g   0  c  m

       /

    Wetting angle of polyimide ith different ioncurrent by irradiated at ions

    'dhesion strength ith different gases

    by irradiated at ions

    6o Current -ensity

    ;igh Current -ensity

    Surface %odification of "olyimide by  ATEC ’s 6inear Ion &eam Source

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      VTS ’s Technical -ata for #CC6

    Schematic draing of the polymeric repeat unitof "%-'+-'.

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      VTS ’s Technical -ata for #CC6

    S'% -ata of modified polyimide film by Ion &eam Source

    &y 8as ' > C

     By Gas A

    &y 8as C

    Ra4 Film

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      VTS ’s Technical -ata for #CC6

    1+16 1+17

    0!2

    0!3

    0!4

    0!5

    0!6

    0!7

    0!8

       P   e   e   ,   S   t   r   e   n   -   t   #

       (   &   -   .   /   C   m   )

    on Doses (Dose/Cm2)

     i-# Current Density

     o% Current Density

    "eel strength ith various doses 

    by

    irradiated at ions

    1+16 1+17

    0!2

    0!3

    0!4

    0!5

    0!6

    0!7

    0!8

       P   e   e   ,   S   t   r   e   n   -

       t   #

       (   &   -   .   /   C   m   )

    on Doses (Dose/Cm2)

     s C

     s A

    "eel strength ith various

    doses 

    by irradiated at ions

    Surface %odification of "olyimide film by Ion Source 

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      =TS’s Technical -ata for #CC6

    1+16 1+17

    0!05

    0!10

    0!15

    0!20

    0!25

    0!30

    0!35

       P   e   e   ,   S   t   r   e   n   -   t   #

       (   &   -   .   /   C   m   )

    on Doses (Dose/Cm2)

    Cu Thic3ness vs "eel Strength 

         ㎏

       f   /   ㎝

    ㎛0 2 4 6 8 10 12 14 16 18 20

    0!0

    0!2

    0!4

    0!6

    0!8

    1!0

    1!2

       P  e  e   ,   S   t  r  e  n  -   t   #

       (

       )

    Cu "#ic$ness ( )

    Curing Test 5() $ 5?2h0℃ 

    "eel strength ith various doses 

    byirradiated at ions

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    재 표

    면 

    &y 8as ' > C

    &y 8as C

    Pee, Stren-t#

    0

    1!2

    0!15

    0!3

    0!45

    0!6

    0!75

    0!'

    1!05

        S

        t   r   e

       s

       s

         (    $

       -

        .    /   c

       m

        ) 

    0 15020 40 60 80 100 120 140

    Stro$e (mm )

    1

    2

    3

    4

    Pee, Stren-t#

    0

    1!2

    0!15

    0!3

    0!45

    0!6

    0!75

    0!'

    1!05

        S

        t   r   e

       s

       s

         (    $

       -

        .

        /   c

       m

        ) 

    0 15020 40 60 80 100 120 140

    Stro$e (mm )

    1

    2

    3

    Pee, Stren-t#

    0

    1!2

    0!15

    0!3

    0!45

    0!6

    0!75

    0!'

    1!05

        S

        t   r   e

       s

       s

         (

        $

       -

        .    /   c

       m

        )

     

    0 15020 40   60 80 100 120 140

    Stro$e (mm)

    1

    2

    3

    Test Condition

    Sample Width @ ㎜

    Sample "osition @ %- C

    "I Thic3ness @ 2

    Cu Thic3ness @ A

    "eeling mode @ verticalA)B0

    "eeling Speed @ () ㎜  / min

     %ean @ ).2) 3gf/cm

     7ormal Temperature

    %ean @ ). 2 3gf/cm

    HCL Test

    KOH Test

    %ean @ ).A 3gf/cm

    Chemical Test

      VTS ’s Technical -ata for #CC6

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    재 표

    면 By Gas A

    &y 8as ' > C &y 8as C

     Conclusion

    VTS ’s Web/Roll Systems @ State!of!the!art *quipment

    VTS ’s 6inear Ion &eam Source @ ;igh Current -ensity  Stability of &eam ,niformity  Si:e #ree

    VTS ’s 6inear  -C %agnetron Sputter Source @ ;igh -eposition RateStability of Coating ,niformity

    Si:e #ree

    Surface %odification of "l by 8as C Ion @ ;igh Surface *nergy  #ast Surface %odification  ;igh "eel Strength Ion Source of ;igh Current -ensity @ ;igh Surface *nergy  ;igh "eel Strength

    Curing Test @ ).4 3gf/㎝

    Chemical Test @ ).2 3gf/㎝