FCCL Web Coater (Roll to Roll)
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Transcript of FCCL Web Coater (Roll to Roll)
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8/9/2019 FCCL Web Coater (Roll to Roll)
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VTS Sputter Roll Coater
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VTS ’s Web/Roll Systems for the Converting Industry are individually
designed to meet each customer’s specific requirements.
The system presented in this brochure allos the user to develop
a process using state!of!the!art components and then go into
production.VTS ’s multi!process high vacuum Web/Roll Coating system is designed
to coat "olyimide #ilm$ %ylar$ foil and other thin plastic or metallicmaterials
stored in continuous roll form.
Typical process stations ithin the high vacuum chamber can include
sputter sources$ electron beam guns$ thermal sources$ substrate heat$
ion beam sources and "lasma "rocess &ar.
VTS ’s Sputter Roll Coater
Introduction
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'WC!(() Sputter Roll Coater
"roduct Information
Technology
&y 'WC!(()$ metals ill be deposited to one side of the film to form a multi! layer at high rate.
Ion beam source is equipped ith gas inletsystem for argon and reactive gases.
*quipment Technique%ulti!Chamber!System consisting of chambers forinding$ pretreatment$ coating$ intermediate pumping
+ne coating drum to cool the film duringthe coating process
Cooling/heating equipment for coating drum
"ump equipment for short pump don ithturbomolecular pumps
"re!treatment by Ion beam source
,p to four standard -C magnetrons for
metallic sputter processes
*lectronically controlled inding system ith driving motors
Technical -ata
Substrate %aterial "lastic film "*T$ "I$ etc.0
Roll diameter ma1. 2)mm
Width up to (() mm
Thic3ness 4( to
4)) #ilm Speed ).5 to ( %/min
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6inear Ion &eam Source
"roduct Information
0 10 20 30 40 50 60 70
0
10
20
30
40
50
60
70
C u r r e n t D e n s i t y (
m A / C m 2 )
Probe Position (Cm)
120 sccm
80 sccm
40 sccm
VTS ’s 6inear Ion &eam Source #eatures / &enefits
7o #ilaments or 8rids
Truly production Worthy!lo maintenance$no consumables$ lo cost
Reactive gas compatible ! I.e.5))9 o1ygen 6o temperature
+perates at %agnetron "ressures).5!(mTorr0
Si:e #ree
7o need for multiple poer supplies!hence easy integration
;igh *nergy
;igh Current -ensity
Stability of &eam ,niformity
Current -ensity -istribution "rofile
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-C magnetrons Sutter Source
"roduct Information
4 6 8 10 12 14 16 18 20 22
0!4
0!6
0!8
1!0
1!2
1!4
1!6
1!8
2!0
2!2
C u
" # i c $ n e s s (
)
Po%er (&%)
"oer vs -eposition Rate
"osition vs -eposition Profile
0 10 20 30 40 50 60
0
500
1000
1500
2000
2500
3000
3500
C u
" # i c $ n e s s (
)
Position (Cm)
Å
㎛
/ m i n
VTS ’s 6inear Sputter Source #eatures / &enefits
Truly production Worthy!lo maintenance$ noconsumables$ lo cost
6o temperature
+perates at %agnetron "ressures).2! (mTorr0
Si:e #ree
;igh "oer compatible
;igh -eposition Rate
Stability of Coating ,niformity
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PI film Tielayer DepositionPretreatment Electro-Plating Patterning
Web coating
PRODUCTION PROCESS OF FCC
Fine Pitch
"olyimide#ilm
Copper
VTS ’s Technical -ata for #CC6
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VTS ’s Technical -ata for #CC6
! "!"#
"!"$
"!"%
!
"!
&!
'!
(!
)!
#!
$!
%!
*!
+as C
+as ,
+as -
W e t t i n g a n
g l e (
)
Ion dose ( /cm2)
0 1016
1017
1018
40
50
60
70
80
'0
()s C
()s *
()s A
S u r f a c e E n e r g y
( m N / m )
Ion Dose ( /cm2 )
Wetting angle of polyimide ith various-oses by irradiated at ions
Surface energy of polyimide ith various-oses by irradiated at ions
Surface %odification of "olyimide film by ATEC ’s 6inear Ion &eam Source
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0 1016
1017
1018
0
20
40
60
80
W e t t i n g a n g l e .
θ /
Ion Dose .0cm&/
VTS ’s Technical -ata for #CC6
0!0
0!1
0!2
0!3
0!4
0!5
0!6
0!7
0!8
0!'
()s C
()s *
()s A
, 1 2 e s i o n s t r e n g t 2 . 3 g 0 c m
/
Wetting angle of polyimide ith different ioncurrent by irradiated at ions
'dhesion strength ith different gases
by irradiated at ions
6o Current -ensity
;igh Current -ensity
Surface %odification of "olyimide by ATEC ’s 6inear Ion &eam Source
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VTS ’s Technical -ata for #CC6
Schematic draing of the polymeric repeat unitof "%-'+-'.
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VTS ’s Technical -ata for #CC6
S'% -ata of modified polyimide film by Ion &eam Source
&y 8as ' > C
By Gas A
&y 8as C
Ra4 Film
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VTS ’s Technical -ata for #CC6
1+16 1+17
0!2
0!3
0!4
0!5
0!6
0!7
0!8
P e e , S t r e n - t #
( & - . / C m )
on Doses (Dose/Cm2)
i-# Current Density
o% Current Density
"eel strength ith various doses
by
irradiated at ions
1+16 1+17
0!2
0!3
0!4
0!5
0!6
0!7
0!8
P e e , S t r e n -
t #
( & - . / C m )
on Doses (Dose/Cm2)
s C
s A
"eel strength ith various
doses
by irradiated at ions
Surface %odification of "olyimide film by Ion Source
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=TS’s Technical -ata for #CC6
1+16 1+17
0!05
0!10
0!15
0!20
0!25
0!30
0!35
P e e , S t r e n - t #
( & - . / C m )
on Doses (Dose/Cm2)
Cu Thic3ness vs "eel Strength
㎏
f / ㎝
㎛0 2 4 6 8 10 12 14 16 18 20
0!0
0!2
0!4
0!6
0!8
1!0
1!2
P e e , S t r e n - t #
(
)
Cu "#ic$ness ( )
Curing Test 5() $ 5?2h0℃
"eel strength ith various doses
byirradiated at ions
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재 표
면
&y 8as ' > C
&y 8as C
Pee, Stren-t#
0
1!2
0!15
0!3
0!45
0!6
0!75
0!'
1!05
S
t r e
s
s
( $
-
. / c
m
)
0 15020 40 60 80 100 120 140
Stro$e (mm )
1
2
3
4
Pee, Stren-t#
0
1!2
0!15
0!3
0!45
0!6
0!75
0!'
1!05
S
t r e
s
s
( $
-
.
/ c
m
)
0 15020 40 60 80 100 120 140
Stro$e (mm )
1
2
3
Pee, Stren-t#
0
1!2
0!15
0!3
0!45
0!6
0!75
0!'
1!05
S
t r e
s
s
(
$
-
. / c
m
)
0 15020 40 60 80 100 120 140
Stro$e (mm)
1
2
3
Test Condition
Sample Width @ ㎜
Sample "osition @ %- C
"I Thic3ness @ 2
Cu Thic3ness @ A
"eeling mode @ verticalA)B0
"eeling Speed @ () ㎜ / min
%ean @ ).2) 3gf/cm
7ormal Temperature
%ean @ ). 2 3gf/cm
HCL Test
KOH Test
%ean @ ).A 3gf/cm
Chemical Test
VTS ’s Technical -ata for #CC6
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재 표
면 By Gas A
&y 8as ' > C &y 8as C
Conclusion
VTS ’s Web/Roll Systems @ State!of!the!art *quipment
VTS ’s 6inear Ion &eam Source @ ;igh Current -ensity Stability of &eam ,niformity Si:e #ree
VTS ’s 6inear -C %agnetron Sputter Source @ ;igh -eposition RateStability of Coating ,niformity
Si:e #ree
Surface %odification of "l by 8as C Ion @ ;igh Surface *nergy #ast Surface %odification ;igh "eel Strength Ion Source of ;igh Current -ensity @ ;igh Surface *nergy ;igh "eel Strength
Curing Test @ ).4 3gf/㎝
Chemical Test @ ).2 3gf/㎝