F1C81 class2 - F1 Media · 2017-09-01 · Eeprom 1.2 Features ... F1C81 has a digital audio...

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F1C81

Specification and Datasheet

Confidential / Preliminary Documentation

Revision 1.3

F1media Co., Ltd.

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List of Contents 1. General

1.1 Overview

1.2 Features

1.3 Application

1.4 Pinout Diagram & Outline Size

1.5 Device Terminal Functions

1.6 Module Dimension

2. Characteristics

2.1 Electrical Characteristics

2.2 RF Characteristics

2.3 Power Consumption

3. Interface

3.1 UART interface

3.2 Audio interface

4. Application Schematic

4.1 1.8V Supply

4.2 2.7~3.3V Supply

5. PCB Layout

6. Reflow Temperature Profile

7. Revision History

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1. General

1.1 Overview

This specification covers Bluetooth module (class-2) which complies with Bluetooth specification version 4.0

/Bluetooth low energy and integrates RF & Baseband controller in small package. This Module has deployed

CSR’s BC08-ROM WLCSP chipset.

F1C81

RAM

ROM

MMU

Processor

2.4GHz Radio

I/O

Filter

XTAL

UART

SPI

PCM/I2S

VCC

Eeprom

1.2 Features

• Dual-mode Bluetooth / Bluetooth low energy

• Fully Qualified Bluetooth v4.0

• Full-speed Bluetooth Operation with Full piconet Support (Up to 7 Slaves)

• Scatternet Support

• Ultra Low Power Consumption

• Support for 802.11 Co-existence

• PCM/I2S digital audio interface

• High speed UART interface (up to 4Mbps)

• Flexible Supply Voltage : 1.8V supply or 2.7~3.3V range supply

• Standard HCI support

• Competitive Size : 8mm x 7mm x 1.45mm (W x L x H, with Shield CAN)

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1.3 Application

• Low-cost phones, Feature phones, Smart-phones

• Personal Digital Assistants (PDA)

• Portable media Players

1.4 Pinout Diagram

PIO[0]

PCM_CLK

UART_RTS

UART_CTS

PIO[9]

PIO[2]

UART_RX

UART_TX

SPI/PCM# SEL

SCL

PIO[1]

PIO[3]

GND

ANT

GND

RESETB

PIO[4]

VDD_PADS

PCM_SYNC

PCM_IN

PCM_OUT

WP

SDA

GND

NC

NC

VDD_1V8

VDD_3V3

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1.5 Device Terminal Functions

Pin No. Pin Name Pin Description

1 SCL EEPROM Clock (option) , Only F1C81E

2 PIO[1] Programmable Input / Output

3 PIO[3] Programmable Input / Output , Clock REQ In

4 GND Ground

5 ANT RF IN/OUT , Connection to Antenna

6 GND Ground

7 RESETB Reset. Active low , Power On Reset

8 PCM_OUT / SPI_MISO PCM synchronous data output /SPI data output

9 PCM_CLK / SPI_CLK PCM synchronous data clock/ SPI clock

10 PCM_IN / SPI_MOSI PCM synchronous data input /SPI data input

11 PCM_SYNC / SPI_CSB PCM synchronous data sync / SPI chip select, active low

12 PIO[0] Programmable Input / Output , 32KHz Sleep Clock In

13 VDD_PADS VDD_IO


15 SPI/#PCM SEL Select SPI or PCM , High = SPI / Low = PCM

16 UART_TX UART Data Output , Active High

17 UART_RX UART Data Input , Active High

18 PIO[2] Programmable Input / Output , Clock REQ Out


20 UART_CTS UART clear to send , Active Low

21 UART_RTS UART request to send , Active Low

22 VDD_3V3 VDD_3V3 Supply

23 VDD_1V8 VDD_1V8 Supply

24 NC NC

25 NC NC

26 GND Ground

27 SDA EEPROM Data (option) , Only F1C81E

28 WP EEPROM Write protect (option) , Only F1C81E

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1.6 Module Dimension

1. Top View (mm)

2. Side View (mm)

P C B

Filter

7

8

1.10.40.8

0.4

0.8

1.6

CSR

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3

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5

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3.3

4

4.3

0.7

0.7

SHIELD CAN

1.45±0.05

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2. Characteristics

2.1 Electrical Characteristics

Absolute Maximum Ratings

Rating MIN MAX

Storage temperature -40°C 85°C

Max Junction Temperature(Tjmax)¹ 115°C

Supply voltage (VDD_3V3) 2.3V 4.8V


I/O voltage (VDD_PADS) 1.7V 3.6V

Other terminal voltages VSS-0.4V VCC+0.4V

1. Condition : On a 4 layer PCB

Recommended Operating Conditions

Operating Condition MIN MAX

Operating temperature range -30°C 85°C

Theta JA (θJA)¹ 83°C



I/O voltage (VDD_PADS) 1.7V 3.6V

RESETB VDD_PADS VDD_HOST

1. Condition : On a 4 layer PCB

2.2 RF Characteristics

Transmitter

Specification Condition MIN TYP MAX UNIT

Output transmit power Normal -6 2 8 dBm

Transmit power density Normal 4 dBm

Transmit power control Normal 2 8 dBm

Frequency Range Normal 2400 2483.5 MHz

20dB bandwidth for modulated carrier Normal 850 1000 KHz

Adjacent channel transmit power ±2MHz -20 dBm

8

±3MHz

±4MHz

-40

-40

Modulation Characteristics

f1avg

f2max

f2avg / f1avg

140

115

175

80

KHz

KHz

%

Initial carrier frequency tolerance Normal -20 20 KHz

Carrier frequency Drift

One slot packet(DH1)

Three slot packet(DH3)

Five slot packet(DH5)

-25

-40

-40

25

40

40

KHz

Transceiver


Adjacent channel transmit power

30MHz ~ 1GHz

1GHz ~12.75GHz

1.8GHz ~5.1GHz

5.1GHz ~5.3GHz

-36

-30

-47

-47

dBm

Receiver


Sensitivity level (0.1% BER) Single slot packets -70 -83 dBm

Transmit power density Multi slot packet -70 -80 dBm

C/I performance

co-channel

1MHz

(Adjacent channel)

2MHz

(2nd Adjacent channel)

3MHz

(3rd Adjacent channel)

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0

-30

-40

dB

Blocking performance

30MHz ~ 2000MHz

2000MHz ~ 2400MHz

2500MHz ~ 3000MHz

3000MHz ~ 12.75GHz

-10

-27

-27

-10

dBm

Intermodulation performance n=5 -39 dBm

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Maximum input level -20 -10 dBm

2.3 Power Consumption

Power Consumption is affected by the Host.

Link State Power Consumption Profile

ACL 20mA Under A2DP,SPP,MAP,OBEX etc

SCO 37mA Under HFP

No Connection , Ready 2mA Under

Connection , Ready 3mA Under

No Connection , Sleep 200uA Under

3. Interface

3.1 UART interface

Four signals are used to implement the UART function.

UART_TX and UART_RX transfer data between the two devices. The remaining two signals, UART_CTS

and UART_RTS, can be used to implement RS232 hardware flow control where both are active low

indicators.

HOST_RX

HOST_TX

HOST_CTS

HOST_RTS

HOST

UART_RX

UART_TX

UART_CTS

UART_RTS

F1C81

3.1.1 UART Setting User can change data format the following selection using PSKEY.

However, host shall communicate with default setting UART connection initiated at first time.

Baud Rate = (PSKEY_UART_BAUD_RATE) / 0.004096

Parameter Possible value

Baud Rate 9600 ~ 4M Baud

Flow Control None

Parity None, Odd or Even

Number of Stop Bits 1 or 2

Bits per channel 8

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3.2 Audio Interfaces

F1C81 has a digital audio interface that is configurable as either a PCM or I2S.

3.2.1 PCM Interface - Continuous transmission and reception of PCM encoded audio data over Bluetooth

- Processor overhead reduction through hardware support for continual transmission and reception of

PCM data

- PCM interface master, generating PCM_SYNC and PCM_CLK

- PCM interface slave, accepting externally generated PCM_SYNC and PCM_CLK

- Various clock formats including :

. Long Frame Sync

. Short Frame Sync

. GCI timing environments

- 13-bit or 16-bit linear, 8-bit u-law or A-law companded sample formats

- Receives and transmits on any selection of 3 of the first 4 slots following PCM_SYNC

3.2.2 I2S Interface The digital audio interface supports the industry standard formats for I2S, left-justified or right-justified. The

interface shares the same pins as the PCM interface, which means each audio bus is mutually exclusive in

its usage.

PCM Interface I2S Interface

PCM_OUT SD_OUT

PCM_IN SD_IN

PCM_SYNC WS

PCM_CLK SCK

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4. Application Schematic

4.1 1.8V Supply

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4.2 2.7~3.3V Supply

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5. PCB Layout

1. Top View (mm)7

8

1.10.40.8

0.4

0.8

1.6

5

3.3

4

4.3

1

2

3

4

5

6

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1.0

1.0

0.7

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6. Reflow Temperature Profile Recommended solder reflow profile are shown in below and follow the lead-free profile in accordance with

JEDEC Std 20C. Table lists the critical reflow temperatures. Flux residue remaining from board assembly

can contribute to electrochemical migration (ECM) over time. This depends on a number of factors, including

flux type, amount of flux residue remaining after reflow, and stress conditions during product use, such as

temperature, humidity, and potential difference between pins. Care should be taken in selecting production

board/module assembly processes and materials, taking into account these factors.

Tem

pera

ture

(deg

ree)

260℃ MAX.10sec.MAX

Pre-Heating150~200℃120sec.MAX

60 sec.MAX Above 220℃

220

200

150

Time

Process Step Lead-Free Solder

Pre-Heat 150~200°C

Pre-Heat Time MAX 120 sec.

Time above liquidus Above +220°C. MAX 60 sec

Peak temperature MAX +260°C

Time within 5°C of peak temperature MAX 10 sec

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7. Revision History

Revision Date Change Descriptions Issued by

Rev 1.0 2012-10-08 Initial release S.J.LEE

Rev 1.1 2013-09-23

Model Name Change(F1C80⇒F1C81)

Electrical Characteristic

Module Layout & Description

J.M.KWON

Rev 1.2 2013-10-29 TX Power ,RX Sensitivity Change.

Power Consumption Add J.M.KWON

Rev1.3 2013-11-26 Junction Temperature Add J.M.KWON

F1C81 class2 - F1 Media · 2017-09-01 · Eeprom 1.2 Features ... F1C81 has a digital audio...

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