Extending Synchrotron X-ray Microscopy to the Laboratory X ... · Cu Post on Die. with Solder. 100...

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Dr. Mohsen Samadi Khoshkhoo Carl Zeiss Microscopy GmbH Extending Synchrotron X-ray Microscopy to the Laboratory X-Ray Microscopy as a correlative imaging technique

Transcript of Extending Synchrotron X-ray Microscopy to the Laboratory X ... · Cu Post on Die. with Solder. 100...

Page 1: Extending Synchrotron X-ray Microscopy to the Laboratory X ... · Cu Post on Die. with Solder. 100 µm. Electronics Example: Processor Module in Cell Phone ... Utilizes white/polychromatic

Dr. Mohsen Samadi KhoshkhooCarl Zeiss Microscopy GmbH

Extending Synchrotron X-ray Microscopy to the LaboratoryX-Ray Microscopy as a correlative imaging technique

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Outline

3D X-ray Microscopy What is a 3D XRM? Architectures: Submicron:

ZEISS VersaXRM Nanoscale:

ZEISS UltraXRM

XRM Applications Materials Science

Merkle & Gelb, Microscopy Today, March 2013

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World’s Largest Installed Base of Synchrotron 3D Microscopes

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Broad portfolio of X-Ray imaging technologies

Synchrotron Source Products

Res down to ~30 nm

Full field tomography

Cryo tomography

STXM

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Tomography in 3D X-ray Microscopy: How it Works

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Projektions

2D Slice Views

Objective

Scintillator

Camera

Source Sample

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ZEISSA complete 3D-Microscopy portfolio

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Resolution [m]10-3 10-4 10-5 10-6 10-7 10-8

sam

ple

size

[m]

1

10-1

10-2

10-3

10-4

10-5

10-6

Xradia Ultra

Xradia VersaSub-micron 3D X-ray Microscope

Nanoscale3D X-ray Microscope

10-9

10-7HIM

micron nanometer

micron

mm

MetrotomX-ray CT

Cross-BeamAURIGA

ORION Nanofab

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ZEISS Xradia Versa – What’s Unique?

Projection based architecture Resolution degrades substantially as the

sample moves away from the source large detector pixel

Two-Stage Magnification for unprecedented Resolution and Contrast High resolution is maintained

as sample moves away from the source

Conventional MicroCT Xradia Versa Family

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Polymer Composites - VersaXRM

200 µm

Polymer composite fiber bundle defects at 40X

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Working Distance Defined

Working distance increases as sample size increases

DetectorSource

Sample

Working Distance

Sample

Traditional CT / µCT architecture (non-XRM):

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0

2

4

6

8

10

12

14

0 10 20 30 40 50

Res

olut

ion

(µm

)

Geometric Mag Based MicroCTs

Resolution rapidly degrades with increasing sample size

Working Distance (mm) Source to center of sample rotation

High Res

Low

Res

ZEISS Xradia Versa

25 mm

XRM Maintains High Resolution at Large Working Distances

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Polymer Foams – In Situ compression

B. Patterson, LANL, M&A March 2012

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Scout and ZoomLocal (interior) Tomography

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Macro

10x

4x

20x

Measurement at varying length scales through Interior Tomography

Macro-70

<1 µm imaging on 10 mm sampleMicroporosity & microfractures

between grains

40X

4X

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Conventional CT

http://blogs.sun.ac.za/ctscanner/sample-size-vs-resolution-example/

12Carl Zeiss Microscopy

100 µm vox50 µm vox 5 µm vox

1 µm vox

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40 µm/voxel

XRM

13Carl Zeiss Microscopy

9.5 µm/voxel2.2 µm/voxel

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ZEISS Xradia 510 Versa Flexible Source – Detector Positioning

Positioning for Absorption Contrast

Positioning for Absorption andPropagation Phase Contrast

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ZEISS Xradia Versa: Tunable Propagation Phase Contrast

Phase Contrast Refraction rather than absorption Phase shift related to refractive

index

VersaXRM Design Small detector pixels (0.34 µm

on 40X) to capture fringes Both source and detector have large

travel lengths to maximize fringe

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Imaging low-Z or similarly dense materials:Propagation Phase Contrast vs. Absorption

Al-Si AlloyPhase contrast mode highlights interfaces, revealing details not present in absorption image

Absorption Absorption + Phase

Al/Si sample courtesy of A. Shahani and P. Voorhees ( Northwestern University)

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Adjust energy for each scan: Automated Filter Changer

Select energy produced by source Spectrum from source is broad band Range is 30 kV 160 kV User selects source energy from this range

Automated Filter Changer Filters selectively tune energy bands from

the broad band source Auto filter wheel allows users to select filters

directly from the scan recipe

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Single Energy Tomography

Example:Al and Si are very difficult to distinguish from one another in single scan

VersaXRM-520

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Compositional Contrast Process Flow Example

Scan #1 – High Energy

Scan #2 – Low Energy

Dual Energy Scans

Dual Scan Contrast Visualizer (DSCoVer)

Both scans combined into one using easy, interactive user interface

Both scans combined together

Aluminum (green)

Silicon (Red)

Aluminum separated from Silicon

VersaXRM-520

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Better imaging for flat samples: HART

What Optimized imaging mode for

high-aspect ratio samples / features

Value Up to 50% higher throughput

for Semi-type high aspect ratio samples with equivalent detectability

How Angle dependent (non-uniform )

projection spacing More densely spaced projections

along long views Less densely spaced projections

along normal view

Tomography without HART: uniformly spaced projections

HART projection spacing and density optimized for feature-rich short side

VersaXRM-520

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Xradia Versa with FPXOverview

FPX – Flat Panel ExtensionCZXRM has developed a world-class flat panel system for the Xradia 5XX Versa.FPX combines MicroCT with RaaD™, offering the best of both technologies in one system

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Xradia VersaFPX and RaaD™ systems

FPXRaaD

Versa RaaD™2-Stage X-Ray Microscopy

FPXmicroCT

FPX: “Scout”Image large samples

with speed

RaaD™: “Zoom”Image with highest

resolution

Xradia Versa with FPXAll-in-one imaging

solution

Xradia Versa interior

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Xradia Versa with FPXEnable solutions that require range

FPX – Enhancing “Scout-and-Zoom” workflowFast, large FOV imaging with FPX enables a broadened, more efficient multi-scale workflow in combination with RaaD™

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4x “Zoom”Versa RaaD™

FPX “Scout”Find regions of interest (ROI)

20x “Zoom”Versa RaaD™

Xradia Versa with FPX

ROI

ROI

ROI

ROI

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Packaging/Assembly – Large Scale Assembly to Small Scale Defects

Mobile phone battery imaged in 3D with 520 Versa (FPX option) without sectioning or opening the package.

Results showed more cracks in the bent regions (fold of jelly roll) than in the straight regions (middle of battery), suspected to be due to high tensile stresses in those positions.

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Hockey stick - Fiber Reinforced Composite“Scout-and-Zoom” workflow for defects

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Extend Versa Scout-and-Zoom workflow to examine damage over multiple length scales down to crack and fiber geometry without sectioning hockey stick

Quickly Scout with FPX

100 µm

0.4X

Zoom with Multiple Objectives

4X

100 µm

2 µm

4 µm

Now available as an Applications Note

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Catalytic ConverterVersa FPX now accommodating larger samples in FOV

Carl Zeiss Microscopy

Scout: Larger sample imaged in FPX using multiple FFOV scans Zoom: Interior tomography imaged of

ceramic monolith (40 mm diameter) without sectioning steel casing Non-destructive

5 mm

114 mm

184

mm

InteriorTomography

Catalytic Converter

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Image Your Electronic Devices or Components:FPX Option Allows Large Field of View and Fast Scans

Electronics Board to Module to Package to Interconnect Motherboard for phone with one workflow on package Three important modules in phones today Processor module Battery module Camera module

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600 µm

Processor

Camera

1 cmBattery

FPX: Complete Smartphone

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Scout and Zoom Workflow Examples

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1 cm

Survey (Scout) Scan High Resolution RaaD (Zoom) Scans

FPX Scout Scan ROI RaaD Scan

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Cu Post on Diewith Solder

100 µm

Electronics Example: Processor Module in Cell PhoneScout and Zoom Offers Enhanced Flexibility and Quality

28Carl Zeiss Microscopy

Step 1: FPX Scout Image

Step 2: Zoom with RaaDInterconnect Image (1.6 µm/voxel)

Solder (die side)

Step 3: Analyze Interconnect Quality withRaaD: Virtual Planar Cross Sections

Cu Pad (substrate)

1 mm

100 µm

100 µm

100 µm

1 mm

Module Image

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Uniquely enabled by ZEISS X-ray Microscopes Utilizes white/polychromatic divergent X-ray beam Configured in Laue focusing geometry Specialized apertures, beam stop, and dedicated detector LabDCT recipes integrated in Scout-and-Scan Available as optional module for Xradia 520 Versa

LabDCT1. Acquisition on Xradia 520 Versa

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Xradia 520 Versa

Patent Pending

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Laboratory Diffraction Contrast Tomography (DCT)ZEISS Xradia 520 Versa

Bringing synchrotron technology to the laboratory 3D crystallographic information

obtained on a laboratory XRM (ZEISS Xradia 520 Versa) Turns non-destructive 3D grain

mapping into a routine tool. Enables extended evolution

(‘4D’) experiments impractical at the synchrotron

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Lab-DCT reconstruction of grain positions and orientations of over 500 Ti-grains. Grain orientation and center of mass shown.

200 µm

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Application Case Sintered copper spheres

Material CopperGrain size 50-150 micronSpace group 225 (Fm-3m) #grains 176

Sample description:

31Carl Zeiss X-ray Microscopy - LabDCT

In collaboration with the University of Manchester

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ZEISS Xradia Ultra 810: 3D X-ray Microscope using X-ray Optics

High brightness x-ray source (5.4 kV)High efficiency condenserHigh-resolution objective zone plateZernike phase contrast opticsPrecision tomography system

50 nm spatial (16 nm pixel) resolution 50 nm

X-ray Source Capillary condenserSample Objective

(Zone Plate)Phase Ring(Zernike)

Detector (CCD)

Mode Mag 2D Res Field of View

Large Field of View 200X 150 nm 65 µm x 65 µm

High Resolution 800X 50 nm 15 µm x 15 µm

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In the past, nanoscale 3D X-ray imaging was only available at the synchrotron Resolution of most instruments are micro scale,

typically lower res than Versa family (albeit faster) Select few have nanofocus architecture, featuring res

down to 30 nm (Xradia only commercial supplier)• With ZEISS Xradia Ultra, near-”nanofocus synchrotron” resolution

and image quality is available in a lab based instrument

What does Synchrotron capability mean?

Xradia UltraSSRL

Synchrotron

Xradia Ultra Laboratory Microscope

30nm lines and spaces

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Materials Science Examples

Batteries/Fuel Cells Ceramics

Glass

Composites

Coatings

Polymers

MetalsSuperoconductors

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Multiphase Polymer

The sample was mounted on an Aluminum rod and placed in a standard pin vice holder.

Carl Zeiss Microscopy

Scan Voxel size (µm)

FOV (mm) Energy/Power(kV/w)

Total scan time (Hrs.)

3-phasepolymer

2.4 2.4 x 2.4 40/3 2

Interface 1 1 1 x 1 40/3 3

Interface 2 1 1 x 1 40/3 3

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Multiphase Polymer

Sample Name Scan Objectives Results3 phase polymer Observe 3 phases and

each interface. Calculate particle size distributions of each phase and volume content.

Successfully imaged and identified interfacesand different sized particles in each phase, using 1 µm voxel resolution scans.

Carl Zeiss Microscopy

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Image on the left shows reconstructed 2D slices. Each of the quadrants represents a different orthogonal virtual slice.

YZXY

XZScanned area shown in red

2.4 mm

Multiphase PolymerLow Resolution Scan

Carl Zeiss Microscopy

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Orthogonal slices of the sample, showing interface and different sized particles. Top layer is EDPM (ethylene propylene diene monomer) rubber with some hydroxyl-terminated polybutadiene (HTPB) and a small amount of toluene diisocyanate (TDI) as curing agent. Bottom layer (polyurethane) consists of the filler and metal oxides

XZ

YZ

Scanned area shown in red

1 mm

Multiphase PolymerHigh Resolution Scan

Carl Zeiss Microscopy

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ZEISS Xradia Versa XRM: 3D Imaging and Printing of Biomimetic Shark Skin

Wen, et al. Biomimetic shark skin: design, fabrication and hydrodynamic function, J. Exp. Bio., 217,1656, 2014.ZEISS EVO SEM of 3D Printed Denticles

ZEISS Xradia Versa 3D Rendered Image

• 3D model of shark skin denticles was constructed using ZEISS Xradia Versa of shortfin mako (Isurusoxyrinchus)

• High resolution XRM dataset inputed into 3D printer to fabricate arrayed model (12X-scale)

• Biomimetic skin underwent hydrodynamic testing to exploring effects of denticle surface roughness

• XRM part of first study to design, fabricate and test synthetic shark membrane

XRM Dataset used as realistic CAD input to 3D Printer

Carl Zeiss Microscopy

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Polymeric materials with engineered pore structures are useful as catalyst support and biomedical scaffolds, but are challenging to fabricate. Sai et al. discovered a simple way to make a ‘hierarchical structure’ – having both large

several micron-sized and ~tens of nanometer-sized pores. ZEISS Xradia 500 Versa was used non-destructively (“requires no alteration to

sample”) and for quantitative 3D network analysis: polymer (blue)and pores (red).

ZEISS Xradia Versa: Imaging and Quantifying Hierarchical Porous Polymers for Biomedical Scaffolds

Carl Zeiss Microscopy

Sai, H. et al. Hierarchical Porous Polymer Scaffolds from Block Copolymers. Science 341, 530–534 (2013).

Weisman Group, Cornell University

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ZEISS Xradia Ultra: 3D-Ordered Macroporous Materials by Colloidal Crystal Templating

H. He, K. Matyjaszewski, et al., Advanced Functional Materials, 23, 4720–4728, (2013)

Carl Zeiss Microscopy

• Novel functional 3DOM polymeric structures for CO2 capture are prepared by colloidal crystals templating thru inexpensive/rapid preparation

• “…this demonstration showed the feasibility of using nanoscale 3D XRM for the visualization of the 3D morphology of 3DOM materials down to 50 nm resolution (16 nm voxels), representing up to three orders of magnitude improved resolution from the previous micro-CT experiments.”

2 µm

DOI:10.1002/adfm.201300401

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• Nanofiltration membrane imaged with ZEISS Xradia Ultra 810 using Zernike phase contrast (64 nm voxel) XRM visualized the different layers

of the membrane: interpenetrating small fiber layer, fibrous backing and interface region

Smallfibers

Sample Courtesy of ITRI

ZEISS Xradia 810 Ultra:Nanofiltration Membrane for Water

Carl Zeiss Microscopy

Large fibrous backing

50 nm resolution

150 nm resolution

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ZEISS Xradia Ultra: Imaging and Analysis of Electrical Trees

Carl Zeiss Microscopy

Schurch, R. et al., Imaging and Analysis Techniques for Electrical Trees using X-ray Computed Tomography. IEEE Transactions on Dielectrics and Electrical Insulation Vol. 21, No. 1; February 2014

Electrical treeing is one of the main mechanisms of degradation in polymeric high voltage insulation, a precursor of power equipment failure Previously used methods for the characterization of electrical trees include optical

microscopy, SEM, TEM, Ultrasound, NMR and others Schurch et al. used ZEISS Xradia Ultra and nanoXCT to acquire high resolution

3D datasets. Subsequent quantitative analysis of tree diameter, tortuosity, volume and other parameters was performed. High resolution, non-destructive XRM provides “new valuable information” and

“is expected to enable a deeper understanding of electrical treeing phenomenon”

DOI:10.1109/TDEI.2014.6740725

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EB-TBC: Buckled Coating Failure

Versa: Non invasive 2D and 3D imaging of delamination @ 0.7 um voxel resolution

White light image

50 µm

delamination

Sample courtesy of Dongming Zhu, NASA GRC

Lau et al, ICACC 2010

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DOI:10.1016/j.scriptamat.2014.10.026

University of Connecticut

XRM virtual cross section

Segmentation and visualization of individual cracks

Quantification of crack geometry

100 μm

Versa XRM used to nondestructively observe cracks in dense ceramic TBC layers at sub-micronresolution with good contrast between cracks, top coat, bond coat, TGO, and substrate layers Results reveal crack size, shape, aspect ratio, opening width,

and position with respect to bond coat surface Discovered linkage of multiple cracks and preferential crack orientation

Carl Zeiss Microscopy

ZEISS Xradia Versa:Characterizing Cracks in Thermal Barrier Coatings (TBC)Ahmadian, S. et al. Scripta Materialia 97, 13-16 (2015)

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YSZLFOV and HRES Data Registration

The 3D rendering below shows HRES and LFOV absorption data sets overlaid onto each other. The yellow boxes show the extent of the two data sets, with the LFOV data clipped away to reveal the HRES data.

Carl Zeiss Microscopy

Visual SI Advanced software by ORS provides tools for registering and manipulating multiple data sets.

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In Situ Experiments:Corrosion (Temperature/Humidity-Induced)

Versa at 1 um voxel

Type 304L Wire

+ MgCl2 Spray

80 mm diameter in situ corrosion chamber. 500 µm wire exposed to 40ºC / 30% relative humidity for atmospheric induced SCC (stress corrosion cracking)

Source: Dirk Engelberg, University of Manchester

3D crack pathsegmentation

IN SITU

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Commercial 18650 BatteryFull Battery Inspection

Specimen imaged non-destructivelywith 520 Versa XRM.

The XRM technique allows specimens to be imaged intact, providing high-resolution data without sectioning.

Workflow: Inspect the specimens Identify regions for higher

resolution analysis Drive the microscope

to enlarge those regions

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Defects Observed After 100 Charge CyclesCommercial 18650 Li-Ion Battery Cell Cathode1.8 μm Voxel Size

Pristine Cycled 100xSame Battery

Non-destructive imaging with 520 Versa XRM

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Laser Weldsin situ tension testing and evolution experiment

Deben CT5000-TECLoad stage

Sample courtesy of Sandia National Lab

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4D Measurement of Cracks in Ti-SiC

The morphology of the crack at Kmax at various crack growth stages.

with Permission from Withers, et al.

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Correlative Imaging – An ultimative Workflow

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15 µm

Al-Cu Eutectic AlloyMulti-scale XRM to SEM Workflow

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XRM:- Quantify microstructure evolution in 3D

over time (4D) - Non-destructive identifcation of buried ROI

EDS MappingBlue – Cu-richRed – Al-rich

FIB-SEM: - Confirm dendritic fine structure with

nanometer-resolution- Analytical evaluation (EDS, EBSD)

25 µm

15 µm 3D-reconstruction

Xradia 520 Versa Xradia 810 Ultra AURIGA FIB-SEM

Sample courtesy of B. Patterson, LANL

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XRM Reconstruction reveals several areas with an unexpected high specific mass

54Materials Research Institute Aalen2015

Detail of Position 1Detail of Position 2

Correlative examination of position 1 and 2

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Correlative examination of e.g. position 1 reveals agglomerated grains containing Lanthanum

55Materials Research Institute Aalen2015

2 µm2 µm 2 µm Mn La

10 µm100 µm

EsBIn-lens

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ZEISS X-ray Microscopy Core Advantages

Highest resolution• Versus any Micro/nanoCT• At largest working

distance (RaaD™)• Unique < 50nm spatial res

Highest contrast • Unique detector design• Unique phase contrast

imaging • Unique dual energy

Non-destructive• Image same sample

multiple times

Not compressed

Compressed

Mouse Brain

Core Advantages

Enables

SCOUT & ZOOM: Switchable magnifications on the VersaXRM

In Situ & 4D: Highest res for in situ due to RaaD™

Correlative Multi-scale Scout and Zoom to FIB

Unique ModalitiesUltraXRM

50 nm line space

Page 57: Extending Synchrotron X-ray Microscopy to the Laboratory X ... · Cu Post on Die. with Solder. 100 µm. Electronics Example: Processor Module in Cell Phone ... Utilizes white/polychromatic