Expert™

Elemental ScientificICP | ICPMS | AA

Specifications

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Expert SpecificationsEXP-Auto – Basic SystemMain frame material Steel frame with anti-corrosion coatingPanel Transparent PVC windows, steel panels with anti-corrosion coating, PVC doorsAlarm tower 4 colors (Red, Yellow, Green, Blue)Emergency switch 3 EMOs on the three different sides of the ExpertTeflon media ULPA filter ULPAfilterwithClass1environment,adjustableairflow

Wafer Transfer Robot With Mapping Sensor Wafer size :6”,8”,and12” Mapping sensor : Two cassettes (For 6” and 8” cassette option) Movement range : • R axis 470 mm (excluding end effector) • T axis 370 degree (±185degreefromhomeposition) • W axis 370 degree (±185degreefromhomeposition) • Z axis 380 mm Accuracy : X-Y(±0.1mm),Z(±0.05mm) Wafer holding : Vacuum chuck

Aligner Module Wafer size :6”,8”,and12” Accuracy : • Centering±0.035mm • Rotation±0.05degree Wafer holding : PEEK holder with vacuumchuck

Sample Rack Number of racks : • Tworacks(AandB)canbeset.

Eachrackhas40vialpositions for2mLvials.(withtheAutoVialWash option,adifferentconfigurationisused)

VPD Chamber With HF Generation Module Material : PTFE and PC window Size : 350(W)x100(H)x350(D)(mm3) Volume :8.5L Wafer holding : PEEK pin Door :PTFEdoorwithairtightseal,closedby pneumaticcylinder VPD duration : TimeorEPD(EPDisanoption) HF leak detector :>0.5ppm HF solution tank : 1,000mLPFAbottle(When EXP-CSoptionisused,HFwillbedirectly supplied from a user’s FAB) HF vapor generator :PFAmicro-flownebulizer andPVDFspraychamber Ventilation :CombinationofN2gaspurgeandventilation MFC : • N2(PFAnebulizer):3SLPM • N2(purging):50SLPM • O2,N2(BEMoption):3SLPM

Operating PC and Software PC :PC/ATcompatibleindustrialPC Operating software : Windows 7 (English) Monitor :17”TFT-LCD

Expert Specifications

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Nozzle cleaning : • Flowingdualrinsesystemusingone

chemicalandoneDIwater.TheusersuppliestheDIwater.Thechemicalisheldintwo2Lbottleswhichareautomaticallyswitched.Theusermustrefillthematlowlevels.N2gaspressuredeliversthechemicals to the rinse port. (With EXP-CS (autochemicalsupplysystemoption),theusersuppliesHFandH2O2 which are stored in a PTFE tank and mixed into a PTFE mixingtankbyPFAsyringepumps.N2 gas pressuredeliversmixedchemicalstotherinse ports.)

Scan solution container : • Two90mLPFAcontainerswithlevelsensor.

With EXP-MS (ICPMS interface option), one containerbecomesanoverflowcontainer.Thescansolutionisstoredintwo0.5LPFAbottlesanddeliveredbyN2 gas pressure. Thetwobottlesareautomaticallyswitched.Theusermustrefillthematlowlevels.(WithEXP-CS(autochemicalsupplysystemoption),theusersuppliesHFandH2O2 which are stored in a PTFE tank and mixed into a PTFEmixingtankbyPFAsyringepumps.N2 gaspressuredeliversmixedchemicalstothescan port.)

Solution delivery :Syringepump,2.5mL (<2%RSD)

Scan Stage, X-Y-Z Scanning Arm and Nozzle Module Wafer holding : Vacuum chuck Material : PEEK Stage speed :0-1,000rpm Motor : Step motor (scan stage) Accuracy : 0.36 degree Motor :Directconnectionpulse(scanarm) Repeatability :±0.1mm Scan mode : Full, Radial, S-Sector,

R-Sector, Edge (option)

Radial scan results on VIS

Scan nozzle: SpecialdesignPTFE,max.volume1.5mL(Patented)

• ɸ10mmsinglenozzle(forbarewafer,minimumvolume200μL)

• ɸ20mmdualnozzle(forbulketching,minimumvolume1,000μL)

Scan solution volume measurement : • Photosensor,<3%at1,000µL

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EXP-PP (PP panel upgrade) Upgrade the standard anti-corrosion coated panels to polypropylenepanels.

EXP-FOUP (FOUP opener) Equips one load port with a FOUP opener. Expert automaticallyclamps,docksandopenstheFOUPdoor,and maps the wafer. a. Upto2loadportscanbeequipped b. BothloadportscanhaveFOUPopeners c. This option has a wafer mapping sensor at the load port door d. 12”FOSBcanbeused e. 6” or 8” wafer adapter (Brooks) is availablefora12”FOUPcassette

EXP-CA (Manual cassette)One6”or8”cassettecanbemanuallysetatoneoftheload ports. The cassette holder is equipped with photo sensorstoautomaticallydetectthecassettesize.Thewafertransferrobotisequippedwithamappingsensortoautomaticallymapthewafer.

EXP-AD (6” or 8” adaptor)UsesaBrooksadaptorwiththe12”FOUP.Theadaptorallowsthe12”FOUPopener(EXP-FOUP)toaccept6”or8”wafers.InfopadpinsorBCR/RFIDoptionisrequired.

EXP-RFID (RFID reader)ReadstheIDofwafercassettesequippedwithRFID.The information is integrated into the Expert software. When used with the FOUP option (EXP-FOUP), the FOUPIDisreadautomatically(oneRFIDreaderrequired for each FOUP opener). With EXP-MS (ICPMS interface option), the information is integrated into the ICPMS interface software.

EXP-BCR (Barcode reader) ReadstheIDofwafercassetteswithbarcodes.Theinformation is integrated into the Expert software. When used with the FOUP opener option (EXP-FOUP), the FOUPIDisautomaticallyread(oneBarCodereaderrequired for each FOUP opener). When used with ICPMS interface option (EXP-MS), the information is integrated into the ICPMS interface software.

EXP-EPD (End point detection) Automaticallydetectsetchingcompletion.TheEPDisintegratedintothesoftwareandtheVPDtimesettingisnolongerrequired–thisfeatureisvitalinetchingfilmofunknownthickness.WhenfilmslikeSiO,SiN,andPoly-SiareetchedintheVPDchamber,EPDdetectsetchingcompletionautomatically.Itshouldbenotedthattheactualthicknessisnotmeasured,EPDrecognizesthecompletionofetchingwhenthefilmthicknessremainsconstant.

EXP-MS (VPD and ICPMS interface system) Allowstheautomatic,coordinatedoperationofVPDandICPMSsystems.TheintegrationwithICPMSreducescontaminationriskandimprovesanalysisquality.AnautosamplerisintegratedintotheExpertsystem.Expertetchesthewafer’sfilmsandrecoversthemetalimpurities. After scanning the wafer, the solution is collectedintoavialontheautosamplerandautomaticallyintroduced to the ICPMS. The Expert software seamlesslycontrolsExpert,ICPMS,andautosampler. a. Automaticallycreatesthecalibrationcurve

andchecksthecorrelationcoefficientandminimumsensitivityforeachelement.

b. AutomaticallyrecalibratesafteranyfailedQCcheck.

c. AutomaticallyanalyzesQCchecksolutionatspecifiedintervals.

d. Automaticallymonitorsinternalstandardto check aspiration and compensate for fluctuationofICPMSsensitivity.

e. Automaticallychecksscansolutionforcontamination and refreshes scan solution if determinedlevelexceedsaspecifiedvalue.(One of the two static rinse ports is replaced withanoverflowcontainerandthescansolutionisdeliveredfromtwo1LPFAbottles.ThesolutionisdeliveredbyN2 gas pressure andtwobottleswillbeswitchedautomatically.Scansolutionshouldmanuallyberefilledintothe1LPFAbottle.)

f. After detecting a potential contamination (baseduponuserdefinedvalues),thesystemwillautomaticallyextendcleaningtimeforthescannozzletopreventcrosscontamination.

Expert Options

Expert Options

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g. ICPMSresultscanbereportedinavarietyofformats such as counts, ppt, atom/cm2, and atom/cm3.

h. ChemicalmodeallowsofflineICPMSanalysisofvarioussamples.

i. Scanresults(sectorandradial)aredisplayedas a map.

Thesamplerackconfigurationisaltered.Nine2mLPTFEvialsareintegratedintotheautosamplerandwashedbytheautovialwashingmodule(EXP-VC).Inaddition,eightvialsareaddedforchemicalanalysismodeandcanbesetforstandardsolutionorsamples(EXP-STD).TheICPMSisnotincluded.TheuserneedstospecifytheICPMSmakeandmodelastheinterfacecanbeusedwithmanydifferentinstruments.

EXP-STD (Standard solution delivery module) Automaticallydeliversstandardsolutiontotheautosamplervialswhenanalysisisrequired.Thestandardsolutionsarepreparedin500mLPFAbottles.Thisupgradereducesreagentconsumptionduetoevaporation,improvesdataquality(concentrationofelementstendstobehigherovertimeexposed),andminimizesthefrequencywithwhichstandardsshouldberefreshed.ThisoptionisavailableforICPMS integration (EXP-MS).

EXP-BEM (Bulk-Si and Poly-Si etching module) ThisoptionintroducesanozonegasintotheVPDchamberwithHFvaporenablingetchingofpoly-Si,WSi,Ti,TiNfilms,andbulk-Silayers.Thedualscannozzlerecoversmetalimpuritiesfromtheetchedsurface.ThePEEKpinsintheVPDchamberarereplacedwithacooledPFAcoatedcarbonplate.O3 gas leak detector is included. This option requires O2 gas to generate the ozonegas.

EXP-VPD (Deep bulk etching) UsesaspecialVPDchamberforbetterhomogeneityindeepbulketching(1um).(Standardbulketching0.1um)

EXP-DR (Wafer drying module) TheExpertisequippedwithasystemthatmeasuresscansolutionvolume.TheWaferDryingoptionautomaticallytransfersawafertothedryingmoduleifadifferenceinscansolutionvolumeisdetected.TheupgradeprovidessignificantsafetyenhancementinpreventingexposuretoHF.

Inaddition,thisoptionisalsousedfordryingachemicalsolutiononawafertoremoveSimatrixafterbulketchingorotherprocesseswithhighSimatrix– integral to TRXRF sample preparation. The Wafer dryingmoduleisalsousedforlocalbulketching.ThedryingchamberhasaPFAcoatedcarbonhotplate.a.Material Polycarbonateb.WaferStage PFAcoatedcarbonhotplate (12”),Max.temp.200°Cc. Wafer loading pines PEEKd.Door Openandcloseautomaticallye.DryingTime Userdefined

EXP-CS (Auto chemical supply system) ReplacesthescansolutionandnozzlerinsesolutionsupplybottleswithchemicalreservoirsandpumpsfordirectchemicalsupplyfromtheFAB.Chemicals(HF,H2O2, and DIW)fromFABaredeliveredtoPTFEreservoirtanks–fromwhichachemicalpumpdeliversanexactamounttoa mixing tank. The mixed solution is supplied to the scan andrinseportsbyN2 gas pressure. (If a FAB does not haveachemicalsupply,ExpertcanuseconcentratedHFandH2O2solutioninabottleforthisoption.)ThestandardExpertsystemusesPFAbottleswithopticalsensorsforbothscansolutionandrinsesolution.Bothbottlesswitchautomatically,buttheuserneedstopreparebothchemicalsandrefilleachbottleatlowsolutionlevels.

EXP-EG (Edge scan module) Enablesasimultaneousscanofboththefrontandbackofawafer1mmfromtheedge.

EXP-VC (Auto vial washing module) Automaticallywashesthevialsusedforscansolutioncollection.Thestandardsystemrequiresmanualpreparationforthevialsontheautosamplerpriortooperation. This option eliminates manual preparation of theemptyvials.Thissystemshouldbeintegratedwiththe ICPMS interface option (EXP-MS).

EXP-BL (Wafer weight measurement module) Automatic,accuratecalculationofetchrate.Asbulketching is performed, the wafer weight will decrease. A balancewithminimumreadingof0.1mgisintegratedintoExpert – measurement of the wafer weight and change in weight allows accurate calculation of etch rate.

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EXP-OHT (Integration with OHT)AllowstheautomatichandoffofacarrierbetweenAMHSequipment(OHT–OverheadHoistTransportation)andExpert. Expert communicates through parallel I/O as definedbySEMIE84.Barcodereader(EXP-BCR)orRFID(EXP-RFID)optionisrequired.

EXP-SECS (SECS communication tool) EnablescommunicationwithCIMHOSTusingtheSECScommunicationprotocoldefinedinSEMI-E30,E87,E40,andE94.TherecipeandwaferinformationspecifiedintheCIM-HOSTinitiatestheoperationofExpert.TheVPD,scan,andanalysisbyICPMSareperformedautomatically.TheICPMSanalysisresultsareautomaticallytransferredtoCIM-HOST.Inordertomeetauser’sconfiguration,detailedspecificationsshouldbediscussed.

EXP-ASAS (Automated standard addition system) Automaticallyaddsinternalstandardsolutiontoasample.ThisoptionisinstalledbetweenExpertandICPMS;itmeasures the sample uptake rate and adds internal standard into the sample line at a constant ratio. The typicaladditionrateis1µl/min.Theinternalstandardcompensates for matrix suppression or enhancement that occursinICPMSanalysis.ThisoptionisrecommendedforhighersiliconmatrixsamplessuchasSiN,Poly-Si,andBulk-Si.Thisoptionisalsoabletomonitorthenebulizerflowrateandensurecompliance/functionality.

Additional(2nd)EXP-ASAScanmakecalibrationstandardforICPMS(VPDandICPMSinterfaceoption,EXP-MS,isrequired).ItshouldbenotedthatthisoptioncannotbeusedwhenthesampleuptakerateofICPMSislessthan100µL/min.

EXP-WF (Wafer Flip) Allowsthewafertransferrobottoflipawafer,exposingthebacksideformeasurement.Note: the wafer transfer robottouchesthefrontsideofthewafer.

EXP-AR (Aqua Regia Scan Solution) Thisoptionsallowsaquaregiascansolutiontoachievebetterrecoveryofnoblemetals.Aspecialcoverisattachedtotheoverflowcontainertoavoidevaporation.Aspecialcoverisalsousedforthescanstagetoenhanceevacuationofthescansolution.(Thecovermustbemanuallyremovedforsectorscan)

EXP-DIL (Scan Solution Dilution Module)AutomaticallydiluteshighconcentrationsofscansolutionbeforeICPMSanalysis.ThisoptionrequiresICPMSintegration(EXP-MS)andautovialwashing(EXP-VC).

EXP-OD (Ozone gas destruction module) Reduces the concentration of exhaust O3below0.05ppm.ThisisforusewithEXP-BEMoption–whichgenerates exhaust O3concentrationof1.5ppm.

Size :2,000(W)x2,500(D)x2,200(H)mm3 Weight : 1,400kgN2 (>99.995%) :0.4-0.6MPa,50L/min(max),1line,1/4”SwagelokfittingAir :0.4-0.6MPa,50L/min(max),1line, 1/4”SwagelokfittingPower :200-220VAC,6kW,Singlephase,50/60HzDIW :0.1-0.2MPa,0.1L/min(max),1/4”Pillarfitting (Ifdualpipingisrequired,outerconnectionis1/2”ferrule)Ventilation : > 360 m3/hour,O.D.150mmx2ducts >100m3/hour,O.D.100mmx1duct(BEMoption)Waste :1line,11/4”(30A)FlangefittingVacuum :<-80kPa,3/8”SwagelokfittingEnvironment :Class1,000cleanroomTemperature :18°–25°CHumidity :35–85%(nocondensation)

Option UtilitiesO2 (>99.5%) :0.4-0.6MPa,5L/min(max),1line, 1/4”SwagelokfittingHF (≈49%) :0.15-0.3MPa,0.1L/min(max), 1/4”Pillarfitting(ifdualpipingisrequired,outer connectionis1/2”ferrule)H2O2 (≈35%) : 0.15-0.3MPa,0.1L/min(max), 1/4”Pillarfitting(ifdualpipingisrequired,outer connectionis1/2”ferrule)

Expert Utilities and Layout

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Delivery & PaymentThestandarddeliverytimeis5months.Thedeliverytimecanbedelayedupto6monthsaccordingtotheuser’srequest.Otherdeliverytimesarenegotiable.

PaymentTerms:

• RemittancebyT/T • 30% upon order • 60% upon shipment • 10%aftercompletingtheinstallation

WarrantyTheExpertincludesamanufacturer’swarranty(IASJapan)asbelow.ESIwillprovideserviceandsupportinaccordancewiththeuser’sserviceplan.

IASwarrantsanyIASunitmanufacturedorsuppliedbyIASforaperiodbeginningonthedateofshipmentandendingonthesoonertooccurof:

(a)thedatethatistwelve(12)monthsfromthecompletion date of installation, or

(b)thedatethatisfifteen(15)monthsfromthedateofshipment.

UnitsfoundinthereasonablejudgmentofIAStobedefectiveinmaterialorworkmanshipwillberepairedorreplacedbyIASwithoutchargeforpartsandlabor.IASreservestherighttochangeorimprovethedesignofanyunitwithoutassuminganyobligationtomodifyanyunitpreviouslymanufactured.

Thiswarrantydoesnotcoveranyunitthathasbeensubjecttomisuse,neglect,negligence,oraccident.Thewarrantydoesnotapplytoanydamagetotheunitthatis the result of improper installation or maintenance, or toanyunitthathasbeenoperatedormaintainedinanywaycontrarytotheinstructionsspecifiedintheIAS’sinstruction and operation manual.

AnyattempttorepairoralteranyIASunitbyanyoneotherthanbyIASauthorizedpersonneloragentswillvoidthiswarranty.Ifanynon-IAScomponentisinstalled

intheIASmanufacturedunitwithouttheapprovalofIAS,thewarrantywillbevoided.Inaddition,thiswarrantydoesnotextendtorepairsmadenecessarybytheuseofparts,accessoriesorfluidswhichareeitherincompatiblewiththeunitoradverselyaffectitsoperation,performanceordurability.IAS’sobligationunderthiswarrantyisstrictlyandexclusivelylimitedtorepairorreplacementofdefectiveIASparts,andnoclaimofbreachofwarrantyshallbecauseforcancellationorrecessionofthecontractofsaleofanyunit.

TrainingThetrainingwillbeheldatusersiteaftercompletingtheinstallation.Thetrainingcoversbasicoperationanddailymaintenance.

Thisspecificationmaychangewithoutanynotice.

Expert Layout

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