EVG770 Flyer 19 01 - EV Group€¦ · DI Erich Thallner Strasse 47 St Florian am Inn Austria +4 771...
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EV Group Europe & Asia/Pacific GmbH DI Erich Thallner Strasse 1 4782 St. Florian am Inn Austria +43 7712 5311 0 Contact [email protected] www.EVGroup.com Printed on paper from sustainable sources. Data, design and specifications may not simultaneously apply; or depend on individual equipment configuration, process conditions and materials and may vary accordingly. EVG reserves the right to change data, design and specifications without prior notice. All trademarks, logos, website addresses or equipment names are registered trademarks and/or the property of EV Group or their respective owners. © EV Group (EVG). All rights reserved. V19/01 EVG®770 Step-and-Repeat Nanoimprint Lithography System Features ■ Efficient master fabrication of microlenses for wafer-level optics down to nanostructures for SmartNIL® ■ Simple implementation of different kind of masters ■ Variable resist dispense modes ■ Live image during dispensing, imprinting and demolding ■ In-situ force control for imprint and demolding ■ Optional optical wedge error compensation ■ Optional automated cassette- to-cassette handling Step-and-Repeat Nanoimprint Lithography for Efficient Master Fabrication The EVG770 is a versatile platform for step-and-repeat nanoimprint lithography for efficient master fabrication or direct patterning of complex structures on substrates. This approach allows uniform replication of templates from small dies up to 50 mm x 50 mm over large areas up to 300 mm substrate sizes. In combination with diamond turning or direct writing methods, step-and-repeat imprinting is frequently used to efficiently fabricate masters required for wafer-level optics manufacturing or EVG’s SmartNIL process. Key features of the EVG770 include precise alignment capabilities, full process control and the flexibility to address requirements of a wide variety of devices and applications. Introduction Technical Data Wafer diameter (substrate size) 100 up to 300 mm Resolution ≤ 50 nm (resolution dependent upon template and process) Supported Process Soft UV-NIL Exposure source High-power LED (i-line) > 100 mW/cm² Alignment Top side microscope for live overlay alignment ≤ ± 500 nm and fine alignment ≤ ± 300 nm First print die to die placement accuracy ≤ 1 µm Active imprint area up to 50 x 50 mm Automated separation Supported Pre-processing Coating: droplet dispense (optional)
Transcript of EVG770 Flyer 19 01 - EV Group€¦ · DI Erich Thallner Strasse 47 St Florian am Inn Austria +4 771...
EV Group Europe & Asia/Pacific GmbHDI Erich Thallner Strasse 14782 St. Florian am InnAustria+43 7712 5311 0
Contact
www.EVGroup.com
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EVG®770Step-and-RepeatNanoimprint Lithography System
Features
■ Efficient master fabrication of microlenses for wafer-level optics down to nanostructures for SmartNIL®
■ Simple implementation of different kind of masters
■ Variable resist dispense modes ■ Live image during dispensing,
imprinting and demolding ■ In-situ force control for imprint
and demolding ■ Optional optical wedge error
compensation ■ Optional automated cassette-
to-cassette handling
Step-and-Repeat Nanoimprint Lithography for Efficient Master Fabrication
The EVG770 is a versatile platform for step-and-repeat nanoimprint lithography for efficient master fabrication or direct patterning of complex structures on substrates. This approach allows uniform replication of templates from small dies up to 50 mm x 50 mm over large areas up to 300 mm substrate sizes. In combination with diamond turning or direct writing methods, step-and-repeat imprinting is frequently used to efficiently fabricate masters required for wafer-level optics manufacturing or EVG’s SmartNIL process.
Key features of the EVG770 include precise alignment capabilities, full process control and the flexibility to address requirements of a wide variety of devices and applications.
Introduction
Technical DataWafer diameter (substrate size) 100 up to 300 mm
Resolution ≤ 50 nm (resolution dependent upon template and process)
Supported Process Soft UV-NIL
Exposure source High-power LED (i-line) > 100 mW/cm²
Alignment Top side microscope for live overlay alignment ≤ ± 500 nm and fine alignment ≤ ± 300 nm
First print die to die placement accuracy ≤ 1 µm
Active imprint area up to 50 x 50 mm
Automated separation Supported
Pre-processing Coating: droplet dispense (optional)
