EV Group Training Courses 2015

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INTRODUCTION Trainer Team Training Facilities

GENERAL COURSES Robot System CAN Bus and CANopen Motion Controllers and Servos WAFER BONDING SYSTEMS EVG5xx Bonding Systems SmartView®NT Alignment System LITHOGRAPHY SYSTEMS EVG®620 Alignment System IQ Aligner®

EVG®1xx Resist Processing System APPENDIX Contact information Booking procedure and pricing About EV Group

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Introduction

Welcome to the EV Group training center

Our tools and associated software are designed for efficient, user-friendly operation and cost-effective, easy maintenance. In-depth knowledge of your production tools allows you to utilize and maintain your EVG equipment at its fullest potential.Our experienced and fully qualified training staff is your perfect partner to provide you with the equipment-specific knowledge to unlock the power of your EVG tools. Operation, handling and adjustments as well as maintenance, both preventive and corrective, are the focus of our training sessions. A new state-of-the-art training center equipped with real production machines, component test rigs and dedicated classrooms with e-learning facilities is the backbone of our training service. Valuable technical documentation and hand-outs will assure long-term ROI of your training sessions.This booklet provides you with an overview of the extensive, in-depth courses we currently offer. However our services don’t stop with the scheduled courses. Do you have specific training needs not covered in this brochure? Contact us and we will work with you to provide a customized solution.

We’re looking forward to welcoming you at our new EVG training department!

Christian Oberbauer,Supervisor Customer Support Training

Example of a Training Certificate E-Learning Software maximises the training's efficiency

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Trainer Team

Professional training Well-trained and qualified staff is key to successful and cost-effective equipment operation. In our training courses we focus on hands-on experience in combination with e-Learning supported solutions. This allows a sustainable and effective transfer of knowledge.Our trainer team is qualified on EVG equipment by an internal education system. This includes hands-on training in every relevant department: Component Manufacturing, Assembling, Quality Assurance and many more. Together with long time personal and professional background in the industry this ensures the high qualification of our training team.

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Training Facilities

State-of-the-art equipment and infrastructureOur training facilities are designed to exceed the expectations and needs of our customers. Our new training center was opened in 2012 as part of an expansion of our headquarters. On a floor space of more than 390m², classrooms, a fully fitted workshop and an equipment area featuring our complete range of industry-leading products were installed.

Our location at EVG headquarters gives us the benefit of direct access to all departments from design and construction to manufacturing. Thus we can offer our customers the best possible training experience by EVG’s own personnel on EVG tools and equipment. Our classrooms complement the hands-on training, allowing theory sessions in relaxed yet professional surroundings.These measures guarantee an ideal transfer of knowledge and give our customers the opportunity to learn and practice under real-world conditions.

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SEMI E161 Compatibility

Ensuring standards compliant training EV Group’s main goal is to offer our training services of a constant, high quality standard to our customers, meeting their demanding expectations.Key to achieving this are the standardization of the training content, an effort which started in 2012, as well as our realignment to comply with the SEMI E161 directives for machine training. These changes necessitated adjustments of the former training to fit these new goals and needs.Among other things, the training content was divided into separate tiers, Tier 1, Tier 2 and Tier 3. This segmentation allows us to better meet our customers’ needs and expectations. Tier 1 (operation) and Tier 2 (advanced operation and preventive maintenance) training is provided to our customers during the installation process of an EVG equipment by the service engineer in charge, in compliance with validated templates.Customers wishing to further advance knowledge beyond these initial trainings are invited to purchase more advanced, in-depth Tier 3 (Maintenance) courses. These trainings are held at the EVG training center. The topics of these trainings are documented in machine-type specific outlines, in compliance with SEMI standard directives.

The standardization process necessitated restructuring of the training documents. The content of the individual training documents now matches the different training levels, ensuring the trainee’s qualification. Maintenance or repair tasks exceeding the trainee’s qualification level result in a referral to tech support. Only if the trainee holds the appropriate qualification level, which is achieved by completing the corresponding trainings course, is he able to see and access more advanced maintenance/repair procedures to resolve the issue.

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Training Documentation

Ensuring standards compliant training EV Group’s main goal is to offer our training services of a constant, high quality standard to our customers, meeting their demanding expectations.Key to achieving this are the standardization of the training content, an effort which started in 2012, as well as our realignment to comply with the SEMI E161 directives for machine training. These changes necessitated adjustments of the former training to fit these new goals and needs.Among other things, the training content was divided into separate tiers, Tier 1, Tier 2 and Tier 3. This segmentation allows us to better meet our customers’ needs and expectations. Tier 1 (operation) and Tier 2 (advanced operation and preventive maintenance) training is provided to our customers during the installation process of an EVG equipment by the service engineer in charge, in compliance with validated templates.Customers wishing to further advance knowledge beyond these initial trainings are invited to purchase more advanced, in-depth Tier 3 (Maintenance) courses. These trainings are held at the EVG training center. The topics of these trainings are documented in machine-type specific outlines, in compliance with SEMI standard directives.

The standardization process necessitated restructuring of the training documents. The content of the individual training documents now matches the different training levels, ensuring the trainee’s qualification. Maintenance or repair tasks exceeding the trainee’s qualification level result in a referral to tech support. Only if the trainee holds the appropriate qualification level, which is achieved by completing the corresponding trainings course, is he able to see and access more advanced maintenance/repair procedures to resolve the issue.

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Wafer Bonding Systems

With over 20 years of experience designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production.

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EVG5xx Bonding System

Bond Module trainingKnow the tool to save time.Using EVG’s extensive documentation in combination with aquired knowledge of the tool’s functionality and inner workings is the first step in addressing your issues and improving the tool’s uptime.

Preventive Maintenance and QualificationBe one step ahead of your issues.Find the best methods to ensure correct tool operation. Use best known procedures to maintain your bond module.

Corrective Maintenance and TroubleshootingBe able to find and solve smaller problems and hard down situations.Analyze and optimize your equipment’s performance.

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EVG5xx Bonding System - Course Details*

Bond ModuleFor a perfect bond result the right hardware and process settings are essential. Pressure and temperature uni-formity need to be controlled accurately to achieve best possible bonds, avoiding any damage, misalignment or un-bonded areas on the substrate. To avoid physical damage, safety features and devices are located on every critical circuit to protect the operator and maintenance engineer.

Topics• General function of bond cover• Adjustment and verification• Vacuum system functionality• Software settings and parameters• Pneumatic function and settings• Safety features and devices• Heater function and set up• Practical exercises and troubleshooting

Course Objectives• Identify all parts of a bond module and determine their main function• Operate the machine’s software• Assemble the main components of the bond module• Understand the function of the piston circuit, vacuum system, heater circuit and safety circuit• Check and adjust piston force accuracy, pressure uniformity, temperature uniformity, vacuum functions,

wafer bow function, pneumatic movements and settings• Use equipment documentation and schematics for troubleshooting• Check and verify safety features and devices

Further Details• Number of Participants: Max. 3• Duration: 10 days

*List not complete. Topics may differ.

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SmartView®NT Alignment System

Several WaysThe SmartViewNT Aligner offers several different alignment technologies. Understand the differences, learn when and how to use them.Knowing the correlations and details of your tool is an essential part when working with it. Improve your knowledge of your machine; learn how to use it efficiently and how to address and respond to unexpected situations.

ExploreLearn how your SmartViewNT Aligner is built, understand the main parts and sub-systems as well as operation, functionality and capabilities. Perform maintenance and preventive maintenance; learn how to adjust the tool for optimum performance.Gain the ability to recover from down situations of your tool and how to best avoid and prevent them.

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SmartView®NT Aligner System - Course Details*

SmartView®NT AlignerThe SmartViewNT Automated Bond Alignment System for universal alignment offers a proprietary method for mi-cron-level face-to-face-, backside-, infrared- and transparent wafer alignment.SmartViewNT Aligner offers key technologies for achieving the required accuracy in stacking multiple wafers for leading edge technologies.

Topics• Controller and tool configuration in software• Motor axis• Input / Output• Optics• Bottom chuck• Top chuck• Laser sensor (PEC)• Process setup

Course Objectives• Configure controllers and motors / tune current loop / run auto commutation• Adjust top table / bottom table / alignment stage• Perform PID tuning for axes• Check top/bottom wafer loading pins• Handle the machine software• Train patterns• Calibrate nano stage• Perform wedge error compensation and calibrate wedge error compensation sensors

Further Details• Number of Participants: Max. 3• Duration: 10 days

*List not complete. Topics may differ.

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Lithography Systems

The company’s key competencies in lithographic technology lie in the high-throughput contact and proximity exposure capabilities of its mask aligners (EVG600, EVG6000, EVG IQ series) and in its highly integrated coating platform (EVG100 series). All of EVG’s lithography equipment platforms are 300mm ready, can be fully integrated into its HERCULES lithography track systems, and are complemented by its metrology tools for top-to-bottom side alignment verification.

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EVG®620 Alignment System

EVG®620 BasicsKnowing your tool is an essential part of working with it. Improve your knowledge of your machine; learn how to use it efficiently and how to address and respond to unexpected situations.

ExploreLearn how your EVG620 is built, find out more about the main parts and sub-systems, operation, functionality and capabilities. Perform maintenance and preventive maintenance; learn how to adjust for optimum performance.Gain the ability to recover from down situations of your tool and how to avoid them in the future.

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EVG®620 Alignment System - Course Details*

EVG®620 Mask AlignerThe EVG 620(0) mask aligner is a versatile tool which can align mask to wafer (lithography) or wafer to wafer (bonding). It can come as fully automated, semi-automated or as a manual system. An optional UV lamp house for lithography useage can be customized for application specific requirements.

Topics• General function and main parts of a EVG620 system• Operate system at user and engineer levels• Adjustment and verification• Software settings and parameters• Practical exercises• Troubleshooting

Course Objectives• Identify all parts of an EVG620 system and determine their main function• Identify tool accessories• Optical theory and component overview• UV Lamp house uniformity check and calibration, component overview• Wedge error compensation exchange and repair• Exchange Z motor and stage motors• Perform preventive maintenance service (PMS)• Operate the system as a user (run a process)• Handle low level, high level, device explorer, machine configuration and adjustments• Understand, setup and perform auto alignment correctly.• Identify different CAN components

Further Details• Number of Participants: Max. 3• Duration: 10 days

*List not complete. Topics may differ.

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IQ Aligner®

CapabilitiesLearn about the special abilities and configurations of the IQ Aligner and how to effectively use them.

FunctionsUnderstand how to enable full-field exposure, contactless wedge compensation, thick resist processing and warped wafer handling for wafer bumping, chip scale packaging and similar applications.

ExploreLearn how your IQ Aligner is built, find out about the main parts and sub-systems, operation and functionality and what it is capable of doing. Perform maintenance and preventive maintenance; learn how to adjust for optimum performance. Gain the ability to understand how to achieve your application, learn troubleshooting techniques to recover from basic error to hard down situations and how to improve uptime.

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IQ Aligner® - Course Details*

IQ Aligner®

The IQ Aligner is available as an UV-NIL and an Automated Mask Alignment System.It is based on a field-proven, robust design with wafer size capability up to 300 mm. The high automation level makes the IQ Aligner suitable for volume production applications while tremendously lowering equipment opera-tion and maintenance costs.

Topics• General function and main parts of an IQ Aligner• Operate system at user and engineer levels• Adjustment and verification• Software settings and parameters• Practical exercises• Troubleshooting

Course Objectives• Identify the parts of an IQ Aligner and determine their function• Assemble and adjust the most important components (Optics, WEC, motors, axis, endeffectors, load tray,...)• Define and modify process recipes• Perform preventive maintenance service (PMS)

Further Details• Number of Participants: Max. 3• Duration: 10 days

*List not complete. Topics may differ.

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EVG®1xx Resist Processing System

Resist processingClean, coat or develop your wafers using an EVG resist processing system. Figure out which method best fits your requirements and learn the most efficient way to optimize key performance factors.

Know your ToolUnderstand operation and functionality and learn troubleshooting techniques.Gain the ability to recover your tool from minor to hard down situations and optimize performance. Know the assembly, electronics, pneumatics, fluid circuits and pumps. Use our schematics in a most efficient manner.

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EVG®1xx Resist Processing System - Course Details*

EVG®1xxUnderstanding and controlling/setting up the system is critical in producing excellent repeatable process results, for spin coating, spray coating and developing substrates. The ability to maintain the tool properly and trouble-shoot issues effectively will reduce maintenance duration and downtime of the system.

Topics• Coat module – spin and spray coating• Develop module• Resist pumps for spin and spray coating• Setup of the Hotplates• Robot unit• Chemical cabinet• Software settings and parameters• Pneumatic function and settings• Safety features and devices• Practical exercises and troubleshooting

Course Objectives• Identify components of the system and their functionality• Operate the machine’s software• Write recipes for the system• Correct preventative maintenance of the system• Troubleshoot and rectify CANBUS/SYNQNET issues• Troubleshoot and setup the hotplates – including loading pin zero position setup• Learn setup and functionality of pneumatic components• Utilize equipment documentation and schematics for troubleshooting• Understand and troubleshoot the safety EMO circuit

Further Details• Number of Participants: Max. 3• Duration: 10 days

*List not complete. Topics may differ.

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Booking

Booking ProcessPlease refer to the individual training overview page for training dates and the reference (order-) number for each date. To book a course please contact us by e-mail or call us (contact information at the top of this page). An order has to be placed at least 30 days before the start of the training session.Please note the limited number of participants per course to ensure the quality of training and individual attention. Our detailed terms and conditions will be provided during the booking process.

PricesPrices for the individual courses are available upon request.

EVG training team at your serviceIf you have any questions regarding our courses, contents and topics covered or have special requests or specific training needs, we’ll be happy to assist you. Please contact us by e-mail at training@evgroup.com or call us at +43/7712 5311-0

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About EV Group

EV Group (EVG) is a recognized technology and market leader for wafer processing equipment. The company targets advanced packaging, compound semiconductor/LED and silicon-based power devices, MEMS, nanotech-nology and silicon-on-insulator (SOI) markets with its industry-leading wafer-bonding, lithography/nanoimprint lithography (NIL), metrology, photoresist coating, cleaning and inspection equipment. EVG has set worldwide industry standards for aligned wafer bonding as well as resist processing for the MEMS, nanotechnology and semiconductor industries. In fact, EVG holds the dominant share of the market for wafer bonding equipment and is a market and technology leader in lithography for advanced packaging and nanotechnology. Through close col-laboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers’ fab lines.

A long history of innovation, superior process capabilities and advanced, cost-effective production equipment, as well as quality and support make EVG the partner of choice, both in R&D and high volume production envi-ronments. EVG’s technological expertise and cooperative relationships with an extensive list of global partners enables customers to develop and successfully commercialize their innovations. EVG is working closely with uni-versities, as well as industry related and independent R&D institutes, and plays a major role in numerous industry consortia.

Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support net-work, with subsidiaries in Tempe, Ariz.; Albany, N.Y.; Yokohama and Fukuoka, Japan; Seoul, Korea, Shanghai, PR China and Chung-Li, Taiwan. The company’s unique Triple i-approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume. With state-of-the-art application labs and cleanroom facilities based at its headquarters in Austria, as well as in the U.S. and Japan, EVG is focused on delivering superior process expertise to its growing global customer base. Last but not least, these advanced process development and application labs are designed to accommodate independent research work to explore and develop baseline processes and conduct small volume pilot line runs to simulate an actual production line process.

EV Group Europe & Asia/Pacific GmbHDI Erich Thallner Strasse 14782 St.Florian am InnAustriaPhone: +43 7712 5311 0Fax: +43 7712 5311 4600E-Mail: Training@EVGroup.com

EV Group Training Center Contact Data, design and specifications may not simultaneously apply; or depend on individual equipment configuration, process conditions and materials and may vary accordingly. EVG reserves the right to change data, design and specifications without prior notice.

All trademarks, logos, website addresses or equipment names that contain the letters or words “EVG” or “EV Group” or any combination thereof, as well as the following names and acronyms are registered trademarks and/or the property of EV Group: ComBond®, CoverSpin™, EZB®,EZ Bond®, EZD®, EZ Debond®, EZR®, EZ Release®, GEMINI®, HERCULES®, HyperIntegration®, IQ Aligner®, LowTemp™, NanoAlign®, NanoFill™, NanoSpray™, NIL-COM®, OmniSpray®, SmartEdge®, SmartNIL™, SmartView®, The Triple “i” Company Invent-Innovate-Implement®, Triple i®. Other product and company names may be registered trademarks of their respective owners.

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