EVALUATION OF ULTRASONIC DISSIMILAR BONDS BY ULTRASONIC … · by ultrasonic testing as...

Proceedings of the 6th International Conference on Mechanics and Materials in Design,

Editors: J.F. Silva Gomes & S.A. Meguid, P.Delgada/Azores, 26-30 July 2015

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PAPER REF: 5664

EVALUATION OF ULTRASONIC DISSIMILAR BONDS BY

ULTRASONIC TESTING IMMERSION METHOD

C-SCOPE MODE

H. Abdel-Aleem1(*)

, S. A. Khodir1

Welding Technology and Inspection Lab., Central Metallurgical Res. & Develop. Institute (CMRDI), Egypt (*)Email: [email protected]

ABSTRACT

Ultrasonic bonding is very useful technique for bonding dissimilar metals which brittle

intermetallic compounds are easily developed on conventional fusion welding process. The

possibility of evaluations of ultrasonic bonds by ultrasonic testing was discussed in detail. In

order to evaluate the quality bonds it is necessary to obtain the correlation between the results

by ultrasonic testing as non-destructive test and mechanical properties, tensile shear strength

in this work as a destructive test. It was confirmed that ultrasonic testing (C-scope mode) was

useful to evaluate the bonding situations of the bonds by ultrasonic bonding when the

appropriate threshold level was selected. In this study it was found that threshold level of 200

had a good correlation between the results of ultrasonic testing and tensile shear test.

Keywords: Ultrasonic testing C-scope mode, ultrasonic bonds, tensile shear test, SEM.

INTRODUCTION

Nowadays it is difficult to find any fields without ultrasonics. It has many applications in

material science, chemical science, medical fields and many industries. For example, in

material science ultrasonics have many applications in both macro- and micro-scales. It has

been used to detect some internal defects and cracks inside the materials. In addition, the

physical properties of ultrasonics are used to get some information about the internal

structures of the materials. For example, it is possible to observe the characteristics of

feathery crystals in aluminum welds by using a scanning acoustic microscope (SAM) without

etching the materials. By using ultrasonics, we can get some useful information, which are

difficult to get by other measuring techniques such as electromagnetic waves, X-rays and

electron beam, etc. So recently ultrasonics are essential techniques in the modern industries

(ASNT handbook. 1991 and M. Katoh, 1997)

Ultrasonic bonding is a low temperature welding process. Frictional heat generated by the

process only raises the temperature of the parts beyond approximately one-third of their

melting temperatures. Since little heat is generated, no cooling water for tooling is required,

and the parts do not melt or anneal. This low temperature in bonding process is very

important in dissimilar welding such as aluminum to copper, aluminum to stainless steel and

aluminum to steel. Fusion welding generates intermetallic compounds that reduce the ductility

of some dissimilar combinations bonds as in the case of the aluminum / copper, aluminum /

stainless steel and aluminum / steel joining. Since ultrasonic bonding does not cause melting

these intermetallic compounds are not developed in bonding of those materials.

This work is mainly concerned with the bonding of dissimilar metals by ultrasonic bonding

and their materials evaluation. Many researchers have made valuable contributions for

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Non-Destructive Inspection Techniques for Materials and Structures

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understanding of dissimilar ultrasonic bonds (J. Wanger, 1992, Y. Watanabe, 1996, T. Adams

1997 , M. Katoh, 2002 and J. Villafuerate, 2003). They focused their studies on the influence

of bonding conditions on the properties of ultrasonic bonds, observing the existence of

intermetallic compounds, and the evaluation the of bonds quality by different mechanical tests

and microscopic observations near bond interfaces. However, evaluations of ultrasonic bonds

by nondestructive methods were not emphasized in their studies (G. Flood, 1997 and 1999,

M.J. Greitmann 1997, and S. Morita, 1997). The authors tried to evaluate ultrasonic bonds

quantitatively by ultrasonic testing (C-scope mode). Moreover, they tried to find a correlation

between the result of ultrasonic testing and a tensile shear test as mechanical test.

MATERIAL USED AND EXPERIMENTAL PROCEDURES

In this study both similar and dissimilar metals bonded combinations were used. There were

three metals combination 1050W/1050N as similar combination with artificial flaw while the

other two combinations are 5052/ SUS304 and 5052/SPCC respectively used as dissimilar

combinations.

It is natural that aluminum surface is covered with a thin oxide film. In this study a symbol

“N” is used to represent a specimen without anodically-oxidized film that is a sheet as

received, while a symbol “W” is used to represent the specimen with an anodically-oxidized

film. Aluminum 1050N and 1050W are commercially pure aluminum. The thickness of the

oxide film was changed to t0 = 4, 15 and 30 µm with an anodizing method by changing the

anodizing time. The combination of similar metal with artificial flaw is 1050W (t 1.5 mm) to

1050N (t 1.5 mm). oxide films with different thickness represent the artificial flaw inside

bond area after bonding.

For the dissimilar materials combinations, there were two combinations, aluminum 5052

(t 1.5 mm) was bonded for two different materials, stainless steel SUS304 (t 1mm) and cold

reduced carbon steel SPCC (t 1mm) respectively. Table 1 shows the chemical composition of

the material used in this study.

Table 1 - Chemical composition of materials used (mass %)

5052

Si Fe Cu Mn Mg Zn Cr Ti Al

0.09 0.270 0.027 0.049 2.19 0.005 0.19 0.015 Bal.

SPCC

C Si Mn P S Ni Cr Ti Fe

0.05 0.004 0.18 0.01 0.01 - - - Bal.

SUS304

C Si Mn P S Ni Cr Ti Fe

0.06 0.85 1.25 0.035 0.020 8.00 18.00 - Bal.

The width and the length of each specimen are 20 and 100 mm, respectively. Before the

bonding, the specimens were cleaned by ultrasonic cleaning in acetone. After that the bonding

was performed using an ultrasonic welding machine and lap joints (over lapped length: 20

mm) were obtained near the center of the lapped. In case of 1050N/1050W combination,

aluminum sheets with the anodically-oxidized films were set in the upper side, which

contacted a horn of the machine, while aluminum sheets without the anodically-oxidized

films were set in the lower side, which was contacted an anvil. While in case of two other

combinations 5052/SUS304 and 5052/SPCC, steel sheets were set in upper side (horn) and

aluminum 5052 sheets to lower side (anvil). Figure 1 shows an example of bond shape and

dimensions of a specimen to be bonded.



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Fig. 1 - An example of Shape and dimensions of a specimen to be bonded (5052/SPCC)

Table 2 shows conditions of the ultrasonic bonding. For each combination, bonding pressure

and amplitude were kept constant. The value of the amplitude shown here is the one of free

horn tip vibration without load. The vibration direction was parallel to the specimen surface.

Input energy (Ei) for the bonding was changed by 4 steps for the 1050W/1050N and by 5

steps for 5052/SUS304 and 5052/SPCC combinations, respectively. When the value of input

energy (Ei) is input into the machine, it is automatically controlled by the area surrounded by

a power vs. bonding time curve during the bonding.

Table 2 - Conditions of ultrasonic bonding

Combination of materials

Input energy

Ei (J)

Pressure

P (MPa)

Amplitude

A (µµµµm)

Horn tip diameter

D (mm)

1050W/1050N

(N: no oxide film, W: with oxide

film)

Thickness of oxide film

t0 (µµµµm) = 4, 15 and 30

350

0.31

68

7

400

450

500

5052/SUS304

600

0.27

50

6

800

1000

1200

1400

5052/SPCC

800

0.27

50

6

1000

1200

1400

1500

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First, macrostructures of the specimens were observed as bonded. After that, the cross-

sections of the bonds were microscopically observed using an optical microscope. The

distributions of constituent elements and the existence of intermatallic compounds near the

bonding interface were analyzed by EPMA. Moreover, the bonding situation was evaluated

by ultrasonic testing (immersion method, C-scope mode) using ultrasonic imaging equipment

(AT 7000 fabricated by Hitachi Construction Machine Co.,Ltd). For each combination

mechanical properties of the bonds were evaluated by performing tensile shear test.

RESULTS

Features of bonds and their cross sections

Figure 2 shows some examples of macroscopic features of the bonded specimens at different bonding conditions. Knurling marks are observed on the top of the bonded specimens due to

the horn of the ultrasonic bonding machine. The tip diameter of the horn was selected based

on preliminary experiments. This depends on the maximum capacity of the machine.

1050N/1050W (t0 = 15 µm, Ei = 500 J)

Fig. 2 - An examples of macroscopic features of the specimens bonded

In all bonding conditions and each bonding combination, there were flashes around circular

bond areas. The flash around the bond area increased with the increase in bonding energy.

Since the knurling marks and the flash around the bonding area make the specimen surface

rough, it is difficult to transmit ultrasonic waves through these sides of the specimens in

ultrasonic testing, as will be mentioned later. Good bonding was obtained by using the

appropriate range of input bonding energies. When the input bonding energy exceeded the

range a hole was developed in the bond area. We could not also use the input bonding energy

less than the range because it was not enough to bond the materials ( H. Abdel-Aleem 2003

and 2004) .

Figure 3 shows examples of cross-sectional microstructures near the bond interface of the

dissimilar combinations at different bonding conditions, and smooth interface and no un-

bonded region nor intermetallic compounds were observed in the microstructures in these

figures.



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Ei = 1000J Ei = 1400J

Fig. 3 - Examples of microstructures near the bond interfaces of 5052/SUS304 and 5052/SPCC

Results by Electronic Probe Micro Analyzer (EPMA)

Figure 4 (a) and (b) show the results of line analysis for 1050N/1050W 5052/SUS304

combinations. The constituent elements mutually diffuse each other by a few micrometers near the bond interface. In the case of 5052/SUS304, Al and Mg in 5052 diffuse to SUS304 ,

while in the SUS304 side, Fe, Ni, and Cr diffuse to 5052 side. In the case of 5052/SPCC

combination, Al and Mg in 5052 diffuse to SPCC, while in the SPCC side Fe diffuses to 5052

side, Fe diffuse to 5052 side.

Both results of microstructure and EPMA showed that there no intermettalic compound was

observed near the bond interface.

(a) 1050N/1050W (b) 5052/SUS304

Fig. 4 - Result of line analysis near the bond interfaces

SPCC

5052

100 μμμμm

5052

SUS304100 μμμμm

10 μμμμm

Cr

Ni

Mg

Al

Fe

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Ultrasonic testing

The major aim of nondestructive evaluation of materials is quantitative prediction of their

mechanical properties. Ultrasonic waves are well known for its ability to evaluate and create

images of internal structures. Recent advances in ultrasonic technology have demonstrated the

use of ultrasonic waves for evaluating several important welding variables (S. Morita, 1997,

M.J. Grietmann, 1997 and H. Abde;-Aleem 2003, 2004 and 2005).

Ohashi et al. have reported that echo height in ultrasonic testing from the interface of a joint

diffusion-welded depended strongly on the dimensions of the individual flaws distributing

near the interface, and for a given interface echo height the joint had higher strength with the

decrease in the individual flaw size (Ohashi 1997). They also showed that the joint strength

was a function of real bonded area estimated fractographically, irrespective of the flaw size.

They discussed the phenomenon using the result of A-scope image because it was not easy to

obtain quantitative data over the bonded region at that time. In this section, the author tried to

evaluate the bonds by ultrasonic testing. Images obtained here show the situation of bond

interfaces and the distribution of the oxide film since they reflect ultrasonic waves.

S. Rokhlin et al. have introduced a concept for nondestructive evaluation of spot welds (S.

Rokhlin, 1985). This concept was based on ultrasonic measurement of the spot weld diameter

(nugget diameter) which is then used for failure load prediction. They have reported that

ultrasonic waves could be used to estimate shear strength of spot welds.

In this work, we tried to evaluate ultrasonic bonds quantitatively by ultrasonic testing.

Moreover, we tried to find a correlation between the result of ultrasonic testing and a tensile

shear test.

Working sensitivity in ultrasonic testing is affected by the combination of ultrasonic testing

equipment and a probe frequency. In order to perform ultrasonic testing under the same

condition it is necessary to define the standard echo height using the standard test block and

adjust the working sensitivity using the echo height. The working sensitivity was set to 100 %

by using the back wall echo from the upper sheet of the specimen bonded. When a probe

frequency over than 20MHz was used, the ultrasonic transmission loss becomes larger on the

specimen surface. No such a phenomenon was observed when a 10 MHz probe was used.

Usually, 2 or 5 MHz probe is used for the conventional ultrasonic testing. The resolution for

detecting a flaw becomes better when a higher frequency probe is used. Hence, the frequency

was decided to be 10 MHz in this work.

In the ultrasonic testing equipment, the flaw echo heights are represented by the difference in

color tones of 16 levels. Good and bad bond areas are represented by blue and red,

respectively. Depending on the bond quality, the color of the bond area should be in the range

between blue and red. The region of the base metal was represented by red because the

transmitted waves were reflected from the back wall of the base metal and their heights are

largest. The region of water (immersion coupling) was represented by blue because there was

no reflection from it.

Figure 5 (a) and (b) show the comparison of C-scope images as bonded with that after

grinding the surface of the specimen. This specimen was for 1050N/1050W combination.

First, the ultrasonic waves were tried to transmit from the specimen surface, which contacted

the anvil. It is not possible, however, to get a good result because the specimen surface is not

smooth enough as shown in the upper figure of Fig.5 (a) and most of ultrasonic waves were

scattered from the surface. After smoothing the surface by grinding, good results could be



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obtained and it was possible to detect the existence of flaws due to the oxide films in the bond

area as shown in Fig.5 (b). Hence, it was necessary to remove the influence of the roughness

of the specimen surface to apply ultrasonic testing for evaluating ultrasonic bonds.

(a) As bonded (b) After grinding

Fig. 5 - Comparison of C-scope image as bonded with that after grinding the surface

Figure 6 shows an example of the results of ultrasonic testing C-scope image for

5052/SUS304 and 5052/SPCC combinations. The color of the good bonded region becomes

yellow green, not blue in cases of 5052/SUS304 and 5052/SPCC combinations, because there

is a big difference in acoustic impedance (Z) between two base metals in each combination

(Z5052 = 16.9×106 kg/m

2s, ZSUS304 = 45.45×10

6 kg/m

2s and ZSPCC = 46.8 ×10

6 kg/m

2s). This

leads to the result that a reflection coefficient from the good interface of 5052/SUS304 is

0.475 and for the bonding interface of 5052/SPCC is 0.468. Therefore, there is some

reflection can be obtained even if the good bond is obtained at the interface.

(a) 5052/SUS304 (Ei = 1400 J) (b) 5052/SPCC (E

i = 1200 J)

Fig. 6 - Example of C-scope images from the bonds of 5052/SUS304 and 5052/SPCC combinations

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Figure 7 (a), (b), (c) and (d) show examples of C-scope images from the bond interfaces for

the anodically-oxidized film thickness of 0, 4, 15 and 30 µm, respectively, in 1050W/1050N

(Ei=400J). The area of dark blue region corresponding to the good bonding decreased with the

increase in the oxide film thickness for the same input energy. It was possible to evaluate the

bonds with the oxide film by ultrasonic testing. Then the authors tried to evaluate

quantitatively the ratio of good bond area. For this, it is convenient to binarize the C-scope

images by using the appropriate threshold echo height level.

(a) t0 = 0 µm (b) t

0 = 4 µm

(c) t0 = 15 µm (d) t

0 = 30 µm

Fig. 7 - Examples of C-scope images from the bond interfaces for different oxide film thicknesses in

1050W/1050N (Ei = 400 J)

It is possible to obtain quantitatively the ratio of good bonded area in the bond area by

analyzing this image. For this purpose it is convenient to binarize the image by using the

appropriate threshold level. Figure 8 shows examples of images of good bond area

represented by gray, after binarizing the original image of C-scope mode at different threshold

echo height levels (hereafter referred to as threshold level; in this equipment 256 levels from

0 (blue) and 255 (red)). It is possible to obtain the ratio of good bond area by obtaining the

area represented by gray. Features in the bond area change depending on threshold levels.

Figure 9 shows the relation between the ratio of good bond area and threshold level for the

5052/SUS304 combination. The ratio of good bond area smoothly increases with the increase

in the threshold level, it was also the same for 5052/SPCC and 5052N/5052Wcombinations.



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Level 140 Level 160

Level 180 Level 200

Fig. 8 - Examples of C-scope images of good bond area after binarizing the original images at different threshold

level (5052/SPCC, Ei = 1200 J)

Fig. 9 - Relation between the ratio of good bond area and threshold level (5052/SUS304, E

i = 1400 J)

In order to evaluate the quality of bonds it is necessary to obtain the correlation between the

results by ultrasonic testing and mechanical properties, tensile shear strength in this work, by

a destructive test. The feature of fracture surface at good bond area after a tensile shear test

should be ductile, that is, dimple patterns should be observed. The feature at bad bond area,

however, should be brittle, that is, no dimple pattern should be observed. Hence, it is possible

0 40 80 120 160 200 2400

20

40

60

80

100

Threshold level

Ratio o

f good b

ond a

rea (%

)

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to decide the appropriate threshold level by comparing the features of the fracture surfaces by

SEM and contours obtained by binarizing the C-scope images at different threshold levels.

Figure 10 shows the contours at different threshold levels including the contour by the

macrostructure of the bond after the tensile shear test for 5052/SPCC combination (Ei = 1200

J). The location marked X1, X2, X3 and X4 show the area corresponding to the boundaries

between ductile and not-ductile area observed by SEM. Figure 11 (a), (b), (c) and (d) show

SEM images of the locations of X1, X2, X3 and X4 shown in Fig.10, respectively. The best

correspondence is obtained in the threshold level of 200. The same method was used to

determine the appropriate threshold level in case of 5052/SUS304 and 1050W/1050N

combinations. Hence, the good bond area was decided by using the result when binarized at

the threshold level of 200 in this work for 51050W/1050N, 5052/SUS304 and 5052/SPCC

combinations.

Fig. 10 - Contours at several threshold levels including the contour by the macrostructure of the bond after the

tensile shear test (Ei = 1200 J

(a) Location X1 (b) Location X2

(c) Location X3 (d) Location X4

Fig. 11 - SEM images of the locations of X1, X2, X3 and X4 shown in Fig. 10



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Figure 12 (a) and (b) show the relation between the ratio of good bond area and input energy

at the threshold level of 200 for 1050W/105N, 5052/SUS304 and 5052/SPCC combination,

respectively. Three specimens were used for each bonding condition for ultrasonic testing.

Though the data varied widely, the ratio of good bond area was more than 75 % in average

except for the case of input energy Ei = 600J in the case of 5052/SUS304 combination (in this

case input energy is too low to obtain good bonding). It is necessary to deform the softer

metal well in dissimilar combinations in ultrasonic bonding to obtain good bonds. The ratio of

good bond area tended to increase with the increase in the input energy.

(a) 1050W/1050N (threshold level 200) (b) 5052/SUS304

(c) 5052/SPCC

Fig. 12 - Relation between the ratio of good bond area and input energy (threshold level of 200)

Tensile shear test

Tensile shear test was performed for the same specimens after performing ultrasonic testing to

evaluate the mechanical properties of bonds. In every case for each combination, the fracture

was observed along the bonding interface as shown in Fig. 13. Figure 14 (a), (b) and (C) show

the relation between the maximum tensile shear load and input energy for 1050W/1050N,

5052/SUS304 and 5052/SPCC combinations, respectively. Though the data varies, the

maximum tensile shear load tended to increase with the increase in the input energy.

600 800 1000 1200 1400 16000

20

40

60

80

100

Input energy, Ei (J)

Ratio o

f good b

ond a

rea (%

)

400 600 800 1000 1200 1400 160020

40

60

80

100


Ratio o

f good b

ond a

rea (%

)

300 400 500 60040

50

60

70

80

90

100


Ratio o

f good b

ond a

rea (%

)

t0 = 0μμμμm

t0 = 4μμμμm

t0 = 15μμμμm

t0 = 30μμμμm

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1050W/1050N

Fig. 13 - Examples of macroscopic features of the specimens after

(a) 1050W/1050N

Fig. 14 - Relation between

The tensile shear strength was obtained by using

shear load and the ratio of good bond area which was obtained ultrasonically

shear strength was obtained by dividing the

area obtained ultrasonically. Figure 15 shows the relation between tensile shear strength and

input energy for 1050N/1050W,

The result shown in Fig. 15 shows that the

that of the base metal (5052) independently of the input energy. This means that there is a

good correlation between the maximum tensile shear load and the ratio of good bond area by

ultrasonic testing. The tensile shear strength is larger than that in 5052/5052 combination

140 MPa depending on the bonding energy),

1000

2000

3000

4000

Maxim

um

tensi

le s

hear load, F

max (N

)

Al without oxide

Al with oxi

10 m

300 400 500500

1000

1500

2000

2500


Maxim

um

tensi

le shear load, F

max (N

)

Destructive Inspection Techniques for Materials and Structures

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5052/SUS304

Examples of macroscopic features of the specimens after the tensile

(a) 1050W/1050N (b) 5052/SUS304

(c) 5052/SPCC

Relation between the maximum tensile shear load and input energy

was obtained by using the results of both the maximum

of good bond area which was obtained ultrasonically

shear strength was obtained by dividing the maximum tensile shear load by the good bond

Figure 15 shows the relation between tensile shear strength and

1050N/1050W, 5052/SUS304 and 5052/SPCC combinations, respectively

Fig. 15 shows that the strength estimated corresponds to about 75% of



ensile shear strength is larger than that in 5052/5052 combination

140 MPa depending on the bonding energy), [15] probably because an oxide film of 5052 is

600 800 1000 1200 1400 1600

1000

2000

3000

4000


10 mm

5052

SUS304SPCC

ide

m

500 600

(J)

t0 = 0 μμμμm

t0 = 4 μμμμm

t0 = 15μμμμm

t0 = 30μμμμm

5052/SPCC

tensile shear test

(b) 5052/SUS304

energy

the maximum tensile

of good bond area which was obtained ultrasonically. The tensile

tensile shear load by the good bond

Figure 15 shows the relation between tensile shear strength and

and 5052/SPCC combinations, respectively.

strength estimated corresponds to about 75% of



ensile shear strength is larger than that in 5052/5052 combination (75-

probably because an oxide film of 5052 is

5052

10 mm



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more easily destroyed by the harder dissimilar metal, that is, SUS304 or SPCC in this work.

M. Hiraishi reported that surface segregation of Mg retarded the good bonding of Al-Mg alloy

sheets in ultrasonic bonding and the adhesion of alcohol on the bonding surface was effective

to improve the strength of bonds (M. Hiraishi, 2003) .In the case of 1050W/1050N, the tensile

shear strength was independent of the input energy and this means that there was good

correlation between the results of the good bond area and the maximum tensile shear load.

The strengths in t0 = 0 and 4 µm were nearly the same and this shows that the oxide film of

about 4 µm did not influence the bond quality. When t0 increased to 15 and 30 µm, the

strength decreased. The strength in t0 =30 µm was about half of the base metal. It was made

clear that the higher tensile shear strength was obtained in the dissimilar metals combination

than in the similar metals combination.

(a) 1050N/1050W (b) 5052/SUS304

(b) 5052/SPCC

Fig. 15 - Relation between tensile shear strength and input energy (threshold level of 200)

CONCLUSION

- Ultrasonic testing immersion method C-scope mode was useful to evaluate the ultrasonic

bondons.

- It was necessary to remove the influence of the roughness of the specimen surface to apply

ultrasonic testing for evaluating ultrasonic bonds.

- In this study it was found that the threshold level of 200 had a good correspondence to the

result of the observation of the fractured surface using SEM.

- There was a correlation between the results of ultrasonic testing and mechanical properties,

tensile shear strength in this work when the appropriate threshold level was selected

600 800 1000 1200 1400 16000

100

200

300


Tensi

le s

hear s

trength

, ττ ττB (M

Pa)

ττττB of 5052 (Base metal)

400 600 800 1000 1200 1400 16000

100

200

300


Tensi

le shear

stre

ngth

, ττ ττB (M

Pa)

ττττB of 5052 (Base metal)

300 400 500 6000

20

40

60

80

100


Tensi

le shear str

ength

, ττ ττB (M

Pa)

ττττB of 1050 ( base metal)

t0 = 0μμμμm

t0 = 4μμμμm

t0 = 15μμμμm

t0 = 30μμμμm

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ACKNOWLEDGMENTS

We would like to express our sincere gratitude to Mr. M. Sudo in Branson Ultrasonic

Division of Emerson Japan Corporation for performing ultrasonic bonding of the specimens.

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by Adhesion of Alcohol, Quarterly Journal of the Japan Welding Society, Vol.21, No.2

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EVALUATION OF ULTRASONIC DISSIMILAR BONDS BY ULTRASONIC … · by ultrasonic testing as...

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