EUV: The Path To HVM...oEnabling HVM = Reaching technology maturity BEFORE the transition to HVM...
Transcript of EUV: The Path To HVM...oEnabling HVM = Reaching technology maturity BEFORE the transition to HVM...
EUV: The Path To HVM
LDP Technology Status
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July 2011
EUV Is Our History
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oWith years of experience at LPP (Jenoptik) and DPP, XTREME has gained a deep understanding of the technological challenges
XTREME’s Learning Edge
1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011
oEnabling HVM = Reaching technology maturity BEFORE the transition to HVM
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FraunhoferILT initiates research on EUV light
source
FraunhoferILT 1st Gen
system
Philips Extreme UV
1st alpha platform (Xe) at Customer
Philips EUV/ XTREME
alpha@ IMEC @ CNSE@ Selete
XTREME3100 (LDP)
/ASML NXE:3100 @ IMEC
1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011
Enabling EUV Lithography
oEUV SCANNER
oImaging
oYield
oEUV Source
oClean Photon (& Spectral purity)
oStability (Dose, Timing …)
Requirements for an EUV Source
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oYieldoCD uniformity
oIso-Dense Bias
oMaximum Throughput
oEffective Throughput
oStability (Dose, Timing …)
oPower
oDuty Cycle and Availability
The Technology Concept: The Best Of Both Worlds
TraditionalLPP
TraditionalDPP
(LDP)
Laser-assisted Discharge Plasma
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Stable
Scalable
Laser-assisted Discharge Plasma (LDP) Technology Concept
Tin Film
Trigger Laser
EUV in 2π
Tin Supply Disc
Plasma
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Liquid Tin Bath
Capacitor Bank
Cooling
Plasma
+ -
LDP Technology Concept – Tin Fulfills Multiple Roles
Tin as wheel protectionTin as electrodes
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Tin as wheel protectionTin as electrodes
Tin as conductor Tin as dynamic coolant
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From Technology To Product
13.5 nm13.5 nm
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NXE:3100 source
Integrated with ASML NXE:3100
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Now @ IMEC
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NXE:3100 source© IMEC
LDP Source Shows Good Dose Stability In Actual Operation
TestMode
ExposureMode
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NXE:3100 source
o XTREME has committed resources and multiple sources are in-house o 3 R&D sources (Aachen)o 2 product sources (Alsdorf)
XTREME‘s Sources for NXE:3100 – Overview
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o To enable EUV to transition to HVM, XTREME has also additional sourceso For qualification x1 (Alsdorf)o For reliability testing x1 (Alsdorf)
o Next Gen source’s architecture is finalized
Looking Forward ... HVM
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o LDP uses power more efficientlyo LDP converts wall-plug power directly into EUV plasma
o LDP is smallero LDP architecture also takes up less space in cleanroom + subfab
o LDP keeps the lithography optics cleanero LDP also prevents the contamination of the scanner and reticle
Why LDP Will Be The Technology of Choice
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o LDP also prevents the contamination of the scanner and reticle
o LDP lithography optics last longero LDP has proven debris mitigation technology for many years in Alpha phase
The Key Take-Aways
o PROGRESS HAS BEEN MADEoXTREME’s 3100 source has been installed at Imec
oTHE DIRECTION IS CLEARoPower, stability, availability and predictability will converge to enable EUV to
transition to HVM
oTHE CHALLENGES ARE IDENTIFIEDThere are still challenges ahead of us
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oThere are still challenges ahead of usoThe challenges are identified & plans have been developedo Focus Teams are in place to address those issues
o WE BELIEVE LDP WILL BE THE TECHNOLOGY OF CHOICE
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XTREME technologies GmbH