EuroCPS for Maribor 24 June2015

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EuroCPS Cyber-Physical Systems EuroCPS Cyber-Physical Systems A network of design centers boosting and initiating synergies between Innovative companies, major CPS-platforms and CPS-competency providers Josef Affenzeller CESCIT Conference, Maribor 24 June 2015 www.eurocps.org

Transcript of EuroCPS for Maribor 24 June2015

Page 1: EuroCPS for Maribor 24 June2015

EuroCPSCyber-Physical Systems

EuroCPSCyber-Physical Systems

A network of design centers boosting and initiating synergies between Innovative companies, major CPS-platforms and CPS-competency providers

Josef Affenzeller

CESCIT Conference, Maribor 24 June 2015

www.eurocps.org

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EuroCPSCyber-Physical Systems

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13 / 02 / 2015Presentation template for the EuroCPS project

Smart Anything Everywhere - SAE

Smart Anything Everywhere Initiative:

• European initiative

• A collection of cluster projects supporting the "smart anything

everywhere" vision of digital innovation based on European networks of

competence

• To enable innovative companies (SME, midcap) to get access to leading

edge technologies in order to sustain the manufacturing and the

competitiveness of Europe in the Cyber Physical System, Internet of Things

and Smart System Integration fields. SAE is the industrial gateway to bring

innovative idea to production

• The 25M€ funding budget will support around 100 experiments with the

aim of involving more than 200 SMEs and midcaps in the field of CPS, IoT

and SSI. It will enable the development of a network of design centers

boosting and initiating synergies between Innovative companies, major

CPS-platforms and CPS-competency providers.

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4 projects in the first call 2014

Innovation Service for

European Smartization by SMEs

Coordinator: Blumorpho

CPS Engineering Labs

Coordinator: Fortiss

Smart Access to Manufacturing for

Systems Integration

Coordinator: Hahn-Schickard Ges.

Smart Anything Everywhere - SAE

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EuroCPS in a nutshell

• Call: ICT-01-2014

• Launched: Feb 1st, 2015

• Duration: 3 years

• 9 Countries

• 15 Partners

• 8 Technology Platforms

• Budget: 9,178,641€

• EC funding: 8,186,835€

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�Industrial Experiment support: 76% of the EuroCPS funding

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Motivations

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Industrial experiments

Innovative company’s needs from

any sectors

European available

Platforms & Competencies

Euro

CPSSustained demand

for local manufacturing

Technology innovations &

Export revenues

New innovative CPS products

with long-term differentiator

Better EU

competitiveness

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Goal & Outcome

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Be

ne

ficiarie

s (CA

)

Final innovative product

IE definition

IE selection

IE Services

IE coaching

IE dev plan

Provide

access and

support to

techno

Needs

�Supported, manage and monitor by cascade funding partners

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EuroCPS Industrial Experiments

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SW intensive

project

So

luti

on

usi

ng

exi

stin

g p

rog

. p

latf

orm

s

� SW prototype

demonstrator

System integration

project

So

luti

on

usi

ng

exi

stin

g S

W &

HW

co

mp

on

en

ts

� Integrated system

prototype demonstrator

CPS w/ innovative

component project

So

luti

on

usi

ng

sp

eci

fic

SW

& H

W c

om

po

ne

nts

� System architecture virtual

prototype demonstrator

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Find a design center close to you

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EuroCPS Networking Partners can help you to find R&D competence centers inyour region and link you to the local ecosystem and industry. In additionEuroCPS Design Centers are available to give support during productdevelopment or upgrade.

• AVL – Austria• BME – Hungary• DIGICAT – United Kingdom• CEA – France• FhG – Germany• FPG – Germany• HTNL – Netherlands• LTU – Sweden• Thales – France• UNIBO – Italy

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Quark System on Chip Platform

Low-power platform provided by Intel

The 9 EuroCPS platforms

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Power management Platform

Component platform provided by Infineon

Silicon Process and Package Technology

Leading-edge silicon processes and package technologies provided by STMicroelectronics

Hardware

iNEMO Inertial Platform

A sensor platform provided by STMicroelectronics

STM32 Microcontroller Platform

32-bit product range provided by STMicroelectronics

Connectivity Platform

Solution for digitalization application provided by Schneider

Integration system

Avionics Platform

Processing board & real time SW solutions provided by Thales

Integrated and Open Development Platform

Simulation methods and tools for development provided by AVL

Software

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IE criteria for award of support

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�Open calls to select 30 Industrial Experiments

�Excellence, Impact and Product implementation

�Maximum IE duration: 18 months

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Project structure

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Competencies

Large companies (CPS

and Components

Platform Providers)

Innovative industrial

experiments from SMEs

Networking

Application demonstrators

Partner’s Roles Definition for type of beneficiary

Networking

partner

is linked to a 3rd party ecosystem,

local industry

Competence

partner

Help to ease the use of technology

platforms

can bring competencies along the

value chain from embedded SW

down to the component level to

link the third party needs to

technology provider

Technology

provider partner

can bring technology or

components or production lines or

programmable platforms that can

be used by industrial experiments

Cascade funding

partner

can manage the execution of the

experiments

3rd party

Industrial experiment

i.e. the end user with a specific

need

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Financial support to 3rd parties

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Design Center 1

3rd

IE1

3rd

IE2

3rd

IE3

Design Center2

3rd

IE4

Design Center 3

3rd IE5

3rd IE6

3rd IE7

3rd IE8

�Support R&D work of 3rd parties involved in IE

�Funding 70% of cost up to 150k€ per 3rd party

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Open calls - Dates

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�3 open calls

�1st call was published on 29th of April 2015

�Call Deadline: 3rd of June 2015 - 17h00 (Brussels time)

�Please visist www.eurocps.org

1st IE batch

2st IE batch

3st IE batch

Apr’15 Sep’15 Apr’16

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Open calls - Basic principal

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�Call is open for 5 weeks

�Evaluation by external experts within 7 weeks

�Start of Industrial Experiments after 12 weeks

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Open calls – Call publication

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�Call was published on

29th of April

�www.eurocps.org

�Call text, guide of applicants

and standard agreement for

contractual work provided

�Information on platform

providers and coaching partners

available on web portal

�Information on open call will be

distributed by EuroCPS partners

�FAQ and help desk available

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Open calls – Proposal preparation

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�Proposal template provided

�Comments what is expected

to be included

�One platform of EuroCPS has

to be addressed

�Proposal language is English

�Submission as PDF using

proposal submission system on

web portal

�Registration process

�Check for completeness

�Modifications until call

deadline possible

�Do not wait until last hours!

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Open calls – Proposal evaluation

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�Technical evaluation by external experts

�Free of conflict of interest

�No internal technical evaluation

�Evaluators will be selected on their expertise

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Open calls – Proposal evaluation

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� The evaluation of IE proposals will be based on scores given

according to the three basic criteria:

� Excellence

� Impact

� Quality and efficiency of the implementation

� For each criterion (excellence, implementation and impact),

a 0-5 score will be given by each evaluator.

� The experiment will be above threshold if each score is equal

to or above 3/impact 4.5 and the sum of the three scores is

not less than 11.5. Half point can be used.

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Open calls – Proposal selection

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� The selection of industrial experiments has to:

� maximize overall results and activities for the EuroCPS

project

� guarantee the better coverage of its areas of interest

� A score above the threshold is required for the selection of

the industrial experiment

� EuroCPS will normally select the highest scoring proposals for

the call

� The selected IEs will be informed accordingly

� Start of IEs after finalisation of contractual work

� Standard agreement has to be signed

� Bilateral agreement with platform provider

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Quark System on Chip Platform

Low-power platform provided by Intel

The 9 EuroCPS platforms

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Power management Platform

Component platform provided by Infineon

Silicon Process and Package Technology

Leading-edge silicon processes and package technologies provided by STMicroelectronics

Hardware

iNEMO Inertial Platform

A sensor platform provided by STMicroelectronics

STM32 Microcontroller Platform

32-bit product range provided by STMicroelectronics

Connectivity Platform

Solution for digitalization application provided by Schneider

Integration system

Avionics Platform

Processing board & real time SW solutions provided by Thales

Integrated and Open Development Platform

Simulation methods and tools for development provided by AVL

Software

CESCIT Conference, Maribor 24 / 06 / 2015

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Challenges for SME

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o First prototype based mainly on existing platform supported

by the EuroCPS platform providers.

o Support also in the view of creation of business cases as well

as preparing the proposals.

o Access to open deliverables from previous projects

o Information on the status as well as where this information

can be found (websites).

o Support from the partner during the experiments.

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Challenges for the IODP activities

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o Higher accuracy of the simulation results

o Shortening the development time

o Reduction of development costs

o Opportunities for SMEs to link their software to larger systems

o Opportunities for business

o ….

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Integrated and Open Development Platform provided by AVL

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Project start

Integration Step X SOP

Vehicle Development Process

TARGET: Increase efficiency of (e.g.) Vehicle

Development Process

Require-ments

Integrated and Open Development Platform (IODP)

… targets the seamless integration and successive

replacement of simulation and physical models along

the development cycle

… enables progressive functional integration at every

stage of process

… relies on smart tool integration along the entire

development cycle

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Integrated and OPEN Development Platform Necessary

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E-MOTORTEST BED

BATTERYTEST BED

ENGINETEST BED

POWERTRAINTEST BED

CHASSISDYNO

ROADTEST

OFFICE SIMULATION

XILTEST

Integrated and Open Development Platform

Model Backbone

Data Backbone

Execution Backbone

Virtual World Real World

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IODP example: Progressive functional integration

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Project start

Integration Step X

SOP

Vehicle Development ProcessRequire-

ments

Powertrain in the Loop

Virtual prototype

Integration of simulation and

hardware components

Powertrain Testbed Environment

Re

al

Te

st E

nvir

on

me

nt

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Platform Input by AVL

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o Access to related major European R&D programs such asARTEMIS projects CESAR and CRYSTAL, and training for themain technologies

o Support based on AVL‘s Integrated and Open DevelopmentPlatform main components and interfaces

o Support for preparation of proposals

� Opportunities for Industrial Experienceso Integration into AVL’s seamless development and validation platformo Get access to comprehensive development data along the entire development cycle for creation of smart solutions

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Infineons “Power Management for CPS” platform is described in the Power Management Selection Guide

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o Please download:

https://www.infineon.com/cms/en/product/promop

ages/pm-selection-guide/

o Infineons “Power Management for CPS” platform

offersoMore than 300 products out of 8 segmentsoFor more than 20 different application families

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Choice of the CPS relevant application families addressed in the Power Management Selection Guide

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Thank you

www.eurocps.org

Project information: [email protected]

CESCIT Conference, Maribor 24 / 06 / 2015