ESP32PICOV302 - Espressif · 2021. 2. 9. · 7 ESP32-PICO-V3-02 STENCIL 27 8 Reflow Profile 28...
Transcript of ESP32PICOV302 - Espressif · 2021. 2. 9. · 7 ESP32-PICO-V3-02 STENCIL 27 8 Reflow Profile 28...
ESP32PICOV302Datasheet
Prerelease Version 0.6
Espressif Systems
Copyright © 2021
www.espressif.com
About This Document
This document provides the specifications for ESP32-PICO-V3-02.
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For revision history of this document, please refer to the last page.
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1 Overview
1 Overview
1.1 Features
MCU
• ESP32 embedded, Xtensa® dual-core 32-bit LX6
microprocessor, up to 240 MHz
• 448 KB ROM for booting and core functions
• 520 KB SRAM for data and instructions
• 16 KB SRAM in RTC
WiFi
• 802.11 b/g/n
• Bit rate: 802.11n up to 150 Mbps
• A-MPDU and A-MSDU aggregation
• 0.4 µs guard interval support
• Center frequency range of operating channel:
2412 ~ 2484 MHz
Bluetooth®
• Bluetooth V4.2 BR/EDR and Bluetooth LE
specification
• Class-1, class-2 and class-3 transmitter
• AFH
• CVSD and SBC
Hardware
• Interfaces: ADC, DAC, touch sensor,
SD/SDIO/MMC Host Controller, SPI, SDIO/SPI
Slave Controller, EMAC, motor PWM, LED PWM,
UART, I2C, I2S, infrared remote controller, GPIO,
pulse counter, Two-Wire Automotive Interface
(TWAI®, compatible with ISO11898-1)
• 40 MHz crystal oscillator
• 8 MB SPI flash
• 2 MB SPI PSRAM
• Operating voltage/Power supply: 3.0 ~ 3.6 V
• Operating temperature range: –40 ~ 85 °C
• Dimensions: (7 × 7 × 1.11) mm
1.2 Description
The ESP32-PICO-V3-02 is a System-in-Package (SiP) device that is based on ESP32 with ECO V3 wafer,
providing complete Wi-Fi and Bluetooth® functionalities. It integrates a 8 MB SPI flash and a 2 MB SPI
PSRAM.
At the core of ESP32-PICO-V3-02 is the ESP32 (ECO V3) chip, which is a single 2.4 GHz Wi-Fi and Bluetooth
combo chip designed with TSMC’s 40 nm low-power technology. ESP32-PICO-V3-02 integrates all peripheral
components seamlessly, including a crystal oscillator, flash, PSRAM, filter capacitors and RF matching links in
one single package. Its assembly and testing are already done at SiP level. As such, ESP32-PICO-V3-02
reduces the complexity of supply chain and improves control efficiency.
With its ultra-small size, robust performance and low-energy consumption, ESP32-PICO-V3-02 is well suited for
any space-limited or battery-operated applications, such as wearable electronics, medical equipment, sensors
and other IoT products.
Comparing to other ESP32 series chips, ESP32-PICO-V3-02 has an additional pin GPIO20. For chip security
purpose, flash pins DI, DO, /HOLD, /WP and PSRAM pins SI/SIO0, SO/SIO1, SIO2, SIO3 are not led out.
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1 Overview
Note:
• For details on ESP32, please refer to the document ESP32 Datasheet.
• For details on ESP32 ECO V3, please refer to ESP32 ECO V3 User Guide.
1.3 Applications
• Generic Low-power IoT Sensor Hub
• Generic Low-power IoT Data Loggers
• Cameras for Video Streaming
• Over-the-top (OTT) Devices
• Speech Recognition
• Image Recognition
• Mesh Network
• Home Automation
• Smart Building
• Industrial Automation
• Smart Agriculture
• Audio Applications
• Health Care Applications
• Wi-Fi-enabled Toys
• Wearable Electronics
• Retail & Catering Applications
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Contents
Contents
1 Overview 3
1.1 Features 3
1.2 Description 3
1.3 Applications 4
2 Block Diagram 9
3 Pin Definitions 10
3.1 Pin Layout 10
3.2 Pin Description 10
3.3 Compatibility with ESP32-PICO-V3 12
3.4 Strapping Pins 13
4 Electrical Characteristics 15
4.1 Absolute Maximum Ratings 15
4.2 Recommended Operating Conditions 15
4.3 DC Characteristics (3.3 V, 25 °C) 15
4.4 Current Consumption Characteristics 16
4.5 Wi-Fi RF Characteristics 17
4.5.1 Wi-Fi RF Standards 17
4.5.2 Transmitter Characteristics 18
4.5.3 Receiver Characteristics 18
4.6 Bluetooth Radio 19
4.6.1 Receiver – Basic Data Rate 19
4.6.2 Transmitter – Basic Data Rate 19
4.6.3 Receiver – Enhanced Data Rate 20
4.6.4 Transmitter – Enhanced Data Rate 21
4.7 Bluetooth LE Radio 21
4.7.1 Receiver 21
4.7.2 Transmitter 22
5 Schematics 23
6 Peripheral Schematics 24
7 Package Information 25
8 Product Handling 28
8.1 Storage Condition 28
8.2 ESD 28
8.3 Reflow Profile 28
9 MAC Addresses and eFuse 29
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Contents
10 Learning Resources 30
10.1 Must-Read Documents 30
10.2 Must-Have Resources 30
Revision History 32
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ESP32-PICO-V3-02 Datasheet v0.6
List of Tables
List of Tables
1 Pin Definitions 10
2 Usage of Pins on ESP32-PICO-V3-02 and ESP32-PICO-V3 12
3 Strapping Pins 14
4 Absolute Maximum Ratings 15
5 Recommended Operating Conditions 15
6 DC Characteristics (3.3 V, 25 °C) 15
7 Current Consumption Depending on RF Modes 16
8 Current Consumption Depending on Work Modes 17
9 Wi-Fi RF Standards 17
10 Transmitter Characteristics 18
11 Receiver Characteristics 18
12 Receiver Characteristics – Basic Data Rate 19
13 Transmitter Characteristics – Basic Data Rate 20
14 Receiver Characteristics – Enhanced Data Rate 20
15 Transmitter Characteristics – Enhanced Data Rate 21
16 Receiver Characteristics – BLE 21
17 Transmitter Characteristics – BLE 22
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List of Figures
List of Figures
1 ESP32-PICO-V3-02 Block Diagram 9
2 Pin Layout of ESP32-PICO-V3-02 (Top View) 10
3 ESP32-PICO-V3-02 Schematics 23
4 ESP32-PICO-V3-02 Peripheral Schematics 24
5 ESP32-PICO-V3-02 Package 25
6 ESP32-PICO-V3-02 PCB Land Pattern 26
7 ESP32-PICO-V3-02 STENCIL 27
8 Reflow Profile 28
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2 Block Diagram
2 Block Diagram
8 MB SPI Flash
ESP32RF Matching
40 MHzCrystal
CLK
/CS
DI DO /HOL
D/W
P
RF Matching
3V3
VDD_
SDIO ESP32-PICO-V3-02
EN
GPIOs
Antenna
2 MB PSRAM
CLK/CS
VDD_SDIO
SIO2SIO3SO/ SIO1SI/ SIO0
Figure 1: ESP32PICOV302 Block Diagram
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3 Pin Definitions
3 Pin Definitions
3.1 Pin Layout
1
2
3
4
5
6
7
8
9
10
11
12
36
35
34
33
32
31
30
29
28
27
26
25
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
49 GND
VDDA
LNA_IN
VDDA3P3
VDDA3P3
SENSOR_VP/I36
SENSOR_CAPP/I37
SENSOR_CAPN/I38
SENSOR_VN/I39
EN
VDET_1/I34
VDET_2/I35
32K_XP/IO32
32
K_X
N/I
O3
3
IO2
5
IO2
6
IO2
7
MT
MS
/IO
14
MT
DI/
IO1
2
VD
D3
P3
_R
TC
MT
CK
/IO
13
MT
DO
/IO
15
IO2
IO0
IO4
NC
NC
IO5
SD1/IO8
SD0/IO7
CLK/IO6
CMD/IO11
SD3/IO10
SD2/IO9
IO20
VDD_SDIO
NC
NC
NC
VD
DA
NC
NC
VD
DA
IO2
1
U0
TX
D/I
O1
U0
RX
D/I
O3
IO2
2
IO1
9
VD
D3
P3
_CP
U
Figure 2: Pin Layout of ESP32PICOV302 (Top View)
Note:
The pin diagram shows the approximate location of pins. For the actual mechanical diagram, please refer to Figure 5.
3.2 Pin Description
ESP32-PICO-V3-02 has 48 pins. See pin definitions in Table 1.
Table 1: Pin Definitions
Name No. Type Function
VDDA 1 P Analog power supply (3.0 V ~ 3.6 V)
LNA_IN 2 I/O RF input and output
VDDA3P3 3 P Analog power supply (3.0 V ~ 3.6 V)
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3 Pin Definitions
Name No. Type Function
VDDA3P3 4 P Analog power supply (3.0 V ~ 3.6 V)
SENSOR_VP/I36 5 I GPIO36, ADC1_CH0, RTC_GPIO0
SENSOR_CAPP/I37 6 I GPIO37, ADC1_CH1, RTC_GPIO1
SENSOR_CAPN/I38 7 I GPIO38, ADC1_CH2, RTC_GPIO2
SENSOR_VN/I39 8 I GPIO39, ADC1_CH3, RTC_GPIO3
EN 9 I
High: On; enables the SiP
Low: Off; the SiP powers off
Note: Do not leave this pin floating.
VDET_1/I34 10 I ADC1_CH6, RTC_GPIO4
VDET_2/I35 11 I ADC1_CH7, RTC_GPIO5
32K_XP/IO32 12 I/O32K_XP (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9,
RTC_GPIO9
32K_XN/IO33 13 I/O32K_XN (32.768 kHz crystal oscillator output), ADC1_CH5, TOUCH8,
RTC_GPIO8
IO25 14 I/O GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0
IO26 15 I/O GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1
IO27 16 I/O GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV
MTMS/IO14 17 I/OADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK,
SD_CLK, EMAC_TXD2
MTDI/IO12 18 I/OADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2,
SD_DATA2, EMAC_TXD3
VDD3P3_RTC 19 P Input power supply for RTC IO (3.0 V ~ 3.6 V)
MTCK/IO13 20 I/OADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3,
SD_DATA3, EMAC_RX_ER
MTDO/IO15 21 I/OADC2_CH3, TOUCH3, RTC_GPIO13, MTDO, HSPICS0, HS2_CMD,
SD_CMD, EMAC_RXD3
IO2 22 I/O ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0, SD_DATA0
IO0 23 I/O ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK
IO4 24 I/OADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1,
EMAC_TX_ER
NC 25 — NC
VDD_SDIO 26 P Output power supply. See note 1 under the table.
IO20 27 I/O GPIO20. See note 3 under the table.
SD2/IO9 28 I/O See note 2, note 3 under the table.
SD3/IO10 29 I/O See note 2, note 3 under the table.
CMD/IO11 30 I/O See note 2, note 3 under the table.
CLK/IO6 31 I/O See note 2, note 3 under the table.
SD0/IO7 32 I/O GPIO7, SD_DATA0, HS1_DATA0, U2RTS. See note 3 under the table.
SD1/IO8 33 I/O GPIO8, SD_DATA1, HS1_DATA1, U2CTS. See note 3 under the table.
IO5 34 I/O GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK
NC 35 — NC
NC 36 — NC
VDD3P3_CPU 37 P Input power supply for CPU IO (1.8 V ~ 3.6 V)
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3 Pin Definitions
Name No. Type Function
IO19 38 I/O GPIO19, VSPIQ, U0CTS, EMAC_TXD0
IO22 39 I/O GPIO22, VSPIWP, U0RTS, EMAC_TXD1
U0RXD/IO3 40 I/O GPIO3, U0RXD, CLK_OUT2
U0TXD/IO1 41 I/O GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2
IO21 42 I/O GPIO21, VSPIHD, EMAC_TX_EN
VDDA 43 P Analog power supply (3.0 V ~ 3.6 V)
NC 44 — NC
NC 45 — NC
VDDA 46 P Analog power supply (3.0 V ~ 3.6 V)
NC 47 — NC
NC 48 — NC
Notice:
1. Note that the embedded flash is connected to VDD_SDIO which is driven directly by VDD3P3_RTC through a 6 Ω
resistor. Due to this resistor, there is some voltage drop on this pin from VDD3P3_RTC.
2. Pins CMD/IO11 and CLK/IO6 are used for connecting the embedded flash, and pins SD2/IO9 and SD3/IO10 are
used for connecting embeded PSRAM. These pins are not recommended for other uses. For details, please see
Section 5 Schematics.
3. IO6/IO7/IO8/IO9/IO10/IO11/IO20 belong to VDD_SDIO power domain and cannot work when VDD_SDIO power
shuts down.
4. For peripheral pin configurations, please refer to ESP32 Datasheet.
3.3 Compatibility with ESP32PICOV3
ESP32-PICO-V3-02 is a new product but it is very similar to ESP32-PICO-V3. It may be possible to update an
ESP32-PICO-V3 hardware design to use ESP32-PICO-V3-02 with minimal or no hardware changes, but please
pay attention to the following:
• Usage of the following pins has changed:
Table 2: Usage of Pins on ESP32PICOV302 and ESP32PICOV3
Pin No.ESP32-PICO-V3-02 (embed-
ded flash and PSRAM)
ESP32-PICO-V3 (embedded
flash, impossible to connect it
with PSRAM)
ESP32-PICO-D4 (embedded
flash, possible to connect it
with external PSRAM)
25 NC NCGPIO16, used to connect em-
bedded flash
27 GPIO20, can be used GPIO20, can be usedGPIO17, used to connect em-
bedded flash
28
SD2/IO9, used to connect
embedded PSRAM, cannot
be used externally
SD2/IO9, can be used GPIO9, can be used
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3 Pin Definitions
Pin No.ESP32-PICO-V3-02 (embed-
ded flash and PSRAM)
ESP32-PICO-V3 (embedded
flash, impossible to connect it
with PSRAM)
ESP32-PICO-D4 (embedded
flash, possible to connect it
with external PSRAM)
29
SD3/IO10, used to connect
embedded PSRAM, cannot
be used externally
SD3/IO10, can be used GPIO10, can be used
32 SD0/IO7, can be used SD0/IO7, can be usedSD0/IO7, used to connect
embedded flash
33 SD1/IO8, can be used SD1/IO8, can be usedSD1/IO8, used to connect
embedded flash
35 NC NC GPIO18, can be used
36 NC NC GPIO23, can be used
• These three modules vary in size. The size of ESP32-PICO-D4 and ESP32-PICO-V3 is (7 × 7 × 0.94) mm,
whereas the size of ESP32-PICO-V3-02 is (7 × 7 × 1.11) mm.
• For security purposes, flash data pins DI, DO, /HOLD, and /WP and PSRAM data pins SI/SIO0, SO/SIO1,
SIO2, SIO3 are not led out.
• It is not possible to connect an external PSRAM chip to ESP32-PICO-V3-02 and ESP32-PICO-V3.
• If a 32.768 kHz crystal is connected to ESP32-PICO-D4 then please refer to ESP32 ECO V3 User Guide for
information about necessary hardware changes for ESP32-PICO-V3-02 and ESP32-PICO-V3.
• Refer to ESP32 ECO V3 User Guide for information about possible software changes and optimizations for
ESP32 ECO V3.
• EMC compliance and RF performance tests should be repeated after a design is updated to use
ESP32-PICO-V3-02.
• Refer to ESP32-PICO-V3 Datasheet for more information about ESP32-PICO-V3.
• Refer to ESP32-PICO-D4 Datasheet for more information about ESP32-PICO-D4.
3.4 Strapping Pins
ESP32 has five strapping pins: MTDI, GPIO0, GPIO2, MTDO, GPIO5. The pin-pin mapping between ESP32 and
the SiP is as follows, which can be seen in Chapter 5 Schematics:
• MTDI = IO12
• GPIO0 = IO0
• GPIO2 = IO2
• MTDO = IO15
• GPIO5 = IO5
Software can read the values of these five bits from register ”GPIO_STRAPPING”.
During the chip’s system reset release (power-on-reset, RTC watchdog reset and brownout reset), the latches of
the strapping pins sample the voltage level as strapping bits of ”0” or ”1”, and hold these bits until the chip is
powered down or shut down. The strapping bits configure the device’s boot mode, the operating voltage of
VDD_SDIO and other initial system settings.
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3 Pin Definitions
Each strapping pin is connected to its internal pull-up/pull-down during the chip reset. Consequently, if a
strapping pin is unconnected or the connected external circuit is high-impedance, the internal weak
pull-up/pull-down will determine the default input level of the strapping pins.
To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32.
After reset release, the strapping pins work as normal-function pins.
Refer to Table 3 for a detailed boot-mode configuration by strapping pins.
Table 3: Strapping Pins
Voltage of Internal LDO (VDD_SDIO)
Pin Default 3.3 V 1.8 V
MTDI Pull-down 0 1
Booting Mode
Pin Default SPI Boot Download Boot
GPIO0 Pull-up 1 0
GPIO2 Pull-down Don’t-care 0
Enabling/Disabling Debugging Log Print over U0TXD During Booting
Pin Default U0TXD Active U0TXD Silent
MTDO Pull-up 1 0
Timing of SDIO Slave
Pin Default
FE Sampling
FE Output
FE Sampling
RE Output
RE Sampling
FE Output
RE Sampling
RE Output
MTDO Pull-up 0 0 1 1
GPIO5 Pull-up 0 1 0 1
Note:
• FE: falling-edge, RE: rising-edge.
• Firmware can configure register bits to change the settings of ”Voltage of Internal LDO (VDD_SDIO)” and ”Timing
of SDIO Slave”, after booting.
• The operating voltage of ESP32-PICO-V3-02’s integrated external SPI flash and PSRAM is 3.3 V. Therefore, the
strapping pin MTDI should hold bit ”0” during the SiP power-on reset.
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4 Electrical Characteristics
4 Electrical Characteristics
4.1 Absolute Maximum Ratings
Stresses beyond the absolute maximum ratings listed in the table below may cause permanent damage to the
device. These are stress ratings only, and do not refer to the functional operation of the device that should follow
the recommended operating conditions.
Table 4: Absolute Maximum Ratings
Symbol Parameter Min Max Unit
VDD33 Power supply voltage –0.3 3.6 V
TSTORE Storage temperature –40 85 °C
Note:
Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain.
4.2 Recommended Operating Conditions
Table 5: Recommended Operating Conditions
Symbol Parameter Min Typ Max Unit
VDD33 Power supply voltage 3.0 3.3 3.6 V
IV DD Current delivered by external power supply 0.5 — — A
T Operating temperature –40 — 85 °C
Humidity Humidity condition — 50 — %RH
4.3 DC Characteristics (3.3 V, 25 °C)
Table 6: DC Characteristics (3.3 V, 25 °C)
Symbol Parameter Min Typ Max Unit
CIN Pin capacitance — 2 — pF
VIH High-level input voltage 0.75×VDD1 — VDD1+0.3 V
VIL Low-level input voltage –0.3 — 0.25×VDD1 V
IIH High-level input current — — 50 nA
IIL Low-level input current — — 50 nA
VOH High-level output voltage 0.8×VDD1 — — V
VOL Low-level output voltage — — 0.1×VDD1 V
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4 Electrical Characteristics
Symbol Parameter Min Typ Max Unit
IOH
High-level source current
(VDD1 = 3.3 V,
VOH >= 2.64 V,
output drive strength set
to the maximum)
VDD3P3_CPU
power domain 1, 2— 40 — mA
VDD3P3_RTC
power domain 1, 2— 40 — mA
VDD_SDIO power
domain 1, 3— 20 — mA
IOL
Low-level sink current
(VDD1 = 3.3 V, VOL = 0.495 V,
output drive strength set to the maximum)
— 28 — mA
RPU Resistance of internal pull-up resistor — 45 — kΩ
RPD Resistance of internal pull-down resistor — 45 — kΩ
VIL_nRSTLow-level input voltage of CHIP_PU
to power off the chip— — 0.6 V
Note:
1. Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain. VDD is the I/O voltage for a particular
power domain of pins.
2. For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is gradually
reduced from around 40 mA to around 29 mA, VOH>=2.64 V, as the number of current-source pins increases.
3. Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test.
4.4 Current Consumption Characteristics
With the use of advanced power-management technologies, ESP32 can switch between different power
modes.
For details on different power modes, please refer to Section RTC and Low-Power Management in
ESP32 Datasheet.
Table 7: Current Consumption Depending on RF Modes
Work mode Description Average (mA) Peak (mA)
Active (RF working)
TX
802.11b, 20 MHz, 1 Mbps, @19.5 dBm 240 385
802.11g, 20 MHz, 54 Mbps, @15 dBm 185 270
802.11b, 20 MHz, MCS7, @13 dBm 180 250
802.11n, 40 MHz, MCS7, @13 dBm 160 205
RX802.11b/g/n, 20 MHz 110 111
802.11n, 40 MHz 116 117
Note:
• The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient temperature at the RF
port. All transmitters’ measurements are based on a 50% duty cycle.
• The current consumption figures for in RX mode are for cases when the peripherals are disabled and the CPU idle.
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4 Electrical Characteristics
Table 8: Current Consumption Depending on Work Modes
Work mode Description Current consumption (Typ)
Modem-sleepThe CPU is
powered on
240 MHz 30 ~ 68 mA
160 MHz 27 ~ 44 mA
Normal speed: 80 MHz 20 ~ 31 mA
Light-sleep — 0.8 mA
Deep-sleep
The ULP co-processor is powered on. 150 µA
ULP sensor-monitored pattern 100 µA @1% duty
RTC timer + RTC memory 10 µA
RTC timer only 5 µA
Power off CHIP_PU is set to low level, the chip is powered off. 1 µA
Note:
• The current consumption figures in Modem-sleep mode are for cases where the CPU is powered on and the cache
idle.
• When Wi-Fi is enabled, the chip switches between Active and Modem-sleep modes. Therefore, current consump-
tion changes accordingly.
• In Modem-sleep mode, the CPU frequency changes automatically. The frequency depends on the CPU load and
the peripherals used.
• During Deep-sleep, when the ULP co-processor is powered on, peripherals such as GPIO and I²C are able to
operate.
• The ”ULP sensor-monitored pattern” refers to the mode where the ULP coprocessor or the sensor works periodi-
cally. When ADC works with a duty cycle of 1%, the typical current consumption is 100 µA.
4.5 WiFi RF Characteristics
4.5.1 WiFi RF Standards
Table 9: WiFi RF Standards
Name Description
Center frequency range of operating channel note1 2412 ~ 2484 MHz
Wi-Fi wireless standard IEEE 802.11b/g/n
Data rate20 MHz
11b: 1, 2, 5.5 and 11 Mbps
11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
11n: MCS0-7, 72.2 Mbps (Max)
40 MHz 11n: MCS0-7, 150 Mbps (Max)
Note:
1. Device should operate in the center frequency range allocated by regional regulatory authorities. Target center
frequency range is configurable by software.
2. For the SiPs that use IPEX antennas, the output impedance is 50 Ω. For other SiPs without IPEX antennas, users
do not need to concern about the output impedance.
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4 Electrical Characteristics
4.5.2 Transmitter Characteristics
Table 10: Transmitter Characteristics
Parameter Rate Typ Unit
TX Power note
11b, 1 Mbps 19.5
dBm
11b, 11 Mbps 19.5
11g, 6 Mbps 18
11g, 54 Mbps 14
11n, HT20, MCS0 18
11n, HT20, MCS7 13
11n, HT40, MCS0 18
11n, HT40, MCS7 13
Note:
Target TX power is configurable based on device or certification requirements.
4.5.3 Receiver Characteristics
Table 11: Receiver Characteristics
Parameter Rate Typ Unit
RX Sensitivity 1 Mbps –97 dBm
2 Mbps –94
5.5 Mbps –92
11 Mbps –88
6 Mbps –93
9 Mbps –91
12 Mbps –89
18 Mbps –87
24 Mbps –84
36 Mbps –80
48 Mbps –77
54 Mbps –75
11n, HT20, MCS0 –92
11n, HT20, MCS1 –88
11n, HT20, MCS2 –86
11n, HT20, MCS3 –83
11n, HT20, MCS4 –80
11n, HT20, MCS5 –76
11n, HT20, MCS6 –74
11n, HT20, MCS7 –72
11n, HT40, MCS0 –89
11n, HT40, MCS1 –85
11n, HT40, MCS2 –83
11n, HT40, MCS3 –80
Espressif Systems 18Submit Documentation Feedback
ESP32-PICO-V3-02 Datasheet v0.6
4 Electrical Characteristics
Parameter Rate Typ Unit
11n, HT40, MCS4 –76
11n, HT40, MCS5 –72
11n, HT40, MCS6 –71
11n, HT40, MCS7 –69
RX Maximum Input Level 11b, 1 Mbps 5 dBm
11b, 11 Mbps 5
11g, 6 Mbps 0
11g, 54 Mbps –8
11n, HT20, MCS0 0
11n, HT20, MCS7 –8
11n, HT40, MCS0 0
11n, HT40, MCS7 –8
Adjacent Channel Rejection 11b, 11 Mbps 35 dB
11g, 6 Mbps 27
11g, 54 Mbps 13
11n, HT20, MCS0 27
11n, HT20, MCS7 12
11n, HT40, MCS0 16
11n, HT40, MCS7 7
4.6 Bluetooth Radio
4.6.1 Receiver – Basic Data Rate
Table 12: Receiver Characteristics – Basic Data Rate
Parameter Conditions Min Typ Max Unit
Sensitivity @0.1% BER — –90 –89 –88 dBm
Maximum received signal @0.1% BER — 0 — — dBm
Co-channel C/I — — +7 — dB
Adjacent channel selectivity C/I
F = F0 + 1 MHz — — –6 dB
F = F0 – 1 MHz — — –6 dB
F = F0 + 2 MHz — — –25 dB
F = F0 – 2 MHz — — –33 dB
F = F0 + 3 MHz — — –25 dB
F = F0 – 3 MHz — — –45 dB
Out-of-band blocking performance
30 MHz ~ 2000 MHz –10 — — dBm
2000 MHz ~ 2400 MHz –27 — — dBm
2500 MHz ~ 3000 MHz –27 — — dBm
3000 MHz ~ 12.5 GHz –10 — — dBm
Intermodulation — –36 — — dBm
4.6.2 Transmitter – Basic Data Rate
Espressif Systems 19Submit Documentation Feedback
ESP32-PICO-V3-02 Datasheet v0.6
4 Electrical Characteristics
Table 13: Transmitter Characteristics – Basic Data Rate
Parameter Conditions Min Typ Max Unit
RF transmit power (see note under Table 13) — — 0 — dBm
Gain control step — — 3 — dB
RF power control range — –12 — +9 dBm
+20 dB bandwidth — — 0.9 — MHz
Adjacent channel transmit power
F = F0 ± 2 MHz — –55 — dBm
F = F0 ± 3 MHz — –55 — dBm
F = F0 ± > 3 MHz — –59 — dBm
∆ f1avg — — — 155 kHz
∆ f2max — 127 — — kHz
∆ f2avg/∆ f1avg — — 0.92 — —
ICFT — — –7 — kHz
Drift rate — — 0.7 — kHz/50 µs
Drift (DH1) — — 6 — kHz
Drift (DH5) — — 6 — kHz
Note:
There are a total of eight power levels from 0 to 7, and the transmit power ranges from –12 dBm to 9 dBm. When the
power level rises by 1, the transmit power increases by 3 dB. Power level 4 is used by default and the corresponding
transmit power is 0 dBm.
4.6.3 Receiver – Enhanced Data Rate
Table 14: Receiver Characteristics – Enhanced Data Rate
Parameter Conditions Min Typ Max Unit
π/4 DQPSK
Sensitivity @0.01% BER — –90 –89 –88 dBm
Maximum received signal @0.01% BER — — 0 — dBm
Co-channel C/I — — 11 — dB
Adjacent channel selectivity C/I
F = F0 + 1 MHz — –7 — dB
F = F0 – 1 MHz — –7 — dB
F = F0 + 2 MHz — –25 — dB
F = F0 – 2 MHz — –35 — dB
F = F0 + 3 MHz — –25 — dB
F = F0 – 3 MHz — –45 — dB
8DPSK
Sensitivity @0.01% BER — –84 –83 –82 dBm
Maximum received signal @0.01% BER — — –5 — dBm
C/I c-channel — — 18 — dB
Adjacent channel selectivity C/I
F = F0 + 1 MHz — 2 — dB
F = F0 – 1 MHz — 2 — dB
F = F0 + 2 MHz — –25 — dB
Espressif Systems 20Submit Documentation Feedback
ESP32-PICO-V3-02 Datasheet v0.6
4 Electrical Characteristics
Parameter Conditions Min Typ Max Unit
F = F0 – 2 MHz — –25 — dB
F = F0 + 3 MHz — –25 — dB
F = F0 – 3 MHz — –38 — dB
4.6.4 Transmitter – Enhanced Data Rate
Table 15: Transmitter Characteristics – Enhanced Data Rate
Parameter Conditions Min Typ Max Unit
RF transmit power (see note under Table 13) — — 0 — dBm
Gain control step — — 3 — dB
RF power control range — –12 — +9 dBm
π/4 DQPSK max w0 — — –0.72 — kHz
π/4 DQPSK max wi — — –6 — kHz
π/4 DQPSK max |wi + w0| — — –7.42 — kHz
8DPSK max w0 — — 0.7 — kHz
8DPSK max wi — — –9.6 — kHz
8DPSK max |wi + w0| — — –10 — kHz
π/4 DQPSK modulation accuracy
RMS DEVM — 4.28 — %
99% DEVM — 100 — %
Peak DEVM — 13.3 — %
8 DPSK modulation accuracy
RMS DEVM — 5.8 — %
99% DEVM — 100 — %
Peak DEVM — 14 — %
In-band spurious emissions
F = F0 ± 1 MHz — –46 — dBm
F = F0 ± 2 MHz — –44 — dBm
F = F0 ± 3 MHz — –49 — dBm
F = F0 +/– > 3 MHz — — –53 dBm
EDR differential phase coding — — 100 — %
4.7 Bluetooth LE Radio
4.7.1 Receiver
Table 16: Receiver Characteristics – BLE
Parameter Conditions Min Typ Max Unit
Sensitivity @30.8% PER — –94 –93 –92 dBm
Maximum received signal @30.8% PER — 0 — — dBm
Co-channel C/I — — +10 — dB
Adjacent channel selectivity C/I
F = F0 + 1 MHz — –5 — dB
F = F0 – 1 MHz — –5 — dB
F = F0 + 2 MHz — –25 — dB
F = F0 – 2 MHz — –35 — dB
Espressif Systems 21Submit Documentation Feedback
ESP32-PICO-V3-02 Datasheet v0.6
4 Electrical Characteristics
Parameter Conditions Min Typ Max Unit
F = F0 + 3 MHz — –25 — dB
F = F0 – 3 MHz — –45 — dB
Out-of-band blocking performance
30 MHz ~ 2000 MHz –10 — — dBm
2000 MHz ~ 2400 MHz –27 — — dBm
2500 MHz ~ 3000 MHz –27 — — dBm
3000 MHz ~ 12.5 GHz –10 — — dBm
Intermodulation — –36 — — dBm
4.7.2 Transmitter
Table 17: Transmitter Characteristics – BLE
Parameter Conditions Min Typ Max Unit
RF transmit power (see note under Table 13) — — 0 — dBm
Gain control step — — 3 — dB
RF power control range — –12 — +9 dBm
Adjacent channel transmit power
F = F0 ± 2 MHz — –55 — dBm
F = F0 ± 3 MHz — –57 — dBm
F = F0 ± > 3 MHz — –59 — dBm
∆ f1avg — — — 265 kHz
∆ f2max — 210 — — kHz
∆ f2avg/∆ f1avg — — +0.92 — —
ICFT — — –10 — kHz
Drift rate — — 0.7 — kHz/50 µs
Drift — — 2 — kHz
Espressif Systems 22Submit Documentation Feedback
ESP32-PICO-V3-02 Datasheet v0.6
5S
chematics
5 Schematics
This is the reference design of the SiP.5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
NC: No Component
IO20
Pin Mapping
NC
ESP32 ESP32-PICO-V3-02
VDDA
LNA_IN
VDD3P3
VDD3P3
SENSOR_VP
SENSOR_CAPP
SENSOR_CAPN
SENSOR_VN
CHIP_PU
VDET_1
VDET_2
32K_XP
32K_XN
GPIO25
GPIO26
GPIO27
MTMS
MTDI
VDD3P3_RTC
MTCK
MTDO
GPIO2
GPIO0
GPIO4
GPIO16
VDD_SDIO
GPIO17
SD_DATA_2
SD_DATA_3
SD_CMD
SD_CLK
SD_DATA_0
SD_DATA_1
GPIO5
GPIO18
GPIO23
VDD3P3_CPU
GPIO19
GPIO22
U0RXD
U0TXD
GPIO21
VDDA
XTAL_N
XTAL_P
VDDA
CAP2
CAP1
GND
VDDA
LNA_IN
VDD3P3
VDD3P3
SENSOR_VP
SENSOR_CAPP
SENSOR_CAPN
SENSOR_VN
EN
VDET_1
VDET_2
32K_XP
32K_XN
IO25
IO26
IO27
MTMS
MTDI
VDD3P3_RTC
MTCK
MTDO
IO2
IO0
IO4
NC
VDD_SDIO
SD_DATA_2
SD_DATA_3
SD_CMD
SD_CLK
SD_DATA_0
SD_DATA_1
IO5
NC
NC
VDD3P3_CPU
IO19
IO22
U0RXD
U0TXD
IO21
VDDA
NC
NC
VDDA
NC
NC
GND
EN
VDET_2/I35
SD_CLK/IO6
SD_CMD/IO11
SENSOR_VP/I36
GPIO16 GPIO18
GPIO23
GPIO17
SENSOR_CP/I37SENSOR_CN/I38SENSOR_VN/I39
VDET_1/I34
LNA_IN
32K_XP/IO32
U0TXD
GPIO19GPIO22U0RXD
GPIO21
MT
MS
/IO
14
GPIO20
32K
_X
N/IO
33
GP
IO25
GP
IO27
GP
IO26
MT
DI/IO
12
MT
CK
/IO
13
MT
DO
/IO
15
GP
IO0
GP
IO2
GP
IO4
GPIO16
SD_DATA_0/IO7SD_DATA_1/IO8
SD_CLK/IO6
SD_DATA_3/IO10SD_CMD/IO11
SD_DATA_2/IO9
GPIO18GPIO5
GPIO23
GPIO17
SD_DATA_2/IO9
SD_DATA_3/IO10GPIO18GPIO17 GPIO16
GPIO23
VDDA2
GND
VDDA
VDD33
GNDGND
VDD_SDIO
VDD3P3_RTC
GND GND
GNDGNDGND
GND
VDD33_CPU
GND
GND GND
GNDGND
GND
GND
VDDA1
GNDGND
GND
VDD_SDIO
GND
VDD_SDIO VDD_SDIO
Title
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A3
2 2Tuesday, May 12, 2020
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1.0
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1.0
L4
1.8nH
R1 20K
U4
PSRAM
CS#1
SO/SIO12
SIO23
VSS4
SI/SIO05SCLK6SIO37VDD8
C610nF
C201uF
C15
1.2pF
C118pF
C3100pF
C90.1uF
R9
NC
C180.1uF
C110.1uF
D1
NC
R17
10K
C5
3.3nF
C40.1uFC13
NC
L5 2.0nH
R14
51R
C190.1uF
C14
1.5pF
R15 510R
C120.1uF
C100.1uF
U2 ESP32
VDDA1
LNA_IN2
VDD3P33
VDD3P34
SENSOR_VP5
SENSOR_CAPP6
SENSOR_CAPN7
SENSOR_VN8
CHIP_PU9
VDET_110
VDET_211
32K_XP12
32K
_X
N13
GP
IO25
14
GP
IO26
15
GP
IO27
16
MT
MS
17
MT
DI
18
VD
D3P
3_R
TC
19
MT
CK
20
MT
DO
21
GP
IO2
22
GP
IO0
23
GP
IO4
24
VDD_SDIO26
GPIO1625
GPIO1727SD_DATA_228SD_DATA_329SD_CMD30SD_CLK31SD_DATA_032
GN
D49
SD_DATA_133GPIO534GPIO1835
GP
IO19
38
CA
P2
47
VD
DA
43
XT
AL_N
44
XT
AL_P
45
GPIO2336
U0T
XD
41
GP
IO22
39
GP
IO21
42
VD
D3P
3_C
PU
37
CA
P1
48
VD
DA
46
U0R
XD
40
GPIO2050
C218pF
U1
40MHz+/-10ppm
XIN
1
GN
D2
XO
UT
3
GN
D4
U3
FLASH
/CS1
DO2
/WP3
GN
D4
DI5
CLK6
/HOLD7
VC
C8
Figure 3: ESP32PICOV302 Schematics
EspressifS
ystems
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atasheetv0.6
6 Peripheral Schematics
6 Peripheral Schematics
This is the typical application circuit of the SiP connected with peripheral components (for example, power
supply, antenna, reset button, JTAG interface, and UART interface).5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
RESET BUTTON
Note: SD2/ IO9, SD3/ IO10, CLK/IO6 and CMD/IO11 are used for intergrated external flash orPSRAM and they cannot be used for other functions. The operating voltage of intergratedexternal flash and PSRAM is 3.3V. Therefore, the strapping pin MTDI/IO12 should hold bit "0"during module power-on reset.
EN
U0RXDU0TXD
LAN_IN
IO4
IO0
IO19IO22
ANTIO5
I34I35IO32
IO3
3IO
25
IO2
6IO
27
IO1
4IO
12
IO20
IO2
1IO
13
IO2
IO1
5
I39
IO7IO8
I38I37I36
EN
GND
VDD33
GND
GNDGND
VDD33
VD
D33
GND
GND
GND
VDD33
GND
GND
VDD33
Title
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Date: Sheet o f
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B
4 4Thursday, April 30, 2020
Title
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B
4 4Thursday, April 30, 2020
Title
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B
4 4Thursday, April 30, 2020
J3
BOOT OPTION
12
C4
TBD
J2
JTAG
1234
C3
TBD
C2
0.1uF
C5 TBD
C1
10uF
ANT1
12
J1
UART
1234
SW1
1
1
2
2
U1 ESP32-PICO-V3-02
VDDA1
LNA_IN2
VDDA3P33
VDDA3P34
SENSOR_VP/I365
SENSOR_CAPP/I376
SENSOR_CAPN/I387
SENSOR_VN/I398
EN9
VDET_1/I3410
VDET_2/I3511
32K_XP/IO3212
32
K_
XN
/IO
33
13
IO2
51
4
IO2
61
5
IO2
71
6
MT
MS
/IO
14
17
MT
DI/
IO1
21
8
VD
D3
P3
_R
TC
19
MT
CK
/IO
13
20
MT
DO
/IO
15
21
IO2
22
IO0
23
IO4
24
VDD_SDIO26
NC25
IO2027SD2/IO928SD3/IO1029CMD/IO1130CLK/IO631SD0/IO732
GN
D4
9
SD1/IO833IO534NC35
IO1
93
8
NC
47
VD
DA
43
NC
44
NC
45
NC36
U0
TX
D/I
O1
41
IO2
23
9
IO2
14
2
VD
D3
P3
_C
PU
37
NC
48
VD
DA
46
U0
RX
D/I
O3
40
R1
TBD
R2
0R
L1 TBD
Figure 4: ESP32PICOV302 Peripheral Schematics
Note:
To ensure the power supply to the ESP32 chip during power-up, it is advised to add an RC delay circuit at the EN pin. The
recommended setting for the RC delay circuit is usually R = 10 kΩ and C = 1 µF. However, specific parameters should be
adjusted based on the power-up timing of the SiP and the power-up and reset sequence timing of the chip. For ESP32’s
power-up and reset sequence timing diagram, please refer to Section Power Scheme in ESP32 Datasheet.
Espressif Systems 24Submit Documentation Feedback
ESP32-PICO-V3-02 Datasheet v0.6
7P
ackageInform
ation
7 Package Information
TECHNOLOGY SPECIFICATION[技术要求]
1.BAN TO USE THE LEVEL 1 ENVIRONMENT-RELATED SUBSTANCES OF JCET PRESCRIBING;
[禁止使用长电科技规定的一级环境管理物质;]
symbolDimension in mm Dimension in inch
MIN NOM MAX MIN NOM MAX
A 1.010 1.110 1.210 0.040 0.044 0.048
c 0.220 0.260 0.300 0.009 0.010 0.012
D 6.900 7.000 7.100 0.272 0.276 0.280
E 6.900 7.000 7.100 0.272 0.276 0.280
D1 4.850 4.950 5.050 0.191 0.195 0.199
E1 4.850 4.950 5.050 0.191 0.195 0.199
H --- 0.300 --- --- 0.012 ---
H1 --- 0.300 --- --- 0.012 ---
L 0.325 0.400 0.475 0.013 0.016 0.019
L1 0.000 0.075 0.150 0.000 0.003 0.006
L2 0.950 1.025 1.100 0.037 0.040 0.043
L3 0.950 1.025 1.100 0.037 0.040 0.043
e --- 0.500 --- --- 0.020 ---
b 0.200 0.250 0.300 0.008 0.010 0.012
aaa 0.100 0.004
bbb 0.150 0.006
ccc 0.100 0.004
ddd 0.050 0.002
eee 0.150 0.006
AD
2X
aaa C
PIN #1
CORNER
E
B
aaa C
2X
24
25
36
37 48
1
12
13
D1eee C A B
H PIN #1L2
H1
E1
eee C A B
L348×b
bbb C A B
ddd C
e
48×L
4×L1
CAVITYccc C
SEATING PLANEC
Side View
c
A
Top View Bottom View
APPROVE
CHECK
DESIGN
APPROVE
PROCESS
STAND.
DRAWING NO. REV.
DIMENSION AND TOLERANCES SCALE
PACKAGE OUTLINE DRAWING
[产品外形图]
PAGE
ASME Y14.5M
TITLE:
DESIGN
JCET
PROJECTION
A3
SIZE
MM
JCET
SIGNATURE AREA
长 电 科 技 CHANGJIANG ELEC. TECH.
UNIT
Yan Chen 2020.04.14
Hongye Fei 2020.04.14
Jie Cheng 2020.04.14
LGA-(7×7)-48
(P0.50 T1.21) GGP3.508.3021WX
PO-DA-770-0048-05-00
A00
10:11 OF 1
Figure 5: ESP32PICOV302 Package
EspressifS
ystems
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ocumentation
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32-PIC
O-V
3-02D
atasheetv0.6
7 Package Information
6.73
2.10
4.00
4.502.
10
4.00
4.50
6.73
0.50
0.50
GND Via Ø0.25
0.68
0.25
C0.5
R0.05
Copper
Solder mask opening
Via
Unit: mmTolerance: +/- 0.05 mm
Notes:1. It is recommended to use copper-defined pad for Pin 1 to Pin 48 and
solder-mask-defined pad for Pin 49 (thermal pad).2. This drawing is subject to change without notice.
0.78
0.35
0.25
0.68
Details of recommended copper-defined pad.
1
13
2512
24
36
48 37
49
Figure 6: ESP32PICOV302 PCB Land Pattern
Espressif Systems 26Submit Documentation Feedback
ESP32-PICO-V3-02 Datasheet v0.6
7 Package Information
6.05
2.40
3.90
6.05
7.71
7.71
1.80
0.30
0.30
1.80
2.40
3.90
7.00
7.00
Copper
Paste mask opening
Recommended via drill size: 0.25 mm
Unit: mmTolerance: +/- 0.05 mm
Notes:1. It is recommended to use a stencil of 80 um
thickness.2. This drawing is subject to change without
notice.
Figure 7: ESP32PICOV302 STENCIL
Espressif Systems 27Submit Documentation Feedback
ESP32-PICO-V3-02 Datasheet v0.6
8 Product Handling
8 Product Handling
8.1 Storage Condition
The products sealed in Moisture Barrier Bag (MBB) should be stored in a noncondensing atmospheric
environment of < 40 °C/90%RH.
The SiP is rated at moisture sensitivity level (MSL) 3.
After unpacking, the SiP must be soldered within 168 hours with factory conditions 25±5 °C and 60% RH. The
SiP needs to be baked if the above conditions are not met.
8.2 ESD
• Human body model (HBM): 2000 V
• Charged-device model (CDM): 500 V
8.3 Reflow Profile
50 150
0
25
1 ~ 3 /s
0
200
250
200
–1 ~ –5 /sCooling zone
100
217
50
100 250
Reflow zone
!217 60 ~ 90 s
Tem
pera
ture
()
Preheating zone150 ~ 200 60 ~ 120 s
Ramp-up zone
Peak Temp. 235 ~ 250
Soldering time> 30 s
Time (sec.)
Ramp-up zone — Temp.: 25 ~ 150 Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 /sPreheating zone — Temp.: 150 ~ 200 Time: 60 ~ 120 s
Reflow zone — Temp.: >217 7LPH60 ~ 90 s; Peak Temp.: 235 ~ 250 Time: 30 ~ 70 s
Cooling zone — Peak Temp. ~ 180 Ramp-down rate: –1 ~ –5 /sSolder — Sn-Ag-Cu (SAC305) lead-free solder alloy
Figure 8: Reflow Profile
Note:
Solder the SiP in a single reflow.
Espressif Systems 28Submit Documentation Feedback
ESP32-PICO-V3-02 Datasheet v0.6
9 MAC Addresses and eFuse
9 MAC Addresses and eFuse
The eFuse in ESP32 has been burnt into 48-bit mac_address. The actual addresses the chip uses in station, AP,
BLE, and Ethernet modes correspond to mac_address in the following way:
• Station mode: mac_address
• AP mode: mac_address + 1
• BLE mode: mac_address + 2
• Ethernet mode: mac_address + 3
In the 1 Kbit eFuse, 256 bits are used for the system (MAC address and chip configuration) and the remaining
768 bits are reserved for customer applications, including flash-encryption and chip-ID.
Espressif Systems 29Submit Documentation Feedback
ESP32-PICO-V3-02 Datasheet v0.6
10 Learning Resources
10 Learning Resources
10.1 MustRead Documents
The following link provides documents related to ESP32.
• ESP32 Datasheet
This document provides an introduction to the specifications of the ESP32 hardware, including overview,
pin definitions, functional description, peripheral interface, electrical characteristics, etc.
• ESP32 ECO V3 User Guide
This document describes differences between V3 and previous ESP32 silicon wafer revisions.
• ECO and Workarounds for Bugs in ESP32
This document details hardware errata and workarounds in the ESP32.
• ESP-IDF Programming Guide
It hosts extensive documentation for ESP-IDF ranging from hardware guides to API reference.
• ESP32 Technical Reference Manual
The manual provides detailed information on how to use the ESP32 memory and peripherals.
• ESP32 Hardware Resources
The zip files include the schematics, PCB layout, Gerber and BOM list of ESP32 modules and development
boards.
• ESP32 Hardware Design Guidelines
The guidelines outline recommended design practices when developing standalone or add-on systems
based on the ESP32 series of products, including the ESP32 chip, the ESP32 modules and development
boards.
• ESP32 AT Instruction Set and Examples
This document introduces the ESP32 AT commands, explains how to use them, and provides examples of
several common AT commands.
• Espressif Products Ordering Information
10.2 MustHave Resources
Here are the ESP32-related must-have resources.
• ESP32 BBS
This is an Engineer-to-Engineer (E2E) Community for ESP32 where you can post questions, share
knowledge, explore ideas, and help solve problems with fellow engineers.
• ESP32 GitHub
ESP32 development projects are freely distributed under Espressif’s MIT license on GitHub. It is
established to help developers get started with ESP32 and foster innovation and the growth of general
knowledge about the hardware and software surrounding ESP32 devices.
• ESP32 Tools
This is a webpage where users can download ESP32 Flash Download Tools and the zip file ”ESP32
Certification and Test”.
Espressif Systems 30Submit Documentation Feedback
ESP32-PICO-V3-02 Datasheet v0.6
10 Learning Resources
• ESP-IDF
This webpage links users to the official IoT development framework for ESP32.
• ESP32 Resources
This webpage provides the links to all available ESP32 documents, SDK and tools.
Espressif Systems 31Submit Documentation Feedback
ESP32-PICO-V3-02 Datasheet v0.6
Revision History
Revision History
Date Version Release notes
2021-02-09 V0.6
Added Figure 6 and Figure 7.
Deleted Reset Circuit and Discharge Circuit for VDD33 Rail.
Updated the C value in RC delay circuit from 0.1 µF to 1 µF.
Modified the note below Figure 8: Reflow Profile.
Added TWAI® in Section 1.1: Features.
2020-08-04 V0.5 Preliminary release.
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ESP32-PICO-V3-02 Datasheet v0.6
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