ESD SYSTEM OVERVIEW
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Transcript of ESD SYSTEM OVERVIEW
ESD SYSTEM OVERVIEW
ESD SYSTEM OVERVIEWSample Holder plateBias Filament Cu Sample12B-A gaugeRGABias SampleElectrometerButterfly valvePumping groupConductanceGas Injection LineFilamentFilament Power SupplyTransport rodFull Range GaugeESD SYSTEM OVERVIEW
Cu SAMPLES
Circuit
AAVV+15 V2-3 A35 KVCu Samples
main steps: MachiningCleaningHeat treatmentESDBake out: lower part
123456/1178910
Bake out: upper part
1B2B3B4B
RGA scans
RGA scans (valve closed)
Degassing: 9 Cycles @ 0.35KV
H2 %H2O%N2/CO %O2 %F %Ar %CO2 %9.5634.1 16.9 1312.49.2536.9Degassing: 9 Cycles @ 0.70KV
H2 %H2O%N2/CO %O2 %F %Ar %CO2 %233430.8 4018.916.244.9Degassing: 9 Cycles @ 1.5KV
H2 %H2O%N2/CO %O2 %F %Ar %CO2 %0.94-0.220.773.7-0.44-3.291.47Calibration: H2
Calibration FactorCalibration: N2
Calibration FactorCalibration: N2 2nd set of data
Calibration FactorDegassing: 30 Cycles @ 0.35 KV
CURRENT!!!!!
Desorption Yield
Desorption Yield
15 RGA Cycles for background Signal + biassing of the sample 15 RGA Cycles with the filament switched on filament + sample degassingDesorption Yield switch on the filament 15 RGA Cycles for background pressure 15 RGA Cycles with the sample biased
Desorption Yield @ 0.35 KV
Desorption Yield @ 10 KV
N2 calibration
Energy correlation
Desorption Mechanisms
Desorption Mechanisms
Stopping power and Range
Kinetic energyStopping Power (MeV cm2/gr)MeVCollisionRadiativeTotal1.00E-021.32E+011.21E-021.32E+01
Stopping power and Range
Kinetic Energy MeVRangegr/cm2Thicknesscm 1.00E-02
4.601E-045.15E-05Energy correlation
Energy correlation
Circuit
AAVV+15 V2-3 A35 KVExtra-electron source
Positive Polarization [KV]Current [A]Negative Polarization[KV]Current [A]7 0-0.2-70.681.1-1.2-80.892.2-91.8103.9-1051530-15100Degassing @ 5 KV
Improvements
Sheet1Vacuum dynamics REFERENCEVacuumArgon (mbar)H2 (mbar)H2 (1 bar)VacuumArgon (mbar)Hydrogen (mbar)Hydrogen (1 bar)w/o etchPassivation SLAC etchw/o etchPassivationSLAC etchw/o etchPassivationSLAC etchw/o etchPassivationSLAC etchw/o etchPassivationSLAC etchw/o etchPassivation SLAC etchw/o etchPassivation SLAC etchw/o etchPassivationSLAC etchw/o etchPassivation SLAC etchCERN22222222222224Bodycote22222222218SLAC2222241422222222222222222222222222456elliptical samples
Sheet2
Sheet3
bake-outTCPart of the systemEquip. DescriptionT ( C )1TMP valve1 Jacket + 1 TC1502T flanges3 Collars + 1TC1503T body1 Tape +1TC1504Full Range Gauge1 Tape +1TC1505Cross chamber flanges3 Collars + 1 TC1506 &11RGA4(2+2) Collars + 2 TC2007B-A Gauge2 Collars + 1 TC2508Sample Holding1 Tape +1TC1509Butterfly valve1 Tape +1TC12010Filament2 Tapes +1TC150
Sheet2
Sheet3
bake-out (upper part)TCPart of the systemEquip. DescriptionT ( C )1TMP1 Jacket + 1 TC1502T flanges3 Collars + 1TC1503T body1 Tape +1TC1504Full Range Gauge1 Tape +1TC1505Cross chamber flanges3 Collars + 1 TC1506RGA3 Collars + 1 TC2507B-A Gauge2 Collars + 1 TC2508Sample Holding1 Tape +1TC1509Butterfly valve1 Tape +1TC12010Filament1 Tape +1TC150
bake-out (lower part)TCPart of the systemEquip. DescriptionT ( C )1B (12)Cross body1flange+1cross body+1viewport + 1TC1502BRod1Tape+1TC803BPirani + Penning1 Tape + 1 TC1804BElbow body + Elbow flange+bellow2 Tape +1 flange + 1TC150TMP rackTMP Valve1 jacket150
Sheet3