ESD Precautions

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Contents

Objective

Handling of Hybrid Devices (Includes solder

reflow information)

Electrostatic Discharge (ESD)

Designated Static Control Areas

Flooring

Footwear/Footstraps

Footwear and Wrist Strap Testers

Humidity

Static Control Work Station

Work Surfaces

Tools

Handl ing Requirements

Product Packaging Materials

Documentation

Appendix A - Defini tions

ISSUE 1 November 1997

Objective

handling by the customer, packing requirements and static precautions to be taken to avoid ESD damage.

quality verification gates during the manufacturing process and visual inspection upon completion. All producis 100% electrically tested to ensure total customer satisfaction.

The following document will ensure that this built-in quality remains with the device in the customersapplication.

Understanding Product Handling and

ESD Precautions (for Hybrid Devices)

The purpose of this document is to cover the handling requirements for Zarlink product. This includes mechanical

Zarlink prides itself in the quality of all manufactured product leaving the company. All product is subjected to two

Wrist Straps


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Product Handling & ESD Precautions

Handling of Hybrid Devices

By handling, we mean any operation that involves

moving work from one place to another.

All components used in the manufacture of hybriddevices have hard cases that appear to protect themfrom rough handling. However, poor handling cancause internal damage, which is invisible. This

internal damage can then cause electrical failure or

reliability problems.

Hybrid devices are manufactured onto a basematerial of alumina. The alumina substrate is a brittlematerial and therefore all devices must be handled

with care. Caution should be taken never to allow thedevices to rub together or fall onto hard surfaces.The devices should not be emptied into a commoncontainer.

It is recommended that the devices be left in the

supplied packaging in order to maintain protectionprior to insertion into boards.

It is recommended the devices are not auto-inserteddue to their size, but inserted by hand into theboards.

Note: Pin 1 orientation must be observed prior toinsertion.

Unless specifically ordered as a surface mountvariant, hybrids cannot be passed through an I.R.

solder process. If they are to be loaded on a boardthat passes through a wave solder process, then onlythe leads may enter the solder. Maximumtemperature of wave allowed is 260C for 60seconds.

Electrostatic Discharge (ESD)

Electrostatic discharge (ESD) is one of the mostsignificant factors leading to damage and failure of awide variety of electronic components. This damage

results in increased manufacturing and warrantycosts, and unreliable products are the result.

comprehensive program for control of staticelectricity generation and discharge. This programcovers all levels of operations.

The implementation and maintenance of a Static

customers.

Designated Static Control Areas

Designated static control areas should be identifiedusing signs, barriers, etc., to clearly define theirlocation and extent.

Whenever facilities, work areas or materials flow are

changed, then the static control requirements shouldbe considered and included in the changes to ensureongoing effective static control.

Flooring

It is recommended that all workstations whereElectrostatic Discharge Sensitive devices (ESDS)and assemblies are handled outside of full staticprotection packaging (i.e. within static control areas)

should be provided with some form of groundconductive or dissipative flooring. This flooringshould ideally extend at least 18" (45cm) beyond thework station where the devices are handled. It ispreferable that this flooring extends continuouslybetween all work stations within the static control

area.

Suitable materials for this flooring include:

Static dissipative carpets

Carbon loaded plastic matting

Laminated dissipative matting

Dissipat ive paint

Dissipative wax or untreated concrete (if tested

and found acceptable).

Tests should be performed regularly on all installed

static control flooring to ensure its continuingeffectiveness.

For this reason Zarlink instituted and now maintains a

Control Program should be the goal of all Zarlink's


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Footwear/Footstraps

Some form of grounding footwear should be providedso that all individuals, while in the static controlareas, have a low resistance path (


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Static Control Work Station

It is recommended that all areas where ESDS

devices and assemblies are handled outside theirfully protective packaging (assembly, test, inspection,kitting, packaging, etc.), should be provided with astatic control work station.

These work stations should include as a minimum, a

grounded dissipative work surface of sufficient sizeand a grounded skin contact wrist strap. Both thewrist strap and the work surface should beconnected separately to the electrical groundthrough a 1 Mega-ohm resistor (in some high voltagetesting such as High Potential and Power Supply

areas, a 10 Mega-ohm resistor is advised) forpersonnel safety.

Work Surfaces

Work surfaces may be made from:

approved static dissipative soft or hard laminate

materials.

As an example, the ground wire assembly may beconstructed of 16 AWG with heat shrink tubing over

the 1 Mega-ohm resistor lead, or alternativelyprocured from an approved supplier.

Note: To avoid incorrect test results at stationswhere live assemblies are tested, it isrecommended that conductive mats are not

used.

Tools

Soldering irons

It is recommended that all soldering irons have thetip connected to ground.

Solder extractors

It is recommended that all soldering extractors be ofthe non-static generating type. Replacement partsshould also be non-static generating.

Handling requirements

Appropriate containers and packaging systems formovement of ESDS assemblies and components

between static control areas should be madeavailable. This includes shipment of kits toproduction, sending material to and from

subcontractors, moving semi-finished goodsbetween buildings and all similar movements. Allsuch packaging should provide full static protection.

Packaging in immediate contact with the ESDSmaterial should be static dissipative. Additionally,there should be a conductive shield totallysurrounding the material. The outer surface of thecontainer should be static dissipative.

Note: No circuits should be touched withoutantistatic precautions. This includes electrical

handling makes the results of failure analysis

invalid.

failures to be returned to Zarlink for analysis. Such


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Product Packaging Materials

It is recommended that ESDS products, all plastics,bubble shooting, film, foam, etc., used forpackaging finished products should havedissipative properties. No insulative packagingshould be used. Since conductive plastics andfoams are normally very expensive and, in fact,

present a certain second order of static dischargehazard, their use should be avoided unless it isdeemed to be absolutely necessary. Staticdissipative packaging is much more effective atpreventing damage than conductive packaging.

way, the original packaging should be used ifpossible. If this is not possible then the circuitsmust be packed into antistatic foam and then intoconductive boxes.

Documentation

All documentation must either be loose orcontained in antistatic wallets. Documentation mustnot be placed in non-conductive plastic.

Disclaimer

claims where the procedures for damage freehandling recommended in this document havenot been properly followed.

If work is to be returned to Zarlink or repacked in any

Zarlink reserve the right to refuse all warranty


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Appendix A - Definitions

Bulk Resistivity

A property of a material relating to a per unitresistance to the movement of an electric chargethrough the material. Units are ohm/cm.

Conductive

A class of materials which readily allows the

movement of electric charge. The bulk and surfaceresistivities of these materials are less than 105 ohm/cm and ohm/square respectively. Charge will notbuild up in localised areas on a conductor becausethe low resistivity allows the charge to quicklydistribute itself throughout the material. If the

conductor is connected to ground, all charge will flowaway.

Static Dissipative

A class of materials whose bulk and surfaceresistivities range from 105 to 1012 ohm/cm and ohm/

square respectively. These materials provide amoderate opposition to the flow of electric chargewhich prevents localised static charge accumulationin the materials and when connected to ground asparkless controlled dissipation of static chargeoccurs.

ESD

An abbreviation for electrostatic discharge, referring

to the flow of an accumulated static charge from anarea of high charge concentration to an area of aconcentration of an opposite charge or an area of

concentration of a lower charge, particularly toground. The rapid flow of charge in an ESD can leadto very large instantaneous currents, intense electricfields and electromagnetic radiation which candamage electronic devices if the discharge passesthrough or near them.

ESDS

An abbreviation for electrostatic discharge sensitive,referring to devices or assemblies which can bedamaged by having an ESD occurring through ornear them.

discharges as low as 100V and some as l ittle as 30V.

Insulator

A class of materials which provide very significantopposition to the flow of electric charge. Both bulkand surface resistivities are greater than 1012 ohm/

cm and ohm/square respectively. Insulators allowstatic charges to accumulate and, since thesecharges cannot flow freely, the time required todissipate these charges is extremely long. Theseproperties make insulators a hazard that must becontrolled as part of an overall program. To do this,all unnecessary insulators must be eliminated,

charge generation on insulators must be minimisedand the dissipation rate of charges on insulatorsmust be increased.

Static Control Area

Refers to designated areas within a facility where

special precautions are taken to keep ESD undercontrol such that ESDS material may be handledoutside of its fully protective packaging.

Many devices used by Zarlink are sensitive to


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www.zarlink.com

Information relating to products and services furnished herein by Zarlink Semiconductor Inc. trading as Zarlink Semiconductor or its subsidiaries (collectively Zarlink)is believed to be reliable. However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application oruse of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result fromsuch application or use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents orother intellectual property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of products are also hereby notified that the useof product in certain ways or in combination with Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property rights ownedby Zarlink.

This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form partof any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and otherinformation appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the capability,

performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guaranteethat such methods of use will be satisfactory in a specific piece of equipment. It is the user

s responsibility to fully determine the performance and suitability of anyequipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does not necessarilyinclude testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in significant injuryor death to the user. All products and materials are sold and services provided subject to Zarlink

s conditions of sale which are available on request.

Purchase of Zarlink s I

2

C components conveys a licence under the Philips I

2

C Patent rights to use these components in and I

2

C System, providedthat the system conforms to the I

2

C Standard Specification as defined by Philips.

Zarlink and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.

Copyright 2001, Zarlink Semiconductor Inc. All Rights Reserved.

TECHNICAL DOCUMENTATION - NOT FOR RESALE

For more information about all Zarlink products

visit our Web Site at


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www.zarlink.com

Information relating to products and services furnished herein by Zarlink Semiconductor Inc. or its subsidiaries (collectively Zarlink) is believed to be reliable.However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any suchinformation, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application oruse. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectualproperty rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of products are also hereby notified that the use of product incertain ways or in combination with Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property rights owned by Zarlink.

This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form partof any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and otherinformation appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding thecapability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constituteany guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the users responsibility to fully determine the performance andsuitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does

not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result insignificant injury or death to the user. All products and materials are sold and services provided subject to Zarlinks conditions of sale which are available on request.

Purchase of Zarlinks I2C components conveys a licence under the Philips I2C Patent rights to use these components in and I2C System, provided that the system

conforms to the I2C Standard Specification as defined by Philips.

Zarlink, ZL and the Zarlink Semiconductor logo are t rademarks of Zarlink Semiconductor Inc.

Copyright Zarlink Semiconductor Inc. All Rights Reserved.

TECHNICAL DOCUMENTATION - NOT FOR RESALE

For more information about all Zarlink products

visit our Web Site at

ESD Precautions

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