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Military/Aerospace Forum Benchtop Power Supplies Teardown: Apple iPad

JULY 2010

In This Issue...

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©2010 National Instruments. All rights reserved. LabVIEW, National Instruments, ni.com, and NI TestStand are trademarks of National Instruments. Other product and company names listed are trademarks or trade names of their respective companies. 1849

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Vol. 53, No. 2 JULY 2010CONTENTS

11 PRODUCT UPDATECrystals and oscillators

71OUTLOOKDark laser

COVER STORYTEST & MEASUREMENT SPECIAL

27 Our annual look at some of the hot topics and trends in test and measurement

29 How scopes deliver 20-GHz bandwidthsand up

34 Moving to LTE-Advanced . . . before LTE arrives!

38 Testing high-performance mixed-signal designs

45 The evolution of real-time testing

48 Measuring and analyzing LED performance

54 Using an oscilloscope to debug the I2C protocol

56 Making more accurate high-resistance measurements

60 Why should you have a digital pattern generator?

FEATURES

17 Military/Aerospace Forum

22 Benchtop Power SuppliesBattery-drain analysis for mobile devices

89 Ferrite core takes the lead

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PRODUCT TEARDOWN

64 What’s Inside? ... Apple iPad

ENERGY-SAVING INITIATIVE SERIES

66 Server rooms shape up and power down

67 Blog: Super caps to grow at 20% through 2014

DEPARTMENTS

7 Viewpoint: The view from Crude Beach

8 Product of the Year Story Behind the Story: Isolating pain points brings success

11 OUTLOOK (Technology News)◾ Dark laser produces stable, 90-ps pulse train◾ Super-small thin films can superconduct ◾ Cu-on-Si process to speed portable

RF electronics development ◾ Flash Memory Summit: Santa Clara, Aug. 17-19

68 Product Roundup: Electromechanical switches

71 Product Update: Crystals and oscillators

NEW PRODUCTS74 Optoelectronics

75 Power Sources

79 Packaging & Interconnections

82 Integrated Circuits

85 Components & Subassemblies

Electronic Products Magazine (USPS 539490) (ISSN 0013-4953)—Published monthly by Hearst Business Communications Inc./UTP Division, 50 Charles Lindbergh Blvd., Suite 100, Uniondale, NY 11553. Periodicals postage paid Uniondale, NY and additional mailing offices. Electronic Products is distributed at no charge to qualified persons actively engaged in the application, selection or

procurement of electronic components, instruments, materials, systems and subsystems. The publisher reserves the right to reject any subscription on the basis of information submitted in order to comply with audit regulations. Paid subscriptions available: U.S. subscriber rate $65 per year, 2 years $110. Single issue, $6.00. Information contained herein is subject to change without notice. No responsibility is assumed by the publisher for its accuracy or completeness.Postmaster: Send address changes to Electronic Products, PO Box 3012, Northbrook, Il 60065-3-12. Phone 847-559-7317 ©2010 by Hearst Business Communications Inc./UTP Division. ALL RIGHTS RESERVED Publications Mail Agreement Number 40012807. Return Undeliverable Canadian Addresses to: Station A PO Box 12, Windsor, ON N9A 6J5

what’s ONLINE...electronicproducts.com

Testing complex modulated wireless systemsAnritsu, Morgan Hill, CA

Polaris networks, Lexington, MACommunications Platforms Trade Association, Beaverton, OR

What’s Inside Apple iPad

64

Testing requirements for AdvancedTCA platforms

MEMS testing in mass production STMicroelectronics, Milan, Italy

Web-based IC customization revolutionizes timing circuitsSilicon Laboratories, Austin, TX

Want to see what the Editors are thinking? http://www2.electronicproducts.com/ElectronicProductsBlogs.aspx

and more!

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© 2010 Cirrus Logic, Inc. All rights reserved. Cirrus Logic, Cirrus, the Cirrus Logic logo designs, EXL Core, and the EXL Core logo design are trademarks of Cirrus Logic, Inc. EP072010

VIEWPOINT

The view fromCrude BeachBased on current news reports, it seems that deep-sea oil exploration technology is lopsided.

For me, summer always seems to be associate with a movie. For instance, A Summer Place, with Sandra Dee and Troy Donahue, will always brings back

memories of the summer of 1959, which I spent with oth-er teenagers at the beach in Connecticut, and Steven Spielberg’s Jaws also reminds me of days on the beach — but not in the water — in 1975. Unfortunately, I think I’ll always associate the summer of 2010 with a video of gal-lons of oil spewing from a twisted, truncated pipe deep in the Gulf of Mexico.

I was watching that video just a few days ago on the New York Times Web site (www.nytimes.com/interactive/ 2010/06/08/us/20100608-oil-spill-live-video-feed-bp.html), ROV cameras from the Skandi Neptune offshore construc-tion vessel showed gas and oil constantly boiling out of the drill casing, while cameras on the Boa Deep C’s Ocea-neering ROVs watched as its robot arms tried to loop ca-bles through steel eyes of equipment that had to be moved. The operation seemed clumsy, until you remem-bered it was being done a mile underwater.

All in all, the technology being used seems pretty amazing; the tele-presence does make you feel as if you are actually on the ocean floor, and the machines are managing to do some amazing things. It just seems as if the technology available to cope with the problem is not enough and a bit too late.

Based on current news reports, it seems that deep-sea oil exploration technology is lopsided. The technology being used to discover and extract oil is well funded and

highly advanced. The technology that isn’t being unwrit-ten and pushed ahead is that for coping with potential problems and events that have led to today’s ecological disaster.

It’s not hard to understand why that’s the case. Any executive can go to the company’s board and say, “I’m going to spend $X million to increase our productivity, and thus improve our bottom line by $XX million.” But if he or she were to say, “I’m going to spend $X million on equipment we may not need, and it won’t improve our profits unless a disaster occurs,” that person is likely to soon be sailing through the skies on a golden parachute.

While the ultimate way to prevent such spills from happening is to stop being heavily dependent on oil, that isn’t likely to happen in the near future. And alternative energy may present problems we have yet to realize. If we are going to field advanced technology, we’re going to have to spend more time thinking about its risks and pre-paring to cope with them.

The only practical way to balance the application of technology to deep-sea oil exploration is to mandate that companies that are granted drilling licenses show that they are able to rapidly respond to a crisis in a way that prevents it from becoming an environmental disaster. Then all we’ll have to worry about when we go to the beach in the summer is attacks by Great Whites.

Richard [email protected]


The Akros AS1854 power SoC is a game changer for PoE-powered devices. This Product of the Year

winner is the first to have a 2-kV isola-tion barrier and integrate the function-ality of numerous ICs and passive com-ponents into a single package. As with all cutting-edge technology it didn’t come to fruition without difficulties.

The major challenge at the outset was designing the high-voltage isola-tion integrated with a power SoC. The requirement was to create a physical isolation barrier that can withstand 4-kVrms separation and 25-kV/μs transients without disrupt-ing high-speed data transfer between the two sides of the IC. These are ex-

tremely difficult specifications to follow for any material, let alone im-plementing them in a bulk CMOS process. The 15-member design team even had to develop unique ways to physically model in 3-D the material and packaging to ensure the chip could withstand the high voltages and transients. And all of this was done on a shoe-string startup budget in just two years.

The idea and necessity for the de-sign the company calls the GreenEdge technology came while working with customers who were creating power-system designs for various IP-connect-

ed equipment. These OEMs had so-phisticated methods to monitor and control logic circuits from remote management software, but were chal-lenged with lack of management and control available in power sub-sys-tems. The Akros team worked with OEMs to understand the pain points involved and trade-offs needed.

GreenEdge technology was the re-sult and helped eliminate the tradi-tional information and communica-tion barrier that existed between high-voltage power domains and low-voltage software domains. It bridges the gap between real-time decision-making software (local or remote) and the power subsystem; providing a su-

perior end-to-end energy manage-ment architecture. The isolation tech-nology enables complete remote monitoring and control of IP appli-ance power subsystems, making net-work-based energy management a practical reality. It reduces space by 40%, system BoM cost by 25%, and provides efficiencies exceeding 90%. Currently, no other digital isolation technology exists in the industry that is specifically targeted and used for power-system cost and efficiency opti-mization, or designed to enable net-work-based energy management.

Paul O’Shea

Isolating pain points brings success

The AS1854 integrates high-voltage isolation and quad-output digital power dc/dc converters in a single device with minimal external components and no optocouplers

EDITORIAL STAFF 516-227-1300 FAX: 516-227-1444

Managing Editor Bryan DeLuca

Senior Editor Paul O’SheaPower Sources, Power Management,Discrete Semiconductors, Circuit Protection, Cooling Devices941-359-8684 • [email protected]

Editor Christina NickolasAnalog/Mixed-Signal ICs, Analog EDA Software, Oscillators, Electromechanical Switches, Prototyping Tools, Microwave Components516-227-1459 • [email protected]

Technical Editor Jim HarrisonDigital ICs, Boards & Peripherals, Development Tools, Motors & Controls 415-456-1404 • [email protected]

Editor Richard ComerfordTest & Measurement, Optoelectronics, Sensors & Transducers, Enclosures, Cabinets, Chassis516-227-1433 • [email protected]

Assistant Editor Christina D’AiroPassive Components, Interconnections, Wire and Cable, Materials 516-227-1383 • [email protected]

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Electronic PRODUCTS

PRODUCT OF THE YEARTHE STORY BEHIND THE STORY

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News about Products... Product Technology... Product ApplicationsOUTLOOK


Dark laser producesstable, 90-ps pulse trainMode-locked diode laser uses quantum dots to produce

soliton-like output that may suit measurement, communication

Scientists at the National Institute of Standards, Boul-der, CO, and at the University of Colorado, Boulder have developed a passively mode-locked quantum-dot

diode laser whose output consists of a train of dark pulses, that is, dips in intensity from a continuous background. The laser’s ultrashort pulses — as little as 90 ps at 1,168 nm — not only make it suitable for short-time measurements, but may also benefi t communications applications because the pulses generally propagate without distortion.

The team fabricated an external-cavity semi-conductor diode laser (see fi gure) using a 5-mm-long single-mode semiconductor ridge wave-guide with InGaAs self-assembled quantum dots buried in the core as the gain section. The dots are all about the same size — about 10 nm in diameter — and all emit light at the same frequency. The quantum dots’ complex gain dy-namics provide the fl exibility needed to operate where dark pulses are stable.

Light amplifi ed by the quantum-dot active region is collimated, fi ltered by a Fabry-Perot etalon, and focused on a saturable absorber to initiate mode-locking. The saturable absorbing medium consists of a few intentionally damaged semiconductor wells grown in an integrated resonant structure to increase the electric fi eld intensity and lower the saturation radiative fl ux over time (fl uence). The absorber structure also acts as an end mirror for the laser cavity. The Fabry-Perot etalon, which has a transmission bandwidth of 10 nm, provides spectral fi ltering to tune and restrict the lasing bandwidth. The fl at facet of the semiconductor diode is used as the output cou-pler with a refl ectivity of approximately 35%. When the laser cavity is well aligned, lasing action occurs with 60 mA of current injected into the gain medium.

A close analogy to the dark pulses are dark optical soli-tons, which are solutions to the nonlinear Schrödinger equation. The equation describes propagation in nonlin-ear media such as optical fi ber, but it does not contain

dissipative terms such as gain, loss, and saturation, which are present in a mode-locked laser. Optical dark solitons are predict-ed to have many properties of practical importance such as ex-

istence in the normal dispersion regime, lack of a thresh-old, and resistance to Gordon-Haus jitter. The dark pulse is a straightforward solution to the linearized version of the equation that describes the operation of a passively mode-locked laser. While having similarities to dark soli-tons, the pulses, the researchers believe, are not actually dark solitons, as they are not transform limited.

Dark pulse generation has previously been observed in semiconductor amplifi ers after injection of a bright pulse, but the pulse train was not stable and eventually decayed. To determine if their dark-pulse solution was stable, the team performed simulations for the full (not linearized) equation and found that the parameters of the laser fall into the range predicted to have stable dark pulses. For further information, e-mail Steven T. Cundiff at [email protected].

Richard Comerford

The external-cavity quantum-dot diode laser shown here in schematic form can stably produce pulses approximately 90 ps wide when the light output nearly shuts down about every 2.5 ns.

Scientists from Bar-Ilan University, Israel, and the U.S. Department of Energy’s (DOE) Brookhaven National Laboratory have worked together to create thin fi lms

that superconduct when cooled below 30 K (–243°C). Led by physicist Ivan Bozovic, the Brookhaven team used mo-

lecular beam epitaxy to build a material with alternating layers of copper-oxide, lanthanum, and strontium, a tech-nique previously used to produce thin fi lms that retain su-perconductivity within a single copper-oxide layer.

The team at Bar-Ilan then used electron-beam lithog-

Super-small thin films can superconduct

OUTLOOK


Cu-on-Si process to speed portable RF electronics development

ON Semiconductor (Phoenix, AZ) recently an-nounced a new integrated passive device (IPD) process technology, an enhancement to the com-

pany’s existing HighQ copper (Cu)-on-silicon (Si) IPD technology, which promises to enable fast development

of cost-effective RF front-end products. Dubbed IPD2, the new 8-in.-wafer process features a second 5-μm copper layer that increases inductor performance, allows greater fl exibility, and supports the design of highly precise, cost-effective IPDs for RF system-in-package applications in

A fragment of superconducting thin film, patterned with nanoloops that measure 150 nm on a side (small) and 500 nm on a side (large), where the nanowires making up each loop have a diameter of 25 nm.

raphy to etch a pattern of thousands of loops into the surface of the material, forming “nanowires” on the sides of these loops that measured 25 nm in diameter and 150 to 500 nm in length. When measured, electrical re-sistance of the patterned arrays showed that they were indeed superconducting when cooled below about 30 K. The scientists also noted that when an external magnetic fi eld was applied perpendicular to the loops, the loop resistance did not continue to increase steadily, but rather changed up and down in an oscillatory manner. “These oscillations in resistance have a large amplitude, and their frequency corresponds to discrete units (quan-ta) of magnetic fl ux — the measure of the strength of the magnetic fi eld piercing the loops,” Bo-zovic said. “A material with such a discrete, switchable

form of magneto-resistance — especially from the superconducting to the non-supercon-ducting state — could be extremely useful for engineering new devices.”

The frequency of the oscillations in resis-tance may also hold some insight as to why copper-oxide materials become superconduc-tors in the fi rst place, and potentially lead to further designs for new materials.

The research appears in the June 13, 2010, online issue of “Nature Nanotechnology” (www.nature.com/nnano/journal/vaop/ncurrent/abs/nnano.2010.111.html), and is supported by the DOE’s Offi ce of Science, by the German Re-search Foundation through a German-Israeli cooperative agreement, and by a scholarship

granted by the Israel Ministry of Science.Christina D’Airo

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OUTLOOK


Flash Memory Summit in Santa Clara, August 17 to 19

Spending a little time at this year’s Flash Memory Summit (Aug. 17 to 19) at the Santa Clara Conven-tion Center* could pay big returns in knowledge

gained about this high-fl ying technology. New applica-tions seem to arrive daily for this low-cost storage medi-um. We have some information for you on a few of the companies that will be exhibiting there.

Anobit (Herzeliya Pituach, Israel) will show you the Genesis SSD, which uses Memory Signal Processing (MSP) technology to deliver lower cost as the fi rst-ever MLC-based SSDs to provide the enterprise-grade reliability and performance previously achievable only by SLC devices. Denali (Sunnyvale, CA) will tell you all about its Dataplex host software product, which delivers dramatic perfor-mance gains using a small NAND fl ash SSD paired with a standard HDD. Dataplex uses intelligent, adaptive cach-ing algorithms to store hot data and applications in an SSD cache, while all other data resides on the HDD.

Intel (Santa Clara, CA) will be demonstrating its X25-V high-value SATA SSD drive, which is aimed at netbooks and dual-drive/boot-drive desktop setups. The affordable $125 40-Gbyte drive yields up to 43% faster system per-formance when used as a boot drive in a dual-drive desk-top PC setup. Another interesting confi gu-ration is two X25-V drives in a RAID 0 setup. JDSU (Milpi-tas, CA) will offer the Xgig LXP 6-Gbit/s SAS/SATA de-velopment system, which offers host and target emulation, as well as error injection and analysis capabilities. This multipurpose tool helps users overcome high-speed serial design chal-lenges and accelerates development of storage subsys-tems.

LeCroy (Chestnut Ridge, NY) will have on hand its next-generation USB test tools, which can help acceler-ate development of USB 2.0 and USB 3.0 devices. LeC-

roy’s Voyager analyzer provides full support for the new USB At-tached SCSI (UAS) protocol and can em-ulate real UAS host operations to help optimize SuperSpeed

performance. Mosaid (Ottawa, Ontario, Canada) will be showing the HLNAND SSD prototype, which uses a

INDILINX controller and multiple 64 Gbyte HyperLink NAND fl ash modules. With a standard SATA 2.0 system interface it achieves 220 Mbyte/s read and 142 Mbyte/s write performance.

OCZ Technology (San Jose, CA) will show the Sand-Force-based Deneva SSDs, which pro-

vide the demanding performance and reliability needed for enterprise-class

storage and computing ap-plications and feature vari-ous OEM-specifi c options. Meanwhile, SandForce (Saratoga, CA) will demon-strate its SSD processors which address the inher-ent endurance, reliability, and data retention issues associated with MLC fl ash,

making it possible to build SSDs that deliver superior per-formance and reliability for broad-based deployment in enterprise applications.

Sandisk (Milpitas, CA) would like to show you the SSD P4, which is ideal for use in small computing devices such as netbooks, smartbooks, and tablet computers. The durable device offer low power consumption and fast performance in capacities from 8 to 128 Gbytes. Silicon Motion Technol-ogy (Jhubei City, Taiwan, ROC) can show you the SM2250 8-channel SSD controller designed to provide high IOPS performance for notebook, enterprise, servers, and high-end workstation applications. Compliant with SATA II, the chip features advanced NCQ functions and a powerful 40-bit BCH ECC engine.

SMART Modular Technolo-gies (Newark, CA) will demon-strate the XceedIOPS 1.8- or 2.5-in. SATA SSD, which is available in 50 to 400 Gbytes and features E-MLC NAND technology. The SSD delivers 250-Mbyte/s sequential read/write speeds and up to 30,000 random input/output opera-tions/s. STEC (Santa Ana, CA) will show the ZeusIOPS enter-prise solid-state drive, which enables storage systems to re-lieve performance bottlenecks.

Jim Harrison

The JDSU Xgig LXP SAS/SATA development system has advanced error injection capabilities.

LeCroy’s Voyager analyzer provides full support for the USB Attached SCSI (UAS) protocol.

SandForce will demonstrate its SSD processors.

SMART Modular‘s XceedIOPS 1.8- or 2.5-in. SATA SSD is available in 50 to 400 Gbytes.

*For more on this year’s Flash Memory Summit at the Santa Clara Convention Center, visit www.flashmemorysummit.com.

portable electronics equipment.Typical IPD2-based designs will include baluns, low-

pass and bandpass fi lters, and diplexers used in the latest portable and wireless applications. This process will be

supported with a comprehensive set of design tools and technical assistance, plus prototyping capabilities. For more information, visit http://www.onsemi.com.

Christina Nickolas

“How can I tell if a power supply is reliable?”

© 2010 Agilent Technologies, Inc.

There’s an indicator on the front.It says “Agilent.” With a typical MTBF of 40,000 hours, over half-a-century of experience, and with more than 250 models to choose from, Agilent’s power supplies are the ones you can count on. In fact the array of our power supplies is so extensive, it wouldn’t fit on this page. For clean, low-noise, programmable power to countless DUTs, there’s an Agilent power supply with your name on it. Actually, it’s our name on it, but you know what we mean.

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Military/aerospace suppliers face a special challenge to provide products that meet

exacting requirements for safety in rigorous environments, and yet they must also provide these products at competitive prices . Some of the is-sues for today’s suppliers include commercial off-the-shelf usage de-signed for long-term reliability, deal-ing with counterfeiting, RoHS issues, and the need for upscreening.

Electronic Products: Are COTS products an important piece of the total cost reduction solution? And is long-term reliability being affected?

Brad Little (High Reliability Product Manager, Texas Instruments): You have to look at this in a bigger picture;

what are we com-paring against? Are we comparing to SCD drawings and looking at that total cost or are we talk-ing about particular applications or en-vironments that

this may be a suitable solution for? From a cost standpoint, I think

that’s a pretty difficult question to answer as you’ve got to weigh the risk and reward from using commer-cial off-the-shelf products, which may only be suitable for certain ap-plications.

Bill Toumey (Vertical Segment Man-ager, Arrow Electronics): I view COTS [commercial off the shelf] as being non-SCD [source control drawings], what you are buying are standard catalog items . . . you could be buying Mil spec parts example, JAN 38510 or 5962 or MIL-Pref 19500s . . . what you

Experts talk about problems with counterfeiting, ITAR controls, and the affect of COTS on long-term reliability

are buying are stan-dard catalog items.

Buying a full Mil-tested part an-swers the question on long-term reli-ability and by vir-tue of the products being standard cat-

alog items that would indicate a pub-lished market price, avoiding cost associated with custom devices. So if that would be the case I think that takes that question of long-term reli-ability out or at least the customer’s buying a tested product. Is that part of that definition, Brad when you...

Brad Little: Yes, I agree with you on that.

John O’Boyle (Business Manager, Mil/Aero Products, Maxim Integrated Prod-ucts): Yeah, we see a lot more move-ment towards COTS, probably three quarters of the business that we do

with the military aerospace commu-nity today is com-mercial off-the-shelf parts. But they still want them with lead finish. So a lot of times they’re buying the parts lead-free

and then refinishing them. But they can’t retest them after they refinish them, which creates a serious problem because they use outside refinishers, who are not set up to do the same level of test as the original manufacturer.

The outside refinishers can do shorts and opens and that sort of thing, but they can’t test the func-tionality and if they cycle them to a higher temperature they could dam-age the parts. So there are a lot of hidden problems in this approach. ESD also comes into play here.

So what we do is we offer our cus-tomers a program where we supply lead finished parts for the mil/aero customers. Those come fully tested on our final QA programs. It’s the same test program we use for the lead-free part. So the customer is getting, like Bill and Brad were commenting, fully tested parts. My concern is when they take a part and just refinish it and plug it onto a board and then it fails, say, 200 hours into the field. That’s a serious issue, like if the land-ing gear doesn’t go down.

Bill Toumey: Not to contradict what John said, many customers are tin/solder-dipping parts and it could cause serious quality issues if the hot solder comes too close to the case, which could cause the seal to crack. Regarding electrical testing, many of the third-party test houses that per-form the solder-dipping cannot per-form the same level of electrical test-ing as the manufacturers themselves.

John O’Boyle: That’s true. We know how to test our parts because we designed them and built them. We know where the weak spots are so we’ll stress those more. Not that there’s any weak spots in any of our parts, of course.

We know how to test them, and test houses don’t. So they’ll test for basic functionality, but there’s a lot of things that are built into parts that we test that never end up on a datasheet.

So I’m just basically raising a red flag. You need to be careful. Say you’re putting a refinished part into a handheld radio it’s probably not a big deal. If you refinish the part and it fails in the field, it is not as serious as a failure on a critical aircraft sys-tem. But if the part is on, say, the landing gear on a military aircraft

CONVENED AND MODERATED BY PAUL O’SHEA

Military/Aerospace Forum

TECHNOLOGYROUNDTABLE


and it doesn’t go down when it’s sup-posed to, well that’s real embarrass-ing. That actually did happen in the past year on an upscreened part.

Wes Morgan (Director of Product Management, ITT): Usage of COTS components requires adoption of the manufacturer’s specification by the customer. The manufacturer’s specification should be based on testing related to reliability.

TECHNOLOGY ROUNDTABLE


When the cus-tomer agrees to adopt the manu-facturer’s specifica-tion, long-term re-liability is not compromised, un-less the manufac-turer’s specifica-

tion is not adequate to meet the reliability requirements of the cus-

tomer’s application.Electronic Products: How do you

see the advent of stricter ITAR con-trols in the U.S. impacting your ability to sell and export our reli-ability dual use items as compared to the past?

George Karalias (Director of Mar-keting, Rochester Electronics): It seems like it’ll probably be getting stricter. As far as our business is concerned with EOL and mature semiconductors,

there’s pretty much a standard list of what can and can’t go, and it’s estab-lished. So we actual-ly aren’t as affected, or our customers aren’t as affected sig-nificantly, as a next-

generation technology provider. We definitely adhere to ITAR —

very much so. But with all that’s go-ing on, it seems like, from what we hear within the government and even through the SIA Anti-Counter-feiting Task Force, ITAR probably will have ramifications that I don’t think will ever go away.

Brad Little: Globally, we do see an increased concern, for instance, at our European customer base where there seems to be a trend to buy ITAR-free products. So we do see some potential impact in regards to our international business

Wes Morgan: Stricter ITAR con-trols have impacted the ability of many U.S. companies that provide state controlled articles as part of their product offering. Although this can be mitigated through standard-ization efforts to build commercial offerings, it requires additional time and effort to get into a compliant sta-tus once an ITAR controlled base has been established.

John O’Boyle: I’ve talked to my European cus-tomers and they try to avoid buy-ing parts from U.S. suppliers that are subject to ITAR or gov-ernment com-merce export controls. So it has an adverse affect on our business because our customers are


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buying products from other vendors overseas rather than buying from us simply because they’re trying to avoid having to do the registration/export licensing.

The military guys overseas really don’t like to be telling the U.S. gov-ernment what they’re doing in terms of buying a part. Obviously they do it if the only place they get it is from the U.S. vendor. And it’s not just

with Maxim, it’s with everybody and it’s pretty widespread. I’ve heard the same comment from more than one customer over there.

Electronic Products: How sig-nificant is the problem of counter-feiting in the mil/aero industry? And the second part of that ques-tion would be what steps are you taking to protect your company or customers from procuring counter-

feit components?Bill Toumey: I’ll just give you a

stat I pulled up on a report I was looking at a couple of weeks ago from the U.S. Department of Commerce, Bureau of Industry and Security, Of-fice of Technology Evaluation dated January 2010. In 2005 there were 3,868 reported incidences of coun-terfeit products. In 2008 that num-ber was 9,356.

I dare to say that based on some of the [data] that I’ve seen thus far this year that number will probably be up again. In the past, I think a lot of the — I’ll call it noncore distribution companies, brokers, independents and gray market folks — were used primarily to locate obsolete prod-ucts, products that are not be in pro-duction today.

It appears that some of the lots that are being identified as counter-feit were procured by major custom-ers in support of production. This is troubling. I understood that in the past it was acceptable to use every potential source looking for these hard to find / odd parts, you search the world. But now when produc-tion-like quantities are showing up from these, unnamed sources — that is troubling.

Brad Little: I think Bill gave a good overview. At TI, we strongly encour-age customers to only buy through authorized TI distributors or TI sales. We also have a counterfeiting task group that we formed to tackle this issue and work with the SIA and gov-ernment agencies to protect our cus-tomers from counterfeit products.

So we do see it as a serious issue and we’re treating it as such. And I also think it goes along with the first question when you were talking about using COTS and Bill high-lighted the increasing obsolescence issues that the aerospace industry faces. This has helped to enable bro-kers and grey market suppliers to come in and fill the component availability gaps.

John O’Boyle: We have the same policy that people only buy through authorized distributors, but we still get a lot of parts counterfeited. And I had a customer recently that said that since they couldn’t get the part from us they were going to go to the gray market. They told me point blank.

TECHNOLOGY ROUNDTABLE



I said, “Do what you want, but we have knowledge of every single part. This is a mil-spec part and ev-ery single part that I’ve shipped of this part number has gone to,” and I listed the customers; “no parts ex-ist in the gray market.” So if you’re going to get something, it’s going to be a re-marked part with the right number of leads. You’ll be lucky if it even works.

Wes Morgan: Counterfitting does not seem to be a high-level problem for us. To protect our com-pany and customers we include date code/Mintmark information that helps to correctly identify the source of manufacturing.

Bill Toumey: The OEM customer-base holds us to very strict guidelines here in the channel. At Arrow, we only buy from our franchise sources, and I don’t think the industry should be going outside the franchise chan-nel. One recent example of third part testing had the end customer here in the States ask for Group A only, no X-ray, no DPA — their lot was more than 38% counterfeit. I don’t believe the

industry should be going outside the franchise channel. .

George Karalias: I totally agree with Bill from Arrow. We find that people say they have to go to the gray market. We’ve found that the problem is exacerbated by a lot of the procurement procedures that are in place within government or indus-try, and the testing and inspection, as Bill said, is really, in a lot of cases, just highly inadequate.

The other part of it is the commu-nication within the industry and the government in talking about what the situation is. This is also a short-coming, which is getting better. I mean back when we started to talk about this and had a symposium on the counterfeiting problem in 2006, it was really a lot of hush-hush. But now it’s definitely coming to the forefront, and we’ve found a lot of cooperation out there as far as people talking about it and seeing how the problem can be remedied.

Electronic Products: Well how do you know a part is counterfeit? I’m as-suming you have to take apart a prod-

uct to see, is that correct? Let’s just say, anything that’s electronic you pull it apart and you’re looking for what?

George Karalias: The part that has to be tested and looked at with that kind of scrutiny is subject to question-able reliability to begin with. Especial-ly for military. As both John and Bill know and Brad, once you leave the au-thorized channel, then it’s free rein. It’s the Wild West, and you don’t know what you’re going to end up with be-cause, if you have that traceability with a legitimate C of C and legitimate paperwork that traces back to TI or Maxim or anywhere, it’s your only sure bet to avoid the counterfeit prob-lem. If you do even have parts that you feel are legitimate, but you want to go through the testing process, it really has to be done with the original test programs – the original processes that were done by the original manufac-turer. Oftentimes you don’t have suf-ficient testing to really tell you what’s going on with a component if it’s not an authorized testing process.

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Battery operating time is a criti-cal factor in the design of mo-bile devices. Many mobile de-

vices incorporate greater functionality, which can quickly reduce runtime. Engineers must employ complex pow-er-management schemes to get the most runtime out of the battery.

To assess runtime, engineers use battery drain analysis, which entails characterizing the device, its firm-ware/software, and its subcircuits, both independently and in combi-nation as a system. Analysis tech-niques include characterizing the battery current drain and how it is affected by the various operating modes and use profiles. With this analysis, engineers can make power management design tradeoffs that maximize battery life.

Most power management systems conserve battery power by putting to sleep, on a sub-millisecond time scale, subsystems that are not active-ly in use. The result is that the device draws a rapidly changing current with on/off events that can take place in a fraction of a second. For example, a GSM cell phone can have 560-μs, 2-A pulses when transmit-ting and then drop back down to milliamp levels during sleep periods, when in standby mode

Validating battery timeOne approach to validating battery-operating time is to use a voltage rundown test where a fully charged battery powers the device under test (DUT) in the operating mode to be validated until the battery dies. This test can be relatively time-consum-

Battery-drain analysis for mobile devices

Understanding battery drain lets designer use complex power-management schemes to increase device runtime

BY EDWARD BROREIN and BOB ZOLLOAgilent TechnologiesSanta Clara, CAhttp://www.agilent.com

Fig. 1. There are several elements in a generic, ideal system for battery current-drain measurement and analysis.

ing as it runs to completion to iden-tify the voltage shutdown point to determine operating time. Also, the results depend on the initial state of the battery, which can vary consid-erably.

An alternative approach is to per-form a current-drain measurement that provides a higher confidence in operating time measurement. The DUT is placed in the operating mode to be evaluated for a short period of time, and the current drain is mea-sured during that specific operating mode. The operating time is then calculated by dividing the nominal battery capacity by the measured current drain. With this method, a designer doesn’t have to wait for the battery to fully discharge to deter-mine runtime.

Elements of an ideal systemIn an ideal system for performing battery drain analysis (see Fig. 1), A means for placing the DUT into the appropriate operating mode for the desired testing (DUT stimulus) is the first thing needed. For mobile phones, a base-station emulator is usually employed.

Second, a means of properly pow-ering the DUT is required, using ei-ther a battery or a power supply. A power supply is useful for testing the DUT independent of its battery to ensure consistency of test or to quickly replicate various battery states without having to wait for the battery to reach those states (fully charged, partially discharged, fully discharged/end-of-life).

Other important system elements are a current transducer for measur-ing current, a digitizer to log the voltage and current signals and soft-ware for analyzing and storing test data, which can be massive — up to gigabytes — for long-term tests.

Measurement considerationsBattery drain analysis using a power supply allows the DUT to be charac-terized independently of its battery. The power supply must have fast re-sponse to minimize transient voltage droop resulting from fast-slewing cur-rent pulses drawn by the DUT as it switches modes or transmits pulses. Many general-purpose power sup-plies can exhibit up to 1 V of tran-


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sient droop under these conditions, so a specialized pow-er supply (sometimes called a battery-emulating power supply) that can tolerate these conditions without voltage droop should be used.

The rapidly changing current waveforms flowing from the battery into the mobile device present two measure-ment challenges: range and speed. First, the dynamic range of current can be greater than 1000:1 or even 1,000,000:1. With full power active currents on the order of 1 to 3 A, and with low-sleep-mode-level currents on the order of tens of microamperes, the range of current to be measured creates a challenge for selecting a current transducer.

A current-sense resistor, or current shunt, could be used but selecting the appropriate sized current shunt can be a challenge. If the shunt is sized to measure the lowest current, there will be a large voltage drop across the shunt during the high-current events, and this will place an un-bearable burden voltage on the circuit. If the shunt is sized for the high current, there will most likely not be enough voltage to measure when microamperes are flow-ing. By going with several shunts for different sized mea-surements, an engineer can solve the signal level issue,

Fig. 2. The current-drain waveform of the RF power amplifier of a cdma2000 handset is complex and unpredictable when viewed in the time domain (above). The same current waveform viewed in a CCDF graph (below) lets designers easily see how often the device is in each current state.

Battery-drain analysis for mobile devices

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but then switching shunts means in-terrupting the measurement.

With respect to measurement speed, the digitizer measures the current shunt voltage and the bias voltage to the mobile device should have a sample rate of 50 kHz or faster to capture sub-millisecond pulses characteristic of sophisticated power management schemes.

Simplifying complex analysisCommunications systems such as 3G employ complex modulation for-mats, characterized by high levels of amplitude modulation required to transmit higher data rates. The re-sulting current-drain waveforms are complex and random when viewed in the time domain.

The current drain versus time for an RF power amplifier of a cdma2000 handset transmitting with three data channels (see Fig. 2a) becomes more complex and unpredictable when run over long periods with varying operation. This scenario is typical for a battery operating-time

test, and it is difficult to observe the effects of design changes on current drain.

A better way to visualize and ana-lyze complex current-drain patterns is to examine their statistical distri-bution, using a complimentary cu-mulative distribution function (CCDF) graph. A CCDF graph will plot current along the x-axis versus its cumulative percent of occurrence on the y-axis (see Fig. 2b).

By looking at the statistical dis-tribution of how much current is being drawn, a designer can quickly see how often a device operates in each current state. Comparing these CCDF charts for various designs shows when the device consumes more power (that is, spends an in-creased percentage of its time in a high-current state) or when it con-sumes less power (i.e., spends an in-creased portion of its time in a low-current state). Therefore, an engineer can evaluate when a design is better (takes less power) or identify a de-sign flaw (unexpectedly takes more power).

Off-the-shelf solutionsSeveral test equipment vendors make products that address various parts of the desired test system. Some vendors offer power supplies that can provide a stable, battery-like output when rapid current puls-es are drawn.

An entry level solution is the Agi-lent Technologies 66300 Series of Mobile Communications DC Sourc-es. The series is purpose-built for powering a mobile device and si-multaneously measuring its current consumption. It integrates a bat-tery-emulating power supply with a high-speed digitizing measurement system similar to an oscilloscope and can provide accurate current measurements for a device’s active, standby and off modes.

This dc source and its companion turnkey software lets users see their current waveforms in a scope-like view, a data-logger view, and on a CCDF chart, without any program-ming. If more accuracy and higher acquisition speeds are needed, other solutions are also available.

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SPECIALTEST & MEASUREMENT

The year 2009 saw the rise of third-generation serial busses such as USB and SATA, and

2010 will see PCIe gen3 with a data rate of 8 Gbits/s and fourth genera-tion SAS serial bus at 12 Gbits/s. In addition to increasing data rates for serial busses, the idea of directly dig-itizing signals above the X-Band (25 GHz) has become more common in applications such as satellites. Opti-cal applications operating at 100 Gbits/s and greater are becoming in-creasingly more popular.

Until 2007, technologies such as these required down conversion or testing with measurement equip-ment unrelated to real-time oscillo-scopes. Now designers can use real time oscilloscope to test third- and fourth-generation serial busses, check direct- digitize signals above the X-band, and easily make 100-Gbaud optical measurements. Since several suppliers now offer band-widths greater than 16 GHz in their oscilloscopes, using different hard-ware and software techniques, it is important to understand the trad-eoffs they make to achieve high bandwidth.

Raw hardware performanceThe most difficult way to achieve bandwidths greater than 20 GHz is through raw hardware performance. A real-time oscilloscope vendor must invest in multiple chips that are rat-ed to these bandwidths (including the preamplifier).

Processes are need that produce a transistor cutoff frequency greater than 150 GHz; these processes are ex-pensive and not common. For an os-

How scopes deliver20-GHz bandwidths and upUnderstanding new techniques used to capture high-speed bus

signals makes choosing the appropriate instrument easiercilloscope vendor, the expense is even greater than computer manufactur-ers, as the former is unable to benefit from economies of scale. Even with

the right processes, the oscilloscope supplier must be able to design in this high speed environment.

For example, for its 90000 X-Series oscilloscope, Agilent cre-ated a proprietary Indium Phosphide (InP) technol-ogy with a cutoff fre-quency of 200 GHz. Thus the highest bandwidth unit in the series, the DSAX93204A, achieves its full 32 GHz with no additional hardware and software techniques. As a result, the oscilloscope’s noise density is the same from 31 to 32 GHz as it is from 1 to 2 GHz. In addition to high bandwidth chips (see Fig. 1), the DSAX93204A uses new packaging techniques to ensure that the InP chips can run at full bandwidth with-out overheating.

Currently, other suppliers use sil-icon germanium to achieve their scope’s bandwidth; the process they

are using has a cutoff frequency close to 110 GHz, so their preamplifier bandwidth is equal to 16 GHz. It is possible to achieve a 200-GHz cutoff frequency without abandoning sili-con germanium. For example, IBM’s 8HP process has a 207-GHz cutoff frequency.

Another benefit of developing high-bandwidth hardware perfor-mance is that the probing can use the same chip process and achieve high bandwidth as well. In the case of Agilent, its probing system achieves 30 GHz.

Raw hardware performance’s big-gest drawback is that it takes signifi-cant time and investment to develop what is often referred to as true-ana-log bandwidth at the high frequen-cies encountered by oscilloscope us-ers today. And just because an oscilloscope has hardware perfor-mance to high bandwidth, it is still very important to understand how

well it was designed; the front end of an oscilloscope could still have high noise if not designed correctly.

Frequency interleavingTo achieve a 30-GHz bandwidth, some oscilloscope designers have chosen to use uses a technique known as frequency interleaving. A

BY BRIG ASAYAgilent Technologies, Santa Clara, CAhttp://www.agilent.com

Chip process technologies available for oscilloscope vendors

Process Company Cutoff freq. (GHz)

HBT (InP) Agilent 2008HP (SiGe) IBM 207

B7HF200 (SiGe) Infineon 2007HP (SiGe) IBM 110

BiCMOS 9MW (SiGe) STMicro 230SG25H1 (SiGe) IHP 190

Fig. 1. This multichip module was developed for the 90000 X-Series oscilloscope.


technique used in the RF world for many years, frequency interleaving is different than the traditional in-terleaving of the ADCs used by oscil-loscope vendors.

All oscilloscope vendors tradi-tionally interleave channel resources such as memory and ADCs to obtain high sample rate and deeper memory depth. For example the Infiniium DSAX93204A interleaves four 20-Gsample/s ADCs to obtain an 80-Gsample/s rate. However, until the use of frequency interleaving, the in-terleaving techniques were only done post acquisition and could only be tightly controlled using highly ac-curate clocks inside the oscillo-scope.

Even so, interleaving errors still occur in today’s oscilloscopes. This causes increases in the oscilloscope’s total harmonic distortion (THD); in most cases, the increase in THD is a worthwhile tradeoff for higher sam-ple rate.

Frequency interleaving, which re-quires additional hardware and ad-vanced digital signal processing, takes this idea of interleaving to a new level. Not only does a vendor in-terleave after the acquisition has tak-en place, but during the acquisition itself. This means that a signal is ac-tually interleaved twice during the entire acquisition process.

To understand how frequency in-terleaving works, consider a signal. The signal enters the oscilloscope and is immediately split by a diplexer, into multiple frequency bands — high fre-quency components and then low fre-quency components. The low frequen-cy components are equivalent to the actual analog performance of the os-

cilloscope, currently limited to 16 GHz.

The high-frequen-cy components are immediately down-converted to have fre-quency components that the oscilloscope hardware can handle. For example, if an os-cilloscope has analog performance to 16 GHz, but the vendor uses frequency inter-leaving to achieve 30 GHz, then frequency components to 16

GHz would not be down-converted, but all components greater than 16 GHz will immediately be passed through the down-converter.

The two frequency components then go through significant digital signal processing to ensure the high-

frequency component was correctly acquired. The low- and high-fre-quency components are then recom-bined to nearly double the analog bandwidth of the oscilloscope.

By developing the frequency inter-leaving technique, oscilloscope ven-dors can produce higher-bandwidth scopes without having to develop ex-pensive preamplifier chips. As is the case with most t e c h n i q u e s , there are trad-eoffs that must be considered.

The biggest tradeoff is the total harmonic distortion, based on how good the interleaving technique is. All of the processing adds distortion, and the additional hardware increas-es the signal path and noise (see Fig. 2). Thus the interleaving technique trades off some measurement accu-racy for increased bandwidth.

DSP boostingIn 2004, the first 13 GHz oscillo-scope used a technique known as DSP boosting to raise bandwidth from 12 to 13 GHz. At the time, many argued that the technique caused too much noise, and they did not accept the 13-GHz figure as a “real” bandwidth. However, in 2007, the first 20 GHz oscilloscope DSP boosted from 16 to 20 GHz. Sudden-ly the arguments against DSP boost-ing seemed to ease, as two major vendors were now “boosting.” But,

more importantly, it was then the only way to achieve a 20-GHz bandwidth.

The first 20-GHz oscilloscope was very well received

in the market, as designers now could make higher bandwidth measure-ments on 6- and 8-Gbit/s signals. They purchased the oscilloscope based only on the banner specifica-tion, without worrying about the technology underlying it.

So what is DSP boosting? DSP boosting is a processing technique in which the high-frequency content of

Fig. 3. Software can be used for DSP bandwidth-enhancement filtering.

Fig. 4. In this sine wave sweep with

DSP boosting, note the noise “boost” at high frequency.

Fig. 2. Noise floor comparisons of different oscilloscopes with different techniques. The 90000 X-Series uses raw hardware.


How scopes deliver 20-GHz bandwidths and up


Fig. 5. Using a 10.3125-Gbit/s industry standard PRBS7 pattern signal with ISI added, measurement performance using of raw hardware (left) and DSP boosting (below) is compared. The raw hardware performance yields over 25% more eye height and width.


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an oscilloscope is pumped with soft-ware. One important point to note is that DSP boosting needs to be distin-guished from other types of DSP cor-rection that oscilloscope vendors use today.

To understand DSP boosting, first remember that a signal can be bro-ken down into its numerous frequen-cy components. Using software, you can amplify the higher-frequency components of the signal. In Fig. 3, the red trace represents a typical os-cilloscope frequency response. The green trace is the result of using a software filter to amplify the high-frequency components, which re-sults in the increased bandwidth.

At this point everything looks just fine. But there is one major draw-back: when the signal is amplified, so is the noise contribution of the os-cilloscope. Depending on how much boosting is done, the technique could actually degrade the signal and give worse results than a lower-bandwidth, non-boosted signal.

This is the single most important reason to really analyze how much

boosting is occurring and whether the bandwidth-noise tradeoff is ac-ceptable. Figure 4 shows the effects of DSP boosting from 16 to 20 GHz on the noise of an oscilloscope. This in-crease in noise has a direct impact when measuring circuit performance (see Fig. 5).

Selections considerationsIn looking to select a scope, the ban-ner specification alone is not the ideal way to measure an oscilloscope’s suit-ability. Oscilloscope vendors use vari-ous techniques to achieve high band-width, and these techniques come with tradeoffs that may be detrimen-tal to measurement accuracy. Accu-racy is not free, and so users should expect to get what they pay for.

If one has a choice between scopes with raw hardware bandwidth or a bandwidth created through DSP techniques, such as boosting or fre-quency interleaving, a rule of thumb is that the one with raw hardware bandwidth will likely be more accu-rate. However, designers should in-vestigate even the most technically advanced oscilloscopes — checking the noise floor, jitter measurement floor, and so forth — to find the one that best suits their needs.



As the Long Term Evolution (LTE) of UMTS networks begins its worldwide rollout based on 3rd

Generation Partnership Project (3GPP) Release 8, and as new features are con-sidered for Release 9, big improve-ments are already being discussed for the next enhancement — LTE-Ad-vanced — which will form Release 10.

LTE-Advanced will add significant features to those of previous releases. Together, they will produce a true fourth-generation wireless technolo-gy with the potential for very high data rates that have so long been promised but haven’t yet appeared.

“What!” you say, “LTE is not a 4G standard?” If you’re talking to the marketing department, the answer is “Of course it is.” But if you ask the technical community, they’ll re-spond “No, it isn’t.” A little history explains why.

The concepts embodied in LTE-Advanced were formed in 2008 when the International Telecommunica-tion Union (ITU) grouped them to-gether within the term IMT (Interna-tional Mobile Telecommunications) -Advanced. This separated IMT-Ad-vanced from the capabilities of past digital wireless standards, which are included under the umbrella of the ITU’s original global wireless plan called IMT-2000. The latter includes UMTS/WCDMA, CDMA 20001xRTT and 1xEV-DO, TD-SCDMA, WiMAX, and LTE Release 8.

The data rate requirements of IMT-Advanced (100 Mbits/s in high-mobil-ity scenarios and 1 Gbit/s in fixed- and low-mobility conditions) effectively rendered it impossible for LTE Release 8 to be considered a true 4G mobile communication system, even though

Moving to LTE-Advanced... before LTE arrives!

True fourth-generation wireless service may be just around the corner; will it mean a significant change in instrumentation?

some of its requirements were met (see Table 1). So LTE is not officially a 4G technology, but rather a major step in that direction. However, as Table 2 shows, LTE-Advanced takes a consid-erable step beyond LTE.

Achieving 4GLTE-Advanced will strive to improve LTE through higher peak and average data rates, greater spectrum efficien-cy, and reduced latency in the control and user planes. To achieve these goals, current LTE features have been improved and new ones defined.

Higher uplink and downlink peak data rates can be achieved by enhanc-ing multiple input, multiple output

(MIMO) capabilities and through car-rier aggregation. MIMO in its simplest form means the use of multiple trans-mit or receive antennas or both (di-versity) to achieve greater perfor-mance. For LTE-Advanced, single-user

MIMO in the downlink can be up to 8 transmit and 8 receive (8 x 8 con-figuration) antennas and now also 4x4 in the uplink, which has not been defined with LTE as of Release 8.

Carrier aggregation is a method for combining the available spectrum in order to accommodate the 100-MHz maximum bandwidth defined with IMT-Advanced. However, as 100 MHz of continuous frequency spectrum is

BY ANDREAS ROESSLERRohde & Schwarz, Columbia, MDhttp://www.rohde-schwarz.com

Table 2. Potential, cost, and benefits of LTE-Advanced

Table 1. Comparing LTE release 8, IMT-Advanced, and LTE-Advanced


not available to any carrier worldwide, carrier aggrega-tion (see Fig. 1) allows fre-quencies in different blocks to be combined to produce something reasonably close.

Up to five carriers, each with bandwidths up to 20 MHz, produce the trans-mission bandwidth of 100 MHz, and, to ensure back-ward compatibility, each carrier can be configured to be compliant with 3GPP Release 8, but need not be compatible with it.

Even if all of a carrier’s licensed frequency blocks are combined, the result will not be 100 MHz, and new spectrum allocations cannot be made until 2015, when the World Radio Conference (WRC) next convenes. Consequently, initial LTE-Advanced deployments will likely be limited to two or three carriers for a maximum downlink/uplink bandwidth of either 40 or 50 MHz, depending on the mode (FDD or TDD).

With LTE in Release 8, transmis-sion of data and control infor-mation is decoupled and the terminal uses the physical up-link control channel (PUCCH) only to transmit information when it does not have to transmit any data on the physical uplink shared chan-nel (PUSCH). This is no lon-ger the case with LTE-Ad-vanced, in which simultaneous transmission of PUCCH and PUSCH is possible, providing a significant increase in aver-age throughput.

Release 8 uses a “localized” SC-FDMA mode (modulation symbols are assigned to adja-cent subcarriers). This continuous mapping provides multiuser gain in the frequency domain. In Release 10, the uplink transmission scheme is ex-tended to support clustered alloca-tion of subcarrier (resource blocks). This enables the flexibility benefits of frequency-selective scheduling, but increases the peak-to-average power ratio, which makes more demands on transceiver and power amplifier de-signers to maintain linearity.

High speed on ‘the edge’Peak spectrum efficiency can be

achieved by using the highest possi-ble level of MIMO and highest-order modulation scheme — which for the downlink means 8 x 8 MIMO and 64QAM modulation. Both enhance-ment techniques require a signifi-cant high signal-to-noise ratio, which is not likely to be present at the edge of the cell’s coverage area.

To improve performance in this area, LTE-Advanced improves spec-tral efficiency using Coordinated Multiple Point Transmission and Re-ception (CoMP). The CoMP concept (see Fig. 2) coordinates and combines

signals from multiple base stations to maintain the high data rates nec-essary to allow LTE-Advanced to achieve its full potential, especially at or near the cell edge.

A user at the edge of a cell’s coverage area may be able to receive signals from multiple cell sites, and the user’s trans-mitted signal may be receivable at mul-tiple cell sites. Assuming this, by coor-dinating the signaling from the multiple cell sites, downlink perfor-mance can be significantly improved. Coordination can be as simple as fo-cusing on interference avoidance. In

the uplink, the signal can be received by multiple cell sites, and through coordina-tion of different cell sites the network can use this multi-ple reception to improve link quality.

New challenges, new boxes?It is reasonable to expect that the major LTE-Ad-vanced enhancements will need new test equipment,

but thanks to trends in test equipment design, this is not necessarily the case. For example, the R&S SMU200A vec-tor signal generator and R&S AMU200A baseband signal generator/fading sim-ulator combine two signal generators in one instrument so multiple compo-nent carriers can be generated. Using a single SMU200A configured with two baseband units, two component carri-ers up to 20 MHz in bandwidth can be generated and faded in real-time ei-ther with contiguous or non-contigu-ous placement. Generating and aggre-gating more component carriers is

possible with additional signal generators.

If no real-time fading and individual power leveling are required, arbitrary multicarrier waveform signal generation is another option that simplifies the setup. With this approach, an instrument such as the R&S SMBV100A vector signal gener-ator, which has a 120-MHz bandwidth, large waveform memory, and high clock rate, can generate complex modu-lated multicarrier waveforms for the proposed contiguously-deployed 100-MHz bandwidth of LTE-Advanced.

So LTE-Advanced promises perfor-mance gains in peak data rates, spec-tral efficiency, performance at the cell edge, overall coverage. and the deliv-ery of what users of wireless-enabled devices have long wanted — truly high-speed data throughput equal to, or perhaps even better than, a wired solution at home. LTE-Advanced, which is at least four years away from deployment, will be received in direct proportion to how well its “3.9G” pre-decessor, LTE, is received in the com-ing years. However, based on its poten-tial, it will be worth the wait.

Fig. 1. The principle of contiguous and noncontiguous carrier aggregation in LTE-Advanced.

Fig. 2. Basic CoMP principles take signals from multiple base stations to maintain the high data rates.


Moving to LTE-Advanced ... before LTE arrives!


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Embedded and computing sys-tems have become increasingly more powerful by incorporating

high-speed buses, industry standard subsystems, and more high-integrat-ed-functionality chips. They have also become more complex, more sensitive to signal quality, and more time consuming to troubleshoot.

While standards exist for many technologies commonly used within high-performance digi-tal systems, a major test challenge is to ensure that these elements are synchronized and per-form as a seamless, inte-grated whole. When hardware and software engineers are working together to troubleshoot the root cause of a spe-cific problem, they require a complete view of information on a bus — both its electrical representation and a higher level of abstraction like the de-coded view of a serial bus protocol. Testing, debugging, and validating a more-complex high-performance de-sign, typically with multiple subsys-tems, requires the ability to time-cor-relate analog and digital signal information.

In such scenarios, engineers are turning to high-performance mixed-signal oscilloscopes (MSOs) that can provide accurate information on tim-ing performance along with views for analyzing data at higher levels of ab-straction. While MSOs have been available for some time, only recently

Testing high-performance mixed-signal designs

In today’s digital systems, ensuring that all elements are synchronized and act as an integrated whole is a major challenge

have they achieved performance lev-els necessary to allow debugging of the latest high-speed serial memory and RF systems.

Analog-digital correlationThe context surrounding an event, provided by time-correlated analog and digital signal information, can be invaluable in debugging digital sys-tems. For example, what memory lo-

cation was being accessed? Where did this packet of information originate? What was the state of the ASIC when that bus fault occurred? Low-level or physical layer details can help identify root cause but often the most efficient way to trace issues is to un-derstand in what state was the larger system. Being able to capture several views of signaling as it flows through a system can provide useful clues and insights.

It is often valuable to analyze specific cycle types, such as signal integ-rity during read cycles or write timing jitter for a spe-

cific bank of memory. Sophisticated signaling schemes such as in DDR can complicate debugging. When cycle in-formation is distributed across several digital signals, it takes sophisticated triggering to respond to it in real time. Thus, effective debugging may include detecting signal faults only during specific bus cycles. Digital pattern qualification can be applied to logic-fault trigger types to detect signal

faults in real time, such as a glitch during a read.

High-speed serial designsHigh-speed serial bus ar-chitectures, including PCI-Express, HDMI, and SATA, provide considerable data throughput along with such benefits as differen-tial signaling, lower pin count, and less space for board layout. As multi-gigabit data rates become common, signal integrity is a critical concern. One

bad bit in the data stream can impact the outcome of an instruction or transaction.

High-performance video systems, such as high-end set top boxes, incor-porate a variety of technologies such

BY CHRIS LOBERGTektronix, Beaverton, ORhttp://www.tektronix.com

Fig. 1. The HDMI system architecture includes high-speed clock and data lines along with the display data channel.

Fig. 2. A display of the SDATA line in digital and analog format makes clear the glitch on I2C SDATA line was due to noise-coupling effects.


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as RF receivers, video processors, memory and high-speed serial inter-faces. In this case, the system uses an HDMI interface which operates at 3.4 Gb/s across each of the three data lanes. The architecture of the HDMI link (see Fig. 1) includes high-speed clock and data lines, along with the display data channel (DDC), which uses I2C signaling in standard mode (10 MHz). The DDC line is used for in-

formation exchange between the source (transmitter) and sink (receiver) devices.

This design required debug as the output to the monitor would turn off intermittently. First the physical layer was checked for functional operation and each lane passed eye diagram and jitter measurements. After the high-speed clock and data lines were mea-sured, the I2C control lines were moni-

tored for error codes or invalid data. In normal operation the DDC uses ad-dresses 0xA0 and 0xA1. Using an MSO, engineering were able to capture and decode the I2C traffic and discover that an incorrect address would some-times be asserted during power up. In the display of the SDATA line in digital and analog format (see Fig. 2), it ap-peared, based on the analog signal view, that there was crosstalk or other noise-coupling effects that corrupted the I2C traffic.

In order to find the root cause of the glitch, adjacent lanes were ana-lyzed and edge rates were evaluated across each high-speed lane. Figure 3 shows a 19-μs time window with a trend plot of edges occurring close to the glitch (see Fig. 3), provides some insight into what caused the signal anomaly. The minimum measured rise time of 53 ps was much faster than the 90 to 100 ps edge rates typically found in HDMI systems. The design was then modified to slow the edge rates and the data and clock shielding lines were also improved.

RF testOne of the challenges with software defined radio design is troubleshoot-ing and mitigation of hardware and software errors. As DSP controls more and more of the analog functionality, illegal state or filter values in the digi-tal baseband portion of a design can manifest themselves as RF spectrum errors when they are propagated to the filtering and amplifier portions of a transmitter.

Time correlated analog and digital views facilitate the task of complex multi-domain analysis. Aided by vec-tor signal analysis software, a thor-ough analysis that includes the fre-quency-, time-, and modulation- domains can be performed on the same data ac-

Fig. 3. In this trend plot of rise times within a 19-μs window near the I2C glitch, the fastest edge rate measured is about 53 ps.



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quisition. To illustrate this, an MSO’s logic trigger was set to catch an illegal state value to the input of a DAC in a transmitter design. The logic trigger for an all “1” state value (0x3F) triggers the acquisition. The correlated view of the analog signal (see Fig. 4) is shown delayed in time by about 34 ns. This represented the absolute delay in the DAC conversion process of this high-speed device.

This analysis enabled the mulit-domain correlated analysis of a signal to the logic state to the spectral re-growth appearing within a pulsed signal on an analog channel. The time domain view of the RF signal did not provide the complete view of the impact this might have on a software radio design,

so further correlated analysis of the RF performance was required.

To assess the RF performance of the signal on the same acquisition, soft-ware analysis was performed on the same data set (see Fig. 5). A logic state trigger was used to trigger the data set and discrete Fourier transforms (DFTs) were performed to show the Spectro-gram and Spectrum frequency domain analysis, and time sampled data is dis-

played as RF I&Q vs. time and amplitude vs. time.

Time correlated mark-ers were turned on to dem-onstrate the time-correla-tion of the RF analysis for different views. This re-vealed that the illegal state values triggered at the DAC resulted in a spectral regrowth at RF. The RF re-growth can be traced back to the digital state in the block diagram, thus ruling out a hardware problem in the analog portion of the transmitter. Fig. 5. Time correlated multidomain views allow in-depth analysis.

Fig. 4. This integrated view shows the logic states at the DAC and analog output.




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Real-time test techniques, which involve the use of a real-time en-vironment to implement a test

application, are used primarily to achieve greater reliability and/or de-terminism in a test system. As such, they play an important role in the de-velopment of many of today’s prod-ucts and systems.

Examples include durability, life-cycle, and other test systems that can operate for long durations or with ex-tended operator absence, thus requir-ing the superior reliability provided by real-time execution platforms. They also include environmental test cells, dynamometers, hardware-in-the-loop (HIL) simulators, and similar test sys-tems that use closed-loop control exe-cution, which requires the low-jitter determinism of real-time execution platforms. By examining several real-time test (RTT) applications, we can see how they are evolving to meet the chal-lenges faced by test engineers today.

Real-time test techniquesA common real-time testing technique is the use of closed-loop control to au-tomatically manipulate a physical variable in the test system, such as temperature, position, torque, or ac-celeration.

For example, when implementing an environmental test system such as a pressure chamber, the test chamber must achieve a specified state in addi-tion to providing stimulus to the unit under test (UUT) and monitoring its response. Because the chamber pres-sure is affected by many variables, such as chamber leakage or varying UUT characteristics, test engineers use a closed-loop control algorithm to monitor the value of a pressure sensor

The evolution ofreal-time testing

Used primarily to achieve greater reliability/determinism, real-time test plays a big role in developing many of today’s products

and automatically adjust the compressor and relief valve command signals to follow the pressure profile specified by the test plan. To imple-ment this automatic control, the closed-loop controller measures the state of the sys-tem and adjusts the com-mands applied to it at deter-ministic time intervals.

Another example is hard-ware-in-the-loop testing, a real-time testing application that is used to test electron-ic control systems more ef-

BY CHRIS WASHINGTONNational InstrumentsAustin, TXhttp://www.ni.com

Fig. 1. RTT systems such as this pressure chamber use closed-loop control to automatically achieve the pressure conditions required by the test plan.

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ficiently. An electronic control sys-tem consists of the electronic control unit (ECU) and the system or envi-ronment it is controlling.

When testing electronic control systems, considerations such as safe-ty, system availability, or cost may make it impractical to perform all desired testing using the complete system. However, the closed-loop coupling between the ECU and the rest of the system makes it impossi-ble to fully test the electronic control unit without the complete system.

HIL simulation is a real-time test-ing technique that uses a software model of the rest of the system to simulate the sensor and actuator in-teractions between the control unit being tested and the rest of the sys-tem. This creates a virtual environ-ment for the ECU, preserving the closed-loop coupling within the sys-tem. To accurately simulate the sen-sor and actuator interactions, the test system must deterministically exe-cute model calculations at consistent, or deterministic, time intervals.

Evolution of RTT systemsAs products and systems grow in complexity, so do the testing chal-lenges. In response to these challeng-es, real-time test systems are converg-ing, producing test systems that resemble a blended set of require-ments formerly found in separate real-time testing applications.

This trend can be seen in the emer-gence of model-based dynamometers. Typically, dynamometer test systems consist of a real-time test application using proportional-integral-deriva-tive (PID) control algorithms to pro-

duce varying load and speed conditions for the UUT. The test system would apply static stimu-lus profiles to the PID con-trollers as well as the UUT to exercise and validate the device. An evolution from traditional dyna-mometers, model-based dynamometer systems use models to implement ad-vanced control algorithms as well as generate dy-namic stimulus profiles for the test system.

Engineers at Wine-man Technologies (www.

winemantech.com) used the National Instruments RTT platform to pro-duce such a system in the form of a six-wheel independent chassis dyna-mometer. In order to adequately test their vehicle, the dynamometer needed to be able to produce test conditions that could simulate vehi-cle maneuvers over varying terrain.

For example, the model-based dy-namometer had to be able to achieve a state in which two wheels were driving in snow, one wheel was slip-ping in mud, two wheels were travel-ing over loose gravel, and another wheel was off the ground. Further-more, the system had to simulate the terrain transitions from wheel-to-wheel as the vehicle executed ma-neuvers.

To implement this test system, the engineers had to combine their experience in building both dyna-mometers and HIL simulators, creat-ing a traditional dynamometer test system with additional features more commonly found in HIL test sys-


The evolution of real-time testing

Fig. 3. Mechanical components are added to an HIL simulation to provide more efficient HEV power train system development and validation.

tems. Specifically, they added the ability to execute complex models deterministically to provide the dy-namic stimulus generation of the six correlated speed/torque profiles and to implement the advanced control necessary to achieve such a task.

This convergence of real-time test requirements can also be seen in an application by European research or-ganization Robotiker-Tecnalia (www.robotiker.es). During their research and development of hybrid-electric vehicle (HEV) power train systems, engineers used the NI real-time test-ing platform to create a specialized HIL test system.

Instead of providing a completely electrical simulation of the vehicle’s sensor and actuator interactions with the ECU, they replaced the power train’s traction drive software models with the actual electrome-chanical components. They then connected them in-the-loop with the software models that simulated the rest of their vehicle to achieve a

more accurate and flexible test system (see Fig. 3).

Because a physical com-ponent had been added to the simulation, they need-ed to add a loading mecha-nism for the traction drive so that the simulation could command its loading con-ditions. The HIL simulator provides the simulated load values to the loading mech-anism controller which ap-plies physical load to the traction drive via mechani-cal coupling.

When implementing this specialized HIL test system, Tec-nalia engineers had to create both an HIL simulator and a dynamometer-based loading system that worked together to provide an electrome-chanical simulation of the HEV pow-er train.

Consumer expectations, regulato-ry bodies, and competitive pressures are pushing products to new levels of complexity at an increasing pace. As companies try to balance this explo-sion in complexity with shorter de-velopment cycles, greater reliability requirements, and fixed or shrinking budgets, real-time testing techniques are playing an increasingly critical role in the development process.

Fig. 2 – Hardware-in-the-loop (HIL) testing is a real-time testing technique that uses software simulations of the missing system components to test electronic control devices.


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The measurement of the spatial luminous intensity distribu-tion of different types of light

sources — including solid-state light-ing (SSL) like LEDs — is important in lighting design and quality control. Everything from automotive head-lamp design to technical plans for lighting rooms or parking lots is based on this data. In some special-ized medical applications, like light

Measuring and analyzing LED performance

For SSL, designers need to understand goniophotometry to measure spatial luminous intensity distribution

therapy, the light beam profile must also be known to design for effective targeting and dosimetry.

For such measurements, gonio-photometers (from the Greek “go-nia,” an angle; “photos,” light; and “metron,” measure) have been used by traditional lighting manufactur-ers for some time. For the most part, however, this is unfamiliar technol-ogy to a new generation of solid-state-lighting and optical engineers.

So it is useful to review goniopho-tometric principles, measurements, and data analysis to point out mea-

BY RALF ZUBER, WOLFGANG DÄHN, and BOB ANGELOGigahertz-Optik, Newburyport, MAhttp://www.led-measurement.com

Fig. 1. A type B goniophotometer is typically set up as shown here.

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surement advantages and limitations, and all the parameters of technologi-cal interest. In the following sections, this is done using measurements taken on two types of light sources that em-ploy different optics to produce differ-ent beam shapes. The measurement parameters and important procedural steps — for example, the alignment of the light source and obtaining the best measurement resolution — are ex-plained, and interpretation of mea-surement results are discussed exten-sively, to elucidate measurement principles.

Spatial distribution dataSpatial distribution data can show the light beam profile in both 2D and 3D geometries. This is important for any application where a particu-lar light shape is required. Measured data also lets designers compare light sources from the same product line, thus providing an essential quality control tool. Furthermore, the data permits very exact calculation of the total luminous flux.

Measurement priorities often differ depending on the application. In re-search and product development, the focus is on obtaining high-resolution data to design and build light sources that radiate perfectly in the desired di-rection. In other applications, like qual-ity control in mass production, mea-surement time and reproducibility are the dominant factors, so a few distinct data points may suffice rather than the entire shape of radiation profile.

In many instances, these differenc-es call for a very flexible measurement system, one whose built-in capabilities and features enable it to be modified according to the specific application. To meet these measurement demands, 3D photometric goniometers (gonio-photometers) are a good choice.

The measurement principleThe principle of a goniometric mea-surement is to measure the complete

luminous intensity distribution of a light source. To accomplish this, many discrete measurement points on the surface of an imaginary sphere around the light source are measured. As a result, the whole ra-diation pattern of the light source can be very closely approximated.

The resolution of the measure-ment points dictates how close the goniometery matches the actual light source spatial distribution. So the number and position of the measurement points are critical for accurate results. The radius of this imagi-nary sphere is the dif-ference between light source (lamp) and re-ceiver (detector). By changing the distance between source and receiver, the light source’s near- and far-field characteristics can be studied.

To reach every point on this imaginary sphere, a goniometer usually works with two axes like the type B go-niometer used for the measurements in this article (see Fig. 1). One axis (θ) rotates between −180° and 180°; the oth-er axis (ϕ) swings be-tween –90° and 90°. Ev-ery point on the imaginary sphere around the light source can be reached and measured. Other common types are type C goniometers that rotate be-tween 0° and 360° on one axis and between 0° and 180° on the other. Similar systems like the type A goni-ometer are not very common.

Mechanical choicesGoniometers of more than one type of mechanical design — including mov-ing-mirror, gimbal-mounted, and

compact — can be used to get the full range of motion required for collect-ing measurements. Moving-mirror go-niometers are technically complex and very expensive, and their large footprint requires a lot of lab space. Gimbal-mounted goniometers also need a lot space in all three directions, because the detector drives around the lamp, which is stationary. Both types of instruments can, however, gather data rapidly.

The compact goniometer needs only as much space in one direction as the required maximum measurement distance. To reach all points over the entire sphere, the light source is rotat-ed on two axes. For measuring LEDs and light sources of similar size, this type of photometric goniometer is of-ten a good choice. At every angular point, the goniometer must stop for a

few milliseconds to take a measure-ment. Thus, the number of measure-ment points, and therefore the resolu-tion of the measurement, dictates the total measurement time.

A compact goniometer was used for this exercise. To analyze measurement results, several types of spatial plots can be produced. For example, the 3D plot provides a quick snapshot of the light source shape, while detailed po-lar layer plots can be made available for further studies.

Fig. 3. The asymmetrical 3D plot (top left) can be viewed in 2D (middle three graphs) to better understand the reflector’s characteristic. The polar plot (right) using data from the 2D plot next to it gives even more detail.



Fig. 2. The luminous intensity distribution measurement of an LED (left) can highlight points of interest, while the polar plot of one scan (right) permits detailed study of the light source’s characteristics.


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Measurement routineThe measurement software needs to be able to cope with non-equidistant measurement routines which are necessary for effective measure-ments. The reason for this require-ment can be seen by considering a simple example of a single LED mea-surement.

In the measurement, the radiation pattern of the LED is restricted to a small beam angle emitted from its tip. Since there is very little or no radiation

emitted from its sides, only a few measurement points are needed there. But in approaching the main area of radiation near the LED tip, more and more points are re-quired for maximum res-olution in the focus area. A similar measurement with equidistant steps over the whole sphere will last much longer, but will not produce any bet-ter results.

So the magnitude of the measurement increment is very important. Therefore, the tolerances of the mechanical parts must always be considered; it makes no sense to measure in 0.001° steps in high-reso-lution areas when the mechanical parts only claim 0.1° accuracy.

A good rule of thumb is it to start with a rough scan needing fewer data points to get a first impression of the light source radiation pattern. This scan can then form the basis of a specific routine that can be devel-

oped by refining those areas where the shape exhibits large changes.

Every light source will have a near perfect measurement routine, but usually one routine will fit many light sources of the same type. For example, the light distribution of LEDs is very similar, so no additional routines would be needed.

In product quality applications, these measurement routines can eas-ily be perfectly fit to the specific light source. This allows fast and very accurate surveillance of the im-portant areas of the light source.

Data analysisNovices often have trouble interpret-ing measurement results. The best way to understand the measured results is by studying different kind of plots, be-cause interpreting the numeric data requires expertise or extra software tools. In quality control, it’s common for the software to be able to compare results online during the actual mea-surement, thus permitting fully auto-mated production processes.

A good way to start analyzing data is to review the 3D beam plot. This review will give a rough outline of the light source’s spatial distribution and highlight the points of interest. For example, for an almost perfect lam-bertian-emitting LED, all important information is presented easily and quickly (see Fig. 2). The light is not ra-diating perfectly in the upper direc-tion, which is recognizable by the crater in its shape. Only a practiced lighting engineer could perceive this from the data only without the plot.

For further studies, polar plots of different layers are a good choice. The 3D plot will pinpoint the most inter-esting areas to study on the polar plot, which speeds up the data analysis.

When same LED is mounted with a reflector to focus the radiated beam, the measurements change significant-ly (see Fig. 3). The beam shape is no longer symmetrical, as in Fig. 2. Ana-lyzing the beam in 3D plots give a good indication of the reflector’s prop-erties, and the polar graph from a 2D perspective aids in detailed analysis. Thus, a designer will have an under-standing of the light/reflector perfor-mance in reality (see Fig. 4), and be able to create designs that meet real-world requirements.

Fig. 4. The actual picture of the light source described by the plots in Fig. 3 show how it conforms to expectations.




In designing and testing an embed-ded system, engineers need to pro-vide a way for the various devices

and subsystems on the system, — such as DACs, low-speed ADCs, fan control chips, EEPROMs, and PLDs — to com-municate. The Inter-Integrated Circuit protocol, more commonly known as I2C, is one of the more popular proto-cols in use today.

Unlike protocols such as SPI and UART that may need multiple dedicat-ed I/O connections, I2C communica-tion takes place using only two I/O connections. Since I/O connections on embedded systems are generally scarce and engineers need to use a minimal number of pins per device, the I2C pro-tocol is often preferred. However, when using an embedded system with mul-tiple I2C devices, debugging the I2C protocol can be tedious. But by using a modern digital oscilloscope for debug-ging, engineers can analyze the I2C protocol and view physical signals without disrupting the system.

Understanding I2CIt is important for engineers to under-stand the protocol thoroughly in order to select the correct set of tools for de-bugging. I2C is a multimaster single-ended serial protocol, which means it can support multiple slaves and multi-ple masters on the same bus. It is based on two bidirectional lines, Serial Clock Line (SCL) and Serial Data Line (SDA), which are pulled high with pull-up re-sistors. These lines together are com-monly known as an I2C bus, which is used for communication among all I2C devices (multiple masters and slaves).

I2C protocol comes in four modes: Standard mode (100 kHz), Fast mode (400 kHz), Fast mode-Plus (1 MHz), and High Speed mode (3.4 MHz). The pro-

Using an oscilloscope to debug the I2C protocol

A modern scope can take the tedium out of checking protocol operations in an embedded system with multiple I2C devices

tocol consists of a Start bit, Address bits, read/write (R/W) bit, data byte, ac-knowledge bit (ACK), no-acknowledge bit (NACK), stop bit, and re-start bit (which is equivalent to Start bit with-

out a stop bit).The Start bit (S) is always sent by a

master to initiate communication. It is defined as high to low transition on the SDA line, while SCL is held high.

Address bits are either in a 7- or 10-bit format, depending on system con-figuration. The 7-bit format has fixed address bits and hardware-selectable address bits (optional), for a total of 7 bits. And the 10-bit format consists of a fixed command (11110) and a 10-bit address (fixed or hardware selectable).

The read/write bit (R/W) is the eighth bit on the address byte, where low is write and high is read, for the 7-bit addressing mode.

In the 10-bit addressing mode, read/write is a little more involved than the 7-bit addressing mode. The write operation consists of two bytes, and the read operation consists of three bytes.

The data byte is sent by the transmitting device (mas-ter or slave) and the acknowl-edge bit (ACK) occurs on the ninth SCL clock pulse. It is transmitted by the receiving device, while it pulls SDA line low. The no-acknowledge bit is transmitted when the re-

ceiving device fails to pull the SDA line low. The transfer is aborted when NACK is received. The stop bit is always sent by the master to end the communica-tion. It is defined as low to high transi-

tion on the SDA line while the SCL line is held high.

Debugging the I2C protocolEmbedded-system engineers must make sense of the I2C messages sent back and forth on their system. They must identify the messages being sent to a particular device based on the de-vice’s address, and then continue to analyze the payload/data bytes trans-ferred between the devices.

Often, engineers use low-cost I2C sniffer/analyzers to capture I2C traffic for analysis. However, most embedded designs have no connector to attach an I2C analyzer on the embedded

BY VRAJESH DAVÉLeCroy, Chestnut Hill, NYhttp://www.lecroy.com

Fig. 1. The screenshot shows I2C address, and how SDA and SCL signals are interpreted for various protocol components.

Fig. 2. The display shows Write (top) and Read (bottom) addressing for 10-bit I2C mode.



board, so engineers must look at elec-trical signals on the I2C bus to make sense of the error or messages trans-ferred among devices.

The problem becomes even more complicated when the device that must be debugged is hot swappable, and engineers cannot put the entire system in debug mode. Oscilloscopes are very useful in these situations, be-cause they allow engineers to probe the I2C bus and capture I2C traffic without disrupting the entire system.

Nevertheless, capturing I2C traffic is

only half the battle. Engineers must also decode the messages sent to several devices, and so of-ten spend many hours manually counting bits. An oscilloscope with an I2C trigger and decode package avoids the frustration of decoding messages manually and gives an instant snapshot of the I2C communication taking place.

For example, consider the state of a Nintendo Wii controller’s I2C bus while it is connected to a Free-StyleGames DJ Hero system (see Fig. 3). Since the Wii controller

and DJ Hero communicate over I2C, several packets are being sent back and forth at any given time [1].

Using a modern digital oscilloscope, engineers can capture I2C traffic and use its decoding capabilities to analyze messages communicated between the master and the slave. The scope’s ability to decode the I2C protocol lets engi-neers debug the design efficiently and effectively. To quickly view timing and packet relationships, a table view pro-vides a higher-level snapshot of a long I2C bus capture.

Fig 3. I2C traffic with multiple devices.

Using an oscilloscope to debug the I2C protocol

The table view in Fig. 3 shows mes-sages (in the data column) sent to each device based on the device address (in the address column) and presents the data in a format similar to a sniffer/ana-lyzer. Also, the scope’s I2C trigger capa-bilities enable engineers to focus on the device they plan to debug, using spe-cific address and data triggers to isolate communication between a particular slave and master.

The I2C protocol is ubiquitous in embedded systems, but the protocol structure of multiple slaves and masters creates many challenges to solving problems in a system. Choosing the correct scope with specialized trigger, decode, advanced search, and viewing tools can simplify and shorten the debug process.

1. Note that no claims are made re-garding any known bug in Nintendo Wii and FreeStyleGames DJ Hero. These systems were used merely to pro-vide an example of a hypothetical real-world situation.

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High-resistance measurements are integral to a variety of test applications, including surface

insulation resistance (SIR) testing of printed circuit boards, resistivity measurements of insulating materials and semiconductors, and voltage co-efficient testing of high-ohmic-value resistors. Ensuring the accuracy of high-resistance measurements (that is, resistances of 1 GΩ or higher) re-quires the use of a number of specific techniques, as well as instruments such as electrometers, source-mea-sure units (SMUs), or picoammeter/voltage source combinations.

Constant-voltage method Measuring high resistances with the constant-voltage method demands an instrument that can measure low currents accurately in combination with a constant DC voltage source. Some electrometers and picoamme-ters provide a built-in voltage source and can automatically calculate the unknown resistance.

Two basic configurations for the making measurements with the con-stant-voltage method are using an electrometer or picoammeter (Fig. 1a), or an SMU (Fig. 1b). In this method, a constant voltage source (V) is placed in series with the unknown resistor (R) and an ammeter (IM). Because the volt-age drop across the ammeter is negli-gible, essentially all the test voltage appears across R. The resulting current is measured by the ammeter and the resistance is calculated in accordance with Ohm’s Law (R = V/I).

Given that high resistance is of-ten a function of the applied voltage, the constant-voltage method is gen-

Making more accurate high-resistance measurements

Because they are integral to a variety of common test applications, ensuring of high-Ω measurement accuracy can be critical

erally preferable to the constant-cur-rent method. By testing at selected voltages, a resistance-versus-voltage curve can be developed, and the voltage coefficient of resistance can be determined. The constant-voltage method is appropriate for measuring extremely high resistances because of the voltage coefficient effect.

The constant-voltage method re-quires measuring low current accurate-ly, so error sources related to measuring low currents must be taken into ac-count. These include improperly

shielded connections to the am-meter, problems related to the ammeter’s voltage burden and in-put offset current, and the source resistance of the device under test. External sources of error can in-

clude leakage current from cables and fixtures, as well as currents generated by triboelectric or piezoelectric effects.

Constant-current methodSeveral instrument configurations are appropriate for measuring high resis-tances with the constant-current method:

An electrometer’s voltmeter func-tion and a current source.An electrometer’s ohmmeter func-tion alone.An SMU’s voltmeter with high input impedance and low-cur-rent source ranges.

Using the electrometer voltme-ter with a separate current source or an SMU allows making a four-wire measurement and controlling the amount of current through the sample. The electrometer ohmme-ter makes a two-wire resistance measurement at a specific test cur-rent, depending on the measure-ment range.

For the constant-current meth-od (see Fig. 2), current from the source (I) flows through the un-known resistance (R) and the volt-age drop is measured by the elec-trometer voltmeter (V). This method supports measuring resis-tances up to about 1012 Ω.

Though this method is relative-ly straightforward, some precau-tions are necessary. The input im-pedance of the voltmeter must be high enough to keep the loading

•

•

•

BY DALE CIGOYKeithley InstrumentsCleveland, OHhttp://www.keithley.com

Electrometers such as this Model 6517B can be particularly useful for measuring extremely high resistances.

Fig. 1. Two basic configurations shown above can be used for making measurements with the constant-voltage method.



error within acceptable limits. Typi-cally, the input impedance of an electrometer voltmeter is greater than 1014 Ω.

Further, the output resistance of the current source must be much greater than the unknown resistance for the measurement to be linear. The voltage across the sample de-pends upon the sample resistance, which makes it difficult to account for voltage coefficient when using the constant-current method. If volt-age coefficient is a concern, it is bet-ter to use the constant-voltage meth-od instead.

Using an SMUAn SMU can measure high resistance in the source current/measure voltage

mode by using either a two-wire (local sense) or four-wire (remote sense) method, a technique that eliminates contact and lead resistance, which is especially important when measuring resistivity of semiconductor materials. These measurements usually

involve measuring low voltages. The resistance of the metal probe to semi-conductor contact can be quite high. When using remote sense, the voltage difference between high force and high sense and between low force and low sense is usually limited to a speci-fied value. Exceeding this voltage dif-ference can produce erratic measure-ments.

Besides the voltage drop limitation, some SMUs have automatic remote sensing resistors located between the HI Force and HI Sense terminals and between the LO Force and LO Sense terminals. This may further limit the use of a single SMU in remote mode for certain applications, such as semi-conductor resistivity. If so, the SMU can be used as a current source in the

two-wire mode, and one or more sepa-rate voltmeters used to measure the voltage difference.

Using an electrometerWhen using an electrometer’s ohm-meter function to measure high resis-tance (see Fig. 3), various factors, in-cluding electrostatic interference and leakage currents, can affect measure-ment accuracy. The ohmmeter uses an internal current source and elec-trometer voltmeter to make the mea-surement. It automatically calculates and displays the measured resistance.

Note that this is a two-wire resis-tance measurement, in contrast with

Fig. 2. The constant-current configuration shown above seems straightforward, but users need to be aware of instrument input and output resistances.

Fig. 3. In the above configuration, an electrometer’s ohmmeter function is used to measure resistance R.

Making more-accurate high-resistance measurements

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using the electrometer voltmeter and external current source, which can make a four-wire measurement. This is because the current source is inter-nally connected to the voltmeter and cannot be used separately.

Guarding and shieldingThe two most common error sources when measuring high resistances are electrostatic interference and leakage

current. Shielding the high-imped-ance circuitry can help minimize the effects of electrostatic interference (shield is connected to circuit LO); guarding offers a very effective way to reduce leakage currents and im-prove measurement accuracy.

A guard is a low-impedance point in the circuit that’s at nearly the same potential as the high-imped-ance lead being guarded.

Circuit settling timeThe measurement circuit’s settling time is particularly important when measuring high resistances. The set-tling time is affected by the shunt ca-pacitance, which is due to the con-necting cable, test fixturing, and the DUT. The shunt capacitance (CSHUNT) must be charged to the test voltage by the current (IS). The time required to charge the capacitor is determined by the RC time constant (one time con-stant, τ = RSCSHUNT), so it’s typically necessary to wait four or five time con-stants to achieve an accurate reading.

When measuring very high resis-tance values, the settling time can range up to minutes, depending on the amount of shunt capacitance in the test system. To minimize settling times when measuring high resis-tance values, keep shunt capacitance in the system to an absolute mini-mum by keeping connecting cables as short as possible. The use of guard-ing can also decrease settling times substantially.

High-MΩ resistorsResistors with values of 1 GΩ (109 Ω) or more — often referred to as high-MΩ resistors — come in two types: carbon-film and metal-oxide. Several factors must be considered when measuring them, including voltage and temperature coefficients, the ef-fects of mechanical shock, and con-tamination. Carbon-film high-MΩ resistors are noisy, unstable, have high-temperature coefficients, dis-play high-voltage coefficients, and are very fragile, when compared with conventional resistors. Metal-oxide types have much lower voltage coef-ficients (<5 ppm/V), and better tem-perature and time stability.

High-MΩ resistors need extreme care in handling because mechanical shock can alter their resistance by dis-lodging particles of the conductive material. It’s also important to avoid touching the resistive element or the glass envelope surrounding it; doing so could change resistance by creat-ing new current paths or small elec-trochemically generated currents. If a resistor acquires surface films from handling or air contaminants, it should be cleaned with a foam-tipped swab and methanol, and dried in low humidity for several hours to let any static charges dissipate.

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Engineers are beginning to ap-preciate that, from prototypes early in the design cycle

through to final system test, a digital pattern generator (DPG) speeds up system debug and therefore shortens the overall product design cycle.

Testing a prototype system basi-cally requires two types of tasks:

Generating an input stimulus to the system.Analyzing the system’s response.

To solve the “stimulus-and-response”

challenge the engineer can save valu-able design time if he has the right equipment.

There is no doubt that scopes, log-ic analyzers and perhaps more spe-cialized analyzers will help doing the

•

•

Why should you have a digital

pattern generator? One of the most recent instruments to

come along, the DPG can be used to speed up debug and shorten time to market

“analysis task.” But many engineers don’t realize that there is an impor-tant new companion for digital sys-tems: the digital pattern generator.

The signal source landscapeSignal generators used for testing and debugging embedded systems come in three flavors, based on gen-erated signals and their purpose. By “embedded systems” we mean mi-croprocessor- or microcontroller-based devices, ASICs, FPGAs, SoCs (systems-on-chip), and DSPs, includ-ing analog, digital, or mixed-analog/digital systems.

Digital pattern generators (see box, “An example of a typical PC-based DPG — the GP-24100 “) produce digi-

tal sequences of 1’s and 0’s complying to a digital voltage standard such as LVCMOS, LVTTL, LVDS, and others. DPGs are used mainly in functional validation. The signal generated con-veys digital information as inputs to a

BY FRÉDÉRIC LEENSByte Paradigm, Nivelles, Belgiumhttp://www.byteparadigm.comand ALAN LOWNESaelig, Pittsford, NYhttp://www.saelig.com

Fig. 1. Stimulus-and-response setups are essential in prototyping an embedded digital system, and DPGs make excellent stimuli.



digital system and often features at least 16 channels or more.

Pulse/pattern generators, on the other hand, produce a digital selec-tion of square pulses. They have the capability of adjusting the electrical characteristics of the output signal, such as rise/fall time, signal drive strength, jitter, and so forth. They are often used for the electrical test and qualification of input buffers, but are sometimes used in a limited way for functional validation like a digital pattern generator. They usually fea-ture only one or two channels.

The waveform generator is an ana-log generator of standard waves like sine, sawtooth, square waves, or arbi-trary complex signals, with the ability to define the amplitude of the output. These are used to stimulate the ana-log inputs of a system. Used for elec-trical validation of such inputs and functional validation of a complex system featuring analog inputs.

While each of these instruments have their place, many engineers are finding that DPGs are essential for anyone involved in embedded sys-tem design (see Fig. 1) — they im-prove the speed of semiconductor and digital system testing — espe-cially during the design phase — and hence address those commodities vi-tal to all program managers — sched-ule and time-to-market.

DPGs in designDuring the design phase, a DPG is an essential stimulus source for almost every type of digital device: digital and mixed-signal ASIC, FPGA, micro-processors and microcontrollers. For functional testing, debug of new de-signs and failure analysis of existing designs, you need a fully programma-ble signal source like a DPG to simu-late signal variations easily. DPGs can be used early in the design cycle to substitute for system components that are not yet available. For example, the DPG might be programmed to send interrupts and data to a newly devel-oped bus or circuit when the processor that would normally provide the sig-nals doesn’t yet exist.

One of the biggest challenges that a design team faces is that the hard-ware and software is usually devel-oped concurrently. Hardware engi-neers always say, “How can we test the hardware when we have no soft-

ware to drive it?” The software engi-neers say, “How can we test our soft-ware when there’s no hardware platform till later in the project cy-cle?” A DPG can help solve both of these needs.

A DPG also allows exploring un-usual test situations — perhaps creat-ing infrequently encountered equip-ment conditions or failures to help verify that software code works and

is robust enough to cope with these stresses — and this, even before the complete hardware is available.

A DPG can also be used to put a circuit into a desired state and then let it operate at full speed or step the circuit through a series of states. Gen-erating the right specific initializa-tion sequences and configuring con-trol register helps in exploring various modes of circuit operations. Because

Why should you have a digital pattern generator?

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bit streams are needed to stimulate a device under test (DUT)

An additional use for DPGs is that of simulating serial protocols. DPGs allow access to ICs that use serial protocols on their functional ports, either as a master (exerciser) or as an analyzer. You can even modify the protocol characteristics to access non-standard serial protocols or to stress the limits of existing ones. DPGs allow you to directly control

nowadays circuits use digital inter-faces that may run at more than a few tens of megahertz, the old ways of us-ing microcontrollers coupled with GPIO is no longer sufficient.

By substituting missing pieces and offering maximal flexibility when generating digital logic signals, DPGs can greatly accelerate a new product’s time-to-market. In fact, a DPG is an effective solution just about anywhere that complex digital


800-542-3355www.calex.come-mail: sales @ calex.com

An example of a typical PC-based DPG — the GP-24100With an 8-Mbyte embedded memory buffer, 100-MHz operation on all 16 digital lines, and a sustained USB throughput up to 30 Mbyte/s, the GP-24100 Base USB High Speed I/O Dev Module is a powerful general-pur-pose and PC-based solution that comple-ments traditional lab equipment for digital electronic system design, test, and debug.

In its ADWG/pattern generator mode, GP-24100 generates extended arbitrary digital stimuli directly from a PC through a USB connection. As an Analyzer, GP-24100 collects, analyzes, stores and displays digital data. Control Panel software provides graphical, scripting and programming interfaces to automate tasks and bridge the programming and hardware divide.


prototype system functional ports to access registers and send or collect data to and from memory locations.

The survey says...In 2009, a survey we conducted with over 300 respondents involved in embedded hardware and software design revealed that a majority of en-gineers (61%) agree with the state-ment that “Using a hardware proto-type speeds up embedded system debug.” Less than 10% of the respon-dents said they “somewhat disagree” or “disagree” with this statement. Over 83% of the respondents de-clared that stimulus generation is at least as challenging as system re-sponse observation. Figures were os-tensibly the same whether it con-cerned IP, FPGA, ASIC, SoC, or full embedded system testing (see Fig. 2).

A vast majority of development en-gineers like using a “real hardware” prototype to test and debug what they are designing. Basically, “testing on prototype” always becomes “stimulat-ing and observing.“

Interestingly, this survey also showed that 69.5% of the engineers surveyed were already well-equipped with oscilloscopes, 57.1% with logic analyzers, and 59.3% with JTAG probes. Yet they still could see the need for a need for a programmable DPG.

On the other hand, only 20.6% of our respondents had a DPG in their lab to perform their testing and de-bugging work. This number rises to 32.8% for simple waveform genera-tors — for analog signal generation (sine/triangle waves and such).

When asked about this situation,

Why should you have a digital pattern generator?

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preliminary results show that engi-neers are keen to use sophisticated commercially-available signal sources for stimulus generation for future proj-ects. In retrospect, they also acknowl-edge that they would have saved valu-able design time if they had used a DPG for functional testing and debug-ging of their last digital system.

The reason why engineers are not systematically equipped with such

an acknowledged time-saving tool — while they always receive a PC and an oscilloscope — is not quite clear, but is probably due to a lack of knowledge among engineers and managers alike that DPGs can save them valuable time. When effective-ly informed, most engineers consider that DPGs can help overcome the many challenges of embedded sys-tem test, debug, and validation.

Fig. 2. Results of a recent survey indicate what designers consider the most challenging aspect of testing an embedded system.


The highly anticipated Apple iPad 16 GB is a tablet device de-signed to provide the user with a multitude of interactive func-tions and apps, including iTunes, iBook, photos, TV, and video. The 9.56 x 7.47 x 0.5-in. iPad weighs 1.5 lbs and features a custom 1-GHz Apple A4 high-performance, low-power system-on-a-chip processor. The device has a 9.7-in. (diagonal) LED-backlit glossy wide-screen Multi-Touch display with 1,024 x 768-pixel resolution at 132 ppi. The display has IPS (in-plane switching) technology, that allows for a viewing angle of up to 178°, and a fingerprint-resistant oleophobic coating. The iPad is Wi-Fi (802.11a/b/g/n) or Wi-Fi + 3G capable, with Bluetooth 2.1 and EDR technology. It also comes with a built-in 25-W-hour rechargeable lithium-poly-mer battery, offering up to 10 hours of continuous operation.

% of Total Cost by Component Type

Battery 10.07%

Other: Enclosures/Final 6.24%

Interconnect PCB/ 4.62%

Misc PCBAssemblies 0.87%

Touchscreen 13 .99 %

Display Module

27.56 %

Main PCB36 .65 %

% of Total Cost by Component Family Electro-Mechanical 6.35%

Module 4.41%

Passive 1.98%

Discrete Semiconductor 1.57%

Optical Semiconductor 0.92%

Integrated Circuit 33.52 %

Display 28.56 %

Battery 15.99 %

% of Total Cost by Assembly

Product Teardown: Apple iPad

Courtesy of Apple

The information in this feature represents a small sample of the data available from the iSuppli Teardown Analysis service. This service provides complete, detailed analyses of electronic equipment by disassembling products and studying their contents. The service has performed teardown analyses on products including wireless handsets, digital still cameras, PDAs, and laptop computers. ISuppli delivers complete assessments of all electronic, electro-mechanical, and mechanical components in such products, from semicon-ductors to passives to displays. Component data includes parts and estimated pricing and is broken down by assembly, function, component family, and type.

For more information on the iSuppli Teardown Analysis service, e-mail iSuppli at [email protected]

For more information on the iSuppli TeardownAnalysis service, e-mail iSuppli at [email protected]

To get the complete teardown analysis and parts list of the Blackberry Storm Smart Phone, including datasheets, go to...

http//electronicproducts.com/whatsinside

Mechanical 6 .70 %

WHAT’S INSIDE?


MEMS microshutters for a new space telescope By Eric LynessMink Hollow Systems, Ashton, MD http://www.minkhollowsystems.com Knute RayNASA Goddard Space Flight Center Greenbelt, MD http://www.nasa.gov/centers/goddard/home/index.html David RapchunGlobal Science and Technology Greenbelt, MD

The James Webb Space Telescope (JWST) is the next big telescope at NASA. More ambitious than the Hubble Space Telescope, its predecessor, the JWST will be placed by NASA at a stable Lagrange point approxi-mately one million miles from the earth. This telescope is the next step-ping stone toward understanding the universe and studying the Big Bang theory at NASA. The next major project milestone is the overall Critical Design Review. JWST should launch in the next decade...

The limiting factors of electromechanical switches By Markus AfolterWilbrecht LEDCO, St. Paul, MN http://www.wilbrechtledco.com

From pharmaceutical to oil and petrochemical industries and many more, process control greatly de-pends on two physical variables: temperature and pressure. While a wide range of sensors are available for temperature and pressure con-trol in process automation applica-tions, the simplest solution is often an electromechanical switch...

Applying piezoelectric film in electronic designs By Jon DentDigi-Key,Thief River Falls, MN http://www.digikey.com Pete SmithMeasurement Specialties, Hampton, VA http://www.meas-spec.com

Piezoelectric film is a transducer technology with unique capabilities and design advantages. It can produce voltage in proportion to compressive or tensile mechanical stress or strain, making it an ideal dynamic strain gage. Lightweight and flexible, piezoelectric film can serve as a highly reliable low-cost al-ternative to more expensive sensors, either as an accelerometer or dynamic switch element, in applications where space is at a premium...

Shifting into high gear In last October’s viewpoint, we wrote about the move away from using a monolithic sili-con manufacturing approach to developing MEMS devices, quoting from an article in the MEMS Industry Association blog by St. J Dix-on-Warren of Chipworks about Analog Devic-es abandoning its integrated iMEMS technol-ogy. At that time, we wrote, “So for now, it looks like the road ahead is paved with multi-ple-IC MEMS devices.” Half a year later, we’re happy to report that road construction is well underway and that MEMS designs using mul-tiple ICs have shifted into high gear.

Roger Grace of Roger Grace Associates points to no fewer than 10 major designs that have taken a multichip approach in his article “Thinking outside the chip for MEMS design success,” which appeared in the February 2010 issue of Electronic Products. For example, he points to Crossbow Technologies’ FAA-certi-fied MEMS-based attitude control system for general aviation, which integrates three MEMS accelerometers and gyros with a DSP chip that incorporates flash and E2 memory functions as well as Kollman filter algorithms.

Grace notes that, “MEMS devices have been available for almost 50 years. Pressure sensors, accelerometers, gyros, and displacement sen-sors have been popularly used as system com-ponents for a wide spectrum of applications in the automotive, aerospace, industrial, medi-cal, and (most recently) consumer markets. However, only until recently has there been an epiphany in the MEMS community that has led to ‘thinking outside the MEMS chip’ and considering all other elements/function-alities required to create an optimum systems solution.”

Grace has been a major proponent for re-thinking how MEMS systems should be de-signed, providing technical guidance to the industry on how to develop marketable prod-ucts: MEMS systems that can get the job done for a price that people can afford. In the series of articles he’s preparing for Electronic Products, all aspects of MEMS development — from de-sign for manufacturing through testing to fi-nal packaging—are being shifting into high gear examined from a fresh angle.

Considering all the new capabilities de-signers want to add to their end products, it’s obvious that there is a penned up demand for MEMS devices that can perform new sensing and energy harvesting feats. It’s clearly a situ-ation in which “thinking outside the MEMS chip” will pay off.

Richard Comerford

For more on Project MEMs, visit www.electronicproducts.com/

projectmems

For testing the microshutter design, NASA used a fully functional, 1/6th scale model of the JWST mirror in an optics test bed.

Snap-action switches are designed to change over from their initial ON1 cir-cuit to their ON2 circuit when the actu-ating force is higher than the internal force

An piezo anti-tamper film is applied to the inside of a module housing.


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Server rooms shape up and power down

Cutting the power used by servers is a really big deal. Search engines Google, Yahoo, and their coun-

terparts employ huge server rooms that take massive amounts of energy. In a report to Congress in 2007, the En-vironmental Protection Agency estimated that 10 new pow-er plants would be required to meet the additional energy demand from data centers by 2011. I recently spoke with Steve Thorne, product line manager for Xeon processors at Intel in Hillsborough, OR. He said the intelligent power management function in newer CPUs makes a big differ-ence. Areas of the processor are shut down if not used – cutting both bias and dy-namic current draw. This was first imple-mented in 2006 and 2007, but has reached new heights in the company’s recent Xeon 5500 series processors.

Lower-power modes were first in-troduced with the 486DX4 proces-sor, so this concept is far from be-ing new, but the latest devices take it to a whole new level. Automated low-power states put processor and memory into the lowest available states that will handle the current workload. Power gates allow indi-vidual idling of cores to near-zero power, independent of other operating cores, reducing idle power consumption to 10 W, versus 16 to 50 W in prior generations. Proces-sors are enhanced with more and lower CPU power states, and the memory and I/O controllers have new power management features.

Intel has C-states numbered starting at C0, which is the normal, full speed, CPU operating mode. In C1 the clock running to the processor is gated off. C2 is the sec-ond idle state where the external I/O controller hub blocks interrupts to the processor. And this continues with C3, C4, etc, and each core has its own C-state.

This, I think, can get really complicated. If a particular processing load occurs, do you put maximum horsepower

into it to get done quickly or use a lower-power mode for a longer time? One core or many? And, you could cut sup-ply voltage and/or clock frequency — or both.

But, Intel has done a great job of cutting power consump-tion with its advanced manufacturing technology — mostly through high-K dielectrics. Compared to servers using CPUs from 2007, the 5500 series processor-based servers can give the same performance in a single rack that took 15 racks

before - using 1/15th the power. So the return on investment for upgrading to the latest servers is

pretty fast. And then there is a cooling multiplier for this. Lower power can save a lot of money.

I also spoke with Intel IT guru Chris Peters who outlined some significant energy sav-

ings that they have done in their own data centers. Intel has 95 data centers world-wide and a total of 100,000 servers. 70%

of those servers are for the design side, and those units have an 80% utili-zation rate — which means there’s not much to be gained with power optimization. 20% are used for of-

fice applications and they have a low utilization and use the power down of cores and network connections in the newer servers to great advantage. Updating to a newer server can cut power by a factor of 9 to 15, Peters says.

Other servers are used for manufacturing — with a high availability requirement — and e-business or supply chain operations. Overall, the data centers use 55 MW — including cooling and power control – and take up about 440,000 sq ft. Compute power needs are growing at about 45% per year.

One area of great success has been in cooling. Buy cleaning up the air flow, getting cables out of the way and making a clean path for the air, they have been able to take a 2-kW rack to 4 kW at the same temperature. Also, they have effectively used a precooler, where water is run through a cooling tower before it goes to the chiller. This yielded an 85% cooling efficiency improvement in some installations.

Intelligent power management and advanced processor manufacturing technology make a difference

BY JIM HARRISONWest Coast Editor


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Super caps to grow at 20% through 2014

A recent report from Innovative Research and Products (iRAP) predicts the global market for

ultracapacitors will grow from an es-timated $275 million in 2009 to $725 million in 2014, at an average annual growth rate of over 20%.

Each of the four major markets where ultracapacitors are needed – stationary, industrial, consumer, and transport energy storage power man-agement —has its own specific re-quirements. From 2009 to 2014, transport energy applications, which are mostly automotive, will show the highest growth rates (27.7%), followed by stationary energy storage (23.7%), consumer electronics (22.7%), and industrial applications (14.1%).

The stationary energy storage mar-ket needs ultracapacitors for short-du-ration applications of energy storage. UPS systems and power management systems used in distributed genera-tion, wind, and solar energy-generat-ing stations use a combination battery and ultracapacitor bank. The battery is for long-duration interruptions and the capacitor for voltage-sag support and momentary interruptions, reduc-ing the cycling duty on the battery and thus extending its life.

Industrial applications need ultraca-pacitors to improve power quality, spe-cifically using them to handle power surges and short-term power loss. The consumer electronics and computer market needs small high-frequency de-vices to reduce battery size.

The transport energy storage mar-ket aims to use ultracapacitors as load-leveling devices with batteries in electric and hybrid vehicles. By far the highest value target for ultraca-pacitor technology globally are auto-motive applications, from hybrid drive trains to power network stabili-zation to the “electrification” of brak-ing, steering, air conditioning, and other subsystems to improve vehicle fuel efficiency and reliability.

To obtain the iRAP report, call 203-569-790 or e-mail [email protected]

Paul O’Shea

ENERGY BLOG


PRODUCTROUNDUP

Supporting the design of electri-cal systems in a variety of mar-kets, the electromechanical

switch comes in different types, such as keylock, pushbutton, DIP, reed, rocker, rotary, slide, snap action, tact, and toggle. The following is a sam-pling of recently introduced products.

The KM1202 through-hole sub-miniature detect switches from C&K Components (www.ck-components.com) feature a minimum electrical life of 10,000 actuations at full load. The switches are available with gold- or sil-ver-plated contacts; maximum contact rating for the gold-plated switches is 0.4 A at 20 V ac or dc, while the silver-

plated devices feature a contact rating of 0.25 A at 125 V ac or dc.

APEM Components (www.apem.com) offers the 12000X778 series pro-

fessional-grade toggle switches that feature a double shell case for extra mechanical strength and electrical insulation. The contact mechanism is suitable for ultra-low-level applications of 10 mA at 50 mV and 10 mA at 5 Vdc minimum with an electrical life up to 150,000 cycles. The switches are also rated for power applications at

2 A at 250 Vac, 4 A at 125 Vac, or 4 A at 30 Vdc max, with an electrical life up to 20,000 cycles. The series also includes a front-panel sealing that meets IP67 specifications and a full epoxy-sealed base.

The CL1200 Series bi-color LED pushbutton switch from CIT Relay & Switch (www.citswitch.com) offers

through-hole, right-angle, and sur-face-mount terminal options with a choice of round and square cap styles, both of which are available with and without LED hole and com-plimentary optional frames. Specifi-cations include an electrical rating of 50 mA at 48 Vdc, and electrical life of 100,000 cycles, a contact resis-tance of less than 50 mΩ initial, and a dielectric strength of 500 Vrms

minimum with insulation resistance of greater than 100 MΩ minimum. In addition, actuation force is 160 ± 50 gf with actuator travel of 0.25 ± 0.1 mm and operating and storage temperature of –40° to 85°C.

Electro-Mech Components (www.electromechcomp.com) offers the SW44687 potentiometer switch as-sembly with both rotary and push-on functionality for maximum opera-tion control. The SPDT switch enables the user to specify a value so that, at the push of a button, the circuit or channel automatically opens at the preset level. The switch also features a 10-kΩ-resistance potentiometer mod-ule, is rated for 0.10 A at 30 Vdc, and has switch life of 100,000 minimum actuations.

For a quiet actuation, NKK Switch-es (www.nkkswitches.com) offers the HB2 series of subminiature pushbut-tons with full-face illumination. The switches offer a mechanical and elec-trical life at 100,000 operations min-imum. They come standard with ei-ther red/green or red/yellow bicolor built-in LEDs. The stroke has a total travel 1.8 mm, with a pretravel of 1.3 mm and an overtravel of 0.5 mm. The nominal operating force is 1.8 N. Rated at 0.4 VA maximum at 28 V ac/dc max, these switches also have contacts with gold plating and an operating temperature range of –13°

C&K’s KM1202

APEM’s 12000X778 series

CIT’s CL1200 Series


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Electromechanical Switches

Narda’s SEM02012

through 122°F.The LP15 series illuminated push-

button switch from E-Switch (www.e-switch.com) features multiple LED col-ors (red, blue, green, yellow, and white), custom marking options for the caps, and several cap sizes. The switch offers a contact rating of 1 mA at 20 Vdc, an electrical life of 300,000 cycles, and a contact resistance of 200 Ω maximum at 5 Vdc and 1.5 mA. This SPST, normally open part pro-vides a dielectric strength of 250 V ac for 1 min and an operating tempera-ture of –20° to 70°C.

Cole Hersee (www.colehersee.com) offers the 95060 key switch series with integral sealed Deutsch connec-tor. It is rated at 10 A at 12 V and 5A at 24 Vdc. Features include engineer-ing thermoplastic construction, fully sealed contact area using O-rings and ultrasonic welding, and an anti-restart option. In addition it is tested to SAE J259 for ignition switches.

Narda Microwave-East (www.nar-

damicrowave.com/east) offers the Model SEM02012 fail-safe SP2T RF switch suited for operation from dc to 18 GHz that features very low in-sertion loss and rugged construc-tion. It operates from 12 Vdc at 275 mA, has maximum insertion loss of 0.5 dB, isolation of at least 60 dB, and VSWR of less than 1.5:1. It uses

SMA female connectors, includes an integral indicator circuit, and mea-sures 1.34 x 1.5 x 0.5 in.

Christina Nickolas


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MIL-PRF-55310/30SMD 14x9mm CMOS XOCertied Per MIL-STD 790 With QPL StatusTypical Frequency Stability:

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Frequencies Within Are ApprovedBroadest Temperature Range

Temps Within Are Approved: -55 to +125°CHighest Shock & Vibration Resistance

Less Demanding Applications Are Approved

Crystals:As Small As: L=3.2 x W=2.5 x H=0.9 mm (max)

Operating Temp Range: -40 to +150°CFrequency Range: 9.84 to50 MHzFrequency Tolerance @ 25°C: ±50 ppmStability Over Temperature Range: ±150 ppmHigh Resistance To Shock & VibrationStandard Load Capacitance: 8 pF

TCXOs:As Small As: L=2.0 x W=1.6 x H=0.8 mm (max)

Frequency Range: 16 to 38.4 MHzHigh Precision GPSFrequency Stability: ±0.5 ppmOperating Temperature Range: -30 to +85°CSupply Voltage: +1.8 / 2.8 VDCAEC-Q200 CompliantEnable/Disable Function Allows DeactivationOf Oscillator Circuit

VCXOs:As Small As: L=5.0 x W=3.2 x H=1.2 mm (max)

Standard Frequency Range: 2.048-700 MHzFreq Stability: ±50 ppmFreq Control Range: ±100 ppm/+1.65 ±1.5 VOperating Temperature Range: -40 to +85°CSupply Voltage: +3.3 VDCOutput Type: LVCMOS, LVPECL, or LVDS

PRODUCTUPDATE

OCXO targets base station, T&M apps

Based on Vectron’s patented microproces-sor correction technology, the MX-041

“Super Single” OCXO features a power consumption of 4 W during warmup and 2 W during steady state at 25°C. Temperature stability is ±0.2 ppb over 0° to 70°C or ±0.6 ppb over –40° to

85°C, ADEV performance is 3e-12 at 1 s, and long-term aging is 10 ppb per year.

Measuring 50 x 50 x 14.55 mm, the OCXO offers a sup-ply voltage of 5 or 12 V and is available with either a HC-MOS or sine-wave output. (Call company for pricing — available now.)Vectron International, Hudson, NHhttp://www.vectron.com

OCXO consumes significantly less power than standard OCXOsAt 600 mW, the VFOV600 OCXO consumes significantly less power than most standard OCXOs. It is built in a space-saving DIL 14 package and generates frequencies up to 100 MHz. The OCXO has stability performance of Stra-tum 3 or better and has a phase noise floor of –160 dBc/Hz. (Call company for pricing — available now.)Valpey Fisher, Hopkinton, MAhttp://www.valpeyfisher.com

OCXO with low jitter targets GPS timing appsThe FTS375 OCXO is a GPS-driven mixed-signal phase-

locked loop, providing a 1-pps CMOS output and generating a 10-MHz CMOS and 10-MHz sine output from an intrinsically low-jitter voltage-controlled crystal oscillator. The part can lock to a 10 MHz reference de-

rived from the on-board GPS receiver, or to an external 10-MHz or 1-pps reference.

PRODUCTUPDATE

Crystals and oscillators

Additional features include three alarm outputs (loss of lock, holdover, and antenna fault), serial input and out-put ports, a 3.3-V power supply, and a temperature range of 0° to 70°C. Measuring 3.937 x 1.969 x 0.708 in, the OCXO meets ITU-T G.811 wander generation mask. ($300 ea/prod qty — available now.)Connor-Winfield, Aurora, ILhttp://www.conwin.com

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VCO operates from 2,620 to 2,710 MHz Used in applications such as digital radio equipment, fixed wireless access, satellite communications systems, and base stations, the CVCO55CC-2620-2710 VCO oper-ates from 2,620 to 2,710 MHz with a control voltage range of 0.5 to 4.5 V. This VCO features a typical phase noise of

–110 dBc/Hz at 10-kHz offset and has excellent linearity. Output power is typically 3 dBm.

Housed in a 0.5 x 0.5-in SMD pack-age, the VCO offers an input voltage of 5 V, with a maximum current con-sumption of 40 mA. Pulling and push-

ing are minimized to 1.5 MHz and 1.5 MHz/V, respec-tively. Second-harmonic suppression is –15 dBc typ. (Call company for pricing — available now.) Crystek , Fort Myers , FL http://www.crystek.com

Oscillator series draws a mere 1.5 μAThe 3.3-V F32K 32.768-kHz oscillator series draw a mere 1.5 μA of current and 250 nA of standby current, suiting them for a wide variety of applications including RTCs, microcontroller sub clocks, sleep-mode clocks, and

watchdog-timer clocks. The HCMOS oscillators come in a 3.2 x 2.5 mm package and offer stabili-ties of 10 to –90 ppm across a tempera-ture range of –10° to 70°C and 10 to –140 ppm across –40° to 85°C.

Supply voltage is 1.5 to 5.5 V, oper-ating temperature is –40° to 85°C, and storage temperature is –55° to 125°C. At 25°C, frequency tolerance is 5±20 ppm. The HCMOS oscillators feature a gold termination finish. (F32K-327 $1.31 ea/50,000 — 8 weeks ARO.)Fox Electronics, Fort Myers, FLhttp://www.foxonline.com

PRODUCTUPDATE

TCXOsOne Size Does Not Fit All

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VCOs target cellular infrastructure appsThe RFVC975x VCO family offers phase noise performance that meets or exceeds the requirements of 2G, 3G, and 4G (LTE and WiMAX) cellular base stations. One of the family members, the RFVC9750, features a frequency from 795 to


WEB EXCLUSIVE: Web-based IC customization revolutionizes timing circuits, by James Wilson, Silicon Laboratories

OCXO enables performance for demanding appsDesigned as a stable reference source for airborne and mobile communications and instrumentation, the YH1300 series OCXO has been designed to deliver consistent, reliable frequency control performance in high-shock-and-vibration environments and features a compact 0.80 x 0.50 x 0.37-in. hermetic DIP package. The device is available from 10 to 50 MHz and offers acceleration sensi-tivity down to 5 x 10-11/g.

It also provides a choice of CMOS square-wave or sine-wave outputs and 3.3-, 5-, or 12-V supply voltage. Electron-ic frequency control (EFC) is provided for precise tuning or phase-locking ap-plications. (Call company for pricing — available now.)Greenray Industries, Mechanicsburg, PAhttp://www.greenrayindustries.com

Crystals and oscillators

858 MHz, a tuning voltage from 1.4 to 4.85 V, an offset of –134.0 dBc/Hz, POUT of 4.0 dBm, a VCC of 5.25 V, and an ICC of 30.0 mA.

Each of these VCOs come in a 6.0 x 6.0-mm overmolded package using the company’s MicroShield Integrated RF Shielding technology which provides excellent RF isolation. (From $2 ea/100,000 — available now.)RF Micro Devices, Greensboro, NChttp://www.rfmd.com/purcase



NEWPRODUCTS

LED lamps mimic incandescent filaments The U-LED LED candle-, globe-, and mini-globe configuration lamps are designed to replicate the appearance of incandescent fila-ment lamps, using LEDs configured like a traditional incandescent fila-ment mount.

C o n s u m i n g less than 1 W and having a life rat-ing of 40,000 hours, the candelabra-base (E12) lamps are suited for decora-tive chandeliers and ornamental fixtures. The lamps are available in 120-V versions with a color tempera-ture of 2,700K (warm white) and they output approximately 36 lm. (Call company for pricing — available now.) Ushio America , Cypress , CA Information 714-236-8600 http://www.ushio.com

Picoprojector LEDs offer high brightness Without increasing their 3.9 x 3.6-mm package size package size, next-generation OSTAR Compact LEDs

provides more light output at higher current than previous models. They can handle up to 6 A in pulsed mode (typically 120 Hz, 2 ms, T s = 25°C), versus the previous 4 A,

At 6 A pulsed, the new LED can produce 350 lm in amber, 600 lm in green, and 165 lm in blue. Use of new packaging material reduces thermal resistance from the previous 6 K/W to 3 K/W, (Contact Mike Mar-

VCSEL offers more output power The A4-PL polarization-stabilized single-mode VCSEL produces a 1.4-mW output — double the power of the previous model. The emission wavelength is 855 ± 10 nm.

The diode laser was developed primarily for use in PC mice and cell-phone trackballs, but can also be used for other sensing applications. It is available both as a bare die and in a TO housing. (Die, less than $1 — available now.) Laser Components IG , Hudson , NH Valerie King 603-821-7040 [email protected] http://www.lasercomponents.com

tins for pricing and availability.) Osram Opto Semiconductors Sunnyvale , CA Francis Nguyen 408-588-3853 [email protected] http://www.osram-os.com

Optoelectronicsedited by richardcomerford

See our online archive at http://electronicproducts.com/op

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NEWPRODUCTS

Programmable LED drivers suit lighting apps The LEDC10 series of dc/dc LED driv-ers target LED lighting applications with output ratings up to 10 W. The LEDC10-12-R48 is a non-isolated, con-stant-current LED driver housed in a compact single in-line package, oper-ates with a 4.5 to 20-Vdc input and provides a programmable constant-current output from 0 to 480 mA with a drive voltage from 3 to 20 Vdc.

The LED drivers feature a con-stant-current output that is program-mable via external logic levels or jumpers connected to trim pins on the driver. The light-dimming con-trol is accommodated via a PWM control input with a duty cycle range of 10% to 100%, or by using the logic level trim inputs. By applying differ-ent combinations of logic to the trim inputs, the maximum output drive

current changes to 50, 150, 350, or 480 mA. All models are convection cooled and can operate in ambient temperatures from –40° to 85°C at full load without derating. The driv-er features overcurrent and overvolt-age protections. ($17 ea/1,000 — available now.) TDK-Lambda Americas San Diego , CA Mel Berman 619-628-2859 [email protected] http://www.us.tdk-lambda.com/lp

Convection-cooled supply offers active PFC The Cincon CFM101S series of switch-

ing power supplies features a 2 x 4 x 1.10-in. open-frame package with con-vection cooled op-

eration. The series provides 90 to 264

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Power Sources

edited by paulo’shea

See our online archive at http://electronicproducts.com/ps

Screw Terminals for Input and Output ConnectionsInternal Input FuseInternal Input Reversal ProtectionInternal Input In-rush Current Limit CircuitInternal Output Led IndicatorMeet EN55022 Class B DIN35 Rail Mounting Optional

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Vac input, 89% efficiency, and active power factor correc-tion for EN61000-3-2 Class D compliance.

The switching power supply offers adjustable single output voltages ranging from 12 to 48 Vdc, a 0° to 70°C operating temperature range, and full-load convection-cooled operation up to 40°C. The series is qualified for Class B emissions and is safety approved to UL/cUL 60950-1, TUV EN60950-1 standards. (From $32 ea/1,000 — avail-able now.) PowerGate , Sunnyvale , CA Paul Christiansen 408-588-1750 [email protected] http://www.powergatellc.com

LED driver meets IP67 reqs for outdoor apps The DLA series of ac-input LED drivers meets IP67 require-ments and feature output power ranges of 50, 75, 100, 120, and 150 W. They offer >85% efficiency for the 50 W and up to 94% for the 150-W models. The drivers have a power-factor input ranging from 0.85 to 0.99 depending on the model.

The drivers are available with either constant-current or constant-voltage out-puts, with the constant-voltage models offering nominal outputs of 12, 18, 24, 36, 42, 48, 54, or 105 Vdc, and con-stant-current models from 350 to 5,950 mA. The output voltage of the constant-current models is determined by the load. The drivers suit outdoor applications such as street,

Power Sources

tunnel, stage or architectural lighting, and traffic signals. (50-W model, $46.80 ea/500 — available now.) XP Power , Sunnyvale , CA Duane Darrow 408-732-7777 [email protected] http://www.xppower.com

Solid-state driver suits LED fixtures The LXMG221W-0700034-D0 pow-er supply driver module supports 5

to 16 LEDs. It has an input voltage range of 90 to

305 Vac, and en-ables operation in 100-, 120-, 220 to

240-, and 277-Vac, 50- and 60-Hz systems. It provides 14 to 48-Vdc output for LED loads up to 34 W. The module provides 90% power conversion peak efficiency while delivering nonflickering dim-ming down to 10%.

The power supply module can be integrated into dimming and non-dimming fixtures and meets require-ments for both commercial and resi-dential applications. Its IP66-rated

plastic package protects the power supply from dust and temporary wa-ter exposure and offers a through-hole for more secure mounting. (Sam-ples, $60 each — available now.) Microsemi , Irvine , CA Information 949-221-7100 http://www.microsemi.com

Parallel-redundant UPS is scalable The MOD10 series online three-phase UPS system features a modular, verti-cally scalable rack-mounted design that offers power protection needs in incremental steps without interrup-tion to the critical load. Users can add 10-kVA 2U-size modules to the UPS system up to 50 or 100 kVA.

The hot-swappable modules can be installed without system shut-down. The UPS system is optimized for critical servers, VoIP devices and other sensitive electronic equipment found in modern data centers and network closets. It can be deployed as a primary source for small to medium data centers or as an end-of-row re-dundant source in larger installa-

tions. The system achieves up to 94% efficiency with <5% total input har-monic distortion, and feature built-in SNMP/Web/network connectivity for remote manageability. (Contact [email protected] for pricing and availability.) Chloride , Libertyville , IL Chuck Heller 847-990-3625 [email protected] http://www.chloridepower.com/usa

PoL converters feature wide input range Part of the Okami series of switching regulator converters, the OKI-78SR nonisolated PoL dc/dc converters target industrial applications. The converters are a direct drop-in re-placement for industry-standard three-terminal 7803 and 7805 series LDOs, and offer a 7 to 36-Vdc input voltage range for nominal 24-Vin with either 3.3- or 5-Vdc output voltage.

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NEWPRODUCTS

The PoL converters offer up to 90.5%; efficiency and a 10.4 x 16.5-mm footprint in a vertical SIP-mount package in industry-standard TO-220 format. They support up to 500-μF ceramic load capacitance and fea-ture no thermal derating over the operating temperature range from –40° to 85°C. (Contact 508-339-3000 for pricing and availability.) Murata Power Solutions Mansfield , MA John Sutherby 08-339-3000 [email protected] http://www.murata-ps.com

Battery-charge cntlrs offer solar input The SCPOE series dual-input/output battery-charge controllers suit back-up power and remote power applica-tions. They charge lead acid batteries from a solar panel input and/or a POE input. The 5-A solar panel input

Mini 40-, 60-W supplies suit medical apps The open frame BSL/BSM Class II se-ries power supplies are available as single outputs of 5, 9, 12, 15, 24, 36, and 48 Vdc in 40 and 60 W. The 2 x 4 x 1.17-in. sup-plies accept universal in-puts ranging from 90 to 264 Vac and feature effi-ciency up to 85%. They offer Class II

protection, offering double insula-tion without protective earthing provision, and target commercial and medical applications.

The open-frame supplies meet UL/cUL 60950-1, Class II; TUV EN60950/60601-1-2, Class II; and CSA C22.2 60601.1, and Class II safe-ty classifications. The medically-ap-proved versions BSM40/BSM60 meet all UL60601-1, Class II safety stan-dards. The BSL version offers 3-kVac output isolation while the medical BSM supplies provide 4-kVac output isolation. (Contact 800-823-8082 for pricing and availability.) Astrodyne , Mansfield , MA Information 800-823-8082 [email protected] http://www.astrodyne.com

takes priority so grid power is not used when the sun is shining. The 24-W PoE output uses a dc/dc con-verter to provide 12, 18, 24, or 48 Vdc. The secondary out-put is equal to the battery voltage.

The dual in-puts on the bat-tery charger al-low powering equipment in areas where grid power is spotty, unreli-able, too expensive, or nonexistent. The dual outputs offer the customer the possibility of two different volt-ages from a 12-V battery system. The series offers protection from over-charge, overdischarge, short circuit, overvoltage, and overcurrent. The operation range extends from –30° to 60°C, Multiple configurations are available for 12- or 24-V battery sys-tems with various POE output volt-ages. ($49.95 each — available now.) Tycon Power Systems Draper , UT Scott Parsons 801 432-0003 [email protected] http://www.tyconpower.com

dc-dc converters isolated board mount

isolated chassis mount non-isolated regulators point-of-load modules LED driver modules

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Power Sources

HIGHLIGHTS

SMT contacts allow variety of solderless PCB connections The 9176 Series connectors feature a stand-alone surface-mount discrete wire IDC contact and cap component that allow a wide range of devices to be connected to the PCB without soldering or crimping. This eases design constraints and re-duces cost, particularly in LED lighting applica-tions, by enabling wires to be simply inserted into the SMT contact with a small tool, and to enable lighting designers to daisy-chain multiple boards.

The single contact and cap accept 18 to 24-AWG wires with 1.1 to 2.1-mm insulation diameter. The dual-beam contacts support a 10-A current rating, and the large SMT solder base provides high levels of PCB stability. Wires can be removed and replaced up to three times, and the optional locking strain relief cap acts as the termination tool for severe-vibration ap-plications. The connectors are supplied on SMT-compatible tape and reel and offer phosphor bronze contacts with tin over nickel plating, with UL94-V0 Nylon 46 insulators. Operating temperature is –40° to 125°C. ($0.08 ea/volumes less than 10,000 — 8 to 10 weeks ARO). AVX , Myrtle Beach , SC Tom Anderson 843-946-0351 [email protected] http://www.avx.com


NEWPRODUCTS

Compact BGA sockets suit test, debug devices The surface-mount Mod5 Series Flip-Top BGA sockets suit test, validation, and debug for 0.50-mm-pitch devic-

es used in handheld and wireless applica-tions. The 20 x 27-mm sockets can ac-c o m m o d a t e packages to 12 mm sq (22 x 22 rows), and require no tool-ing or mounting

holes in the target PCB. The sockets also feature precision-

machined solder balls and metallic spring probes with a system life of 200,000 cycles minimum. The de-vices also offer easy actuation, with a simple cover and turnscrew heat sink, that enables quick insertion and extraction. Additional mount-ing options and custom designs are also available. (Contact company for pricing and availability.) Advanced Interconnections West Warwick , RI Customer Service 800-424-9850 [email protected] http://www.advanced.com

Rugged cover sets are ultrasonically welded The CFast line of cover-sets and 24-way connectors features a two-piece p l a s t i c frame that is molded a r o u n d the cover and ultra-sonically welded together once as-sembled. Available in Type I or Type II packages, the surface-mount con-nectors are rated at 1.5 A per pin and designed to exhibit no disconti-nuity greater than 100 ns.

The devices offer a total mating force of 28.8 N maximum at 25 mm/min, and total unmating force of 3.7 N minimum, 24.5 N maximum at 25 mm/min. The connectors and cover sets are rated to 10,000 mating cy-cles, with operating temperatures from –55° to 85°C. (Ea/100,000: Top and bottom covers, $0.71; connec-tors, $1.37 — 4 to 6 weeks ARO.) ITT Interconnect Solutions Santa Ana , CA Keith Teichmann 714-628-2046 [email protected] http://www.ittcannon.com

Packaging & Interconnections

edited by christina d’airo and richard comerford See our online archive at http://electronicproducts.com/in

EMI/EMC gaskets offer high conductivity The ECG-7000 and ECG-8000 series electrically conductive cushioning gaskets (ECG) are compressible poly-

m e r i c - f o a m tapes that of-fer high z-axis conductivity and a thermal conductivity of 0.9 W/m-K.

The single-sided ECG-7000 series have a thin, electrically conductive adhesive tape laminated on the mesh fabric side of the cushion gasket, and the double-sided ECG-8000 have the same tape laminated on both sides of the cushion gasket. The gaskets can be die-cut to any size or shape in-cluding curved edges, and available in standard rolls. (Contact company for pricing — available now.) 3M Electronics Markets Materials St. Paul , MN Sales 800-251-8634 solutions.3m.com/wps/portal/3M/en_US/WW2/Country/Corp/Contact3M/

Backplane connector is fast, rugged The Fortis Zd connector is a high-speed, modular backplane system that allows data rates of 10 Gbits/s. Designed for military and commer-cial aerospace applications, the user-configurable backplane offers MIL-SPEC contacts and a M55302 heritage Mini-Box separable interface that provides four points of contact on all sides of the pin.

The connector is available in two- and three-pair versions with either plastic, shielded, or machined metal shell. The connector also includes a staggered and protected daughter-card pin field that supports two-level maintenance. (Contact company for pricing and availability.) Tyco Electronics , Harrisburg, PA Gregory Powers [email protected] http://www.TheFutureUnleashed.com.

Micro-USB sockets, plugs save space The Type B Mi-cro-USB 2.0 and USB 3.0 Micro-USB plugs and sockets can with-

stand over 10,000 mating cycles and support On-the Go technology. All USB 3.0 sockets are backward com-patible with USB 2.0 plugs and suit a variety of peripheral devices.

The #940TR surface-mountable Micro-USB 2.0 socket is available on tape and reel with UL94V-0 rated in-sulating material. The #955 through-hole mountable Micro-USB, 3.0 socket delivers data transfer speeds to 4.8 Gbits/s. The #941 USB 2.0 and #947 USB 3.0 Micro-USB plug kits are supplied with an unassembled metal housing with strain relief. Plugs and sockets are manufactured with gold plated contacts. (Contact company for pricing and availability.) Keystone , Astoria, NY Sales 800-221-5510 [email protected] http://www.keyelco.com

Connectors suit military vehicles, equipment The Fischer LandForce Series circular connectors are guaranteed for 10,000 mating cycles and designed to improved protec-tion of Future Soldier Systems, military vehicles, and other land-based equipment. The one-piece plug body connectors are constructed of a special high-resistant aluminum, are sealed to level IP68 / 69K mated or unmated, and withstand fog, salt spray (5% 35°C, MIL STD-202 Meth-od101A), sand, and moisture.

Operating temperatures range from –50° to 140°C, with EMC 360° high-performance shielding tested according to IEC norm 60512-23-3. The plug is available in two body sizes with push-pull locking or emer-gency release system, and configura-tions including multipole contacts from 2 to 19 poles. (Contact compa-ny for pricing and availability.) Fischer Connectors , Alpharetta , GA USA Sales 800-551-0121 [email protected] www.fischerconnectors.com/htm/Contact-us-Maps.asp

Enclosures act as shielding, mounting kit Type 32 Enhanced enclosures have gasket “spoons” stamped into the aluminum along the frame to pro-vide EMC shielding. The covers’

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NEWPRODUCTS

Connector suits mass-transit transmission The CIR-M12 circular bayonet data-bus connector bundles multiple Eth-ernet, MVB, WTB,m and video lines to enable data transmission in mass-transit systems. The connector in-cludes ITT’s Quadrax QXM12 con-

rounded design also helps contain EMI, and the unique design of the extru-sions allows direct mounting of PCBs or other compo-nents. Bezels conceal front assembly screws.

Standard cases come in 2U to 4U heights and various widths and depths. Features include stylized rubber feet for desktop applications, optional carry handles, and other ac-cessories. Customization is available. (Less than $100 ea / prod qty — stock to 2 weeks ARO.) Elma Electronic , Fremont , CA Sales 510-656-3400 [email protected] http://www.elma.com

tacts, rated at 3 A, which are mounted into the FRCIR circular bayonet se-ries hardware. Four conductor wires and associated braids are integrated into the contact and grouped by a NFF16-101–NFF16-102-approved thermoplastic insert, which con-forms to UNI-CEI 11170 (I2F2) and UL94-V0 specifications.

The connector’s coupling gaskets are silicone rubber, and metallic parts are made of RoHS-compliant aluminium alloy with black epoxy-urethanic varnish. Specifications in-clude operat-ing voltage of 100 Vdc, i n s u l a t io n resistance of 10 GΩ, and o p e r a t i n g temperature of –40° to 125°C. (Con-nector with plug, receptacle, and four male and female contacts, $255 — 8 to 10 weeks ARO.) ITT Interconnect Solutions Santa Ana , CA Keith Teichmann 714-628-2046 [email protected] http://www.ittcannon.com

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Packaging & Interconnections

HIGHLIGHTS

16-bit DAC offers lowest power, 3x more accuracy Designed for loop-powered smart-transmitter ap-plications used in industrial equipment, the AD5421 D/A converter with on-board power man-agement circuitry is a complete loop-powered digi-tal-to-4-to-20-mA transmitter that consumes 50% less power and offers a 55% footprint saving over competing offerings. Presented as offering three times more accuracy than competitive products, the DAC provides on-chip diagnostics that increase system uptime of process control systems located in large plants, such as oil refineries.

In addition, the part includes a voltage regulator, which is commonly used to power itself and other devices in the smart transmitter. The regula-tor provides a programmable output voltage of 1.8 to 12 V. The device also contains precision 1.25- and 2.5-V references, eliminating the need for a discrete regulator and voltage reference.

Consuming only 250 μA of quiescent current, the AD5421 offers 0.05% max TUE (total unadjusted error) and 5-ppm drift performance. The AD5421 can be used with standard HART (highway addressable remote transducer) protocol circuitry and offers NAMUR-compliant output ranges. Housed in 9.7 x 4.4-mm 28-lead TSSOP or 5 x 5-mm 32-lead LFCSP packages, the DAC is specified over the extended industrial temperature range of –40° to 105°C

SATA III drivers have adaptive equalization The PS8521A and PS8521B SATA III bidirectional repeater/redriver chips are said to be the first such ICs to in-corporate adaptive equalization, which significantly improves perfor-mance. The devices support 1.5-, 3-, and 6-Gbit/s data rates, as well as out-of-band signaling.

The PS8521A is also presented as the first SATA III device using a power-saving 1.5-V supply voltage, while the B version uses the tradi-tional 3.3 V. The ICs transition into

and incorporates a standard SPI-compatible interface. ($4.52 ea/1,000 — samples available now.) Analog Devices , Wilmington , MA Customer Service 800-262-5643 http://www.analog.com

HOW DO YOUCROSS REFERENCEONE PART TO ANOTHER?

12CROSSESFOUND

NEWPRODUCTS edited by christinanickolas, jimharrison and paulo’shea

See our online archive at http://electronicproducts.com/ic

sleep mode when no traffic is pres-ent on the SATA bus and become ac-tive with less than 10-ns latency. The chips feature adaptive receiver equalization and output pre-em-phasis and come in a 4 x 4-mm TQFN20 package. ($1.50 ea/volume qty — available 3rd qtr.) Parade Technologies San Jose , CA Customer Support 408-329-5540 [email protected] http://www.paradetech.com/

AudioDAC

(per channel)+

-

+V

-V

+V

AK4430(per channel)

+V

New 2Vrms Output DAC

Conventional Audio DAC Circuit

Operating from a single +3.3V power supply, the AK4430 elimi-nates the need for an e ternal audio ampli er. Delivering high audio delity even in noisy environments, the AK4430 is ideal for consumer audio applications where size and cost are limited.

AK4430 Audio DAC Circuit

24-bit stereo audio DAC 104dB dynamic range -92dB THD+N High PSRR No pop noise Zero offset Single +3.3V power supply

For more information visit our website at:http://www.akm.comContact our technical support staff at:1-888-AKMSEMI (256-7364)E-mail: [email protected]

60-W dc/dc converter sets new benchmark for size, power density The PI3101 Cool-Power high-densi-ty isolated dc/dc converter delivers 60 W of output power in half the size of existing solutions, setting a new standard for power density by delivering over 105 W/in.2 It com-bines isolation, voltage transforma-tion, and o u t p u t r e g u l a -tion into a surface-m o u n t P o w e r -System-in-Package (PSiP) platform with a 0.57-in.2 footprint and a 0.27-in. profile. It suits applications where board space, airflow, and height di-mensions are limited, such as ad-vanced telecom and wireless infra-structure, networking and communications, PoE applications, and high-speed server platforms.

The isolated converter features power conversion and isolation at the point-of-load and provides a 36 to 75-Vdc input and a regulated 3.3-Vdc output at up to 18 A. It withstands input voltage transients up to 100 V for 100 ms and pro-vides 2,250-V input-to-output iso-lation. The converter can replace 16th-bricks or discrete-based de-signs with a 50% reduction in total solution area. Programmable fea-tures include ±10% output voltage trimming, programmable soft-start capability, remote on/off enable, and a temperature monitor func-tion. ($29.97 ea/1,000 — available late June.) Picor , North Smithfield , RI Carl Smith 401-235-1111 [email protected] http://www.picorpower.com

Universal DDR3 register is low cost The SLGSSTE32882 DDR3 register covers 800 to 1600 RDIMM specifi-cations at 1.35 to 1.5 V. The device comes in a 176-TFBGA package with full compliance to JEDEC standards.

The 28-bit 1:2 or 26-bit 1:2 and 4-

bit 1:1 registering clock driver fea-tures selectable super high drive out-put drive strength, and single-register backside-mount function support. ($2.49 ea/10,000 — samples available now.) Silego Technology Santa Clara , CA Sales 408-327-8800 http://www.silego.com/


Integrated Circuits

Part NumberVDS

(V)ID

(A)

RDS(on) Max@ VGS=10V

(mΩ)

Qg(nC)

Package

IRFS3004-7PPBF 40 240 1.25 160 D2PAK-7

IRFP4004PBF 40 195 1.7 220 TO-247

IRFS3004PBF/ IRFB3004PBF 40 195 1.75 160 D2PAK/ TO-220

IRFR4104PBF 40 30 5.5 59 D-PAK

IRFS3006-7PPBF 60 240 2.1 200 D2PAK-7

IRFS3006PBF/ IRFB3006PBF 60 195 2.5 200 D2PAK/ TO-220

IRFB3206PBF 60 210 3.0 120 TO-220

IRFS3206PBF/ IRFP3206PBF 60 210 3.0 120 D2PAK/ T0-247

IRFR1018EPBF 60 79 8.4 69 D-PAK

IRFP4368PBF 75 195 1.85 380 TO-247

IRFS3107-7PPBF 75 240 2.6 160 D2PAK-7

IRFS3107PBF 75 195 3.0 160 D2PAK

IRFB3077PBF 75 210 3.3 160 TO-220

IRFR3607PBF 75 80 9.0 84 D-PAK

IRFP4468PBF 100 195 2.6 360 TO-247

IRFS4010-7PPBF 100 190 4.0 150 D2PAK-7

IRFB4110PBF 100 120 4.5 150 TO-220

IRFS4010PBF 100 180 4.7 143 TO-220

IRFP4568PBF 150 171 5.9 151 TO-247

IRFB4115PBF 150 104 11.0 77 TO-220

IRFS4115PBF 150 99 12.1 77 D2PAK

®

Distributors :

•TailoredforSynchronousRectification

•Optimizedforfastswitching

•Upto20%lowerRDS(on)*

•Upto20%increaseinpowerdensity*

•RoHSCompliant

•LeadFree

*Comparedtopreviousgenerations

for more information call 1.800.981.8699 or visit us at www.irf.com

Your FIRST CHOICEfor Performance

Lower RDS(on) Higher Performance

THE POWER MANAGEMENT LEADER

HIGHLIGHTS

Circuit protection device supports USB suspend mode The PolyZen ZEN059V130A24LS is an integrated de-vice that provides complete circuit protection for electronics with USB ports and meets suspend-mode power-consumption requirements for USB 3.0. The increased operating current allowed by the USB 3.0 specification lets devices consume 900 vs 500 mA in USB 2.0. The higher charging current helps shorten the charge time for mo-bile devices. The device supports a USB device designed to work with sus-pend-mode operation and limits the device to 2.5-mA average current draw.

The ZEN059V130A24LS is a polymer-enhanced zener diode that provides coordinated protection against damage caused by overvoltage, overcurrent, and ESD transients in a single package. It combines high power-absorption capabilities with zener voltage <6 V and low power-consumption. The de-vice’s polymer thermal-protection architecture allows it to absorb high-en-ergy pulses and block overvoltage and reverse-bias sources that could ulti-mately damage a stand-alone zener diode. The device protects sensitive downstream electronics and its 5-V power consumption meets USB 3.0 sus-pend mode requirements. For USB 3.0 devices, it can be placed on the USB input port or the Powered-B plug. Its embedded time-delayed overvoltage lockout and overcurrent switching help protect against the use of improper power supplies, reverse bias sources and negative voltages, ESD transients, and inductive spikes. ($0.66 ea/3,000 — available now.) Tyco Electronics, Raychem Circuit Protection , Menlo Park , CA Curtis Wong 650-361-2485 [email protected] http://www.tycoelectronics.com/

Stacked MOSFETs save space, achieve 90% efficiency at 25 A The CSD86350Q5D Power Block is a synchronous MOSFET half bridge that achieves >90% efficiency at 25 A and in half the area of competitive power MOSFET devices. It combines two asymmetric NexFET power MOSFETs in an advanced package that delivers high performance in low-voltage synchro-nous buck half-bridge applications, including servers, desktop and notebook PCs, base stations, switches, routers, and high-current PoL converters.

The MOSFET device can generate up to 40 A of current with a switching frequency of up to 1.5 MHz to reduce solution size and cost. The pinout and grounded lead frame reduces development time and improves overall circuit performance. The device also achieves comparable performance to GaN-based solutions at less cost. The 5 x 6-mm SON dual-MOSFET solution is half the size of the typical two-MOSFET devices in similar packages. The SON package has an exposed grounded pad on the bottom to simplify layout. Find more information at www.ti.com/mosfet-pr . ($1.75 ea/1,000 — available now.) Texas Instruments , Dallas , TX Product Information Center 800-477-8924 http://www.ti.com


NEWPRODUCTS

32-mm BLDC motors feature long lifetime The BX4 line of 32-mm brushless DC-servomotors feature a long operational lifetime, a high cogging-free output torque, and no adhesive-bonded joints. Intended for applications like robotics, automation, machinery, and aerospace/aviation, they operate from –20° to +100°C with 79,5% efficiency.

The motors come in 42- or 68-mm lengths with 12- or 24-V windings, and provide a continuous-output torque of 56 or 97 mNm. The series has a maxi-

Components & Subassemblies

edited by edited by p.o’shea, j.harrison and c.d’airo

See our online archive at http://electronicproducts.com/cs


NEWPRODUCTS

SPECIFICATIONS

EIA 7343, in 1.9, 2.8, and 4.2mm thickness

Capacitance Range: 6.8 to 470μF

Rated Voltage: 2 to 16VDC

ESR: 6 to 70mΩ

Operating Temperature: -40 to 105°C

APPLICATIONS

Computer: Notebook, Netbooks, Servers

Digital AV: LCD/Plasma TV, Audio/Video,

and Hi-Def Recording Box

Telecom: Routers, Base Stations

SUPPORTING OVERALL POWER MANAGEMENT:Noise Suppression, Ripple Absorption, Decoupling

NEW... from Murata...

POLYMERAluminum Electrolytic

Capacitors

YOUR COMPLETE CAPACITOR SOLUTIONS PROVIDER

For additional Polymer Information, visit

www.murata-northamerica.com/polymer_al

Actuator has integrated position sensor The LAS13-18-000A linear voice coil actuator features an integrated posi-tion sensor and com-pact package. It targets a variety of positioning and force con-trol applica-tions and has 6 mm of total stroke and 15.5 N peak force.

The actuator has a 1.3-in. diame-ter with a 11.8-in.-long body, a 0.38-in. shaft, a nominal voltage of 27.2,V, and a nominal current of 1.59 A. An accuracy of 10 to 20 μm can be achieved. (From approx. $350 ea/prod qty — available now.) BEI Kimco Magnetics , Vista , CA Sales 800-572-7560 [email protected] http://www.beikimco.com

SMD rotary position sensor is customizable Offered in a 15-mm package, the SMD PS15 Series rotary position sen-sor is available with seven different rotor designs and 15 shaft styles, al-lowing for custom configurations for control or position feedback require-ments. The sensors are housed in a dustproof enclosure, available in nine colors in standard or UL94-compatible plastic.

The RoHS- and REACH-compliant series comes standard with a 240° electrical angle, 100,000-actuation lifecycle, and linear, log, and antilog electrical tapers. Other features in-clude an SPDT switch, rotational an-gle of 265° ±5°, operating tempera-tures of –40° to 85°C, and tolerances of ±30%. An optional detent feature is also offered. (From $0.460 ea/10,000 — 8 to 10 weeks ARO.) Piher North America Libertyville , IL Paul Cain 847-918-9300 [email protected] http://www.piher.net

Ferrite core can thread multiple cables The 1.25 x 1.23 x 1.25-in. FerriShield multiturn sleeve snap ferrite core pro-

vides high imped-ance by threading multiple cables. The bisected, snap-on design features serpentine cable

threading, allowing up to three pass-through openings for cables with di-ameters from 0.365 to 0.203 in.

Cables can be “looped” through one, two, or thee of the ferrite holes to improve impedance. A single pass through the SS28B2035-3 ferrite can provide 340-Ω impedance at 100 MHz, and passing the same cable through additional holes creates im-pedance equal to the square of the number of turns. Cores are available with and without adhesive. (From less than $10 each — stock.) Leader Tech , Tampa , FL Tim Black 813-855-6921 [email protected] http://www.leadertech.com

PFC rectifier features 1-V voltage drop Six new 600-V, 8-A FRED Pt rectifiers suit consumer electronics applica-tions. They feature a typical voltage drop of 1 V at rated current, and a

recovery time as low as 16 ns in hard-switching condi-tions, and typical leakage current of 30 μA at 125°C.

The rectifiers ad-dress 70 to 400-W

switch-mode power supply applica-tions, and provide PFC solution for laptop computer and printer adap-tors, desktop PCs, TVs and monitors, game controllers, and ac/dc power supplies in DVD and Blu-ray players. The devices also suit lighting and ballast applications. The six devices provide a maximum forward voltage from 1.07 to 3.2 V, a typical t RR at 25°C from 200 to 16 ns, and a typical Q RR at 125°C from 2,400 to 62 nC. (Ea/1,000: TO-220AC pkg, $0.33; TO-220FPAC pkg, $0.37 — available now.) Vishay Intertechnology Malvern , PA Information 619-336-0860 [email protected] http://www.vishay.com/

mum speed of 5,500 or 7,100 rpm and is now available in versions with inte-grated speed controller (SC), or inte-grated motion controller (CS). (BX4 3242, from $175.70; 3268, from $258.20 ea/100 — stock.) MicroMo Electronics , Clearwater , FL Sales 800-807-9166 [email protected] http://www.micromo.com

Components & Subassemblies


More Power To You! BlockMaster’s High-Power Terminal BlocksOur blocks are: • Available up to 250A@600V• PC Board or Thru-Panel• UL Approved, RoHS CompliantIdeal for: • Power Supplies • HVAC • Motor Controls • Off-Road Vehicles

BlockMaster Electronics, Inc.1-800-595-8881www.blockmaster.com

Get the First Word on New Product Launches!The Electronic Products’ New Product Introduction supplies you with the most important new product information in a matter of minutes! Everything you need is here…in easy-to-navigate, user-friendly form:• Product Specs • Press Information • Videos • Important data (such as white papers, reference designs, etc.) • Manufacturer Information • Where to buy And much more!Check out the latest Product Launch at:Hearst Electronic Grouphttp://www.nxtbook.com/fx/clients/hearst/archives_npi.php

Panasonic Circuit Protection ComponentsPanasonic Electronic Components is an industry leading manufacturer of high quality, reliable and advanced Circuit Protection products that are available in a wide range of specifications.• ESD Suppressors • Thermistors• ZNR Surge Absorbers • Heat Spreading Material (PGS)• Thermal Cut-offs• VaristorsPanasonic Electronic Compontentspiccomponentsmarketing@ us.panasonic.comwww.panasonic.com/ ecomponents/ctp/

Fixed Frequency Active Filter Modules and Module Boxes Krohn-Hite’s Fixed Frequency Filter Modules and Module Boxes are made custom for applications needing a low cost solution.• Low Noise • Frequency Selection: 1Hz to 2MHz • HP, LP, BP and Custom • 1 to 16-Poles, Butterworth or Bessel • Input and/or Output • Filter Module Box with BNC In/Out

Gains to 100• Battery Powered Boxes AvailableFor more information call

Krohn-Hite508-580-1660 www.krohn-hite.com

Small Size, High Reliability Ultra-Miniature Quartz Crystal With a 3.2 mm x 1.5 mm footprint and a 0.97 mm maximum height, the CX11 crystal is one of the smallest crystals available in the industry. It is available in a 32.768 kHz frequency, as well as frequency ranges of 100 kHz to 180 kHz and 20 MHz to 50 MHz. Calibration tolerances down to 30 ppm are available for this crystal. The CX11 is ideal for medical, military and industrial applications where board space is at a premium. To obtain the latest datasheet for the CX11, visit www.statek.com.

Statek [email protected]

Miniature Piezo Chime Tone Alarms are 103 dB @ 2’Floyd Bell’s stylish Turbo Series piezoelectric alarms are twice as loud and half the size of industry counterparts. • The pleasant chime tone can be heard in most loud

environments and has a watertight seal when used with a gasket. • Optional rotary volume control lets the user decide on the

loudness. • Various voltages, terminations

and tones available.

Floyd Bell [email protected]://www.floydbell.com Turbo Series

Alarm with Volume Control

advertiser index This index is provided as an additional service. The publisher does not assume any liability for errors or omissions.

Absopulse Electronics Limited …………76Acopian Power Supplies ………………75Advanced Interconnections Corp ……58Agilent Technologies ……………… 4, 15AKM Semiconductor Inc ………………83Allied Electronics Inc ……………………49Ametek Programmable Power …………76Apex/Cirrus Logic ……………………… 6APM Hexseal ……………………………68Aries Electronics …………………………32Avnet Electronics Marketing …… 2, 59Blockmaster Electronics ………………88Cadsoft Computer Inc. …………………40Calex Manufacturing Co. Inc. …………62Coilcraft …………………………………10Coilcraft CPS ……………………………16Connor Winfield Corporation …………72ConTech …………………………………48

Cornell Dubilier Electronics ……………19Crystek Corporation ……………………73CUI/Novum ………………………………12CUI/V-Infinity ……………………………78Data Image ………………………………74Digi-Key Corporation ………………… 1Elma Electronics, Inc. …………………69Endicott Research Group (ERG) ………48Fairchild Semiconductor Logic ………66Floyd Bell, Inc. ……………………………88Fox Electronics …………………………71Garrett Electronics, Corp. ………………61Globtek Inc. ………………………… C1, 75Harwin ……………………………………20Hioki USA Corporation …………………53Hittite Microwave Corp. ………… 55, 57Integrated Power Design ………………25International Rectifier …………………84

ITW Insulcast ……………………………67Krohn-Hite Corp. ………………… 63, 88LeCroy ……………………………………51Linear Technology Corp. ………………13Linx Technologies ………………………85Master Bond Inc …………………………81Master Distributors ………………………42Maxim Integrated Products ……… 37, C4MicroCrystal ……………………………72Minmax Technology Co Ltd …………52Mouser Electronics ………………………28MS Kennedy Corporation ………………18Murata Electronics North Amer. Inc …86National Instruments …………………… 3NDK America Inc. ………………………70OKW Enclosures Inc ……………………81Panasonic Industrial Co ………………88Pelican Products ………………………… 9

Pico Electronics Inc ……………… 69, 80Pletronics …………………………………73Pduke Technology ………………………76Probe Master Inc …………………………26Recom Power, Inc. ………………………23Renesas Electronics Corp. ………………31RF Monolithics, Inc. ……………………62Rhode & Schwarz …………… 39, 41, 43Rigol Technologies ………………………60Schurter, Inc. ……………………………24Spectrum Advanced Specialty Prds. … 44, 45Statek Corporation ………………… 87, 88Super Bright LED’s ………………………74TDK-EPC Corp. …………………… 33, 35TEKO Enclosures inc ……………………79Tektronix, Inc. ……………………………47Vicor Corp.- Brick Group ………………77Vicor Corp.- VI Chip Group ………… C2Vicor Corp.- Westcor Division …………21

ProduCt mart Electronic Products Presented by the Manufacturer

Iron powder (IP) core fl at coil in-ductors have become the de-fault choice of design engineers

that need to meet low inductance (0.4 to 10 µH) requirements at high currents (10 to 40 A). How-ever, these inductors are commonly designed into applications which do not require the very low profi le offered by the fl at coil winding inductors at a price premium. Flat coil inductors at a price premium were originally developed for mobile comput-ing applications, and feature different critical requirements than that of datacom applications.

The IP fl at coil inductor’s characteristics do not yield an op-timum inductor design for the modern high- frequency switch-mode power supply (SMPS). An alternative winding technology and material choice is presented to reduce costs and increase performance while using the additional available height. Fi-nally, a direct comparison between the IP fl at coil and the new inductor validates this performance enhancement in a real ap-plication.

The optimized inductor The optimum inductor design is best derived by considering the features, benefi ts and limitations of the present IP fl at coil solution. This solution is constructed from a helical coil wound

from rectangular cross section wire, which provides an excel-lent core fi ll factor, and is surrounded by IP material.

With the low inductance achieved by a few turns, the wind-ing has low dc resistance (R dc ) in a very low profi le. In applica-tions where this is not a requirement, the same R dc per turn can be achieved in a coil using standard round wire of the same cross section. The height of the round wire coil (RWC) is in-creased, but with the immediate benefi t that is a much reduced coil cost.

The IP material can support large currents without satura-tion. The saturation current is signifi cantly higher than the rated heating current, which is an advantage for computing ap-plications where the power supply needs to provide high cur-rents for a short duration. However, in datacom SMPS applica-tions, this feature is not useful, as the peak (or ripple) current is a fi xed percentage of the rms current. A better solution is one where the saturation current is just a little larger than the heat-ing current

The IP material also has relatively high core losses. A com-parison of other available magnetic materials shows that there are superior options, especially when considering that induc-tors in datacom applications typically have higher volt-second

Cover-to-Cover Service and Selection The 2010 Digi-Key catalog:

2,777 pages More than 460,000 products in stock and ready for immediate shipment Over 440 supplier partners Same-day shipping/ next-day delivery for orders received prior to 8 p.m. CT

Digi-Key Corporation Thief River Falls, MN 56701 800-344-4539 www.digikey.com

••

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distributor

Custom Switching Solutions Guide from Omron Omron’s Switch Engineering Center will assist you in custom designing your switch to meet your exact specifi cations. Custom Requirements include:

Special levers, terminal bends, customized wire harnessing, different plastics/materials, unique operating forces, and MORE Get your copy of the new Custom Switching Solutions Guide today!

Omron Electronic Components847-882-2288 [email protected] www.components.omron.com/components/web/pdfl ib.nsf/0/A951FBF93EC5EE118625770B00

70B985/$fi le/SB_SWEC-01_CustomSwitchSoltns.pdf

•

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electromechanical

continued on page 90

New ferrite core round wire coil inductors outperform traditional iron powder core flat coil inductors in datacom applications

Ferrite core takes the lead

BY GERARD HEALY Pulse, Tuam, Ireland http://www.pulseeng.com

APPLICATION

REFERENCE

MATERIALS

catalog/literature application notes

design software design kits

evaluation boards reference designs

july2010

http://arm.eem.com

drops, which generate a larger core excitation when compared to the low voltage drops in computing applications. The in-creased excitation (Delta B) generates significantly higher core losses, particular at higher switching frequencies (see Fig. 1).

Finally, the IP material has an inherent tendency to degrad-ed when continuously subjected to elevated temperatures in excess of 100°C over a long period of time. While this is not a concern for mobile computing applications, thermal aging is an issue for applications where components are required to have an operating temperature range up to 125°C. Higher-grade IP materials are available, but this further increases the cost of the component.

In comparison, ferrite material does not have issues with thermal aging, is low in cost and offers 10% of the core losses of IP material. Significant performance enhancement arises from selecting this material.

The ferrite round wire coil inductorThe optimization process is incorporated into the ferrite round wire coil inductor demonstrated in Fig. 2.

Some additional features include:• Flattening and self terminating of the coil ends for increased

reliability• Dummy third pin for increased mechanical stability.

• Less turns compared to IP equiva-lent, lower Rdc .

• Tighter Rdc tolerance.• Optimized core design based on

coil dimensions further reduces core losses.

• Possible to increase number of winding turns/larger induc-tance range.

Performance comparisonThe table in Fig. 3 shows the electrical specification of two in-ductors of comparable size (7.5 x 7.5 mm). The height of the RWC is 6.4 mm, while the flat coil equivalent is 3.2 mm.

The RWC features a significantly lower Rdc and the satura-

Free Guide to Understanding Electrical Test and MeasurementKeithley’s Guide to Understanding Electrical Test and Measurement CD offers practical information to help you analyze your applications and the solutions that can solve your test and measurement needs. This useful reference library includes application notes, articles, data sheets, demos, selector guides, and white papers for a complete technical overview of applications and instrumentation options. Visit www.keithley.com/at/562 to request your free CD.Keithley Instruments, Inc.Cleveland, Ohio 44139 800-588-9238www.keithley.com

test & measurement

Boker’s Free 2010 Washer CatalogBoker’s complimentary 2010 Washer Catalog features more than 24,000 non-standard flat washer sizes available with no tooling charges. Outside diameters of 0.080” to 5.140”, a broad range of IDs and thicknesses, as well as 2,000 material options provide endless possibilities. Materials include low-carbon sheet steel, various spring steels, stainless steel, aluminum, brass, copper, nickel silver and non-metallics. ISO 9001:2008 Registered

Boker’s, [email protected]/arm

packaging & interconnects

Order Your Interpower Corporation CD Catalog OnlineInterpower Corporation is your power system component warehouse. We offer a 1 week manufacturing lead-time, no minimum order requirements, and value-added services to make designing for export EASY and FAST.

International Cordsets • Plugs and SocketsHigh Power Pin and Sleeve DevicesNorth American and International CableStrain Reliefs • Power Entry ModulesFuses and Fuseholders • Accessory Power Distribution

Interpower CorporationOskaloosa, IA 52577800-662-2290www.interpower.com

•••••


ITE/Medical Grade Power Supplies Catalog Technical information on domestic and international wall plug-in, desktop and open frame power supplies (switchmode, unregulated) battery chargers (Ni-CD, NiMH, LA/GC) and transformers UL, CSA, TUV, CE and other international safety agency approvals Custom designs, stock, modified and just-in-time delivery at very competitive prices100% of Globtek products are RoHS compliantCEC/EnergyStar Supplies

GlobTek, Inc.Northvale, NJ 07647201-784-1000www.globtek.com

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power sources

Fig. 1. Core loss vs. Delta B for different core materials.

Fig. 2. The ferrite round wire coil inductor.

continued on page 91

Ferrite core takes the lead continued from page 89

90 Application Reference Materials july 2010 arm.eem.com

tion current is optimized to 30% greater than the heating cur-rent. Considering a typical end application as outlined below, this and the reduced core losses significantly reduce the total inductor losses.

The development of a new type of wound inductor was mo-tivated by the need to offer a lower-cost solution for low-induc-tance, high-current requirements to the datacom market com-pared to currently available product offerings. The RWC inductor achieves this by reducing the cost of the winding technology. The selection of a ferrite core material brings the additional benefit of improved performance and an increased operating temperature range.

Compact Supercapacitors at All-New Illinoiscapacitor.comVisit IC’s ALL NEW website with powerful new parametric search tools! See DCN supercapacitors reaching up to 400 Farads. Custom packs offer higher ratings.

0.25F to 400F, 2.7 & 5.4WVDCOperating temperature: -40° to +65°COperating life is 10 years (500,000 cycles)High Power Density, Low ESRApplications include: battery pack alternatives,

memory backup, battery/capacitor hybrids; more. Illinois Capacitor [email protected]

•••••

passive components

Ultra Low ESR Capacitors Mission Critical AppsUltra-low ESR Capstick Type CS & CB in thru-hole or SMD versionsIdeal replacement for MLC’s in high frequency filtering applications Angstor Type RA which is designed for high-frequency filtering and EMI/RFI suppression Surfilm Type ST in SMD reflow chip package for HF input applications Quencharc R/C network for arc/noise suppression

ITW PaktronLynchburg, VA 24502434-239-6941www.paktron.com

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passive components

New Filter, Connector, Ceramics & Antenna Short Form CatalogComplementing the most complete line of coaxial EMI components, power surface mount filters, filtered arrays and power filters, Spectrum also offers it’s recently expanded lines of advanced ceramics, film modules, filtered and unfiltered interconnects and antenna assemblies.

Custom, Application-Specific Solutions Innovative Solutions from Components to Complex Assemblies • Full Vertical IntegrationIndustry’s Broadest Line of Standard ProductsMIL-Qualified Products • Low Cost Manufacturing

Spectrum Advanced Specialty ProductsFairview, PA, 16415, 814-474-1571www.SpecEMC.com

••

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passive components

Type 947C offers More Options for Power Electronics!!!Next generation inverter designs for renewable energy applications demand reliable DC link capacitors with higher capacitance values, voltage, and current ratings. Now available in new case sizes, Cornell Dubilier’s expanded range of Type 947C power film capacitors meet or exceed the requirements for bulk energy storage, ripple filtering and life expectancy for wind and solar power inverter designs, as well as electric vehicle applications. Cornell DubilierAluminum: 864-843-2277 Other: [email protected]

passive components

Ferrite core takes the lead continued from page 90

New Short Form Catalog of Coilcraft MagneticsComprehensive source of inductors, transformers and filters forpower, RF, filter and data applications, includingnew values for 30 product families:

High performance chip and power inductorsSquare air core inductorsCoupled inductors for SEPIC applicationsDesigner’s kitsOrder FREE SAMPLES on-line

Coilcraft800-322-2645www.coilcraft.com

•••••

www.coilcraft.com

Magneticsfor RF, power,filter and dataapplications

www.coilcraft.com

May 2010

®

passive components

High Q Military-Grade Ceramic Chip Inductor GuideNew, very robust ceramic resonators, designed for military and other critical product applications. The ML Series offers:

Exceptionally high Q factors, especially at use frequencies • Outstanding self-resonant frequency • Tight inductance tolerance High-temperature encapsulate for -55° to +155° operationTested under environmental stress conditions Also available with tin-lead terminals

Coilcraft [email protected]

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®

Magneticsfor RF, power,filter and dataapplications

www.coilcraft.com

September 2009

passive components

Fig. 3. Total inductor losses vs. current comparison for RWC and flat coil.

arm.eem.com july 2010 Application Reference Materials 91

When you need precision, choose LEMOThe LEMO line of REDEL plastic connectors are precision designed to ensure durable, reliable performance in critical medical devices. The standard for the EP catheter industry, REDEL connectors are lightweight, sterilizable, and include machined gold-plated contacts for superior electrical performance.

Metal ShieldingMedical touch-proof applicationsHybrid insert configurationsMultiple keying options • 2 to 48 contacts

Heilind ElectronicsWilmington, MA 01887877-891-5968www.heilind.com

••••


LK-110IS Magnetic Shielding Lab Kit“Hands-on” shield design kit eases prototyping

Kit contains wide range of shield material samples including CO-NETIC® AA and NETIC® alloy and foil and CO-NETIC® braided sleeving. Includes a handheld, single-axis magnetic field Gaussmeter that provides the user with a quick, reliable and easy way to measure EMF radiation. Specially configured to introduce technical personnel to materials and procedures in evaluating magnetic fields and shielding shapes.

Magnetic Shield Corporation800-304-5665shields@magnetic-shield.comwww.magnetic-shield.com

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Visit Mill-Max’s Design Guide OnlineSearch • Download individual product drawings and specs;Browse • 237 pages of standard offerings available with traditional

platings, as well as RoHs compliant platings;Create • Design in Mill-Max products from

choices of standard and application specific parts.

For our new Design Guide and to see new products, go to www.mill-max.com/design Response Code: EP567

Mill-Max.Oyster Bay, NY 11771www.mill-max.com/EP567


METCASE Aluminum Enclosures Catalog Catalog featuring the extensive METCASE range of aluminum electronic enclosures from OKW. The range includes:

Small instrument casesDesktop and portable enclosuresSloping front terminal enclosuresWall mounted enclosures19” rack mounting cases19” Instrument cases The catalog provides all ordering and technical information in an easy to use format

OKW Enclosures, Inc.800-965-9872 www.metcaseusa.com

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Hundreds of Pins and Patterns at Your FingertipsFlip through our comprehensive catalog to create the exact IC socket, adapter, or connector you need. Select a footprint and choose from hundreds of screw-machined terminals to match your application.

SMT and through-hole BGA, PGA, DIP, SIP and more Test, development, or production Free samples and fast prototypes

Advanced Interconnections Corp.West Warwick, RI 02893401-823-5200www.advanced.com

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Switch Sealing Boot CatalogHermetically seal any switch, potentiometer or circuit breaker with a HEXSEAL® silicone sealing boot. IP66/68 rated, meets MIL Spec MIL-DTL-5423 and is UL Recognized. Armored and EMI/RFI versions. Toggle, pushbutton, rotary and rocker styles to fit all popular devices. Catalog features manufacturer cross reference charts. NEMA & technical reference info.

APM [email protected]


New 2010 Enclosure CatalogOver 2,500 enclosures, cabinets, chassis and racks are described in Bud’s new 2010 product catalog. Same day shipping is available on 95% of items.

Large Cabinet RacksCommunications Cabinets/RacksOpen and Card RacksSmall Metal EnclosuresNEMA BoxesPlastic BoxesAccessories/Brackets

Bud Industries, Inc.Willoughby, OH 44094-0431440-946-3200www.budind.com/10

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Protection from earthquakes and other threatsWhen the ground starts to shake and things are being torn up the last thing you want to worry about is the shock and vibration resistance of your system’s enclosure. Our seismic resistant cabinets meet these requirements:

Telecordia GR-63 CORE through Zone 4Mil-Spec 810 and 901Shock/vibrationMil-Std 461, IEEE 299, NSA -94-106EMI/RFI, FCC/VDE • Metric and more

Personal assistance available by phone.

Equipto Electronics Corp.Aurora, IL 60506800-204-7225www.equiptoelec.com/seismic.htm

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Signal Enhancing Materials for RFID Applications RFID Antennas are sensitive to metals • Nearby metals absorb the antenna’s power • Less antenna power means: weaker signals & shorter communication range

This is a serious problem in RFID enabled mobile devices. Try our Flex RFID to correct this problem!• Super thin sheets: 100um to 400um • Flexible, yet sturdy & self adhesive • Excellent performance at 13.56 MHz • Flex RFID is available in two types: BD & RM

NEC TOKIN America 408-324-1790 www.nec-tokin.com /english

•

oscillators, fi lters & RF

Ceiling Light Uses GLT’s LED-Based EdgeLighting Technology & Is Mass Producible New troffer uses advanced light extraction technology for bright, uniform illumination in a thinner form factor with longer life and economical design. LEDs are spaced along edge of troffer assembly against the light guide backlight to create a 23.5” x 23.5” assembly only 9 mm (0.35”) thick and weighing < 3 kg (6.6 lbs.). GLT can design and economically mass produce with no deviation in performance from unit to unit.

Global Lighting Technologies, Inc. 866-922-4584 / 440-922-4584 www.glthome.com

optoelectronics

Precision Lens Optics from Prototype to Production Universe Kogaku’s application engineers will help with your optics design considerations, from lens assembly and overall specifi cations to budgets and timetables. Reduce your project costs with Universe’s extensive selection of standard lens assemblies and elements, and value-added services for component modifi cation. Custom lenses can often eliminate the need for other design modifi cations.60 Years of Optics Design Innovation.

Universe Kogaku America 516-624-2444 [email protected] www.ukaoptics.com

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optoelectronics

LED Light Delivery Solutions For over three decades, our focus has been on identifying and creating the LED light delivery hardware our customers need to be successful. Whether it’s an off-the-shelf product or a custom solution, we are prepared to tackle your most unique product requirements.

Lenses • Lightpipes Cable Assemblies Panel Mounts Board Mounts 100% RoHS Compliant

Visual Communications Company San Marcos, CA 92069 800-522-5546 www.vcclite.com

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optoelectronics

Modifi ed and Custom Interconnects from Samtec The guide details Samtec’s design and development capabilities for application specifi c products.

Pin Modifi cations • Body Modifi cations Special Platings and Metals (non-magnetic; ferrite free) • Special Cables and Wiring Rugged locking, latching and screw down systems • Quick Turn Prototype samplesShort lead times • Full engineering supportComplete design and development support

Samtec, Inc. New Albany, IN 471501-800-SAMTEC-9 www.samtec.com

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Comprehensive RF Products Guide Crystek specializes in providing high-frequency, low-phase-noise solutions to the microwave and RF wireless industries. Crystek’s custom engineering solutions, manufacturing capabilities and quality control are unmatched in the industry. The RF Products Guide provides specifi cations for:

VCOs (voltage controlled oscillators)PLL/Synthesizers (phase lock loops)SAW Oscillators • Low Pass FiltersAmplifi ers • AttenuatorsRF Coax Cable Assemblies

Crystek Corporation Ft. Myers, FL 33913 800-237-3061 www.crystek.com

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Expanded Patented Delay Lines These all silicon delay lines use low-power CMOS technology. Inputs/outputs are TTL compatible, combining the reliability of semiconductors with the stability & accuracy of hybrid lines. Other features:

High reliabilityVoltage/temperature compensationDelay Tolerance of 1% availableVery low ground bounce5 & 10 equally spaced tabsNo external components neededLow cost and delivery from stock

Data Delay Devices, Inc. Clifton, NJ 07013 973-773-2299 www.datadelay.com

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COTS & QPL Crystals & Oscillators Frequency control components for Hi-Rel/Demanding Environment applications. The product line-up includes:

MIL-PRF-55310/30 CMOS XO-40 to +150°C Crystals-40 to +125°C CrystalsGPS Grade TCXOsXOsFixed Com VCXOs & FCXOsSAW Filters

NDK 815-544-7900 [email protected] www.ndki-rel.com

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High Voltage Test and MeasurementThis brochure features high voltage electronic and electro-mechanical devices that we design, test, manufacture and calibrate.

HV Relays & HV Voltage DividersHV Probes & HV Digital Multimeters HV Power Class VoltmetersHV Switches & HV Circuit BreakersHV AC Hipot & DC Hipot MegmeterHV Calibration - A2LA AccreditedLab, Industrial & Military Applications.ISO 9001:2008 QMS CertifiedISO/IEC 17025:2005 Accredited

Ross Engineering Corp.408-377-4621info@rossengineeringcorp.comwww.rossengineeringcorp.com

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HV RELAYSHV SWITCHESHV CONTACTORSHV MEASUREMENTHV ENERGY STORAGEHV SAFETY & ACCESSORIES

HV PROBESHV DIVIDERS

HV VOLTMETERSHV HIGH CURRENT

HV CALIBRATION LABELECTRONIC & HIGH POWER

ISO 9001:2000QMS CERTIFIED

ISO/IEC 17025:2005

540 WESTCHESTER DRIVECAMPBELL, CA 95008UNITED STATES

U.S. TOLL FREE: 1-800-654-3205PHONE: (408) 377-4621

FAX: (408) 377-5182

www.rossengineeringcorp.come-mail: [email protected]

ROSS ENGINEERING CORPORATION

10V to 1,000,000V DC to 10MHz

test & measurement

AC/DC & DC/DC Power SuppliesSince 1957, Acopian has been a global supplier of AC-DC power supplies, DC-DC converters; & redundant & multiple-output power systems.

Power supplies are available in all voltages from 0v to 30 kV and up to 1200W. • Single, dual, triple and wide adjust outputs; • Switching, linear, regulated & unregulated power supplies; Programmable, High Voltage, Universal Input, UL508, PFC • Rack, Wall or DIN rail mounting. 3 Day Shipping Guaranties 5 Year Warranties

Acopian Power [email protected]

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power sources

Mini Power Supplies Shipped Within 3 DaysConserve space with Acopian mini-modules. Outputs ranging from 1 to 75 volts, and from 30mA to 2.5 amps are available.

AC-DC and DC-DC Every Output from 1v to 75vUp to 2.5 ampsSingle and Dual OutputLinear, SwitchingWith Screw Terminals, PCB MountingCustom Capabilities

Acopian Power SuppliesEaston, PA 18044610-258-5441 • 800-523-9478www.acopian.com

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power sources

Bel Power’s Non-Isolated & Isolated DC-DC Converter ModulesCovered in our new, 4-color brochure:

SMD and vertical mount boost converters, overmolded SMD, and compact SMD parts. Modules operating from 2.5V, 3.3V, 5V, or 12V rails and providing output voltages from less than 1V to 5V. Parts providing output currents ranging from 1A to 150A, and those which convert 48V buses to 12V rails.

Bel Power Inc.Westborough, MA 01581508-870-9775www.belpower.com

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power sources

Transformers, Transducers and Accessories Catalog

Catalog features split-core and solid-core current transformers, potential transformers, electrical transducers for AC and DC applications Signal conditioners, digital and analog panel and switchboard meters Current relays/switches, shunts, shunt switches, shorting terminal blocks, multi-function power meters, and accessories

Flex-CoreColumbus, OH 43235614-889-6152www.flex-core.com

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test & measurement

Complete Guide to Ultra-Fast I-V ApplicationsKeithley’s 20-page on-line tutorial offers insight into a variety of semiconductor measurement applications for ultra-fast I-V measurements. Learn about the ultra-fast I-V sourcing and measurement techniques being used for many technologies, including compound semiconductors, medium power devices, non-volatile memory, MEMs, nanodevices, solar cells, and CMOS devices. Visit http://www.keithley.com/ultrafast for a free download.

Keithley Instruments, Inc.Cleveland, Ohio 44139 800-588-9238www.keithley.com

test & measurement

Mini RFID Data Loggers and Readers OM-84 Matchbook Series™

Economical • Accurate Reliable solution for cold chain environmental monitoringMiniature weather-resistant designFactory replaceable batteryStore up to10,000 readings • ReusableNIST-Traceability (No Points) • CE CompliantBuilt-in LEDs display high and low alarmDesigned and Manufactured by OMEGA

Omega Engineering, Inc. Stamford, CT 06907 USA1-866-TC-OMEGAwww.omega.com

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test & measurement

Leading Technology and Value in InstrumentationRigol Technologies 2010 products include 5 families of scopes from 50 MHz and just $399 to 1 GHz models. Discover what you can do with modern instruments and platforms that pack in memory, features, and new capabilities.

50 MHz to 1 GHz Scopes20-350 MHz Generators2 and 3 GHz Spectrum Analyzers80 & 160 W power supplies5.5 & 6.5 digit DMMs • Special Lab Offers

Rigol Technologies USAOakwood Village, OH 44146877-4-RIGOL-1www.rigolna.com

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test & measurement


Sensor Solutions from AKMAKM is one of the world’s leading providers of magnetic sensors. Hall-Effect elements, IC’s, and input devices can be used in a wide variety of applications, replacing mechanical and optical solutions. Providing high reliability at a low price point, AKM’s sensors enable innovative products and applications.

Hall-Effect elements • Hall-Effect IC’sLinear Hall Effects • Current SensorsNon-Contact Rotation Angle SensorsSemiconductor Magneto-Resistive Elements

AKM SemiconductorSan Jose, CA [email protected]

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semiconductors

MOSFET Selection GuideCentral Semiconductor Corp. manufacturers a broad range of low power MOSFETs in a wide variety of surface mount packages including the new Tiny Leadless Modules (TLM™). Device specifications include:

20V to 60V0.1A to 1.0ARds(on)= 0.14Ω to 8.0ΩSingle and Dual devicesN-Channel and P-ChannelUltra miniature packages

Central Semiconductor Corp.Hauppauge, NY 11788631-435-1110www.centralsemi.com/arm6

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semiconductors

Monolithic Programmable Pulse Generators The 3D3600- and 3D7600-series of precision pulse generators offer a wide range of pulse width adjustment in space-saving SMD packages. Resolution options are 8, 12 or 22 bits, and supply voltage options are 3.3V or 5V. Pulse width resolution ranges from 250ps to 800us. Devices find use in a wide array of applications, including DC-DC converters, PWM encoding, motion control, automated test equipment and medical equipment.

Data Delay Devices, Inc.Clifton, NJ 07013973-773-2299www.datadelay.com

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semiconductors

Rectifiers, Bridges, Diodes, HV AssembliesFull lines of standard and many unique designs. Recoveries to 50 ns. Specialist in Manufacturing Rectifiers Since 1951. BRIDGES to 120 Amps, to 12,000 PRV. DIODES to 6 Amps., to 30,000 PRV. HV ASSEMBLIES to 25 Amps. to 200,000 PRV. RoHS Compliant, ISO9001 Certified, UL Recognized

Electronic Devices, [email protected]

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semiconductors

Battery HoldersFor computers, alarms, controls, instruments, toys, appliances.Featured products:

SMT button and cell holders Battery snaps Case hardware Computer-clock back-up holders Multi-cell holders with covers Auto cigarette lighter plugs

Memory Protection Devices631-249-0001www.batteryholders.com

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power sources

NEW Miniature, Low Cost Switching POL RegulatorsAvailable now from MicroPower Direct, the SR7820 and SRM7810 are miniature high efficiency, switching POL regulators. They offer many high performance features, including:

1A (SRM7810) or 2A (SR7820) OutputsLM78xx Replacement • Efficiency to 96%Short Circuit and Thermal ProtectionLow, Low Cost!!

MPD offers a variety of high performance, low cost power products. Check our website today!

MicroPower Direct, LLC781-344-8226sales@micropowerdirect.comwww.micropowerdirect.com

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power sources

DC/DC Converters AC/DC Power SuppliesReliable, quality, economical converters. Experienced technical support & customer service.DC/DC Products

1W to 40W • Fixed, 2:1, and 4:1 InputsHigh Isolation/Isolated/Non-Isolated Designs

AC/DC Products3W to 25W • Compact PCB StylesDIN Rail Units

Mornsun America978-567-9610sales@mornsunamerica.comwww.mornsunamerica.com

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power sources

PDuke DC/DC ConvertersPDuke’s quick selection guide:

Details more than 1000 standard models from 1 watt to 150 watt Input voltages from 2.4 to 280 VDC Output voltages from 0.75 to 78 VDC Bipolar and multiple outputs available High I/O isolation Provides engineers with the tools required to select high quality Power Mate DC/DC converters

PDukeWalnut, CA 91789909-598-5000www.pduke.com

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power sources

Lead Times 4 Weeks or Less!


Floyd Bell Piezo AlarmsThe industry’s largest selection of piezoelectric alarms. All products carry an impressive 2-year warranty. Available in many tone types, body styles, voltages and terminations. With an in-house wire-harness division, Floyd Bell is able to ensure that all alarms will be a perfect match to your application. ISO 9001:2000 registered company – all products made in USA.

Floyd Bell [email protected]

electromechanical

More Choices, More Options, More Value InduKey® Industrial Input Devices

Standard and compact footprints with multiple mounting options Mechanical or optical trackballs, touchpads, mouse buttons, joysticks or numeric keypadsStainless steel and vandal-proofFront-mounted, sealed USB-Port Protection to IP68/NEMA6P including anti-microbial Standard, semi- or fully custom keyboard designs

InduKey North America [email protected]

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electromechanical

Experience Mouser’s Time-to-Market Advantage!Get to market faster with the most rapid new product and technology introductions in the industry, multiple print catalogs, as well as daily updates to our website.

NEWEST Products • NEWEST TechnologiesSame-day Shipping NO Handling Charges • NO MinimumsOver A Million Products to Easily Buy Online

We make it easy to do business with Mouser!

Mouser Electronics, Inc.800 346-6873mouser.com

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distributor

Design With the BestYours free—Newark’s 2010 Catalog is the ultimate reference and buying guide for design engineers.

Broadest-in stock selection, great value 440+ top manufacturers—from components to test Detailed technical reference pages and product selector guides

Newark1-800-463-9275www.newark.com/catalog

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distributor

TI’s New Analog Switch GuideFind out about TI’s latest Analog Switch devices with the new Analog Switch Guide. The latest version includes:

Broad product portfolio Newest LAN, Network, PCI, USB and Video Switch devicesUpdated pinouts and packagingLatest application information

Download your copy today by visiting

Texas Instruments IncorporatedDallas, TX 75243www.ti.com/switches

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semiconductors

TI’s New I2C Guide Download the I²C Guide today! Find out the latest information on TI’s comprehensive I²C portfolio. This new guide includes updates on the latest I²C devices and features:

Product information I/O Expanders, multiplexers, switches, hubs, buffers and repeaters New low-voltage keypad and LED controllers & I/O expanders Packages

Texas Instruments IncorporatedDallas, TX 75243www.ti.com/i2c

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semiconductors

TI’s New Logic Guide Download the New Logic Guide Today! Find the latest logic devices that meet your design requirements in TI’s new Logic Guide. The new guide includes:

Packaging options New logic devices Updated functional cross reference tools

Texas Instruments IncorporatedDallas, TX 75243www.ti.com/logic

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semiconductors

TI’s New Little Logic GuideFind the latest Little Logic devices that meet your design requirements in TI’s new Little Logic Guide that includes:

New little logic package options (new uQFN and NanoStar™) Logic technology migration (new AUP family) Functionality tables for all TI Little Logic families

Texas Instruments IncorporatedDallas, TX 75243www.ti.com/littlelogic

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semiconductors


Universal Power Distribution SystemsAltech Corp’s new catalog features various innovative ways to distribute power in your panel.

Well known UL508 busbars in two sizes and ratings up to 200A/480V AC Introducing the UL489 recognized busbar for Altech’s line of Miniature Molded Case Circuit Breakers with an industry leading rating of 115A/480V AC New ADP distribution system utilizing 0.25” quick-connects

AltechCorp.®

Flemington, NJ 08822908-806-9400www.altechcorp.com

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electromechanical

Industrial EnclosuresAltech’s expanded line of TK Industrial Enclosures, with metric knockouts, is here. Now our entire line of industrial enclosures is in metric. Metric knockouts align with international standards making selection easier and more universal. Plus the PG standard is still available. All of Altech’s enclosures are internationally accepted and stand up to the harshest environments to help you protect your devices. They protect against dust, water and corrosion while enhancing the value of your product. AltechCorp.®


electromechanical

Terminal BlocksAltech offers a Terminal Block line with the most competitively priced blocks in the industry. Featuring DIN Rail, panel mount and printed circuit board terminal blocks. Screw and spring clamp models are available. This advanced line of wire termination products will increase your design options and help to get the job done more efficiently. Our line of blocks include feed-through (single, double or triple level), distribution, ground, fuse, disconnect, thermocouple, surge suppressor and indicator.

AltechCorp.®


electromechanical

DIN Rail Power SuppliesAltech DIN RAIL mountable power supplies have Universal AC input. They are suitable for industrial and automation applications.

UL508 ListedInstalled on DIN rail TS35/ 7.5 or 15Available from 10-960W Protections: Short circuit / Overload / Over-voltage / Over temperatureCooling by free air convectionWorldwide approvals3 year warranty

AltechCorp.®


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power sources

1st in - UL508 Manual Motor Controllers

RingTongue

BoxClamp

Electrical Rating: 0.3-60A: 480Y/277VAC0.3-25A: 1 pole - 42VDC; 2 Pole - 80VDC30-60A: 1 pole - 24VDC; 2 Pole - 60VDC

Short Circuit Withstand Rating:(UL/CSA - Ratings)0.3-60A (RC): 10kA with UL-listedRK5 back-up fuse or MCCB

Interrupting Capacity (VDE - Ratings):0.3-10A (RC): 10kA; 13-60A (RC): 5kAno branch circuit protection required

New Improved Design Maintains Same UL/CSA Approved Reliabilty.Altech UL508 Listed Manual Motor Controllers are Suitable as Motor Disconnect.

Standard Dual Connection TerminalUnique for industry standard box & ring tongue terminalReinforced HousingAdded ridges and new housing design improves overall product strengthModern Look with New ColorDark blue handle and terminal caps enhance appearance and match imprintMarking WindowLarge marking area withclear swivel window screen 908.806.9400 | altechcorp.com

MAX9938

ILOAD

VBATT =1.6V TO 28V

VDD = 3.3V

RSENSE

RS+

POUT

10kΩ

GND

RS-

µC

LOAD

Wide, 1.6V to 28V inputcommon-mode range is ideal for

portable and notebook applications

Low, 500µV (max) VOSenables use of small

sense resistor (50mΩ)

Ultra-low, 1µA (max)quiescent current over temperature

ADC

Great things comein small packages

Industry’s smallest current-sense amplifier

UCSP is a trademark of Maxim Integrated Products, Inc.

Tiny, 1mm x 1mm, 4-bump UCSPTM

is 50% smaller than the competition

Innovation Delivered is a trademark and Maxim is a registered trademark of Maxim Integrated Products, Inc. © 2010 Maxim Integrated Products, Inc. All rights reserved.

www.em.avnet.com/maxim

™DIRECTwww.maxim-ic.com/shop

For free samples or technical support, visit our website.

www.maxim-ic.com/MAX9938-info

TM

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