Engineering Manual Multicore MP218 Solder Paste - Henkel · Across the Board. Around the Globe....

Engineering Manual

Multicore MP218 Solder Paste

Across the Board. Around the Globe.Slide 2

Introduction Physical Properties Operating Parameters Test Data Troubleshooting Contact Details <Prev Next> Print

Introduction

About the electronics group of Henkel

About the electronics group ofHenkel

Product description

Features & benefits

Henkel is the world’s leading and most progressive provider of qualified, compatible material sets forsemiconductor packaging, board level assembly and advanced soldering solutions. Through its Hysol®,Loctite® and Multicore® brands, and its global customer support infrastructure, Henkel delivers world-classmaterials products, process expertise and total solutions across the board to preempt industry changes. Bypartnering with key industry leaders to pioneer added-value materials and processes, and by prioritizingenvironmental responsibility and training, Henkel is formulating the materials to enable tomorrow’s electronicindustry.



Introduction

Product description


Product description

Features & benefits

Henkel’s Multicore MP218 solder paste is a halide-free, no-clean, pin-testable solder paste. It was previouslysupplied to selected customers and independent test houses for evaluation purposes as developmentproduct XP44.



Introduction

Features & benefits


Product description

Features & benefits

Product attribute Process benefit

Outstanding humidity resistance – exhibits highcoalescence even after 24 hours exposure to 75%RH

Reduces process variation due to environmental factors, a particular advantage in hightemperature/humidity conditions

Colorless residues Improves speed and ease of post-reflow inspection

Soft, non-stick pin-testable residues Improves ease and reliability of in-circuit testing and reduces frequency with which testprobes require cleaning

Fine alloy particle size and optimized paste viscosity Suitable for fine pitch, high speed printing up to 150 mm/s (6 in/s)

Extended open time & tack-life Reduces solder paste wastage

Halide-free flux classification: ROL0 to ANSI/J-STD-004 High reliability of finished assembly without cleaning

High tack force Resists component movement during high speed placement, reducing the need for rework

Long printer abandon times Reduces solder paste wastage

Excellent solderability Suitable for use on a wide range of surface finishes including HASL, Ni/Au, immersionSn, immersion Ag and OSP Cu

Wide printing and reflow process windows Accommodates a wide range of printer settings and reflow profiles. Suitable for use in airand nitrogen



Physical properties

Technical data

Technical data

Datasheet MP 218Click icon



Operating parameters

Printing; Process window

MP218 solder paste was subjected to testing in Henkel laboratories to establish the print process window,using the following equipment:

Ambient conditions during testing were 24ºC/28%RH.

A solder paste bead of approximately 250 g was placed on the stencil and printed onto the boards at speedsranging from 20 to 200 mm/s and squeegee pressures ranging from 2-8 kg (approx. 4.4 - 17.6 lbs). Strokewas set at 230 mm (approx. 9"), separation speed at 10% and the print gap at zero (contact print).

During printing, paste roll, stencil wipe, aperture release and drop-off were assessed with the naked eye. Afterprinting, the solder paste deposits were examined using a stereomicroscope to assess the generalappearance and to note the incidence of any defects:

Printer DEK 260

Squeege Metal blade, 230 mm (approx. 9"), 60º

Stencil Laser cut, stainless steel, 125 µm (approx. 0.005") thickness

Boards Bare copper, no resist

Deposits examined 0.64 mm (approx. 0.025") QFP100 (0.38 mm (approx. 0.015") pads), 0.5 mm (approx. 0.020")TQFP100 (0.25 mm (approx. 0.010") pads), 0.4 mm (approx. 0.016") TQFP (0.2 mm (approx. 0.008") pads) and BGA225 (1.27 mm (approx. 0.050") pitch)

Inspection Stereomicroscope (X10-X30)

Topography Ideally the shape and volume of the paste deposit should reflect the stencil aperture geometry

Skipping Little or no evidence of printed paste on the pad due to non-filling of stencil apertures ornon-release of paste from apertures

Incomplete or insufficient fill Poor paste coverage on the pads due to paste not being released from the stencil or notfilling some of the printed area

Spikes Central area of the printed deposit raised, usually attributable to excessively low print pressure

Dog-ears Extremities of the paste deposit raised

Printing

Process window

Slump testing

Reflow

Process window & thermalprofiles

Humidity resistance & solderballing performance

Wetting




Printing; Process window

Printing

Process window

Slump testing

Reflow



Wetting

MP218 Print Process Window

Test board includes 0.6 mm (approx. 0.025"), 0.5 mm(approx. 0.020") and 0.4 mm (approx. 0.016") pitchcomponents.

Print speed plotted against squeegee pressure (kg/cm squeegee blade length).




Printing; Slump testing

Printing

Process window

Slump testing

Reflow



Wetting

In-house testingMP218 solder paste was subjected to slump testing in the Henkel laboratories in accordance with IPC TM-650-2.4.35, using a 0.2 mm (approx. 0.008") thick stencil, IPC slump pattern A-21. Results are below.





Independent testingSlump testing of MP218 to IPC ANSI/J-STD-005 was carried out independently by Universal Instruments SMTlaboratory. Samples were printed onto glass slides using both IPC A-20 and IPC A-21 stencils. The sampleswere inspected after 15 minutes exposure to 150ºC; results are shown below. MP218 met the requirement.

C ANSI/J-STD-005 slump test results(minimum spacing) after 15 minutes at 150ºC,using IPC-A-20 stencil pattern

IPC ANSI/J-STD-005 slump test results(minimum spacing) after 15 minutes at 150ºC,using IPC-A-21 stencil pattern

Printing

Process window

Slump testing

Reflow



Wetting





Printing

Process window

Slump testing

Reflow



Wetting

Independent testingSlump testing of MP218 to JIS-Z-3284 was carried out independently by Universal Instruments SMT laboratory.Samples were printed onto copper clad cards and inspected after 15 minutes exposure to 150ºC; results areshown below. MP218 met the requirements.

JIS-Z-3284 slump test results (minimumspacing) after 15 minutes at 150ºC, using JIS-specified stencil pattern




Reflow; Process window & thermal profiles

MP218 solder paste was subjected to testing in Henkel laboratories to establish the reflow process window,using the following equipment and settings:

Boards were printed and reflowed at varying times to peak process temperature, from 2-12 minutes. Bothlinear and soak-type reflow profiles were used, and the reflowed boards examined using a stereomicroscope.Reflow quality was assessed according to the appearance of the solder fillet and post-reflow residue, payingparticular attention to coalescence during reflow, solder surface appearance, solder balling, residue surfacequality and residue color.

Printer DEK 260

Print settings Print speed 75 mm/s (approx. 3"/s); pressure 5 kg (approx. 11 lbs)

Stencil Stainless steel laser-cut stencil, 150 µm (approx. 0.006") thickness

Boards Bare copper, no resist

Reflow oven Seho FDS6440

PCB areas examined 0.64 mm (approx. 0.025") QFP pads, 0.4 mm (approx. 0.016") TQFP pads, 0.3 mm (approx. 0.012") TQFP pads and 0.2 mm (approx. 0.008") BGA225 pads

Inspection Stereomicroscope (X10-X30)

Printing

Process window

Slump testing

Reflow



Wetting





Linear reflow profileThe convection reflow oven’s zone settings were maintained at the settings shown below; the peaktemperature and time to peak temperature were adjusted by varying the belt speed from 30 cm(approx. 12")/min to 200 cm (approx. 79")/min. MP218 gave excellent reflow performance at times topeak temperature 2 min 12 s and 9 min 24 s. Peak temperatures were 190ºC and 243ºC respectively(these should not be taken as guidelines for profiling; these results merely indicate the large reflowprocess window of MP218).

Oven Preheat 1 Preheat 2 Preheat 3 Preheat 4 Reflow 1 Reflow 2 Cooling 1 Cooling 2

Fan settings 80% 80% 80% 80% 80% 80% 80% 80%

Temp. settings 140 160 175 230 260 260 40 30

Printing

Process window

Slump testing

Reflow



Wetting





Printing

Process window

Slump testing

Reflow



Wetting

Soak reflow profileThe convection reflow oven’s zone settings were maintained at the settings shown below; the peaktemperature and time to peak temperature were adjusted by varying the belt speed from 30 cm (approx.12")/min to 200cm (approx. 79")/min. MP218 gave excellent reflow at times to peak temperature between2 min 30 s and 7 min 30 s. Peak temperatures were 184ºC and 210ºC respectively (these should not betaken as guidelines for profiling; these results merely indicate the large reflow process window of MP218).

Oven Preheat 1 Preheat 2 Preheat 3 Preheat 4 Reflow 1 Reflow 2 Cooling 1 Cooling 2

Fan settings 80% 80% 80% 80% 90% 90% 90% 90%

Temp. settings 170 170 160 160 230 230 60 40




Reflow; Humidity resistance & solder balling performance

In-house testingMP218 solder paste was subjected to testing in Henkel laboratories to establish its humidity resistance andsolder balling performance.

After printing, coupons were stored in a controlled temperature/humidity chamber. After each storage periodthe pasted coupons were reflowed using convection reflow oven (peak temperature 210ºC, time to peak 2 min30 s, time above liquidus 40 s). The coupons were photographed using a video microscope after reflow.These results indicate that Multicore MP218 has superior humidity resistance and solder balling performance.

Reflowed in 25°C/75%RH immediately after printing

Reflowed after 24 hours exposure to 25°C/75%RH

Printing

Process window

Slump testing

Reflow



Wetting





Printing

Process window

Slump testing

Reflow



Wetting

Independent testingSolder ball testing was carried out independently by Universal Instruments Corp., conducted in accordancewith IPC ANSI/J-STD-005 and JIS-Z-3284 standards.

The IPC solder ball tests showed good results for all three test conditions.

IPC solder balling test, reflowed after 1 hour exposure to 25°C/75% RH

IPC solder balling test, reflowed after 2 hours exposure to 25°C/75% RH

IPC solder balling test, reflowed after 24 hours exposure to 25°C/75% RH





Printing

Process window

Slump testing

Reflow



Wetting

Independent testingThe JIS solder ball tests showed good results from the one hour test, acceptable results from the two hourtest and marginal results for the 24 hour test.

The major difference in results between the IPC test and JIS test occurred at the 24 hour test stage - thesolder pot heating method of the JIS test stipulates a faster heating rate, which may explain the difference.

JIS solder balling test, reflowed after 1 hour exposure to 25°C/75% RH

JIS solder balling test, reflowed after 2 hours exposure to 25°C/75% RH

JIS solder balling test, reflowed after 24 hours exposure to 25°C/75% RH




Reflow; Wetting

Printing

Process window

Slump testing

Reflow



Wetting

MP218’s wetting behavior on different surface finishes is shown below.

Linear profile, previously reflowed once Soak profile, previously reflowed once

Offset printing on bare copper board finish – linear reflow profile Offset printing on bare copper board finish – soak reflow profile

Pre-reflowed bare copper boards – linear and soak profiles Pre-reflowed bare copper boards – linear and soak profiles

NitrogenAir



Test data

J-STD-004 reliability test results


Telcordia GR-78-COREreliability test results

Reliability testing to JIS-Z-3284

Pin-testability assessment

Tack test results

Voiding test results

MP218 solder paste was tested according to J-STD-004. Results for the various tests are summarized below.

Surface Insulation Resistance (SIR) to J-STD-004, test method IPC-TM-650 2.6.3.3Five boards of type IPC B-24 test pattern were used for this test, separated into two groups. Group A boards(two off) were left unfluxed and unsoldered as controls, while Group B boards (three off) were printed withMP218 solder paste and reflowed. The boards were maintained at 85°C/85%RH and readings taken after 24,96 and 168 hours of exposure to the test conditions. MP218 solder paste meets this requirement.

Elapsed time SIR (Ω), unfluxed control SIR (Ω), Sn63MP218AGS90

Reading after 24 hours at 85°C/85%RH 3.0x1010 1.5x108





Test data






Tack test results


Copper Mirror test to J-STD-004A copper mirror was prepared and a sample of MP218L0 solder paste stencilled directly onto its surface. Thecopper mirror was maintained at 23±2°C/50±5%RH for 24 hours before removal of the solder paste andinspection of the mirror for removal of the copper film by the flux. No removal of the copper film wasobserved, therefore MP218L0 solder paste is classified as J-STD flux type L.



Test data






Tack test results


Copper Corrosion test to J-STD-004The tests were carried out using three test coupons of 99% pure copper of dimensions 50 mm x 50 mm (2" x2") and thickness 0.5 mm (0.02"), with a circular depression created in the centre of each. MP218 solder pastewas placed in each depression and reflowed. The coupons were maintained at 40°C/93±2%RH for 240 hoursthen examined at 30x magnification for evidence of corrosion products. No discoloration of the fluxresidues was observed and on removal of the residues, no pitting of the underlying copper wasobserved. This result is consistent with J-STD flux classification L.



Test data

Telcordia (formerly Bellcore) GR-78-CORE reliability test results





Tack test results


MP218 was tested in accordance with Telcordia GR-78-CORE reliability specification.

Surface Insulation Resistance TestThe tests were carried out using six type IPC-B-25 test combs with a spacing of 0.3 mm (approx. 0.0125").Three boards were left unfluxed and unsoldered as controls and three boards were soldered with MP218solder paste. The test combs were left to stabilize at 35°C/85%RH for 24 hours and the insulation resistancemeasured. After the conditioning period of 96 hours the insulation resistance was measured again. Afterelectrical measurement the test pieces were visually examined for any discoloration or electromigration. Nodiscoloration or electromigration was observed on any of the test combs. The average insulation resistanceshould be greater than 1.00x1010

Ω; MP218 solder paste meets this requirement.






Test data

Telcordia (formerly Bellcore) GR-78-CORE reliability test results





Tack test results


Electromigration testThe tests were carried out using six type IPC-B-25 test combs with a spacing of 0.3 mm (approx. 0.0125").Three were left unfluxed and unsoldered as controls and three were soldered with MP218 solder paste. Thetest combs were left to stabilize at 65°C/85%RH for 96 hours and the insulation resistance measured. Afterthe conditioning period of 500 hours the insulation resistance was measured again. The average insulationresistance should not degrade by more than a factor of ten after storage at 65°C/85%RH for 500 hours;MP218 solder paste meets this requirement.

After completion of the electromigration test, the test samples were examined at 10x magnification forevidence of electromigration reducing conductor spacing by more than 20%. Any discoloration of the patternswas also noted. No discoloration or evidence of electromigration was observed on any of the testcombs.






Test data






Tack test results


MP218 solder paste was tested according to JIS-Z-3284. Results for the various tests are summarised below.

Surface Insulation Resistance TestTemperature/humidity: 85ºC/85%RHTest pattern: IPC-B bare copper finish test combsSpacing: 0.3 mm (approx. 0.0125"), conductor overlap 15.75 mm (approx. 0.62")


Initial reading, ambient conditions 2.95x1011 2.23x1011






Test data






Tack test results


Corrosion Testing to JIS-Z-3284The tests were carried out using six test coupons of 99% pure copper of dimensions 5 cm x 5 cm (approx. 2"x 2") and thickness 0.5 mm (approx. 0.02"). The edges of the coupons were bent at right angles to form threebase/cover pairs (plates A and B as required by JIS-Z-3284). A deposit of MP218 solder paste was stencilledonto two of the base coupons and the third kept as a control. After reflow, the coupons were maintained at40°C/93±2%RH for 72 hours then examined for evidence of corrosion using a stereomicroscope. Noevidence of corrosion was observed.



Test data






Tack test results


Electromigration Testing to JIS-Z-3284The tests were carried out using six type IPC-B bare copper finish test combs with a spacing of 0.3 mm(approx. 0.0125") and conductor overlap of 15.75 mm (approx. 0.62"). After reflow, a bias of 50V was appliedacross the combs, which were maintained at 85°C/85%RH for 1,000 hours then visually inspected fordendritic growth.

No electromigration after 100 hours at 85º/85%RH with 50v bias.

Full print test method and results are available upon request from Henkel.

MP218 coupon after JIS-Z-3284electromigration test

Control coupon after JIS-Z-3284electromigration test



Test data






Tack test results


MP218 solder paste and a competitor’s premium material chosen as benchmark were subjected to testing inHenkel laboratories to compare their pin-testability, using single and double reflow cycles and three differentreflow profiles. A test board, MP218 solder paste and a crown-pattern test probe were used in the tests. Pin-testability was assessed within one hour of reflow, once the boards had cooled to room temperature.

ResultsAfter 840 simulated pin tests, dwell time 0.05 s:

Profile Single reflow % good tests Double reflow % good tests

Sn63MP218AGS90 Competitor’s paste Sn63MP218AGS90 Competitor’s paste

1 235ºC 214 s 99.8 99.8 100.0 99.4

2 245ºC 264 s 99.3 98.8 98.8 95.0

3 241ºC 351 s 95.2 87.6 98.3 95.2



Test data






Tack test results


After 840 simulated pin tests, dwell time 0.05 s:

MP218 Competitor’s solder pasteMP218

Probe appearance after single reflow tests: Probe appearance after double reflow tests:

Pro

file

3P

rofil

e 2

Pro

file

1

Pro

file

3P

rofil

e 2

Pro

file

1

Competitor’s solder paste



Test data

Tack test results

MP218 solder paste tack testing was carried out independently by Universal Instruments Corp., conducted inaccordance with IPC ANSI/J-STD-005 and JIS-Z-3284 standards.

The testing for each standard was conducted at time zero (no exposure time), 1, 4, and 7 hours. A minimumof six tests was performed for each time duration, for both the IPC and JIS standard tests.

The 1-, 4-, & 7-hour samples were aged at 25°C/50%RH. The average tack force for both the IPC and JIStests at each of the test conditions is shown below:

IPC & JIS Tack Test Results





Tack test results




Test data






Tack test results


MP218 solder paste voiding tests were carried out independently by Universal Instruments Corp.

A total of four panels were assembled for this project. The panels were printed, populated with componentsand reflowed using two different reflow profiles:



Test data






Tack test results


The following two images show the X-ray results from CSP and BGA components soldered on the panels:

X-ray analysis of the BGA and CSP revealed limited solder voiding but at an acceptable level based on the IPC-7095 specification. No major difference was found between the boards reflowed using the two different profiles.

X-ray image of 0.75 mm pitch CSP using Profile 1 X-ray image of 0.75 mm pitch CSP using Profile 2

X-ray image of BGA using Profile 1 X-ray image of BGA using Profile 2



Troubleshooting

Printing

Printing

Reflow

For the purposes of this solder paste printing troubleshooting guide, it is assumed that the correct thickness ofstencil is used and that gasketing, stencil cleaning, component solderability, board support and handling aresatisfactory.

Paste bleeds under stencil, leadingto bridging

Paste skips – solder paste doesnot release completely from stencil

Paste deposits are irregular Unsatisfactory aperture filling Paste deposit excessive, leading tobridging

Description

Print pressure Separation speed Separation speed; increase printspeed to lower viscosity

Squeegee speed and pressuresettings

Squeegee pressure may need tobe increased; separation speed

Poor print definition leads to ‘dog-ears’

Paste scooping Overprinting – paste depositexceeds pad area

Paste bridges or smears; pooredge definition

Print is misaligned

Separation speed; increase print speed

Reduce squeegee pressure Reduce print pressure or adjustprint speed

Reduce print pressure Stencil registration/printeralignment

Check/adjust



Troubleshooting

Reflow

Printing

Reflow

For the purposes of this solder paste reflow troubleshooting guide, it is assumed that component and boardstorage and handling are satisfactory and that the reflow profile is suited to the specification limits of thecomponents and substrate.

Description Check/adjust

Solder joint cracks during cooling Tombstoning/Manhattaneffect/drawbridging

Reflow incomplete Poor solderability

Cooling rate Adjust preheat to balancetemperature at both component

terminations

Reflow profile: balance timeabove liquidus with excessiveheat causing flux exhaustion

Reflow profile – may need toreduce preheat

Mid-chip beading Paste bridging Uncoalesced solder

Check paste life and stencilgeometry alignment, gasketting

and cleanliness

Check the under stencilcleanliness, print preassure,

gasketting & the board

Check reflow profile to ensuresufficient time above reflow is

provided for



Contact details

15350 Barranca Parkway,Irvine, CA 92618USATel: +1 949 739 2500

Kelsey House, Wood Lane EndHemel HempsteadHertfordshire, HP2 4RQUKTel: +44 1442 233233

Lot 62049 Jalan PortlandTasek Industrial Estate, 31400Ipoh, PerahMalaysiaTel: +605 547 6811

Henkel Americas Henkel Europe Henkel Asia

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Engineering Manual Multicore MP218 Solder Paste - Henkel · Across the Board. Around the Globe....

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Transcript of Engineering Manual Multicore MP218 Solder Paste - Henkel · Across the Board. Around the Globe....