Engineering Manual Multicore LF318 Solder Paste€™s Multicore LF318 solder paste is a...

Engineering Manual

Multicore® LF318 Solder Paste

Across the Board. Around the Globe.Slide 2

Introduction Physical Properties Operating Parameters Test Data Troubleshooting Contact Details <Prev Next> Print

Introduction

About the electronics group of Henkel

About the electronics group ofHenkel

Product description

Features & benefits

Henkel is the world’s leading and most progressive provider of qualified, compatible material sets forsemiconductor packaging, board level assembly and advanced soldering solutions. Through its Hysol®, Loctite®

and Multicore® brands, and its global customer support infrastructure, Henkel delivers world-class materialsproducts, process expertise and total solutions across the board to preempt industry changes. By partneringwith key industry leaders to pioneer added-value materials and processes, and by prioritizing environmentalresponsibility and training, Henkel is formulating the materials to enable tomorrow’s electronic industry.



Introduction

Product description


Product description

Features & benefits

Henkel’s Multicore LF318 solder paste is a halide-free, no-clean, pin-testable solder paste. It was previouslysupplied to selected customers and independent test houses for evaluation purposes as development product XP48.



Introduction

Features & benefits


Product description

Features & benefits

Product attribute Process benefit

Outstanding humidity resistance – exhibits highcoalescence even after 72 hrs @ 27°C/80%RH

Reduces process variation due to environmental factors, a particular advantage in hightemperature/humidity conditions

Colorless residues Improves speed and ease of post-reflow inspection

Soft, non-stick pin-testable residues Improves ease and reliability of in-circuit testing and reduces frequency with which testprobes require cleaning

Fine alloy particle size and optimized paste viscosity Suitable for fine pitch, high speed printing up to 150 mm/s (6 in./s)

Extended open time & tack-life Reduces solder paste wastage

Halide-free flux classification: ROL0 to ANSI/J-STD-004 High reliability of finished assembly without cleaning

High tack force Resists component movement during high speed placement, reducing the need for rework

Long printer abandon times Reduces solder paste wastage

Excellent solderability Suitable for use on a wide range of surface finishes including HASL, Ni/Au, immersionSn, immersion Ag and OSP Cu

Wide printing and reflow process windows Accommodates a wide range of printer settings and reflow profiles. Suitable for use in airand nitrogen

Low voiding Reduced risk of bridging on small pitch BGAs or CSPs. Reduced risk of decreased jointreliability and/or outgassing.

Low slump Reduced bridging



Physical properties

Technical data

Technical data

Datasheet LF318Click icon



Operating parameters

Printing: Process window

LF318 solder paste was subjected to testing in Henkel laboratories to establish the print process window, usingthe following equipment:

Ambient conditions during testing were 24ºC/28%RH.

A solder paste bead of approximately 250 g was placed on the stencil and printed onto the boards at speedsranging from 20 to 200 mm/s and squeege pressures ranging from 2–8 kg (approx. 4.4 – 17.6 lbs). Stroke wasset at 230 mm (approx. 9"), separation speed at 10% and the print gap at zero (contact print).

During printing, paste roll, stencil wipe, aperture release and drop-off were assessed with the naked eye. Afterprinting, the solder paste deposits were examined using a stereomicroscope to assess the general appearanceand to note the incidence of any defects:

Printer DEK 260

Squeege Metal blade, 230 mm (approx. 9"), 60º

Stencil Laser cut, stainless steel, 125 µm (approx. 0.005") thickness

Boards Bare copper, no resist

Deposits examined 0.64 mm (approx. 0.025") QFP100 (0.38 mm (approx. 0.015") pads), 0.5 mm (approx. 0.020")TQFP100 (0.25 mm (approx. 0.010") pads), 0.4 mm (approx. 0.016") TQFP (0.2 mm (approx. 0.008") pads) and BGA225 (1.27 mm (approx. 0.050") pitch)

Inspection Stereomicroscope (X10-X30)

Topography Ideally the shape and volume of the paste deposit should reflect the stencil aperture geometry

Skipping Little or no evidence of printed paste on the pad due to non-filling of stencil apertures or non-release of paste from apertures

Incomplete or insufficient fill Poor paste coverage on the pads due to paste not being released from the stencil or notfilling some of the printed area

Spikes Central area of the printed deposit raised, usually attributable to excessively low print pressure

Dog-ears Extremities of the paste deposit raised

Printing

Process window

Slump testing

Abandon time

Volume consistency

Reflow

Process window & thermalprofiles

Humidity resistance & solderballing performance

Wetting

Voiding

Tack

Tack performance




Printing: Process window

LF318 Print Process Window

Test board includes 0.6 mm (approx. 0.025"), 0.5 mm(approx. 0.020") and 0.4 mm (approx. 0.016") pitchcomponents.

Print speed plotted against squeegee pressure (kg/cm squeegee blade length).Printing

Process window

Slump testing

Abandon time

Volume consistency

Reflow



Wetting

Voiding

Tack

Tack performance




Printing: Slump testing

In-house testingLF318 solder paste was subjected to slump testing in the Henkel laboratories in accordance with IPC™-650-2.4.35, using a 0.2 mm (approx. 0.008") thick stencil, IPC slump pattern A-21. Results are below.

Printing

Process window

Slump testing

Abandon time

Volume consistency

Reflow



Wetting

Voiding

Tack

Tack performance





Details IPC ANSI/J-STD-005 Slump Test

15 min RT15 min 150ºC1 min 150ºC

Printing

Process window

Slump testing

Abandon time

Volume consistency

Reflow



Wetting

Voiding

Tack

Tack performance




Details JIS-Z-3284 Slump TestSummary of slump data

96SCLF318AGS88.5VBatch No. CP4I0623

Room Temperature, 60 minutes 150°C for 1 minute

3.0 x 1.5 mm apertures 0.2 mm 0.3 mm

3.0 x 0.7 mm apertures 0.2 mm 0.2 mm

1 min 150ºC 15 min 150ºC 15 min RT

Printing

Process window

Slump testing

Abandon time

Volume consistency

Reflow



Wetting

Voiding

Tack

Tack performance



Response to 1 hour Pause/Procedure

4 knead prints 5 prints 5 prints 1 print VolumeMeasurement

1 hour abandon time

Understencilclean

Understencilclean

Printing

Process window

Slump testing

Abandon time

Volume consistency

Reflow



Wetting

Voiding

Tack

Tack performance

Printing: Abandon time




Abandon time/Results Printing

Process window

Slump testing

Abandon time

Volume consistency

Reflow



Wetting

Voiding

Tack

Tack performance

AGS: 20-45 µm powderADP: 15-38 µm powder

Printing: Abandon time




Equipment used: DEK Infinity Cyberoptics SE300; deposits examined 0.4 mm QFP, 0.4 mm & 0.5 mm CSP Solder paste: 96SCLF318AGS88.5V, batch no. CP5A008 Settings: 50 mm/s, 6 kg, 250 mm/60° squeegee, 100 mm thick stencil

Deposits examined:

Procedure

Aperture Shape Dimensions No. of deposits examined per board

0.4 mm CSP Round Ø245 µm 964

0.5 mm CSP Square 270 µm x 270 µm 337

0.4 mm QFP Rectangular 830 µm x 220 µm 97

4 knead prints 5 prints 5 prints VolumeMeasurement

Understencilclean

Understencilclean

Printing

Process window

Slump testing

Abandon time

Volume consistency

Reflow



Wetting

Voiding

Tack

Tack performance

Printing: Volume consistency




Printing

Process window

Slump testing

Abandon time

Volume consistency

Reflow



Wetting

Voiding

Tack

Tack performance

Printing: Volume consistency






Reflow: Process window & thermal profiles

LF318 solder paste was subjected to testing in Henkel laboratories to establish the reflow process window,using the following equipment and settings:

Boards were printed and reflowed at varying times to peak process temperature, from 2–12 minutes. Bothlinear and soak-type reflow profiles were used, and the reflowed boards examined using a stereomicroscope.Reflow quality was assessed according to the appearance of the solder fillet and post-reflow residue, payingparticular attention to coalescence during reflow, solder surface appearance, solder balling, residue surfacequality and residue color.

Printer DEK 260

Print settings Print speed 75 mm/s (approx. 2"/s); pressure 8 kg (approx. 17.5 lbs)

Stencil Stainless steel laser-cut stencil, 125 µm (approx. 0.005") thickness

Boards Bare copper, no resist

Reflow oven Seho FDS6440

PCB areas examined 0.6 mm (approx. 0.025") QFP pads, 0.4 mm (approx. 0.016") TQFP pads, 0.3 mm (approx. 0.012") TQFP pads and 0.2 mm (approx. 0.008") BGA225 pads

Inspection Stereomicroscope (X10-X30)

Printing

Process window

Slump testing

Abandon time

Volume consistency

Reflow



Wetting

Voiding

Tack

Tack performance





Linear Reflow ProfileThe convection oven’s zone settings were maintained at the settings shown below; the peaktemperature & time to peak temperature were adjusted by varying the belt speed from 30 cm/min(12”/min) to 130 cm/min (51”/min).

Range of acceptable reflow conditions:T>217°C: 11.5 – 171 sPeak temperature: 223 – 266°CBelt speed: 30 – 120 cm/min(These should not be taken as guidelines for profiling – they merely indicate that LF318 has a large process window when assessed underlaboratory conditions.)

Printing

Process window

Slump testing

Abandon time

Volume consistency

Reflow



Wetting

Voiding

Tack

Tack performance




Soak Reflow ProfileThe convection oven’s zone settings were maintained at the settings shown below; the peak temperature & timeto peak temperature were adjusted by varying the belt speed from 30 cm/min (12”/min) to 130 cm/min (51”/min).

Printing

Process window

Slump testing

Abandon time

Volume consistency

Reflow



Wetting

Voiding

Tack

Tack performance


Range of acceptable reflow conditions:T>217°C: 11.5 – 171 sPeak temperature: 223 – 266°CBelt speed: 30 – 120 cm/min(These should not be taken as guidelines for profiling – they merely indicate that LF318 has a large process window when assessed underlaboratory conditions.)


Reflow after 72 hrs, 27°C/80%RH



Initial

LF318: Humidity resistance

Note: J-STD condition 25ºC, 50%RH initial and after 4 h

Printing

Process window

Slump testing

Abandon time

Volume consistency

Reflow



Wetting

Voiding

Tack

Tack performance

Reflow: Humidity resistance & solder balling performance



LF318 was tested to establish humidity resistance and solder balling performance. After printing, coupons werestored in a temperature/humidity controlled chamber. After the appropriate storage period they were removed fromthe chamber and reflowed, in air, using a convection reflow oven. Profile peak temperature was 242°C, time topeak 5 min 15 s, time above liquidus (217°C) was 80 s.



Reflow: Wetting

Wetting behaviour of LF318 according to J-STD-005.

This test is carried out to determine the ability of a solder paste to wet an oxidised copper surface & toqualitatively examine the amount of solder spatter of the paste during reflow.

LF318 was printed onto 4 copper test pieces (each 76x25x0.8 mm) using a 0.2 mm thick stencil with roundapertures 6.5mm in diameter. Two test pieces were reflowed immediately after printing on a solder bath at242°C. The reflowed solder was then examined at 10X magnification to establish if the copper was uniformlywetted with no evidence of non-wetting, de-wetting or spatter around the deposit.The test was repeated on theremaining test coupons after 4 hours exposure to 25°C/50%RH. LF318 passes this test.

Reflowed after 4 hours exposure to25ºC/50%RH

Reflowed within 15 minutes of printing

Printing

Process window

Slump testing

Abandon time

Volume consistency

Reflow



Wetting

Voiding

Tack

Tack performance



Immersion TinAfter reflow

Immersion TinAfter print

Bare CopperAfter reflow

Bare CopperAfter print

SOT23 Pads: Offset print

Gold over nickelAfter reflow

Gold over nickelAfter print

Immersion SilverAfter reflow

Immersion SilverAfter print

Printing

Process window

Slump testing

Abandon time

Volume consistency

Reflow



Wetting

Voiding

Tack

Tack performance



Reflow: Wetting


Linear Profile (Worst case scenario)

Void % area = 0.49% over132 ballsVoid % area in ballscontaining voids = 3.38%Total of 16 Voids1 Void > 10% ball area2 Voids 10% - 5%13 Voids < 5%

Device: TBGA132 SnPb ballsPCB: Cu pads @ 0.5 mm pitchStencil thickness = 120 µm

Printing

Process window

Slump testing

Abandon time

Volume consistency

Reflow



Wetting

Voiding

Tack

Tack performance



Reflow: Voiding


Tack testing according to J-STD-005

Tack testing should be continued until tack reaches 80% of the initial tack force is reached.However, as can be seen, even after 72 hours LF318 tack remained high. Testing was notcontinued after this time.

Printing

Process window

Slump testing

Abandon time

Volume consistency

Reflow



Wetting

Voiding

Tack

Tack performance

Tack perfomanceOperating parameters



Pin testability assessment

J-STD-004 reliability testresults

JIS standards testing

GR-CORE-78

Test data

Pin testability assessmentIntroduction Physical Properties Operating Parameters Test Data Troubleshooting Contact Details <Prev Next> Print

Pin testability in Air/N2 Pin test done on copper laminate; electrical continuity during testing monitored using an electronic counter Boards were reflowed using profile below, 3 in air & 3 in N2 environment Test done using 4-pin crown point probe (Croda PA4QPS-040) 840 test points per PCB


Test data





GR-CORE-78

Pin-testability: Air reflow

Board No.(Reflowed in air)

% contacts using crown probe on 840 test pads Result

1 100% Pass

2 100% Pass

3 100% Pass

Probe appearance after 840 hits



Test data





GR-CORE-78

Pin-testability: N2 reflow

Board No.(Reflowed in N2)

% contacts using crown probe on 840 test pads Result

1 100% Pass

2 100% Pass

3 100% Pass

Probe appearance after 840 hits; onereflow cycle



Pin testability assessmentTest data





GR-CORE-78

Pin testability after multiple reflow cycles Some copper laminate test boards with 840 pads made with 96SCLF318AGS88.5V were reflowed in air a

number of times to simulated double-sided boards with selective soldering. The profile used can be seen below. Pin testability was then assessed after reflow using a 4-pin crown point probe (Croda PA4QPS-040);

electrical continuity during testing was monitored using an electronic counter





GR-CORE-78


Pin testability assessmentTest data

Pin-testability: Air reflow3 test boards per conditionProbe appearance after 840 hits; two reflow cycles

Reflowedtwice

% contacts using crown probe on 840 test pads

Result

1 100% Pass

2 100% Pass

3 100% Pass

Probe appearance after 840 hits Probe appearance after 840 hits

Reflowedthree times

% contacts using crownprobe on 840 test pads

Result

1 100% Pass

2 100% Pass

3 100% Pass

Pin-testability: Air reflow3 test boards per conditionProbe appearance after 840 hits; three reflow cycles





GR-CORE-78

J-STD-004 Reliability test resultsTest data


J-STD004: copper mirror IPC-TM-650, 2.3.32 Flux induced corrosion (copper mirror) No breakthrough of copper = flux classification ‘L’

LF318 Copper Mirror- no breakthrough Control Copper Mirror – no breakthrough





GR-CORE-78

J-STD-004Test data


J-STD004: halide test IPC-TM-650, 2.3.33 Silver chromate paper method No discoloration of silver chromate paper = flux activity ‘0’

LF318 Control





GR-CORE-78

J-STD-004Test data


J-STD004: flouride test IPC-TM-650, 2.3.35.1 No change in colour from purple to yellow confirms absence of flourides Flux activity type ‘0’

Zirconium-alazarin purple lake With LF318 added





GR-CORE-78

J-STD-004Test data


J-STD004: chlorides & bromides IPC-TM-650, 2.3.35 Chloride & bromide concentrations Halide content <0.005%

J-STD004: flux solids IPC-TM-650, 2.3.34 Flux solids (non-volatile content) determination Approximately 2 g of flux medium was accurately weighed into a clean metal dish which was then placed

into an air circulating oven at 145°C for 2 hours. The dish was allowed to cool and re-weighed. The solids content was calculated using the following equation:Solids content = (final mass of flux medium/initial mass of flux medium) x 100%

Solids content was found to be 69%

J-STD004: flux corrosion IPC-TM-650, 2.6.15 No evidence of corrosion = type ‘L’ flux classification Test done in duplicate: 240 hrs (10 days) humid storage at 40°C/93±2%RH – no evidence of corrosion products

LF318 – coupon 1 LF318 – coupon 2





GR-CORE-78

J-STD-004Test data


J-STD004: SIR IPC-TM-650, 2.6.3.3 Moisture & surface insulation resistance Passmark: 1 x 108 Ω

24 hrs at 85°C, 85%RH, 50V bias. 96 hrs at 85°C, 85%RH, 50V bias. 168 hrs at 85°C, 85%RH,50V bias.

Control (ΩΩ) 5.89 x 109 3.60 x 109 2.85 x 109

96SCLF318AGS88.5V (ΩΩ) 3.13 x 109 1.03 x 109 1.06 x 109

Passmark (ΩΩ) 1.00 x 108 1.00 x 108 1.00 x 108





GR-CORE-78

JIS standards testingTest data


JIS-Z-3284: SIR

JIS-Z-3284: electromigration 85°C/85%RH, 50V bias, 1000 hours duration No dendrites observed

Pass: 1 x 108 ΩΩ85°C, 85%RH

Initial 24 hours 96 hours 168 hours

LF318 (ΩΩ)) 7.44 x 1011 1.73 x 109 1.75 x 109 1.96 x 109

Unfluxed control (ΩΩ)) 8.94 x 1011 1.51 x 109 1.26 x 109 1.27 x 109





GR-CORE-78

GR-CORE-78Test data


GR-CORE-78: SIR

35°C/85%RH, 50V bias 24 hours 96 hours

LF318 (ΩΩ)) 1.489 x 1011 1.84 x 1011

Controls (ΩΩ)) 1.804 x 1011 1.47 x 1011





GR-CORE-78

GR-CORE-78Test data


GR-CORE-78: electromigration

65°C/85%RH, 10V bias 96 hours 500 hours Dendrites

LF318 (ΩΩ)) 3.73 x 1010 3.47 x 1010 None

Controls (ΩΩ)) 2.59 x 1010 5.24 x 1010 None



Troubleshooting

Printing

Printing

Reflow

For the purposes of this solder paste printing troubleshooting guide, it is assumed that the correct thickness of stencilis used and that gasketing, stencil cleaning, component solderability, board support and handling are satisfactory.

Paste bleeds under stencil, leadingto bridging

Paste skips – solder paste does notrelease completely from stencil

Paste deposits are irregular Unsatisfactory aperture filling Paste deposit excessive, leading tobridging

Description

Print pressure Separation speed Separation speed; increase printspeed to lower viscosity

Squeegee speed and pressuresettings

Squeegee pressure may need tobe increased; separation speed

Poor print definition leads to ‘dog-ears’

Paste scooping Overprinting – paste depositexceeds pad area

Paste bridges or smears; pooredge definition

Print is misaligned

Separation speed; increase print speed

Reduce squeegee pressure Reduce print pressure or adjustprint speed

Reduce print pressure Stencil registration/printeralignment

Check/adjust



Troubleshooting

Reflow

Printing

Reflow

For the purposes of this solder paste reflow troubleshooting guide, it is assumed that component and boardstorage and handling are satisfactory and that the reflow profile is suited to the specification limits of thecomponents and substrate.

Description Check/adjust

Solder joint cracks during cooling Tombstoning/Manhattaneffect/drawbridging

Reflow incomplete Poor solderability

Mid-chip beading Paste bridging Uncoalesced solder

Check paste life and stencilgeometry alignment, gasketting

and cleanliness

Check the under stencilcleanliness, print preassure,

gasketting & the board

Check reflow profile to ensuresufficient time above reflow is

provided for

Cooling rate Adjust preheat to balance temperatureat both component terminationsReflow profile: balance time

Above liquidus with excessiveheat causing flux exhaustionReflow profile – may need to

reduce preheat



Contact details

15350 Barranca Parkway,Irvine, CA 92618USATel: +1 949 7839 [email protected]

Technologies House, Wood Lane EndHemel HempsteadHertfordshire, HP2 4RQUKTel: +44 1442 278000

No. 90 Zhujiang RoadYantai Development ZoneShandong China 264006Tel: +86 535 6399820

Henkel Americas Henkel Europe Henkel Asia

electronics.henkel.com

Contact

Technical Data Sheet LF318 Solder Paste

July 2005

NOT FOR PRODUCT SPECIFICATIONS THE TECHNICAL INFORMATION CONTAINED HEREIN IS INTENDED FOR REFERENCE ONLY. PLEASE CONTACT HENKEL

TECHNOLOGIES TECHNICAL SERVICE FOR ASSISTANCE AND RECOMMENDATIONS ON SPECIFICATIONS FOR THIS PRODUCT.

PIN-TESTABLE LEAD-FREE SOLDER PASTE PRODUCT DESCRIPTION Multicore™ LF318 solder paste is a halide-free, no clean, pin testable Pb-free solder paste, which has excellent humidity resistance and a broad process window, both for reflow and printing. LF318 solder paste offers a high tack force to resist component movement during high speed placement, long printer abandon times and excellent solderability over a wide range of reflow profiles in air and nitrogen and across a wide range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP Copper. FEATURES AND BENEFITS • Outstanding humidity resistance – gives excellent

coalescence even after 72 hours exposure to 27ºC/80% RH, thus reducing process variation due to environmental factors

• Colourless residues for easy post-reflow inspection • Soft non-stick pin testable residues allow easy in-circuit

testing • Suitable for fine pitch, high speed printing up to 150mm/s

(6”/s) • Extended open time & tack-life leading to low wastage. • Halide free flux classification: ROL0 to ANSI/J-STD-004 TYPICAL PROPERTIES Based upon type 3 powder; other sizes also available

Properties LF318 Alloys 96SC, 97SC

Powder Particle Size, µm 20-45 Multicore Powder Size

Coding AGS

Metal Loading (% weight) 88.5

Slump, J-STD-005, mm(4) RT (15 minutes)

0.33 x 2.03 mm pads 0.63 x 2.03 mm pads 150oC (15 minutes)

0.33 x 2.03 mm pads 0.63 x 2.03 mm pads

IPC A21 Pattern

0.06 0.33

0.25 0.41

Viscosity measured at

25°C (Typical) Brookfield, cP(1)

Malcom 10rpm, P(2)

Thixotropic Index (Ti)(3)

765,000 1961 0.54

Tack(5) Initial tack force, gmm-2 Useful open time, hours

2.0 >24

(1) Measured at 25°C, TF spindle at 5rpm after 2 minutes (2) Measured at 25°C, and a shear rate of 6s-1

(3) TI = log (viscosity at 1.8s-1/Viscosity at18s-1) (4) Slump data are expressed as the minimum spacing between pads of the size shown that does not allow bridging (5) Tack data are derived from comparative laboratory tests and do not necessarily relate directly to a particular user’s conditions

Solder powder: Careful control of the atomisation process for production of solder powders for LF318 solder pastes ensures that the solder powder is produced to a quality level that exceeds IPC/J-STD006 & EN29453 requirements for sphericity, size distribution, impurities and oxide levels. Minimum order requirements may apply to certain alloys and powder particle sizes. For availability with other alloys and powder sizes, contact your local technical service helpdesk. DIRECTIONS FOR USE Printing: Multicore LF318 solder paste is available for stencil printing down to 0.4mm (0.016”) pitch devices, with type 3 (AGS) powder. Printing at speeds between 25mm/s (1.0”/s) & 150mm/s (6”/s) can be achieved using laser cut, electro-polished, or electroformed stencils and metal squeegees (preferably 600).

Acceptable first prints have been achieved at 0.4mm (0.016”) pitch after printer down times of 4 hours without requiring a knead cycle.

Reflow: Any of the available methods of heating to cause reflow may be used including IR, convection, hot belt, vapour phase and laser soldering. LF318 is not particularly sensitive to reflow profile type. There is no single reflow profile which is suitable for all processes & applications, but the following graph shows example profiles that have given good results in practice.

Cleaning: Multicore LF318 solder pastes are no-clean & are designed to be left on the PCB in many applications since they do not pose a hazard to long term reliability. However, should there be a specific requirement for residue removal, this may be achieved using conventional cleaning processes based on solvents such as Multicore MCF800, or suitable saponifying agents. For stencil cleaning and cleaning board misprints, Multicore SC-01 Solvent Cleaner is recommended.

Example Reflow Profiles

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150

200

250

300

0 2 4 6

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LF318, July 2005

Americas Henkel Corporation 15350 Barranca Parkway Irvine, CA 92618 U.S.A. 949.789.2500

Europe Henkel Loctite Adhesives Ltd Technologies House, Wood Lane End Hemel Hempstead Hertfordshire HP2 4RQ, United Kingdom +44 (0) 1442 278 000

Asia Henkel Loctite (China) Co. Ltd No. 90 Zhujiang Road Yantai Development Zone Shandong, China 264006 +86 535 6399820

All trademarks, except where noted are the property of Henkel Corp.

RELIABILITY PROPERTIES Solder paste medium: Multicore LF318 medium contains a stable resin system and slow evaporating solvents with minimal odour. The formulation meets the requirements of the Telcordia (formerly known as Bellcore) GR-78-CORE and ANSI/J-STD-004 for a type ROL0 classification.

Test Specification Results Copper Plate Corrosion ANSI/J-STD-004 Pass Copper Mirror Corrosion ANSI/J-STD-004 Pass Chlorides & Bromides ANSI/J-STD-004 Pass Surface Insulation Resistance (without cleaning)

ANSI / J-STD-004 Telcordia GR-78-Core

JIS-Z-3284

Pass Pass Pass

Flux Activity Classification (without cleaning)

ANSI/J-STD-004 ROL0

PACKAGING Containers: Multicore LF318 solder paste is supplied in:

• 500g plastic jars with an air seal insert. • 1kg, 600g or 500g Semco cartridges

Other packaging types may be available on request; please contact your local technical service helpdesk for assistance. Storage: It is recommended to store LF318 at 0-10°C (NB cartridges should be stored tip down to prevent the formation of air pockets). The paste should be removed from cold storage a minimum of 8 hours prior to use. Do not use forced heating methods to bring solder paste up to temperature. Multicore LF318 solder paste has been formulated to minimize flux separation on storage but should this occur, gentle stirring for 15 seconds will return the product to its correct rheological performance. To prevent contamination of unused product, do not return any material to its original container. For further specific shelf life information, contact your local Technical Service Centre. Shelf Life: Provided Multicore LF318 solder pastes are stored tightly sealed in the original container at 0-10°C, a minimum shelf life of 6 months can be expected. Air shipment is recommended to minimize the time that containers are exposed to higher temperatures. DATA RANGES The data contained herein may be reported as a typical value and/or range. Values are based on actual test data and are verified on a periodic basis.

GENERAL INFORMATION For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). Note The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user's responsibility to determine suitability for the user's purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporation’s products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.

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