Energy-conserving classical computation: prospects and ... · Single atom defects can cause local...
Transcript of Energy-conserving classical computation: prospects and ... · Single atom defects can cause local...
IBM T. J. Watson Research Center
© 2007 IBM Corporation
Energy-conserving classical computation: prospects and challenges
Thomas N. Theis, Director, Physical Sciences, IBM Research
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Transmission line stabilizer
Measured probability of finding the system in the “current flowing out” state
Three 100 nm Josephson junctions
An exploratory quantum deviceIBM Josephson Junction Qubit
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5 criteria for building a practical quantum computer(The DiVincenzo Criteria)
1. Well-defined extendible qubit array (stable memory)2. Preparable in the “000…” state3. Long decoherence time (>104 operations)4. Universal set of gate operations
extremely precise control of dynamical phase5. Single-quantum measurements (read out)
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The criteria for historically successful classical logic devices are very different.
After H.-S. P. Wong, “Novel Device Options” in Sub-100nm CMOS Short Course, IEDM, 1999
Amplification: Input drives the outputSignal level restorationNoise immunityGlobal as well as localcommunications
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The extension of silicon CMOS technology
The search for the “ultimate” FET
Prospects for adiabatic switching and reversible logic
“Beyond the FET”: The Nanoelectronics Research Initiative -- a path for the commercial emergence of quantum devices?
Topics
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RESULTS:Higher Density: α2
Higher Speed: αLower Power: 1/α2
per circuit Power Density: Constant
Lxd
GATEn+ source n+ drain
WIRINGVoltage, V
W
p substrate, doping NA
tox
L/αxd/α
GATEn+ source n+ drain
WIRINGVoltage, V / α
W/α
p substrate, doping α*NA
tox /α
Transistor ScalingDennard, et al., 1974
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The silicon transistor in manufacturing …
35 nmGate Length
90 nm technology generation
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… and in the lab.
TSi=7nm Lgate=6nm
Source Drain
Gate
B. Doris et al., IEDM , 2002
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1.0E+05
1.0E+06
1.0E+07
1.0E+08
1.0E+09
1.0E+10
1980 1985 1990 1995 2000 2005 2010
Num
ber o
f Tra
nsis
tors
106
105
108
109
1010
107
1 Million
1 Billion
~50% CAGR
Microprocessor Transistor CountLithography continues to deliver density scaling.
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Still, we are approaching some limits.
E N k IBM J R&D (2002)
0.01 0.1 110
-5
10-3
10-1
101
103
pow
er (W
/cm
2 )
Active Power
Passive
Power
gate length (μm)
Pow
er D
ensi
ty (W
/cm
2 )
Air-cooling becomes expensive
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1.0E+02
1.0E+03
1.0E+04
1990 1995 2000 2005 2010
Clo
ck S
peed
(MH
z)
103
102
104
Microprocessor Clock Speed TrendsCooling costs are limiting clock speeds.
2004 Frequency Extrapolation
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The Problem with Passive Power Dissipation:The Inability to Scale Atoms
Direct tunneling through the gate insulator will be the dominant cause of static power dissipation.
Single atom defects can cause local leakage currents 10 – 100x higher than the average current, impacting reliability and generating unwanted variation between devices.
Field effect transistor
Source Drain
Gate
1.2 nm oxynitride
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10S Tox=11A
High-k/Metal Gate Stack
90nm Generation Gate Stack:Tinv = 1.9 nmToxGL = 1.1 nm
High-k/Metal Gate Stack:Tinv = 1.45 nmToxGL = 1.6 nm
SiON/poly-Si Gate Stack
The Work-Around: High-k Insulator / Metal Gate Stack
Oxide interlayer
High-k material
Metal gate electrode
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Improving Performance
0.18um 0.13um 90nm 65nm
Technology Generation
0
20
40
60
80
100
Rel
ativ
e G
ain
in P
erfo
rman
ce
Innovation Scaling
Since the 90’s7
nitrogen
N
9fluorine
F
Before the 90’s
1hydrogen
H 5
boron
B
8oxygen
O
15
phosphorus
P14
silicon
Si
33arsenic
As
Device Elements:
20calcium
Ca
38strontium
Sr
56barium
Ba
43Ruthenium
Ru
77iridium
Ir
45rhodium
Rh
27cobalt
Co
78platinum
Pt
45palladium
Pd
28nickel
Ni
35Br35Bromine
Br30zinc
Zn32
germanium
Ge
83bismuth
Bi
6carbon
C
2helium
He
57lanthanium
La58
cerium
Ce59
Praeseodymium
Pr
60neodymium
Nd62
samarium
Sm63
europlum
Eu64
gadollinium
Gd65
terbium
Tb66
dysprosium
Dy67
holmium
Ho68
erbium
Er69
thullium
Tm70
ytterbium
Yb
22Ti22titanium
Ti
74Tungsten
W74tungsten
W73
Tantalum
Ta73tantalum
Ta
39yttrium
Y
71barium
Lu
40zirconium
Zr
72hafnium
Hf
23vanadium
V
41niobium
Nb
24chromium
Cr
42molybdenum
Mo
75Rhenium
Re
21scandium
Sc
Beyond 2005
No longer possible by scaling alone– New Device Structures
– New Device Design point
– New Materials
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Innovation Will Continue:Transistor Roadmap Options
2004 2007 2010 2013 2016 2020
37 nm 25 nm 18 nm 13 nm 9 nm 6 nm Physical Gate
back-gate
channel
isolation
buried oxide
channel
top-gate
Double-Gate CMOS
Source Drain
Gate
depletion layer
isolation
buried oxidehalo
raised source/drain
Silicon Substrate
doped channel
High k gate dielectric FinFET
Strained Si, Ge, SiGe
isolation
buried oxide
Silicon Substrate
Ultrathin SOI
In general, growing power dissipation and increasing process variability will be addressed by introduction of new materials and device structures, and by design innovations in circuits
and system architecture.
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Post-Silicon CMOS: The Quest for the Ultimate FET
W200nm
Self-Aligned Carbon Nanotube FET: Extension Contacts Based on
Charge-Transfer Chemical Doping
Vertical Transistor Based on Semiconductor Nanowires
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Individual Vertical Surround Gate Si Nanowire FET
Undoped 60 nm SiNWs on n-SiAl bottom contactNi top contact20 nm PECVD SiO2 dielectricAl gate
Accumulation (p-type)Weak inversionLarge currents (20μA @ Vsd=3V)No gate leakage (< 1pA @ Vg= 4V)Swing ~250 mV/decadeOn/Off ratio ~ 104
ION
IOFF
VTΔVg = VSD=2V1 μm
Al gate
NW + dielectric
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10-5
10-4
10-3
10-2
10-1
100
101
|I d| [μA
]
-2 -1 0 1 2Vgs [V]
Vds -0.7 V -0.5 V -0.3 V -0.1 V
20
15
10
5
0
|I d| [μA
]
-1.2 -0.8 -0.4 0.0Vds [V]
-1.2 V
-0.8 V
-0.4 V
0 V 0.4 V
Vds = -1.6 V
12
8
4
0
g m[μ
S]
-2.0 -1.0 0.0 1.0Vgs [V]
90 K 300 K
Pd Pd
nanotube
Subthreshold Characteristics
Output Characteristics
Temperature dependence
Simple back-gated CNTFET
Intrinsic Performance of Carbon Nanotube FETs
Yu-Ming Lin et al. (IBM), EDL 2005
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2m
Tg
gfCπ
=Cut-off Frequency
260 GHz550 GHz800 GHzfT @ Lg = 65 nm
32 pF/m120 pF/m38 pF/mCg/L
3.5 μS27 μS12.5 μSMaximum gm
12-nm SiO28-nm HfO210-nm SiO2Gate Dielectric
~ 1.1 nm~ 1.7 nm~ 1.8 nmDiameter
Seidel et al. (Infineon)
Javey et al. (Stanford)
Lin et al.(IBM)
Cg : gate capacitance
Intrinsic Switching Speed of CNFETs
Yu-Ming Lin et al. (IBM), EDL 2005
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Carbon Nanotube FET:Potential for greatly improved turn-on characteristics (low-voltage operation)
J. Appenzeller, Y.-M. Lin, J. Knoch, and Ph. Avouris, Phys. Rev. Lett. 93, 196805 (2004)
Dual-Gate CNTFET
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FETs approach the “kT” limit
Data compiled by R. Keyes,
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Can we operate FETs near or below the kT “limit”?
Two paths1. Conventional Logic:
Reduce the stored energy, ½ CV2, toward the kT limit, accept the reduction in switching speed, and use redundancy and error correction to keep the error rate in bounds.(Refrigeration is allowed, but this makes economic sense only if total power dissipation is reduced.)
2. Reversible Logic:
Maintain ½ CV2 well above kT, implement adiabatic switching, energy-conserving reversible logic circuits, and energy-recovering (i.e. resonant circuit) power supply to reduce energy losses per switching event to ~ kT or below.*
* Note: Dissipation > kT per logical operation is not a thermodynamic limit. It is a practical limit for computing architectures that are not logically reversible.
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How much energy must be dissipated to charge a capacitor?
Adiabatic Charging
( T >> RC)
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David Frank, IBM Research
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Applications of Adiabatic Charging
Drive specific capacitances which cause large dissipation.– Power supplies
– Energy conserving data bus drivers
Broadly implement reversible logic.– Retractile cascade, reversible pipelines (easy)
– High-efficiency regenerative power supply (difficult)
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Reversible Logic: Implementation with FETs
It is conceptually possible to build general purpose reversible computers with energy dissipation per operation going asymptotically to zero as frequency goes to zero.But, frequency must be reduced by about 1/1000 to achieve benefits with respect to conventional approaches to CMOS logic.
Dissipation of 4 bit ripple counter (D. J. Frank, 1995)
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Energy dissipation depends on the physics of the device!
Adiabatic Computing
Energy-time trade-off depends
strongly on device physics!
DJ Frank, MIT Workshop on Reversible Computation, February 14, 2005
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Will there be a successor to the FET?
Many have written about this subject.
An article by George Bourianoff (“The Future of Nanocomputing”,IEEE Computer 36, pp. 44–53) sparked discussions within the SRC regarding the objectives of a new research program – the Nanoelectronics Research Initiative (NRI) – which would stimulate the exploration of devices “beyond the FET”.
computational state vectors other than electronic charge
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Beyond Charged-Based Logic?
Spintronics
Plasmonics
Nanomechanics
DNA Chemistry
p -GaAssubstrate
+
AlGaAs
Ga Asq ua ntum wellEF
MgO
AVT IC
CoFe
Collec tor
Magnetic Field
e-
Luminescence AlGaAs
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Nanoelectronics Research Initiative (NRI)
AMD, Freescale, Micron, TI, IBM, IntelJoint Industry funding of University Research
Promoting both – Invention / Discovery (distributed research, “let many flowers bloom”)
– Proof of Concept (focused university consortia with outstanding facilities)
“Extend the historical cost/function reduction, along with increased performance and density … orders of magnitude beyond the limits of CMOS”– Computational State Vectors other than Electronic Charge
– Non-equilibrium Systems
– Novel Energy Transfer Mechanisms
– Nanoscale Thermal Management
– Directed Self-assembly of such structures
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A device that switches much faster than the ultimate transistor must dissipate much less power per switching event than the ultimate transistor.
A device that can be integrated much more densely that the ultimate transistor will be much smaller than the ultimate transistor.
Fast, near-adiabatic switching
Energy-conserving (reversible) logic
Precise control of dynamical phase over many logical operations
Fine-grained error correction
“Classical” logical states approximated by small ensembles of quantum states
Quantum decoherence contributes to error rate
Fine-grained error correction
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The is much excitement regarding the possibility of spin-based logic devices.
“If the operations are done coherently the minimum switching energy derived for charge-based information processing does not apply.”
“…the switching energy of a fast spin-based device can be much closer to the fundamental limit than a charge-based device”
D. D. Awschalom and M. E. Flatte, Nature Physics 3 (153 – 159) March 2007
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Spin-based insulated gate field effect transistorK.C. Hall and M.R. Flatte, APL 88, 162503 (2006)
E
E
E
E
long T1
short T1
source
drain
E
E
E
Esource
drain
OFF
ON
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Spin angular momentum transfer and spin-torque:
Co Cu Co
<100nm
F2(<5nm)F1
N NNSpin-transfer:
Transport current affecting magneto-dynamics
N F2 NM
Conduction electrons
M
H
θ
damping
spin-torque
J. C. Slonczewski, J. Magn. Magn. Mater. 159, L1 (1996); ibid, 195, L261 (1999).
J. Z. Sun, J. Magn. Magn. Mater. 202, 157 (1999); Phys. Rev. B62, 570 (2000) , Nature 425, 359 (2003).
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Unknowns
The device(So far, nothing smaller or faster than an FET can reliably gate another device.)
The non-local interconnections
Energy cost of the control system. – Analogous to a clock in a conventional circuit? … or are there reversible
versions of non-clocking (handshaking) circuits?– Stringent timing requirements and limits on energy dissipation?
Energy cost of error correction
Trade-offs between energy dissipation and raw error rate.
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Conclusions
Silicon CMOS logic will be extended at least another 10 years. – New materials and transistor structures
– Cooperative circuit and device technology co-design
BUT … we appear to be entering an era in which fundamental physics and truly adventurous electrical engineering can again play a central role in the evolution of information technology.
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Thanks to colleagues ...
Paul Solomon
David J. Frank
Charles Bennett
Bob Keyes
for many discussions, both recent and long past ...
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… and thanks for your attention!