Energy-conserving classical computation: prospects and ... · Single atom defects can cause local...

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IBM T. J. Watson Research Center © 2007 IBM Corporation Energy-conserving classical computation: prospects and challenges Thomas N. Theis, Director, Physical Sciences, IBM Research

Transcript of Energy-conserving classical computation: prospects and ... · Single atom defects can cause local...

Page 1: Energy-conserving classical computation: prospects and ... · Single atom defects can cause local leakage currents 10 – 100x higher ... Y 71 barium Lu 40 zirconium Zr 72 hafnium

IBM T. J. Watson Research Center

© 2007 IBM Corporation

Energy-conserving classical computation: prospects and challenges

Thomas N. Theis, Director, Physical Sciences, IBM Research

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© 2007 IBM CorporationT.N. Theis, 06/03/2007 2

Transmission line stabilizer

Measured probability of finding the system in the “current flowing out” state

Three 100 nm Josephson junctions

An exploratory quantum deviceIBM Josephson Junction Qubit

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5 criteria for building a practical quantum computer(The DiVincenzo Criteria)

1. Well-defined extendible qubit array (stable memory)2. Preparable in the “000…” state3. Long decoherence time (>104 operations)4. Universal set of gate operations

extremely precise control of dynamical phase5. Single-quantum measurements (read out)

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The criteria for historically successful classical logic devices are very different.

After H.-S. P. Wong, “Novel Device Options” in Sub-100nm CMOS Short Course, IEDM, 1999

Amplification: Input drives the outputSignal level restorationNoise immunityGlobal as well as localcommunications

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The extension of silicon CMOS technology

The search for the “ultimate” FET

Prospects for adiabatic switching and reversible logic

“Beyond the FET”: The Nanoelectronics Research Initiative -- a path for the commercial emergence of quantum devices?

Topics

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RESULTS:Higher Density: α2

Higher Speed: αLower Power: 1/α2

per circuit Power Density: Constant

Lxd

GATEn+ source n+ drain

WIRINGVoltage, V

W

p substrate, doping NA

tox

L/αxd/α

GATEn+ source n+ drain

WIRINGVoltage, V / α

W/α

p substrate, doping α*NA

tox /α

Transistor ScalingDennard, et al., 1974

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The silicon transistor in manufacturing …

35 nmGate Length

90 nm technology generation

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… and in the lab.

TSi=7nm Lgate=6nm

Source Drain

Gate

B. Doris et al., IEDM , 2002

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1.0E+05

1.0E+06

1.0E+07

1.0E+08

1.0E+09

1.0E+10

1980 1985 1990 1995 2000 2005 2010

Num

ber o

f Tra

nsis

tors

106

105

108

109

1010

107

1 Million

1 Billion

~50% CAGR

Microprocessor Transistor CountLithography continues to deliver density scaling.

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Still, we are approaching some limits.

E N k IBM J R&D (2002)

0.01 0.1 110

-5

10-3

10-1

101

103

pow

er (W

/cm

2 )

Active Power

Passive

Power

gate length (μm)

Pow

er D

ensi

ty (W

/cm

2 )

Air-cooling becomes expensive

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1.0E+02

1.0E+03

1.0E+04

1990 1995 2000 2005 2010

Clo

ck S

peed

(MH

z)

103

102

104

Microprocessor Clock Speed TrendsCooling costs are limiting clock speeds.

2004 Frequency Extrapolation

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The Problem with Passive Power Dissipation:The Inability to Scale Atoms

Direct tunneling through the gate insulator will be the dominant cause of static power dissipation.

Single atom defects can cause local leakage currents 10 – 100x higher than the average current, impacting reliability and generating unwanted variation between devices.

Field effect transistor

Source Drain

Gate

1.2 nm oxynitride

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10S Tox=11A

High-k/Metal Gate Stack

90nm Generation Gate Stack:Tinv = 1.9 nmToxGL = 1.1 nm

High-k/Metal Gate Stack:Tinv = 1.45 nmToxGL = 1.6 nm

SiON/poly-Si Gate Stack

The Work-Around: High-k Insulator / Metal Gate Stack

Oxide interlayer

High-k material

Metal gate electrode

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Improving Performance

0.18um 0.13um 90nm 65nm

Technology Generation

0

20

40

60

80

100

Rel

ativ

e G

ain

in P

erfo

rman

ce

Innovation Scaling

Since the 90’s7

nitrogen

N

9fluorine

F

Before the 90’s

1hydrogen

H 5

boron

B

8oxygen

O

15

phosphorus

P14

silicon

Si

33arsenic

As

Device Elements:

20calcium

Ca

38strontium

Sr

56barium

Ba

43Ruthenium

Ru

77iridium

Ir

45rhodium

Rh

27cobalt

Co

78platinum

Pt

45palladium

Pd

28nickel

Ni

35Br35Bromine

Br30zinc

Zn32

germanium

Ge

83bismuth

Bi

6carbon

C

2helium

He

57lanthanium

La58

cerium

Ce59

Praeseodymium

Pr

60neodymium

Nd62

samarium

Sm63

europlum

Eu64

gadollinium

Gd65

terbium

Tb66

dysprosium

Dy67

holmium

Ho68

erbium

Er69

thullium

Tm70

ytterbium

Yb

22Ti22titanium

Ti

74Tungsten

W74tungsten

W73

Tantalum

Ta73tantalum

Ta

39yttrium

Y

71barium

Lu

40zirconium

Zr

72hafnium

Hf

23vanadium

V

41niobium

Nb

24chromium

Cr

42molybdenum

Mo

75Rhenium

Re

21scandium

Sc

Beyond 2005

No longer possible by scaling alone– New Device Structures

– New Device Design point

– New Materials

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Innovation Will Continue:Transistor Roadmap Options

2004 2007 2010 2013 2016 2020

37 nm 25 nm 18 nm 13 nm 9 nm 6 nm Physical Gate

back-gate

channel

isolation

buried oxide

channel

top-gate

Double-Gate CMOS

Source Drain

Gate

depletion layer

isolation

buried oxidehalo

raised source/drain

Silicon Substrate

doped channel

High k gate dielectric FinFET

Strained Si, Ge, SiGe

isolation

buried oxide

Silicon Substrate

Ultrathin SOI

In general, growing power dissipation and increasing process variability will be addressed by introduction of new materials and device structures, and by design innovations in circuits

and system architecture.

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Post-Silicon CMOS: The Quest for the Ultimate FET

W200nm

Self-Aligned Carbon Nanotube FET: Extension Contacts Based on

Charge-Transfer Chemical Doping

Vertical Transistor Based on Semiconductor Nanowires

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Individual Vertical Surround Gate Si Nanowire FET

Undoped 60 nm SiNWs on n-SiAl bottom contactNi top contact20 nm PECVD SiO2 dielectricAl gate

Accumulation (p-type)Weak inversionLarge currents (20μA @ Vsd=3V)No gate leakage (< 1pA @ Vg= 4V)Swing ~250 mV/decadeOn/Off ratio ~ 104

ION

IOFF

VTΔVg = VSD=2V1 μm

Al gate

NW + dielectric

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10-5

10-4

10-3

10-2

10-1

100

101

|I d| [μA

]

-2 -1 0 1 2Vgs [V]

Vds -0.7 V -0.5 V -0.3 V -0.1 V

20

15

10

5

0

|I d| [μA

]

-1.2 -0.8 -0.4 0.0Vds [V]

-1.2 V

-0.8 V

-0.4 V

0 V 0.4 V

Vds = -1.6 V

12

8

4

0

g m[μ

S]

-2.0 -1.0 0.0 1.0Vgs [V]

90 K 300 K

Pd Pd

nanotube

Subthreshold Characteristics

Output Characteristics

Temperature dependence

Simple back-gated CNTFET

Intrinsic Performance of Carbon Nanotube FETs

Yu-Ming Lin et al. (IBM), EDL 2005

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2m

Tg

gfCπ

=Cut-off Frequency

260 GHz550 GHz800 GHzfT @ Lg = 65 nm

32 pF/m120 pF/m38 pF/mCg/L

3.5 μS27 μS12.5 μSMaximum gm

12-nm SiO28-nm HfO210-nm SiO2Gate Dielectric

~ 1.1 nm~ 1.7 nm~ 1.8 nmDiameter

Seidel et al. (Infineon)

Javey et al. (Stanford)

Lin et al.(IBM)

Cg : gate capacitance

Intrinsic Switching Speed of CNFETs

Yu-Ming Lin et al. (IBM), EDL 2005

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Carbon Nanotube FET:Potential for greatly improved turn-on characteristics (low-voltage operation)

J. Appenzeller, Y.-M. Lin, J. Knoch, and Ph. Avouris, Phys. Rev. Lett. 93, 196805 (2004)

Dual-Gate CNTFET

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FETs approach the “kT” limit

Data compiled by R. Keyes,

IBM Research

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Can we operate FETs near or below the kT “limit”?

Two paths1. Conventional Logic:

Reduce the stored energy, ½ CV2, toward the kT limit, accept the reduction in switching speed, and use redundancy and error correction to keep the error rate in bounds.(Refrigeration is allowed, but this makes economic sense only if total power dissipation is reduced.)

2. Reversible Logic:

Maintain ½ CV2 well above kT, implement adiabatic switching, energy-conserving reversible logic circuits, and energy-recovering (i.e. resonant circuit) power supply to reduce energy losses per switching event to ~ kT or below.*

* Note: Dissipation > kT per logical operation is not a thermodynamic limit. It is a practical limit for computing architectures that are not logically reversible.

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How much energy must be dissipated to charge a capacitor?

Adiabatic Charging

( T >> RC)

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David Frank, IBM Research

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Applications of Adiabatic Charging

Drive specific capacitances which cause large dissipation.– Power supplies

– Energy conserving data bus drivers

Broadly implement reversible logic.– Retractile cascade, reversible pipelines (easy)

– High-efficiency regenerative power supply (difficult)

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Reversible Logic: Implementation with FETs

It is conceptually possible to build general purpose reversible computers with energy dissipation per operation going asymptotically to zero as frequency goes to zero.But, frequency must be reduced by about 1/1000 to achieve benefits with respect to conventional approaches to CMOS logic.

Dissipation of 4 bit ripple counter (D. J. Frank, 1995)

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Energy dissipation depends on the physics of the device!

Adiabatic Computing

Energy-time trade-off depends

strongly on device physics!

DJ Frank, MIT Workshop on Reversible Computation, February 14, 2005

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Will there be a successor to the FET?

Many have written about this subject.

An article by George Bourianoff (“The Future of Nanocomputing”,IEEE Computer 36, pp. 44–53) sparked discussions within the SRC regarding the objectives of a new research program – the Nanoelectronics Research Initiative (NRI) – which would stimulate the exploration of devices “beyond the FET”.

computational state vectors other than electronic charge

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Beyond Charged-Based Logic?

Spintronics

Plasmonics

Nanomechanics

DNA Chemistry

p -GaAssubstrate

+

AlGaAs

Ga Asq ua ntum wellEF

MgO

AVT IC

CoFe

Collec tor

Magnetic Field

e-

Luminescence AlGaAs

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Nanoelectronics Research Initiative (NRI)

AMD, Freescale, Micron, TI, IBM, IntelJoint Industry funding of University Research

Promoting both – Invention / Discovery (distributed research, “let many flowers bloom”)

– Proof of Concept (focused university consortia with outstanding facilities)

“Extend the historical cost/function reduction, along with increased performance and density … orders of magnitude beyond the limits of CMOS”– Computational State Vectors other than Electronic Charge

– Non-equilibrium Systems

– Novel Energy Transfer Mechanisms

– Nanoscale Thermal Management

– Directed Self-assembly of such structures

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A device that switches much faster than the ultimate transistor must dissipate much less power per switching event than the ultimate transistor.

A device that can be integrated much more densely that the ultimate transistor will be much smaller than the ultimate transistor.

Fast, near-adiabatic switching

Energy-conserving (reversible) logic

Precise control of dynamical phase over many logical operations

Fine-grained error correction

“Classical” logical states approximated by small ensembles of quantum states

Quantum decoherence contributes to error rate

Fine-grained error correction

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The is much excitement regarding the possibility of spin-based logic devices.

“If the operations are done coherently the minimum switching energy derived for charge-based information processing does not apply.”

“…the switching energy of a fast spin-based device can be much closer to the fundamental limit than a charge-based device”

D. D. Awschalom and M. E. Flatte, Nature Physics 3 (153 – 159) March 2007

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Spin-based insulated gate field effect transistorK.C. Hall and M.R. Flatte, APL 88, 162503 (2006)

E

E

E

E

long T1

short T1

source

drain

E

E

E

Esource

drain

OFF

ON

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Spin angular momentum transfer and spin-torque:

Co Cu Co

<100nm

F2(<5nm)F1

N NNSpin-transfer:

Transport current affecting magneto-dynamics

N F2 NM

Conduction electrons

M

H

θ

damping

spin-torque

J. C. Slonczewski, J. Magn. Magn. Mater. 159, L1 (1996); ibid, 195, L261 (1999).

J. Z. Sun, J. Magn. Magn. Mater. 202, 157 (1999); Phys. Rev. B62, 570 (2000) , Nature 425, 359 (2003).

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Unknowns

The device(So far, nothing smaller or faster than an FET can reliably gate another device.)

The non-local interconnections

Energy cost of the control system. – Analogous to a clock in a conventional circuit? … or are there reversible

versions of non-clocking (handshaking) circuits?– Stringent timing requirements and limits on energy dissipation?

Energy cost of error correction

Trade-offs between energy dissipation and raw error rate.

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Conclusions

Silicon CMOS logic will be extended at least another 10 years. – New materials and transistor structures

– Cooperative circuit and device technology co-design

BUT … we appear to be entering an era in which fundamental physics and truly adventurous electrical engineering can again play a central role in the evolution of information technology.

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Thanks to colleagues ...

Paul Solomon

David J. Frank

Charles Bennett

Bob Keyes

for many discussions, both recent and long past ...

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… and thanks for your attention!