Enclosures in Action: Equipment Protection … Rack is particularly suitable for rack mountable...

Please see page 26Please see page 12

Emcor Introduces W-Series Line of Wall Mount EnclosuresPlease see page 4

Hardware

Please see page 14

Feature Article: Custom Enclosures:Getting Exactly What You Want in a

Protective Instrumentation Enclosure

Power

Please see page 16

As the weather heats up, the need for efficient andalways available thermal protection increases. From tinyheat sinks to large heat exchangers, we have you cov-ered! Check out pages 10 through 13 for informationon the latest termal protection products, as well asprofiles the leading companies in the thermal industry.

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NASCAR spectators attend the races for the thrill, spectacle, theexcitement and to cheer on their favorite cars and drivers. However,getting these high performance race cars ready involves copiousamounts of testing and preparation. Race teams comb over everyinch of their vehicles, testing the equipment under as many differentconditions as a driver might encounter at the track and scientificallydetermining how to increase their performance. As the sport hasdeveloped, so have the testing meth-ods. Computer simulations and analysisare now a key part of winning,

One contender is Chip GanassiRacing Teams, Inc. The team wasfounded 18 years ago as a one-car IndyCar team partnered with Target Stores,and has grown into a competitive rac-ing group that competes in both theNASCAR Nextel Cup and Busch Series,IRL, Indy Pro-Series and Rolex Grand-AM series.

According to simulation engineerCraig Derian, growth and innovation arethe watchwords at Chip Ganassi Racing,and are a big part of why the team hasenjoyed so much success.

“We are constantly refining ourmethods and finding new ways to gauge our equipment,” he said. “Tothis end, we have recently started incorporating engineering simula-tion work in preparation for race events.”

In the fall of 2006, Chip Ganassi Racing initiated a collaboration withDell and Microsoft that quickly lead to innovative changes to theirtesting methods. Using high-powered Dell computer hardware, ChipGanassi Racing drivers are prepared for races via computer simulationsthat mimic the variety of conditions drivers face at the track. It’s veryprocess-intensive work and the computers used by Chip Ganassi Racinggo beyond the capabilities of an average PC.

“Right now we have servers that operate as a cluster,” said Derian.“We are able to simulate, monitor and ultimately improve the car anddrivers’ performance, and diagnose potential problem areas before we

encounter them live on the track.”Because the servers are both delicate and valuable, Chip Ganassi

Racing has been limited in the past when the car and driver are onthe track, preparing for a race. It became clear that the simulationswould have to be run on location if the team could find a way to pro-tect the instruments from jostling, vibration impact, or any other trav-el-related hazards that could reduce the computers’ effectiveness, or

destroy them outright.Enter Hardigg Cases. Many of

Hardigg’s packaging and trans-port cases can withstand every-thing from the vibrations in anaircraft cargo hold to a directfall from the back of a truck,and are capable of safeguardinggear from the effects of impact,extreme temperature, water,shock, vibration and even expo-sure to chemicals and deconta-mination solutions. With a casefor nearly every imaginableapplication, Chip Ganassi Racingwas able to find the perfect fitfor the Dell supercomputingcluster in the Classic Rack series.

Designed specifically to provide the best shock and vibration pro-tection to delicate equipment up to 340 pounds, Hardigg Classic Rackcases can withstand extreme falls while keeping sensitive electronicequipment secure and safe. Individually fine-tuned shock mounts foreach application provide shock and vibration dampening plus allowcooling airflow for the successful operation of equipment. TheClassic Rack is particularly suitable for rack mountable precision testequipment, medical diagnostic equipment, meteorological instru-ments, broadcast and video gear, lab equipment, and servers.

Chip Ganassi Racing selected a 14U case that is capable of stackingas many as 14 of the Dell servers safely and securely. As of January2007, the Dell servers have been mounted for easy transport to thetrack. So far, the computers have operated flawlessly.

Enclosures in Action: Equipment Protection Technology at the Track

THERMAL PROTECTION SOLUTIONS

www.pulizzi.com

July/August 2008 www.EquipmentProtectionMagazine.com

CONTENTSCONTENTS

3

Volume 6, Issue 4

Editor & PublisherDavid Webster

Director of ContentShannon M. Given

Associate EditorsNick Depperschmidt, Jeremy Mar tin

Assistant EditorsHeather Krier, Joanna Larez

News EditorsSuzanne Harrold, Scott Nash, Karen Poulson,

Sue Hannebrick, Staci Hannebrick, Jeremy Fleming

Manager of Administration & Customer Service

Marsha GrilloFulfillment Services Manager

Marc VangDirector of Sales

Jessi Car terAdvertising, Sales & Marketing

Suzanne Harrold, Account ExecutiveJessica Thebo, Marketing Manager

Jennifer Graham, Kristen Reming, Marketing AssistantsProduction

Julie McCann, Production ManagerOffice ManagerJulie Williams

Director of CirculationMarc Vang

Circulation and Data EntryAndy Gurokovich

EQUIPMENT PROTECTION (ISSN #1544-7812) is a publication of WebcomCommunications Corp. Subscription price for one year (six issues) is freefor qualified subscribers, $44 in the US for non-qualified subscribers; $60in all other countries. Single copies are $20 each. Back issues are avail-able. Payment must be made in US funds in order to process the order.Direct all subscription inquiries, orders and address changes to FulfillmentServices.

Third-class and fourth-class postage paid in Denver, Colo.

POSTMASTER: Send address changes to: Webcom Communications, 7355 E. Orchard,

#100, Greenwood Village, CO 80111.

Photocopy Rights: Permission to photocopy for internal or personal use, or theinternal or personal use of specific clients is granted by EQUIPMENT PROTEC-TION for users through Copyright Clearance Center, provided that the base feeof $2.50 per copy of the article, plus $1.00 per page is paid directly to theCopyright Clearance Center, 222 Rosewood Drive, Danvers, MA 01923 USA(508) 750-8400. For government and/or classroom use, the CopyrightClearance Center should be contacted. The rate for this is 3 cents per page.Please specify ISSN # 1544-7812.

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Webcom Communications Corp.7355 E. Orchard Rd., # 100Greenwood Village, CO 80111

Phone 720-528-3770Fax 720-528-3771

[email protected]

Letter from the EditorBoy it sure is hot! Now, that is welcome

conversation sitting on the beach in Hawaii,but not if excessive heat has damaged yourequipment and systems. That is why everysummer we provide you with a special thermalmanagement issue packed with products andsolutions to beat the heat!

For 2008 we are covering a wide array ofthermal management topics including an arti-cle from Stego, Inc. (see page 22) covering theuse of specially controlled heating units to ridenclosures of unwanted humidity and conden-sation. Additional thermal management sec-tions include an article on detecting air filterblockages for electronic enclosures fromDegreeC (see page 24), an expanded newthermal products section and our thermalsolutions showcase on page 13. There you will

find information on some of the leading ther-mal management companies in the industry.

Speaking of thermal management solu-tions, check out page 17. There you will findconference information for Webcom’s newThermal Management and TechnologySymposium. It’s a must attend event for any-one in the thermal marketplace!

Even with all this space dedicated to thermaltopics, we haven’t forgotten the rest of you!This issue is jam packed with new products,industry news and three additional articles cov-ering electromagnetic shielding and customenclosure design. We hope you enjoy it.

Nick Depperschmidt Editor, Equipment Protection [email protected]

In This Issue

ENCLOSURES

EMI/EMC/ESD

THERMAL

POWER

HARDWARE

FEATURES

DEPARTMENTS

Asis Introduces its Performance Series 6-Slot AdvancedTCA Shelf

- Page 4

OtterBox Provides Protection for Samsung’s Q1 Ultra and Q1 Ultra Premium

Family of Ultra Mobile PCs - Page 6

FCI Develops Economical D-SUB Shielded Hood Series

- Page 8

SolaHD Introduces STV 200/400K Series Surge Protective Devices

- Page 14

EnerSys Revolutionizes UPS Solutions with DataSafe 16 V Front-Terminal

UPS Batteries - Page 15

Avoid Downtime with Affordable Enclosure Cooling

- Page 10

High Temp Furnace Camera System is Capable of Severe Service

Environments to 4,000°F - Page 12

Extruded AdvancedTCA Front Panels Offer Aesthetic, Precise Finish

- Page 16

Touch-Safe Power Cage Clamp Places Emphasis on Safety and Ease of Use

- Page 17

Electromagnetic Shielding for Thermoplastic Composites - Page 18

Planning Ahead for EMC Is Vital for Equipment Protection

And Reliability - Page 20

Condensation Control in Electronic Enclosures -Thermostats

Vs. Hygrostats - Page 22

Detection of Air Filter Blockage in Electronics Enclosures - Page 24

Custom Enclosures: Getting Exactly What you Want in a Protective

Instrumentation Enclosure - Page 26

Industry News - Page 28

Marketplace - Page 28

Webguide - 0

Calendar of Events - Page 31

ENCLOSURESENCLOSURES

Equipment Protection Magazine July/August 2008

Emcor Introduces W-Series Line of WallMount Enclosures

Emcor has released its new W-series of wall-mount elec-tronic equipment enclosures. The new enclosures aredesigned for use anywhere that space is an issue. Theserugged 19-inch weldedcabinets are designedwith quality materialsand construction.

Enclosures comecompletely assem-bled with lockablefront door and rearwall mount section.The entire enclosurecan be rotated to allow the cabinet (center) section toopen either to the left or right. The front door canalso be rotated for left or right hinged applications.

The cabinet section has openings on the top, bottomand both sides. The panels for these openings are inter-changeable and are available in solid, vented or fan panelconfigurations. The hinged wall-mount section has cableaccess knockouts located on the top and bottom flangefor fast, easy cable management.

These 19-inch enclosures are available in 24.5 and 32inch cabinet section depths, with 12U and 18U open-ings. Enclosures are also available in nine contemporarypaint colors.

Pelican Releases Dual Mode Shipping CaseResponding to increasing

demand for tough, versatile,shipping cases, Pelican Products,Inc. has introduced the 1730transport case. Designed toeither be moved manually orstacked on pallets, the 1730 fea-tures four extra-deep base-to-lid, locking cleats that ensuremaximum stacking stability.

For easy manual transport,the case comes standard withseveral mobile-friendly featuresthat include two double-widehandles and ruggedpolyurethane wheels with stainless steel ball bearings andnylon hubs for extended towing durability. With nearly10,000 cubic inches of usable storage space and an infi-nite number of internal storage possibilities, the 1730 fea-tures an open cell-core wall, polymer construction engi-neered to protect sensitive equipment.

Standard features include a lid equipped with a poly-mer O-ring for a dust and water tight seal and dual actionlatches that have been tested to withstand nearly 400pounds, but open with a light pull. Genuine PelicanProtector Cases are fully stackable for maximum spaceefficiency and can always be spotted by a distinctive,trademarked “Dual Band” design.

The 1730 features an integrated automatic pressureequalization valve that keeps moisture out and preventsvacuum lock so the case is easy to open at any altitude.

The 1730 transport case is also available with a manualpressure regulation valve and a humidity indicator formoisture regulation. This feature is optional which makesit well suited for storing weapons or anything else thatrequires strict atmospheric conditions.

The 1730 transport case, with manually customizablePick ‘N Pluck foam, has an MSRP of $549.95 and isbacked by the Pelican Products lifetime guarantee.

New ABS Instrument Enclosures from OKWOKW’s Meditec enclosures have been designed for

housing modern portable and desk mounted electronics.These modular enclosures are available in a large range ofsizes and formats. Typical applications will include testand measurement systems, wellness and medical devices,laboratory equipment,peripherals, data storageunits and much more.

The Meditec enclosureshave a modern appear-ance with 'L' shape mold-ings that are joinedtogether at mitred cor-ners. The construction isvery rigid due to strength-ening ribs on the inside.The standard color is off-white, with other colorsavailable on demand.

The cases are moldedin a special grade of ABS(UL 94 HB) Novodur P2MT/AT by Bayer, which is robustand shock resistant. It is also anti-static, stable and hightemperatures and can be cleaned completely, vital forinfection control in medical applications.

Four standard plan sizes are offered: 6.29 by 7.87 inch-es, 6.29 by 10.23 inches, 11.41 by 7.87 inches and 11.41by 10.23 inches with standard heights of 2.91 and 4.88inches. This can be increased in increments of 1.97 inchesby fitting one or more of the accessory side panel kits.

Optional sloping front panels are designed forergonomic operation of controls and easier viewing ofthe displays. An infill panel can also be fitted under thesloping panel for mounting connectors for probes anddata cables. Other accessories include ABS front panels,stacking feet and wall mounting brackets.

Protek Wall-Mount Packages AvailableWith Fan/Filter of Air Conditioner forSimple Thermal Management

Hoffman has released its Protek wall-mount packages,a ready-to-use DataCom solution with integrated thermalmanagement. These preconfigured packages include aType 4 or 12 cabinet with either a fan and filter or airconditioner to control internal temperatures while pro-tecting 19-inch rack equipment from harmful environ-mental contaminants.

Protek wall-mount packages are available in singledoor and double-hinged models and require no addition-al layout, drilling or sawing to accommodate thermaldevices. Plus, air conditioners, fans and filters operate on

110/115 VAC 50/60 Hz line voltage with a standard NEMA15 A plug internal to the cabinet (5-15P).

Protek fan and filter packages protect equipment in awide variety of applications including Type 1, 12 or 4 ULlisted environments, when the ambient temperature is 5°Fless than the maximum allowable internal equipmenttemperature. The top-mounted 6-inch pagoda fan effi-ciently exhausts hot air from the top of the cabinet forincreased internal airflow and heat dissipation, while thebottom-mounted filter prevents dust from entering thecabinet and damaging the equipment. In addition, the fil-ter can be easily removed for periodic cleaning withoutaccessing the cabinet.

For applications where high ambient air temperatures,up to 130°F, would normally cause equipment failure,Protek air conditioner packages deliver additional ther-mal management, providing 254 watts (800 BTUs) ofcooling. Plus, since the right-side mounted T4 lineindoor/outdoor air conditioner doesn’t allow outside airinto the cabinet, rack equipment is also protected fromexternal contaminants.

Protek wall-mount packages feature fully welded andground body and door construction for rugged, long-termdurability. Type 12 cabinets offer window doors withscratch-resistant safety glass, allowing equipment moni-toring without opening the door, which minimizes con-tamination. The locking wing knob with two keys providessecurity and convenience in indoor applications. Type 4cabinets feature solid doors for complete physical andvisual protection and a padlock-capable, tamper-resistant,quarter-turn latch (tool included) for easy operation andsecurity options in indoor and outdoor applications. Plus,the foam-in-place, non-absorbing seamless gasket aroundthe door seals against outdoor air infiltration and ischemically resistant. Protek wall-mount packages areplenum rated for use in air exchange areas.

Protek wall-mount packages cool internal air and pro-tect equipment from falling dirt, splashing water, hosedirected water, freezing rain and many other hazards. Thisdesign makes Protek well suited for remote networkapplications in harsh environments and remote intermedi-ate distribution frames (IDFs) for extension of networksystems, access points and consolidation points.

Are You an A, B or C? Your subscription to Equipment Protection maga-zine may be about to expire. Check your status in

the colored box located in the mailing label on thefront cover. Subscribe online at

www.EquipmentProtectionMagazine.com.

4

Asis has introduced its Perform series six slot AdvancedTCA shelf. The unique designof the Asis six slot AdvancedTCA shelf provides space for six node ATCA blades in a 6U(10.5 inch) shelf making it well suited for telecom anddata communications products that require high availabil-ity, fault management and real-time performance.Moreover, HUB functionality is already integrated in thestandard shelf management boards.

The shelf manager is based on Pigeon Point 500 shelfmanagement module (ShMM) and features a unique HPI-based software module, offering access to the shelf con-trol and management interface. The shelf also featuresunique distribution of sensors, and comprehensive alarmI/O. Asis' proprietary Basic shelf manager is based on aPowerQuick processor and cost reduced ShMM. Lastly,Asis' fan control board automatically controls chassistemperature using dedicated temperature sensors located inside the chassis or con-trolled by the ATCA blade/switch using I2C bus.

With support for more than 300 watts per slot and compliance with the strict NEBS(GR63) cooling requirements, the Perform series six slot shelf surpasses the current

solutions found in the market both in normal stage and in any failure condition.Featuring a fault-tolerant airflow design, two 38 mm fan trays with eight high perform-

ance fans each and patented air flow technology, thePerform six slot shelf push-pull cooling maximizes airflow to assure the highest-level of heat reduction. Asis’advanced cooling scheme also enables customization ofthe air flow according to user’s specific needs, allowingextreme high power dissipation from selected slots. Forapplications requiring more than 300 watts per slot, thePerform series airflow can be easily customized to meetspecific thermal requirements.

The AC/DC 6-Slot Perform series also features a 10gbps backplane that exceeds the AdvancedTCA standardwhile ensuring signal integrity. These enhanced capabili-ties are based on practical experience and comprehensive

signal integrity studies which led to the unique optimization of the backplane. In addi-tion, the new shelf also incorporates three redundant and hot-swappable 1,500 wattpower supplies. For DC applications, the shelf also features hot-swappable and redun-dant -48 VDC PEM.

Asis Introduces its Performance Series 6-Slot AdvancedTCA Shelf

www.apc.com



OtterBox Provides Protection for Samsung’s Q1 Ultra and Q1Ultra Premium Family of Ultra Mobile PCs

Otter Products, LLC has introduced theOtterBox 1990, a semi-rugged case toprotect the Samsung Q1 Ultra and Q1Ultra Premium UMPCs from SamsungElectronics America, Inc. As part of theDefender series line, the 1990 safeguardsfrom drops, bumps and scratches whilestill allowing complete interaction with allnavigation keys, I/O ports, camera andwebcam right through the case. Ultra-mobile enthusiasts and businessesemploying ultra-mobile product solutionsnow have even more mobility.

“Mobility without compromising device ruggedness is everything and the OtterBox1990 allows Q1 Ultra and Q1 Ultra Premium users even more convenience on the go,”said Curt Richardson CEO, Otter Products, LLC. “The case provides protection fromdrops and scratches and offers a sense of security so people can truly work anywherelike on the airplane, in a cab, while waiting in line or rushing to a big presentation.”

“Samsung Electronics is very excited about the release of the OtterBox 1990. Samsungstrongly believes that this new solution will generate incremental business for both com-panies, especially as the new UMPC product category continues to expand. Samsungwelcomes our new partnership with OtterBox,” said Bret Berg senior product marketingmanager, Samsung Electronics America, Inc.

Engineered with convenience in mind, the OtterBox 1990 case offers an inter-changeable hand strap on the back that can be switched to the right or left sidedepending on the user. Additional carrying options consist of the Samsung wrist lan-yard, included with Q1 Ultra and Q1 Ultra Premium UMPCs, or OtterBox offers anoptional shoulder strap kit.

The OtterBox 1990 comes in black silicone on a black polycarbonate shell or black sil-icone on a yellow polycarbonate shell. Black cases work for military, emergency services,government or general users, and yellow cases are well suited for construction, fieldforce automation and industrial customers. The case accommodates standard four cell

and extended six cell batteries. An included tethered stylus with external stylus storageand a flip stand for multimedia use provide the ultimate experience and protection inone compact solution.

Carlo Gavazzi Computing Solutions Releases its Complete LineOf 700 Series ATR Enclosures

Carlo Gavazzi Computing Solutions has released a complete line of 700 series AirTransport Rack (ATR) enclosures, engineered for maximum flexibility, durability andcooling in a range of harsh environment applications.

The 700 series ATRs are designed to pro-tect a variety of commercial off-the-shelf(COTS) air-cooled cards, extended tempera-ture cards and conduction cooled militarygrade cards in a variety of deployed environ-ments. Satisfying a variety of thermal chal-lenges, the enclosures can be engineeredwith convection (714 series), re-circulatingair (715 series), conduction (716 series) orair-over conduction (717 series) coolingmethods. For added flexibility, the 716 seriesfeatures configurable conducting walls toaddress the challenging diversity of environ-mental conditions found in the military sector.

The enclosures allow maximum flexibility in configuration of size, cooling and powerrequirements. The 714 series features a modular aluminum frame equipped with solidrivet technology. The 715 and 717 series leverage dip-brazed construction for a sealedsystem protecting the internal electronics from the external environment. All 700 seriesenclosures range in size and weight to meet the varying weight and footprint require-ments of airborne and vehtronics applications. When paired with Carlo Gavazzi’s SystemPerformance Monitoring technology, the enclosures can activate internal heaters in coldstart-ups or control the cooling fans to maintain optimal thermal conditions for the cir-cuit card assemblies.

Providing added ATR format flexibility, the enclosures can be modified to any customform factor, and are available in a range of standard ARINC sizes, from ¼ ATR to 1 ½ATR. Optional configurations for the line of ATR enclosures include modular power sup-ply supporting AC or DC filtered inputs to military specifications, adjustable card cagesfor front panel card or backplane I/O and an avionics tray for both fixed and isolatedmounting for severe shock and vibration environments. The enclosures can support busstructures and platforms in the VME (VITA) and CPCI (PICMG) architectures.

CRU-DataPort Unveils Hand-Held SATA RAID DeviceCRU-DataPort has released the new DataPort 25 hand-held SATA (serial ATA) RAID

removable drive enclosure. Constructed with heavy-duty stainless steel, the DataPort 25line allows users to hot-swap two 2.5-inch SATA hard drives from a 3.5-inchslot in PCs, servers and other devicessuch as digital cameras. By addingRAID functionality to this small-form-factor storage device, users will bene-fit from faster data throughput orincreased data reliability.

"The DataPort 25 is unique becauseof its small size, large storage capacityand rugged design," said Jon Johnson, executive director of marketing, CRU-DataPort."The added functionality of RAID support will enhance customer applications, whichinclude digital video surveillance capture in military and police vehicles, mass transitsuch as busses and trains, and digital audio/video capture and editing in devices likeportable video cameras."

CRU added a hardware-based RAID chip that provides four different settings: RAID 0(striping) for higher performance, RAID 1 (mirrored) for data redundancy, concatenatedso the drives appear as a single logical unit and JBOD for maximum capacity of storage,which can be as high as 640 GB based on current drive capacities. RAID levels are con-figurable on both the removable drive carrier and on the receiving frame, allowing mul-tiple carriers to have different RAID settings.

"RAID can help reduce the chance of losing sensitive data due to drive failure,"Johnson said, "But that data still needs to be backed up to another storage device forprotection against total loss."

Totech Super Dry Introduces Two 1 Percent Dry Cabinet Models MSD handling specialist has introduced several

advanced 1 percent RH models. Designed to helpmeet the formidable challenges associated with IPC J-STS-033 for handling of moisture sensitive devices,the XSD series delivers a host of premium perform-ance features, precision measurement, 24/7 data log-ging and ergonomic touch screen operator interface.

The SDR series combines the features of the XSDin a configuration that accepts full feeder trolleysfrom all pick and place manufacturers, a majoradvantage to factory floor logistics. Both productsdeploy self-regenerating desiccant, widely regardedas a safe, reliable, energy-efficient and virtually main-tenance free dehumidifying technology.

6

www.elma.com


Staco FirstLine Options Cabinet Can be Tailored to PowerDistribution Requirements

The new FirstLine OC power distribution cabinet from Staco Energy Products Co. pro-vides comprehensive flexible power distribution. This unique options cabinet, which iscustomizable to fit virtually any application, reducesinstallation time by providing maintenance bypass,branch circuit distribution and voltage transformation ina single cabinet.

With up to 96 branch circuit breakers with or with-out main panel disconnect circuit breakers, theFirstLine OC simplifies the installation, moving orchanging of electrical equipment. UL 1778 listedFirstLine is well suited for power distribution needswithin data centers, industrial plants, commercial facili-ties, lighting applications and more.

Safety is assured with true wraparound bypass forsystems maintenance. Three interlocked switches pro-vide complete removal of power from the UPS cabinetwithout dropping the critical load. With top, bottom,and side cable entry options, FirstLine can be installedin raised floor or non-raised floor environments. Snap inbreakers simplify the installation of branch circuits, and spacious wire ways reduce thecost of installation. Computer grade grounding also eliminates the need for additionalgrounding, thus saving installation time and costs.

“With standard features and options, the FirstLine OC can be tailored to specific cus-tomer applications” said Dave Kendall, Staco vice president, sales and marketing. “Byincluding maintenance bypass, branch circuit distribution and voltage transformation ina single, convenient cabinet we’ve simplified installation time and reduced installationcosts. In addition to unrivaled versatility, FirstLine also ensures safety with sequencedsafety interlocks.”

New Ruggedized MicroTCA Chassis from Elma Passes MIL Tests Elma Electronic, Inc. has released a ruggedized ATR chassis for MicroTCA. This chassis

is an ARINC 404A full-size ATR long enclosure, often used in commercial and militaryaviation. The rugged enclosure features modified front panels that can be secured to thechassis. This provides more protection for shock and vibration. Shockabsorbers/dampers can also be added to the enclosure for extra protection. Thermal

management can be achieved via either con-vection or conduction-cooling.

Testing shows the chassis meets the MIL-STD-810E shock/vibration requirements andMIL-STD-461 for electromagnetic interference.The vibration and shock tests were performedaccording to the IEC 61587 1 and VITA 47 stan-dards in six axes (three spatial axes, with thesystem rotated by 180° for each axis).

The backplane holds six AMCs, one MCH(MicroTCA Carrier Hub), and one power mod-ule. Single modules slots in the full size are standard, but other configurations are possi-ble with the enclosure’s modular design. The compression-mount version of the signalconnectors are used

The MicroTCA.1 and MicroTCA.2 specifications for Rugged MicroTCA are still in draft.Elma is offering the ruggedized MicroTCA ATR for early development/testing until thesespecifications are completed.

New Easy-Mount Plastic Enclosures from TekoThe new Teko Smartbox range offers electronics engineers a versatile and low cost

housing solution. These universal enclosures are available with external mounting ears,which allow fast mounting to walls,machines, furniture or any vertical or hori-zontal surface, without the need to openthe case. Typical applications will includeremote sensing and detection devices, RFequipment, switching units, security devicesand connection nodes.

Smartbox enclosures are molded in high-impact polystyrene (UL 94 HB) and twostandard colors are offered, off-white orblack. The cases consist of a top and basemolding which are assembled by self-tapping screws. The thin base part is available withor without two mounting ears, and the deep top part includes internal screw pillars forPCBs. The top part can be machined for LED, switches and connectors.

A range of 32 individual models is offered including eight standard sizes with exter-nal dimensions from 2.244 by 1.496 by 0.787 inches to 5.039 by 2.520 by 1.614 inches.The Smartbox cases without the mounting ears are well suited for hand-held or table-top devices.


7

http://www.itw-air.com

EMI/EMC/ESDEMI/EMC/ESD


FCI Develops Economical D-SUB Shielded Hood Series FCI has expanded its range of high-

performance, traditional D-sub shieldedhoods with an economical series. Thisnew product is well suited for indoor sig-nal or power applications requiringrobustness and/or high EMI/RFI perform-ance in the industrial and telecommunica-tions markets.

"The simplified connector design resultsin a lighter connector and allows forreduced assembly time, which can yield upto 20 percent reduced total applied costwhile still providing the high level of per-formance that FCI's customers have cometo expect," said Luc Maillet, global product manager, FCI Electronics.

This D-Sub shielded hood is designed with an optimum number of pieces: two half-metal covers in zamack (zinc alloy), two jack screws and a steel fiber-reinforced plasticstrain relief for EMI/RFI screening and mechanical cable retention. The strain relief workswith cable diameters from 4.0 mm to 13 mm. With just two screws to fasten, assembly isfast and easy, allowing for reduced labor costs.

The D-Sub shielded hood series is available in 9, 15, 25 and 37 position versions. Thehoods can withstand an operating temperature from -40°C to 120°C and are UL94V-0qualified. FCI's full line of D-Sub hoods includes plastic, metallic coated plastic andmetal straight and right-angle versions.

3Gmetalworx Offers Numerous RF and EMI PCB-Level Shielding Products

3Gmetalworx is offering three product configurations for PCB-level shielding require-ments. Included in these configurations are basic shielding cans, single cavity shield setsand multi cavity shield sets.

Basic PCB shielding cans provide low-cost solutions to many RF/EMI shielding require-ments. Basic cans may incorporate engagement tabs, trace/component relief, tun-

ing/access openings, thermal relief and canbe built to nonstandard shapes as required.In cases where irregular shapes produceundesirable openings, inserts can be resist-ance welded into place. Corner seams canbe resistance welded with the addition ofinternal flanges to increase performance.Typical cans, however, do not allow for theremoval of the shield for rework, since theyare usually soldered directly to the PCB.

In cases where a more significant degreeof access is required, a single-cavity fence with a removable cover is recommended.Such fence and cover packages are designed to shield a single circuit area, with thefence soldered directly to the PCB, and a cover that can be removed and re-installed asrequired. Single-cavity sets usually incorporate many product features and can be builtin a wide range of footprint sizes and package heights.

To scale down the physical size and cost of a product, multi-cavity shields are oftenutilized to bring together a number of single-cavity shields, which reduces the overallcost and footprint of the metalwork. Due to the complex nature of such designs and therelated circuitry, multi-cavity designs have removable covers to allow access, and a widecross-section of supporting features such as engagement tabs, trace/component relief,thermal relief, connectors, etc… It is possible to build multi-cavity fence sets assembledfrom dozens of discreet components and having a proportionate number of cavities,opening up a world of design possibilities.

Comprehensive Beryllium Copper Product Line for EMI/RFIShielding from TBA ECP

TBA Electro Conductive Products (ECP) now offers one of the most comprehensiveranges of Beryllium Copper EMI/RFI shielding strips available from a single source. Thecompany's portfolio of BeCu EMI/RFI shielding products is one of the largest standardranges of fingerstock profiles available and, in many instances, the company candespatch from stock. Profiles are available in full lengths (usually 406 mm) or can besupplied cut down to customer requirements.

Fingerstock BeCu shielding strips are available in an extensive range of mountingstyles including clip-on, stick-on, snap-on, special mounting products, low profile andhook-on gaskets and connector gaskets. A wide range of plating options is availableincluding clean and bright, gold, silver, bright tin, bright nickel, zinc/clear chromate andelectroless nickel among others. These plating options ensure compatibility with mostmetals, avoiding any potential problems of galvanic corrosion.

Beryllium copper shielding strips offer excellent spring qualities and long life. Otherimportant characteristics include low closing forces and high attenuation exceeding 100 dBfor many styles. The pure metal BeCu shielding strips deliver superior attenuation com-pared to fabric gaskets. Metal gaskets also offer greater longevity as they are harder wear-ing than fabric types. When used in sliding applications, BeCu gaskets are self-cleaning.

Engineers' Design Packs, featuring small samples of BeCu gaskets presented in an A4folder, are available to help designers choose the correct profile for the job. The compa-ny can also cross refer competitor part numbers so if a customer has been let down bya supplier or their original supplier stops providing the part, TBA ECP is usually able tooffer a direct or very near equivalent replacement.

Complementing its range of beryllium copper shielding strips, TBA ECP also suppliesstainless steel versions of its low-profile and pressure sensitive mounting gaskets. Theseextend the choice of materials available to design engineers and provide hard-wearingand long-lasting EMI/RFI shielding in a wide range of applications.

COTS Commercial Equivalent Single Line Feed-Thru EMI FiltersMeet QPL Requirements

Spectrum Control, Inc. offers COTS single line feed-thru EMI filters that are com-mercial equivalent to M15733-PRF/72, M15733-PRF/73 and M15733-PRF/74. These fil-ters meet all requirements of the QPL,are readily accessible and UL andSemko approved. COTS single line feed-thru filters are offered in both AC andDC models with customizing optionsavailable. Spectrum Control’s AC andDC COTS filters are an economical EMIsolution, providing an excellent sourceof filtering in a compact package andare well suited for the military andaerospace industries.

Spectrum’s commercial equivalenthigh current feed-thru series filter up to500 Amps with an attenuation of 4 to 90dB from 1 Mhz to 1 GHz and voltage ratingsof 130 VDC and 250 VAC. The DC models have C and Pi configurations with Class Y4capacitors and the AC models have C and Pi configurations with Class Y2 capacitors.Both the AC and DC series boast a rugged bolt-in style with a D-shaped bushing foreasy installation.

Send New Shielding Products for Inclusion in Equipment Protection Magazine

Contact Nick Depperschmidt for more information:[email protected].

8

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www.remoteexpo.com

THERMALTHERMAL


Rittal’s Air/Water Heat Exchangers Provide Cooling in Harsh Environments

Rittal Corp. has released a line of air/water heatexchangers, the latest addition to Rittal’s family ofclimate control products. This cooling technology isdesigned for use in a broad range of manufacturingapplications, including those where harsh, aggressiveenvironments such as hot steel or metal dust coulddamage control system electronics. Newlyredesigned, these heat exchangers are virtually main-tenance-free when integrated with a central chillersystem or chilled water supply. There are no filters tochange, condenser coils to clean or refrigerant to check or refill.

Available in both wall-mounted and roof-mounted models, Rittal’s air/water heatexchangers provide added efficiency at ambient temperatures from 1°C to 70°C. Aclosed system that circulates only clean air internally to the cabinet, this cooling tech-nology is compliant with enclosure NEMA 12 rating, ensuring protection against dustand direct streams of water. These heat exchangers provide a wide cooling output rangeof 300 to 5,000 W for every application need. The wall-mounted version is up to 30 per-cent slimmer than previous models, reducing space requirements significantly while stillproviding optimum performance in extreme conditions.

The air/water heat exchangers are available with either the standard Basic Controlleror an optional Comfort Controller. The basic unit controls and monitors functions suchas temperature control, leak detection and fault signal contact. The comfort controlleralso offers temperature display on the unit, a master-slave function, remote diagnosisand two fault signal contacts.

Avoid Downtime with Affordable Enclosure Cooling Vortec has introduced its latest model to its lineup of UL listed, Vortex A/C cooling

systems for electrical enclosures. Requiring only a compressed air supply to operate,the Vortex A/C quickly installs on electrical control panels to maintain enclosure tem-peratures within a range of 80°F to 90°F.

The 5,000 BTUH Vortex A/C model fea-tures dual vortex tube cooling units, eachwith its own reliable mechanical thermostatto provide two-stage levels of refrigeration.To conserve energy, the first stage offers2,500 BTUH cooling capacity and, if needed,a second stage activates to double the sup-ply of refrigerated air to the enclosure.

At a fraction of the size and cost of arefrigerant-based air conditioner, the VortexA/C provides reliable, below-ambient cool-ing in environments up to 175°F. The no-downtime, maintenance-free units incorporate vortex tube technology to convert fil-tered compressed air into a low pressure, refrigerated air stream distributed throughoutthe enclosure. Refrigerated air entering the cabinet provides a light positive purge toseal out contaminants, while hot air is expelled through a relief valve. Even when theVortex A/C cycles off, a purge-air port can be opened to create a slight positive pressurein the cabinet to keep out dust and dirt. As with other cooling capacity models, the5,000 BTUH unit is suitable for NEMA Type 4 and 4X rated electrical cabinets, and canbe mounted on the top or side of the enclosure.

Vette Corp Unveils Coolant Distribution Unit for Data CenterLiquid Cooling

Vette Corp (Vette) has introduced its LiquiCool coolant distribution unit (CDU) seriesfor its data center cooling solutions line. The CDU supports a number of critical func-tions for liquid cooled rack-mounted equipment. In a liquid-cooled system, the build-ing's chilled-water supply should not be a direct source of cooling for data center racks.Instead, the CDU creates an isolated secondary cooling loop that is separated from thebuilding primary chilled water supply.

Controlled by the CDU to stay above the room's dew-point, the secondary coolingloop prevents condensation from forming. Since the CDU controlled secondary coolingloop only contains a few gallons of water, it reduces the exposure of conventional liquidcooling solutions within the whitespace by an order of magnitude.

"Liquid cooling solutionscan dramatically reducedata center cooling energycosts and improve floorspace utilization,” said JoeCapes, datacom facilitiesmanager, Vette Corp.“Coolant Distribution Unitsare an important compo-nent of our LiquiCool datacenter cooling solutionsand provide intelligentmanagement control for upto ten racks of equipment."

Vette's LiquiCool CDUsare available in rack-mounted or free-standing configurations andcome with a one year parts and labor warranty.Additional LiquiCool CDU features include redun-dant pumps and valves, dew point tracking formaximum performance, auto fill and bleed of sec-ondary loop, remote monitoring plug and gomanifold with leak free couplings.

Control Resources Introduces NewFan Speed Control for Four-Wire Fans

SmartFan Cirrus-6 is a digital fan speed controland alarm that offers an off-the-shelf cooling solu-tion for four wire DC fans and blowers. Cirrus-6can control and monitor tach pulses from up to six12, 24 or 48 VDC fans with open collector or 0 to

10

The Ecosaire has added a space-saving direct drive fan, environmentallyfriendly R-410a refrigerant and energy-saving free cooling to its Spacemaker(SM) series of air conditioning equipment for data equipment centers,telecommunications rooms, digital switchgear sites, medical equipmentrooms, electrical rack rooms, Internet server vaults and other critical coolingenvironments. The SM series is available in sizes of two to seven tons.

Besides cooling, unit customization can include gas phase and/or ultravio-let filtration to eliminate airborne contaminants, dehumidification to reducecorrosion-causing condensation, humidification to eliminate static electricity,energy-saving hot gas reheat and many other options factory-interfaced andpackaged for single source responsibility. Larger units up to 40 tons areavailable from Ecosaire’s EC series.

The replacement of previous belt drives or blower configurations by thedirect drive fan reduces the SM series’ already compact footprint by anadditional 35 percent, making it well suited for space-challenged environ-

ments. The direct drive also enables the energy-saving options of a variablefrequency drive (VFD) or electrically commuted (EC) motors.

The addition of free cooling reduces energy costs by up to 50 percent innorthern climates by utilizing wintertime ambient outdoor air and a glycolloop to cool instead of the unit’s direct expansion (dx) refrigeration circuit.For sites with available chilled water loops, the SM series also offers anoptional dual cooling feature where the glycol loop provides primary cool-ing and the dx circuit serves as a redundancy back-up, thus eliminating theexpense of a second unit or two dx circuits for redundancy.

Additional SM series features include a double-wall case construction thatseparates R-value insulation from the air stream to enhance indoor air quali-ty, and the Supervisaire on-board microprocessor capable of either self-suffi-cient controlling/monitoring or interfacing with all protocols of buildingautomation systems.

Ecosaire Adds Direct Drive Fan, Free Cooling and R-410a to A/C Spacemaker Series

www.norenproducts.com


12 VDC control signal requirements. The controller accepts fan speed com-

mands (including on/off) and providesindividual pass/fail fan status via an I2Cinterface. The I2C interface also providestemperature readings from an on-boardthermistor and EEPROM storage. TheCirrus-6 can be configured to control fanspeed based on temperature or analog control signal (PWM, 5.0 VDC).

Configuration of the Cirrus-6 is settable via I2C interface or options can be set at thefactory to customer specifications. Special and custom configurations are available.Benefits of using SmartFan include acoustical noise reduction, energy savings, greaterproduct reliability, increased fan life and improved safety.

New DC Fans Provide Performance and Low Cost for Multiple Applications

In an effort to deliver high volume orders of in-demand DC fan models for industrialand computer equipment designers, Orion Fans has introduced its OD1238 series. These120 by 38 mm fans are available in multiple configurations,including multifunction, high performance, waterproof and theeconomical Challenger version.

The OD1238 series fans are suitable for a wide range ofapplications, including industrial controls, servers, telecommuni-cations, networking equipment, computer equipment, motordrives and cabinets, electronic enclosures and panels.

Optional features available on most models includetachometer outputs, thermal speed control, PWM input, con-stant speed control with variable input voltage, and rotationdetection alarm. Orion's OD1238 series DC fans are available in voltage ratings of 12, 24and 48 VDC. This series can provide a wide spectrum of air flow from 60 to 220 CFM.Orion fans are UL/cUL, TUV and CE approved.

In addition to the standard OD1238 series, Orion offers 120 by 38 mm fans in ninehigh performance versions for increased airflow, waterproof versions for damp or humidenvironments and an economical version for high volume applications. Orion can provideadditional customization or value added services depending on customer requirements.

Anodized Substrate Technology Withstands Higher Voltages,Increases Light Output for LEDs

Providing lighting system design engineers with an improved thermal solution for LEDand solid state lighting systems, TT electronics IRC has enhanced its Anotherm substratetechnology with a thermally efficient glass dielectric mate-rial that withstands higher voltages, and enables increasedlight output for LEDs. Designated Anotherm Plus, theanodized aluminum material enhances thermal manage-ment for power LEDs in applications such as gaming andvending machines, outdoor signage and display, aquariumlighting, emergency vehicle lighting, as well as architectur-al and general lighting.

"Compared to other metal core PC boards, theAnotherm Plus substrates have improved adhesion and pull strength as well as higherdielectric strength, and provide more options for design engineers from a surface stand-point," said Tom Morris, applications engineering manager for IRC's Advanced FilmDivision. "The Anotherm Plus material's high thermal conductivity and low thermalresistance characteristics help increase the LEDs' lifespan."

The Anotherm Plus technology consists of a highly thermally conductive aluminumalloy substrate, with a thermally conductive glass dielectric material that is printeddirectly onto the aluminum substrate, providing added thermal transfer for LED assem-blies that are mounted directly onto the substrates.

FLIR Systems Offers Two New Infrared Cameras for Predictive Maintenance

FLIR Systems, Inc. has added two new offerings to its T-series of infrared cameras forpredictive maintenance. The cameras offer high-performance features at a very competi-tive price making it more readily available to a greater number of electrical andmechanical contractors.

“Infrared cameras have become an importanttool for electrical and mechanical contractorsworking to identify problems before equipmentfails,” said David Francoeur, director of marketing,FLIR Systems. “The real benefit is being able to beproactive. With an infrared camera you can orderparts and schedule repairs as needed, helping savetime and money in terms of maintenance, down-time and lost production.”

The T-250 and T-200 cameras have FLIR’s picture-in-picture Fusion that enhances thevalue of an infrared image by, with a push of a button, allowing the overlay of an infraredimage directly over the corresponding visible image. It makes for easier identification andinterpretation of infrared images. The cameras include 200 by 150 infrared resolution(30,000 pixels), auto and manual focus for different users and various applications, andhigh thermal sensitivity to pinpoint problems quickly. The T-250 offers a touch screencapability for sketching diagrams and marking images, helpful in generating reports.

CPI Passive Cooling Solutions Achieve Green IT Infrastructure Chatsworth Products, Inc. (CPI) is helping achieve green IT infrastructure results with

its CPI Passive Cooling Solutions. With today’s data centers consuming significantamounts of energy to cool increasing density requirements, responsible thermal man-agement practices have become crucial for survival. To overcome thermal issues andhelp achieve green IT infrastructure results, CPI Passive Cooling Solutions used with theTeraFrame Family of cabinets, provide thermal management techniques to maximizecooling unit efficiency, reduce energy costs up to 40 percent and overall energy con-sumption and minimize environmental impact. From small applications with heat loadsof 2 kW per cabinet, to large applications with heat densities beyond 20+ kW, CPIPassive Cooling Solutions provide advanced thermal control with zero points of failure,thus delivering a Tier IV solution.

By isolating hot exhaust air from cool supply air and blocking bypass airflow aroundequipment, CPI Passive Cooling Solutions reduce wasted cooling capacity and maximizethe flow of cool air throughout the cabinet and data center without the need for addition-al CRAC units, in-row air conditioners or risky liquid cooling solutions. Since no additionalpower or plumbing is required, construction costs associated with CPI Passive CoolingSolutions are much lower compared to active cooling solutions.

The hot air isolation achieved with CPI Passive Cooling creates a consistent air tem-perature throughout the data center, eliminating the cabinet’s dependency on closeproximity perforated access floor tiles for cool air. Since CPI Passive Cooling Solutionsutilize 100 percent of the HVAC cool supply air, CRAC unit efficiency is maximized andthe data centers thermostat temperature can be increased, which decreases overallenergy consumption and operating costs, while effectively protecting critical equipment.Due to the 100 percent utilization of HVAC cool supply air and maximized cooling effi-ciency, CPI Passive Cooling Solutions also permit higher heat and power densities to beadded to the data center.

The thermal management techniques used by CPI Passive Cooling Solutions wereestablished through collaborations with innovative and forward-thinking companies tohelp solve their own data center thermal issues. By developing and testing these solu-tions with industry-leading IT equipment manufacturers, financial institutions and ITmanagement organizations, CPI Passive Cooling Solutions have been proven to provideadded efficiency and solve high-density data center cooling problems.

THERMALTHERMAL

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www.eicsolutionsinc.com

THERMALTHERMAL


Jaro Releases Ultra-High-Speed Turbo Fan Jaro Thermal's new AS series of super-

flow turbo fans provides 174 CFM ofchilly-cold air in a thin 25 mm design.The pancake design utilizes a cutting-edge system of aerodynamic blades,which are specifically designed andangled to maximize static pressure. Atthe same time, a slick air-gliding frameadds additional air flow to create thissuper cooling fan.

At 120 by 120 by 25 mm, the fan iswell suited for server, and other comput-er oriented applications, where high output is required. The fan can also be used in anyapplication that requires high air flow. To exceed today's toughest requirement's, thenew pancake fans feature 70,000 hours of life at 40°C and 65 percent. Options includeon-board PWM control, alarm output, tachometer output, thermistor control, IP55 pro-tection and a choice of connector pre-applied.

HP Introduces Second-Generation Modular Cooling System HP has unveiled a technology that makes data centers more

efficient while increasing system reliability with the newModular Cooling System (MCS) G2, a bi-directional coolingrack. HP MCS G2 adds to data center computing power andexisting cooling infrastructure without adding to the overallheat load. This second generation liquid cooling rack uses a bi-directional cooling technology designed for data centers withdense computing infrastructure and limited space.

Building upon the technology included in the first genera-tion MCS, the MCS G2 can simultaneously cool two serverracks or concentrate up to 35 Kilowatt to cool a single rack.MCS G2 reduces the cost to cool a standard rack of IT gear,as well as decreases the amount it costs to cool the maximum amount of ultra denseservers and blades.

The MCS G2 is integrated with HP’s Systems Insight Manager and is configurable withservers and storage via Fatory Express service. The unit has been decreased to 15.8 gal-lons per minute for maximum cooling, while keeping lower operational costs. Additionalfeatures include an expansion rack CTO, adjustable temperature set point, a polycarbon-ate front door and an automatic door release mechanism.

SubZero Engineering Releases Data Center Ceiling PartitionSystem Dubbed the RackHat

SubZero Engineering has released its first data center ceiling partition system dubbedRackHat, enabling data center managers a greater ability to separate hot and cold airbetween rack rows. Energy savings through superior airflow management has savedSubZero customers 25 percent on a typical installation. Computational Fluid Dynamicsstudies performed by SubZero Engineering has revealed that most legacy data centersrequire a better way to ensure that hot exhaust air does not re-circulate into the coldintake aisle. The Rack Hat ceiling partition system will further drive data centersimprovements in reaching total hot and cold air separation.

“The Rack Hat is experiencing unprecedented deployment success,” said Larry Mainers,director of SubZero Engineering Research and Development. “No where else can cus-tomers find such a simple easy to install solution that fits any data center ceiling grid.”

SubZero Engineering has preformed numerous CFD’s on data centers across the USwith one consistent reoccurring issues, loss of cooling capacity due to the mixture of hotand cold air. According to Mainers this mixture is what leads to Latent Cooling Penalty.

“Latent Cooling Penalty occurs when the energy required to remove heat at the airconditioner is transferred first to removal of humidity,” said Mainers. “This situation ismade even worse when significant hot and cold air mixing occurs in the data centerbecause the lower temperature air returning to the CRAC unit looses more moisture inthe cooling process than warmer, unmixed air would. Thus, the need to separate hotand cold air as much as possible.”

SubZero engineers started to module air flow with partitions above the racks andbetween the hot and cold aisle. The affect was the hot air was forced to move aroundracks and thus not mixing with the cold intake airflow. Intake temperatures changedinstantly and CRAC units worked less, thus saving energy and adding cooling capacity.

Bass VRI’s High Temp Furnace Camera System is Capable ofSevere Service Environments to 4,000°F

Bass VRI has introduced the new BassCam CF serieshigh temperature camera system. This high temperatureimaging system is designed as a long term solution foreffectively managing furnace/boiler operation, mainte-nance and performance.

BassCam CF series cameras are designed for demandingand severe service applications. Environments that requirevisual inspection or verification in extreme temperatures upto 4,000°F are just the right fit for BassCam CF series cam-eras. Forward and off-axis viewing direction, allow great flexibility in adapting to virtuallyany furnace/boiler system. Lens optics from 20° to 120° wide and insertion lengths up to72 inches are available

Expanded Temperature Sensor Line Features Wide Range ofSizes and Configurations

Red Lion Controls, Inc. has expanded its line of rugged thermocouples and RTD tem-perature sensors, with more than 50 new sensor models available in various sizes andconfigurations. Sensors can be easily combined with tem-perature meters, controllers and a complete line ofaccessories, including connectors, transmitters and exten-sion wires, to deliver robust solutions for a wide range oftemperature measurement and control requirements.

Thermocouple and RTD sensor models offer numerousconfigurations for increased versatility in diverse applica-tions. Models include a series of quick-disconnect tem-perature probes featuring both miniature and standardsize connector terminations. Probes are available innumerous calibration types, sheath materials and diameters and are supplied with a mat-ing female connector.

New RTD sensor models, utilizing the latest technology to provide high-performancetemperature sensing with outstanding accuracy, include the TMPRT001 surface mountsensor with an advanced design that easily withstands high vibration environments. Plus,the new TMPRTOO2 pipe plug RTD sensor delivers reliable operation in pressure vesselapplications. Both RTD sensors feature optional mini-connectors for simple installation.

“With 50 new thermocouple and RTD sensor models, Red Lion now offers the diversi-ty to act as a single source for challenging temperature sensing applications includingpressure vessel, extruders/molding and packing machines,” said Jeff Thornton, Red Lionproduct manager. “Plus, a complete line of accessories and rugged construction provideexceptional flexibility and durability further enhancing our rugged, complete line of tem-perature meters and controllers.”

Sensor models are compatible with a variety of optional connectors, making sensorssimple to install and use for plug-and-play operation in many applications. TMPTRN two-wire connectors feature built-in signal amplifiers to convert signals to a standard 4 to 20mA output for use with J, K and T type thermocouples and connectors are available toaccommodate RTD sensors as well. Additionally, TMPCN standard size and miniaturequick-disconnect connectors come in both male and female termination options for usewith ANSI type J, K, T or E thermocouples.

12

www.chatsworth.com


THERMALTHERMAL

13

ThermalSolutionsShowcase

Chatsworth Products, Inc.Nicole McLawhorn,PR/Advertising SpecialistPhone: 252-635-4264Fax: [email protected]

Chatsworth Products, Inc.

Chatsworth Products, Inc. (CPI) is a leading manufactur-er of systems designed to organize, store and secure ITinfrastructure equipment. As an industry leader, CPI setsthe BENCHMARK by delivering superior structuralsupport exceeding customer expectations through inno-vation, function and performance. Our product lineincludes Rack, Cabinet and Enclosure Systems, ThermalManagement Solutions, Zone Cabling and WirelessEnclosures, Wall-Mount Systems, Cable Management,Cable Runway and Tray, Power Management, Electronics,Monitoring and Security, Grounding and Bonding andSeismic Protection Systems. Unequalled service and sup-port, and a global network of industry-leading distribu-tors, assures customers that CPI is dedicated to deliveringsolutions designed to meet their needs.


Degree Controls, Inc.

DegreeC provides intelligent cooling solutions to addressthe heat generated by densely packed electronics for avariety of industries. We use sophisticated thermal analy-sis and computer simulation to design and manufactureproprietary fan trays and intelligent controllers critical tothermal management and system reliability. We call thisIntegrated Thermal Management (ITM). We also offerdesign validation and reliability testing along with compli-ance testing to all relevant standards, including UL/CSA,NEBS, and CE requirements.

Much of our expertise involves airflow — sensing, meas-uring, simulating, and ultimately managing the flow of air.We also provide a range of products and services for non-thermal applications where precise airflow is critical.

Degree Controls, Inc.18 Meadowbrook DriveMilford, NH 03055 USATel: (877) 334-7332www.DegreeC.com


Kooltronic, Inc.30 Pennington-Hopewell Road Pennington, New Jersey 08534 609 466-3400 www.kooltronic.com

Kooltronic, Inc.

Kooltronic, Inc. was founded in 1956 to fill the need forcooling in the emerging electronics and computer indus-tries. The Company pioneered the development of spe-cialized blowers and fans as well as closed-loop coolingfor harsh industrial applications, with the first specially-designed Air Conditioners and Heat Exchangers forsealed enclosures introduced in the early 1960s. Sincethen, KOOLTRONIC has evolved into a substantial tech-nology company, specializing in the innovative design andproduction of both forced ventilation and closed-loopcooling for all types of enclosures containing electronic,medical, industrial, telecommunication and other heat-producing equipment.


Noren Products, Inc.1010 O’Brien DriveMenlo Park, CA 94025Phone: 866-936-6736 or650-322-9500www.norenproducts.com

Noren Products, Inc.

EFFICIENT COOLING OF ELECTRICAL PANELSAND ENCLOSURES USING THE COMPACT CABI-NET COOLER by NOREN PRODUCTS. REMOVESWASTE HEAT WHILE KEEPING OUT CONTAM-INANTS USING HEAT PIPE TECHNOLOGY

Noren Products manufactures air-to-air and air-to-waterheat exchangers for cooling electrical panels without lettingcontaminants inside (including washdown, and hazardouslocation). COMPACT CABINET COOLERS prevent fail-ures/downtime caused by overheating electronics. Norenunits are easy to install, low maintenance, freon free andcost a fraction of air-conditioning. Nema 12, 4, 4x,Stainless Steel, UL, CUL, CE available.www.norenproducts.com .


Vortec • ITW Air Management10125 Carver Rd. Cincinnati, Ohio 45242 800-441-7475 www.itw-air.com

Vortec/ITW Air Management

Vortec, an ITW company, was first to develop technologyfor converting the vortex tube phenomenon into practi-cal, effective industrial cooling solutions. Since then,Vortec has continued to refine and expand vortex tubeapplications, as well as develop air amplification productsfor more efficient use of compressed air in cleaning andconveying applications. Requiring little or no mainte-nance, Vortec products are backed by an unprecedented,10-Year Warranty on all of the core, compressed air itemsmanufactured. The Vortec line of innovative productsincludes Vortex Coolers and the all-new Vortex A/C forcompact and highly reliable thermal protection of electri-cal enclosures and control panels.


STEGO, Inc.1395 South Marietta Parkway #800Marietta, GA [email protected]

Stego, Inc.

STEGO is a leading manufacturer and supplier of ther-mal management products and accessories for enclosures.With multiple locations world-wide, our focus is on pro-viding off-the-shelf and custom solutions to innovativeOEM's and distributors. Our product line includes con-vection and fan assisted heaters, filter fans, tempera-ture/humidity controls, lights and other accessories foruse in enclosures. Most of our products are designed forDIN rail mounting, with functionality and quality in acompact design in mind. Our engineers have the knowl-edge needed to assist customers in their specific applica-tions. With our open approach towards innovation, wewill continue to provide superior products and solutions.


Precision Quincy Corp1625 W Lake Shore DriveWoodstock, IL 60098815-338-2675pqsales@precisionquincy.comwww.precisionquincy.com

Precision Quincy Corp.

Precision Quincy Shelters offers full service design andengineering along with our line of custom manufacturedequipment shelters and cabinets. Guaranteed compliancewith all codes, programs, specifications and zones.

We give our customers top equipment value for theirmoney, while maintaining a friendly personal customerrelationship, both during and after the project is success-fully completed.


EIC Solutions, Inc.1825 Stout Drive Warminster, PA 18974 USA-800-497-4524 [email protected] www.eicsolutions.com

EIC Solutions, Inc.

EIC Solutions manufactures a complete line of electron-ic enclosures and solid state, thermoelectric air condition-ers designed to protect PC's and other types of industrialcontrol equipment from harsh environments. We special-ize in providing innovative and cost effective solutionsdesigned to protect your investment. EIC's products areused in virtually every industry.

EIC Solution’s products and services include electronicenclosures, thermoelectric air conditioner, compressor-based air conditioners and air conditioned transit cases.


Thermshield LLC

Thermshield, LLC is a global supplier of thermal manage-ment products and EMI/RFI materials since 1990. Ourcooling product line covers a broad range of solutionsincluding stampings, board level and custom high ratioextruded heat sinks, bonded/folded fin, skived fin heatsinks, heat pipe assemblies, cold plates, cooling interfacematerials and thermal cut-offs (TCO). Our expertise inthermal design technology, along with state of the art soft-ware tools, provides Thermshield with the ability to findeconomical and reliable solutions to difficult thermal prob-lems. For more information contact us today.

Thermshield, LLCP.O. Box 1641Laconia, NH [email protected]

www.chatsworth.com

www.degreec.com


www.kooltronic.com


www.precisionquincy.com

www.stegousa.com

www.thermashield.com

http://www.itw-air.com

POWERPOWER


Eaton Adds to Scalable Pulsar MX Frame Family for ProtectingDense Computing Environments

Eaton Corp. has introduced its new 10 kVA Pulsar MXFrame. Sold under the MGE Office Protection Systemsbrand, Eaton's Pulsar MX Frame is now available in a 10Uconfiguration. Accommodating Eaton's Pulsar MX 5000 RThot-swappable power and battery modules, the Pulsar MXFrame gives users a low-entry cost to scalable power inone easy-to-populate modular system.

As with Eaton's larger 20 kVA 16U (28-inch) frame, thesame power and battery sub-modules can be used forboth the stand-alone Pulsar MX RT 5 kVA uninterruptiblepower supply (UPS) and the modular chassis, which signifi-cantly reduces the entry cost to scalability. Through thisapproach, users can decide to acquire a cost-competitivePulsar MX 5000 RT and migrate to a fully scalable, redun-dant solution using the Pulsar MX Frame while still usingthe original power and battery sub-modules of the original 5 kVA stand-alone UPS.

"The Pulsar MX Frame is well suited for blade servers and dense telecommunicationracks, as the Pulsar MX Frame saves precious rack space and allows users to easily max-imize their UPS investment,” said Hervé Tardy, vice president and general manager,

Distributed Power Quality Division, Eaton. "Whenpower demands grow, users can purchase aPulsar MX 10U Frame and simply populate itwith the original sub-modules. An additional 5kVA power sub-module and battery sub-modulecan be added to quickly scale up to 10 kVA orcreate a 5 kVA system with N+1 redundancywithout having to purchase a completely newUPS. This provides a distinct cost advantage forour customers.”

When the Pulsar MX on-line double-conver-sion power modules are connected in parallelwithin the new Pulsar MX Frame, the power canbe readily scaled from 5 kVA to 10 kVA, withoutdisrupting connected equipment, all within thePulsar MX's compact 10U frame. With up to 9kW or 4.5 kW with N+1 redundancy, this scalablesolution is designed for a rack populated withblade servers.

Using only 3U for the combination of powerand battery sub-modules, the 5 kVA compactrack mount/tower UPS units feature hot-swap-pable battery and power sub-modules, autobattery-test, switched outlets and a multilingualLCD display.

Pulsar MX Frame boasts two communicationslots for versatile, redundant network integration.Eaton's power management software providescoverage for most environments found in high-density computing environments like Linux,VMware and Microsoft Virtual Server. Eaton'spower management software also incorporatesseamless integration with the IBM BladeCenter aswell as the ability to dynamically manage redun-dancy at the protected server level.

SolaHD Introduces STV 200/400KSeries Surge Protective Devices

SolaHD has introduced its STV 200/400K seriesof surge protective devices (SPD). With surgecurrent capacity of 200 to 400 kA per phase, thenew devices are designed to offer industrialplants, commercial and institutional buildings,and data centers the continuous protection theyneed from damaging high-impulse voltage tran-sients and electrical noise commonly found atthe service entrance or at distribution panels.

Featuring the industry¹s highest surge currentrepeatability, the STV 200/400K provides tran-sient protection in all modes (L-N, L-G, N-G) and

EMI/RFI filtering. It utilizes patented circuitry to monitor the status of all protectionmodes, including neutral to ground. Should protection be unavailable in any mode, thegreen LED will be extinguished, and the red LED will be illuminated. In addition, high iso-lation form C dry contacts provide remote monitoring of suppression system failure,under voltage, phase and power loss. Patented suppression integrity monitoring indicatesfailure for both shorted or opened suppression components.

The modular design of the STV 200/400K provides for added installation flexibility,while its design permits installation in industrial locations. The standard enclosure israted NEMA 12 with available options for NEMA 3R, 4 and 4X. Other options include arotary disconnect, transient counter and remote monitor panel.

STV 200/400K devices are UL and cUL Listed. In addition, they are ANSI/IEEE (C62.11,C62.41, C62.45 Categories A, B and C3) and NEMA LS1, ISO 9001 tested. They are avail-able in hardwire, three phase configuration.

Cherokee International Touts Front End/Rectifier with Ultra-High Efficiency at Light Loads

Cherokee International has released its 2,500 watt CAR2512 front end intended forlow profile, 12 V distributed power architecture applications, such as high-performanceenterprise and service-provider switches androuters, mid- to high-end servers and storageequipment. Packaged in a small, 1U-highfootprint and measuring 1.65 by 4 by 14.88inches, the CAR2512 hits an ultra-high powerdensity of 25 W per cubic inch.

The CAR2512 delivers 208 amps, supporting12 V bus architectures that power point-of-load (POL) converters. As a standout feature,the CAR2512 can achieve 90 percent efficien-cy at just 20 percent of load, with a peak efficiency of 91.5 percent, enabling it to surpasstoday’s application-orientated efficiency standards such as the 80 Plus Gold Standard.

The small form factor is designed for space-constrained applications where systemreal estate is at a premium. Up to four units can be mounted side-by-side to deliver10,000 watts of power in just 1U height. Protection features on the rectifier includeinput over and under voltage, output over voltage, over temperature and over current.In addition, a microprocessor-based design allows for automatic fan speed control,which is well suited for optimizing noise levels of sensitive office-environment applica-tions. This model is also available with full I2C communications, providing intelligentmonitoring and control of critical parameters.

"Improving data-center efficiency is a key goal for IT, and Cherokee International hasdesigned the new 12 V, 2,500 watt CAR2512 front-end with efficiencies up to 91.5 per-cent and has placed particular emphasis on light-load conditions where sever applicationstruly operate,” said Mike Wagner, vice president of marketing for Cherokee International.“As an example, we’ve improved the power efficiency through the use of patent-pendingcircuitry and an innovative thermal management approach to allow us to recover almost80 percent of the energy normally dissipated on the secondary side as heat."

GE’s UPS Delivers Maximum Efficiency Greater than 94 Percent,30 Percent Smaller Footprint

GE Digital Energy has released its 750 kVA SG series digital energy UPS, which offersenergy-conscious electrical managers of large data centers and mission critical facilitiesmaximum efficiency greater than 94percent, a 2.5 percent increase fromprevious 750kVA designs and a 30 per-cent smaller footprint.

Operating in a double conversionmode with true continuous on-lineVFI (voltage and frequency independ-ent) operation, the 750 kVA utilizesGE’s Intelligent Energy Management(IEM), which automatically determinesthe most efficient mode of operationfor the Redundant ParallelArchitecture (RPA) system. The 750kVA, compatible with full GE or non-GE systems, also offers front service access with a small system footprint and elimi-nates the need for an input isolation transformer. This reduces maintenance, installa-tion and repair costs.

Developed using GE’s design for Six Sigma methodology, the 750 kVA utilizes the RPAparalleling system to parallel up to eight 750 kVA modules, eliminating single points offailure and increasing system efficiency and reliability. In the RPA system, the UPS is con-trolled in a true peer-to-peer configuration with up to eight modules, using redundancyin all critical elements and functions, resulting in no single points of failure. A zig-zagtransformer also improves voltage regulation during unbalanced load conditions.

The 750 kVA utilizes an optional Simple Network Management Protocol (SNMP) plug-in card, allowing the UPS to be managed with an existing network management systemor with Digital Energy exclusive UPS with non-proprietary service software architecture.Along with delivering energy savings and reliability, the 750 kVA SG series digital energyUPS also utilizes a Space Vector Modulation (SVM) digital control technique to createfaster transient response and low output distortion of 3 percent.

The new UPS achieves more than 5 percent input THD with 6-pulse rectifier whileeliminating the need for an input isolation transformer. The SG series also remotelymonitors and managers power with connections via LAN or the internet.

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Littelfuse 250 VAC Surface-Mount Time-Delay Fuse SeriesImproves Circuit Protection of Printed Circuit Boards

Littelfuse, Inc. has released its 0443 surface mounttime-lag fuse line for over current protection of printedcircuit boards. With dimensions of approximately 10.1by 3.12 by 3.12 mm, these fuses are well suited forapplications with the higher 250 VAC requirement andwhere space is limited.

The fuses have inrush current withstand (I2t) ratingsof up to 127A2s (5 A current rating) along with a timelag characteristic. This means lower probability the fusewill open during momentary overloads, which can add up to lower warranty boardreplacement costs.

The small size characteristic of the 0443 series was designed to be particularly attrac-tive to OEMs of products that have AC inputs for LED lighting, notebook PC poweradapters or any AC/DC power module. The 0443 series offers current ratings from 500mA to 5 A, all with an interrupting rating of 50 A at 250 VAC.

This product series complements Littelfuse's broad line of DC surface mount fuses usedon the secondary side of power circuits, with ratings from 62 mA to 15 A at voltages from24 to 350VDC. Agency approvals of these products include UL, CSA, METI and VDE.

EnerSys Releases DataSafe 16 VFront-Terminal UPS Batteries

EnerSys has introduced the first 16 V front ter-minal battery for UPS markets. The DataSafe 16 Vbattery provides more power in less space, easieraccess and cost benefits.

"EnerSys’ 16 V front terminated valve-regulatedlead acid (VRLA) battery is designed specificallyfor UPS applications," said Steve Vechy, director ofUPS and Utility Marketing at EnerSys. "We thriveon innovations that give our customers everydayefficiencies for better productivity and bottomlines. But, this is also a major step forward for ourentire industry in supporting UPS applications."

The DataSafe 16 V UPS battery is available intwo sizes, 500 Watts per cell (WPC) and 925 WPC.DataSafe 16 V front-terminated batteries requireonly 44 square feet to support a typical 750 kVAUPS system with a full 15 minutes of run time.The VRLA batteries used for UPS applica-tions are designed to back-up the primarypower system, typically supplying power for15 minutes until the backup generator isfully operational. Until now, these batterieswere limited to 12 V batteries.

DataSafe 16 V Front-Terminal UPS bat-teries require 20 percent less space andscale easily to large capacity systems, mini-mizing the number of strings needed forlarger UPS systems thereby reducing costs.The DataSafe 16 V battery fits within manyexisting cabinet designs, eliminating addi-tional expenses for costly slide-out trays orto upgrade from 12 V batteries.

With complete front access and up to 50percent fewer connections, DataSafe 16 Vbatteries offer more simplified installation,access and maintenance than top-terminat-ed 12 V batteries. This less complicatedwiring helps reduce costs.

PDI Releases the Wavestar 500KVA Mission Critical PDU

Power Distribution Inc. (PDI) has addedthe Wavestar mission critical 500 KVApower distribution unit (PDU) to itsPowerPak line. This new design representsan industry first with the ability, throughthe Wavestar monitoring system, to locally

display both PDU critical functions and PDI's branch cir-cuit monitoring system (BCMS) in a single device. TheWavestar monitoring system can provide these points tothe building management system remotely via Modbusor SNMP.

"The Wavestar 500 KVA PDU addresses the marketneed for efficient, intelligent power solutions to serve theincreasing rack power density from blade servers," saidKeith Schmid, president and CEO, PDI. "In addition, wehave integrated market requested features such as a high-efficiency low inrush transformer, front access design toallow for easy infrared scans, compression lugs, plug instyle breakers, hinged panels with two point locks, and bus connections for the trans-former and circuit breakers into this product."

Are You an A, B or C? Your subscription to Equipment Protection magazine may be about to expire.Check your status in the colored box located in the mailing label on the front

cover. Subscribe online at www.EquipmentProtectionMagazine.com.


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HARDWAREHARDWARE


Dirak Introduces New Technology forFastening Sheet Metal Panels

The new 1-035SL captivejoiner 9.5 Snap-Line from Dirakoffers all the benefits of tradi-tional captive screws plusimproved ease of use by theend-user, significant reductionin time of installation andreduction in the risk of dam-age to sensitive electronicequipment housed insideenclosures. The captive joineralso functions as a slam toclose latch, requiring just asimple push of the panelagainst the frame to ensure latching.

Designed for ease of use by the end-user, disengagingthe two panels is achieved by turning the knob 45°instead of the more time consuming traditional screw-ing/unscrewing. The unit can be completely removedfrom both panels on-site and re-installed quickly with asimple push making it well sutied for maintenance appli-cations. Where misalignment is a concern the captive-joiner compensates for tight tolerances that are difficultto achieve. The 1-035SL’s knob design offers a comfort-able grip for actuation and opening and eliminates theneed to install a separate handle. For applications thatrequire restricted access the captive-joiner is also avail-able in a tool (NEBS) operated style.

Traditional captive screws require an insert that canbecome dislodged if excessive force is applied from thecaptive screw. The fallen insert can severely damage theelectronic equipment housed inside the enclosure. Sincethe Captive-Joiner does not require an insert, this problemis completely eliminated. Additionally, secure attachmentto the panel eliminates the possibility of the captive joinerfalling out under extreme vibration conditions and damag-ing sensitive equipment housed inside the enclosure.

A single component design, which combines the func-tion of the captive screw and the captive nut/cage nut,reduces and the installation process by simplifying it. Thefastener is completely installed from the front of thepanel and does not need an insert, so it is ideal for appli-cations where access to the back panel is restricted.Additionally, the unit fits a standard cut-out for 19 inchracks, 9.5 by 9.5 mm, so there is no need to modify thepanel cut-out.

The captive joiner incorporates D-Snap technologymaking it quick and easy to install into the panel. Snap-Line captive joiners do not require mounting hardware or

tools for installation and can be used in blind applicationswhen access to the back of the panel is restricted. Thesimple installation process ensures secure installationresulting in zero defect assembly and the reduction ofcomponents means a reduction of cost and inventory.

New Concealed Hinges for Large Enclosures EMKA has released a heavy duty

hinge that is designed for doors with a25 mm return flange. It is quick andeasy to install either by welding,mechanically attachment or both. Thehinge pin slides for easy door removal,but remains attached to the enclosureby means of an acetal circlip.

In the mild steel version, the doorpart is phosphatized, giving good cor-rosion protection and providing anexcellent surface for powder coatingand is suitable for welding. For out-door applications in corrosive environ-ments, NEMA 4X or GR 487 boxes, astainless version is available.

EMKA’s full smart hardware line of enclosure hardwareis designed to make assembly quick, easy and repeatable.The units include handles and latches (single and multi-point) master keying, lift-off, quick assembly and othertypes of hinges, as well as EMI gasketing.

Card Guide System Provides Stability inHarsh Environments

Triple E Corp's card guide cluster assembly is well suit-ed for enclosure systems and is intended for use in harshenvironment commercial, industrial and military applica-tions. The guide assemblymeets IEEE1101.10 andIEEE1101.11 specificationsand is fully compliant withall Eurocage based systemsincluding VME, VME64X,VXS, PXI and cPCI standards.

The 901 Series card guidecluster features Triple E'spatented all-extruded alu-minum construction creatinga monolithic card guidestructure with exceptional stability and durability com-pared to plastic card guides. The metal card guide com-pletely eliminates flexing and warping problems, providesflameproof protection and better heat transfer.

Card guides in one, two, three or four slot clusters are

easily interchangeable with most plastic card guides forconvenient replacement upgrades. Standard colorsinclude green (power supply), red (CPU) and smooth alu-minum (I/O). Guide versions are available to supportVME board depths from 80 mm to 400 mm, all keying,ESD and alignment pin features.

All-aluminum guide decks provide added stability withanti-rotation front and rear tie bar rails with two tappedholes at each end. Card guide clusters securely attach torails with M3.5 or 6-32 machine screws and all exposedsurfaces are powder coat over clear chromate for addedscratch protection. For higher force applications, anoptional stainless steel inject/eject plate upgrade providesadditional strength achieving virtually unlimited inser-tion/extraction cycles and is recommended for 9U tallPCB's and cards deeper than 220 mm.

Extruded AdvancedTCA Front PanelsOffer Aesthetic, Precise Finish

Elma Electronic, Inc. has introduced AdvancedTCA(ATCA) front panels that offer a more precise and fin-ished look than typical stamped sheet metal versions.Elma offers the extruded ATCA panels in two versions.The first version has a 0.5 mm deep channel for over-lays, typically a printed lexan substrate with pressure-sensitive adhesive on the back side, to be placed. Theother version is for silk-screening /painting and does nothave a channel.

The extruded aluminum panels offer the advantage ofaesthetic, precise square edges. Conversely, the radiusededges of sheet metal panels do not look as attractive. Theround shape creates a visual effect where you can see themetal arching away on the outside of the lines whenpainted. Painting these panels is also difficult as it is chal-lenging to decipher a straight line for masking. The sameproblem exists for overlays.

When an overlay is placed on a sheet metal panel witha rounded edge, the overlay edges may peel up awayfrom the panel. Further, since the overlay is placed on arounded surface, it is more difficult to place it squarelyand accurately. The Elma extruded panel’s channel pro-vides a clean and exact fit for the overlay, preventing mis-alignment and protecting its edges.

The non-channel version is anodized on theoutside of the panel with a clear chromate for anattractive finish. They can also be silk-screened/painted without complications with thepanel’s square edges. Both types of Elma’s ATCApanels are alodined on the inside of the panel forelectrical continuity (EMC) purposes.

In prototyping to low volumes (underapproximately 200 pieces), the costs for extrud-ed aluminum is actually less than sheet metal.Therefore, the customer receives a superiorproduct for fewer costs, up to a certain volume.The panels are designed for ATCA standardboards with an 8U height and 1.2 inches wide.Custom versions are available. Elma also offersfront panels for VME-based, cPCI-based, andMicroTCA architectures.

AFCO Systems Releases HighAirflow Door for DatacenterEnclosure Systems

New ASHRAE specifications calling for 80 per-cent nominal airflow through passive data centercabinet doors often result in trading off stabilityfor greater airflow. But in a breakthrough, AFCOSystems has developed a new door for its datacenter enclosure systems that meet requirementsfor both airflow and durability.

“As we began adopting the new ASHRAE speci-fication, some of AFCO’s customers expressedconcern that the resulting product was too flim-sy,” said Paul Mallia, AFCO’s director of engineer-

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ing. “I challenged our engineering team to come up witha design that would meet or exceed the 80 percent air-flow requirement without sacrificing the ruggedness anddurability associated with the AFCO product line.”

AFCO engineers met the challenge through a uniquecombination of bracing and force-heated aluminumextrusions that provided the maximum amount ofstrength and passive airflow to the cabinet. In addition tothe target goals of durability and high airflow, the engi-neers created a more robust hinging system, accommoda-tions for grounding studs and an overall look that is moreaesthetically pleasing.

Stainless Steel Latch Provides Strength,Convenience for Smaller Enclosures

The addition of a new compact, stainless steel M1-15latch to the line of Southco M1 push-to-close latchesoffers a new option forenclosures thatdemand corrosion-resistant durability in acompact housing to fitsmaller profile doorsand drawers. Pull-tabactuation and push-to-close latch engagement provide fingertip conven-ience for opening and closing. With a 122 pound(545 N) maximum recommended working loadrating, this latch is designed to deliver robust per-formance even in mobile applications where thecontents of an enclosure can shift and create animpact load on the inside of the door.

Cast stainless steel construction provides asmooth, attractive surface that can stand up toharsh marine environments or repetitive washdown and cleaning cycles in foodservice, medicalor industrial applications. Its attractive design andmultiple finish options—polished stainless steel asstandard with brushed nickel, satin nickel, diamondbrass or black available upon request—also make itan option for furniture applications. As part of theM1 family of latches, it provides a consistency oflook and finish that complements the use of otherSouthco access hardware. In addition to the stan-dard non-locking style, a lockable version providesthe option of keylocking access control.

The M1-15 is easy to install in a singe 1.5-inchround hole, and presents a smooth, virtually flushinstalled look with no visible mounting hardware.Provided with a reversible mounting bracket, itaccommodates door panel thicknesses ranging from0.02 inches to 0.75 inches (0.5 mm to 19 mm).

CHTB High Temperature ResistantConnection Blocks from OKW

OKW Electronics haslaunched a new range of hightemperature resistant connec-tion blocks from CamdenElectronics. These aredesigned for making connec-tions that have to withstandextreme temperature condi-tions inside electrical and elec-tronic equipment.

The CHTB connectionblocks are rated 450 V AC. A wide range of 16 dif-ferent blocks are offered including one way, twoway, three way and four way models, and cableinsert diameters of 3.0 mm (32 Amp), 3.5 mm (41Amp), 4.4 mm (57 Amp) and 6.0 mm (76 Amp).Rigid conductors of up to 16 mm² and flexible con-ductors of up to 10 mm² can be accommodated.The two, three and four way models include count-er-bored screw fixing holes for easy mountinginside the cabinet or housing.

The main insulating body of the CHTB series ismanufactured in porcelain (DIN 40685), and has aworking temperature range of up to 1,000˚C. Thecable inserts are manufactured in Nickel-platedbrass and have a working temperature of up to350˚C. The cable clamp screws are manufactured inZinc-plated steel CQ-15 and have a metric thread.

Touch-Safe Power Cage Clamp PlacesEmphasis on Safety and Ease of Use

The two-conductor,feed-through blockfrom Wago providessafe, secure connectionsfor all conductor typesup to 200 A/600 V. AllPower Cage Clampmembers feature a side-entry design, makingthem well suited forconnecting large conductors in space-restricted areas,such as switchgear cabinets.

Termination is simple with one twist of a hex wrench(2/0 or 4/0) or screwdriver (2 AWG) activates the springand clamp. Next, push the locking tab, freeing both hands

for conductor manipulation. A simple rotation releasesthe latch, clamping the conductor in place.

To complement the side-entry design, an availablecomb-style jumper provides safe potential commoning.No tools are needed as the jumper snaps into place, sav-ing wiring time, and associated costs, related to securingthe screws in the bridge-style jumpers used by competi-tors. For easy troubleshooting, the Power Cage Clamp fea-tures a built-in test point and an optional test plugadapter for testing wired blocks. The space-saving PowerTap is also available for safe power distribution to addi-tional loads, it is simply installed into the jumper slot.

The Power Cage Clamp further ensures personnel safe-ty with features such as a shock protector for unusedconductor entries, highly visible test plug covers, as wellas available WMB/WSB marking tags for convenient iden-tification. UL approval is currently pending.

HARDWAREHARDWARE

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FEATUREFEATURE


Chris Severance, Technology Team Leader Chomerics Division of the Parker Hannifin Corporation

Unlike traditional EMI shielding materials made of metal, thermoplastics offer theadvantages of design flexibility, lighter weight and lower density.

Selective plated and painted thermoplastic parts are also used as EMI shields. Platingand painting are done as secondary operations. This lengthens the supply chain andadds cost. A more direct solution is to use a thermoplastic material that has been com-pounded with conductive filler. This allows for advantages of injection molding withoutcostly secondary operations.

In these experiments, several commercially available electromagnetic interference(EMI) shielding thermoplastic materials were evaluated for electrical resistance and EMIshielding. International Electrical and Electronics Engineers (IEEE) test method 299 andASTM D4395 shielding tests were performed as far field shielding tests. A ladder boxconfiguration was used to evaluate near field shielding. Electrical resistance was meas-ured along the surface and through the parts.

Need for EMI ShieldingElectromagnetic interference (EMI) is radiated or conducted energy that negatively

changes an electric circuit’s performance. The EMI wave consists of both an electricalfield and magnetic field oscillating at right angles to each other (See Figure 1)

When this wave contacts asurface it is either reflected,absorbed, transmitted orsome combination of allthree. This is expressed as: SE= R + A +B (1)

Where SE is shielding effec-tiveness, R is the reflectionfactor, A is the absorption fac-tor and B is correction factorfor far boundary reflections.

Most EMI shielding materi-als work by reflecting the EMIwave. This occurs when thereis a large impedance mis-match between the shieldingmaterial and the wave. Thisoccurs for materials with highelectrical conductivity. [1]

The necessity of EMI shielding for electronic devices is increasing rapidly. This isdriven by advances in wireless devices and a proliferation of electronic devices in thehome and in transportation. These devices need to be shielded to ensure their cor-rect operation. Additionally, safety standards are being enacted to limit human expo-sure to this radiation.

Standard EMI TestsStandard shielding effectiveness tests of these composites is necessary to compare

them to metal or plated plastic solutions. Tests can be performed in the far field ornear field and over a wide range of frequencies depending on the desired application.These tests are very effective for the electronic device designer to compare various EMIshield materials to one another.

The issue for the injection molder of thermoplastic shields is to assure parts withconsistent electrical performance are delivered to the customer. The need exists toconduct quality tests to ensure that all parts are shielded. Shielding tests require ade-quate equipment, time and expertise to ensure repeatable and accurate results. Thisis not a readily available option for most injection molders.

Measuring resistance is much easier in all cases. There are several different tech-niques for measuring electrical resistance.[2] Ideally, they would correlate with EMI shield-ing. This article examines how well several standard EMI shielding tests correlate withelectrical resistance tests.

Testing MethodsHigh electrical conductivity thermoplastics can be made by compounding conductive

filler into thermoplastic. Fillers for these materials include carbon fiber, metal fibers,metal plated fibers and metal particles.[8, 9]

Three commercially available EMI shielding grades of PC/ABS plastic were evaluated.The three different grades contained 10, 20 and 30 wt% nickel plated carbon fiber(NiCF). The NiCF was treated with a proprietary sizing chemistry to ensure thoroughdispersion of the fibers in the end part. See Figure 2.

All test parts were molded on a 60-ton Engelinjection molding machine with a general purposescrew. The individual part dimensions are explainedin the individual test descriptions below.

Electrical resistance was measured by methods ofthrough resistance and surface resistivity.

Through resistance was measured on a 6.35 cmdiameter by 3 mm thick disc. The disc is placedbetween two 51 mm gold plated probes that areattached to an ohmmeter. 358 kPa was applied tothe sample. The resistance after 15 seconds underload is recorded. See Figure 3.

Surface resistivity was measured using the probedescribed in MIL-DTL-83528C. [7] The same 6.35 cmdiameter by 3mm thick disc from the through resist-ance measurement was used. The probe wasattached to an ohmmeter. A load of 145 kPa wasapplied to the probe to ensure good contact withthe specimen. Resistance was measured after 15seconds under load.

Shielding effectiveness was measured per ASTMD44935, a modified IEEE 299 standard, and theLadder Box method.

ASTM D4935 is a standard method for testing farfield shielding effectiveness [6]. A 13.3 cm diameterby 1.5 mm thick disc of NiCF filled polymer is put inan enlarged coaxial transmission line. This is placedbetween a signal generator and a receiver. Shieldingeffectiveness is found from the change in receivedpower of the sample. A frequency range of 100to 1,000 MHz was examined.

The Ladder Box (Figure 4) was developed as amethod to test near field shielding to mold smallhandheld devices. The test method uses a mold-ed part consisting of three five-sided cavities thatare a square with a length of 3.8 cm. An electricalconductive gasket is applied to the top of each ribwall. This is then mated against a printed circuitboard with an antenna for each cavity. A networkanalyzer is used to measure shielding effectivenessfrom one cavity to the other.[3]

IEEE test method 299 describes a test methodfor testing the EMI shielding of complete electronicdevices. [5] This test method was modified to test flatplaque. A 13.3 cm diameter by 1.5 mm thick disc ofsample material is mounted to a test fixture to cover acircular opening. An arrangement of four blind holenuts and bolts is used to attach the disc. See Figure 5.A receiving and transmitting antenna are placed onemeter from the test fixture. A power measurement ofthe transmitted signal is measured for several frequen-cies. This measurement is subtracted from the power measurement of the open refer-ence to obtain shielding effectiveness at each frequency. Three samples were measuredfor material.

18

Electromagnetic Shielding for Thermoplastic CompositesAn Evaluation of Standardized Electrical Resistance Tests

Figure 1

Figure 2: Conductive Thermoplastic

Pellets

Figure 3: Through Resistance Test

Fixture

Figure 4: Ladder Box Shielding Method

Figure 5: IEEE 299 Far Field

Shielding Evaluation Test

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ResultsGenerally, it was found that through resistance provides a better correlation than

surface resistance for all shielding tests. Type and fit of the correlation between shield-ing effectiveness and electricalresistance varied across the fre-quency sweep. This may be due tothe increased within test variabilityof surface resistance compared tothrough resistance.

Results of shielding and resist-ance data are shown in Tables 1and 2, respectively. As expected,electric resistance decreases andEMI shielding effectiveness increas-es as the filler level increases.

Surface resistance data has morewithin test variation than throughresistance. The coefficient of varia-tion, which is standard deviationnormalized by average, for the sur-face resistance measurements ismore than 2X that of through resist-ance. Additionally, test variation islowest for all tests at the 30 wt per-cent NiCF material. There is a weakpositive trend with coefficient ofvariation and NiCF wt percent.

Figure 6 is the plot of shieldingeffectiveness versus through resist-ance for the three polymer grades.The curves for ladder box methodand ASTM 4359 both have signifi-cant negative correlation betweenshielding effectiveness and electri-cal resistance. Data from IEEE 299gives a curve with very little slope.These trends are also true for sur-face resistivity.

Shielding effectiveness is a func-tion of frequency applied. This isevident from looking at the data inTable 1 and the plot of the data inFigures 7 and 8. Examining singlepoint shielding effectiveness or anaverage shielding effectivenessacross a frequency sweep can bemisleading. For example, 30wt per-cent NiCF and 10wt percent NiCFhave very similar average IEEE 299shielding results, 62.6 dB and 62.2dB. Examining the entire curveshows very different behavior across the frequency range. 10wt% NiCF yields lower shieldingeffectiveness values than 30wt percent NiCF at fre-quency lower than 4,000 MHz but higher shieldingeffectiveness at frequencies greater than 8,000 MHz.

This behavior changes the correlation betweenelectrical resistance and shielding effectiveness.Figure 9 shows electrical resistance plot againstshielding effectiveness for each individual fre-quency tested. The slope of the plot shifts from

positive to negative over the frequency range. At some frequencies there is no trend asthe 20 percent NiCF gives the highest shielding effectiveness.

This behavior is not as pronouncedfor the ASTM 4935 and Ladder Boxshielding effectiveness tests. For thesetests, shielding effectiveness vs. resist-ance shows a negative trend across theentire frequency. This may be a func-tion of test frequency, the ASTM testhas little overlap with the IEEE 299 test,or it may be a function of test setup.The tests do give different results fromeach other in terms of the magnitude ofthe shielding effectiveness values. ASTMD4935 yields the highest values for all three materials and Ladder Box yields the lowest.

ConclusionsThe data presented show that is difficult to predict shielding effectiveness with

resistance measurements alone. Shielding effectiveness is not a single point but a curveover a frequency range. The frequencies of interest must be understood and definedto ensure the behavior at those frequencies.

ASTM 4935 and Ladder Box shielding effectiveness test show greater demarcationbetween the materials tested than IEEE 299. Surface resistivity has more within test variationthan through resistance. Additionally, the magnitude of results is very different from the dif-ferent EMI shielding tests even at the same frequency.

References1. Chomerics, EMI Shielding For Military/ Aerospace Electronics. 1998 2. B Braumgarter, EOS/ESD Technology, February/March, (1989) 3. Chomerics, Electrically Conductive Elastomers Volume Resistivity Measurement Procedures, (1995)4. R Foster and D Rich, The Proceedings of the IMAPS/SMTA Conference, (2002)5. IEEE Std 299 IEEE Standard Method for Measuring the Effectiveness of Electromagnetic

Shielding Enclosures (1997)6. ASTM D4935-99, Standard Test Method for Measuring the Electromagnetic Shielding

Effectiveness of Planar Materials, (2001)7. MIL-DTL-83528C, Gasket Material, Conductive Shielding Gasket, Electronics, Elastomer,

EMI/RFI General Specification For (2001)8. P. Dave and D. Chundury, Journal of Injection Molding Technology. Vol. 1, No 3 (1997)9. W.S. Jou et al. ANTEC 2004, (2004)10. Interference Technology, Fall 2006.

AcknowledgmentsAdapted from a paper presented at ANTEC Conference, Cary, NC in May 2006. CHOMERICS and PREMIER are registered trademarks of Parker Hannifin Corp.

Author BiographyChris Severance is a Technology Team Leader for Chomerics Division of the Parker

Hannifin Corp. He has a MS in Plastics Engineering from University of Massachusetts-Lowell and a BS in Chemical Engineering from the University of New Hampshire. He hasworked on processing and developing conductive polymer composites for the last eightyears. He may be reached at 781-939-4346 or [email protected].

FEATUREFEATURE

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Table 1: Shielding Effectiveness Data

Table 2: Electrical Resistance Data

Figure 6: Through Resistance vs. Shielding Effectiveness

Figure 7: Frequnecy vs. Shielding Effectiveness for

30 percent NiCF

Figure 8: Frequnecy vs. Shielding Effectiveness for

10 Percent NiCF

Figure 9: Log Resistance vs. Shielding Effectiveness

www.equiptoelec.com

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Troy A. Miesse, Industrial Business Development Mgr.Rittal Corp

Today’s technical measurement and control, communication and data technology sys-tems are extremely powerful with large numbers of complex electronic components thatcan be highly sensitive to electromagnetic influences. Professional planning for electro-magnetic compatibility from the outset is, therefore, crucial to the lasting functional reli-ability of equipment and systems.

The electromagnetic environment in the manufacturing world is presenting seriouschallenges to the operation of equipment and software. As more and more equipment isadded to the manufacturing floor, increased electromagnetic interference is occurring.This in turn results in equipment downtime and reduced productivity.

Currently in Europe electromagnetic compatibility (EMC) laws regulate conditions forimporting, marketing, installing and operating any equipment that can cause electromag-netic interference or that can be influenced by such interference when operated. In fact,since Jan 1, 1996, the compliance of a device or system with the protection require-ments of EMC legislation must be documented by the CE symbol on the device or sys-tem. This mounting pressure is forcing the US and other countries to conform to EMClaws and is making electromagnetic interference a serious issue.

Electromagnetic InterferenceElectromagnetic interference (EMI) is an electromagnetic disturbance that interrupts,

obstructs or otherwise limits or degrades the effective performance of electronic equip-ment. This interference is the result of electromagnetic energy that is emitted into thesurrounding environment through the operation of electronic devices. Interference canhave a variety of impacts, including: improperly functioning or non-functioning equip-ment and the inability to collect accurate data.

As equipment becomes faster and controls are placed in smaller spaces where thereare shorter distances between components and cables, electromagnetic interference isbecoming a much more serious problem for equipment on the manufacturing floor.Switching times are getting shorter and pulse edges are becoming steeper, resulting inhigher currents and voltage frequencies. Also, controls and components are consumingless energy (i.e., lower operating voltages and currents), which means these controls andcomponents can be more readily influenced by interference. All this adds up to poten-tial EMI problems that need to be realized and addressed.

Electromagnetic interference can be measured by EMF (electromagnetic field) meters.These meters measure interference in gauss units of magnetic field strength and theycapture the frequency bandwidth of electromagnetic interference in Hz.

Sources of Electromagnetic InterferenceElectrical devices which operate in an electromagnetic environment with other devices

may be both transmitters (source of interference) and receivers (potentially susceptibleequipment) of interference energy. The transmission of electrical energy from one circuitto another is known as coupling. Electromagnetic interference is generated from internaland external man-made sources as well as by natural sources such as lightning or electro-

static discharges. The man-made types of interference are typically grouped into two cat-egories: line conducted (line path) and field induced (radiated path).

Internal man-made EMI sources are influences that are carried via common lines suchas power supply, grounding, etc. Line path interference can be caused by: capacitivecoupling, inductive coupling or electromagnetic (EM) wave influence. Capacitive cou-pling is caused by unintended capacitance between conductive structures, which belongto different power circuits. Inductive coupling is caused by energy transfer from one cir-cuit to another through a shared magnetic field, produced by currents which are chang-ing fast (switching) or by electrostatic and flash discharge. EM wave influence is thecombination of both capacitive and inductive coupling with interference voltages onlines that cause electromagnetic waves.

External man-made devices and equipment create radiated path interference thatadversely impacts electronics. Types of field interference include: magnetic sources thatoperate with low voltage and high currents, producing a low-frequency magnetic field;electric sources that operate with high voltage and low currents, producing a low-fre-quency electric field; and electromagnetic wave sources which combine magnetic andelectric fields to produce a high-frequency wave. Examples of these types of interfer-ences are show in the table below.

EMI ShieldingShielding in enclosures helps eliminate electromagnetic interference and helps pro-

tect electronics enclosed within them. While there are no EMC standards for enclosuresin the United States, there are some FederalCommunications Commission (FCC) regulationsabout the amount of electromagnetic interference asystem can emit. Different levels of EMI require dif-ferent levels of EMI protection to promote magneticand electrical attenuation, or the reduction of signalamplitude from any EMI disturbance. The idealshielded enclosure offers slot/gap-free electricallyconductive surfaces that have corrosion protection,are reliably bonded to all removable parts such asdoors, lids and roofs and provide protection againstthe ingress of dust and humidity.

EMI shielding effectiveness (SE) is measured interms of decibels with the decibel value equaling theratio of measurements of electromagnetic fieldstrength taken before and after shielding is in place.Every 20 dB increase in SE represents a tenfoldreduction in EMI leakage through a shield.

Common applications that use EMI shielded enclo-sures include: communications, digital test measure-ment systems, drives (pump motors) and instrumen-tation. Typically, the anticipated interference range ofsuch electronic systems is somewhere within 10 ft ofa device. Most electrical units will list their anticipat-ed interference ranges, depending on their respectivemanufacturer’s requirements. By using the appropri-ate EMI shielding, possible damage to sensitiveequipment and inaccurate data results can be avoid-ed as well as disruptions in an environment. A widerange of electromagnetic compatible (EMC) enclo-sure options exists for varied applications. The dia-gram on the opposite page shows examples ofshielding for electromagnetic interference sources.

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Planning Ahead for EMC Is Vital for EquipmentProtection and Reliability


www.schroff.us/midas


EMC Shielding SolutionsEmpty sheet steel housings offer users the best conditions for EMC correct control

installations. These enclosures already offer a shielding level over a wide frequencyrange and can be used for most applications. These standard sheet steel enclosures pro-vide shielding against electrical fields to provide sufficient EMC protection when lowelectromagnetic interference is encountered. To avoid wiring-induced influences or toadd additional shielding against high frequency electromagnetic fields, wire meshscreens and EMC cable clamps/ connectors can be added to the standard enclosure. Acomposite material can be used inside gasketing that shields and seals between theenclosure frame, door, roof, walls and base.

An enhanced level of EMI protection for enclosures can be achieved via the use ofadditional electrical connections, such as ground straps and brackets between the enclo-sure and the doors/walls. The objective is to solidly bond all housing parts continuouslytogether to form a secure “Farad’s cage” that will effectively block EMI. Special attentionshould be given to long narrow slits or openings, as these will leak more radiation thana simple hole of similar area.

A high level of shielding against EMI can be achieved by an enclosure frame or enclo-sure body of sheet steel that is constructed with a conductive aluminium zinc surfacecoating. The outside surfaces of this enclosure, including the rear wall, roof and door,are coated with an aluminum zinc finish for corrosion protection. On the zinc-coatedinside surfaces, self-adhesive EMC/NEMA/IP combination gaskets provide completebonding throughout the cabinet. Standard zinc-coated cable entry panels rest on thesame gasket to provide continuous bonding. All cable entry/exit points in the enclosureshould be properly grounded and shielded to maintain the EMC protection.

There are a variety of EMC enclosures, including junction boxes, instrument enclo-sures, racks and freestanding cabinets. Additionally, a variety of EMC accessories are

available such as EMC ground straps, cable entry connectors, cable ties and fan and filterunits. Zinc galvanized components such as mounting panels and gland plates also workwell to maintain a solid bond throughout the system. A well-planned combination ofenclosures and accessories is the best way to guard against EMI.

Plan aheadAs global requirements begin to change, electronics and design engineers need to

look ahead at what is being built and where it is going to be applied, what atmosphereit is going to be in and what pre-existing conditions apply. The right EMC-shielded enclo-sure and system design strategies will provide equipment protection, reliable equipmentoperation and environmental stability.

Rittal Corp., headquartered in Springfield, Ohio, is a part of Rittal GmbH & Co. KG - taleading enclosure manufacturer. Rittal’s complete product offering includes industrialenclosures, 19 inch electronic components, climate control, power distribution, data com-munication and telecommunication/outdoor products. For more information please visitwww.rittal.com or 1-937-399-0500.

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Practical EMC Tips When Handling Components That Emit InterferencePractical EMC Tips When Handling Components That Emit Interference• Inverters available on the market today make it impossible to maintain a level of radi

interference suppression without a radio interference suppression filter at the main input. Linefilters also boost a system’s resistance to interference.

• Cables between an inverter and a motor must be shielded: Shield contact on both sides.

• Metallic components in the enclosure must have a large surface area and should be connectedto one another with a high level of RF conductivity. Avoid surface finishes that have high electrical resistance levels.

• Relays, contactors and magnetic switches installed in the same circuit must be connected viaarc extinguishing combinations or overvoltage-limiting components.

• Analog control leads should be shielded on one side and contacted inside the enclosurewhere possible. Ensure low-resistance connections across a large area.

• Digital signal cables should be shielded on both sides across a large area with low resistancecontact. In case of differences in potential, an additional equalizing conductor should be laidparallel. Separable connections must always be equipped with metal-cased connectors.

• Avoid excess loops on all connection cables. These could result in RF short circuiting of theabove measures. Unassigned strands in the cable should be connected to potential equalizationat both ends.

• Unshielded cables in a circuit, i.e., outgoing and return conductors, should be twisted against symmetrical interference sources.

• Physically separate hot and cold cables at the planning stage. Pay attention to the motor cable.

• The cable routing in an enclosure should be as close as possible to the reference potential;“free-floating cables” act as both active and passive antennae.

www.sorbothane.com

www.strikesorb.com

FEATUREFEATURE


Gary Silk, Director of Sales and MarketingStego, Inc.

Condensation – An Overlooked Cause of FailureMoisture as a result of condensation, especially when combined with aggressive gases

and dust, causes electrical and electronic components to corrode and fail prematurely.This problem can affect any components housed in electrical or electronic cabinets andenclosures. Electrical and electronic systems are at risk wherever humidity is present andvariations in temperature occur. Corrosion caused by condensation creates a destructivecascade of events which include changing contact resistances, flashovers, creepage cur-rents, and reduced insulation properties. The end result is system failure.

Up to a relative air humidity of 65 percent, the probability that condensation willform remains low. Condensation events can be reduced substantially by keeping theenvironment inside an enclosure at a temperature as little as 9°F (5°C) higher thanthat of the ambient air.

The higher the ambient air temperature, the more invisible water vapor it can absorb.Even if the amount of water vapor remains the same, the air will become saturated asthe temperature drops. When the air can no longer hold the water vapor it contains, ithas reached the “dew point” and a condensation event occurs.

Outdoor equipment is particularly at risk since condensation occurs with the shiftbetween warm daytime and cooler nighttime temperatures. Greater damage can bebrought about by condensation caused by seasonal climatic changes or by the sud-den temperature drops associated with changing weather fronts. Even indoor sys-tems can be susceptible to the formation of condensation through humidity andtemperature variations.

Enclosure Heaters and Control DevicesHeaters are typically applied to enclosures that house electronics for two reasons.

One is to keep the electronics above a safe operating temperature, typically 32°F or 0°C.The second is to control condensation and keep water vapor from condensing on elec-

tronic components. To function most efficiently, heaters should be operated in conjunction with control

devices such as thermostats, hygrostats, or a combination of the two. The purpose of thisarticle is to focus on condensation control and to compare the use of thermostats andhygrostats to determine which control device is best for controlling condensation.

Thermostats have been the most commonly used control device. This is due primarilyto the fact that thermostats are relatively low cost. In fact, thermostats are the mosteffective device when the objective is to keep the enclosure interior above a definedminimum safe operating temperature. When used to control condensation, however,thermostats are essentially a blunt instrument. They will get the job done but in orderto be effective when controlling condensation, the thermostat must be set to a temper-ature that is above the highest dew point temperature in a given geographic area.

Dew points have been recorded in North America as high as the low 80°F range andare common in the mid 70°F range. Using thermostats to control condensation giventhese high potential dew points means that any time the actual dew point is lower thanthe set point, the heater really does not need to be energized “on”, and two negativeside effects occur:

1. energy is wasted and since energy costs money, money is wasted, and 2. heater and thermostat life is reduced, resulting in premature replacement and con-

sequently more wasted cost.

Heating Requirements of a Typical ApplicationOne representative application is in motor-operated high voltage switches utilized by

electric utility companies to switch high voltage power along transmission and distribu-tion lines and at substation locations. Typically a NEMA 4 enclosure houses the motoroperator, which is comprised of various electronic and electro-mechanical components.Enclosure sizes vary but a common size is 36 by 24 by 10 inches. Engineers wanting todevelop one product solution that can be applied throughout North America mustdesign the thermal management system to handle ambient temperatures as low as -40°F(-40°C) and, as mentioned above, the system must accommodate dew points in the high70°F range.

For purposes of keeping the enclosure interior at a safe minimum operating tempera-ture, common practice is to keep the interior of the enclosure at or about 40°F (4°C) toallow for tolerance error of the control device and provide some safety factor. To main-tain the enclosure interior at or above 40°F (4°C) in this example, a heater with at least700 watts of heating power would be required. This same heater would have enoughcapacity to also control condensation since high dew points and low temperatures donot occur simultaneously. Although the heater would have to heat the interior of theenclosure to a higher temperature when controlling condensation, the ambient temper-ature would also typically be higher so that the temperature rise would be similar to (ormore likely, less than) heating the enclosure to 40°F from a -40°F ambient.

In order to isolate the condensation control aspect of the thermal management sys-tem, it is necessary to focus on the operation of the heater only at temperatures abovethe minimum safe operating temperature of 40°F (4°C).

Controlling Condensation Using a Thermostat When using a thermostat to control condensation, in

order to cover all potential condensation events, itwould have to be set to the high 70°F range. For pur-poses of this example, a temperature of 77°F (25°C) hasbeen chosen. The heating power required to raise theinterior temperature of the enclosure in our examplefrom the base heating level of 40°F (4°C) to 77°F (25°C)is approximately 335 watts. Only when the dew point isactually at 77°F is the 335 watts of heat really needed.Energy and heater life are being wasted during all occur-rences when the dew point is below 77°F. In order toprecisely determine the amount and cost of the wastedenergy, an extensive study on a location specific basiswould need to be conducted. Due to time and cost lim-itations, some conservative assumptions have been usedfor comparative calculations.

If it is assumed that the heater is running 50 percentof the time due to the fact that the ambient temperatureis below 77°F (25°C) but above the minimum safe oper-ating temperature of 40°F (4°C), the basis to determinehow much energy is used and the cost of that energy can

be established. This correlates to a total of 4380 hours of an 8760 hour year that theheater will be operating due to the thermostat being set at 77°F (25°C) vs. 40°F (4°C).

Using the required 335 W of heat and the current average cost of energy in the U.S.,which is about 9.0 cents per kilowatt hour, approximately 1,467 kilowatt hours of elec-tricity, is used per year to eliminate condensation incidents at a total annual cost ofabout $132 per motor operator. As noted earlier, the more the heater is used will alsoreduce its overall life, thereby adding to total system cost.

Controlling Condensation Using a HygrostatA hygrostat operates like a thermostat with the exception that the hygrostat will open

or close a contact energizing the heater based on a relative humidity set point. Using ahygrostat to control condensation changes the equation dramatically since it onlyrequires about 9°F (5°C) of temperature rise to eliminate a possible condensation event

Condensation Control in Electronic Enclosures -Thermostats vs. HygrostatsThe Energy Savings Alone are Enough to Justify the Decision

Figure 1: Example of a ther-

mostat regulated heating unit


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at any dew point level. [Note: the 9°F increase is anaverage value, the actual value may be slightly higheror lower depending on the ambient temperature andrelative humidity].

If a hygrostat is set to energize the enclosure heaterat any humidity level above 65 percent R.H., then theheater will only have to raise the interior of the enclo-sure 9°F (5°C) to prevent a condensation event. Againassuming that 50% of the time, relative humidity willbe above 65%*, then the heating power required toraise the temperature by 9°F (5°C) is 81 watts. Usingthe same numbers from the above example (4,380hours by 81 watts = 355 kilowatt hours) at the same9.0 cents per kilowatt hour would mean that the costof controlling condensation using a hygrostat would beabout $32 per year. Compared with the $132 per yearby using a thermostat, this yields a cost savings of about$100 per year. The cost of the hygrostat is about 4.5times the cost of a thermostat but that increasedcost is made up many times over using a hygrostatinstead of a thermostat.

Making the assumption that relative humiditywill be above 65 percent half of the time is a veryconservative assumption. Assuming that relativehumidity was above 65 percent for a lesser per-centage of the time, which is more realistic,would in fact result in the cost savings associatedwith using a hygrostat being even greater as theheater would be energized less than 50 percentof the time.

Ideal Control – Thermostat and Hygrostat forElimination of Condensation

In geographic areas of North America wherethe temperature gets colder than the electronicsminimum safe operating temperature, thermostat-ic control of the heater is essential. In the fewgeographic areas where a minimum safe operatingtemperature is the only concern a thermostat is infact the ideal heater control device. In areaswhere the temperature stays above the minimumsafe operating temperature of the electronics butwhere relative humidity exceeds 65%, then ahygrostat is the most appropriate device to con-trol heater operation. However in most areas,seasonally cold temperatures and opposite seasondew points above 65 percent are common. Inthese areas, a dual-function hygrotherm is theoptimum control device.

A hygrotherm combines the functions of a ther-mostat and a hygrostat, so that the same heaterwill be energized either when heat is required dueto low ambient temperatures or when the relativehumidity is high enough to cause a condensationevent. However, the hygrostat will allow the heaterto remain de-energized when conditions areacceptable inside the enclosure resulting in signifi-cant energy savings and extending the life of thethermal management system.

ConclusionElectric utilities are increasingly concerned

about conserving energy to eliminate additional

capital investment in generation capacity. All other industries are simply trying to con-serve to save money due to the high cost of energy. The time to re-think how cabinetand enclosure heaters are controlled is now and the hygrostat and hygrotherm devicesshould be evaluated on more than a first cost basis. Lower operating costs also result ina “greener” control system strategy.

Stego is a leading manufacturer and supplier of thermal management products andaccessories for enclosures. With multiple locations world-wide, our focus is on providingoff-the-shelf and custom solutions to innovative OEM's and distributors. Our product lineincludes convection and fan assisted heaters, filter fans, temperature/humidity controls,lights and other accessories for use in enclosures. Most of our products are designed forDIN rail mounting, with functionality and quality in a compact design in mind. Our engi-neers have the knowledge needed to assist customers in their specific applications. Withour open approach towards innovation, we will continue to provide superior products andsolutions. For more information contact Stego, Inc. at 770-984-0858, [email protected] www.stegousa.com

Figure 2: Example of a hygrostat

regulated heating unit

Figure 3: Example of a heating unit con-

troled by both a thermostat and hygrostat

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Rajesh Nair, Chief Technology Officer, Degree Controls, Inc,

In an electronic product consisting of circuit boards,mechanical enclosures and air filter, the airflow throughthe product can be represented by a simplified electricalequivalent as shown in Figure 1. The pressure, P, createdby the air mover generates airflow through the enclosure.The impedance faced by airflow is mainly constituted bythree factors:

• Mechanical structures in the chassis such as cardguides, intake and exhaust air vents and flow deflectors (Rc)• Circuit boards with components and heatsinks (Rb)• Air filter (Rf)

The first two listed items, remain constant for a givenconfiguration of shelf and boards deployed in the lab orfield. The third item, the air filter, exhibits increasedimpedance as the filter gets blocked with dust.

Rf usually starts as a fraction of the rest of the systemimpedance, (Rc + Rb). Over time as the filter becomescontaminated, its contributed impedance can rise to becomparable or higher than the chassis and board imped-ances combined. This results in a significant drop in air-flow with time. The relation between increase in systemimpedance and airflow drop is shown in Figure 2. Thisdrop is caused primarily due to clogged air filter.

Today, electronic products are getting hotter andsmaller. In these products with extremely high heat densi-ty, a drop in airflow due to filter blockage, if not detectedin time, can cause overheating and damage of devices. Inhigh availability products for telecom, military and med-ical applications, it is very critical to detect a blocked fil-ter and initiate filter change. In this article, we willapproach different ways of determining the change in air-flow impedance caused by air filter.

Dust Arrestance and Filter ResistanceDust Arrestance is the ability of a filter to remove par-

ticulate or gaseous material from an air stream. A test isperformed where synthetic dust of known dust sizes isintroduced in an air stream of 300 FPM face velocity.Incremental known amounts of dust are introduced andthe filter is weighed to determine percentage ofarrestance. The filter arrestance is defined as (change inweight of filter) / (total dust introduced). This is normallypresented as a percentage.

As the filter gets blocked, its resistance increases. Filterresistance is defined as the pressure drop across it (inchesof water column) at 300 FPM face velocity.

As shown in the next two plots of data from real test,the percentage arrestance remains reasonably constantover a large mass of dust collected. However, the resist-ance could rise ten times higher with blockage. Thatmeans, to push 300 fpm of face velocity through a shelf,the fan has to work extremely hard under 1 inch of watercolumn pressure. This pressure is normally higher thanthat from the shelf and circuit board combined.

Estimating Air Filter BlockageThere are two immediate effects caused by air filter

blockage: Drop in airflow and increase in temperature rise

through the shelf. Airflow through a shelf is a related to the system

impedance. The temperature rise is a function of availableairflow. Therefore, it is possible to estimate filter resist-ance directly through airflow or indirectly through tem-perature rise.

The most common approach for initiating filter changeis a simple time-based change. This assumes that the rateof change of filter impedance is known, such that in agiven time, such as six months, the filter has blocked to aknown level. This is quite far from how things work. First,constant filter blockage rate assumes known dust densityand airflow through the shelf. Environment of use ofequipment can vary so much that in six months filterscould be over-blocked in certain installations whereas, itcan still be clean in other locations. Time-based filterreplacement is not recommended for high-power, high-availability equipment.

Temperature Based Filter Blockage DetectionSeveral products currently in the market use air tem-

perature sensors at the intake and some at the exhaust ofa shelf, therefore it is possible to monitor the averagetemperature rise (ΔT) in some shelves. In addition to filterresistance, the temperature rise also depends on heatload and fan speed (airflow). In a system with constantpower load and fan speed, this temperature rise can beused for estimating filter resistance.

In several shelves the temperature measured isnot used for fan speed control. So, using fan andtemperature information for filter blockage detec-tion is quite difficult unless there can be a centralcontrol unit.

Detection of Air Filter Blockage in Electronics Enclosures

Figure 1: Electrical equivalent circuit representing airflow

through an electronic enclosure

Figure 2: Airflow through a shelf with clean and dirty air filters

Figure 3: Method for determining dust arrestance of air filters

Figure 7: An intelligent thermal controller is used to

monitor filter resistance

Figure 4

Figure 5

Figure 6


Using an intelligent fan controller that can monitortemperatures at inlet and exhaust and has the capabilityto control fan speeds, it is possible to estimate filterblockage through temperature rise. For such a reliablemonitoring system to work, the heat load has to stay con-stant such that the temperature rise is purely assigned tofilter blockage. Difference in circuit board configurationin a shelf or its usage level can cause difference in heatload. In systems with varying power loads such as telecomor server equipment that have different network traffic atdifferent times, estimation of filter blockage through tem-perature rise and fan speed alone can be tricky.

Airflow is the primary factor that is affected by filterblockage. Therefore, airflow is a better parameter for esti-mating filter resistance.

Airflow Based Filter Blockage DetectionAs shown in Figure 8, airflow (current) generated in a

shelf depends on pressure across the fan (voltage)and flow impedance (resistances Rc, Rb and Rf).Airflow is not affected by the heat generated byelectronics in the shelf. Therefore, by measuringairflow under a given fan performance and shelfcircuit board configuration, the filter resistancecan be estimated. Using a thermal controller thatmanages fan speed a simple index such as air-flow/fan speed can represent the filter resistance.There are several sophisticated algorithms thatcan accurately monitor filter resistance. Thesemethods can compensate for other factors such asshelf configuration and altitude of installation.

Shelf configuration can affect the airflow resist-ance offered by the shelf and circuit boards.These variations can be easily compensated by ini-tializing the controller to measure and store air-flow levels at different fan speeds for any givenconfiguration using a clean filter. These initial con-ditions for different configurations may berecalled by the controller and the right one usedat installation.

A thermal management system, as shown inFigure 10, designed for use in high-power and high-availability system has several valuable features:

• Manages temperature at multiple locations.The controller can identify the worst case locationand adjust fan speed to bring that location backto acceptable levels.

• Synchronizes fan speeds such that beat noise andvibration can be nearly eliminated. A 60 rpm differencebetween two fans causes noise and vibration of 1 Hz. Thisvibration can cause failure of hard disks, connector con-tacts and device sockets.

• Detects and predicts fan failure. Efficiency of a fan’sperformance is constantly monitored by the controller. Adrop in fan efficiency can be detected early on by thecontroller to enable scheduled maintenance and avoid anemergency service from fan failure.

• Board mounted airflow sensors monitor airflow atcritical locations such as heatsink fins and power devices.

• Monitors filter resistance over time and alarms whenit reaches certain preset threshold.

• Operates in pre-programmed fail-safe modes underfailure conditions such as fan failure, low input voltage,filter blockage or higher ambient temperature.

• Communicates alarms and status with host system

Closing Thoughts:Heat density in electronic products has reached

extremely high levels. However, the maximum tempera-ture many semiconductor devices can handle has changedvery little in the past decades. This makes the removal ofheat extremely important for reliability of operation.

The air impedance of a filter can change with its timeof use. This impedance change causes a drop in airflowthrough the shelf. Detection mechanism of filter resist-ance is a critical part of design of a shelf. Temperatureand airflow based filter resistance measurement methodswere discussed. Airflow is the primary factor that isaffected by filter blockage. Temperature is a secondaryeffect of filter blockage. Therefore, monitoring filterresistance through airflow is the most direct and reliablemethod for monitoring filter blockage.

For more information visit www.DegreeC.com.

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Figure 8: Filter resistance estimation through airflow

fan speed

Figure 9: Airflow variation with filter blockage and

fan speed

Figure 10: Airflow sensor used with a controller to

monitor filter resistance


Ken Tumblison, PresidentBuckeye Shapeform

In the past, OEMs, product designers and engineersbasically had two choices when it came to designing sen-sitive internal components that required an enclosure,design them to fit into a standard, off-the-shelf box, orexpend considerable time, money and effort to have oneor more mill, machining or metal shop modify an enclo-sure or custom build one from the ground up.

Fortunately, today’s forward-thinking enclosure manu-facturers are beginning to think outside of those off-the-shelf boxes and are bringing many product customizationoptions and services in-house. By offering the flexibility tochange everything from the height, depth or width of apre-engineered enclosure case, manufacturers are givingtheir customers the freedom to design their products andapplications without being forced into a standard enclo-sure footprint.

Some manufacturers are even offering detailed cus-tomization services like hole punching, machining and theapplication of self-clinching inserts, along with finishingtouches like silk screening and graphic overlays. As aresult, it’s more affordable and more convenient thanever for an OEM or designer to acquire a case that’s per-fectly configured to a specific product or applicationdesign—and 100-percent ready to install.

Replacing ‘One Size Fits All’ With ‘One-Stop Shopping’So how, exactly, can a manufacturer modify a case?

The answer is, anyway you can imagine. Most enclosuremanufacturers already offer a sizable selection of qualitystandard cases in various materials, sizes, configurationsand styles, such as desktop, handheld and rackmountunits. Sometimes, one of these stock solutions will be justwhat an OEM needs. But more often than not, a standardcase doesn’t quite fit the bill.

Modifications allow better support for product anddesign engineers’ requirements and specifications, downto the very last detail. And they allow customers to geteverything they need—all from one single source.

The Customization Process: from AutoCAD to Zinc Chromate

In certain instances, starting with a standard enclosureand modifying it to fit a customer’s design will work,

other times, it’s best to design the ideal enclosure solu-tion first. Based on the specifications identified, you canthen look for a pre-engineered, standard case, which canbe modified to fit the product. Or, if necessary, you cancreate a completely customized solution from scratch.

To facilitate this first step in the process, some manu-facturers are beginning to either provide or offer theircustomers access to technology-based design and draw-ing services.

Design and Drawing ServicesDesign and drawing services are typically powered by

industry-leading engineering tools and technology, such asAutoCAD. AutoCAD is an engineering software applicationthat manufacturers can use to quickly and easily drawdetailed dimensional illustrations of all the componentsof an enclosure. The drawings specify everything fromheight, width, depth, hole sizes, hold position, hole con-figuration, finish and more. AutoCAD drawings, or theirequivalent, let you know exactly what type of case youneed to house your specific application—and they let themanufacturer know just how to assemble the enclosurecomponents for the perfect fit.

From there, the customization process can include any-thing and everything from creating special case sizes tospecial services such as hole punching, finishing, shieldingand graphic overlays. Some of the in-house customizationservices your enclosure manufacturer may be able to pro-vide include:

Special SizesSome manufacturers engineer flexibility into enclosure

components in order to accommodate special sizing when

a standard size won’t fit the end user’s requirements. Youmay be able to request that the height, width and/ordepth of your enclosure be modified to meet your exactspecifications. If you are using an extruded case, extru-sions can sometimes be cut to specific depths to betteraccommodate your product design.

Self-Clinching Inserts Inserts such as studs, stand-

offs, blind studs, captive nuts,Spring Latches, rivets and rightangle standoffs are available in avariety of sizes and can often beadded to a case in order tomount electronics or hardware.

Punching and HolesYou may want a hole punched into your enclosure in

order to mount internal components or allow for venting.Some manufacturers offer a variety of punches and holesin different sizes, configurations and shapes, ranging fromsquare, to round, to trapezoid. The punches are ideal forcustomizing enclosures made of extruded aluminum, alu-minum sheet or steel sheet.

MachiningA machining process can be used for holes, vents, cor-

ner radius, cutouts, counter boring and other customizedprocesses to extruded aluminum enclosures. Unlike punch-ing, the machining process does not require the material to

be flat. The machining process can also be used tomill enclosure components, such as handles, out ofaluminum bar stock. Most machining is performedbefore metal finishing in order to ensure a uniformfinish coating.

FinishingOften, enclosures are finished with an under-

coat and topcoat to provide a durable and attrac-tive finish that protects your product and helps itfunction at its best. The final use for the productoften dictates the best type of finish to use—aseach finish offers different properties and advan-tages. Your enclosure manufacturer may be ableto provide you with a variety of finishing options,such as:

• Alodine: Ideal on aluminum for paint adher-ence, inhibiting oxidation, and conductivity, alo-dine finishes come in yellow or clear.

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Custom Enclosures: Getting Exactly What you Want in aProtective Instrumentation Enclosure

Using design software, custom enclsoures can be easily

build and prototyped in a number of configurations

Custom punched holes in enclosure panels

Machining bar stock aluminium can produce custom

handles and such as the one above


• Anodize: Anodize finishes are used on aluminum andavailable in clear, black and other colors and are primarilyused for their cosmetic appearance, hardness and oxidiz-ing inhibiting properties.

• Zinc Chromate: The primary functions of this typeof finish include conductivity and rust-inhibiting. Zincchromate is commonly available in yellow or clear andused on steel.

• Paints: Powder and water-based paints can add eyeappeal to your product and allow you to utilize a specificcolor scheme. PMS and RAL colors can be matched, andspecific textures can be achieved with this type of finish.

Vinyl-Clad Aluminum: Vinyl-clad aluminum andsteel provide a very tough yet attractive finish andare ideal for enclosures that require punching.The finish features a lightly textured surface and isavailable in a variety of different colors.

ShieldingShielding protects products by limiting interfer-

ence into or out of an enclosure. It’s particularlyimportant for products that include highly sensi-tive components inside the enclosure or forenclosures that will be placed near other sensitiveequipment or components. The shielding processuses overlapping seams and multiple fasteners tominimize gaps and spaces between enclosurecomponents while ensuring effective conductivityamong components To meet special require-ments, Copper-Beryllium and Metal-Impregnatedgasketing, Copper-Nickel paint and/or additionalfastening hardware can also be used.

MaskingFor plated or painted enclosure components, a

masking process creates a raw contact surface,which is essential for improving the effectivenessof the shielding process. Masking can also helpachieve a specific appearance for your enclosure.

Graphics and Silk-ScreeningYou can really make a product your own with

the application of your company or productname, a logo, or other artwork on your enclosure.Some manufacturers provide graphic overlay andsingle or multi-color silk screening capabilities toprofessionally apply your graphics or artwork andput the final touches on your case.

Case Closed: OEM’s Can Enjoy DesignFlexibility Along with Value-Added Service

Based on all the customization options that arebecoming more readily available from enclosuremanufacturers, it’s easy to see how any OEM—oreven a single inventor working out of his base-ment—can take advantage of cases designed tobetter meet the specific requirements of any typeof product or application.

But the benefits of in-house customizationsolutions don’t end with lifting the constraints onelectrical component and product design.Manufacturers who provide these services at theirshops are also bringing considerable value to theircustomers of all sizes in terms of customer serv-ice, time and costs saved.

Today, we’re seeing shrinking order sizes. OEMsand product designers are more pressed than everfor in-house resources. Customers are demandingfaster and faster delivery times. When an OEM isable to deal with an enclosure-manufacturing

expert who already understands the necessity for uniquesolutions, low-volume or one-off orders and fast turn-around times, time and money is saved compared toplacing and tracking orders with multiple vendors whomay not understand or be able to accommodate needs.

With in-house enclosure customization solutions, OEMsand product designers in every industry win on everylevel. And the manufacturer is rewarded with some prettysatisfied customers.

Kenneth R. Tumblison is president of BuckeyeShapeform. For more than 100 years, Buckeye has beencommitted to providing quality products to OEM compa-

nies of all sizes around the world. Founded in 1902 as theBuckeye Stamping Company, the organization nowincludes Buckeye Enclosures, Buckeye Novelty Cans,Buckeye Knobs, and Buckeye Deep Drawn Technology.Buckeye Enclosures offers a complete line of off-the-shelfinstrumentation enclosures as well as services for modify-ing standard enclosures and creating completely cus-tomized solutions in either metal or plastic material. Foradditional information, contact Buckeye Shapeform at877-728-0776 or [email protected] or visitwww.buckeyeshapeform.com.

FEATUREFEATURE

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Paints and powder coating add aesthetics and func-

tionality to custom enclosure designs

www.antennasonline.com


Global Market for Thermal Management Worth $11.1 Billion by 2013

According to a new technical market research report, “The Market for ThermalManagement Technologies” from BCC Research, the global market for thermal manage-ment was worth $6.1 billion in 2007. This is expected to increase to $6.8 billion in 2008and $11.1 billion by the end of 2013, a compound annual growth rate of 10.3 percent.

Thermal management hardware, including fans, blowers and heat sinks, account formore than 80 percent of the total thermal management market. The other main thermalmanagement product segments (software, interface materials and substrates) eachaccount for between about 4 percent and 6 percent of the market.

The largest end markets for thermal management technologies in 2007 were thecomputer industry (57 percent of total revenues), telecommunications (16 percent) andindustrial/military electronics (9 percent). By 2013, medical and office electronicsshould have moved into a tie for second place with telecommunications, each with a 12percent market share, followed by consumer electronics (8 percent).

The Americas, consisting of the US and Latin America, will maintain their number oneposition throughout the period under review, with a market share of just under 40 per-

cent, followed by Asia-Pacific with around 23 percent to 24 percent. The Asia-Pacificcountries (except Japan) are not only the second-largest market in absolute terms, butthey also have the highest projected growth rate.

The development of the thermal management industry is one of the most interestingaspects of the rapid innovation in the high-tech industry. As pressure to achieve higherlevels of device integration while reducing cost, size and complexity continues, the issueof managing heat and power dissipation has become increasingly significant.

Leader Tech Completes ExpansionLeader Tech celebrated the completion and grand opening of its Global EMI Shielding

Technology Center with local dignitaries, employees, valued customers and specialguests. The expansion project was prompted by a significant increase in both domesticand international demand for the company's EMI shielding products.

“Every detail of our new one-of-a-kind facility has been tailor-engineered to stream-line and improve our customer service, engineering and manufacturing processes” saidDario Negrini, president, Leader Tech. “The new expansion encompasses all facets of thebusiness including people, building size and equipment and has drastically increased our

productivity and capacity across all three of our core product lines includ-ing, board, enclosure and cable shielding.”

In a time when companies are moving away from the EMI Shielding cus-tomer through offshore manufacturing and distribution channels, LeaderTech is staying committed to the US market by continuing to expand itsindustry experienced team, manufacturing technology and US based facility.

“As a core value of our company, we believe that customers are betterserved when they talk directly to a live applications engineer instead of amachine”, said Tim Black, director of dales and marketing. “Personalizedand responsive support coupled with innovative domestic manufacturinghas been and will continue to be the hallmark of Leader Tech’s industry-best engineering and customer support departments.”

OtterBox, a Colorado Company, SupportsNeighboring Tornado Victims

Less than ten miles from the headquarters of Otter Products, LLC., tor-nadoes instantaneously turned lives upside down. Homes, vehicles andbelongings were lost, hundreds were injured and one man even lost hislife. To help a nearby family or families rebuild after the devastation,OtterBox donated 10 percent of online proceeds from sales in June 2008.

Talking to people around town and at the office after the storm, it wasevident the close connections to those afflicted by the tornadoes.

“We are looking for a family or families through the Red Cross, church-es and other organizations to offer our assistance to,” said CurtRichardson, CEO of Otter Products, LLC. “The OtterBox team is a familyand we want to pull together to offer what resources we can to help thosewho have lost so much.”

Parker Acquires Remaining Interest in Parker Seal De Mexico

Parker Hannifin Corp. has acquired the remaining stake in its joint ven-ture, Parker Seal de Mexico. Parker held a 49 percent stake in the $8.3 mil-lion revenue company prior to acquiring the remaining interest from multi-ple joint venture partners. Terms of the acquisition were not disclosed.

“We were very fortunate to have an excellent partner in Mexico for 42years. Now, as the sole owner of this operation, Parker can sell any of itsthousands of seal products into the Mexican market," said Heinz Droxner,president of Parker's Seal Group. "This is part of our long term strategy toserve customers who have operations in Mexico, and positions Parker tomeet all of their sealing requirements in-country."

Parker manufactures seals by various processes in a broad range of flu-orocarbon, PTFE and metal materials for use in liquid, gas, automotive,food processing, medical and electromagnetic shielding applications.

Active Power Receives Certification from ChinaMinistry of Information Industry for Flywheel System

Multiple products in Active Power, Inc.’s CleanSource UPS 300 seriesline has been certified by China’s Ministry of Information Industry (MII).This industrial certification is the result of an in-depth review of ActivePower products and its manufacturing facility by MII inspectors.

“MII certification validates our product integrity as we execute our growthstrategy of native geographic expansion,” said Jim Clishem, president and CEO,Active Power. “According to a September 2007 report from IMS Research,China’s growth will generate a large demand for IT related equipment and inturn UPS systems. As electricity costs and demand on power grids in Chinaincrease, Active Power is well positioned to offer an efficient, reliable andgreen battery free alternative for critical backup power protection.”

The flywheel based CleanSource UPS system is a proven technology withmore than 40 million hours of runtime in field installations across 42 coun-tries. Active Power has shipped more than 1,800 flywheels in systems whichare a reliable, predictable source of energy, providing consistent backuppower for mission critical applications. CleanSource is well suited to oper-ate in environments with challenges presented by power grid fluctuations,with no degradation in service over the systems’ 20 year design life.

INDUSTRY NEWSINDUSTRY NEWS

28

www.interactpower.com

www.integraenclosures.com

www.remotemagazine.com


Laird Technologies, Inc. Holds Dedication Ceremony for NewChennai Manufacturing Facility

Laird Technologies, Inc. hosted a dedication ceremony for its first manufacturing facil-ity in India. The facility, located in the Nokia Telecom SEZ (Special Economic Zone) inSriperembudur near Chennai, was inaugurated today by Shri. L.K. Tripathi, ChiefSecretary to Tamil Nadu Government and Shri. G. K. Pillai, Commerce Secretary,Government of India. Mr. Mike Connor, British Deputy High Commissioner and Directorof UK Trade and Investment for Southern India, was also present for the occasion, aswere top management from The Laird Group PLC and Laird Technologies, Inc.

With an investment of more than $15 Million, Laird Technologies’ 160,000 sq. ft. man-ufacturing facility will employ between 1,000 to 1,200 people when in full production.The manufacturing facility will initially produce antennas, battery packs and EMI shieldingproducts for cellular handset applications for its Indian customers. The company alsoexpects to export the products manufactured at the Chennai facility to overseas markets.

“The choice of Chennai as the company’s first location in India was due to the avail-ability of a skilled work force, support from the Tamil Nadu Government, the presenceof good logistics, excellent infrastructure facilities, lower costs and our close to thecustomer strategy, said Sri Talpallikar, Laird Technologies Managing Director-India.“This new facility will allow us to support ourIndian customers with products in a timely andefficient manner.”

Laird Technologies already supplies products tolarge Indian enterprises in the mobile phone, tele-com infrastructure equipment, computer hardwareand automotive electronics sectors from manufac-turing facilities outside India. By setting up of themanufacturing facility in Chennai, LairdTechnologies is poised to aggressively expand itscustomer base over the next 12 to 18 months inthe rapidly growing market for electronic productsin India.

Sola/Hevi-Duty Changes Name toSolaHD

Sola/Hevi-Duty has changed its name toSolaHD. Complete with a re-designed logo, thenew identity signifies SolaHD's singular mission ofproviding a more comprehensive line of powerquality solutions for industrial facilities worldwidethrough extensive research and new technologies.The name also better communicates the SolaHDpromise to customers to improve efficiencies, pre-serve data and increase equipment longevity.

SolaHD products include surge protectivedevices, power conditioners, transformers andpower supplies that compose and support powerthroughout branch distributions. In addition, itoffers line reactors, power supplies and uninter-ruptible power supplies (UPS) control voltage tosensitive computer and production line equipment.

Pelican Products Acquires KeyAustralian Distributor

Pelican Products, Inc., (Pelican) has acquired anew Australian distributor, Pelican ProductsAustralia Pty. Ltd. The company has served asPelican’s exclusive product distributor in Australiafor the past 20 years. The company, which will berenamed Pelican Products Pty. Ltd. is Pelican’sfirst-ever acquisition and supports the company’scontinued global expansion plans.

“We are extremely excited to formally expandour international business with Pelican’s first everacquisition by bringing our Australian distributionpartner officially into the Pelican Products corpo-rate family,” said Lyndon Faulkner, president andCEO, Pelican Products, Inc. “The owners, Graemeand Lorraine Roberts, have built a great businessand developed a strong reputation for Pelicanthroughout Australia and we owe them a debt ofgratitude for their hard work. As they transitioninto retirement, we will seek to build upon theirsuccess in order to take the Pelican brand to newheights in this region of the world as we continueto build our global reach.”

Until recently, Pelican Product’s leaders havefocused on growing the company organicallysales increases attributable to constant productinnovation and a strong sales force. As the com-pany moves forward, it will augment this growthwith strategic business acquisitions around theworld to bolster Pelican’s position as a global

case and light manufacturer. In addition to the Australian acquisition, the company has enlisted a senior execu-

tive, Christian Nyman, to head up the Australian business unit and expand theAustralian business for Pelican’s International group. Nyman brings a diverse back-ground in B2B and B2C sales with such noted manufacturers as LG Electronics,Siemens, Philips Consumer Electronics and LEGO. Most recently, Nyman managed theAsia-Pacific mobile phone business for LG and was responsible for developing LG’soperator and distribution channel strategies for consumer, enterprise andsmall/medium business markets.

“Pelican has offered me a terrific chance to draw on my past sales management andoperations experience in the Asia-Pacific region to help take the Pelican brand inAustralia to greater heights,” said Nyman. “I believe that we have a huge opportunity toexpand Pelican’s distribution in the region and experience increased revenue growthbeyond the strong levels that the previous owners achieved.”

Send Company News for Inclusion in Equipment Protection MagazineContact Nick Depperschmidt for more information:

[email protected].

INDSUTRY NEWSINDSUTRY NEWS

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WEBGUIDEWEBGUIDE

30


Your online source for high quality electrical enclosures and

electrical supply products. We offer a broad line of UL

approved enclosures made of 304 and 316 stainless steel,

powder coated carbon steel, 5052-H32 aluminum and fiber-

glass reinforced polyester. The stainless steel, aluminum

and fiberglass enclosures are Nema 4X rated, and the car-

bon steel enclosures are Nema 4 and Nema 12 rated.

Full enclosure product line available with pricing and

searchable product database. Order online or by phone.

Use credit card or terms account.

www.elma.com

Elma is a leading manufacturer of electro-mechanical com-

ponents and systems for the Telecommunications, Medical,

Industrial control, Instrumentation and Defense industries.

Elma offers an extensive line of VME, VME64X, VXI,

Compact PCI (CPCI) enclosure and chassis for 19" rack-

mount use. In addition, to our systems products our innova-

tive selection of Eurocard, IEEE1101.10 and front panel

components (LEDs, knobs, test points, etc) is the most com-

prehensive in the industry. Elma also manufactures a pre-

mium line of rotary switches and encoders.

www.equiptoelec.com

Equipto Electronics Corporation is the leading innovator

and supplier of standard and custom designed packaging for

electronics. Its products are used worldwide to house aero-

space, computers, military, manufacturing, networking,

telecommunications and other electronic systems. They are

sold to leading electronics manufacturing companies

through its representatives in the U.S., Canada and Mexico.

Use the convenience of your computer to design, spec,

view, price or print everything you need to know about

Equipto Electronics enclosures and other packaging solu-

tions for electronics. Web site can be used as a resource for

engineering, to establish bills of materials, determine budg-

ets and more. Enclosures include those that meet EMI/RFI,

seismic, FCC, military, TEMPEST, EMP and European

EMC specs. You can also use the Web site to request a free

Equipto Electronics catalog on a disc.


Integra Enclosures is a leading manufacturer of thermoplastic

electrical enclosures. Located in Northeast Ohio, Integra offers

high-quality polycarbonate enclosures in sizes ranging from

6”x6”x4” up to 18”x16”x10” all carrying UL-50 Type 4X, 12, 13

and Marine Use ratings, as well as submersible (6P) ratings in

certain models. Integra also offers innovative options like total-

ly clear covers, fully non-metallic hinging, fully adjustable sub-

panels, and multiple mounting options.

www.lairdtech.com

Laird Technologies is the world's leading producer of EMI/RFI

shielding materials and related products for the telecommunications,

information technology, automotive, defense, and medical equip-

ment industries. The Laird Technologies product line includes com-

prehensive shielding and grounding offerings.

These include engineered board level shields, beryllium copper fin-

gerstock, conductive fabric-over-foam, electrically conductive elas-

tomers in extruded profiles, molded shapes and form-in-place gas-

kets, knitted wire mesh gaskets, air filters and ventilation panels and

microwave absorbers. The company also offers complete EMC and

product engineering and testing services.

Laird Technologies was formed through a series of mergers and

acquisitions involving some of the EMI industry’s leading brands,

including Instrument Specialties, APM, Bavaria Elektronik,

Altoflex, R&F Products and most recently, BMI. The company has

facilities throughout North America, as well as in in China, France,

Germany, Japan, Scotland, Singapore and Taiwan.

Visitors to Laird Technologies' new website will find greatly

improved navigational capabilities. Main content categories are

now accessible from every page!


Founded in 1968, Noren Products has been a leader in

manufacturing products based on heat pipe technology. At

present we have five main product lines, each with their

own design and development staff. For almost forty years

we have been widely recognized for our ability to solve

heat transfer challenges with cutting edge designs.

www.itwvortec.com

In 1961, Vortec became the first company to develop tech-

nology for converting the vortex tube phenomenon into prac-

tical, effective industrial cooling solutions. Our Vortec line of

innovative products includes Vortex Enclosure Coolers and

the new Vortex A/C for reliable, maintenance-free thermal

protection of electrical enclosures and control panels.

Site provides full product information on the Vortec line of

Vortex Coolers and Vortex A/C, as well as other pneumatic

products for cooling, cleaning and conveying; includes

product specifications, dimensions, interactive worksheet

for sizing enclosure coolers, and secure online ordering.

www.zerocases.com

Zero Manufacturing is the leading manufacturer of quality,

deep-drawn aluminum and plastic cases and enclosures.

ZERO’s real product is protection ensuring the safe transport

and viability of valuable equipment and electronics without

compromise. ZERO can meet your needs with one of our

standard products, or through a specialized custom design,

we have the engineering and manufacturing expertise to see

the job through to success. For Unparalleled Protection,

choose ZERO Manufacturing, Inc.


Allied Moulded Products, Inc., manufacturer of the original

fiberglass outlet box, was established in August 1958. Noted

for strength and rigidity, Allied Moulded fiberglass rein-

forced non-metallic electrical boxes and enclosures are

favored by the industry and the company continues to expe-

rience tremendous growth. Since 1958, the demand for

Allied Moulded products has led to several expansions of the

manufacturing facility located in Bryan, Ohio. Along with

the plant expansion, there have been many new employment

opportunities created for the residents of the area.

www.apmhexseal.com

APM manufactures environmenal sealing boots for hazard

protection of switches, potentiometers, & circuit breakers

to IP68 rating. Self-sealing & locking fasteners that seal to

20,00psig internal/external.

Site contains complete ordering specifications, cataloging,

cross refernce charts, & access to CAD drawings for her-

metic sealing boots & self-sealing fasteners.


EIC Solutions Inc., specializes in the design and manufac-

ture of electronic enclosures and thermoelectric cooling

systems. EIC’s industrial enclosures provide protection for

computers and sensitive electronic equipment. EIC also

offers a complete line of compact, lightweight, thermoelec-

tric cooling systems for electronic and computer enclosures

in harsh industrial settings.

Products available, including steel & stainless steel enclo-

sures, unique thermoelectric air conditioners & accessories,

are shown in color. Drawings are available for solid state

coolers & options. One page "Sizing Guide" can be printed

& utilized to determine the best air conditioner for the appli-

cation. And electronic RFQ's can be submitted for all items,

resulting in a prompt & detailed quotation via e-mail.

www.chatsworth.com

Chatsworth Products, Inc. (CPI) is a leading manufacturer

of systems designed to organize, store and secure IT infra-

structure equipment. CPI sets the BENCHMARK by deliv-

ering structural support that exceeds customer expectations

through innovation, function and performance.

CPI’s comprehensive Website (www.chatsworth.com) pro-

vides users with extensive product and solutions informa-

tion along with various state-of-the-art design tools and

layout resources, including CPI s Product Configurator

(www.chatsworth.com/configurator), which allows users

to create customized products and solutions to meet their

specific needs.

www.stegousa.com

STEGO manufactures Thermal Management Products for

electrical and electronic enclosures. We also offer design

assistance and custom products for applications requiring

custom solutions.

Our website offers information about our products and serv-

ices, factory locations and general information about

STEGO. It has recently been redesign and now offers cata-

log navigator capabilities and downloadable CAD drawings.


Precision Quincy, is the leading manufacturer in pre-fabri-

cated shelters and industrial size ovens. Our 200,000

square foot manufacturing plant supplies, OEM s and

direct customers, nationwide, with high quality equipment

at competitive prices.

Precision Quincy s website allows users to easily navigate

through its products, request a quote, and contact the parts

and service s department. The search tab, located in the

upper right corner of screen, allows users to easily search

for a specific product by name or model number.

www.kooltronic.com

Kooltronic offers a full line of thermal management solu-

tions widely used in the data, telecom and electronics indus-

tries. Our products include Fans, Packaged & Centrifugal

Blowers, Fan Trays and Air Conditioners for use in 19

racks, enclosures and electronic equipment.

For over 50 years Kooltronic has been the leader in enclo-

sure cooling. Our online sizing guide makes product selec-

tion easy.

Our online sizing program makes choosing the appropriate

cooling unit easy.Abundant technical information available

for download covering: performance, dimensions and

power requirements, as well as operators manuals and

wiring diagrams.

www.thermshield.com

Thermshield is a supplier of thermal management products

including stamped,extruded aluminum, copper, bonded fin,

skived, folded fin heat sinks, heat pipe assemblies,

EMI/RFI materials and TCO's.

Thermshield's website offers a variety of information

regarding our product lines, local sales representation con-

tacts, along with cross references to board level heat sink

parts and on-line downloadable product catalogs in PDF

formats..



www.apmhexseal.com

www.chatsworth.com

www.eicsolutions.com

www.elma.com

www.equiptoelec.com


www.kooltronic.com

www.lairdtech.com

www.norepproducts.com


www.stegousa.com

www.thermshield.com

www.itw-air.com

www.zerocases.com


CALENDAR OF EVENTSCALENDAR OF EVENTS

31

August4-7, NGDC (Next Generation Data Center)San Francisco, Calif. Contactwww.ngdcexpo.com

11-15, MIL-STD Course 2008, Gaithersburg,Md. Contact www.wll.com

18-21, IEEE EMC, Detriot, Mich. Contactwww.emc2008.org

20-22, Random Vibration and Shock TestTraining, Santa Barbara, Calif. Contact www.equipment-reliability.com

24-27, CableTec Expo, Philadelphia, PA.Contact www.scte.org

September 2008 7-12, Annual EOS/ESD Symposium, Tucson,Az. Contact www.esda.org

22-25, National Manufacturing Week,Chicago, Il. Contact:www.devicelink.com/expo/nmw07

22-28, Assembly Tech Expo, Chicago, Ill. Contact www.devicelink.com/expo/atexpo07

October 2008 3-8, EMC By Your Design - A PracticalApplications Seminar and Workshop,Chicago, Ill. Contact www.dlsemc.com

7-8, Certified Data Center ProfessionalCourse, Denver, Colo. Contact www.theicor.org

13-17, IR Thermography/Level ICertification, Knoxville, Tenn. Contact www.mhm.assetweb.com

20-22, Random Vibration and Shock TestTraining, Redford, Mich. Contact www.equipment-reliability.com

28-31, MIL-STD Course 2008, Gaithersburg,Md. Contact www.wll.com

November 2008 3-7, Inframation, Reno, Nv. Contact www.inframation.org

5-6, Remote Conference and ExpoAtlanta, Ga. Contact www.RemoteExpo.com

Calender of EventsCalender of Events

AD Products...........................................................................15, 30www.adproductsco.com

Allied Moulded Products, Inc...........................................16, 30www.alliedmoulded.com

American Power Conversion......................................................5www.apc.com

Chatsworth Products, Inc............................................12, 13, 30www.chatsworth.com

Degree Controls, Inc...................................................................13www.degreec.com

Eaton Corp.-Pulizzi Products......................................................2www.pulizzi.com

EIC Solutions, Inc...........................................................11, 13, 30www.eicsolutionsinc.com

Elma Bustronic.........................................................................6, 30www.elmabustronic.com

Equipto Electronics Corp....................................................19, 30www.equiptoelec.com

Fibox Enclosures..........................................................................15www.fiboxusa.com

Integra Enclosures................................................................28, 30www.integraenclosures.com

Interact Power..............................................................................28www.interactpower.com

ITW Vortec.........................................................................7, 13, 30www.ITW-Air.com

Kooltronic, Inc.......................................................................13, 30www.kooltronic.com

Laird Technologies...............................................................30, 32www.lairdtech.com

Noren Products, Inc......................................................10, 13, 30www.norenproducts.com

Pentair Electronic Packaging....................................................20www.pentair-ep.com

Precision Quincy Corp.................................................13, 20, 30www.precisionquincy.com

Raycap, Inc....................................................................................21www.raycapinc.com

Sorbothane, Inc............................................................................21www.sorbothane.com

Stego, Inc.........................................................................13, 18, 30www.stegousa.com

Thermshield LLC............................................................13, 14, 30www.apmhexseal.com

Zero Manufacturing...............................................................8, 30www.zerocases.com

www.EquipmentProtectionMagazine.com

Index of AdvertisersIndex of Advertisers

www.lairdtech.com

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