Projektkoordination:Robert Bosch GmbH

Thomas Fleischmannfon +49 7121 35-39527

e-mail: thomas.fleischmann@de.bosch.com

Projektmanagement:edacentrum GmbH

Peter Neumannfon +49 511 762-19383

e-mail: neumann@edacentrum.de

Laufzeit: 11.04.2016 - 10.04.2019Homepage: www.edacentrum.de/trace

Enabling Smart Mobility and Smart Infrastructure by Development of a Technology ReAdiness

Process for Consumer Electronics(TRACE)

Das diesem Beitrag zugrundeliegende Vorhaben wurde mit Mittelndes Bundesministeriums für Bildungund Forschung gefördert.

MotivationStatus:− Functional requirements of innovative automotive/industrial systems require leading edge

semiconductor devices− Underlying technologies not defined, designed or qualified for automotive useEffect:− Reliability of corresponding technologies under automotive load unclear – lack of research− Device assessment and system integration process neither standardized nor aligned through the

supply chain− No accepted definition of „Automotive“ available through the supply chain – lack of standardization− “Old, established” automotive quality assurance processes do not longer match market dynamics

or technology complexityResult:− Over-/under engineering− Innovation barriers− Legal contradictions (eventually technically ok, but forbidden) Design potential limited

Solution / Target:− “New Automotive Definition”− Deployment of consumer electronics under transparent rules / constraints (new automotive

integration process – a Transfer Process)

Technical Core

TRACEMethod

Target System

AnalysisRequirements:

Application/system/module/

component, CE-AE gap analysis, measures

Demonstrator

ToolsModeling & Simulation

Test & Validation

Systems-System architecture, system design and assembly (PCB), housing (2nd level package)

TRACE MethodGuideline for qualification or modification/ qualification of CE components to enable

their integration into AE systems

TRACE Target System Analysis

Consideration of 4 different application/component segments

Systems• System enhancement

concepts

• Hardware architecture /

design upgrade

• Software architecture /

design upgrade

• System test upgrade

Components• Semiconductor technology

upgrade (IC, sensor)

• Circuit design upgrade (IC,

sensor)

• Package upgrade (IC,

sensor)

• Component test upgrade

(IC, sensor)

Quality and supply, cost analysis-Quality management, supply management, cost analysis and modelling

Quality, supply, cost analysis• Quality & Safety Management

• Supply Management

• Cost analysis and modelling

• Life Cycle Assessment

Components-Semiconductor technology, circuit design, design for test, assembly (1st level package)

Modeling & Simulation• Identification of failure

mechanisms & specification

of simulation criteria

• Electrical and electronic

effects

• Thermo-mechanical effects

• Multi-field effects

• Functional deviations

Test & Validation• Identification of possible failure

mechanisms

• Specification of test and validation criteria

• Concepts for improved and/or increased

• Test coverage

• Validation coverage

• Release concepts

Demonstrator1. Detection and Ranging2. Navigation3. Autonomous Infrastructure Interaction

TRACE workpackages