EMI/EMC Design Applications - Ansys · PDF fileEMI/EMC Design Applications ... Conducted EMI...

© 2010 ANSYS, Inc. All rights reserved. 1 ANSYS, Inc. Proprietary© 2010 ANSYS, Inc. All rights reserved. 1 ANSYS, Inc. Proprietary

EMI/EMC Design Applications

Mark ChristiniLead Application EngineerANSYS Inc

Juliano Fujioka MologniLead Application EngineerESSS - Brazil

© 2010 ANSYS, Inc. All rights reserved. 2 ANSYS, Inc. Proprietary

Outline

Introduction

ANSYS Technology for EMI/EMC

Case Study 1 “Simulating EMI/EMC Effects for High Power Inverter Systems”

Case Study 2 “EMI Modeling and Characterization of the Rhino SMPS”

Case Study 3 “Car EMI Interference Cases” by FIAT Brazil


Introduction

• EMI/EMC– Magnetic Field– Electric Field– Conducted Fields– Radiated Fields– Testing and solutions– Simulation is solving EMI/EMC problems both

quantitatively and qualitatively

“Electronics is outpacing the basic construction of these boards . . . we’re going to have to change how we do things.” - Paul Huray, Ph.D.

Professor of Electrical Engineering, University of South Carolina


ANSYS Technology for EMI/EMC

• EM physical design• Parasitic extraction• Conducted EMI• Radiated Emissions• System Simulation

ElectronicsElectromechanical


Alstom High Power Inverter

Case Study #1


• Excerpts from Ansoft Workshop, Inspiring Engineering- “Simulating EMI/EMC Effects for High Power Inverter

Systems”- Emmanuel Batista; Alstom Pearl, Vincent Delafosse, Ryan

Magargle; Ansoft Corporation

• The physical quantities in the inverter that need accurate simulation are:

- Quantity of current going through the conductors- Frequency dependent parasitics (RLC) between

conductors - IGBT characterization curves- Power dissipation- Emitted fields

Alstom High Power Inverter Case Study #1


IGBT Module Pack 3D accurate model

Parameters Extraction

Electromagnetic (EM) study

Design and Couplings Model

IGBT Model

• Tridimensional IGBT pack model and EM study

• Parasitic model extraction

• IGBT circuit model

Far Field Study

• Far Field Study for Electric Field EM

System Configuration


Different modeling techniques are integrated

• Tridimensional IGBT pack model and EM study

• Parasitic model extraction

• IGBT circuit model

• Far Field Study for Electric Field EM

Finite Element Method

Finite ElementMethod

FEA / BoundaryElement Method System Simulation

Analysis Methodology


SheetScan

IGBT Charaterization


E-field @ 100 MHz, Power = 10kW

Simplorer / HFSS Simulation


Rockwell SMPS Conducted EMI

Case Study #2


Rockwell SMPS Conducted EMICase Study #2

• Excerpts from presentation at Ansoft Workshop, Leading Insight– “EMI Modeling and Characterization of the Rhino SMPS” – Carson Baisden, Rangarajan M. Tallam, Gary L. Skibinski:

Rockwell Automation

• Goal: Characterize and reduce EMI emissions from Flyback SMPS– Model SMPS– Determine critical components in system– Determine noise attenuating techniques

• Procedure– Model: Actives and Passives (discrete components and interconnects)– Use simulations to find critical paths– Focus attention on these paths to mitigate noise

Copyright © 2006 Rockwell Automation, Inc. All rights reserved.


Modeling Process

• Model all passive components including transformer with shields

• Model active components from datasheet

• Create geometric model in Q3D and solve

• Create and solve transient model in Simplorer with LISN

• Perform FFT to verify



• Create geometric model in Q3D– Import using interface tool

• Define materials• Define boundary conditions

– Conductors (Nets) to solve the capacitance between

– Terminals (Sources/Sink) solve resistance and inductance

• Solve (C, R, L)• Post Processing

– Export lumped parameters– Matrix Reductions– Field plots

Parasitic Extraction



Parasitic Extraction

• Capacitance Matrix(30 min)

– 1 >10pF– 11 5-10pF– 24 1-5pF– 428 <1pF

• Inductance Matrix: R,L,M(30 min)

– 63 Paths (23 Pri & 40 Sec)– 31 Paths (16 Pri & 25 Sec)



Transformer Shielding

• Where/how to physically place shield

• Where to electrically connect shield

• Size and cost of shield

Add Shield



• Blue elements are input from Q3D and are turned on/off

• 2ns step, 4ms end time• Obtain time domain

solution, voltages in LISN

• Perform FFT for common mode and differential mode EMI

System Simulation



Simulated vs Measured Voltage


SimulatedMeasured

SimulatedMeasured


Reduction of Conducted EMI



FIAT Car EMI Interference

Case Study #3


EMC/EMI Automotive Success Stories by Fiat Brazil

http://www.saebrasil.org.br/eventos/congresso2010/


Full Vehicle EMC / EMI

Understand the emission and susceptibility for devices in cars.– Today 35% of an automobile’s cost is in electronic components.– Electromagnetic Compatibility (EMC) is a critical aspect of the automotive

design.– Predicting EMC performance via modeling and simulation allows for further

cuts in design cost and time and robust engineering.– Vehicles are large and complex and in the past automakers needed to rely on

simplified models, so the question is:

Is it possible to simulate an entire vehicle?


Full Vehicle EMC / EMI

Spark Plug Fields on PT Cruiser

85.00 90.00 95.00 100.00 105.00 110.00Freq [MHz]

0.00

0.10

0.20

0.30

0.40

0.50

0.60

0.70

0.80

0.90

1.00

Volta

geA

tFM

Por

t

Ansoft Corporation HertzianDipoleXY Plot 2Curve Info

VoltageAtFMPort98MHz : FMband

Some distortion from pattern of ideal

groundplane

More distortion from pattern of ideal

groundplane

Even More distortion from pattern of ideal

groundplane

Voltage induced on FM antenna

GPS Antenna Positioning


Wiring Harness

Cell Phone PCB

ELECTRIC FIELD PLOT DUE TO PCB

21

3

FULL VEHICLE EMC ANALYSIS (VEHICLE NOT SHOWN HERE DUE TO CONFIDENTIALITY) AND A CELL PHONE PCB EMI IS SIMULATED. THE INTERFERENCE OF THE CELL PHONE ON THE WIRING HARNESS PLACED IN THE DOOR WAS SUCESSIFULLY STUDIED.

EMC/EMI Automotive Success Customer Stories in Brazil - FiatCell Phone EMI on car doorwiring harness


HFSS + Designer + SIwave: Shielding and EMC Analysis

Dynamically link SIwave to HFSS to plot the field strengths around the

enclosure

SIwave field solution can be used as a radiation source for HFSS

• Radiated Emissionis affected by theexternal Housing

Designer circuit excites Siwave PCB

• RadiatedEmissionfrom thePCB only


Conclusion

• Simulation is an extremely effective method to predict EMI/EMC problems in power systems and will reduce costly prototyping and testing cycles

ANSYS technology provides the most comprehensive state-of-the-art EMI/EMC solution in the industry

EMI/EMC Design Applications - Ansys · PDF fileEMI/EMC Design Applications ... Conducted EMI...

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