Embedded and HMI · to extend and enhance the feature sets of their products. Paul Donaldson...

I S S U E 1 7 0 3

Application Spotlight on:

Embedded and HMI

Component Focus: Pages 3-13 ST’s S2-LP radio transceiver for licence-free bands gives users a link budget of more than 140dB

Circuit Centre: Pages 14-17 Design spotlight: drone technology

Application Spotlight: Pages 18-24 Everspin MRAM: the speed and endurance of SRAM with the non-volatility of Flash or EEPROM

Board-of-the-Month: Page 25 Cypress PSoC prototyping kit offers developers touch-sensing buttons and wireless connectivity

Technical View: Pages 26-27 The proper way to compare a power module with an equivalent circuit built with discrete components

Developing for a drone?Turn to page14 now

to see the Circuit Centre feature!

S T A R P R O D U C T

S E E P R E V I O U S I S S U E S O F F T M AT W W W. M Y- F T M . C O M

Launch of industry’s lowest-power mid-range density FPGA product family

Microsemi has released its new cost-optimised PolarFire™ Field Programmable Gate Array (FPGA) product family, delivering the industry’s lowest power at mid-range densities, and featuring 12.7Gbits/s Serializer/Deserializer (SerDes) transceivers as well as best-in-class security and reliability.

The PolarFire chips are the first non-volatile FPGAs to offer power and cost advantages over SRAM FPGAs that include 10Gbits/s transceivers. The new FPGAs provide cost-effective processing capabilities for the growing number of converged 10Gbits/s ports in networking infrastructure, while consuming much less power than competing devices. They also provide a reliable choice for designers concerned about the threat to deep sub-micron SRAM-based FPGAs from Single Event Upsets (SEUs) in their configuration memory.

The PolarFire’s 12.7Gbits/s transceiver is optimised for area and power: total power consumption is less than 90mW at 10Gbits/s. With best-in-class low device static power of 25mW at 100,000 logic elements, zero in-rush current and unique Flash*Freeze mode for best-in-class stand-by power of 130mW at 25°C, PolarFire devices consume as little as half the power of competing FPGAs in the same application.

The FPGA family also provides the industry’s best reliability due to its inherent immunity to configuration SEUs. Additional features that produce higher reliability include built-in single

MICROSEMIerror correction and double error detection, memory interleaving on large static random access memory, and system controller suspend mode for safety-critical designs.

Security features include an Athena TeraFire EXP5200B crypto-processor for secure data communications, and patented differential power analysis countermeasures which protect bitstreams and keys from being deciphered. An integrated Physically Unclonable Function (PUF), 56kbytes of secure embedded non-volatile memory, built-in tamper detectors with custom responses, and true random number generators add to the security capabilities of the PolarFire FPGAs.

Users of the new PolarFire devices can take advantage of Microsemi’s Libero SoC Design Suite, which offers comprehensive, easy-to-learn development tools. The suite includes a complete design flow with Synopsys Synplify Pro synthesis and Mentor Graphics ModelSim Pro mixed-language simulation with best-in-class constraints management, and Microsemi’s differentiated FPGA debugging suite, SmartDebug. Popular IP solutions for 1G Ethernet, 10G Ethernet, JESD204B, DDR3/4 memory interfaces, AXI4 interconnect IPs and more are available for use with PolarFire devices.

PolarFire: Ideal for use in 10Gbits/s network ports

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APPLICATIONS• Wireline access networks • Cellular telephone infrastructure• Defence equipment • Commercial aircraft• Factory-automation equipment • Smart optical communications modules • Video broadcast equipment• Process control and automation• Machine vision processing and analytics• Programmable logic controllers• Industrial networking • Video and image processing

FEATURES• Multi-gigabit multi-protocol transceivers • Up to 481,000 logic elements • Up to 33Mbytes of RAM • Up to 1,480 18 x 18 multiply-accumulate

blocks with hardened pre-adders• Integrated dual PCIe interface • High-speed I/O supporting DDR4, DDR3L

and LPDDR3/DDR3 memories • Clock and data recovery on GPIO pins to

support SGMII

170302 For samples or pricing [email protected]

F T M T E C H N O L O G Y W A T C HN E W S I N B R I E F

F O L L O W U S N O W – S E A R C H F T M B O A R D C L U B O N

As OEMs intensify their efforts to develop products for the Internet of Things (IoT), designers are facing new challenges that are driving semiconductor manufacturers to extend and enhance the feature sets of their products.

Paul DonaldsonVertical Segment DirectorFuture Electronics (EMEA)

Two of the trends that are most in evidence today are in the field of wireless connectivity, where new capabilities in embedded radios are coming on stream, and in the complexity of embedded software.

Radio technologies for embedded systems have in the past emphasised low power consumption and robust connectivity, especially when operating in licence-free spectrum at frequencies below 1GHz. STMicroelectronics’ S2-LP transceiver, see page 6, is an excellent example of this.

These attributes remain important, but device designers are also increasingly looking for added capabilities in order to provide more valuable information to the user. For example, the LoRa® networking technology now has the ability to show geolocation information, potentially eliminating the need for a discrete satellite positioning IC. The P-NUCLEO-LRWAN1 development system from ST, see page 7, provides an excellent environment in which to experiment with LoRa technology.

In the field of embedded software, the complexity of end product applications continues to grow. At the Embedded World 2017 exhibition in Nuremberg, Germany, Future Electronics is demonstrating IoT streetlight design examples. New smart streetlights will integrate multiple sensors, measuring parameters such as ambient light, temperature and relative humidity and air pollution and detecting the presence of people nearby.

Tiny MEMS oscillators offer low power consumptionMicrochip’s latest DSC6000 MEMS oscillators excel as clock references in small, battery-powered industrial or automotive applications.

Combining low power consumption with high frequency stability and stable jitter performance, the DSC6000 devices are available in a small surface-mount package with a footprint of 1.6mm x 1.2mm. The oscillators provide a frequency range from 2kHz to 80MHz.

AC-DC power supplies in tiny open-frame form factor

CUI has expanded its line of AC-DC power supplies with the PBO family of tiny Single-In-line Package (SIP) open-frame modules. The 3W and 5W versions of the PBO series measure 35mm x 11mm x 18mm.

The 3W PBO models are also available in low-profile, right-angle versions measuring 35mm x 18mm x 11mm, making them ideal for applications in which vertical board space is at a premium.

New TDC offers industry-best combination of speed, precision and powerams has launched a new version of its Time-to-Digital Converter (TDC) offering improved speed and precision together with low power consumption.

TDCs from ams, which can measure short time intervals with great precision, are widely used in Light Detection and Ranging (LIDAR) and laser-ranging devices, in Positron Emission Tomography (PET) medical scanners, and in automated test equipment. The introduction of the TDC-GPX2 means that these applications can benefit from increased resolution up to 10ps and a new high sampling rate of up to 70Msamples/s.

Compare such systems to a pre-IoT networked streetlight offering no more than simple remote control functions and remote status monitoring: the difference in the software is vast.

This new software requirement makes increased demands of the system controller or processor hardware. In response, ARM and its partners have made a significant investment in IoT solutions. This year will see the delivery of the latest ARM® Cortex®-M23 and Cortex-M33 platforms, which will incorporate advanced security support as a standard component.

Elsewhere, NXP Semiconductors continues to extend its high-end i.MX processor series: the i.MX 6ULL, featured on page 24, is a good example of the optimisation of processor products for IoT applications.

For more information about this and any other component featured in this issue of FTM, please contact your local branch of Future Electronics or e-mail [email protected].

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©Copyright 2017 Future Electronics Ltd. All trademarks contained herein are the property of their respective owners. Applications for product samples, badge boards, demonstration boards, Future Electronics’ boards and other advertised materials from Future Electronics are offered subject to qualification. Images of product packages throughout this publication are for illustration purposes and not necessarily an exact representation of the advertised part.

Apply now at my-boardclub.comFast-track board request code: FTM73A

PRE-REGISTER FOR THE POLARFIRE BOARD

This kit is ideally suited for high-speed transceiver evaluation. A 300,000 logic element PolarFire FPGA with DDR4, DDR3, an FMC connector and Ethernet ports enables development of a broad range of high-performance designs.

Orderable Part Number: MPF300-EVAL-KIT

Logic chip provides USB Type-C configuration capability

NXP Semiconductors’ PTN5150A is a small, low-power Configuration Channel (CC) logic chip, providing CC control-logic detection and indication functions in USB Type-C connector applications.

The features of the PTN5150A enable a USB Type-C connector to be used as both host and device at either end of the cable. It can also support USB Type-C-to-legacy-USB cables and adapters as defined in the USB Type-C specification.

The device can work autonomously, or it can connect to a controller through its I2C interface.The PTN5150A can be configured to operate in dual-role, Host or Device mode through an

external configuration pin or through the I2C interface. The CC control logic detection and indication block supports three current modes: default current is 500mA/900mA, medium current is 1.5A and high current is 3.0A.

On detection of the plug’s orientation, the pin identifier will indicate whether the PTN5150A is working in either the Host or Device role. Other status indicators are also reflected in the I2C registers.

NXP SEMICONDUCTORS

APPLICATIONS• Mobile devices• Portable computing equipment• Docking stations

FEATURES• Complies with USB Type-C

specification v1.1 • Supports plug, orientation, role and

charging-current detection• 15μA stand-by current• Supply-voltage range: 2.7V to 5.5V• ESD protection exceeds 7kV on the

human body model and 500V on the contact discharge model


New RF and controller products pave the way for next-generation IoT designs

C O M P O N E N T F O C U S


New 600V power MOSFET lowers conduction and switching losses

Vishay Intertechnology has introduced the N-channel SiHP065N60E, the first device in its fourth generation of 600V E series power MOSFETs to be released.

Built using Vishay’s latest energy-efficient E series superjunction technology, the SiHP065N60E features low maximum on-resistance at a 10V gate-source voltage of 0.066Ω, some 30% lower than that of previous 600V E series MOSFETs. The new superjunction technology also produces a reduction in gate charge: at 49nC at 10V, it is 44% lower than in the earlier E series devices.

This means that the figure of merit of the SiHP065N60E, the product

VISHAYof the on-resistance and gate charge, is 25% lower than that of the closest competing MOSFET in the same class. The reduction in conduction and switching losses provided by the new device will help designers to achieve higher energy efficiency in power factor correction circuits and hard-switched DC-DC converter topologies.

The MOSFET is rated for a maximum continuous drain current of 25A at a case temperature of 100°C.

SiHP065N60E: 30% lower on-resistance

5

APPLICATIONS• Telecoms equipment• Enterprise power systems • High-intensity discharge lighting• Fluorescent ballast lighting• Welding equipment • Motor drives• Battery chargers• Solar inverters

FEATURES• Low effective output capacitances

improve switching performance • Withstands transient over-voltages in the

avalanche mode with limits guaranteed through 100% UIS testing

• 5V maximum gate-source threshold voltage

• 0.5°C/W maximum junction-to-case thermal resistance

• 1.2V maximum drain-source body diode forward voltage




ESD diode protects very high-speed interfaces

Low-profile supercapacitors offer energy capacity up to 470μF

The PUSB3FR4 from Nexperia is capable of protecting high-speed interfaces, such as ports using the latest SuperSpeed USB3.1 technology, from damage caused by ESD.

Murata’s DMT series of supercapacitors provides a compact source of auxiliary or back-up power for end-products with a low profile, such as solid-state disks and smart cards. The thinnest Electric Double-Layer Capacitor (EDLC) supercapacitor in the DMT series, the DMT3N4R2U224M3DTA0, is just 2.2mm high.

As well as protecting USB interfaces carrying data at rates up to 10Gbits/s, the PUSB3FR4 is also suitable for High-Definition Multimedia Interface (HDMI), DisplayPort, external Serial Advanced Technology Attachment (eSATA) and Low Voltage Differential Signalling (LVDS) interfaces.

The device includes four high-level ESD-protection diode structures.

Designers can use the DMT series supercapacitors to stabilise the power line, providing a boost to the power supply at times of peak power demand. This peak power assistance function is particularly useful in battery-powered wireless communication devices such as remote keyless entry controllers and sensor nodes. The Murata supercapacitors are also used as a back-up power supply to enable end-products to save mission-critical data to non-volatile memory in case of power loss.

NEXPERIA

MURATA

APPLICATIONS• Portable devices• TVs and monitors• DVD recorders and players• Graphics cards • Set-top boxes • Games consoles

FEATURES• Up to ±15kV ESD protection for contact

discharges, exceeding the requirements of the IEC 61000-4-2 standard level 4

• Matched 0.5mm trace spacing• Signal lines with ≤0.05pF matching

capacitance between signal pairs• Design-friendly pass-through signal routing

APPLICATIONS• Solid-state drives • Remote keyless entry systems • Smart keys• Tracking devices• Smart cards • Wireless sensor nodes

FEATURES• 4.2V rated voltage• ±0.3mm thickness tolerance • ±20% capacitance tolerance• Operating-temperature range:

-40°C to 85°C

They protect sensitive transmitters and receivers in very high-speed signal lines.

All signal lines are protected by a special diode configuration offering very low line capacitance of just 0.29pF. These diodes use a snap-back structure to provide high ESD protection to downstream components.

The device is encapsulated in a leadless DFN2510A-10 plastic package.

Murata’s supercapacitors are notable for their low levels of Equivalent Series Resistance (ESR). The DMT series also offers a wide operating-temperature range and operates highly reliably.

Murata also supplies the DMF series of supercapacitors, which offer ultra-low ESR of less than 100mΩ and capacitance of up to 1F, making them particularly suitable for high-power applications.

PUSB3FR4: Provides ESD protection to USB interfaces

4



Part Number Capacitance Equivalent Series Resistance Length x Width Thickness

DMT334R2S474M3DTA0 470μF 130mΩ 21mm x 14mm 3.5mm

DMT3N4R2U224M3DTA0 220μF 300mΩ 21mm x 14mm 2.2mm

DMT series: Rapid charge and discharge capability

Security IC offers turnkey solution to product authentication

The A1006 from NXP Semiconductors is a secure, tamper-resistant authentication IC which offers a strong cryptographic solution intended to be used by device manufacturers to prove the authenticity of their products.

The A1006 is offered as a turnkey solution which provides designers with an easy means to integrate authentication functions into their end-products. Because it offers high-speed operation and low power consumption, it has a minimal impact on the performance of the end-product design. The time to perform authentication operations on-chip is less than 50ms. Operating current in active mode is just 500μA.

The A1006’s security is based on a unique asymmetrical public/private key Diffie-Hellman authentication protocol. There are two different keys for encryption and decryption based on Elliptic Curve Cryptography (ECC), with a NIST B-163 binary field curve.

NXP SEMICONDUCTORSIn addition, each A1006 has a static pair of ECC private keys and corresponding certificate which contains the public key and additional information, including a unique identifier and the customer’s product fields and usage data.

The A1006’s certificates are digitally signed using an Elliptic Curve Digital Signature Algorithm (ECDSA) based on the NIST P-224 curve and the SHA-224 digest hash. Non-volatile memory is available for storage of data about device behaviour and logistics as well as arbitrary data.

A1006: Identity secured with pair of ECC private keys

APPLICATIONS• Electronic accessories• Portable devices• Computing equipment• Consumer electronics products• Embedded systems

FEATURES• I2C Fast-mode interface • 3μA current at 3.3V in deep sleep mode • 8kV ESD protection against contact

discharge according to IEC 61000-4-2 standard

• 4kbit EEPROM with minimum 10 years’ memory retention at 85°C

• EEPROM lasts for minimum 500,000 write/erase cycles

• Operating-temperature range: -40°C to 85°C




Re-drivers ensure signal integrity in USB Type-C systems

Combination of controller and RF boards with software for development of LoRaWAN nodes

ON Semiconductor has introduced re-drivers which enable designers to maintain signal integrity at the high data rates supported by the latest USB standards.

The P-NUCLEO-LRWAN1 from STMicroelectronics is an STM32 Nucleo pack for 32-bit STM microcontrollers demonstrating the capabilities of the LoRa® low-power wireless wide-area networking technology.

Its single- and dual-channel USB re-drivers, the NB7VPQ701M and NB7VPQ702M, which have a small board footprint, both support USB3.0 and USB3.1 Gen 1 systems operating at up to 5Gbits/s, and USB3.1 Gen 2 operating at up to 10Gbits/s.

USB Type-C is emerging as the default industry standard for rapid charging and high-speed data transmission, capable of supplying 100W of power and transferring a 50Gbyte data file in just 38s. The default USB3.1 protocol for USB Type-C systems is capable of achieving ‘SuperSpeed+’ data rates of up to 10Gbits/s, theoretically twice as fast as the ‘SuperSpeed’ USB3.0.

While such high data rates are good for users who handle large data files or streaming data at high rates, they also create signal-integrity problems for the system designer.

The pack includes an STM32 NUCLEO-L073RZ board. This board features a low-power, 32-bit STM32L0 MCU based on the ARM® Cortex®-M0 processor core. Supplied with the controller board is the SX1272MB2xAS LoRa extension board from Semtech.

The development kit is also backed by a certified embedded software solution from ST, the I-CUBE-LRWAN. The combination of this software and the two boards

ON SEMICONDUCTOR

STMICROELECTRONICS

Signal integrity can be impaired by PCB traces, connectors, flexible PCBs, cables and other system components, causing Inter-Symbol Interference (ISI) which degrades the deterministic component of the total jitter budget.

The NB7VPQ701M and NB7VPQ702M devices can compensate for these losses by providing varying levels of user-selectable equalisation at the input receiver and de-emphasis on the output transmitter. These techniques may be combined to optimise the eye opening for the outgoing data signals, enabling the system to comply with the tight defined specifications of the USB standard.

The NB7VPQ701M and NB7VPQ702M are proven to restore signal integrity and to extend signal range up to 36 inches of FR4 PCB trace, or 5m of cable at a data rate of 5Gbits/s.

provides the means to implement a complete LoRaWAN™ Class A node. As well as supporting the LoRa RF modulation scheme and the LoRaWAN networking protocol, the P-NUCLEO-LRWAN1 also enables designers to implement the frequency-shift keying and on-off keying methods of RF signal modulation.

The pack is ideal for designers developing systems to operate in either the 868MHz or 915MHz ISM frequency bands.

USB re-driver: Extends range over cable up to 5m

P-NUCLEO-LRWAN1: Up to 20dBm RF output

IFLR series: Very low DC resistance

7

APPLICATIONS• Mobile devices • Docking stations • Active cables• Dongles• Games consoles• Monitors and smart TVs• Virtual reality systems

FEATURES• 1.8V power supply• Automatic detection of receiver

termination • Integrated input and output termination• Chip Enable pin for deep power-saving

mode• Hot-plug capable• ±4kV ESD protection on the human body

model

APPLICATIONS• Automated meter reading • Home and building automation • Wireless alarm and security systems • Industrial monitoring and control • Long-range irrigation systems

FEATURES• 157dB maximum link budget • 20dBm, 100mW constant RF output • 14dBm high-efficiency power amplifier• Programmable bit rate up to 300kbits/s • -137dBm RF sensitivity• 89dB blocking immunity • 10mA current in Receive mode • Fully integrated synthesiser with a

resolution of 61Hz





Low-power RF transceiver provides link budget of more than 140dB

Low-profile, high-current inductors optimised for high-frequency VRMs

Vishay Intertechnology has introduced a series of low-profile, high-current inductors for high-frequency Voltage Regulator Module (VRM) 10.0 applications

STMicroelectronics’ S2-LP is an ultra low-power RF transceiver intended for RF wireless applications operating at frequencies below 1GHz.

The IFLR series devices offer saturation currents as high as 71A and very low DC resistance values. With a frequency range up to 2MHz, the new inductors serve as high-performance, space- and power-saving solutions for VRMs and DC-DC converters in power supplies and Point-of-Load (PoL) converters.

Featuring a shielded package, the IFLR inductors offer high resistance to thermal shock, moisture, mechanical shock and vibration.

It is suitable for use in the licence-free ISM and Short-Range Devices (SRD) frequency bands at 433MHz, 868MHz and 920MHz, but can also be programmed to operate at other frequencies in the 430-470MHz or 860-940MHz bands.

The S2-LP is ideal for use in power-constrained products such as wireless alarm systems: it draws just 7mA when receiving, and 10mA when transmitting at an output power of +10dBm. It also has a very efficient power-management circuit. An integrated switching regulator provides for operation from a 1.8V to 3.6V input at a power-conversion efficiency of 90%, making it suitable for use in battery-powered devices.

VISHAY

STMICROELECTRONICS

APPLICATIONS• Servers• Low-profile, high-current power supplies • PoL converters

FEATURES• ±20% inductance tolerance• Operating-temperature range:

-40°C to 125°C

APPLICATIONS• IoT devices• Smart metering • Home energy-management systems • Wireless alarm systems • Smart home systems• Building automation equipment• Industrial monitoring and control • Smart lighting systems

FEATURES• -130dBm receiver sensitivity• Excellent blocking • Programmable RF output power up to

16dBm • Programmable digital filter at receiver• Battery indicator and low-battery detector • Automatic packet acknowledgment and

retransmission • Antenna diversity algorithm • Flexible packet length with dynamic

payload length • Supports Wireless M-Bus protocol• Enables operation in SIGFOX™ networks

The S2-LP supports a variety of signal modulation schemes: Gaussian Frequency Shift Keying (GFSK), On-Off Keying (OOK) and Amplitude Shift Keying (ASK). The data rate of the device’s RF transmissions is programmable in a range from 300bits/s to 500kbits/s.

The S2-LP can be used in systems with channel spacing of 12.5kHz/25kHz, supporting narrowband operation.

The S2-LP offers an RF link budget of more than 140dB, providing for long-range communication in many applications. It meets the regulatory requirements applicable in territories worldwide, including Europe, Japan, China and the US.

S2-LP: 500kbits/s maximum data rate

6



Part Number IFLR-2727EZ-01 IFLR-4027EZ-01 IFLR-4031GC-01 IFLR-5151HZ-01

Case Size 2727 4027 4031 5151

Inductance Range (µH) 0.072 to 0.150 0.085 to 0.220 0.170 to 0.215 0.21 to 0.44

Typical DC Resistance (mΩ) 0.32 0.38 0.26 0.32

Maximum DCR Resistance (mΩ) 0.35 0.42 0.29 0.35

Heat Rating Current (A) 45 50 61 50

Saturation Current Range (A) 30 to 58 33 to 70 44 to 60 35 to 71


Orderable Part Number: NB7VPQ701MMUGEVK


Orderable Part Number: P-NUCLEO-LRWAN1



Proximity/ambient light sensor offers strong immunity to interference

Motion and environmental sensor expansion board for ST’s 32-bit MCUs

The optoelectronics group of Vishay Intertechnology has released a high-sensitivity proximity and ambient light sensor module which can detect objects as far as 1m away.

STMicroelectronics’ X-NUCLEO-IKS01A2 expansion board features MEMS motion sensors and environmental sensors in a format compatible with the STM32 Nucleo family of 32-bit microcontroller boards.

Housed in an 8mm x 3mm x 1.8mm surface-mount package, the Vishay VCNL4100 combines a high-power IR emitter, photo-detectors for proximity and ambient light sensing, a signal processing IC and an 8-/16-bit ADC.

The detection range over which the proximity sensor functions is some fi ve times longer than that of previous generations of IR sensor modules. This means that the VCNL4100 can be used for: • presence detection to activate the display in

printers, copiers and home appliances• collision avoidance in toys and robots• presence detection for lighting control in

offi ces, corridors and public buildings• presence detection in washrooms • vehicle-occupancy detection in car parks

Equipped with an Arduino UNO R3 connector for the easy addition of peripheral shields, the X-NUCLEO-IKS01A2 features the LSM6DSL 3D accelerometer and 3D gyroscope and the LSM303AGR 3D accelerometer and 3D magnetometer. The environmental sensors mounted on the board are the HTS221 relative humidity and temperature sensor, and the LPS22HB MEMS pressure sensor. The pressure sensor provides a 260hPa to 1,260hPa absolute digital output.

The X-NUCLEO-IKS01A2 interfaces with an STM32 microcontroller via the I²C pin. It is possible to change the default I2C port.

ST also supplies X-CUBE-MEMS1 software for the X-NUCLEO-IKS01A2, an expansion

VISHAY

STMICROELECTRONICS

APPLICATIONS• Printers and copiers• Home appliances• Robots • Toys• Lighting controls • Smart home and smart offi ce equipment

FEATURES• Adjustable persistence to prevent false

triggers • Immune to fl uorescent light fl icker• Excellent temperature compensation from

-40°C to 85°C.• Operating voltage range: 2.5V to 3.6V

APPLICATIONS• Motion tracking and gesture detection• Sensor data collection• Indoor navigation• IoT and connected devices• Intelligent power saving for handheld

devices• Vibration monitoring and compensation

FEATURES• DIL24 socket for additional MEMS

adapters and other sensors • I2C sensor hub features available on

LSM6DSL

Integrating all the circuitry needed for these applications in one device, the sensor module eliminates the need for additional light barriers and for optical alignment of the IR emitter and photodiode.

The ambient light and proximity sensors of the VCNL4100 operate in a parallel structure, and each offers a programmable interrupt function with high and low thresholds. This allows the sensor to wake-up an application from a low-power mode, reducing the overall power consumption of an application.

Benefi tting from Filtron™ technology, the ambient light sensor’s spectral sensitivity is close to that of the human eye while cancelling out the effect of background light sources.

package for the STM32Cube software environment. It provides a complete set of middleware for building applications using the board’s environmental and motion sensors. Code developed with the software is easily portable across different members of the STM32 families, because it is part of the STM32Cube software platform.

The X-CUBE-MEMS1 includes a sample application for transmitting real-time sensor data to a PC. An application for a PC based on the Windows® operating environment may be used to log sensor data.

VCNL4100: Integrated module with emitter and detector

X-NUCLEO-IKS01A2: Includes Arduino connector

8




Orderable Part Number: X-NUCLEO-IKS01A2

The VCNL4100’s built-in ambient light photodiode is sensitive to light as dim as 0.01 lux and as bright as 5,243 lux, allowing the device to operate in applications with either a dark or transparent lens design.

T E C H T A L K P A R T N E R S

S E M I N A R 2 0 1 7I N V I T A T I O N

Future Electronics, in partnership with key suppliersand industry experts, presents TECH TALK, a series of

short seminars at Embedded World, stand 3-225

T E C H T A L K 1

Unifying industrial communication with the IEEE Time Sensitive Networking

(TSN) standard

T E C H T A L K 6

Bridging the gap between MCU and MPU with the

STM32F7 series M7 Cortex

T E C H T A L K 2

Building security into next-generation IoT and Industry

4.0 products

T E C H T A L K 7

Developing with the ON Semiconductor IoT IDK

T E C H T A L K 3

Secure provisioning and over-the-air updates – node to

cloud with ARM® mBed

T E C H T A L K 5

IoT solutions using LoRaWAN

T E C H T A L K 4

Implementing safety and security functions with the new family of NXP S32K processors

based on ARM® M4

Stand: 3-225COME AND VISIT US AT

BOOK NOW: access to the seminars is by prior application only and spaces are limited.To reserve your place go to: http://bit.ly/TechTalk2017

170314 For more information [email protected]



Multiplexer for USB3.1 supports data rates up to 10Gbits/s

Bluetooth Low Energy RF SoC runs protocol stack and application code

The FUSB340 from ON Semiconductor is a 2:1 data switch for USB3.1 Gen1 and USB3.1 Gen2 systems. It supports both the SuperSpeed 5Gbits/s maximum date rate and the SuperSpeed+ 10Gbits/s data rate.

The BlueNRG-1 from STMicroelectronics is a Bluetooth® Low Energy (BLE) single-mode radio System-on-Chip (SoC) intended for use in wearable devices and short-range applications.

It is intended for use in mobile devices, and in USB Type-C applications in which a reversible cable requires a switch.

The FUSB340 data switch offers superior performance and supports various high-speed data-transmission protocols, in addition to USB3.1:• PCI Express, Gen 3 • Serial Advanced Technology Attachment

(SATA) • Fibre Channel• Display Port 1.3

The BlueNRG-1 is an improved version of the BlueNRG network processor. The new SoC includes an ARM® Cortex®-M0 processor core which can run user application code as well as ST’s BLE protocol stack. The stack supports operation in master and slave roles, and dual roles simultaneously.

The BlueNRG-1 features 160kbytes of Flash memory, 24kbytes of static RAM and standard serial peripheral, UART and I2C communication interfaces. It also features multi-function timers, a watchdog timer, a real-time clock and a DMA controller.

An ADC provides an interface to analogue sensors, and can read the measurements made by the integrated battery monitor. A digital filter is available for processing a stream of pulse density modulation signals.

ON SEMICONDUCTOR

STMICROELECTRONICS

The power specifications of the FUSB340 make it attractive to designers of battery-powered and other power-constrained end-products. It draws just 12μA in active mode. In shut-down mode, the maximum current is less than 1μA.

The chip’s radio provides up to 8dBm of output power at the antenna connector, and an excellent link budget of up to 96dB. It also provides an accurate received signal strength indicator to enable dynamic power control.

An efficient, integrated DC-DC converter helps the new SoC to keep power consumption low, aided by a reduction in sleep-mode current in the BlueNRG-1 compared to the BlueNRG. When transmitting, the device draws a maximum 8.2mA at 0dBm.

The BlueNRG-1 is supported by the STSW-BLUENRG1-DK evaluation software package, which provides a BLE binary library with a complete set of application programming interfaces and related-event callbacks. The software package also provides a set of BLE demonstration applications which come with a complete set of header and source files.

FUSB340: Compatible with the latest very high-speed USB interface standards

11

APPLICATIONS• Mobile devices• Computing devices

FEATURES• 10GHz bandwidth • -1.0dB typical insertion loss at 2.5GHz• 2kV ESD protection on the human body

model• Operating-voltage range: 1.5V to 5.0V• Operating-temperature range:

-40°C to 85°C

APPLICATIONS• Automotive products • Watches • Fitness and sports equipment• Consumer medical devices• Remote controls • Home and industrial automation • Assisted living devices• Mobile phone peripherals • Lighting • PC peripherals

FEATURES• 1μA current in sleep mode with active

BLE stack • Certified to ETSI EN 300 328, EN 300

440, FCC CFR47 Part 15, ARIB STD-T66 • 14 or 15 GPIOs • Temperature sensor • Operating-temperature range:

-40°C to 105°C





High-speed I/O interconnects support wide range of communications standards

PCIe 2.1 packet switch complies with automotive quality standards

TE Connectivity (TE) supplies a wide range of pluggable high-speed I/O solutions which support higher data rates than traditional copper interfaces, such as RJ45, can provide.

The PI7C9X2G404SLQ from Diodes Inc., is a four-port/four-lane PCI Express® (PCIe) 2.1 packet switch for one x1 or x2 upstream port, and three x1 downstream ports. The PI7C9X2G304SLQ has the same functions, but supports one x1 or x2 upstream port and two x1 downstream ports.

A pluggable I/O interface offers important advantages as a high speed I/O interconnect. With a standard I/O interface and the flexibility of pluggable modules, system designers can choose between fibre and copper links, and find interconnects suitable for various data rates and protocols. Standards supported by TE high-speed I/O solutions include Fibre Channel, Ethernet, InfiniBand and SAS.By choosing TE connector components, OEMs benefit from the expertise of a company that has always been at the forefront of the development of pluggable I/O standards. TE continues to be engaged in the specification of new pluggable interface standards to

The switches enable designers to comply with automotive specifications, and to meet the latest low-power system requirements. Qualified to AEC-Q100 Grade 3, the switches are manufactured in facilities certified to the automotive TS16949 standard. They also comply with the following standards:• PCIe base specification, revision 2.1• PCIe CEM specification, revision 2.0• PCI-to-PCI bridge architecture specification,

revision 1.2• Advanced Configuration Power Interface

(ACPI) specification

TE CONNECTIVITY

DIODES INCORPORATED

APPLICATIONS• Cellular infrastructure• Access routers and switches• High-end servers• Medical diagnostic equipment• Network hubs

FEATURES• Provides a standard interface at the end

equipment • Wide range of highly customisable passive

and active copper cable assemblies• All connector cages are fully metal-

shielded for grounding and EMI suppression

• Thermally- and EMI-enhanced cages available for improved performance

APPLICATIONS• Automotive telematics and infotainment• Wired telecoms equipment • Wireless communications infrastructure• In-vehicle wireless access points• Vehicle-to-vehicle communications • Advanced driver assistance systems • Video surveillance • Vehicle navigation systems• Security systems

FEATURES• Integrated 100MHz clock buffer for each

downstream port• 14mm x 14mm QFP outline• Up to 512 bytes maximum payload

meet the market’s rapidly changing needs for higher bandwidth. It has the technical expertise required to deliver superior designs providing for high signal integrity and low EMI at high data rates.

The PI7C9X2G404SLQ and PI7C9X2G304SLQ switches give users the flexibility to fan out high-speed links from a wide range of end points such as microcontrollers, FPGAs, video processors and application-specific systems-on-chip. They are particularly well suited to automotive telematics and infotainment systems.

The switches feature power-saving functions at both the link and device level. Link power-management functions include:• L0, L0s, L1, L2, L2/L3 Ready and L3 link

power state• Active state power management for L0s and

L1 state

TE Connectivity’s high-speed connectors support fibre and copper links TE Connectivity and the TE connectivity (logo) are trademarks.

PCIe 2.1 packet switches: Qualified to AEC-Q100 Grade 3

10



For device power management, the switches have the following features: • D0, D3Hot and D3Cold • 3.3V auxiliary power support in D3Cold

power state

Connector Name

Cage Part Number

Connector Part Number

zQSFP+ 2170754-1 1551920-2

zSFP+ 2227730-1 2170088-1

QSFP/QSFP+ 1888674-1 2110819-1

SFP+ 2007198-1 1888247-1

CFP 2057629-1 2057630-1

CXP 2149159-5 2149448-1



Radial aluminium capacitors offer high-temperature operation and long useful life

Low-profile FPC connector has 0.2mm pitch

Vishay Intertechnology’s 160 RLA automotive-grade aluminium electrolytic capacitors are capable of operating at up to 150°C and offer a useful life of as long as 2,000h at this high temperature.

Hirose has introduced the FH53 series, a range of Flat Printed Circuit (FPC) connectors for small portable electronic devices that require high-speed signal transmission.

The 160 RLA series is available in ten case sizes, from the smallest at 10mm x 12mm to the largest at 18mm x 35mm, all with radial leads. Capacitance values range from 33μF to 3,300μF over a voltage range of 16V to 50V.

The capacitors offer very low impedance of as little as 23mΩ at a switching frequency of 100kHz, enabling designers to achieve high system reliability. Ripple-current ratings are as high as 2A when switching at 100kHz at a temperature of 150°C.

The 160 RLA series devices are ideally suited to smoothing, filtering and buffering functions in switch-mode power supplies and DC-DC converters.

The connector series offers excellent impedance characteristics, and supports the signal-transmission requirements of the Embedded DisplayPort v1.3 and MIPI D-PHY v1.1 standards.

The dimensions of the FH53 are compact: a short mounted depth of 3.2mm, a height of just 0.65mm and a fine pitch of 0.2mm minimise the required mounting area, saving valuable board space.

Two multi-functional metal fittings are incorporated into the connector housing to ensure that tabbed FPC insertion/withdrawal operations are performed correctly, and to hold the FPC in place temporarily before locking. A firm and tactile click confirms that the FPC has been locked correctly.

VISHAY

HIROSE

The capacitors are housed in a cylindrical aluminium case with pressure relief, insulated with a blue PET sleeve. They are charge- and discharge-proof, so there is no peak-current limitation.

When locked the metal fittings close to hold the FH53’s tabs firmly in place.

The FH53’s unique contact design features a sharp protrusion in the bottom section which presses up into the FPC stiffener to increase the retention force to 9.9N in the horizontal direction. In addition, each contact and metal fitting supports the actuator axle during rotation to hold the actuator securely in place.

Solder wicking from the surface-mount termination area to the contact points is prevented by a nickel barrier. Clearance is provided at the sides of the contacts/metal fittings and the housing to prevent flux penetration.

160 RLA capacitors: Impedance as low as 23mΩ

FH53 FPC connector: Just 0.65mm high

13

APPLICATIONS• Automotive systems • Industrial appliances• Telecoms equipment• Military equipment

FEATURES• AEC-Q200 qualified• Excellent ripple-current capability• High stability • High reliability

APPLICATIONS• Cameras • Video recorders• Portable music players• Handheld gaming systems• Point-of-sale devices• Medical equipment

FEATURES• Number of contacts: 19 or 41 • Top contact• 0.2A current rating• 30V AC/DC voltage rating





Energy-storage capacitors offer high power density

Latest supercaps give fast charge/discharge performance

The 220 EDLC ENYCAP™ electrical double-layer capacitors from Vishay Intertechnology provide a high-capacitance store of energy which is robust and may be quickly charged and discharged.

The 196 HVC ENYCAP™ polarised energy-storage capacitors from Vishay Intertechnology provide a compact source of stored energy with excellent charge and discharge performance, for use in energy-harvesting and power line back-up applications.

Featuring high energy density of between 9Ws/g and 13Ws/g, the 196 HVC ENYCAP devices are available in a wide variety of layouts, voltage ratings and capacitance values between 4F and 90F.

The capacitors are provided as a single cell with a rated voltage of 1.4V, or in versions with two, three, four, five or six cells and a voltage of 2.8V, 4.2V, 5.6V, 7.0V or 8.4V.

Designers also benefit from a choice of package styles: • a radial stacked through-hole package• a surface-mount flat package• a lay-flat configuration with pins, tabs and

connectorsUnlike common multi-cell lithium-ion

batteries, 196 HVC ENYCAP capacitors do not

VISHAY

VISHAY

APPLICATIONS• Back-up power supplies• Burst-power support• Storage device for energy harvesting • Micro-UPS • Energy recovery

FEATURES• 1,000h useful life at 85°C• No maintenance necessary• Rapid charge and discharge• REACH and RoHS compliant

APPLICATIONS• Embedded computers• Utility meters• Point-of-sale terminals• Servers• Data-storage systems• Professional remote controls• Real-time clocks• Emergency lighting• Access-control systems • Surveillance cameras• Vending machines• Network equipment

FEATURES• Up to 2,000h useful life at 85°C• Maintenance-free• Non-hazardous electrolyte• Storage-temperature range:

-40°C to 85°C

The devices are available in ‘Power’ and ‘Energy’ versions. The Power versions can provide high peak currents up to 35A at 65°C. In the Energy versions the maximum peak current is 25A at 65°C.

The 220 EDLC ENYCAP is rated for operation at 2.7V at up to 65°C. Operation at up to 85°C is possible at an operating voltage of 2.3V. The capacitors’ useful life is more than 10 years when operated at a

temperature of 20°C, and they can withstand more than 500,000 charge/discharge cycles.

All products in the 220 EDLC series are available in radial through-hole versions. Moreover, all are manufactured in a clean room as part of Vishay’s commitment to the production of reliable and high-quality products.

require cell balancing. Recommended charge currents and maximum discharge currents are specified so as to ensure the optimum lifetime in any application.

In some applications, such as solar-energy generators and emergency signalling in medical devices, the energy-storage capacitors must be maintained in a constantly high state of charge, which calls for a highly reliable charging circuit. A new application note from Vishay, ‘Power Management Solution: Constant Voltage Pulse Charging of Hybrid Capacitors’, describes why and how to implement a cost-effective constant-voltage charging scheme.

220 EDLC ENYCAP: Supplied in through-hole radial package

196 HVC ENYCAP: Up to 90F capacity

12



Rated Capacitance (F) Case Dimensions (mm)

15 16 x 20

20 16 x 20, 18 x 20

25 18 x 20

30 16 x 31

35 16 x 31, 18 x 31

40 18 x 31

45 18 x 35

50 18 x 35

55 18 x 40

60 18 x 40


Orderable Part Number: MAL219699001E3

USB Type-C controller enables 100W power delivery

Robust gate driver for half-bridge circuits

USB Power Delivery buck/boost controller

Dronetechnology

30V power MOSFET operates at high efficiency

The FUSB302B from ON Semiconductor is a programmable USB Type-C controller with Power Delivery (PD) functionality.

ON Semiconductor’s NCP5104 is a 600V gate driver which provides two outputs to directly drive two N-channel power MOSFETs or IGBTs arranged in a half-bridge configuration. It is ideal for use in the half-bridge motor-drive circuits that commonly power the motors in drones, safely handling transient over-voltage events up to 600V.

The NCP81239 USB Power Delivery (PD) controller from ON Semiconductor is a synchronous buck-boost controller which can convert an input ranging from 4.5V to 28V to an output compliant with the requirements of the USB Type-C PD 3.0 specification. It supports PD outputs up to 100W, and is compatible with the Qualcomm Quick Charge™ technology.

The NTD4804N is a 30V power MOSFET from ON Semiconductor which offers efficient operation in DC-DC converters and low-side switching applications.

The controller is able to perform USB Type-C detection, including detecting attachment and orientation. The FUSB302B integrates the physical layer of the USB Power Delivery (PD) protocol, providing up to 100W of output power. The PD block also provides full support for alternative interfaces included in the USB Type-C specification.

• Conforms to USB Type-C 1.2 and USB PD 3.0 specifications

• Reference code available for several embedded controller platforms

• 25μA active mode current

The device uses the bootstrap technique to ensure that the high-side power switch is properly driven. Operating from a 3.3V or 5V input, the NCP5104 may be controlled directly by a microcontroller.

• 50V/ns dV/dt immunity • Gate-drive supply range: 10V-20V• Output source/sink current capability:

250mA/500mA• Matched propagation delays between

both channels

The NCP81231 is a version of the NCP18239 providing step-down conversion only, providing a lower-cost option for designs which do not require boost conversion.

• I2C interface• Switching-frequency

range: 150kHz to 1.2MHz

• Meets timing requirements for slew-rate control during transition

• Over-voltage and over-current protection

It features a low maximum on-resistance of 4mΩ at a gate-source voltage of 10V for high efficiency and low conduction losses. It is capable of handling a maximum drain current of 117A, and of operating at a maximum junction temperature of 175°C.

• 1.4°C/W junction-to-case thermal resistance

• 2.5V maximum gate threshold voltage

• 73nC total gate charge

C I R C U I T C E N T R E

S E E P R E V I O U S I S S U E S O F F T M AT W W W. M Y- F T M . C O M 15

170323For samples or pricing e-mail [email protected]





F O L L O W U S N O W – S E A R C H F T M B O A R D C L U B O N14

ON SEMICONDUCTOR

ON SEMICONDUCTOR

POWERSUPPLY

POWERSUPPLY

ON SEMICONDUCTORMOSFET

Drones, properly known as unmanned aerial vehicles (UAVs), are enjoying a surge in sales, and this has attracted interest from manufacturers of control, power, sensing, imaging and communications components, which play a crucial role in the functioning of a drone.

Of particular importance to a drone is the motor system design: the motor must provide sufficient power and control, but also operate at high efficiency to give the longest possible battery run-time between charges. That’s why this Circuit Centre features a number of the best MOSFETs, integrated motor driver ICs, gate drivers and microcontrollers for motor control.

It also highlights RF transceivers from STMicroelectronics which offer long range and operate in unlicenced frequency bands.

ON SEMICONDUCTORGATEDRIVER

Recommended Partsn Main CPUsCypress Semiconductor: PSoC 6Microchip: ATSAMS70N19NXP Semiconductors: i.MX6UL, KV5xSTMicroelectronics: STM32H7x3, STM32F7

n Aux MCUsCypress Semiconductor: S6E1B8 seriesMicrochip: PIC16F1933NXP Semiconductors: LPC800 seriesSTMicroelectronics: STM32L052T8

n Multi-channel TransceiversMurata: TRC104STMicroelectronics: SP1ML-868, SP1ML-915, SPSGRF-868

n Gate DriversDiodes Inc.: ZXGD3005E6Intersil: ISL89163NXP Semiconductors: MC34937, GD3000ON Semiconductor: NCP5359A, NCP5104STMicroelectronics: PM8851

n MOSFETsDiodes Inc.: DMN3008SFGNXP Semiconductors: PSMN0R9-30YLDON Semiconductor: NVD4804N, NTD4804NSTMicroelectronics: STB155N3LH6, L6230, STSPIN230Vishay: SiE882DF

n FlashCypress Semiconductor: S34ML08G1 seriesMacronix: MX60LF8G18AC

n SDRAMAlliance Memory: AS4C2GM4D3L, AS4C1G8MD3L, AS4C512M16D3L

n Wi-Fi®Amp’ed RF: WF43Microchip: RN1723Panasonic: PAN93x0Redpine Signals: RS-9110-N-11-28STMicroelectronics: SPWF01SA, SPWF01SC

n AccelerometersMurata: SCA3300NXP Semiconductors: MMA8451QRohm Semiconductor: KXCJKSTMicroelectronics: LSM6DS3US

n BarometersNXP Semiconductors: MPXHZ6130ARohm Semiconductor: BM1383AGLVSTMicroelectronics: LPS25H seriesTE Connectivity: MS5534C

n CompassNXP Semiconductors: MAG3110Rohm Semiconductor: KMX61 STMicroelectronics: LSM303C

n GyrosMicrochip: MM7150NXP Semiconductors: FXAS21002CRohm Semiconductor: KXG03STMicroelectronics: LSM9DS0

n GPSNXP Semiconductors: MMA955xLOriginGPS: ORG1510-MK04STMicroelectronics: STA8058

n USB PowerCypress Semiconductor: EZ-PD™ CCG3ON Semiconductor: NCP81231

n BatteryPanasonic: UR18650ZTAVARTA: 56786 Rechargeable ACCU

n Battery Chargerams: AS8506CIntersil: ISL94203

n Power SupplyON Semiconductor: FUSB302B, NCP81239

Low-voltage triple half-bridge motor driver for BLDC motors

1A low-side gate driver with configurable asymmetric sink/source

High-performance MCUs for motor control

Integrated gate driver IC supports three half bridges

The STSPIN230 from STMicroelectronics is a triple half-bridge motor driver intended for use in Brushless DC (BLDC) motors.

STMicroelectronics’ PM8851 is a high-frequency, low-side MOSFET driver. It has complementary Output pins to differentiate between sink and source driving; they have a current capability of 1A for the sink and 0.8A for the source.

The Kinetis® KV5x family of MCUs from NXP Semiconductors offers exceptional precision, wide-ranging sensing capabilities and high-performance control functions, making the devices ideal for controlling drone-motor rotors.

The GD3000 from NXP Semiconductors is a gate driver IC for three-phase motor drive. It provides three half-bridge drivers, each capable of driving two N-channel MOSFETs.

Housed in a small 3mm x 3mm package, the driver is ideal for battery-powered devices such as drones. It can be forced into a zero-power state, giving a marked extension to battery run-time. The high- and low-side MOSFETs in the STSPIN230’s power stage have a low total on-resistance of 0.4Ω, further contributing to efficient operation.

The device offers protection against over-currents, over-temperature and short-circuits.

• Operating-voltage range: 1.8V to 10V • 1.3A maximum average output current • Operating-temperature range:

-40°C to 150°C

The PM8851 includes both input and output pull-down resistors. Under-voltage lock-out circuitry for the input and output stages prevents the IC from driving an external MOSFET in unsafe conditions.

The PM8851’s small package allows it to be placed close to the gate of the driven MOSFET, reducing the risk of injecting high-frequency noise between the Output pin and the MOSFET’s Gate pin.

• Input-voltage range: 10V to 18V• 30ns maximum propagation delay

Based on an ARM® Cortex®-M7 core running at 240MHz with a single-precision floating point unit, the KV5x series MCUs feature a PWM controller operating at a high resolution of 260ps. In addition, four 12-bit ADCs sample at a rate of 5Msamples/s. A comprehensive enablement suite from NXP and third-party resources, including reference designs, software libraries and motor configuration tools, help the designer to realise high-performance motor designs.

• Up to 1Mbyte of Flash and 256kbytes of RAM

• Ethernet option with true random number generator and cryptographic unit

• 44 timer channels

It can drive a peak current to the gate of up to 2.5A, operating from a single power supply with in an input-voltage range of 6V to 60V.

The GD3000 protects the external power stage against the risk of damage from excessive current. It includes a current shunt amplifier for accurate current measurement, a feature which also enables the device to detect phase errors.

NXP supplies the FRDM-GD3000EVB evaluation board to help designers to use the GD3000 in prototype designs. The FRDM-GD3000EVB is intended for use with a FRDM-PWRSTG Freedom Expansion Board and a FRDM microcontroller board.

• Charge pump to boost drive current at low supply voltage• 75V transient voltage protection • Programmable dead time range: 50ns to 12μs


Orderable Part Numbers: FRDM-GD3000EVB and FRDM-PWRSTG


Orderable Part Number: TWR-KV58F220M


Orderable Part Number: STEVAL-IHM042V1


Orderable Part Number: STM32F769I-DISCO


Orderable Part Number: X-NUCLEO-IDS01A5


Orderable Part Numbers: STEVAL-SP1ML868 and STEVAL-SP1ML915









Integrated RF module operates in licence-free frequency bands

868MHz/915MHz transceiver module includes on-board antenna

High-performance MCUs offer power efficiency advantage

Driver IC optimised for FOC motor designs

The SP1ML-868 and SP1ML-915 from STMicroelectronics are fully integrated RF modules operating in the 868MHz Short-Range Devices (SRD) and the 915MHz ISM frequency bands. The modules feature ST’s SPIRIT1 RF transceiver and an STM32L1 microcontroller.

The SPSGRF-868 from STMicroelectronics is an easy-to-use, low-power RF module based on ST’s SPIRIT1 RF transceiver, operating in the 868MHz Short-Range Devices (SRD) band. A related module, the SPSGRF-915, operates in the 915MHz ISM band.

The very high performance required in advanced drone designs is well catered for by the STM32F7 family of microcontrollers from STMicroelectronics, which are based on the ARM® Cortex®-M7 processor core.

STMicroelectronics’ L6230 is a fully integrated three-phase motor driver optimised for designs using field-oriented commutation, because it has an independent current-sense input for each phase.

The compact SP1ML module also integrates an on-board antenna with an easy-to-use interface, allowing users to add wireless connectivity to their designs without requiring in-depth RF experience. It has all the necessary FCC and CE regulatory approvals, helping OEMs to reduce development costs and time-to-market.

• UART host interface to external MCU • 14mm x 13.4mm footprint• 11.6dBm maximum output power• Data rates up to 500kbits/s

Each module provides a complete RF implementation in a tiny 13.5mm x 11.5mm board footprint. They implement various signal modulation schemes: Frequency Shift Keying (FSK), Gaussian FSK, Minimum Shift Keying (MSK), Gaussian MSK, On-Off Keying (OOK) and Amplitude Shift Keying (ASK).

The SPSGRF-915 is FCC- and IC-certified, while the SPSGRF-868 is CE-certified.• Data rates up to 500kbits/s• On-board antenna• -118dBm receiver sensitivity• Programmable output power

up to 11.6dBm

Taking advantage of ST’s ART Accelerator™ as well as an L1 cache, STM32F7 microcontrollers deliver the maximum theoretical performance of the ARM Cortex-M7 core, whether code is executed from embedded Flash or external memory: 1082 CoreMark or 462DMIPS at a clock speed of 216MHz.

Despite their high performance, the STM32F7 MCUs make efficient use of the battery power on which a drone runs. Power performance is rated at 7 CoreMark/mW at 1.8V. In Stop mode with all context and SRAM saved, the MCU draws just 100μA.

• Camera interface (except STM32F7x3/F7x2)• Floating point unit• HDMI-CEC capability

The L6230 device provides a three-phase bridge, consisting of six 0.73Ω power MOSFETs with an intrinsic fast freewheeling diode. Cross-conduction protection is implemented by using a dead time of typically 1μs between the turn-off and turn-on of the two power MOSFETs in each leg of a bridge.

An uncommitted comparator with an open-drain output is available.

• Non-dissipative over-current protection on the high-side MOSFETs

• Thermal shut-down• 1.4A maximum average

current output





NXP SEMICONDUCTORS

STMICROELECTRONICS

GATEDRIVER

GATEDRIVERSTMICROELECTRONICS

STMICROELECTRONICS

MOSFET

MOSFETSTMICROELECTRONICS NXP SEMICONDUCTORSMCU MCU

STMICROELECTRONICS STMICROELECTRONICSMULTI-CHANNELTRANSCEIVER

MULTI-CHANNELTRANSCEIVER

E M B E D D E D A N D H M I


7” displays offer high brightness for viewing outdoors

NXP unifies development support for LPC and Kinetis MCUs

LCD display manufacturer, AZ Displays, has launched a range of high-brightness WVGA 7” TFT displays, offering resolution of 800px x 480px.

Developed as a cohesive set of software development tools for Kinetis® and LPC microcontrollers from NXP Semiconductors, the MCUXpresso software and tools bring together NXP’s software enablement products into one platform for a shared software experience across a broad set of ARM® Cortex®-M MCUs.

The new Liquid Crystal Display (LCD) screens are supplied with either an LVDS or RGB interface, and with optional tape-attached or optically-bonded resistive or projected capacitive touchscreens.

The new MCUXpresso platform includes: • MCUXpresso SDK – an open-source

Software Development Kit (SDK) configured specifically for the user’s choice of processor and evaluation board. It includes drivers, stacks, middleware and application examples.

• MCUXpresso IDE – an easy-to-use Integrated Development Environment (IDE) for creating, building, debugging and optimising an application.

AZ DISPLAYS

NXP SEMICONDUCTORS

The displays, which feature brightness ratings of up to 1,000 nits, enable users to view the content on the screen even in direct sunlight.

The displays’ contrast ratio is rated at 500:1. Operating over a temperature range of -20°C to 70°C, these 7” displays offer a viewing cone of ±70° in the horizontal plane and 70°/-50° in the vertical plane. The high brightness of the new displays makes them particularly well suited to use outdoors.

The new high-brightness range of LCD screens from AZ Displays complements its existing 7” displays, which have lower brightness ratings of 200 nits to 500 nits. Like the high-brightness versions, these 7” displays also offer WVGA resolution of 800px x 480px.

• MCUXpresso Config Tools – a suite of system configuration tools, including pins, clocks, SDK builder and more.

The release of MCUXpresso software and tools unifies thousands of Kinetis and LPC microcontrollers under a single set of compatible tools.

The MCUXpresso IDE merges the best of the popular LPCXpresso and Kinetis Design Studio IDEs into one easy-to-use IDE for both Kinetis and LPC MCUs. The MCUXpresso IDE offers basic editing, compiling and debugging features with the addition of MCU-specific debugging views, code trace and profiling, and multi-core debugging. Debug connections support Freedom, Tower and LPCXpresso boards and custom hardware platforms.

The MCUXpresso SDK, formerly known as the Kinetis SDK, is a collection of open-source software components for Kinetis and LPC devices with a growing set of sensor, NFC and connectivity stacks and drivers. It uses static analysis tools, and includes peripheral drivers, wireless and wired connectivity stacks, middleware, Real-Time Operating Systems (RTOSs), user guides, API documentation, driver and middleware usage examples and demonstration applications.

AZ Displays: Touchscreen options available

19

APPLICATIONS• Industrial systems• Outdoor applications

FEATURES• 154.08mm x 85.92mm active display area• LED backlighting• 75% minimum luminance uniformity• 30,000h LED lifetime

APPLICATIONS• IoT devices and infrastructure• Industrial equipment• Consumer devices• Home appliances• Home and building automation

FEATURES• ARM CMSIS-CORE start-up and device

header files • CMSIS-DSP standard libraries• Open-source peripheral drivers • All drivers and start-up code are

MISRA-C:2004 compliant • FreeRTOS™, μC/OS-II® and μC/OS-III®

RTOS kernels pre-integrated



A P P L I C A T I O N S P O T L I G H T


1W communications processor offers line-rate networking performance

Comprehensive protection functions safeguard HDMI interfaces

The QorIQ® LS1012A from NXP Semiconductors is a communications processor intended for use in space-constrained, battery- or USB-powered networking and IoT applications. Featuring an 800MHz processor core and various high-speed interfaces, it provides line-rate networking performance while typically consuming just 1W of power.

Nexperia’s IP4788CZ32 is a highly integrated protection device which prevents electrical damage to HDMI transmitter host interfaces.

The LS1012A is based on a single ARM® Cortex®-A53 core with ECC-protected L1 and L2 caches. It features 32kbytes of L1 instruction and data cache and 256kbytes of coherent L2 cache. In addition, the ARM Cortex-A53 core features the NEON™ SimD module and dual-precision floating point unit. The memory controller supports 16-bit DDR3L memory devices operating at 1GHz.

The networking functions of the QorIQ LS1012A processor include a

The protection and monitoring capabilities of the IP4788CZ32 for HDMI include:• Over-current and over-voltage protection• Display Data Channel (DDC) buffering and

decoupling• Hot-plug detection• Back-drive protection• Consumer Electronic Control (CEC) buffering

and decoupling• ±14kV ESD protection for contact discharges

for all external I/Os. This far exceeds the requirements of the IEC 61000-4-2, level 4 standard.

The IP4788CZ32 incorporates transmission-line clamping technology on the high-speed Transition Minimised Differential Signalling (TMDS) lines to simplify routing and to help to reduce impedance discontinuities.

NXP SEMICONDUCTORS

NEXPERIA

three-lane, 6GHz multi-protocol SerDes which provides support for high-speed interfaces. These include up to two Gigabit Ethernet ports, a DMA-controlled PCI Express® Gen 2.0 port, and one SATA 3.0 port.

The LS1012A includes a hardware packet-forwarding engine which offloads processing of IP packets from the main processor core. Processing IP traffic at a rate of up to 2Gbits/s, this packet-forwarding engine yields higher performance and lower power consumption than pure software processing can achieve.

The processor’s QorIQ trust architecture is compatible with that of higher-end QorIQ devices in the LS family.

All TMDS lines are protected by an impedance-matched diode configuration which minimises the impedance discontinuities typically caused by conventional shunt diodes.

The IP4788CZ32’s 60mA linear regulator guarantees an HDMI-compliant 5V output voltage at inputs rising up to 6.5V.

The DDC lines use a new buffering method which decouples the internal capacitive load from the external capacitive load for use with standard CMOS or LVTTL I/O cells at voltages as low as 1.8V.

LS1012A: Includes hardware packet-forwarding engine

IP4788CZ32: Simplifies routing of signal lines

18

APPLICATIONS• IoT gateways • Smart home gateways• Network-attached storage• Ethernet drives for data-centre storage • Entry-level broadband Ethernet gateways • Building- and factory-automation systems

FEATURES• Dual USB controllers • One SuperSpeed USB3.0 controller with

integrated PHY • One USB2.0 controller• Dual 1Gigabit/2.5Gigabit Ethernet

controllers• Quad SPI• SD/MMC interface• Support for ARM TrustZone®

APPLICATIONS• Blu-ray Disc™ and DVD players• Set-top boxes• PC graphics cards• Games consoles• HDMI picture-quality enhancer modules

FEATURES• Supports HDMI 2.0 and all earlier

standards • Compatible with 6Gbits/s TMDS bit rate • Supports 4K UHD 60Hz display modes• Simple flow-through routing uses less

PCB space• Robust ESD protection without

degradation after repeated ESD strikes




Orderable Part Number: FRDM-LS1012A

Part Number Brightness Interface Touch Option

ATM0700D6J 1,000 nits RGB None

ATM0700L6J 1,000 nits LVDS None

ATM0700D6J-T 800 nits RGB Resistive touch

ATM0700L6J-T 800 nits LVDS Resistive touch

ATM0700D6J-CT 850 nits RGB Capacitive touch

ATM0700L6J-CT 850 nits LVDS Capacitive touch

The MCUXpresso SDK comes with built-in support for the MCUXpresso IDE as well as other leading toolchains in the ARM ecosystem including IAR Embedded Workbench, ARM® Keil® MDK™, Atollic® TrueSTUDIO® and SOMNIUM® DRT.

This buffering also redrives the DDC and CEC signals, allowing the use of longer or cheaper HDMI cables with a higher capacitance.

The only external component required for the operation of the IP4788CZ32 is a single capacitor.



New family of serial NOR Flash memories raises peak data rate to 400Mbytes/s

Non-volatile MRAM lets systems store more data, more often

The latest OctaFlash series of serial NOR Flash memory devices from Macronix is available today in densities ranging from 256Mbits to 1Gbit.

Available in densities up to 16Mbits, the Everspin range of Magneto-resistive RAM (MRAM) memory devices combines the speed and unlimited endurance of SRAM with the non-volatility of Flash.

The new OctaFlash devices with eight I/Os provide greater bandwidth than Macronix’ current Quad I/O Flash devices. The OctaFlash memory family’s user interface is backwards-compatible with that of the Macronix Single I/O serial NOR Flash series, allowing users to extend their product’s memory capability with minimal design effort.

The use of MRAM allows designers to create products that store more data, more often than is possible with the use of older non-volatile memory technologies, normally Flash or EEPROM, for back-up memory operations.

Traditionally, systems store mission-critical streaming data in fast volatile memory. When power is interrupted, lost or turned off, storage capacitors are generally used to keep the system powered while data is transferred from volatile memory to non-volatile Flash or EEPROM.

Non-volatile MRAM eliminates the need for storage capacitors because data can be written to MRAM extremely fast – much faster than to Flash or EEPROM.

MACRONIX

EVERSPIN

OctaFlash NOR Flash devices operate at high frequencies of 133MHz (single I/O) or 200MHz (8 x I/Os), and support a new Double Transfer Rate (DTR) feature for Read, Programme and Erase operations. This results in an increase of the effective data rate from 100Mbytes/s in the Quad I/O Serial NOR Flash series to 400Mbytes/s in the OctaFlash series. At the same time, Read latency has been considerably reduced.

System designers can use the improved performance of the OctaFlash memories to run eXecute In Place (XIP) operations more effectively and to shorten access times, accelerating system performance.

All the OctaFlash parts enable a Hardware Reset function, support Suspend/Resume instructions, and feature a Unique ID.

And because MRAM, unlike Flash or EEPROM, has unlimited endurance for Read/Write operations, the system can store data to MRAM as frequently as the application requires.

MRAM also offers other important benefits for logged data storage, including: • 20-year data retention • No requirement for wear levelling

The Everspin MR25Hxx MRAM devices feature a standard serial peripheral interface. The devices are organised in words of 8 bits each, and provide Read/Write timings compatible with serial EEPROM and serial Flash, with no Write delays. Unlike other serial memories, both Reads and Writes can occur randomly in memory with no delay between Writes.

Everspin also supplies MRAM devices with a parallel interface which have commands and controls compatible with SRAM memory technology. They are available in densities from 256kbits to 16Mbits, in TSOP and BGA package options, and rated for commercial, industrial and extended industrial temperature ranges. There are also automotive-qualified parts with a parallel interface which have a temperature range of -40°C to 125°C.

OctaFlash: Lower Read latency

21

APPLICATIONS• Automotive instrument clusters• Car infotainment systems• Telematics modules• Digital cameras

FEATURES• Adjustable dummy cycles• Configuration register• Individual sector protection• Operating-temperature range:

-40°C to 85°C

APPLICATIONS• Aircraft engine-control units• Flight-control computers• Navigation and guidance systems• Drones • Cockpit voice recorders• Programmable logic controllers• Data loggers

FEATURES• Block Write protection• Fast SPIs with 40MHz and 50MHz

clock rates• AEC-Q100 qualified parts available• Radiation-tolerant




Reference platform speeds design of modular IoT gateways

Complete hardware and software platform for USB Type-C development

The SLN-NTW-GTWY from NXP Semiconductors, a modular IoT gateway solution, is a hardware and software platform for gateways for commercial network installations containing many nodes. Use of this NXP IoT gateway platform enables OEMs to reduce time-to-market, cut the risks associated with wireless connectivity, and save development costs.

The P-NUCLEO-USB001 from STMicroelectronics is a development tool for designers who want to implement USB Type-C and USB Power Delivery technologies in new end-product designs.

The modular IoT gateway combines a high-performance i.MX applications processor, a production-ready Linux®-based board support package, out-of-the-box low-power wireless mesh connectivity, commissioning through NFC and state-of-the-art security capabilities.

Via low-power wireless mesh network technologies such as Thread® and ZigBee®,

The P-NUCLEO-USB001 is an STM32 Nucleo pack supported by a certified embedded software solution, the X-CUBE-USB-PD. It provides the means to control two USB Type-C ports using a single STM32F072, a 32-bit microcontroller based on the ARM® Cortex®-M0 processor core.

The X-CUBE-USB-PD software conforms to the specifications of both the USB Type-C 1.2 and USB Power Delivery 2.0 specifications. A simple analogue front-end interfaces the STM32F072 MCU with the Configuration Channels (CC lines) of USB Type-C receptacles, and allows for communication over these lines using the USB Power Delivery communication protocol.

NXP SEMICONDUCTORS

STMICROELECTRONICS

the gateway can provide a connection to more than 250 devices on the edge of the network. It then provides these edge devices with a link to the cloud through Wi-Fi® and Ethernet channels. Local intelligence enables time-critical responses even when cloud connectivity is not available.

The security features of the i.MX processor include high-assurance boot, secure key storage, external tamper detection for passive and active events, and internal tamper detection for protection against voltage, glitch and differential power analysis. A cryptographic acceleration and assurance module handles the execution of encryption software.

For efficient commissioning of end nodes, the gateway features secure NFC tap-to-connect capability. Using a smartphone application, end nodes can be quickly commissioned, even when the device that is being installed is not powered.

Because the gateway is a modular reference design, developers have the flexibility to quickly build and iterate a range of design implementations adapted to specific use cases.

The P-NUCLEO-USB001 is fully configurable: it supports Provider, Consumer or Dual-Role Port (DRP) modes of USB operation.

The P-NUCLEO-USB001 pack consists of two boards: the NUCLEO-F072RB MCU board on which the USB protocol stack runs; and the MB1257 expansion board, which provides a USB Type-C physical interface. The pack also includes a certified USB Type-C full-featured cable.

NXP’s IoT gateway: Supplied with Linux BSP

P-NUCLEO-USB001: Includes certified USB software

20

APPLICATIONS• Large commercial IoT networks

FEATURES• i.MX6UL system-on-module, based on

ARM® Cortex®-A7 Core • Kinetis® KW41Z 2.4GHz dual-mode

Bluetooth Low Energy and 802.15.4 wireless radio

• JN5169 ZigBee and 802.15.4 wireless MCU

• PN7120 NFC controller • A70CM secure element• FCC/CE/IC certified • Over-the-air programming via Multicast

APPLICATIONS• Consumer devices• Media players• Games controllers• Digital cameras and camcorders• Printers and scanners• Industrial products

FEATURES• Two USB Type-C DRP receptacles • USB2.0 Full-Speed data communication

interface as a peripheral • Load and discharge switches on the

supply bus • Voltage and current sensing for monitoring

the supply bus • EMI filters • A power connector to interface with an

external power supply (not supplied)



Part Number Density Supply Voltage

Frequency (MHz), Bus Width Package Options

MX66LM1G45G 1Gbit 2.7V to 3.6V 133 (x1, x8) 300mil 16-SOP 6mm x 8mm 24 TFBGA (5x5)

MX25LM51245G 512Mbits 2.7V to 3.6V 133 (x1, x8) 300mil 16-SOP 6mm x 8mm 24 TFBGA (5x5)

MX25UM51245G 512Mbits 1.7V to 2V 133 (x1); 200 (x8) 300mil 16-SOP 6mm x 8mm 24 TFBGA (5x5)

MX25UM25645G 256Mbits 1.65V to 2V 133 (x1); 200 (x8) 300mil 16-SOP 6mm x 8mm 24 TFBGA (5x5)


The Everspin MRAM evaluation board is an Arduino-derived shield which will interface with any microcontroller evaluation board that has an Arduino UNO pin-out.

Orderable Part Number: MR25H00-EVAL


Orderable Part Number: P-NUCLEO-USB001




MCU board provides microphones and display for developing audio and video applications

Power-efficient ARM Cortex-M4-based MCU ideal for HMI applications

The 32F413HDISCOVERY kit from STMicroelectronics allows users to develop applications based on an STM32F4 microcontroller, which features the ARM® Cortex®-M4 processor core.

Offering great flexibility and a scalable choice of performance options, the LPC546xx microcontroller family from NXP Semiconductors runs at speeds of up to 180MHz while drawing as little as 120µA/MHz. The MCUs’ 21 communication interfaces make them ideal for human-machine interfaces and for the connectivity needs of new IoT applications.

At the heart of the 32F413HDISCOVERY kit is a STM32F413ZHT6 MCU, which has 1.5Mbytes of Flash memory and 320kbytes of SRAM and is housed in a 144-lead QFP package.

Like all the STM32F4 series MCUs, the STM32F413ZHT6 is well equipped with audio, sensor interface, graphics, security and video functions and high-speed connectivity. It has an LCD parallel interface, two 12-bit DACs, a 12-bit ADC, 12 Pulse-Density Modulation (PDM) interfaces, one serial audio interface, up to five I2S interfaces, and a USB2.0 controller with PHY.

The LPC546xx MCU family, powered by the ARM® Cortex®-M4 core, offers support for Ethernet networking, as well as two CAN FD controllers, which conform to the CAN 2.0 standard. An integrated external memory controller, Quad SPI interface, TFT-LCD controller and a high-performance architecture provide users of the LPC546xx MCU family with the capability to implement cost-effective new display solutions.

The LPC546xx MCU family is particularly effective when used in applications that require data aggregation from several different inputs.

STMICROELECTRONICS

NXP SEMICONDUCTORS

The 32F413HDISCOVERY kit provides support for Arduino™ Uno V3 connectivity, giving unlimited expansion capabilities from a wide choice of add-on boards.

The kit supports ARM’s Keil® development toolchain, as well as IAR and Atollic tools and the ARM mbed™ platform.

The MCUs provide a variety of wake-up sources, including NXP’s FlexComm peripherals.

DSP capabilities enable LPC546xx MCUs to support complex algorithms in data-intensive applications. Flash options support large, flexible internal and external memory configurations.

The LPC546xx MCUs are compatible with other devices in the LPC54000 series, which means that the LPC546xx family provides a seamless migration path for users of LPC54000 devices to increase processing power and add advanced peripherals.

LPC546xx MCU: Handles complex algorithms

23

APPLICATIONS• Security systems• Audio equipment• Human-machine interfaces

FEATURES• 240px x 240px LCD • 8Mbit pseudo SRAM • 128Mbit Quad-SPI Flash memory • I2S audio codec • One audio jack connector with

microphone input and stereo output • Two ST MEMS microphones • USB Micro-AB connector • microSD card connector• 802.11b/g/n Wi-Fi® module• User and reset push-buttons • Two user LEDs

APPLICATIONS• Building control and automation• Diagnostic equipment• Multi-node/multi-protocol communication

hubs• HMI applications• Data collectors• Telematics and fleet management

FEATURES• Up to 512kbytes of Flash memory• Up to 200kbytes of RAM• 16kbytes of EEPROM• 12-bit, 12-channel ADC• Real-time clock• Temperature sensor





High-speed DDR2 SDRAM chip offers 2Gbit capacity

High-performance backplane connectors support data rates up to 56Gbits/s

The AS4C128M16D2 from Alliance Memory is a high-speed CMOS Double Data Rate 2 Synchronous DRAM (DDR2 SDRAM) which provides 2Gbits of data storage in an 84-ball, 8mm x 12.5mm x 1.2mm FBGA package

The broad portfolio of high-speed backplane connectors from TE Connectivity (TE) provides system designers with the flexibility they require to meet the challenges of their application.

The device provides a reliable, pin-compatible drop-in replacement for a number of similar products available today.

The AS4C128M16D2 DDR2 DRAM is organised as eight banks of 16 x 16Mbits. It achieves high data-transfer rates by employing a chip architecture which pre-fetches multiple bits and then synchronises the output data to a system clock.

The chip is designed to meet key DDR2 SDRAM requirements:• Posted Column Access Strobe (CAS) with

additive latency• Write latency = Read latency-1• On-Die Termination (ODT)

All of the control and address circuits are synchronised with the positive edge of an externally supplied clock. I/Os are

For the most demanding applications operating at data rates up to 56Gbits/s, the STRADA Whisper connector portfolio is available in four, six and eight pairs per column, supporting a card pitch of 16.4mm, 20.4mm and 25.4mm. The connectors provide a density of up to 20 differential pairs/cm.

ALLIANCE MEMORY

TE CONNECTIVITY

synchronised with a pair of bi-directional strobes in a source-synchronous fashion.

Operating the eight memory banks in an interleaved fashion allows random access operation to occur at a higher rate than is possible with standard DRAMs. A sequential and gapless data rate is possible depending on burst length, CAS latency and the speed grade of the device.

All variants are available in commercial, 0°C to 85°C, and industrial, -40°C to 95°C, temperature ranges. An automotive temperature range of -40°C to 105°C is available on some parts. The functionally equivalent AS4C128M16D2A, fabricated in a different location from the AS4C128M16D2, is also available to give customers confidence in the parts’ continuity of supply.

The Z-PACK HM-Zd and Z-PACK HM-Zd Plus connectors support data rates up to 12.5Gbits/s with two, three or four pairs per column. The Z-PACK HM-Zd Plus products provide better signal integrity in a design that is backwards-compatible with Z-PACK HM-Zd products. These connectors support the Advanced Differential Fabric (ADF) connector specified in the PICMG 3.x Advanced TCA specifications.

Z-PACK HS3 connectors support data rates up to 6.25Gbits/s for both single-ended and differential signals.

TE’s MULTIGIG RT connector provides a pinless backplane connection with a PCB construction which gives the connector system the flexibility to combine 100Ω differential, 50Ω single-ended, open pin field and power wafers in one connector module.

The 100Ω IMPACT connectors support high data rates up to 25Gbits/s.

The 85Ω impedance version of the Z-PACK TinMan connector conforms to the QPCle and Intel QPI standards.

Z-PACK Slim UHD connectors have a low profile, at just 12.5mm wide, and accommodate 55 lines/cm.

AS4C128M16D2: Supports industrial and automotive temperature ranges

IMPACT, MULTIGIG RT, STRADA Whisper, Z-PACK, TE Connectivity and TE connectivity (logo) are trademarks.

22

APPLICATIONS• Automotive systems• Industrial equipment• Consumer devices• Networking equipment• Medical products • Embedded systems

FEATURES• Single 1.8V power supply• 400MHz clock rate• 800Mbits/s data rate per pin• Programmable Read or Write burst

lengths of 4 or 8• Easy-to-use Refresh functions • Programmable mode and extended mode

registers

APPLICATIONS• Telecoms and network servers/switches• Routers• Enterprise networking equipment • Optical networking gear • Optical Transport Network equipment

FEATURES (STRADA Whisper)• Power Sum FEXT is lower than -50 dB for

system implementations at 12.5GHz• Insertion loss is less than 1dB, and is

linear up to 20GHz• Individual shielded pairs offer excellent

signal integrity and EMI performance• Little skew through high-speed differential

pairs• Common-mode impedance controlled

throughout the connector• Electrical performance maintained even in

a 1.5mm unmated condition• 85Ω and 100Ω versions available




The board features the LPC54608 device, a 272px x 480px colour LCD touchscreen, three user LEDs and user buttons, and built-in power consumption measurement capability.

Orderable Part Number: OM13092


Orderable Part Number: STM32F413H-DISCO

Connector Name Plug Part Number

Receptacle Part Number

STRADA Whisper 2149967-3 2149968-3

Z-PACK HM-Zd and Z-PACK Hm-Zd Plus 6469002-1 6469001-1

Z-PACK HS3 5120658-1 5120790-1

MULTIGIG RT 1410187-3 1410142-1

IMPACT 2007777-1 2007703-1

Z-PACK TinMan 100Ω and 85Ω 1934269-1 1934218-1

Z-PACK Slim UHD 2042088-2 1982738-2

F T M B O A R D C L U B

To apply for these free boards go to: www.my-boardclub.com/ftmTerms and conditions apply. Visit www.my-boardclub.com/about_us for details

PSoC MCU dev kit features touch-sensing buttons and wireless connectivity

A new prototyping kit from Cypress enables customers to evaluate and develop projects using the PSoC 4000S, a family of programmable system-on-chip controller ICs.

PSoC 4000S devices feature an ARM® Cortex®-M0+ processor core, up to 32kbytes of Flash memory, 4kbytes of SRAM, up to 36 general purpose I/Os all capable of CapSense® capacitive sensing, as well as six programmable analogue blocks and seven programmable digital blocks. The PSoC Creator™ Integrated Development Environment (IDE) enables rapid prototyping of end applications based on a PSoC 4000S device while minimising the requirement for PCB spins and fi rmware changes.

The PSoC MCU includes 16 Smart I/Os™ which provide pin-level Boolean operations on input and output signals, even when the device is in deep sleep. It also offers a programmable interconnect and routing sub-system which can be confi gured in the PSoC Creator IDE.

The introduction of the PSoC 4000S prototyping kit offers an open-footprint break-out board which enables the designer to take advantage of all the features of the PSoC 4000S.

Future Electronics’ Board Club: supporting innovative electronics design

Europe’s electronics industry thrives on the application of innovation and creativity, and an essential innovator’s tool in design projects is the development board. The Board Club website is a Future Electronics resource for users of development boards. Here, and only here, Board Club members can gain access to exclusive free development boards and development board offers.If you would like to register for membership, please visit: www.my-boardclub.com/register.php

CYPRESS SEMICONDUCTOR

PSoC 4000S dev kit: On-board RF module provides Bluetooth Low Energy connectivity

25


Orderable Part Number: CY8CKIT-145-40XX

APPLICATIONS

• Industrial equipment• Wearable devices• Home appliances • Consumer devices

FEATURES• PSoC 4000S device:

CY8C4045AZI-S413• USB connector• 5V USB power supply• Current-measurement jumper




Launch of industry’s lowest-power ARM Cortex-A7-based processor

NXP Semiconductors has released the i.MX 6ULL applications processor, an addition to the broad i.MX 6 processor family which consumes as much as 30% less power than other processors based on an ARM® Cortex®-A7 core. The i.MX 6ULL is ideal for IoT, consumer and industrial end-product designs which face tight cost constraints.

The processor offers secure encryption functions, and provides various memory interfaces. It includes an integrated power management module, helping to reduce the complexity of the user’s board design by reducing the need for external power circuitry.

The i.MX 6ULL’s single ARM Cortex-A7 core runs at up to 900MHz, and includes 128kbytes of L2 cache. It supports the 16-bit DDR3 and LPDDR2 memory types.

The i.MX 6ULL is expected to be popular with developers of human-machine interfaces

NXP SEMICONDUCTORSbecause of its built-in support for display functionality. This includes a parallel LCD controller at up to WXGA (1366px x 768px) resolution, an 8/-10-/16-/24-bit parallel camera sensor interface, and an electrophoretic display controller for E-Ink panels at up to 2048px x 1536px resolution.

The i.MX 6ULL processor has compatible and scalable ball-grid array package options. The 14mm x 14mm package is ideal for simple and low-cost PCB designs. The 9mm x 9mm option is ideal for space-constrained applications. The device is available in three variants: the MCIMX6Y0, MCIMX6Y1 and MCIMX6Y2.

24

APPLICATIONS• Human-machine interfaces• IoT gateways• Home energy-management systems• Smart energy concentrators• Intelligent industrial-control systems• Portable medical equipment• Streaming audio equipment• Printers and 2D scanners• Smart appliances

FEATURES• Parallel NOR Flash/pseudo-SRAM• Dual-channel Quad-SPI NOR Flash• Two MMC/SD card interfaces• Two USB2.0 interfaces with PHY• ESAI, I2S and S/PDIF audio interfaces• Two 10/100 Ethernet interfaces with

IEEE 1588 capability• Two 12-bit ADCs with resistive touch

controller


The board includes the following features:• Three CapSense buttons• A fi ve-segment CapSense slider• LEDs to provide feedback• Capacitors to support development of

CapSense touch-sensing applications• Bypass capacitor to ensure high-quality

analogue-to-digital conversion • A push-button to provide a simple user input• Load capacitors to connect the 32kHz

external crystal oscillator• A Cypress EZ-BLE® PRoC™ radio module for

Bluetooth® Low Energy connectivityThe PSoC 4000S prototyping kit also integrates the Cypress KitProg2, which enables on-board programming, debugging and USB-to-UART and USB-to-I2C bridging. KitProg2 is used to programme and debug the target PSoC 4000S/EZ-BLE PRoC devices. The PSoC 4000S kit allows the user to snap away the KitProg2 board from the PSoC 4000S target board.


The i.MX 6ULL-EVK includes an LCD and supports audio playback as well as many connectivity options. Software development based on the Linux® operating system is backed by NXP’s Linux board support package for the i.MX 6ULL.

Orderable Part Number:MCIMX6ULL-EVK

Future Electronics launches industry’s fi rst complete ‘sensor to cloud’ service at Embedded World 2017New IoT Solution Platform bundles wireless networking, internet connectivity and cloud services into one, easily commissioned service – all via Future Electronics.

Future Electronics has introduced its IoT Solution Platform, providing cloud storage, security and dashboard analytics in a single, out-of-the-box solution.

Quick and easy to evaluate, the IoT Solution Platform allows embedded developers to tailor a cloud service to the specifi c needs of their application.

Learn more at the Future Electronics stand 3.225 at Embedded World (Nuremberg, 14-16 March 2017) and see an IoT streetlight demonstration, based on the Future Electronics IoT Solution Platform.

www.FutureElectronics.com


T E C H N I C A L V I E W


Of course, a module is not itself a single ‘component’: it is a single package containing many components. Nevertheless, experience shows that the real-world reliability of power modules is far superior to that of comparable discrete circuits. This is because the construction of a module is, in various ways, less prone to failure than a set of discrete board-mounted components. For instance, the module’s footprint is smaller than that of the equivalent discrete circuit, so it is less affected by any warping of the board. Also, the temperature inside a module is more evenly distributed, because it is smaller and the moulding compound aids heat distribution. With fewer, less intense hot spots, the devices inside the module run cooler and more efficiently and are less likely to fail.

A module also has fewer solder joints: the dies of active components are directly soldered to the base board of the module, but the other connections are made by bonding, as in an IC, as shown in Figure 2. This means that there are far fewer solder joints and bonds than in a discrete design. In addition, bonds are less susceptible to cracking, bending and other failure mechanisms than the solder joints used with discrete surface-mount components.

But the reliability advantage of the module goes further than this: again, module manufacturers commit enormous time and resources to testing and validating their products, as shown in Figure 3. This testing can include Highly Accelerated Lifetime Testing (HALT), which overstresses the part in order to arrive at a calculated Mean Time Before Failure (MTBF) value for the module.

Reliability reports provided on the manufacturer’s website also give an indication of the product’s FIT rate. For example, a board-level reliability report for Intersil modules is available at www.intersil.com/content/dam/Intersil/misc/power-modules/power-module-board-level-reliability-report.pdf.

What this means is that the power-system designer can benefit from fully tested, fully documented reliability data about the entire power circuit, across all specified operating conditions. By contrast, any reliability data about the components used in a discrete circuit apply only to each of these components individually, and not to the entire circuit.

In the case of a module, these system-level reliability data are based on exhaustive and lengthy tests; again, few OEMs will have the engineering resources available to perform such exhaustive testing on an in-house power-supply design. For these reasons, then, the designer can have greater confidence in the reliability of a module-based power-system design than in that of a discrete circuit; and the real-world reliability of the module-based production units is more likely to match or exceed their predicted performance than production units of a discrete circuit.

There is a further advantage for the user of a module: he or she has the reliability data available from the beginning of the design process. By contrast, testing to establish the reliability of a discrete circuit can only take place after the circuit has been designed and built in prototype form. If at this stage it is found to be too unreliable, and the design requires modification, there is a severe risk of delay to the introduction of the product. With a module, there is no such risk.

3) Predictability of performanceThe third way in which a module’s performance can be expected to be superior to that of its discrete equivalent is in the predictability of its performance. For the central component of a power-conversion circuit, the power regulator or power controller IC, performance is normally well documented in the datasheet. But this documentation only applies to the IC.

Fig. 2: The internal structure and finished package of a second-generation SLLIMM IGBT power module from STMicroelectronics with Direct Bonded Copper, or DBC, substrate. (Image credit: STMicroelectronics)

Fig. 3: An EMC test chamber. Power module manufacturers perform EMC tests on their product and provide comprehensive documentation. (Picture credit: Adamantios under CC 3.0 licence)


Why like-for-like comparisons between a power module and a discrete circuit are invalid

Early in the process of designing a high-power, high-value product such as a telecoms server board or an industrial computer, the development team will decide whether to implement the intermediate power stage and Point-of-Load (PoL) converters with complete, fully integrated modules, or with discrete power components instead.

By Simopekka NiskanenField Applications Engineer, Future Electronics (Finland)

When system architects consider this decision, it can be tempting to take a matrix approach: to list the advantages and disadvantages of each, and weigh them up in the light of the particular requirements of the end product. So, for example, the benefits of using a power module include:• Fast time to market, since a module provides a ready-made circuit

which is supplied fully tested and approved. A module reduces the burden of EMC compliance on the user.

• Small board footprint and low component count• Easy for engineers with limited analogue or power design experience to

implement in product designs

Among the drawbacks of a power module, designers might be concerned about their limited ability to second-source the device, and its potentially higher unit cost.

For a discrete circuit implementation, these benefits and drawbacks would be reversed: it would be larger and more complex and would use many more components, but those components would normally be fairly readily replaceable, and the Bill-of-Materials (BoM) cost would normally be lower than that of the module.

If the overriding design consideration is BoM cost, it is likely, with this decision method, that the development team will opt for a discrete circuit. If, on the other hand, time to market is the most important issue, demanding a rapid design process and minimal testing and validation, or if power density is a critical factor, the circumstances favour the choice of a module. If the design team has little or no power or analogue expertise, a module will also be the preferred choice.

This is, of course, a rather stark characterisation of the system architect’s decision-making, and in reality the thought process behind it will be much more complex and nuanced than this simple description implies. Nevertheless, development teams commonly make the assumption that power modules and discrete power-converter circuits which perform the same function are therefore equivalent, and can be compared on a like-for-like basis.

In this author’s experience, this can be a flawed assumption. This article explains why.

Why module-based designs perform differentlyOn first consideration, it might seem odd to suggest that a power module-based design would perform differently from a discrete circuit working with the same input and output voltage and current specifications. To take a random example, Intersil’s ISL8273M is an 80A digital power module which operates from a supply rail of 4.5V to 14V, and which provides a single-channel, dual-phase output at a voltage which is programmable in the range 0.6V to 2.5V. Inside its 18mm x 23mm x 7.5mm package will be found a digital power-controller IC, MOSFETs, LDOs, inductors and various other power components – the same component types with which an equivalent discrete power circuit would be implemented.

Because of the way the module is packaged and assembled, its board footprint is certainly a great deal smaller than that of the equivalent discrete circuit. But this is not the only difference. In fact, there are three ways in which a module in many cases offers superior performance to a functionally equivalent discrete circuit.

1) Layout optimisationReputable suppliers of power modules, such as Intersil, Vicor, Exar, ON Semiconductor and Fairchild, have valuable brands to protect. This means that they take great pains to provide users of their modules with every assistance to ensure that they work to their highest potential in all conditions.

One way in which they do this is by providing layout guidelines which give the user a blueprint for optimising the thermal and electrical performance of the entire power circuit, including the small number of external components supporting the module. This optimal layout will have been developed and refined after exhaustive testing across the range of operating temperatures and other conditions specified for the module, as shown in Figure 1.

Because the manufacturer’s brand stands behind the module, it is important for it to commit the necessary engineering time and resources to this optimisation. By contrast, the economics of product development at OEMs dictate that the same level of layout optimisation is normally out of the question. The thermal and board-level design is typically done on a ‘best effort’ basis, to achieve the best performance in the limited development time available.

In most cases, this best effort will fall short of the absolute optimisation that module manufacturers

perform. The thermal performance and layout efficiency of a module-based system can therefore typically be assumed to be better than that of a discrete circuit.

2) System reliability Much the same argument applies to the reliability of a power module when used within its specified operating conditions.

The reliability argument in favour of modules over discrete power circuits is usually illustrated in terms of component numbers: put simply, this argument states that a system’s Failure In Time (FIT) rate increases in a more or less linear fashion with each increase in the number of components in the system. In other words, a circuit containing 20 components is likely to have a FIT rate around 20 times higher than that of a circuit containing a single component.

T E C H N I C A L V I E W


READ THIS ARTICLE TO FIND OUT ABOUT:

• How power modules reduce design time and risk, but at a price

• Why the reliability of a power module is often better than that of an equivalent discrete circuit

• How a power module provides for more predictable performance, supported by better documentation

Fig. 1: Intersil’s recommended PCB layout for its ISL8273M power module. (Image credit: Intersil)

For a module, this documentation applies to the entire power-conversion circuit. This means that the module user can implement a system design in full confidence that the performance of the power system’s electrical parameters, such as line and load regulation and EMC, will be exactly as predicted by the product documentation.

For a discrete circuit, the performance of the system, as opposed to that of a single controller or regulator IC, is not at all supported by a manufacturer’s documentation. As above, an OEM’s testing and validation of a discrete system’s performance will rarely be as exhaustive or comprehensive as that of a module manufacturer. Defects or weaknesses in the performance of a discrete circuit in a given operating condition might therefore elude discovery during the design process. This creates a risk that the real-world performance of the discrete circuit will be worse than that of its module equivalent.

Avoiding the trap of like-for-like comparisonsThis article argues, then, that the decision over whether to use a module or discrete components for the implementation of a power-conversion circuit should not be based on the assumption that functional equivalence is the same as performance equivalence.

According to the arguments presented above, it is certain that in some cases a module will perform better – both electrically and thermally, and over a more predictable lifetime – than its discrete equivalent. The assumption that exact like-for-like comparisons can be made between a module and its discrete equivalent is therefore flawed.

Embedded and HMI · to extend and enhance the feature sets of their products. Paul Donaldson...

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Transcript of Embedded and HMI · to extend and enhance the feature sets of their products. Paul Donaldson...