Microstructure And Resistivity Of Cu/NiThin Film Prepared By Magnetized

Electroplating On Various ElectrolyteTemperature

By M. TOIFUR

WORD COUNT 3406 TIME SUBMITTED 13-MAY-2020 01:25AM

PAPER ID 58626233

13%SIMILARITY INDEX

1

2

3

4

5

6

7

Microstructure And Resistivity Of Cu/Ni Thin Film Prepared ByMagnetized Electroplating On Various Electrolyte TemperatureORIGINALITY REPORT

PRIMARY SOURCES

Jumratul Wustha, Moh. Toifur, Azmi Khusnani."Thickness and Resistivities of Cu/Ni Film Resulted byElectroplating on the Various Electrolyte Temperature", Journal ofPhysics: Conference Series, 2019Crossref

www.ijstr.orgInternet

docplayer.netInternet

Buddhadev Purohit, Ashutosh Kumar, Kuldeep Mahato,Pranjal Chandra. "Electrodeposition of MetallicNanostructures for Biosensing Applications in Health Care",Journal of scientific research, 2020Crossref

Magdy A?M Ibrahim. "Improving the throwing power ofacidic zinc sulfate electroplating baths", Journal ofChemical Technology & Biotechnology, 2000Crossref

Muthi’ah Lutfia Khansa, Moh. Toifur, AzmiKhusnani, Yudhiakto Pramudya. "Deposition TimeVariation on Thickness and Resistivity of Cu/Ni ThinFilm Obtained by Magnetic Field-Assisted Electroplating Process",Journal of Physics: Conference Series, 2019Crossref

Ganesh, V.. "Fine grain growth of nickelelectrodeposit: effect of applied magnetic field

136 words — 5%

95 words — 3%

40 words — 1%

20 words — 1%

19 words — 1%

13 words — < 1%

12 words — < 1%

8

9

10

11

12

EXCLUDE QUOTES ON

EXCLUDEBIBLIOGRAPHY

ON

EXCLUDE MATCHES OFF

during deposition", Applied Surface Science, 20050215Crossref

eprints.uny.ac.idInternet

dyuthi.cusat.ac.inInternet

worldwidescience.orgInternet

chalcogen.roInternet

M Toifur, Y Yuningsih, A Khusnani. "Microstructure,thickness and sheet resistivity of Cu/Ni thin filmproduced by electroplating technique on the variation of electrolytetemperature", Journal of Physics: Conference Series, 2018Crossref

11 words — < 1%

9 words — < 1%

9 words — < 1%

8 words — < 1%

7 words — < 1%