Electronics SystemsQualification+byAnalysis · 2020-06-25 · TODAY’S(PRESENTATION(AGENDA...
Transcript of Electronics SystemsQualification+byAnalysis · 2020-06-25 · TODAY’S(PRESENTATION(AGENDA...
Electronics Systems Qualification by AnalysisWilliam Villers, Director of Engineering, TEN TECH LLC
TODAY’S PRESENTATION AGENDA
Introduction to TEN TECH LLC• Company Profile• Business Organization• Areas of Expertise
Electronics Systems & Harsh Environments• Air, Sea and Land Electronics Systems• Source of Thermal & Mechanical Loads• Analysis of Harsh Environments
ATR Chassis Analysis Example• Radar System Random Vibration Analysis• Single Board Computer Thermal Cycling• Shock Response & Electronics Cooling
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INTRODUCTIONSCompany Profile, Organization and Areas of Expertise
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INTRODUCTIONS: WILLIAM VILLERS
Co-founder & Director of TEN TECH LLC• Manage Technical Aspects of the Company• Project Management & Customer Relations• Analysis Team Management• Executive Decisions Authority
Seasoned Aerospace & Defense Professional• MSME & ABD Doctor of Engineering, MIT France• Over 20 years of Industry Experience in Europe & US• Engineering & Engineering Management• Eurocopter, Aerospatiale
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INTRODUCTIONS: TEN TECH LLC
Design, Test & Analysis Services Provider• Offices in Culver City, CA and Billerica, MA• Primary Focus on Aerospace & Defense
Trusted Industry Specialists• Seasoned Aerospace Engineers• Proven Technology & Processes
Certified Woman-Owned Small Business• ITAR-Registered Government Contractor• Certified WOSB, SBA 8(m)• Cage Code & Active DD2345
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Culver City, CA
Billerica, MA
TEN TECH LLC’S AREAS OF ANALYSIS EXPERTISE
• Stress & Deflection• Shock & Vibration• Fatigue Life Prediction• Thermal Analysis• Electronics Cooling• Fluid Dynamics• Aerodynamics• Kinematics• Vibro-Acoustic• Aeroelasticity
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HARSH ENVIRONMENTSRugged Electronics Systems, Mechanical & Thermal Loads
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AIR, SEA AND LAND RUGGED ELECTRONICS
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THERMAL & MECHANICAL HARSH ENVIRONMENTS
• Transportation• Take-off & Maneuvering Loads• Engine Structural or Acoustic Loads• Engine/Motor Thrust Transients• Pogo & Solid Motor Pressure Oscillations• Turbulence & Aerodynamics• Payload Release Loads• Pyrotechnic-Induced Loads• Electronics Operations & Heat Dissipation• Thermo-mechanical Effects• Flight & Onboard Equipment Operations• Impact & Explosions• Sun, Wind Gust, Icing
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HARSH ENVIRONMENTS IN TERMS OF ANALYSIS
Quasi-Static Acceleration
Sinusoidal Vibration• Propellers• Gunfire
Broadband Random• Transportation vibration• Engine & Propeller vibration• Aerodynamic pressure oscillations• Vibro-Acoustics
Shock Transient• Stage Separation, Engine Shutoff• Payload Release• Explosive Environments
Thermal Cycling & CTE Mismatch• Board & System-Level
Thermal Management• Fan Sizing and Placement• Dust Filters Selection• Components Junction Temperatures• Airflow Path Optimization
Environmental Heating• Altitude Considerations• Solar Radiation• Storage Extremes
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TYPICAL ENVIRONMENTAL GUIDELINES
Mechanical• Shock & Crash• Random Vibration• Sine-on-Random• Explosion & Blast
Thermal• Temperature & Altitude• ECS & Fans Failure
Thermo-Mechanical• Thermal Stress• Interface Gapping
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ATR CHASSIS ANALYSIS EXAMPLESMIL-STD-810G Shock, Vibration and Thermal Analysis
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PERFORMANCE VALIDATION BY ANALYSIS
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AIR TRANSPORT RACK (ATR) SYSTEM EXAMPLE
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Backplane
Wedge-Lock
Payloads
ATR Chassis & Payloads
RADAR SYSTEM RANDOM VIBRATION ANALYSIS
Complete ATR Chassis 3D CAD Model• Brazed Aluminum Plates Design• STEP File of Fully Populated Assembly
System-Level Model• Assembly FEM from CAD Product Structure• Modeling of Brazed Joints• Modeling of Fasteners & Bolts
Sine-on-Random Vibration Analysis• Structural Margins Calculations• Fatigue Life Estimates• Structural Members• Solder Joint Fatigue
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SINGLE BOARD COMPUTER THERMAL CYCLING
CTE Mismatch Analysis• Warping of PCB• Gapping of Thermal Pads• Stress Concentration on Components• Low Cycle Fatigue Issues
Thermo-Mechanical Solution• Non-Linear Analysis• Boundary Condition Sequence
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CLOSING REMARKSSummary, Q&A
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SUMMARY
Analysis of Aerospace Systems is Complicated• Large Models, Complex Geometry• Numerous Requirements Across Multiple Disciplines• Many Potential Failure Modes• System-Level and Component-Level Analysis
Requires High-End CAE Tools• Strong Integrated Multi-physics Environment• Excellent Model Abstraction Functionality• Advanced Meshing Functionality• High Performance Solver Technology• Cluster-Ready Solver
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