Electronics Systems

From Chip to

System From Specification

to maintenability

Electronic

design and

manufacturing

Expertise &

Consultancy

in software

security

Expertise &

Consultancy in

Electronics

ASIC design and

Manufacturing

2

3 companies in France :

1 Company in Germany : since september 2009

Created in 1991 / On Alternext Market

Turnover 2010 : 56 M€

2 M€ investment / year

10 000 m² facilities

650 Engineers & Technicians

3

GmbH

&

Turnover per company - 2009 Turnover evolution

Turnover per field of activity

4

0

10

20

30

40

50

60

70

2005 2006 2007 2008 2009 2010 2011

2005

2006

2007

2008

2009

2010

2011

Serma Technologies

25,636%

Serma Ingenierie

26,336%

ID MOS7,6

11%

Serma GmbH 12,5

17%

► Quality reference:

- ISO 9001 V2008 on all offices

- Avionics : level B, accreditation PART 21G et PART 145, FAR 145

► R&D activities :

- High temperatures electronics, PCB technologies, diagnostics, MEMS…

- Member of more than 6 “Competitivity clusters” : Aerospace Valley, Minalogic,

Move’o, ASTech, Route des lasers (Alpha),…

°

°

° °

PARIS - ILE DE FRANCE Electronics Technology

Software Safety R&D

BORDEAUX Headquarters

Electronics Technology ITSEF

R&D

TOULOUSE Electronics Technology

R&D

GRENOBLE - Minatec

Electronics Technology

Micro-Electronics

UK Sales office

TUNISIA Electronics Technology R&D

BULGARIA, ASIA (partners)

SERMA Gmbh Sales offices

Nuremberg, Berlin, Cologne

°

ITALY Sales Office

CANADA Sales office

°

Electronics design and Modeling

Electronics equipment production and

maintenability

Working model : Work packages, services,

on-site, customized platforms

Staff: 200 people including 90%

Engineers & technicians

Means: 1000 m² of technical offices

Analyse

Evaluate

Control

The functional safety of your system

►Audit of development processes

►Secutiry Analysis (APR, AMDEC, FT…)

►Security files setup

►Specifications validation (system / software)

►Software FMDS Analysis (Critical code reading, Software AMDEC)

►Tests files setup, cover evaluation

Specialist in design and production of specific integrated circuits

► Digital, analog and Mixed ASICS.

ID MOS works within its offices in Gradignan, in Tunisia and some

partners in Bulgaria and Asia.

►Expertise & Consultancy on components, boards &

Systems.

►Test and physical analysis laboratories

►Training

►R&D partnerships on innovative technologies Our Means

►Staff: 150 including 90% Engineers & Technicians

►5000 m² of laboratories

►6000 expertises per year

►25 M€ Equipments

SERMA TECHNOLOGIES works within its offices and laboratories in Pessac,

Fontenay-aux-Roses, Grenoble and in Tunisia

• Technological Analysis

– Construction Analysis

– Physical and Chemical Characterization

– Critical Process Analysis (Construction analysis of the system)

– Integrated Circuit modification with “Focused Ion Beam” (FIB)

– Components batch securing

– DPAs

– Solderability tests

– PIND Test

• Failure Analysis

– Electrical and physical defect identification

– Failure mechanism understanding

– Corrective actions plan

Certified

- Optical microscopes (up to 2400 x 2400)

- Scanning Electronic Microscope with EDX system

- Castaing Microprobe (WDS)

- Micro-Fine X-Ray

- Acoustic microscope

- X-Ray Fluorescence

- Transmission Electron Microscope

- Polishing & micro-sections

- Wet etch and plasma dry etch

- Micro-probing

- Laser Cutter

- PIND Test

- Emission microscope

(EMMI, OBIRCH)

- Pull Test, Shear Test, Ball Shear Test

- Wetting balance (solderability test)

- Focus Ion Beam

Main testing devices

components batch securing

• Level 1

– External Visual Inspection

– X-Ray Inspection

– Chemical opening on one part &

Internal visual inspection

– Chip marking record

• Level 2

– Solderability test

– Scanning Acoustic Microscopy (SAM)

– I(V) Electrical Test

A simple offer, adaptable to your needs, and up to functional test (around 7000

test programs in SERMA’s Library).

Electrical test and characterization

- Development of test solutions

- Go / NoGo Test, Upscreening (7000 test programs in

our library)

- Parametric characterization (AC / DC, Functional)

- Qualification according to standards (ESCC, MIL,

AECQ100…) including radiation tests.

- Customized evaluation (non-standard specifications)

- ESD, Latch-up, Electromigration

Verigy Pinscale 93000

Main testing devices

Logics & Memories

- Verigy Pinscale 93000 (448 digital channels, 1800MSps)

- Schlumberger EXA ITS 9000 (256 pins, 100 MHz)

- Schlumberger EXA 3000 SOC mixed (280 pins, 200 MHz)

- Schlumberger S15 – 128 pins to 20 MHz (x 2)

- Sentry 1650 (256 pins, 20/40MHz)

Analogs & Mixed

- Teradyne A370

- HP 9472

- LTS2020

- Specific test benches for IGBT,MOS,ADC/DAC components under LABVIEW

software

Main testing devices

Actives , Passives & Specifics

- Eaton & HP 9470

- Applicos ATX 7002 : Test Station for components DAC et ADC

- Various test benches for L-R-C (HP4095, HP 4094)

- ESD (Keytek MK2-SE, 256 channels, Oryx Orion)

- Latch-Up (Oryx 11000EX, 384 channels)

- Semiconductor reliability (Quali Tau)

Environmental Tests

- Thermal cycles / Thermal shocks

- Temperature & humidity

- Pressure Cooker & Hast

- High-temperature storage, Burn-in,

- HALT (-100°C / +250°C ; 70°C / mn ; 70 g)

- HASS …

- Mechanical tests

More than 15 years of expérience in « Post

Programming Burn-in »

- 700 Devices

- 100 different designs

SERMA has ACTEL’s Accreditation (on AVL

« Approved Vendor List »)

Well known families: RT1280, RT14100,

RTSX32SU, RTSX72SU, RTAX250,

RTAX1000, RTAX2000, RTAX4000

One stop solution for full back-end production

• Physical Expertise

– Physical / Chemical Analysis

– Focused ion Beam imaging

– Transmission Electron Microscopy

– Atomic Force Microscopy

– Metallic and molecular contamination

– Sample preparation

• Electrical Expertise

– Circuit Edit with FIB

– ESD expertise (Tests, Consulting,

Audits, Protection design)

– Latchup characterization

– Electromigration

– Failure Analysis on IC

– Lifetime test

Industrialization Production

Preliminary

project Maintenability R&D

R&D Technologies et composants

Supply Chain Control and management of components

Quality Insurance Obsolescence, Components database, PPAP

Training Bring technologies / Quality culture and skills to your company

Qualification Components, process, boards, system

Specifications Functional analysis, mission profile

Benchmarking Analysis

Technological choices Technologies and components

Sub-contractors selection, Lean manufacturing, Audit Assistance

Reliability, robustness, Qualification, computation, DFR/DFT Plans

Field return, root causes research Capitalization

Robustness test

plen definition

Reliability Improvment Plan

Axis : Robustness Axis : Lifetime

Reliability test plan

defintion

Quality analysis of the

Components

Assembling

Robustness tests

management and

realization

Reliability tests

management and

realization

Audit process

d’assemblage

Mission profile analysis

Constraints identification

Risk Analysis :

Components technologies

Sensitivities identification

Axe : Process

Qualification test

plan definition

Axis : Qualification

Qualification tests

management and

realization

Risk Analysis :

Components

Assembling

« 4 Axis »

Method

• Objectives

– Sub –contractor qualification

– New products integration

– New technologies introduction

• For the customer:

– Quality and reliability improvment

– Mastery of manufacturers quality

– Upgrading your suppliers in adequacy with used technologies

– Manufacturing process improvment plan definition (can be at prototype phase)

– Support for supplier qualification and choice

• Activities

– Preparation

– Audit

– Synthesis and report

Analysis and monitoring of status of obsolescence and durability of your BOMs

• TECHNOLOGIES : Lead free…

• MANUFACTURING: Board and process

• AUDIT : Manufacturing lines

• FAILURE ANALYSIS

• TECHNOLOGICAL ANALYSIS

• SUPPLIER QUALITY INSURANCE: PPAP…

• CONTROL: IPC…

• RELIABILITY: MTBF, AMDEC…

• SMART CARDS

• SOFTWARE SECURITY AND RELIABILITY

Training