Electronic Products - March 2010

Elect ronicPRODUCTSNo-nonsense tools for the busy EE

Test and measurement tools FPGA coprocessing Mechatronics

MARCH 2010

In This Issue...

electronicproducts.com

A Hearst Business Publication

p33

POWERSpecial

Data acquisition just got a lot easier.

More ways to control. More ways to connect.The new Agilent 34972A Data Acquisition Switch Unit takes our best-selling Agilent 34970A

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>> Find out what else LabVIEW can do at ni.com/imagine/rf 866 337 5041

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COVER STORYPOWER SPECIAL

33 This Special features a variety of contributed articles examining some of the hot topics and trends in energy efficiency, generation, and backup for power designs

35 The true cost of UPS ownership

38 Batteries are only as reliable as the connectors

42 Good vibrations for energy harvesting

47 Understanding features and specs of today’s LDOs

51 Battery power from DMFCs for consumer, military apps

57 Cost effectively meeting energy-efficiency targets

65 Comparing active PFC and passive attenuation

70 OC, OV protection shrinks USB port electronics

FEATURES

17 Test & Measurement ToolsLatest test gear supports the LTE rollout

22 FPGAs, PLDs, and ASICsThe evolution of FPGA coprocessing

28 MechatronicsTesting wind-turbine software with HIL simulation

Vol. 52, No. 10 MARCH 2010CONTENTS

Mechatronics Testing wind-turbine software with HIL simulation

11Test & Measurement Tools

17OUTLOOKAdhesion device for climbing the walls

28

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ENERGY-SAVING/ALTERNATIVE ENERGY

74 Meeting 30 mW standby in mobile phone chargers

DEPARTMENTS7 Viewpoint: Robot me, robot you

8 Product of the Year Story Behind the Story: Digital control becomes a reality

11 OUTLOOK (Technology News)◾ Adhesion device could have us climbing

the walls ◾ Electric vehicle is readied for U.S. Postal Service◾ 100-mm-diameter graphene wafers promise

high-speed electronics◾ Researchers find practical way to harvest power

in small amounts◾ The Embedded Systems Conference underway

April 26-29 in San Jose

76 Product Roundup: Wire & Cable

NEW PRODUCTS

77 Integrated Circuits

79 Power Sources

85 Optoelectronics

86 Test & Measurement

88 Components & Subassemblies

91 Packaging & Interconnections

95 Boards & Peripherals

Electronic Products Magazine (USPS 539490) (ISSN 0013-4953)—Published monthly by Hearst Business Communications Inc./UTP Division, Uniondale, NY 11553. Periodicals postage paid Uniondale, NY and additional mailing offices. Electronic Products is distributed at no charge to qualified persons actively engaged in the application, selection or procurement of electronic components, instruments, materials, systems and subsystems. The publisher reserves the right to reject any subscription

on the basis of information submitted in order to comply with audit regulations. Paid subscriptions available: U.S. subscriber rate $65 per year, 2 years $110. Single issue, $6.00. Information contained herein is subject to change without notice. No responsibility is assumed by the publisher for its accuracy or completeness. Postmaster: Send address changes to Electronic Products, PO Box 3012, Northbrook, Il 60065-3-12. Phone 516-227-1300 ©2010 by Hearst Business Communications Inc./UTP Division. ALL RIGHTS RESERVED

Publications Mail Agreement Number 40012807. Return Undeliverable Canadian Addresses to: Station A PO Box 12, Windsor, ON N9A 6J5

LDOs solve portable power management challengesAnalog Devices, Norwood, MA

Large panel LCD/LED lighting considerationsAnalogicTech, Santa Clara, CA

what’s ONLINE...electronicproducts.com

Developments in PoE siliconMicrosemi, Irvine, CA

Achieving buck-boost functionality with existing battery chargersSummit Microelectronics, Sunnyvale, CA

New packaging, MOSFETs meet power supply needsTexas Instruments, Dallas, TX

Circuit protection for industrial controllers, supplies, and portable equipmentTyco Electronics, Harrisburg, PA

and more!

ELECTRONIC PRODUCTS http://electronicproducts.com MARCH 2010 5

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VIEWPOINT

Robot me, robot youWill your favorite TV robot soon be

knocking at your door?

We all grew up watching movies and TV shows that included robots, from cartoons like the Jetsons to dramas like Lost in Space. Robots still continue to draw awe even in the biggest blockbuster movies

like Avatar. When I was six years old, I saw the first Star Wars. I came out of that movie thinking when I grew up, or at least by now, I’d have a robot to do everything from menial task like washing dishes to advising me on what to do in complex situations. Okay, maybe I was getting ahead of myself, but I was only six. . . .

Now it’s 2010, and I still have no robot to do my bidding. So it got me wondering how plau-sible is it for us to see robots similar to those is the movies in the next 10 years, or so, based on current robotic development being worked on right now from companies and the military to research universities.

When they show upMy first reaction, as a child, was one of won-der, maybe because of George Lucas’ setting for Star Wars, but not all people see robots the same way. From my experience, most people either have one of two reactions when they see or meet (yes, meet) a robot: either they love it or they think it is just plan creepy, es-pecially the android form.

Why? My guess is that creators, whether in enter-

tainment or technology itself, draw from what they know best their own inner human psyche and how we interact with the world. For some those similarities are too much. For others it is a wonder.

While doing my research the one thing I determine quickly was there is no com-mon definition to what a robot is or must be. So how do we define the word “ro-bot”? This is a tough one.

Most sources described androids over robots. For example, the Merriam Webster Dictionary defines a robot as “a machine that looks like a human being and per-forms various complex acts (as walking or talking) of a human being” and an an-droid as a “mobile robot usually with a human form.” The Oxford English Dictionary defines a robot as “a machine capable of carrying out a complex series of actions automatically, especially one programmable by a computer.” While less dramatic of a definition, it is also very simple one that allows even children’s toys to be classified as robots.

So to define a robot is a bit harder than one expects and one we may never agree upon. The word’s origin though comes from the Czech for “forced labor,” as Len Schiefer, Electronic Products’ Copy Chief, pointed out to me. (Huh…Interesting.)

Movies vs. realitySo, how do our favorite movies and TV robots stack up to real life? Will they be a reality in the next 10 years? Next month, find out if your favorite robots will soon be knocking on your door. . . .

Bryan DeLucaComment at http://www.eebeat.com/?p=1408

EDITORIAL STAFF 516-227-1300 FAX: 516-227-1444

Managing Editor Bryan DeLuca

Senior Editor Paul O’SheaPower Sources, Power Management,Discrete Semiconductors, Circuit Protection, Cooling Devices941-359-8684 • [email protected]

Editor Christina NickolasAnalog/Mixed-Signal ICs, Analog EDA Software, Oscillators, Electromechanical Switches, Prototyping Tools, Microwave Components516-227-1459 • [email protected]

Technical Editor Jim HarrisonDigital ICs, Boards & Peripherals, Development Tools, Motors & Controls 415-456-1404 • [email protected]

Editor Richard ComerfordTest & Measurement, Optoelectronics, Sensors & Transducers, Enclosures, Cabinets, Chassis516-227-1433 • [email protected]

Assistant Editor Christina D’AiroPassive Components, Interconnections, Wire and Cable, Materials 516-227-1383 • [email protected]

Chief Copy Editor Leonard Schiefer

Custom Media Editor Beth Croteau

Creative Director Daniella Abruzzo

Art Director Don Wilber

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Electronic PRODUCTS


The high-power output and integrated digital pow-er control functions are making their way into the marketplace as they address increasingly

complex and challenging power management needs. The stumbling block for this technology, however, has always been providing these capabilities at a competi-tive price.

The SMB211 from Summit Microelectronics fulfills the need for simplifying power management designs, especially in multirail applications. It’s an intelligent power conversion and control product that can be used in multiple configurations on a single board, thereby minimizing costs associated with the qualification, in-ventory, manufacturing, and experience of a higher number of devices. Additionally, the device’s versatility in functional and parametric performance allows the optimization of each rail, thereby making the appro-priate tradeoff between space, efficiency, and power de-livery rail by rail.

Summit engineers managed to develop this powerful design concept at a competitive price, but it didn’t come without a challenge. One of the most difficult tasks was to ensure seamless integration between the analog (pow-er) and the digital sections and by doing so to make no performance compromises. Another challenge was to en-sure a low product cost/price for enabling digital power management for the masses, which was the initial goal for the SMB211 development.

While digital control can be defined to allow hundreds of functional and parametric configurations, the team needed to focus on key functions and also provide easy-to-use tools (graphical user interface, etc.) to allow a very fast learning curve for the engineering community and avoid hurdles associated with product complexity. After all, power management is a daunting task for many of the young engineers and digital control is also a relatively new concept on the marketplace. So, the goal of combin-ing the two should be to simplify product evaluation/de-sign and to improve system performance and not to make the engineering tasks more painful.

Paul O’Shea

Digital control becomes a reality

www.schurterinc.com/new_pems

Schurter has expanded its range of IP rated power entry modules to include series 6100 appliance inlet, offered with IP 54 protection to the equipment as well as the power inputSeries 5707 filtered power entry module with fuseholders provides IP 65 protection to the equip-ment, and now also offers optional IP 54 protection at the power inputInlets for both series are according to IEC/EN 60320, C14 Class I or C18 Class II.Series 5707 features:- 1- or 2- pole fuseholders for 5 x 20 mm fuses- EMC filter with shield in standard and medical versions (M5 or M80), rated from 1 – 8 A at 250 VAC- Series 6100 appliance inlet rated 15 A / 250 VAC and 10 A /250 VAC - Both series are ENEC and cURus approved for use in equipment according to IEC/UL 60950 and IEC/UL 60601-1- Available with UL/CSA Hospital Grade cord set Nema 5-15P and cord retaining device

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Power entry modules provide seal protection against particles and liquids

PRODUCT OF THE YEARTHE STORY BEHIND THE STORY

ELECTRONIC PRODUCTS http://electronicproducts.com MARCH 20108

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News about Products... Product Technology... Product ApplicationsOUTLOOK


Adhesion device could have us climbing the walls

Early prototypes of the battery-operated pump provide enough tension to hold up to 30 g

Researchers at Cornell University have created a switchable adhesion device that could one day al-low objects — or even people — to cling to walls.

The palm-sized device was invented by Paul Steen, profes-sor of chemical and biomolecular engineering, and Mi-chael Vogel, a former postdoctoral associate, and uses wa-ter surface tension as an adhesive bond.

The device consists of three plates. The top plate is fl at and patterned with holes measuring one-millionth of meter across. The middle plate is also porous and the bot-tom plate contains a small liquid reservoir.

An electric fi eld created with a common 9-V battery is used to pump water through the device, causing droplets of water to squeeze through the top layer. The surface ten-sion of the exposed droplets causes the device to adhere to another surface. The adhesion can be switched off by simply reversing the electric fi eld.

Professor Steen noted that one of the biggest challeng-es the researchers faced was keeping the droplets from coalescing when they got close together. To solve this, the pump was designed to resist water fl ow while it’s turned off. Early prototypes of the device had about 1,000 300-μm-sized holes and were able to hold about 30 g of weight

once adhered to a surface. The researchers found that scaling down the size and increasing the number of holes on the device increased the amount of adhesion force. They estimate that a 1-in.2 device with millions of 1-μm-sized holes could hold more than 15 lbs.

Once the pump mechanism is perfected, the researchers hope to create more advanced prototypes for devices that will not only be able to create stronger adhesive bonds, but also cover the water droplets with thin membranes that could be controlled by the pump and potentially exert small, simul-taneous forces.To view a video of the device in ac-tion, visit http://www.news.cornell.edu/stories/Feb10/adhesive.html. For more information, visit http://www.news.cornell.edu/stories/Feb10/SteenAdhesion.html.

Christina D’Airo

Cornell’s surface tension-based adhesive device could one day allow objects, and people to cling to the walls.

AC Propulsion and AutoPort will partner in engi-neering, development and conversion to provide an electric vehicle con-

version prototype for the United States Postal Service. The USPS chose it as one of fi ve solutions in a feasibility study for the possible conver-sion of its 142,000 long-life vehicles (LLVs) to plug-in bat-tery electric vehicles.

The design will be stripped of the gasoline engine, trans-mission, and other compo-nents and refi tted with the AC Propulsion AC-150 drive system, an integrated power system that includes an ac

Electric vehicle is readied for U.S. Postal Service

induction motor, inverter, charger, and 12-V power sup-ply. AutoPort will convert the vehicle on-site at its facili-

ties in New Castle, DE. The converted vehicle will com-ply with Guidelines for Elec-tric Vehicle Safety SAE J2344 and all applicable Federal Motor Vehicle Safety Stan-dards.

The EV solution offers a revenue-producing potential of Vehicle-to-Grid (V2G) technology integrated into its drive system. It is the only V2G-capable drive-train worldwide. “For AutoPort,

this is a landmark day in our history, to be one of the com-

OUTLOOK


100-mm-diameter graphene wafers promise high-speed electronics

A team of researchers from the Electro-Optics Center (EOC) Material Division at Penn State University were able to produce graphene wafers

with a diameter of 100 mm — exceeding the previous dem-onstration of 50 mm. This is considered a major achieve-ment in the development of graphene because it promises to enable next-generation high-power high-frequency electronic devices.

For a while now, graphene has been under the scope of sci-entists for its remarkable chemi-cal and structural properties. A two-dimensional form of graph-ite, graphene consists of tightly bound carbon atoms in a hexag-onal arrangement resembling chicken wire.

This new development in graphene was conducted by using silicon sublimation, where the team thermally pro-cessed silicon carbide wafers in a high-temperature fur-nace until the silicon moved away from the surface, leav-

ing behind a layer of carbon that formed into a one- to two-atom-thick fi lm of graphene on the wafer surface. This 100-mm-diameter wafer was claimed the largest

commercially available for sili-con carbide wafers.

According to Joshua Robin-son, a materials scientist at EOC, the university is currently fabri-cating fi eld-effect transistors on the 100-mm graphene wafers and will begin transistor perfor-mance testing in early 2010. The teams goal is to improve the speed of electrons in graphene made from silicon carbide wafers to closer to the theoretical speed, approximately 100 times faster than silicon. That will require improvements in the material quality, says Robinson, but the technology is new and there is

plenty of room for improvements in processing. E-mail Joshua Robinson at [email protected] for more informa-tion.

Christina Nickolas

This graphene wafer contains more than 22,000 devices and test structures. Source: EOC.

Researchers find practical way to harvest power in small amounts

At the International Solid State Circuits Conference (ISSCC) in San Francisco, CA, last month, Massa-chusetts Institute of Technology Prof. Anantha

Chandrakasan and alumnus Yogesh Ramadass unveiled energy-scavenging systems being developed that could create power from temperature differences of just 1° or 2°, producing about 100 μW of usable power.

As a result of research over the last decade, power con-sumption of sensors, processors, and communications devices has been reduced to the point where it is possible to run systems, such as a wearable thermal-harvesting system, from very low power. However, existing power harvesters are limited by their controlling interface cir-

cuitry: commonly used full-bridge rectifi ers and voltage doublers severely limit the electrical power extractable. In addition, the power consumed by the control circuits themselves make it impractical for them to be used to harvest small amounts of power.

To overcome these limitations, the team developed a bias-fl ip rectifi er that improves on the power extraction capability, making it more than four times greater than that of existing full-bridge rectifi ers. The team demon-strated an effi cient control circuit, implemented in a 0.35-μm CMOS process, with embedded dc/dc buck and boost converters that can share their fi lter inductor with the bias-fl ip rectifi er, thereby reducing the volume and com-

panies selected by the USPS to participate in their demon-stration project involving the conversion of an LLV to an all Electric Vehicle,” said Roy Kirchner, president of Auto-Port. “We believe that electricity is the right fuel for the USPS delivery fl eet, and by including V2G capabilities, our solution will give the lowest total cost of operation.” AC Propulsion and AutoPort’s solution will be tested against

the USPS’s requirements at AutoPort’s facilities, and then will be placed into service in the Washington, DC-metro area for at least one year, where they will be monitored for carrier satisfaction, cost of operation, and maintenance. For further Information, call Yee Chow at 646-912-9798 or e-mail [email protected].

Paul O’Shea

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OUTLOOK


The Embedded Systems Conference underway April 26 - 29 in San Jose

The Embedded Systems Conference will be happen-ing from Monday April 26th to the 29th at the McEnery Convention Center in San Jose, CA, with

sessions starting 8 a.m. Monday. The Exhibition hours are Tuesday noon to 8 p.m, Wednesday 11:30 a.m. to 7:00 p.m., and Thursday 11:30 a.m. to 4:00 p.m. Here is a sampling of prod-ucts you can see on the exhibit fl oor:

GrammaTech (www.grammatech.com) will have its CodeSonar source code analysis tool on hand, which is now fully sup-ported for all cur-rent versions of Windows, along with Linux, So-laris, and Mac OS X. The tool features expanded security-related checks that enforce C/C++ se-cure-coding rules provided by the Build Security In (BSI) software assurance initiative of the De-partment of Homeland Security.

Synopsys (www.synopsys.com), in booth 715, will show its language and model-based high-level synthesis (HLS) technology that provides an effi cient path from algorithm concept to sili-con. Designers can construct high-level algo-rithm models from MATLAB language and IP model libraries, and then use the Synphony HLS engine to synthesize optimized RTL implemen-tations for ASIC and FPGA architectural explora-tion and rapid prototyping. Synphony HLS also generates high-performance C models for sys-tem validation and early software development in virtual platforms.

VIA Technologies (www.via.com.tw) will demonstrate

the VIPRO VP7806 and VP7815 fanless panel PCs with TFT 6.5- or 15-in. LCD touchscreens. These two systems are based on VIA’s recently released EITX-3000 board with a 1.3-GHz VIA Nano processor and 1-Mbyte L2 cache.

At booth 1538, WinSystems (www.winsystems.com) will roll out its EBC-Z530 Atom-based SBC, which features a rich array of on-board peripherals and supports the new SUMIT (Stackable Unifi ed Modular Interconnect Technology) interconnect with either Pico-I/O or SUMIT-ISM boards for ex-pansion. The company is also showing its high-speed dual-channel CompactFlash (CF) cards with extended temperature operation.

AppliedMicro (www.appliedmicro.com) (Applied Micro Circuits Corp.) will announce the APM 82xx processor, a single-core system-on-chip targeting multifunction storage applications for the connect-ed digital home. The chip offers a cost-effective 1-GHz 2,000 DMIPS CPU with high fl oating-point

performance, en-abling consumer storage applications. The processor fea-tures PCI-Express, SATA, Gigabit Ether-net, and USB 2.0 in-terfaces.

Microchip (www.microchip.com) will be demonstrating its battery-friendly 8- and 16-bit PIC mi-crocontrollers with nanoWatt XLP eX-treme Low Power technology in booth 1116, including the l o w - p i n - c o u n t PIC24F04KA201 16-bit family, which

features 20-nA sleep currents and starts at less than $0.99 each in high volumes. Solutions for touch sensing and displays will also be featured in the Microchip booth, in-cluding PIC microcontrollers with integrated mTouch ca-pacitive touch-sensing modules and graphics display drivers.

Jim Harrison

For more on the Embedded Systems Conference from April 26 to 29 at the McEnery Convention Center in San Jose, CA, visit http://esc-sv09.techinsightsevents.com/.

WinSystems will show its EBC-Z530 Atom-based SBC

Microchip MCUs feature nanoWatt XLP low-power technology.

ponent count of the overall solution.The team’s present experimental versions of a thermal-

harvesting system require a metal heat sink worn on an arm or leg, exposed to the ambient air. “There’s work to be done on miniaturizing the whole system,” Ramadass

says. This might be accomplished by combining and sim-plifying the electronics and by improving airfl ow over the heat sink. For further information, call Jen Hirsch at 617-253-1682 or e-mail [email protected].

Richard Comerford

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Latest test gear supports the LTE rollout

Planned rollout of long-term evolution systems by major telecom firms has

instrument makers offering tools for lab and field

BY RICHARD COMERFORDEditor, Electronic Products

Last month, Verizon CTO Rich-ard Lynch announced that his company remains on track to

launch long-term evolution (LTE) services in as many as 30 markets this year. Networks in Boston and Seattle may have fully passed testing by the end of next month, with a for-mal launch of the fourth-generation transmission scheme later this year. In 2011, AT&T will also be moving to LTE, and T-Mobile, Vodafone, France Télécom, and Telecom Italia Mobile have publicly expressed their com-mitment to LTE. It “is the clear choice for the next leap in wireless technol-ogy,” according to market researcher In-Stat.

Now that the next-generation-wireless path is clear, test and mea-surement companies of all stripes are introducing new systems that allow users to make the key measurements necessary to ensure a reliable rollout. February has seen a number of new introductions, and it is expected that still more are to come.

LTE’s demandsWikipedia refers to LTE as “essential-ly a mobile broadband system with enhanced multimedia services built on top.” More formally, LTE is based on the LTE Terrestrial Radio Access Network technology specifications included in 3GPP Release 8 from the 3rd Generation Partnership Project organization (www.3gpp.org), and is

an evolution of the GSM/UMTS (comprising WCDMA and HSPA) sys-tems family. While the standard was approved by early 2008, it was only in November 2009 that carriers agreed on the technical profile of voice and SMS services.

LTE uses orthogonal frequency division multiple access (OFDMA) which, according to the global mo-bile suppliers association GSA (www.gsacom.com), provides several key benefits, including a significant in-crease in peak data rates, better cell-edge performance, less latency, and bandwidth scalability, and co-exis-tence with GSM/EDGE/UMTS sys-tems, as well as reduced capital-in-vestment and operating costs. The technical improvements have given rise to the need for new instrumenta-tion. The standard also covers use of multipath/multisignal transmission schemes, commonly referred to as multiple-input and multiple-output, or MIMO.

In or out?It has recently been suggested that Agilent Technologies (www.agilent.com) might be exiting the LTE busi-ness, since it recently sold its Net-work Solutions communications test business to JDSU (www.jdsu.com). However, Ron Nersesian, president of Agilent’s Electronic Measurement Group, confirmed that the company is “committed to test-technology leadership ... in next-generation standards such as LTE.” The recent divestment, the company points out,

Test & Measurement

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only involves network assurance so-lutions, network protocol test, and drive test products focused on wire-less network service providers.

At the Mobile World Congress in Barcelona, Spain, last month, Agilent showcased a host of its LTE test products, including:

Comprehensive MIPI X-Domain test solutions for wireless and im-aging applica-tions, with con-formance and compliance tests from packet to pixels.An RF test solu-tion for 2G/3G/3.9G using the Agi-lent MXG and PXB for real-time LTE eNB receiver testing and MIMO receiver implementation, and the PXA signal analyzer for RF trans-mitter testing of LTE FDD, LTE

•

•

TDD, HSPA+, and digital video standards such as DVB-T/H;One-box testers for R&D and manufacturing UE tests, includ-

ing the 8960 test set with interactive functional test (IFT) capability, which can serve as a single-plat-form test solution for mobile devices across their entire lifecycle.Drive test solution for LTE phones with comprehensive, in-teractive network performance testing:

•

•

throughput, throughput vs. loca-tion, carrier-to-interference ratio, MIMO capacity enhancement, and channel resource allocation.The SART LTE real time signal analyzer, which helps users de-sign and deploy equipment that meets specification and quality standards.The N9923A FieldFox RF vector network analyzer (VNA, Fig. 1) and the N9912A FieldFox RF Ana-lyzer for wireless installation and maintenance. The company was recently recog-

nized by Frost and Sullivan with a Best Practices Award for world mar-

ket-share leadership in LTE and WiMAX test equipment.

Testing multipath operationSome of the latest test in-strumentation is de-signed to test for handset

designs for the effects of mul-tiple path signals on their opera-tions.

MIMO relies on having two or more signals to carry different sets of data to and from a handset, thereby increasing the effective data rate. In the urban canyons of the world, these signals will be reflected along multiple paths and reach the hand-set in offset versions with different amounts of fading and noise.

LTE’s 3GPP standards define the test scenarios for such operations, and test equipment manufacturers are coming up with advanced instru-mentation for testing handset per-formance.

Aeroflex claims it has the first one-box test system for cell phone signal fading simulation: the 7100 Series digital radio test set (Fig. 2) with the fading-simulator software option. An inexpensive baseband tool for signal fading profiling, it “will save customers tens of thou-sands of dollars...and circumvent po-tential calibration errors that cause faulty test results. In addition, confi-dence is boosted by the repeatability of the fading profiles,” according to Phil Medd, product manager for Aeroflex Test Solutions.

The system uses digital fading simulators and noise generators to modify RF signals transmitted by the

•

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Fig. 2. The Aeroflex 7100 Series digital radio test set with fading simulator option lets users test handset designs to 3GPP standards.

Fig. 1. Agilent’s N9923A FieldFox VNA is designed to simplify field installation of LTE systems.


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“How can I tell if a power supply is reliable?”

© 2010 Agilent Technologies, Inc.

There’s an indicator on the front.It says “Agilent.” With a typical MTBF of 40,000 hours, over half-a-century of experience, and with more than 250 models to choose from, Agilent’s power supplies are the ones you can count on. In fact the array of our power supplies is so extensive, it wouldn’t fit on this page. For clean, low-noise, programmable power to countless DUTs, there’s an Agilent power supply with your name on it. Actually, it’s our name on it, but you know what we mean.

For free measurement tips and the Agilent Power Products brochure go to www.agilent.com/find/powertips

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7100 Series Thus the unit can emulate degradations intro-duced into the radio channel by real-life obstacles such as buildings and foliage, in accordance with the fading pro-files specified by 3GPP in 36-521-1. It lets users flexibly allocate cells and fading taps for LTE user equipment (UE) without the need for manual reconfiguration. The test scenarios are fully repeatable.

Pricing depends upon the hardware and software op-tions ordered, but a typical system with two RF carriers and 2x2 MIMO is approximately $100,000 and the fading simulator software option is priced at $10,000.

Late last month, the Propsim F8 MIMO over-the-air emulator (Fig. 3) was introduced by EB (www.elektrobit.com) to enable realistic performance testing of LTE devices. The system is based on a custom solution that EB previously delivered to LG Electronics.

Whereas traditional OTA testing usually focused on single-input/single-out-put (SISO) devices, only measuring power and an-tenna efficiency, the Prop-sim F8 is designed to let engineers evaluate all criti-cal parts of a mobile termi-nal design at once, includ-ing antennas, RF front end, and baseband processing.

Designed to drive an-tennas in an anechoic chamber in which the handset to be tested has been placed, the technology-in-dependent radio channel emulator can be configured with up to 8 physical inputs / outputs, up to 16 fading channels, and up to 24 fading paths per channel. Stan-dard channel models include 3GPP SCM/SCME, constant, and pure Doppler. It supports 3,4,5,8 (single polarized) / 6,8,10,16 (dual polarized) OTA antenna configurations and one or two transmitter antennas.

A key aspect of the system’s performance is it use of real-time fading, in which characteristics are computed on the fly, versus the more static parametric fading used by other systems.

Down the lineLitePoint (www.litepoint.com), a pioneer in MIMO design testing, moved into manufacturing realm at the Mobile World Congress with the IQxstream mobile test system. The system is designed for testing nine 2G, 3G and 4G cellular standards: GSM, EDGE, CDMA One,W-CDMA, HSPA, HSPA+, CDMA-2000 EV-DO, and LTE 3G. The sys-tem has a 100-MHz capture bandwidth for multichannel capture, and uses a parallelism architecture to reduce per-device test time and cost; it can test adjacent channel leakage ratios (ACLR) in one five-channel capture.

The tester performs analysis, typically done sequential-ly, in parallel, using multicore processing, and it can test up to four devices in near parallel fashion, including those containing up to two transmitters and receivers.

Fischer Connectors, Inc.1735 Founders Parkway Alpharetta, GA 30009Tel: 800.551.0121Fax: 678.393.5401 [email protected]

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Fig. 3. EB’s Propsim F8 MIMO OTA emulator uses real-time algorithmic fading to provide complete handset testing in a way that can mimic real-world conditions.


from denisbul

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The evolution of FPGA coprocessing

Sustained processing performance is nearly equal to peak

BY MIKE STRICKLANDAltera, San Jose, CAhttp://www.altera.com

The architecture of an FPGA al-lows the implementation of many algorithms where the

sustained performance is much clos-er to the device’s peak performance than when using either a quad-core CPU or a general-purpose graphics processor (GPGPU). The strong benchmarking results from FPGA ac-celerators continue to improve with the appropriate focus on the silicon, arithmetic, and library founda-tions. Since even the larg-est FPGAs cur-rently consume less than 30 W, they can be used in many applications. Several trends are con-verging to make FPGA acceleration of algorithms more attractive. These include the following:

• FPGAs today are large enough to en-compass larger algorithms. It is now possible to fit options-pricing algorithms or 1-Mpoint fast Fourier trans-forms into FPGAs. The latency to off load an algo-rithm from the CPU to an FPGA is minor compared to the time saved by the algorithmic speedup.• Single-core CPUs have hit a power/cooling wall. The move to multicore CPUs is well underway, howev-er existing software writ-ten for single-core must be rewritten to extract parallelism for reasonable performance scaling.

• Active support of FPGA coprocessing. In some cases, these CPU interfaces — AMD with the Torrenza Initiative and Intel by licensing FSB and QPI to FPGA vendors — support 8 Gbytes/s speed with latency for posted writes of under 140 ns.

FPGA benchmark results have shown excellent Monte Carlo float-ing-point results using a socket accel-erator compared to dual quad-core CPUs or a GPGPU (see Table 1). How does an FPGA running at 150 to 250 MHz deliver better results than a

quad-core CPU running at 2 to 3 GHz or a 128-core GPU running at 1.35 GHz? As demonstrated in the Monte Carlo Black-Scholes algo-rithm, the FPGA architecture has unique capabilities that combine to deliver the impressive results.

Table 1. Monte Carlo Black-Scholes Performance Comparison (CPU and GPU results at 1M paths per option)

Monte Carlo 2 Quad-Core CPUs nVidia 8800 XD2000i + 2 EP3S260s

Precision Single Single Double

Paths per second ~240M ~900M 1.8G

RNG type Halton Halton Mersenne

Source RapidMind RapidMind XtremeData

Fig. 1. FPGA architecture.

FPGAs, PLDs, and ASICs


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Features of FPGA architectureFlexible FPGAs can be programmed and reprogrammed as needed. A typi-cal FPGA comprises an array of logic blocks, memory blocks, and DSP blocks, surrounded by programmable interconnects that can be configured with software (see Fig. 1). This archi-tecture enables the following fea-tures:

• Function parallelization: replication of a function many times.• Data parallelization: handling of data arrays or data matrices.• Custom instruction with pipelining: streaming data with one result per clock.• Huge primary cache bandwidth and size: 3X to 10X compared to GPGPUs.• Flexible routing of datapath: huge crossbar routing transfers data in one clock.• Concatenation of functions and data flow: all in one clock.• Custom off-chip I/Os: protocol, bandwidth, and latency as needed.• Scalable roadmap: larger arrays have

plenty of headroom for power and cooling.

The advantages for parallelization and pipelining are pretty obvious, but FPGAs also have an ad-vantage in primary cache and bandwidth over GPG-PUs. Within the FPGA, logic is surrounded by memory blocks. The XDI module has a 3.3-Mbyte primary cache with a bandwidth of 3.8 Tbytes/s — about 5 to 10 times larger than the primary cache (for streaming processors) on the nVidia 8800 GTX GPGPU.

The advantage also includes the

Table 2. Peak floating point performance of four solutions using the Black-Scholes benchmark

1:1 Adder/Multiplier 2 Quad-Core CPUs

nVidia 8800 XD2000i w/1 EP3S260

XD2000i w/1 EP3S260

Precision Single Single Single Double

Clock (MHz) 2500 1350 280 256

FP ops/cycle 8 2 1 1

# of Cores 8 128 384 192

Peak GFLOPS 160 346 108 49

Fig. 2. A foundation for FPGA acceleration with a system-level solution.

FPGAs, PLDs, and ASICs The evolution of FPGA coprocessing

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FPGA’s ability to use the excess rout-ing bandwidth to construct the data path and memory access flexibly and directly to each logic block. The pro-

grammable interconnects shown in Fig. 1 provide a large amount of routing bandwidth. Modules and boards can be designed as needed for off-FPGA bandwidth, memory size, and latency, and I/Os can also be customized.

A final aspect of FPGA architec-ture is the ability to scale to larger ar-rays of logic, memory blocks, and DSP blocks. Logic and primary cache sizes scale together. With the largest FPGAs currently consuming about 30 W peak, the FPGA architecture has plen-ty of room to scale to new process ge-ometries without hitting current datacenter power and cooling limits.

While FPGA architecture has nu-merous outstanding capabilities, sev-eral areas must come together for a superior CPU coprocessing solution.

Silicon and arithmetic foundationsMost algorithms using double-preci-sion floating point have about a one-to-one ratio of addition and multi-plication operators. In an FPGA, the addition core uses logic, the multi-plication core uses the DSP blocks, so the FPGA must have a balanced ratio of logic to DSP blocks. Another FPGA feature is Programmable Power Tech-nology, which allows each logic block, DSP block, and memory block to be programmed to run in higher- or lower-power mode depending on


from denisbul

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Intel Embedded Solutions: Home Energy Management

© 2010 Intel Corporation. Intel, the Intel logo, Intel Sponsors of Tomorrow™ and Intel Sponsors of Tomorrow logos are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.

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Blue grid.eps

The evolution of FPGA coprocessing

the design timing requirements.Floating-point operator cores have

been improved to run at higher clock

speeds and to use fewer DSP blocks and less logic. Using a floating-point compiler, the logic to route 64-bit data paths between different floating-point operator cores can be reduced.

Combining the steps of normal-izing (converting fixed to floating-point format) at the end of one float-ing-point operation and then denormalizing (converting floating-point to fixed format) for the input of the next floating-point operation can be significantly reduced. The en-tire datapath for a mathematical ex-pression with floating-point opera-tions can be fused together, saving up to 40% in logic and increasing clock speed slightly.

The right mix of floating-point op-erators is important. If an algorithm has many transcendentals (expo-nents, logs, etc.), the FPGA can be configured with as many as are need-ed. In GPGPU designs, a few hard blocks are added for such functions, but at a much smaller ratio than sin-gle-precision floating-point logic. Function libraries are needed to em-ploy algorithmic tricks, abstract the hardware details, and optimize for particular FPGA resources.

Building on the silicon, arithme-tic, and library foundations, the sys-tem-level solution in Fig. 2 takes care of the tool chain, module/board de-sign, CPU interface, and data passing from the CPU to the FPGA-based ac-celerator by using the expertise of partner companies.

Enabling sustained performance close to peakFor tasks that can be parallelized or pipelined, FPGA capabilities fre-quently enable a much higher sus-tained performance relative to peak performance and keep all device re-sources available. Starting with an example of the Monte Carlo Black-

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Table 3. Monte Carlo Black-Scholes performance/power ratioMonte Carlo 2 Quad-Core CPUs CPU + nVidia 8800 CPU + XD2000i w/2 EP3S260sPrecision Single Single DoubleM results per second 240 900 1800

Performance/peak GFLOPS 1.5 2.6 12.0Power ~150W ~215W ~110WPerformance/watt 1.6 4.2 16.4Results/clock 0.1 0.7 6.4

FPGAs, PLDs, and ASICsADVERTISEMENT

Scholes benchmark, an equation pipeline was created to run at 150 MHz. n each clock, random numbers

generated on the FPGA by a Mer-senne Twister core were fed (concat-enated) into this “custom instruc-tion” with one result per clock. Twelve of these custom instruction pipelines fit in the two FPGAs on the module, yielding 12 × 150 M = 1.8 G results/s with double-preci-sion floating-point logic. With ad-ditional tuning, twice this perfor-mance is expected.

It is interesting to compare sus-tained vs. peak-performance float-ing-point capabilities of different ar-chitectures. Table 2 shows the peak performance for single-precision floating point for four possible solu-tions. Since the Black-Scholes equa-tion requires more functions (expo-nent, square root, etc.) than the usual addition and multiplication func-tions, the total GFLOPS in the Black-Scholes results are not counted.

Table 3 shows the ratio of Black-Scholes results to peak GFLOPS to get a relative measure of sustained per-formance vs. peak performance. The FPGA has the best sustained perfor-mance compared to peak perfor-mance. Also, the FPGA has the best raw performance in double-precision logic compared to single-precision logic for the other two accelerators, as well as the best performance/watt.

For many algorithms that con-tain parallelism or that can be pipe-lined, the sustained performance of FPGAs can approach peak perfor-mance due to excess routing band-width that enables a custom data-path, letting logic access memory or results from another logic block in one clock. While fixed architectures have a predetermined set of logic blocks for different functions, the FPGA can be configured to have the optimum ratio of logic functions for a given algorithm for the best use of device resources.


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Mechatronics

Testing wind-turbine software with HIL simulation

BY SAMIR BICOSiemens Wind Power A/SBrande, Denmarkhttp://www.siemens.com

For its wind turbine control sys-tems, Siemens’ engineers faced the challenge of improving the

automated testing of frequent soft-ware releases, as well as the testing and verifying during the develop-ment phase of the software’s ability to control the wind turbine’s mecha-tronic system components.

Software de-velopers regular-ly release new version of the controller soft-ware. Each time they do, the soft-ware needs to be tested to verify that the release will exe-cute reliably under the actual conditions experienced in a wind park. So with every software

release, our group must per-form factory ac-ceptance testing before the soft-ware can be used in the field.

Wind turbine complexityA wind turbine system is a com-plex electrome-chanical system consisting of sev-eral components, including a rotor, gears, a convert-er, and a trans-former that to-gether convert kinetic wind en-ergy to electricity (see Fig. 1). The turbine’s control system must in-terface with these

components through hundreds of I/O sig-

nals and mul-tiple communication protocols. The most complex part of the control sys-tem is the embedded control soft-ware executing the control loops.

Given the need to frequently test the control software, the new test system had to provide the ability to automate this process. The previous test system was developed 10 years ago and based on another software environment and PCI data acquisi-tion boards.

The old test system’s architecture and performance did not meet the new requirements for fast test time and scalability. It was difficult to maintain and did not have sufficient automation capabilities for efficient testing.

It also lacked automatic test result documentation and test-case trace-ability and did not provide the re-quired remote control capabilities. In addition, the old test environment did not support multicore process-ing, which prevented us from taking

Wind turbines like that used in the Lillgrund offshore wind farm in the sound between Malmö and Copenhagen are complex systems needing tight control by real-time software.

Fig. 1. Wind turbines consist of a complex system of multiple electromechanical components.

A new system using hardware-in-the-loop (HIL) testing of embedded-control software releases keeps turbines

up on the farm


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IRFS3006-7PPBF 60 2.1 240* 200 D2PAK-7

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ments. Also, the products high level of support and quality provided high confidence that the solution would fulfill the requirements for availabil-ity and reliability.

Since in-depth development ex-pertise for test systems was not avail-able in-house, the team contracted the development to CIM Industrial Systems A/S in Denmark. CIM Indus-trial Systems A/S has the test engi-neering capability available and the largest number of certified LabVIEW architects in Europe. Ultimately, this project’s success was due in no small part to CIM.

A flexible RT test systemThe new test system (see Fig. 2) simulates the behavior of the real wind-turbine components by run-ning simulation mod-els for these compo-nents in the LabVIEW Real-Time system. By using HIL, the simu-lator is able to supply the electromechani-cal simulation signals to the system under test without the need for actual hardware, and can do so in a much more flexible manner than the ac-tual turbine hardware could.

Running LabVIEW, the host computer provides an intui-tive graphical user interface that us-ers can easily adapt the system by moving the components in the panel (see Fig. 3). The Windows OS applica-tion also communicates with two external instruments that were not real-time compatible.

The software on the host com-puter communicates over Ethernet with the LabVIEW Real-Time mod-ule in a PXI-1042Q chassis. The module runs simulation software that typically consists of 20 to 25 simulation DLLs executing in paral-lel. This solution can call user mod-

advantage of the computing power of the latest processors.

Looking ahead for testAfter evaluating the technologies available, the development team chose LabVIEW software and PXI-based real-time and field-program-mable gate array (FPGA) hardware to develop a new real-time test system that would employ hardware-in-the-loop (HIL) testing of the embedded control software releases. The team saw this technology as giving the flexibility and expandability needed to meet future technical require-

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Fig. 2. The architecture of the Siemens Wind Power Test System permits flexible adaptation to changing demands.

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Testing wind-turbine software with HIL simulation

The new system’s benefitsThe new Siemens Wind Power test system has several benefits over the previous generation solution. Be-cause of the modularity of the sys-tem, it is easy to improve, adapt, and further develop. The system un-der test can be quickly replaced without any changes in the test sys-tem architecture. Remote-control capability and simple replication of the system gives the flexibility to copy the system to other sites as op-erations expand.

The simulator not only provides

an environment to effectively verify the new software releases and test special situations in our laboratory, it also gives us a tool to test new technologies and concepts we are working on.

The modular architecture allows us to scale-up the system to meet the growing requirements of rapidly evolving wind energy technology. We envision dividing the simulation to multiple LabVIEW Real-Time tar-gets to meet our future testing needs. NI TestStand will also be used to fur-ther automate test execution.

els built with al-most any modeling environment, in-cluding the Lab-VIEW Control De-sign and Simulation Module, Simulink software from The MathWorks, or ANSI C code. The execution rate of a typical simulation loop is 24 ms, leav-ing plenty of pro-cessing capacity to meet future expan-sion needs.

Customizing with FPGABecause of the lack of standards for wind turbines, a lot of custom com-munication proto-cols are used. Using an NI PXI-7833R FPGA-based multifunction RIO module with the LabVIEW FPGA Module make it possible to interface with and simulate these custom protocols.

In addition to protocol inter-facing, the FPGA subsystem is used to simulate magnetic sensors as well as for accurate three-phase voltage and current simulations. A second FPGA board is connected to an NI 9151 R Series expansion chassis to further increase the sys-tem channel count.

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Fig. 3. The system’s intuitive GUI lets users easily adapt the system by moving components.

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SPECIALPOWER

Present-day uninterruptible pow-er supplies (UPSs) under 10 kVA and their battery technologies

are the largest UPS market segment. They make up the bulk of the UPS units installed worldwide for busi-ness, industrial, scientific, IT, and home applications.

Since the UPS market is very large, the UPS business has become very competitive, with a large number of domestic and international UPS manufacturers to choose from. Un-fortunately, the selection is so large that consumers off all types, from a scientific laboratory to automated production, are often misled into buying a UPS on price alone, with-out fully understanding what they are buying or what the available op-tions are.

For home users this is typically not a problem, as they simply want to back up their home computer long enough to allow the operating sys-tem to perform an orderly shutdown. For the other applications, users face a costly learning experience if they buy a UPS on cost alone. Before con-sidering the purchase of a UPS, the user must know about the basic UPS design types.

UPS designsThere are three basic UPS designs: off-line, line-interactive, and on-line. They provide three different levels of backup and power protection.

Off-lineThe off-line UPS is the lowest cost and can provide basic battery backup and limited surge protection only. In

The true cost of UPS ownership

Batteries are at the heart of every UPS and the cost of ownership may be a hidden issue

every case, the unit is designed around low cost. Therefore in battery mode it does not provide a true sine-wave output and instead it has a very distorted quasi-sine and even square-wave outputs. When in utility power mode, the utility power is fed direct-ly to the UPS output without any power conditioning.

Line-interactiveThe line-interactive UPS is very simi-lar to the off-line, except it has an in-ternal automatic tap switching trans-former circuit (automatic voltage regulation or AVR) that at-tempts to maintain some output voltage regulation in gross steps. Depending on the cost of the line-interac-tive UPS, the battery mode output waveform could be quasi-sine-wave or true sine-wave in some cases.

Again, when in utility power mode, the utility power is fed directly to the UPS output, without any power conditioning. A good quality line-interactive UPS will cost substantially more than an entry level line-in-teractive model. This type of UPS is best suited for non-critical workstation based applications.

On-lineThe on-line UPS is the best-grade UPS. When powered by the utility source, it converts the ac to a regu-lated dc, thereby removing most unwanted utility power problems. It then regenerates new, clean true sine-wave output power 100% of the time, whether operating in battery or utility modes.

The on-line UPS acts like an elec-tronic firewall between the utility power and connected equipment. It is the best choice for use in any me-dium to large business, industrial, scientific, or IT application. The on-line UPS is the only truly generator-compatible UPS since, unlike other UPS types, it eliminates generator frequency shifts and voltage sags. As the on-line UPS incorporates a con-tinuous duty inverter, it supports the connection of extended runtime bat-tery packs, allowing runtimes over several hours.

Battery overviewBatteries are at the heart of every UPS and due to the large number of UPS units typically installed in a me-dium to large corporation, the cost of ownership may be a hidden and costly issue. Typically, the referenced UPS topologies use valve regulated sealed lead-acid (VRLA) type batter-ies as they provide the highest power density at the lowest cost.

BY MICHAEL A. STOUTFalcon ElectricIrwindale, CAhttp://www.falconups.com

Fig. 1. Trickle (or float) service life for 3 to 5-year-rated batteries.


Other battery types like lithium-polymer are far too expensive at this time. Until recent technology developments, the VRLA battery used in a UPS typically had a three to five year service life, if main-tained in a 77°F environment and properly charged.

Besides not maintaining the battery at the proper state of charge, heat is the greatest enemy of VRLA batteries. Per manufac-turer specification, should a three to five year life battery be installed into a 122°F environment, its ser-vice life will be shortened to less than one year.

A real-world exampleAs a real-world example, with the average UPS using from three to twenty VRLA batteries, a toll road company in the southwest would need many UPS units installed in toll booths, resulting in exceeding-ly high cost of ownership. The same is true for all types of production applications, where hundreds of UPSes are deployed and between the cost of the batteries and the manpower involved with changing batteries every other year becomes a drain on resources. Ironically, a UPS is supposed to increase the re-liability of the system it is power-ing but a weak battery can spell di-saster (see Figs. 1 and 2).

The VRLA battery service life can be shortened further by excessive discharge and recharge cycles. Of-fline and line-interactive UPS mod-els can excessively switch to battery

mode if installed in lo-cations where utility voltage or frequency regulation is poor. This is not the case with double-conversion on-line UPS models as they only draw power from the batteries when the utility volt-age is excessively low, or is lost completely. As the on-line UPS typi-cally costs a bit more, the battery chargers often are of a better de-sign and better main-tain the batteries charge state, resulting in a longer service life.

VRLA battery technology is ad-vancing, so look for a UPS compa-nies that offers products using newly designed batteries having a higher temperature rating and up to 12–year service life. Not only do these batteries reduce the number of battery replacements when in-stalled into a 77°F environment, but per manufacturer specifica-tions, the batteries will have a four–year service life when used in a 122°F environment.

A standard battery lasts less than a year at that temperature. These bat-teries are ideal for high temperature applications. A few UPS manufactur-ers have taken implementation of these batteries one step further by thermally insulating them inside of a thick wall plastic enclosure. This thermally insulates the batteries, adding to their service life.

The inside of enclosed equipment racks are often packed with heat gen-erating equipment which can raise the internal temperature of the rack to very high levels. Most UPS products designed for rackmount use secure their internal UPS batteries directly against the bottom surface of the UPS chassis. As the internal rack tempera-ture increases, it elevates the tempera-ture of the metal chassis surfaces, which is then conducted directly to the internal batteries, reducing their service life.

Proper UPS storageProper UPS storage is another factor that can affect battery life. When the UPS is disconnected and not used for

several months, the internal VRLA batteries will self-discharge. If stored for over six months they can become overly discharged to the point they cannot be recharged again, requiring a premature battery replacement. It is a good practice when storing a UPS to plug it in and recharge the batter-ies every four months to prevent this problem.

Dispose or recycleLastly, when replacing all VRLA batteries always dispose or recycle the spent batteries in accordance with all local and federal laws and regulations. VRLA batteries are classified as hazardous waste, but the good news is they can be almost entirely recycled.

With the microprocessor control-ling virtually every computer and piece of today’s electronic equip-ment, the selection of an on-line UPS assures the highest level performance and protects against the greatest number of potential power prob-lems. This ensures a successful inte-gration even with the most power sensitive equipment. It also provides reliable, worry-free operation of the equipment and eliminates costly tri-al and error approaches in attempt to save a few dollars. In the case of labo-ratory and biomedical applications an improvement of the equipment’s accuracy if often realized.

At the time of initial UPS purchase, maximize your return on investment by selecting a brand that offers 10 to 12-year service-life batteries. When deciding where to install the UPS, se-lect a location that will have as close to a 75°F temperature as possible. If the UPS must be installed in a loca-tion with elevated temperatures, schedule battery replacements ac-cordingly. Think of the UPS as the insurance policy ahead of your equip-ment. If the equipment is a used Hon-da Civic and you’re a college student, maybe not so much insurance is needed. However, as a professional, any automobile you rely on to get you from point A to B demands substan-tially more.

Fig. 2. Trickle (or float) service life for 10 to 12-year-rated batteries.

The true cost of UPS ownershipSPECIALPOWER

For more on uninterruptible power supplies, visit http://www2.

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SPECIALPOWER

Perhaps no device has undergone such continual evolution and development in the last 50 years

as the portable primary power source — the battery. Portability, miniatur-ization and computerization in elec-tronic devices have driven a good deal of this change. Common applications now include power source and memo-ry backup for computers, cell phones,

Batteries are only as reliable as the connectorsSuppliers of battery connection hardware

must now have their own in-house engineering and testing

remote controls, camer-as, control/assist in au-tomotive, utility meters, dataloggers, emergency tracking systems, secu-rity systems, RFID tags, and defibrillators, as well as other sophisti-cated medical and mili-tary applications.

Driven by these many applica-tions, changes are being seen in a variety of battery characteristics. Where alkaline and nickel cadmium

once dominated, now lithium-ion batteries are commonly used in por-table consumer electronics because of their high energy-to-weight ratios, lack of memory effect, and slow self-

BY LARRY NEMBHARDKeystone Electronics, Astoria, NYhttp://www.keyelco.com

Fig. 1. Despite advances in portable electronics, a device is still only as reliable as the connector that holds the battery.

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discharge when not in use. In addition to consumer electron-

ics, Li-ion batteries are also being used in defense, automotive, and aerospace applications. These cells are used not only for memory backup applications, but are now the primary power source for mobile electronics. The result is that Li-ion batteries are now available in a variety of shapes and sizes.

Performance goalsRegardless of change, the goals in bat-tery development over the years have remained the same: longer life, smaller and lighter packages, and more power delivered, economically and safely. Different applications, however, have different factors determining the type of battery required. When such factors are designed for, they become the fea-tures that achieve performance goals, such as new high-rate cells that fulfill the most reliable high-power output with low-space requirement and with high-pulse-current drain.

Low self-discharge is another per-formance goal leading to longer shelf life. Today, a five-year shelf life for lith-

ium cells is common and 10 years is common in certain demanding com-mercial and military applications. The lithium coin cells used for memory backup in computers are likely to out-last the hardware in which they are used. These examples demonstrate that as electronic products have grown, different demands requiring different designs have driven the evo-lution of the chemical battery. That is not all that has evolved, however.

Battery connectionsThere is a direct connection between the battery and the device it powers. The bridge between them is the con-nection device, and this has had to evolve as well. Time was when battery connectors were simply stamped, plat-ed and then riveted onto printed circuit boards and soldered. Early battery con-nectors were crude compared with to-day’s devices, which are often major components incorporating sophisticat-ed interconnection technology. As bat-tery connection devices have evolved, they have had to meet a number of challenges, including the following.

SPECIALPOWER

Rapid growth of designsThere are virtually as many battery holders, retainers, contacts, clips, straps and snaps as there are cell or battery configurations. Most configu-rations today are designed so that the batteries can be quickly and easily in-stalled and/or replaced. Many are available on tape-and-reel in addition to loose piece. They come in horizon-tal and vertical mount configurations, with single or multiple contacts for se-ries and parallel applications. These connectors are used on PCBs or in self-contained battery compartments. They may include such features as in-sulated polarization designs, inverse polarity protection and battery reten-tion latches.

Rugged constructionWhen batteries were larger, contacts could be larger. With the trend toward smaller and lighter designs, lighter contact forces must still provide reli-able connections. They have to be just as rugged as former connections to hold the battery securely while with-standing shock and vibration, but at a


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fraction of the size and weight.One solution to the problem of bal-

ancing strength and size has been to employ holders and retainers design and manufacturing technology to de-velop battery holders constructed of a combination of plastic and metal sub-components. Demanding applications where cost and space is a concern, stamped contacts and clips are used, such as the toy industry and promo-tional throwaway products. Retainer clips are available to lock the batteries in place while offering the lowest pos-sible profile and prevent loosening or shifting of the battery.

Design considerationsLower voltages and less amperage af-fect engineering on both sides of the connection. For example, less con-tact resistance is imperative, so con-tacts need to be made of the proper materials for given applications. Where such alloys as phosphor bronze and beryllium copper were once reserved for high-performance interconnects, they are now used in battery contacts as well.

Another design consideration is how to prevent the battery from be-ing put in the wrong way. By polar-izing the contacts, the battery hold-ers assure proper continuity and circuit protection.

High-density packagingWith space at a premium in many commercial and consumer electron-ics, not only the batteries, but also the holders and retainers are following a trend toward miniaturization. As a re-sult, low-profile holders and compact battery contacts are necessary. These components must be compatible with pick-and-place assembly systems; they should be balanced and lightweight for reliable tape packaging and ma-chine pick-up and placement.

Manufacturing costsToday, the cost of materials, includ-ing specialized plating, has made tooling an integral part of any appli-cation. Holders and retainers have to remain economical while providing reliable performance. Many manu-facturers must use high-speed press-

es to reduce cost for stamped con-tacts. Molds must be design with multiple cavities to reduce run time. Standard stock parts are made avail-able to meet most applications.

Environmental concernsIn the past there were few if any envi-ronmental concerns regarding battery disposal. Recognizing the devastating effect that lead, cadmium, and lithi-um, among other metals, have on the environment, the government now regulates the disposal of batteries.

Regulation, in turn, has encour-aged the development of battery hold-er designs that allow the batteries to be removed quickly and safely. The use of an inexpensive but durable connec-tion solution is seen in numerous bat-tery clip designs in today’s computers and electronics. When PCBs are dis-posed, the batteries on the boards may be disposed of separately. With the lat-est battery connectors, taking out a battery is as easy as putting it in. The battery holders and retainers have to be environmentally friendly and must be RoHS compliant.

Batteries are only as reliable as the connectors


SPECIALPOWER

The concept of energy harvest-ing has been around for a num-ber of years, the implementa-

tion of a system in a real world environment has been cumbersome, complex and costly. Nevertheless, examples of markets where an ener-gy-harvesting approach has been used include transportation infra-structure, wireless medical devices, tire pressure sensing, and the largest so far, building automation. In the case of building automation, systems such as occupancy sensors, thermo-

Good vibrations for energy harvesting

An integrated rectifier extracts energy from almost any sourcestats and light switches can elimi-nate the power or control wiring normally required and use a me-chanical or energy-harvesting sys-tem instead.

Similarly, a wireless network us-ing an energy-harvesting technique can link any number of sensors to-gether in a building to reduce heat-ing, ventilation, and air-condition-ing (HVAC) and lighting costs by turning off power to non-essential

areas when the building has no oc-cupants. Furthermore, the cost of en-ergy-harvesting electronics is often lower than running supply wires, so there is clearly an economic gain to

be had by adopting a harvested pow-er technique.

A typical energy scavenging con-figuration or system, (represented by the four main circuit system blocks shown in Fig. 1), usually consists of a free energy source such as a piezoelec-

BY TONY ARMSTRONGLinear Technology, Milpitas, CAhttp://www.linear.com

Fig. 1. The four main blocks of a typical energy-scavenging system.

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tric transducer attached to a vibrating mechanical source such as an HVAC duct or a window pane. These small piezoelectric devices can convert small vibrations or strain differences into electrical energy. This electrical ener-gy can then be converted by an ener-gy-harvesting circuit (the second block in Fig. 1) and modified into a usable form to power downstream circuits. These downstream electronics will usually consist of some kind of sensor, analog-to-digital converter and an ul-tra-low-power microcontroller (the third block in Fig. 1). These compo-nents can take this harvested energy,

now in the form of an electric current, and wake

up a sensor to take a reading or a measurement then make this data available for transmission via an ultra-low-power wireless transceiver — rep-resented by the fourth block in the circuit chain shown in Fig. 1.

Each circuit system block in this chain, with the possible exception of the energy source itself has had its own unique set of constraints that have impaired its economical viability until now. Low cost and low power sensors and microcontrollers have been available for a couple of years or so; however, it is only recently that ul-tra-low-power transceivers have be-come commercially available. Never-theless, the laggard in this chain has

SPECIALPOWER


Fig. 2. The LTC3588-1 circuit schematic converters a vibration or strain source into electric current.

been the energy harvester.Existing implementations of the

energy harvester block typically con-sist of low performing discrete con-figurations, usually comprising of 30 components or more. Such designs have low conversion efficiency and high quiescent currents. Both of these deficiencies result in compro-mised performance in an end sys-tem. The low conversion efficiency will increase the amount of time re-quired to power up a system, which in turn increases the time interval between taking a sensor reading and transmitting this data. A high quies-cent current limits how low the out-put of the energy-harvesting source can be, since it must first overcome the current level needed for its own operation before it can supply any excess power to the output.

Piezoelectric energy harvesterWhat has been missing until now has been a highly integrated, high-effi-ciency dc/dc buck converter with low-loss full-wave bridge rectifier that can


from denisbul

both harvest and manage the piezo-electric energy from a vibration or strain source. However, Linear Tech-nology’s new LTC3588-1 piezoelectric energy-harvesting power supply great-ly simplifies the task of harvesting sur-plus energy from such sources.

The circuit shown in Fig. 2 uses a small piezoelectric transducer to con-vert mechanical vibration into an ac voltage source that is fed into the LTC3588-1’s internal bridge rectifier. It can harvest small vibration sources and generate system power instead of using traditional battery power.

The LTC3588-1 is an ultra-low-qui-escent-current power supply designed specifically for energy-harvesting and/or low-current step-down applica-tions. It can interface directly to a piezoelectric or alternative ac power source, rectify the voltage waveform and store harvested energy on to an external capacitor, bleed off any excess power via an internal shunt regulator and maintain a regulated output volt-age be means of a nanopower high-ef-ficiency buck regulator.

The LTC3588-1’s internal full-wave bridge rectifier is accessible via two differential inputs, PZ1 and PZ2 that rectifies ac inputs. This rectified out-put is then stored on a capacitor at the VIN pin and can be used as an en-ergy reservoir for the buck converter. The low-loss bridge rectifier has a to-tal voltage drop of about 400 mV with typical Piezo generate currents, which are normally around 10 μA. This bridge can carry up to 50-mA current. The buck regulator is enabled once there is sufficient voltage on VIN to produce a regulated output.

The buck regulator uses a hysteretic voltage algorithm to control the out-put through internal feedback from the VOUT sense pin. The buck converter charges an output capacitor through an inductor to a value slightly higher than the regulation point. It does this by ramping the inductor current to 260 mA through an internal PMOS switch and then ramping it down to 0 mA through an internal NMOS switch, thereby efficiently delivering energy to the output capacitor. Its hysteretic method of providing a regulated out-put reduces losses associated with FET switching and maintains an output at light loads. The buck converter deliv-ers a minimum of 100 mA of average load current when it is switching.

With analog switch-mode power

supply design expertise in short sup-ply around the globe, it has been dif-ficult to design an effective energy-harvesting system as illustrated in Fig. 1. However, with the introduc-tion of the LTC3588-1 piezoelectric energy-harvesting power supply, with integrated low-loss full-wave bridge rectifier, that’s all about to change.

This revolutionary device can ex-tract energy from almost any source of

mechanical vibration or strain. Fur-thermore, with its comprehensive fea-ture set and ease of design, it simplifies the hard-to-do power conversion de-sign aspects of an energy-harvesting chain. This is good news for the sys-tem designer because these “good vi-brations” can be used to power the energy-harvesting system, instead of having to deal with the traditional configuration headaches.

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from denisbul

As today’s electronic devices be-come more and more complex, the need to provide a wide

range of regulated voltage supplies continues to increase. Additionally, battery-powered electronic devices must contend with the limited volt-age/current provided by the battery, making the task of providing several regulated voltages even more com-plicated.

The use of low-dropout regulators

(LDOs) is popular for a wide variety of applications, including battery-powered electronic devices. However, it is critical that the designer under-stand the features and specifications of the LDO, and how these specifica-tions affect the overall system.

Overview of LDO architecture A LDO uses a voltage-controlled cur-rent source to create a given output

Understanding features and specs

of today’s LDOs Consider the input power source, the loading requirements, and the transient response

before selecting an LDO for a system voltage. LDOs consist of a bandgap reference, an amplifier, a pass tran-sistor and a feedback network (see Fig. 1). The pass transistor, typically an n-channel or p-channel FET, functions as a variable resistor in or-der to regulate the output voltage. This output voltage is compared to the band gap reference, and the am-plifier drives the pass transistor ac-cordingly to equalize the voltage on its inputs.

Dropout voltage Since the LDO architecture relies on adjusting a resistive element to cre-

ate a given output voltage, a LDO (or any linear regulator) can only create an output voltage that is lower than the input voltage. The minimum re-quired differential voltage between the input and the output in order for the output to maintain regulation is called the dropout voltage. Since a LDO uses only a single FET transistor

BY KEVIN TRETTER Microchip Technology, Chandler, AZ http://www.microchip.com

Fig. 1. Basic LDO architecture

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as the pass element, it has a lower dropout voltage than the other lin-ear-regulator topologies; hence the name low-dropout regulator, or LDO.

Dropout voltage becomes a critical specification in battery-powered ap-plications where the LDO is used to regulate the battery voltage. For ex-ample, consider an application that is powered from a single lithium-ion (Li-Ion) cell. A Li-ion cell has an open-circuit voltage of approximately 3.6 V when fully charged, and will decrease in voltage to approximately 2.7 V when fully depleted. In this example, an LDO is used to regulate this battery voltage to 2.5 V, to power the rest of the system. If the LDO has a dropout voltage of 200 mV or less, the output of the LDO will remain regulated un-til the battery is completely used. However, if the LDO has a dropout voltage of 500 mV, then the output will fall out of regulation when the battery voltage drops to 3 V. In this case, the battery cannot be fully de-pleted and therefore battery life is negatively affected.

Line regulation Another com-mon specifica-tion for LDOs is line regula-tion. This specification in-dicates how well the device regulates the output voltage under a varying in-put voltage. Line regulation is typical-ly specified as a percentage change in the output voltage for a 1-V change in the input voltage (%/V). It is impor-tant to note that line regulation is a dc, or steady-state, parameter. Therefore, any output-voltage transients that re-sult from a change in the input voltage are ignored.

In the example used above to dis-cuss dropout voltage, a LDO provid-ed a regulated 2.5-V output from a

Fig. 2. LDO with power good

SPECIALPOWER

Understanding features and specs of today’s LDOs

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single Li-ion battery. In this example, the input voltage to the LDO changes over time as the Li-ion battery cell becomes depleted. Therefore, the output voltage of the LDO, although nominally 2.5 V, will vary as the battery voltage varies. The degree of this variation is a func-tion of the LDO’s line-regulation specification.

Line regulation can also be a criti-


from denisbul

SPECIALPOWER

very useful when implementing a LDO to power a sensitive device that requires a very clean start-up voltage. In this case, the LDO’s output can remain disconnected from the load until the Power-Good indicator be-comes active. At that time, the sys-tem can connect the output of the LDO to the load, ensuring a clean, stable power supply that will not cause any issues resulting from a slow transient on the power supply.

Overtemperature protection Another useful feature found on cer-tain LDOs is overtemperature pro-tection. As with all silicon integrated circuits, there is a maximum tem-perature limit for the silicon, typi-cally called the maximum junction temperature, around 150°C. Beyond the maximum junction temperature, the silicon can become permanently damaged. Some LDOs, including the MCP1825, implement over-tempera-ture protection circuitry that moni-tors the internal junction tempera-ture of the silicon. If it reaches the maximum junction temperature (150°C for the MCP1825), the output of the LDO will shutdown until the junction temperature drops to an ac-ceptable level. This prevents perma-nent damage to the integrated circuit from extreme temperatures.

The system designer must be aware of the various specs of the LDO and how they affect the overall system design.

At first glance, low-dropout linear regulators appear to be very straight-forward and simple to design into a system. For the most part this is true, being one of the advantages of this type of dc/dc converter. However, the system designer must be aware of the various specifications of the LDO and how these specifications affect the overall system design. When se-lecting the proper LDO for a given application, the system designer must consider the input power source, the loading requirements, and how the transient response of the LDO will affect the rest of the circuitry in the system.

cal factor for systems that support multiple supply sources, such as an ac/dc converter with a battery back-up. In this case, the main power sup-ply may be a 12-V supply coming from the ac/dc converter, but if pow-er is lost, the system switches to a battery backup, which may be run-ning at 9 V. How a LDO reacts to this sudden step in the input voltage can be critical. If the output of the LDO changes significantly, this could cause other system failures.

Load regulation While line regulation accounts for changes in the input voltage to the LDO, load regulation accounts for changes in the output loading of the LDO. By definition, load regulation is the ability of the LDO to maintain a constant output voltage under varying current-load conditions. This specification is typically shown in a datasheet as a percentage change in the output voltage of an LDO per a given change in load current.

In applications where the current loading will change significantly, load regulation becomes an impor-tant specification for the LDO. For example, let’s consider a system that implements a LDO to provide a regu-lated power supply to a microcon-troller. The microcontroller could have multiple states of operation—perhaps a shutdown or sleep mode—along with various levels of activity. The current draw of such a device can change rapidly as the microcon-troller goes from one state to the next, and any voltage glitches on the power-supply rail could adversely af-fect the microcontroller. Therefore, being able to provide a steady output voltage under various current loads becomes critical in selecting the proper LDO.

Power-good indicator Outside of the basic operation of a linear regulator, some LDOs such as Microchip’s MCP1825, offer addi-tional features such as a power-good indicator. This feature provides a logic output that indicates when the output of the LDO is stable and with-in regulation. Typically, this output pin includes some built-in hysteresis to avoid false triggers caused by noise or other phenomenon.

A power-good indicator can be

Understanding features and specs of today’s LDOs


from denisbul

Demand for long-running portable power has grown rapidly in the

past few years. This has been largely driven by the explosion of consumer electronic devices such as laptops, mobile phones, and camcorders. Increased elec-tronics usage by the military has also required improved, in-stantly rechargeable, mobile power solutions.

Battery power from DMFCs for consumer, military apps

We need a new approach if direct methanol fuel cells are to realize their potential

These devices have been his-torically powered by lithium-ion batteries. However, they have several well-known drawbacks, such as discharge rate, weight, safety concerns, disposal issues, and recharge capability.

Manufacturers are increas-ingly using fuel cells to re-place Li-ion batteries. Fuel cells generate power by the electrochemical conversion of a fuel, which can be in-stantly replenished. For the portable power segment, di-

BY CHRIS D’COUTONeah Power Systems, Bothell, WAhttp://www.neahpower.com

Fig. 1. Assembly of typical Neah fuel cell and its components.

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rect methanol fuel cells (DMFCs) are the most promising solutions be-cause they can be created in the most compact form-factor, methanol.

DMFCs have historically depend-ed on a proton exchange membrane (PEM), which uses air as a reactant. Although performance of PEM-based DMFCs has been improved since their introduction in the 1960s, they con-tinue to have significant technical

and commercial limitations. These include operating issues, water man-agement issues, reliability, low power density and efficiency, size, and cost.

A new approach to DMFCs is being created that eliminates these draw-backs. The new design uses a porous silicon structure and liquid electro-lyte that allows the fuel cell to oper-ate in non-air-breathing environ-ments, such as under water, and on

SPECIALPOWER

long-duration missions, such as mili-tary engagements. It provides in-creased power density, a closed-sys-tem operation, and can be manufactured on existing semicon-ductor lines.

Limitations of PEM-based DMFCsLike a battery, fuel cells have two electrodes, one negative and one positive. Fuel cells generate electrici-ty by combining a fuel such as meth-anol at the negative electrode (the anode) with oxygen from air at the positive electrode (the cathode).

Electricity is produced from the chemical reaction that occurs when the fuel, catalyst, and electrolyte come together at a common point (the three-phase interface). Current DMFC designs create this three-phase interface at the surface of a polymer material called the PEM.

The PEM serves as a separator be-tween the two electrical terminals in the fuel cell. Its solid lattice contains functional groups that help conduct protons. Since the functional groups are fixed in place and not available freely in liquid form, the only place for the production of electricity is at the surface of the PEM.

This limits the reaction zone to a facial or two-dimensional area, which restricts power output of the fuel cell because power scales with active area. Power densities are typi-cally 60 to 80 mW/cm2. It also leads to several technical and commercial limitations, including the following.

Misappropriation of methanol Methanol crossover is where the meth-anol passes from the anode through the PEM and reacts with the catalyst at the cathode. This reduces the voltage of the fuel cell and wastes methanol. While the use of diluted methanol minimizes crossover, it requires carry-ing additional water, which reduces the gravimetric energy density.

No efficient power density Methanol-fueled PEM systems oper-ate at about 25% efficiency due to limitations in the chemical reaction with methanol. In particular, meth-anol crossover reduces voltage and wastes fuel, decreasing efficiency. Since the PEM is two dimensional, increasing the power output to equal


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from denisbul

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that of Neah’s fuel cell requires a proportional increase in surface area of approximately 2.25 to 3X. This combina-tion of low efficiency and a 2D reaction zone yields low power density of 60 to 80 mW/cm2.

Vents water vapor Controlling the moisture content is crucial for maximiz-ing the power output of PEM-based DMFCs. Typically, PEMs require a specific level of hydration to perform ac-ceptably. Some DMFC designs release excess water vapor into the air. This can be problematic given a fuel cell’s close proximity to the electronic devices it is powering. For some applications, such as military devices, venting water vapor is simply unacceptable.

Degrades in poor conditions PEM-based DMFC performance can degrade over time. Since they require air as a reactant, toxics and contami-nants in the air can poison the cathode. High humidity can cause the PEM to degrade or fail by limiting the in-take of air, while low humidity can cause the PEM to crack and leak. Operating PEMs in a range of temperatures, hu-midity levels, shock levels, and vibration conditions can also degrade the PEM.

Increases manufacturing costs Little progress has been made in the technological develop-ment of PEMs and PEM-based DMFCs. Few large manufac-turers create PEMs, and most PEM-based DMFC makers have to purchase this component, rather than manufacture it in-house. This drives up infrastructure costs to build, test, and bring designs to market.

Si-based DMFCS: the new approachA new approach is needed if DMFCs are to realize their potential for providing a high energy density, portable power source that can operate in a range of conditions, and be manufactured cost effectively.

The latest DMFC designs replace PEMs with a porous silicon electrode structure and use liquid electrolyte. This creates a 3D reaction zone that can generate higher power density. The fuel cell also uses liquid oxidant, rather than air; and methanol. This provides several advantages over PEM-based DMFCs, including the following.

Increases power density Silicon-based DMFCs produce about two-and-a-half times more power than PEM-based DMFCs. One of the smallest silicon-based devices, developed by Neah Power Systems, is

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Fig. 2. A 50-W fuel cell integrated with a charge station to recharge other types of batteries.


from denisbul


have been in development, but have some longevity and reliability con-cerns due to the use decomposed oxy-gen derived from peroxide. Collects excess water The fuel cartridge is the source of oxi-dant, and serves as a reservoir for col-lecting excess water. Therefore, these fuel cells do not expose the stack to am-bient air and do not vent hot water va-por into the area around the fuel cell.

Uses all methanol The silicon-based DMFC design uses a recirculation process that runs until all available methanol in the replaceable fuel cartridge has been consumed.

Can be customized by application Pumps, electrodes, cartridges, and heat exchangers are modular, and can be sized according to the appli-cation. For example, a cartridge could provide 8, 12, or 20 hours of runtime. This lets electronics device manufacturers provide a broader mix of products, and lets consumers select the size of their fuel cell based

upon their usage habits.

Leverages existing manufacturing infrastructure Silicon-based fuel cells can be manu-factured using the large, mature, cost-efficient infrastructure of the semiconductor processing industry. This eliminates the need to develop large, costly manufacturing capabili-ties in-house, and can speed time-to-market. Manufacturing of some fuel cell components—such as micro-pumps, heat exchangers, and printed circuit boards—can also be out-sourced. This lets fuel cell manufac-turers dedicate resources to increas-ing performance, miniaturization, and cost reduction.

Silicon-based DMFCs are a key tech-nology in the future of portable elec-tronic devices for a wide variety of market segments. With all the advan-tages described here—high energy-conversion efficiency, non-air-breath-ing environment operation, and cost-effective manufacturing—silicon-based DMFCs can soon be the leading portable power source.

58 x 58 x 2 mm and produces 2-W pow-er. The design provides 40 times more reaction zone than PEMs, increasing power density to up to 180 mW/cm2. Some silicon-based DMFCs can be man-ufactured with larger electrodes to fur-ther increase volumetric energy density.

Provides closed-system operationThe porous silicon electrodes can be assembled into cells and stacks that do not use a PEM or other type of separa-tor between the positive and negative terminals. The methanol and oxidant react at the catalyst sites in the pores and produce electricity. Residual fuel and by-products are forced out of the cells by a continuous flow of liquid through the electrodes.

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Despite the present economic reprieve, global energy con-sumption is increasing faster

than new sources of power can be put into service. Trying to reduce the rate at which electrical power de-mand is growing, local and regional governments are setting increasingly higher efficiency standards for a growing list of products that use electricity.

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For example, in November 2009, the California Energy Commission (CEC) announced that effective Jan-uary 1, 2011, televisions with screens of up to 58 in. must meet new effi-ciency requirements to be sold in the Golden State. This means that power supply engineers must find new ways to improve the efficiency of the pow-er conversion circuitry they design.

New standards requirementsMost of the new efficiency standards are similar to those developed by the U.S. Environmental Protection Agen-cy’s (EPA) Energy Star program, which have generally followed the mandatory regulations that have been established by the CEC. Prior to the new standards, power supply ef-ficiency was typically only specified and measured at full load. However, most power supplies rarely operate at full load, and may spend much of their time unloaded, or at very light loads (10% to 25%).

The researchers who developed these standards began by measuring the efficiency of many commercially

available power supplies to establish baseline performance. During test-ing, they discovered that the effi-ciency of most of the power supplies they evaluated was poor at light loads.

They also observed that many of the power supplies had fairly high values of no-load power consump-

Table 1. Potential benefits and drawbacks of design tactics/factors and market demands

Design Tactics/Factors and Market Demands

Potential Benefits Potential Drawbacks

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Higher efficiency operationLower internal temperaturesReduced switching noise *

Higher BOM and assembly costsHigher parts count, lower yieldLower MTBF (from part count)

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Higher efficiency operation Lower internal temperaturesLower BOM and assembly costs

Higher BOM costs if exotic components are used (GaN, GaAs, or Sic)

Higher Switching Frequency

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Conducted EMI challengesPCB layout becomes criticalThermal management issues

Cost/Size Reduction Better profit margins(smaller size is a big selling point in many markets)

Low-cost component reliabilityHigh-density temperature riseClose proximity noise problems

More/Improved Functionality

Fault detection & warningMeets customer demands

Higher costs & lower marginsReduced overall reliability

* Reduced noise may result if zero voltage and/or zero current switching (ZVS, ZCS) are realized


tion. Since their goal was to mitigate power demand growth, many of the new standards addressed no-load power consumption in addition to setting minimum efficiency targets for multiple operating points.

The new standards specify mini-mum efficiency levels for several load points, such as 20%, 50%, and

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Meeting efficiency demandsTo meet these requirements, design-ers have resorted to new strategies for improving the efficiency of the power supplies they design. For example, many engineers had realized that they could meet the harmonic-cur-rent specifications of specs such as IEC61000-3-2 with filtering alone.

However, ensuring that full-load PF is >0.9 requires the use of an active

power factor correction (PFC) pre-regulator, which is most cost effec-tively implemented as a boost con-verter. Initially, active PFC converters were used in power supplies of 300 to 1,600 W, as a cost-effective way to en-sure that they complied with the har-monic current requirements of IEC61000-3-2. However, well-de-signed boost converters can operate very efficiently (>95%) and can en-able more efficient operation of the downstream output converter stage, since it can be optimized to operate from a fixed, high input voltage.

Switched-mode converters can be designed to deliver their full-load power while operating in the con-tinuous conduction mode (CCM) or the discontinuous conduction mode (DCM). From a bill-of-materials (BOM) cost perspective, DCM active PFC boost converters tend to be less expensive solutions for power sup-plies that must deliver a maximum load power of around 200 to 250 W. Above 250 to 300 W, CCM operation tends to provide the more cost-effec-tive solution. This is an important crossover range because a CCM boost converter requires a better perform-ing and more expensive diode than does a DCM converter. Additionally, a CCM stage will require different EMI filter components to ensure that it meets conducted emissions limits than will a DCM stage.

Table I shows the benefits and drawbacks of the design tactics, fac-tors and market demands that influ-ence the business decisions power supply manufacturers must make. Of these tactics and factors, the one that often offers the highest improvement in converter efficiency for the lowest cost is still the use of premium com-ponents; particularly, the best avail-able power-semiconductor devices.

Important specsIn switched-mode converters, the greatest loss quadrant for all power rectifier diodes — bipolar or Schott-ky — is forward conduction, with the forward-voltage drop (VF) being the dominant factor. That is what prompted the use of MOSFETs as synchronous rectifiers, in low-volt-age output rectification applications, since their on-state drain-to-source voltage (VDS) is substantially lower than the VF of any rectifier diode.

100% in the 80 Plus computer power supply program, and 25%, 50%, 75%, and 100% in the CEC and Energy Star specifications for External Power Supplies (EPS). Maximum no-load power consumption levels also are specified in the EPS standards. Last-ly, EPA Energy Star added minimum power factor (PF) specifications (0.9) for computer power supplies that went into effect in July 2009.

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However, a number of technical issues prevent that same tactic from being used to replace the boost di-odes used in active PFC converters. Schottky diodes, made from silicon carbide (SiC) or gallium nitride (GaN) are the latest attempt to improve CCM boost converter efficiency. However, those diodes are still pro-hibitively expensive for cost-sensi-tive applications. As a result, several power-semiconductor manufactur-ers have introduced improved ultra-fast, bipolar silicon diodes in the past few years.

The second greatest loss quadrant for power diodes is the turn-off tran-sition. During forward conduction, the cathode of a bipolar device is saturated with minority carriers (holes) injected into it by the anode. Those carriers must be cleared from the cathode before a depletion re-gion can develop to withstand the reverse voltage.

Those carriers are considered stored charge (called QRR for bipolar devices), since they must be evacuat-

ed from the device before reverse blocking can occur. QRR is removed by two mechanisms: (1) the holes re-combine with electrons at designat-ed “recombination centers” that are strategically located near the anode, and (2) they are swept back into the anode and out of the diode as reverse recovery current (IRR).

Because adding recombination centers increases the VF of the device, QRR and IRR cannot be eliminated but only minimized. In a boost convert-er, the diode location and the high output voltage make the effects of di-ode IRR all the more detrimental to efficiency because IRR flows through the boost MOSFET as it is transition-ing through its active region, where power dissipation is quite high.

Since the QRR of a boost diode de-termines the IRR that flows through it, each time the diode is switched off — which can reduce the efficien-cy of the converter by 1% to 2% — then the datasheets of those diodes ought to specify maximum values for QRR and/or IRR. However, most

boost diode datasheets only specify typical values for those parameters, if they are specified at all.

This is usually the case because QRR and IRR are not easy to measure and every test that is performed on each part increases its cost. There-fore, if a datasheet only contains typical values for these parameters, chances are they were obtained from device characterization, and are not measured on, nor guaranteed for each part.

Qspeed Semiconductor was the first manufacturer to specify and test the QRR of every diode it ships. Qspeed’s new H-Series family of 600-V diodes is optimized to have the lowest QRR (even at junction temper-atures of 125°C) of any bipolar, sili-con diodes available.

Before design engineers decide to try out a new, complex converter to-pology, they should consider the in-creased efficiency and lower BOM cost benefits that can result from using premium power-semiconductor com-ponents in their present designs.

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Poor power factor associated with electronic power conver-sion equipment is caused by

nonlinear circuit elements. In most off-line power supplies, the ac/dc front end consists of a bridge rectifier followed by a large filter capacitor.

With this circuit, current is drawn from the line only when the peak voltage on the line exceeds the voltage on the filter capacitor. Since the rate of rise and fall of the cur-rent is greater than that of the line voltage, and the current flows dis-continuously, a series of predomi-nantly odd harmonics is generated — third, fifth, seventh, etc.

It is these harmonics that cause the problems with the ac power dis-tribution system (overheating the transformers, wires, etc). The Euro-pean Union has implemented the EN61000-3-2 standard to protect its ac power distribution grid.

For the last few years, compli-ance to EN61000-3-2 has been re-quired to do business within the EU. This standard places upper lim-its on the amount of harmonic cur-rents certain products may gener-ate. The purpose of this limitation is to minimize degradation of the ac mains caused by excessive har-monic currents.

These harmonic currents are me-tered by the utility company and in-cluded in the electric bill you pay, even though they are not doing any useful work.

Historically, ac/dc power sup-plies were classified as Class D products under this standard. This class of products has harmonic cur-rent limits that vary in direct pro-portion to the amount of power

Comparing active PFC and passive attenuationTwo methods help comply with EN61000-3-2 but each

has advantages and disadvantages

drawn from the ac line. In order to attenuate the harmonic currents sufficiently to meet the varying

limits of this standard, a technique called power factor correction (PFC) has been universally used. This technique results in an offline switch-mode power supply with a near-unity

BY JOHN KOVACSVicor, Andover, MAhttp://www.vicorpower.com

Fig. 1. An active harmonic attenuator module consists of a full-wave rectifier, high-frequency zero-current switching boost converter, active inrush current limiting, short-circuit protection, control, and housekeeping circuitry.

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power factor and with very low har-monic currents. Active PFC circuits can be complex and, because they are active, they can generate considerable EMI and require extensive filtering.

It is important to note that the EN specification does not refer to power factor nor does it require power factor correction or set any power factor limits: it only sets limits on harmonic currents. However, since active power factor correction has been the de fac-to method for complying with the harmonic current limits, the term PFC has been generally accepted to not only mean power factor corrected

but also to mean EN compliant.Amendment 14 to EN61000-3-2 re-

classified ac/dc power supplies from Class D to Class A, eliminating the vari-able limit placed on harmonic currents. That limit is replaced with a fixed limit based only on the maximum input power of the class, which is 1,000 W. Since, in effect, ac/dc power supplies drawing less than 1,000 W have had their harmonic current limit increased, passive alternatives are now available to compete with active PFC for achieving EN61000-3-2 compliance.

It is useful to compare the active power factor correction method with

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the passive harmonic currents attenua-tion method.

Active PFCAn active harmonic attenuator mod-ule (see Fig. 1) consists of a full-wave rectifier, a high-frequency zero-cur-rent switching (ZCS) boost converter, active inrush current limiting, short-circuit protection, control, and housekeeping circuitry.

The incoming ac line is rectified and fed to the boost converter. The control circuitry varies the operating frequency of the boost converter to maintain the output voltage of the harmonic attenuator above the peak of the incoming line, while forcing the input current to follow the wave shape and phase of the line voltage. The ac input current follows the volt-age waveform and a power factor bet-ter than 0.99 is achieved (see Fig. 2).

Passive harmonic attenuationA passive harmonic attenuation method for compliance to EN61000-3-2 standards consists of an au-toranging ac/dc front-end module

Comparing active PFC and passive attenuation

Fig. 2. Input voltage and current waveforms without (left) and with (right) power factor correction.

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and a passive harmonic attenu-ation module (see Fig. 3). This solution provides transient/surge immunity, harmonic cur-rent attenuation, and EMI fil-tering, in addition to the power switching and control circuitry necessary for autoranging rectifica-tion, inrush current limiting, and overvoltage protection.

Adding a series inductor upstream from the hold-up capacitor will lengthen the conduction angle of the capacitor during the charging cycle. This reshaping of the ac current wave-form minimizes the generation of ac

harmonics (see Fig. 4), improves the power factor to the 0.7 to 0.8 range, and provides compliance to:

EN61000-3-2 Harmonic current.EN55022, Level B conducted emissions.EN61000-4-5 Surge immunity.EN61000-4-11 Line disturbances.EN6100-3-3 Inrush current.

A comparison of passive vs. activeBoth methods offer compliance to the EN standard, but both methods have advantages and disadvantages.

••

•••

Essentially, the passive approach using a high-inductance low-Q choke for passive harmonic current attenu-ation enables EN compliance for power solutions needing up to roughly 700-W input power. It’s a simple, robust, reliable, and inexpen-sive method of harmonic current re-duction that can be employed in

many lower-power systems. It re-quires, however, bulky low-frequen-cy magnetics, and it can’t accommo-date the universal input voltage range although autoranging is appli-cable for the majority of applications today.

Active power factor correction practically eliminates the ac line cur-rent harmonics, achieving near-unity power factor, and it can accommo-date a universal input voltage range. It is often more costly with more complexity in the design, however, and has lower efficiency.

Fig. 3. Offline power supply configuration using passive harmonic attenuation.

Fig. 4. Harmonic currents vs. EN61000-3-2 limits.

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Comparing active PFC and passive attenuation

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When the universal serial bus (USB) interface was intro-duced over a decade ago, its

impact on consumer and industrial markets alike was grossly underesti-mated. Several standard revisions and billions of devices later, USB is as common to computing as the key-board.

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OC, OV protection shrinks USB port electronics

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Fig. 1. Protected interface through USB 2.0.

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overcurrent transients. Additional overvoltage and overcurrent threats include hot plugging, short circuit-ing, ESD events, faulty equipment, and user error.

To adequately manage USB port overcurrent and overvoltage protec-tion needs, it is important to exam-ine the use of next-generation pro-tection solutions. Lead-free polymer positive temperature coefficient (PTC) devices protect circuits from potentially destructive overcurrent conditions.

Electrostatic discharge (ESD) suppressors and transient voltage suppression (TVS) products protect circuits from overvoltage, specifi-cally ESD, electrical fast transient (EFT), and surge threats. As USB in-terface standards continue to evolve and change, combining these solu-tions can help protect sensitive USB ports, assist designers in speed of development and reduce total cost of ownership.

USB standards, concerns for protectionUSB includes a four-wire interface with a pair of data lines, one power line operating at 4.4 to 5.25 Vdc, and ground through its 2.0 release. USB 3.0 adds a SuperSpeed differential data bus, achieves data transfer rates up to 5 Gbits/s, and specifies nearly twice the sourcing current of USB 2.0. USB 2.0 and 3.0 require the use of a resettable fuse for overcurrent protection on the power line. Every line requires overvoltage protection as illustrated in Figs. 1 and 2.

Overcurrent and overvoltage tran-sients introduce separate protection concerns and thresholds for USB ports. USB 2.0 ports operate from tens of milliamperes to a maximal operating current of 500 mA, which is increased to 900 mA in USB 3.0. Overcurrent protection primarily fo-cuses on resistance, which must be no greater than 700 mΩ with a max-imal voltage drop of 350 mV, and re-action time. The fuse must react fast enough to prevent damage to the cir-cuit and slow enough to prevent startup transients from tripping it (nuisance tripping). According to UL60950, a 5-A short must be re-moved in less than 60 s.

Overvoltage concerns focus largely on ESD protection based on


the IEC Standard 61000-4-2 for the human body model (HBM), and are quantified by capacitance. The to-tal USB interface line capacitance must be less than 10 pF with a sig-nal clamping voltage under 6 V. By combining the technology and ca-pability of next-generation resetta-ble fuses and ESD suppressor devic-es, it is possible to choose the right options without sacrificing the in-

tegrity of the solution.

Resettable fuses for OC protectionResettable fuses exhibit a positive tem-perature coefficient (PTC) effect when heated, with the characteristic of ex-ponential rather than linear increase in resistance with rising temperature. As the fuse temperature increases due to current or ambient temperature,

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2 to 40 Watts • Single, dual & triple outputs• Wide 2:1 & 4:1 input ranges• Compact metal packages• Industry standard pinout

50 to 200 Watts• Regulated single outputs• Wide 2:1 & 4:1 input ranges• Compact metal case• Up to 90% efficiency

Medical• 3 to 6 Watts• BF & CF applications• 2 μA patient leakage current• High 6 kV isolation

Military• 5 to 150 Watts• 10-50 VDC input voltage• -55 ºC to +100 ºC temp.• Single & dual outputs

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the material expands, increasing the impedance from low to high by mul-tiple orders of magnitude.

This transformation of the mate-rial allows the fuse to protect the load from overcurrent, within the rated limits of a device, creating a high-impedance circuit with slight leakage current. Once the current is removed, the material cools and re-turns to its highly conductive, low resistance state. The power must then be cycled in order to reset the device, generally resuming normal

operation within one second. The entire process is illustrated in Fig. 3.

Next-generation designsManufacturers are introducing new technologies and manufac-turing processes for superior performance and smaller sizes as the trend in miniaturization continues. One such technology, that we at Bourns call freeXpan-sion technology, limits the me-chanical restric-

tions during the ex-pansion of materials at the trip state and the contraction of materials upon reset.

This new technol-ogy allows for smaller surface-mount pack-age sizes (0603/1608 metric), higher cur-rent- and voltage-handling capabilities, and improved resis-tance stability. These Fig. 3. Current and resistance vs. time.

next-generation resettable fuses meet USB 2.0 and 3.0 voltage and current requirements, delivering reliable overcurrent and overtemperature protection with impedance as low as 3 mΩ.

ESD protection technologyESD is the transfer of an electrical charge between two surfaces of unequal potential. ESD is the pri-mary cause of IC malfunctions and

Fig. 2. Protected USB 3.0 interface.

SPECIALPOWER

800-542-3355www.calex.come-mail: sales @ calex.com

200 Watt Wide Input Range DC/DC Converter

• 9 to 36 Volt Input Range• 24, 28 and 48V Outputs• Efficiency greater than 90%• 1/2 brick case• Extended output voltage trim range• Zero to full load operation• Five Year Warranty• Ideal for industrial and military COTS applications

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Innovative DC/DC Solutions from 1 to 400 Watts


from denisbul

www.clare.com

78 Cherry Hill Drive Beverly, MA 01915 978-524-6768

For more information on Clare’s LED Driver ICs visit:For more information on Clare’s LED Driver ICs visit:http://www.clare.com/Products/LEDDrivershttp://www.clare.com/Products/LEDDrivers.htm.htm

High Voltage Driver High Voltage Driver for for

High Brightness LEDsHigh Brightness LEDs

•• 450V Operation for Global Applications 450V Operation for Global Applications•• Drives Series and Parallel LED StringsDrives Series and Parallel LED Strings•• Linear or PWM Brightness ControlLinear or PWM Brightness Control•• Regulated LED Drive Current Regulated LED Drive Current •• Minimal Additional Component CountMinimal Additional Component Count•• Compact Compact 8-Pin SOIC RoHS Compliant Package8-Pin SOIC RoHS Compliant Package

can be extremely dangerous to sensitive electronic components. Four types of suppression technol-ogy are available to protect against ESD events:

Polymer ESD suppressors use a printed circuit board (PCB) manu-facturing process and polymer space discharge. The breakdown of the inserted polymer between the electrodes allows this device to work. Multilayer varistor (MLV) ESD suppressors use a thick-film manufacturing process and work through the breakdown of zinc oxide. The third technology uses an air gap design based on air discharge between two electrodes in a con-trolled air space. Finally, TVS diode ESD suppressors use a thin film manufacturing process, operating through the breakdown of the p/n junction.

Next-generation ESD suppressorsNext-generation ESD suppressors are offered in a variety of package types and employ two basic technologies. One type uses polymer technology in surface-mount 1206 and 0603 packages providing a maximum ca-pacitance of 0.5 pF for USB port pro-tection.

This technology causes voltage charges to jump across the device in a stepping stone fashion. The dis-tance between the metal particles within the component determines the ESD transient response of the de-vice. Bidirectional protection is pro-vided by the polymer-based device, and the repeatability is typically more than 100 hits.

The other option includes sur-face-mount 0603- and 0402-package sizes and employs a unique air gap discharge technology. This technol-ogy enables the device to distinctly control ESD and EFT.

Compared to the typical 5 pF of its TVS counterparts, the capacitance of some air gap devices is a mere 0.05 pF, leaving a full 9.95 pF for the de-signer to meet the 10–pF maximal capacitance for the USB interface. The highest observed leakage cur-rent of 5 nA is far less than the 1 mA typical of most TVS components. Air gap discharge provides bidirectional

•

•

•

•

protection and typically can with-stand approximately 1,000 hits. In-dividual parts can be used or an ar-ray can protect four lines or more in a single package.

In discrete, array, and combo de-sign packages, designers have the flex-ibility of incorporating these solutions into various different configurations. For additional information about Bourns circuit protection products in-

cluding next-generation resettable fuses and ESD suppressors, visit http://www.bourns.com/ProductFamily.aspx?name=circuitprotection


For more on overcurrent and overvoltage protection, visit

http://www2.electronicproducts.com/Power.aspx


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Meeting 30 mW standby in mobile phone chargers

Achieving a five-star energy rating without secondary-side control

Do the math and it’s easy to understand why gov-ernment bodies and

handset manufacturers are sud-denly so smitten with reducing standby power in mobile phone chargers: There are over four billion mobile phone users worldwide and most of them leave their chargers plugged-in even when the phone is disconnected. Accord-ing to Nokia, up to two-thirds of the electricity consumed by a mobile device is lost when in no-load mode.

While cutting greenhouse emissions and fossil fuel consumption is without question important to all of us, mobile phone charger solutions must also provide practi-cal benefits such as reasonable cost, ease of implementa-tion and assured reliability. Engineers look to designs with integration and packaging that combines a PWM controller, a MOSFET (if so desired) and protection func-tions into a single entity that enables a five-star energy rating with no-load power consumption of 30 mW or less. The industry average is about 300 mW, no load.

Stringent no-load tolerancesToday’s mobile phone consumers demand large touch-screens, a multi-megapixel camera, Bluetooth, and 802.11 Wi-Fi, Web browsing, e-mail and database access, GPS nav-igation, music and video downloads and, in the near fu-ture, mobile digital TV. All of these in-demand functions require power. Of course, the most common charging source is the ac wall outlet and an outboard ac/dc adapter, commonly referred to as a cell phone charger, although most of the time the charging circuit is actually located inside the mobile phone.

Mobile phones only require, on average, about 2 W when charging, while by comparison, laptop PCs need close to 100 W. Still, with over four billion mobile phone users worldwide — compared to the one billion who own PCs — reducing the power consumed by the chargers in standby, or no-load, has become one of today’s critical de-sign considerations.

Measures have been taken to tighten requirements for both efficiency and no-load power. The most recent, and most stringent, of these is a voluntary charger Star Rating System agreement put forth by the world’s five largest mo-bile phone makers, Nokia, Samsung, Sony Ericsson, Mo-torola and LG Electronics. Chargers will be labeled starting at zero stars for >0.5 W standby power consumption and going up to the top five star rating for consumption of <0.03 W (30mW) no load power rating (see figure). Most

current mobile phones currently have standby power in the range of 150 to 300 mW.

This is important so it bears repeating: To achieve the coveted five-star rating chargers must reach a level of no-load power consumption of 30 mW or less, which is 90% below the threshold of Energy Star level V.

Why tight CV/CC tolerances are importantLi-ion technology is currently the battery technology of choice for small portable devices. It is attractive because of its high energy density, low self-discharge characteristics, and tremendous flexibility in size and shape. Li-ion cells are generally suited to a constant-current/constant-voltage (CC/

BY JAMES SHEENFairchild SemiconductorTaipei, Taiwan, ROC

The rating system for chargers goes up to five-stars at 30 mw idle power.


from denisbul

CV) charging strategy and the length of each charging mode depends on the capability of the charger.

The charger operates in a constant current charging mode when the battery voltage is low and this is when most of the energy is trans-ferred. Once the battery has charged to the float voltage (battery voltage at zero current, usually around 4.2 V) the system will begin to reduce the charging current to maintain the desired voltage — and thus switch to constant-voltage mode.

Although relatively simple to im-plement, charging the cell actually re-quires precise control of the float volt-age region to obtain to maximize battery capacity and improving ser-vice life. Imprecise battery voltage regulation could undercharge the bat-tery, with a large decrease in battery capacity. Or, if the voltage is too high, the battery cycle life is significantly degraded. Excessive overcharging of a Li-ion cell could also result in cata-strophic failure of the unit.

Meeting the 30-mW goalFor design engineers the bar has been raised suddenly. Consider that it was little more than a year ago when mobile phone power suppliers would receive kudos for designing CC/CV adapter/chargers with stand-by-mode consumption of 75 mW at 120 Vac and 90 mW at 240 Vac.

However, while 30 mW is a very challenging specification, it can be meet quite comfortably with the lat-est generation of primary-side-regu-lation PWM ICs. For example, Fairch-ild has the FSEZ1317 that integrates a 700-V, 1-A power MOSFET — provid-ing big space and cost savings. CV/CC control tolerances have been tightened from ±10% to ±5% and the number of external resistors and capacitors needed has been reduced from 12 down to five (three resistors, two capacitors).

This primary-side-regulation PWM controller’s very precise CC/CV regu-lation is done without using second-ary-side voltage or current-feedback circuitry needed in alternative solu-tions. Secondary-feedback circuitry in battery charger applications no longer appeals to designers since it in-creases cost, device count, and board space. It also negatively impacts en-

BCCDaleSiliconixSprague

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Components are supplied in cut tape or bulk form, and stored in notebooks, cabinets or cases, with reeled items stored in bins.

• Ceramic Capacitors • Thick-fi lm Resistors • Fuses• Tantalum Capacitors • Thin-fi lm Resistors • Diodes• Inductors • Transistors • Varistors • Resistor Arrays • Trimming Potentiometers • Ferrite Beads

The components you need at your fi nger tips

ergy efficiency, since secondary-side components consume power.

For designs that require an exter-nal MOSFET, an additional option available to engineers is something like the Fairchild FAN103 primary-side-regulation PWM controller. These low-cost ICs feature HV start-up, proprietary Green Mode control, and a proprietary technique called Truecurrent, which regulates output

current by using a primary-side-regu-lation-controlled flyback converter. The controller uses an analog signal process and sampling technology to achieve output voltage/current regu-lation through a primary-side auxil-iary transformer winding. With this approach, a charger can achieve a smaller form factor, lower standby power, and higher efficiency than conventional circuit designs.

Mobile phone chargers


Wire & Cable

PRODUCTROUNDUP

Wire and cable are a pretty versatile bunch. As the electronics industry continually requires faster, more powerful, and more environmentally friend-

ly means of data and power transmission, these devices have no trouble keeping up. Here is a sampling of some products recently introduced into the wire and cable market.

The Limiting Port SFP+ assemblies from W.L. Gore (www.gore.com) can satisfy limiting-port specifications up to

7 m, and offer an alternative to active copper technology and optical transceiver modules.

The passively-equalized cables are created by combining Gore’s Eye-opener+ conductor tech-nology and low-loss expanded PTFE cable dielec-

tric and can be used with L-P switches and adapter cards. The conductors’ core/skin design provide dis-

tributed equalization without requiring RIC circuitry on the connector paddle card and reduce jitter.

Offering a fully-recyclable alternative to PVC hook-up wire, EcoWire from AlphaWire (www.alphawire.com) con-tains a patented, modified polyphenylene ether (mPPE) thermoplastic insulation. This light, durable material gives the wire a significantly reduced wall thickness — from 28 (0.07 mm2) to 10 AWG (5.37 mm2) — over its PVC-based counterparts. The non-halogenated insula-tion also contains no heavy metal pigments, which meets Waste Electrical and Electronic Equipment (WEEE) re-quirements.

The iPass+ high-speed channel (HSC) pluggable CXP copper and optical interconnect system from Molex (www.molex.com) enables 12 channels of 10-Gbit/s data, for up to 120 Gbits/s of total bandwidth. The system provides both copper and optical direct-attach options for the same system port, increasing system-level hard-ware flexibility for end users. Providing one-step place-ment to the host board, the dual paddle-card system is available in both single and stacked dual-port configura-tions. The CXP 12X direct-attach copper cables are avail-able in a variety of lengths, and can accommodate single, ganged, or stacked connector configurations in extreme-ly high-density requirements. The system was adopted as the InfiniBand Architecture Specification Vol. 2 Release 1.2.1; Annex A6 in September 2009.

The Pwr Profile+ I/O cable assemblies from FCI Elec-tronics (www.fciconnect.com) feature an integrated latching system and are 8.38 mm high with mating board-mount headers. The assemblies are available with two power con-tacts, two signal pins for presence detection or power con-trol, and an optional grounding shield on the board connector for EMC requirements. The assem-blies are rated to 37 A per contact without exceeding a 30°C temperature rise in still air, and have signal pins for power control and a presence detection feature that includes optional jumpered signal contacts for monitoring which ports have mated cables and which are empty.

Christina D'Airo


from denisbul

HIGHLIGHTS

Two-string HB LED driver is industry’s first for auto apps

Claimed as the industry’s only two-string HB (high-brightness) LED driver for automotive appli-cations, the MAX16838 integrates a boost or SEPIC switching converter, two linear current sinks, and all necessary power MOSFETs. Features include an LED dimming range of 5,000:1 at 200 kHz and a switching frequency from 200 kHz to 2 MHz.

The driver optimizes conversion efficiency by automatically adjusting the switching converter’s output voltage to the voltage supply required by the LEDs. Capable of delivering up to 150 mA per string, the driver operates over the –40° to 125°C automotive temperature range and accepts a wide, 4.75 to 40-V input range.

Housed in a 20-pin TQFN and TSSOP packages, the MAX16838 also in-cludes a complete set of protections including LED fault, overtemperature, and overvoltage. If an LED fails open or short, the driver automatically dis-ables the affected string while keeping the others working, thus improving system reliability. (From $1.45 ea/1,000 — available now.) Maxim Integrated Products , Sunnyvale , CA Customer Service 800-998-8800 [email protected] http://www.maxim-ic.com


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Clock drivers handle up to 10 Gbits/s The NB7L585, NB7L585R, NB-7V585M, and NB7V586M clock and data driver ICs provide a 2:1:6 func-tion integrating a 2:1 mux with a 1:6 fanout buffer. The NB7L585 and NB7L585R are 2.5/3.3-V devices with ei-ther LVPECL outputs or Re-duced Swing Emitter Coupled Logic (RSECL) outputs of 400 mVp-p.

The NB7L585 operates up to 5 GHz or 8 Gbits/s and the NB7L585R and M operate up to 7 GHz or 10 Gbits/s. The NB7V585M operates from a 1.8/2.5-V supply and has six CML differential outputs. The NB-7V586M operates from 1.8 V and has six outputs configured as three banks of differential pairs. They come in 3 x 3-mm 16-pin or 5 x 5-mm 32-pin QFN packages. (From $5.25 ea/1,000 — samples available now.) ON Semiconductor , Phoenix , AZ Sales 602-244-6600 http://www.onsemi.com

Fuel gauge IC makes battery smart The bq3060 battery fuel gauge IC turns a battery into a “smart battery”

that measures and maintains a re-cord of available capacity, voltage, current, and tem-perature for lithi-um-based batter-

ies. The single chip also provides battery safety, including authentica-tion, short-circuit, and discharge protection.

The battery fuel gauge reduces cost and size for smart batteries, is offered in a 24-pin 7.8 x 6.4-mm TSSOP pack-age, and is a 50% smaller than a high-end fuel gauge. It has <69–μA power consumption mode, provides SHA-1 authentication to ensure host-battery compatibility, and supports two-wire SMBus 1.1 interface with 400-kHz programming option. ($3.55 ea/1,000 — available now.) Texas Instruments , Dallas , TX Product Information Center 800-477-8924 http://www.ti.com

Integrated Circuits

edited by christinanickolas, jimharrison and paulo’shea

See our online archive at http://electronicproducts.com/ic

For designers working IBA applicationsin server, ATE, telecom, industrialcontrol, etc., VIB0101THJ offers layoutflexibility, reduced power converterfootprint, and easy design for fasttime-to-market.

• 4x smaller than previous best bus converters

• Simple design for fast time-to-market

• High efficiency

• Powers standard 12 V POL converters

• 16x capacitance reduction feature

Call 1-800-735-6200 to order.

vicorpower.com/vichip

800-735-6200

48 V : 12 V Bus Converter for Server, ATE, Telecom, and Industrial Control

Products in mass production and available from stock

BCM ModelPackage

VIN VOUT Output Efficiency

Number Range Range Power (%)(V) (V) (W)

VIB0101THJ Half 38 – 55 Vdc 12.0 120 W 94.5

B048F120T30 Full 38 – 55 Vdc 12.0 300 W 95.1

B048F096T24 Full 38 – 55 Vdc 9.6 240 W 96.2

vicorpower.com/bcm-half/ep

For more information on V•I Chip and IBA,

please see the whitepaper atwww.vicorpower.com/iba

120 W Half-ChipWithApecSnipe.qxp:EP 2/5/10 11:06 AM Page 1

from denisbul

HIGHLIGHTS

Rack-version UPS with long-life batteries targets automated labs The FN series double-conversion on-line UPS rack-mount version offers a choice of scaling from 5 to 40 kVA with 3U-high transformer modules and compact 2U and 3U modules for power and batteries. An optional long-life battery rated to last 10 years (twice the life of the standard battery) is available.

The parallel or n+1 redundant UPS meets the demands of IT, laboratory, and industrial infrastructures with a scalable platform. The UPS models include a faster processor using a DSP technology. They can be configured us-ing individual 5-, 6-, or 10-kVA models, providing up to 20-, 24-, and 40-kVA capacity. For n+1 redundant operation, the capacity is 15, 18, and 30 kVA.

Included UPSilon computer shutdown and management software sup-ports all Windows platforms, as well as Novell NetWare 5 and 6, Linux, and FreeBSD. UPSilon for Unix is also available.

For remote management, users may purchase an optional SNMP/HTTP agent board that installs directly inside the UPS and provides a TCP-IP–ad-dressable 10/100 Ethernet port. (208/220-V 5-kVA model, from $4,198 — available now.) Falcon Electric , Irwindale , CA Sales 800-842-6940 [email protected] http://www.falconups.com


NEWPRODUCTS

225°C dc/dc buck converter targets EV Based on the two-chip set MAGMA-HYPERION and power transistors, the VESUVIO technology imple-ments buck dc/dc converters that op-erate from –55° to 225°C and target electric-vehicle applications. It can step down input voltages from 6 to 30 V to an output voltage adjustable from 1.2 V up to 90% of the input.

Configured as a synchronous dc/dc converter, it oper-ates in continuous current mode at a constant frequency. It uses the soft-start capability and pro-vides a dc-line regu-lation better than ±1.5 mV/V. A dem-

onstration board is adjusted to a 5-V output and delivers up to 10 W at 225°C. The technology is available for licensing and includes the refer-ence design and its schematic. (Con-tact 800-310-3050 or sales@trendset-

ter.com for availability.) Cissoid , Round Rock , TX Sales Trendsetter Electronics 800-310-3050 [email protected] http://www.cissoid.com

120-W dc/dc modules target railway apps The CMS120 series of 120-W dc/dc modules target railway applications. Designed to be PCB mounted, they measure 92 x 45 mm, are 20 mm high, and have an integral extruded aluminium heat sink. They meet all relevant railway standards, includ-ing EN50 155, and work across a broad operating temperature range without derating.

The modules offer a low input of 12 to 50.4 Vdc with nominal inputs of 24 and 36 Vdc and a high-input range from 43.2 to 154 Vdc with nominal inputs from 72 to 110 Vdc. They have output voltages of 12 and 24 V and an operating temperature range from –40° to 85°C. (Contact

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Power Sources

edited by paulo’shea

See our online archive at http://electronicproducts.com/ps

[email protected] for price and availability.) Martek Power , Torrance , CA Information 310-202-8820 [email protected] http://www.martekpowerabbott.com

Half-brick suits cellular infrastructure apps The HBA48T12280 350-W half-brick dc/dc converter suits to RF amplifiers in cellular infrastructure applica-tions. It offers up to 90% efficiency for loading conditions ranging from 40% to 100%. The converter features a trim range that en-ables it to operate within a 21 to 33-Vdc output.

The dc/dc con-verter also features an on-board input differential LC-filter, a 36 to 75-Vdc input range, a –40° to 100°C operating temperature range, the capability to withstand a 100-V input transient for 100 ms, and the ability to start-up into prebiased loads. It has a 2.4 x 2.28-in. indus-

try-standard half-brick footprint, and a 0.5–in. height. (Contact [email protected] for pricing and availability.) Power-One , Camarillo , CA Steve Pimpis [email protected] http://www.power-one.com

Low-profile 1.5-kW supply suits bulk power The HPU1K5 1,500 W ac/dc power supply series targets industrial appli-cations that require bulk power within a compact enclosure. Three single-output models are available covering the nominal output voltag-es of 12, 24, or 48 Vdc, with each be-ing user adjustable either manually or via an external voltage signal.

The universal input range covers 85 to 264 Vac, with output power up to 1,500 W available at high line in-put and up to 1,200 W when using input voltages below 180 Vac. Using an integral fan, the supply can be mounted either vertically or hori-zontally and operates from –20° up to 50°C at full power, and up to 70°C

with derating. It includes a variable-speed fan, a dual-stage PFC-circuit, and synchronous rectification for better than 90% efficiency. ($507 ea/500 — available now.) XP Power , Sunnyvale , CA Duane Darrow 408-732-7777 [email protected] http://www.xppower.com

1-W converters offer 89% efficiency The MER1 isolated 1–W single output dc/dc converters offer 89% efficiency levels and across –40° to 85°C tem-perature range. The series provides regulation for applications that pro-vide local power on control system boards and others that need small output voltage variations.

The dc/dc converter range features five input voltages ranging from 5 to 48 V and output voltages of 5, 9, 12, or 15 V. They offer galvanic isolation of 1 kVdc and are housed in an indus-try-standard pinout package measur-ing 0.774 x 0.242 x 0.4 in. The con-verters are encapsulated and use toroidal magnetic technology and re-


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Actel Power ManagementActel’s Mixed-Signal Power Manager

(MPM) using the Fusion mixed-signal

flash-based FPGA is ideal for power

management, power-up and power-down

sequencing, or power trimming and data

logging. This brief overview covers the

concepts of power management, MPM

features, the interactive MPM graphical

user interface used to configure the Fu-

sion device without reprogramming the

Fusion mixed-signal FPGA circuitry, and

the capabilities of MPM on the Fusion Ad-

vanced Development Kit hardware.

Solving Your Test System Connectivity Needs With Agilent GPIB and Instrument Control ProductsAgilent has a solution for your connectivity

needs. In just under 10 minutes, you’ll learn

about connectivity products that allow you to

interface virtually all test instruments to your

PC test system. Solutions include:

• GPIB interface cards

• USB/GPIB converters

• LAN/GPIB gateways

• LAN/USB/RS232 hubs

• GPIB cables

WEBCAST EVENTSReal Time Ethernet Synchronization Using the IEEE 1588 Precision Time Protocol (PTP)The DP83640 Precision PHYTER® device

from National Semiconductor delivers the

highest level of precision clock synchroni-

zation for real time industrial connectivity

based on the IEEE 1588 standard. By attend-

ing this event, you’ll learn how the 1588 PTP

fits into the Ethernet standard and how you

can achieve new levels of precision in your

next application without increasing develop-

ment or total system costs.

Register under POWER Register under T&M Register under COMMUNICATIONS

from denisbul

quire no external components. ($4.20 ea/large qty — available now.) Murata Power Solutions Mansfield , MA John Sutherby 508-339-3000 [email protected] http://www.murata-ps.com

400-W ac/dc supplies are 1U high The NXT-400 series compact, ac/dc power supplies provide 400-W into an 8.5-W/in. 3 power density, and fits into a 3.9 x 8 x 1.5 -in.1U-high unit. The series features eight models providing adjustable single outputs from 2.5 to 48 Vdc.

The power supply provides 85% efficiency (typical), 0.5% line and load regulation, operating tempera-tures up to 70°C with airflow, and a power-factor-corrected 90 to 264-Vac input. Options include remote in-hibit/enable, cover and chassis, and isolated 5-Vdc standby power. They also offer safety compliance to EN60101-1 (medical) and EN60950-1 (ITE) standards. ($277.63 ea/large qty — available now.) Power Sources Unlimited Wrentham , MA Sales 800-966-7784 [email protected] http://www.psui.com

Tunable loop 30-A PoL converter suits telecom The MegaTLynx dc/dc 30-A power converter suits distributed power ar-chitectures and intermediate bus voltage applications used in telecom, datacom, server, storage and net-working equipment. The power mod-ule is a nonisolated, dc POL convert-er and features 96% peak efficiency and delivers full load capability at 85°C with only 200-lfm airflow.

The converter module operates from 6 to 14-V input voltage and provides a regulated output voltage from 0.8 to 2.75 V. It features a 10-mV load voltage regulation, remote on/off, overcurrent and overtemperature protection, and output voltage sequencing and paral-leling. (Contact Rudi Chakrabarty [email protected] for pricing and availability.) Lineage Power , Dallas , TX Sales 800-526-7819 http://www.lineagepower.com

1-kW low-profile supplies suit DPA The RFE1000 series is a 1-kW single-output ac/dc power supplies featuring a 1.61-in.-high 1U package for stand alone or distributed power architec-tures (DPA). They suit bulk power ap-plications requiring 24, 32, or 48 Vdc

for communications, factory automa-tion, test and measurement, robotics, and RF amplifiers.

The supplies operate from an 85 to 265-Vac input with PFC, and can be used individually, or up to eight units can be connected in parallel to form an n + 1 redundant power system with built-in ORing diodes. Each power


Power Sources


NEWPRODUCTS

12-V distributed supply rated to 2,900-W out The DS2900 is a 12-V front-end distrib-uted power supply that suits high-avail-ability telecommunications applica-tions and server farms and large storage systems. It is rated for up to 2,900-W adjustable output power at 240 A.

The power supply features a 3.3-Vdc auxiliary output for powering standby circuitry and an optional al-ternative 5.5-Vdc auxiliary output. The 2U x 3U form factor offers a sys-tem-level power density of more than 24-W/in. 3 It provides a typical operating efficiency of 91% at 50% load. The supply accepts an input voltage range of 180 to 264 Vac. It is equipped with active PFC rated at 0.99 typ. The active ac inrush con-trols limit inrush current at power-on to 55 A and is protected against

600-W switcher suits industrial apps The Mean Well HRP-600 series 600-W

switching power supplies suit indus-trial applications and feature up to 89% efficiency and 6.77 W/in. 3 power

density in an 8.58 x 4.13 x 2.50-in. package. An optional remote on/off control with 5-V/0.3-A standby output is provided for no-load power con-sumption <0.75 W in standby mode,

The power supply family consists of eight single-output models with ad-justment ranges from 3.3 to 55.2 V. It features active PFC, 300-Vac input surge immunity for 5 s, remote sense, a dc-ok signal, EMS immunity, an inter-nal fan for up to 50°C operation, and protection against short circuits, over-load, overvoltage, and overtempera-ture. ($132 ea/250 — available now.) PowerGate , Sunnyvale , CA Information 866-588-1750 [email protected] http://www.powergatellc.com

• High efficiency standard, modified standard and custom build • Up to 200 watt single, double & triple output• 2:1 or 4:1 ultra-wide range input• Cost effective small possible sizes for board mount• Extensive technical support

Toll Free: 1-866-997-3853 Email: [email protected]

For product information log on to:WWW.PDUKE.COM

supply has variable-speed cooling fans and can operate in temperatures rang-ing from 0° to 70°C. They have a pow-er density of 10.5 W/in. 3 and an effi-ciency of up to 88%. ($295 ea/1,000 — available now.) TDK-Lambda Americas San Diego , CA Mel Berman 619-628-2859 [email protected] http://www.us.tdk-lambda.com/lp

from denisbul

Lighting power modules target LEDs The PIL100 series 100-W LED lighting power modules feature constant-cur-rent or constant-voltage models, all of which feature an input voltage range that accepts up to 305 Vac. The output of the constant current models ranges from 350 to 4,200 mA. The constant voltage models offer 12 to 105-Vdc outputs.

The power modules have an effi-ciency up to 93% and a specified oper-ating temperature range from –35° to 70°C with no derating. The modules are housed in an aluminum enclosure that meets IP67 waterproof standards, making them suitable for harsh indoor or outdoor applications. ($56.75 ea/large qty – available now.) Power Partners , Hudson , MA Power Partners 978-567-9600 [email protected] http://www.powerpartners-inc.com

Mini dc/dc LED drivers control power, brightness The LD24E series is a family of min-iature, dc/dc LED drivers that power and control high-brightness LEDs. They feature a constant-current out-put, output power to 17 W, PWM dimming, and efficiency to 95%.

The LED driver family has five models that operate from 5.5 to 36 Vdc and provide constant current outputs of 300, 350, 500, 600, or 700 mA. They feature short-circuit pro-tection and a remote on/off input. A PWM-input allows digital control of LED dimming. (From $5.05 ea/100 — available now.) MicroPower Direct , Stoughton , MA Steve Forrester 781-344-8226 [email protected] http://www.micropowerdirect.com


5-V folding blade adapter targets PDAs The PSA05F is a 5-V folding blade adapter that is 15-mm thick when the blades are folded. The adapter suits personal electronics, including digital cameras, PDAs, and MPEG players. It is available with a USB A socket out-

put, and meets the requirements of the U.S. Federal Energy Independence and Security Act of 2007 (EISA) as well as Energy Star EPS 2.0 requirements.

The adapter features a Level V En-ergy Star efficiency compliance, a five-star standby power, and 72.3% average efficiency. It features short-circuit protection with auto restart

and overvoltage protection. The adapter is rated to operate between 0° and 40°C and between 10% and 90% humidity. ($4.95 ea/1,000 — available now.) Phihong USA , Fremont , CA Glenn Morton 510-445-0100 [email protected] http://www.phihongusa.com

TEL: (781) 344-8226 FAX: (781) 344-8481 E-Mail: [email protected]

www.micropowerdirect.com

F4000RWF4000RW MPS-03MPS-03 A1200RUA1200RU LD24ELD24E

• 40W Output Power • 3W Output Power •12W Output Power • 7W - 17W Output

• Wide 2:1 Input • Universal AC Input •Ultra-Wide 4:1 Input • 95% Effi ciency

• 2 x 1.6 Inch Case • 100 - 400 VDC Input •Single/Dual Outputs • PWM Dimming

• 1,600 VDC Isolation • Tight Regulation •Remote On/Off • Wide Input Range

• High Effi ciency • 3.3 - 24 VDC Outputs •>1 MHour MTBF •Constant Current Out

• Remote On/Off •>200 kHour MTBF •14 Standard Models • -40 to +85°C Oper.

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Don’t squeeze out product performance, put up with erraticdeliveries, or accept poor customer service to meet tight budgetconstraints. MPD offers over 4,000, standard, high performanceDC/DC converters, AC/DC power supplies, switching POL regula-tors and a new line of low cost LED drivers. All at great savingsover competing products.

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overvoltage conditions up to 130%. ($526 ea/prod qty — available now.) Emerson Network Power Carlsbad , CA Information 760-930 4600 http://www.powerconversion.com/

Power Sources


NEWPRODUCTS

150-W converters have 4:1 input The PD150 series dc/dc converters fea-ture a 4:1 input voltage ranges of 9 to 36 Vdc, and 18 to 75 Vdc and outputs of 12, 15, 24, 28, and 48 Vdc . They use a chassis-mount package and have fixed switching frequencies.

The dc/dc converters have 87% ef-ficiency, and provide up to 200 W output power and 2 kVdc I/O isola-tion. All models feature a trimmable output voltage and constant-current-mode output limit and suit telecom, networking, and industrial applica-tions. (Contact [email protected] for pricing and availability.) Mega Electronics New Brunswick , NJ Information 732-249-2656 [email protected] http://www.megaelectronics.com

3øMotorHybrids.AI GD05101MSK P/U021085&021001Scale is 100% Final size is 4.5"w x 7.25"h Insert into Power Electronics Mag-AprilIssue 01/13/05.esy

Power modules suit –55° to 70°C apps The 24-VOUT power supplies of the PC-MAS100, PM-IP67A100 and HSA75 Cool-Line series were re-designed and are quali-fied for use within the –55° to 70°C temperature range. The universal devices with ac and dc input ranges suit world-

wide applications and are available for chassis mounting and DIN rail mounting.

The CoolLine modules have a constant output power of 75 or 100 W, are short-circuit protected, and need no ground load. The vacuum encapsulated modules are prepared for applications in Class 2 and com-ply with the low-voltage directives.

(Contact [email protected] for price and availability.) MTM Power , Canton , MA Sal Bucacci 774-565-3800 [email protected] http://www.mtm-power.com

Power Sources

from denisbul

HIGHLIGHTS

Multichip LED ousts less-efficient 75-W lamps by typically delivering 1,200 lm Presented as a general-lighting breakthrough, the XLamp MPL EasyWhite 24-chip LED can typically deliver 1,200 lumens at 250 mA, producing consistent color at an efficacy of 60 lm/W. Thus it can give a light output equivalent to a 3,000K, 75-W equivalent BR-30 incandescent bulb while consuming 78% less energy, thereby meeting the efficacy / output requirements of the U.S. Energy Star program.

Optimized for directional lighting apps and able to produce up to 1,500 lm, the 125°-viewing-angle LED comes in 2,700K, 3,000K, 3,500K, and 4,000K versions that are in the center of the respective ANSI C78.377-2008 color bins — a color space 75% smaller than the overall bins. The LEDs can shorten design/manufacture cycles, improve color consistency, and be spec-ified like traditional light sources by color temperature and brightness.

The device works from a 24- or 75-W supply and comes in a 72% smaller, 12 x 13-mm-footprint package. Its back is a thermal pad that attaches di-rectly to a heat sink to maximize cooling. (Contact company for price — available now.) Cree , Durham , NC Sales 919-313-5300 [email protected] http://www.cree.com

Touchscreens are more transparent, reflect lessThe 3.5-in. transmissive (T-55343), and the 3.0-in. (T-55149) and 3.5-in. transflective (T-51963) touchscreen displays use a capacitive touch switch technology that eliminates air gaps and reduces the number of layers needed. Each touchscreen is just 0.5 to 0.7 mm thick in the viewing area; transparency is 95% minimum, and reflection is less than 15%.

Operating range is −20° to 70°C, and lifetime is about 100 million touches. In addition to being avail-able with a TFT LCD, the touch switch solution is also available alone. (Samples, from $50 — 3.0-in. and 3.5-in. models available now; versions with 5.7-in. and 6.5-in. di-mensions will be available soon.)Optrex America, Plymouth, MIJessica He [email protected]://www.optrex.com


NEWPRODUCTS

Optoelectronicsedited by richardcomerford

See our online archive at http://electronicproducts.com/op

HIGHLIGHTS

Protocol analyzer/exerciser can testPCI Express 3.0 buses completelyTo transition to PCI Express 3.0, whose specification is currently under devel-opment by PCI-SIG, designers will have to test for higher bus speeds, back-wards-compatibility requirements, a change in the encoding scheme, and a number of new advanced protocol features. To assist with such development, the Digital Test Console protocol analysis and exerciser system is a complete, integrated solution able to handle these test needs — from electrical to pro-tocol layer — for all x1 through x16-lane architectures. To accomplish these tasks, the instrument provides equalization snoop probe (ESP) — a unique technology for reliable data capture at 8 Gtransfers/s — a Link Training and Status State Machine (LTSSM) exerciser for validating new encoding and pro-tocol designs, and a flexible GUI to help debug the advanced protocol.

The console is designed to work as part of a complete system that can in-clude a 90000 Series Infiniium oscilloscope for ensuring electrical compli-ance of PCIe 3.0 devices, an 86100C Infiniium DCA-J jitter analyzer, J-BERT N4903B high-performance serial BERT, N5990A test automation software, and the Advanced Design System (ADS), which provides simulation for de-sign characterization and optimization. (Average system price, $100,000 — console and associated instruments available now.)Agilent Technologies, Santa Clara, CASales 800-829-4444http://www.agilent.com

Project1:Layout 1 2/19/10 8:47 AM Page 1


NEWPRODUCTS

Dual-freq. generatoris inexpensive Priced under $800, the Model 409B/02 direct digital synthesis (DDS) signal generator provides dual frequencies to 171 MHz with 0.1-Hz resolution and ±1.5-ppm accuracy. The unit has four outputs (two 1-Vpp phase-synchronous sine waves and two matching LVCMOS), and it fea-tures serial control, 500-MHz exter-nal clock input, and an on-board TCXO stable to ±1.5 ppm.

Based on the ADI AD9958 ADC, the instruments has 32-bit frequen-cy, 10-bit amplitude, and 14-bit phase resolution on each channel. The unit operates from 5 Vdc, and comes with ac adapter and control software; multiple units can be syn-chronized using an external clock. ($795 — stock to 2 weeks ARO.) Novatech Instruments , Seattle , WA Sales 206-301-8986 [email protected] http://www.novatech-instr.com

Test & Measurementedited by richardcomerford

See our online archive at http://electronicproducts.com/tm

from denisbul

HIGHLIGHTS

Foil resistors enable new design solutions The H and HZ series of secondary-standard, hermetically sealed, oil-filled Bulk Metal foil resistors en-able entirely new areas of design for resistors by offering resistance and reliability options for applications such as feedback devices for operational amplifi-ers, precision voltage di-viders, meter multipli-ers, and precision bridge resistors. The resistors’ special construction al-lows their copper leads to pass through the seal to the outside of the enclosure, minimizing thermal EMF at the internal termination-to-resistor junction assembly. The de-vices are said to experience a mini-mal shift in resistance values over

Power MOSFETs have lowest R DS(on)

, target automotive apps The AUIRF7739L2 and AUIRF7665S2 DirectFET2 power MOSFETs are pre-sented as providing the automotive industry’s lowest R DS(on) . They also feature dual-sided cooling, and low parasitic inductance and resistance in an AEC-Q101-qualified package for automotive applications. These devices are lead-free and offer over-

(From $10 — samples available from 10 working days; standard or-ders, 5 weeks.) Vishay Intertechnology Malvern , PA Andrew Post 610-251-5287 [email protected] http://www.vishay.com

their entire lifetime. Specifications include tolerances

of 0.001% (10 ppm), values of 5 Ω to 1.84 MΩ, a shelf-life stability of 2 ppm (±0.0002%) for at least 6 years (unaffected by humidity), and a rise time of ≤1 ns. Maximum TCR ranges from ±2 ppm/°C for the H series to ±0.2 ppm/°C for the Z-Foil HZ series.

Other key specifications include electrostatic dis-charge protection up to 25 kV, 1-ns rise time with es-sentially no ringing, cur-rent noise of ≤ –40 dB, typical thermal EMF of

0.05 μV/°C, and a ≤0.1 ppm/V volt-age coefficient.

The resistors can be carried in sets for daily or periodic calibration of factory measurement equipment. Laboratory- and metrology-level specifications are also available.

www.paktron.com

Applications

MissionCritical

www.paktron.com


NEWPRODUCTS

edited by p.o’shea, c.nickolas, r.comerford and c.d’airo

See our online archive at http://electronicproducts.com/cs

from denisbul

Smart MEMS sensor makes handhelds aware of both location and movement Said to be the first three-axis gyro-scope with an embedded hardware accelerator engine for motion pro-cessing, the MPU-3000 motion-pro-cessing unit is an inertial sensing integrated device that enables con-current operation of location-based services, 3D gaming, image stabili-zation, and gesture recognition in smart phones and other handheld devices. The single-chip CMOS MEMS IC covers a range of motions from 250°/s to over 2,000°/s with a noise specification of 0.03º/s/Hz.

For complete motion processing, the 4 x 4 x 0.9-mm IC includes built-in 16-bit ADCs, programmable digi-tal filters, built-in six-axis sensor fu-sion capability, and I 2 C or SPI digital interfaces. It is factory calibrated to 1% sensitivity, and consumes just 13 mW in operation.

The device extends the tradi-tional inertial sensor architecture

all system-level size and cost reduc-tions along with superior perfor-mance and efficiency when compared to traditional standard plastic-packaged components.

The AUIRF7739L2 in the large-can package delivers 0.7-mΩ R DS(on) at 40 V. The large package features a 60% smaller footprint and 85% lower pro-file than a D2PAK. The device suits heavy-load motor-control applica-tions including electric power steer-ing, battery switches, and integrated starter alternators in micro hybrid ve-hicles (stop and go), and chassis, drive train, and power train systems.

The AUIRF7665S2 small can de-vice features 8.3-nC gate charge and exhibits low parasitics for fast switching performance. This de-vice targets automotive switching applications including the output stage of Class D audio amplifiers as well as dc/dc converters and fuel injection systems. (Ea/low volume: AUIRF7739L2, $2.60; AUIRF7665S2, $0.46 — available now.) International Rectifier El Segundo , CA Graham Robertson 310-726-8512 [email protected] http://www.irf.com

with its Digital Motion Processor (DMP) acceleration engine, which, together with an embedded FIFO, offloads high-frequency motion al-gorithm computations from the handheld’s application processor, thereby improving overall system performance.

The unit provides a dedicated I 2 C

interface for an external accelerome-ter, use of which lets the DMP perform six-axis sensor fusion on gyroscope and accelerometer outputs. The DMP can thus report quaternion data to the application processor, offloading it from sensor fusion computation and timing synchronization. Other features include a temperature sensor


Components & Subassemblies

and an FSYNC pin for synchroniz-ing image/video and GPS data. (Un-der $4 ea / prod qty — samples avail-able now; prod qty, 2nd qtr.) InvenSense , Sunnyvale , CA Mike Housholder 408-988-7339 ext. 299 [email protected] http://www.invensense.com

2470 Fox Hill Road, State College, PA 16803-1797Phone: 800-458-3401 or 814-355-8004 • Fax: 814-355-2714E-mail: [email protected] • Source code: 56235

QUALIFICATIONS

ISO9001 & AS9100 • MIL-PRF-55342 • MIL-PRF-32159 • MIL-PRF-914

RESISTIVE PRODUCTS

At State of the Art, we like control... the superior design, manufacturing and delivery of every resistor we make.

Technology, quality and reliability are not an option; they’re a given. And our policy of made in the USAwill never change.

Sure we’re control freaks, but you wouldn’t want it any other way.

Control Freaks

We are mission-critical resistor specialists


NEWPRODUCTS

Snap-acting switch has new mounting support The ZMS Series subminiature snap-acting switch line now feature a mounting hole with a locating stud, along with potted wire leads in straight and right-angle configura-tions to meet IP67 sealing specifica-tions. Wire-lead versions meet IP67 specifications, while pc-board sol-dering terminations meet dust and splash-proof requirements.

Features include a contact rating of up to 125 Vac and a mechanical life span of more than 100,000 cy-cles. The RoHS-compliant switches feature an operating temperature range from –40° to 85°C. This series is suited for use in communication devices, testing equipment, consum-er electronics, and security/alarm systems. (From $0.75 to $0.95 ea/10,000 — 6 to 8 weeks ARO.) C&K Components , Newton , MA Sales 800-635-5936 http://www.ckcorp.com

100-V bridge rectifier suits lighting apps The CBRHDSH2-100 Schottky bridge rectifier, packaged in the HD DIP case, has a 0.7-μA reverse-leakage cur-rent. The 2-A, 100-V full-wave bridge

rectifier suits power-management, solid-state lighting, and PoE applications.

The bridge recti-fier features a 50%

reduction in board space over four individual Schottky rectifiers in an SMA package. ($0.28 ea/3,000 – avail-able now.) Central Semiconductor Hauppauge , NY Tom Donofrio 631-435-1110 [email protected] http://www.centralsemi.com

Si, SiC power modules come in SOT227 pkgs An expanded line of APTxxxxxxx diode modules offers 35 full-bridge devices in SOT227 packages. They range from 6 to 100 A with voltages from 45 to 1,700 V.

The SiC diode modules are avail-

able with currents from 6 to 40 A, in voltages of 600 and 1,200 V. The Schottky diode modules are offered with a current range from 30 to 60 A, with voltages from 45 to 200 V. Two standard mains rectifier diode full bridge modules are available with 40- and 90-A current ratings and voltage ratings of 1,600 V. (Si diode bridges, from $8.47; SiC diode bridg-es, $24.26 — available now.) Microsemi , Irvine , CA Information 949-221-7100 http://www.microsemi.com

Components & Subassemblies

from denisbul


NEWPRODUCTS

QFN sockets dissipate IC heatDesigned for 0.4-mm-pitch 84-pin ICs in 10 x 10-mm packages, the CG-QFN-7003 QFN socket operates at

bandwidths up to 10 GHz with less than 1 dB of inser-tion loss. The socket requires no solder-ing, and can dissi-pate up to several watts without extra heat sinking and handle up to 100 W

with custom heat sink.Specifications include typical

contact resistance of 20 mΩ per pin, pin self-inductance of 0.11 nH, and mutual inductance of 0.028 nH. Temperature range is –35° to 100°C, current capacity is 2 A per pin, and capacitance to ground is 0.028 pF. ($647 each — available now.)Ironwood ElectronicsBurnsville, MNIla Pal [email protected]://www.ironwoodelectronics.com

Headers, connectors withstand high tempsAvailable with 1 to 36 contacts per row, the single- and dual-row Hi-Temp 0.10 0 - in.- con-tact-centerline male headers can withstand operating tem-peratures from –65°C to 150°C. The headers complement the company’s Hi-Temp dual-row card edge connec-tors, which come in 0.039-, 0.050-, 0.100-, 0.125-, and 0.156-in. contact centerline versions, are offered with 2 to 120 contacts per row, and support a temperature range of –65° to 250°C.

Both devices offer current ratings from 1 to 3 A max per contact, are supplied with full or selective gold plating and offer 500 mating cycles, minimum. (2-position/4-pin single-row headers, from $0.12 ea/1,000; 4-position/8-pin dual-row card edge connectors, from $1.70 ea/1,000 —

stock to 5 days ARO.)Sullins Connector SolutionsSan Marcos, CANick Chiew [email protected]://www.sullinscorp.com

TEAs minimize power consumptionThe modified Tunnel series of ther-moelectric assemblies (TEAs) feature a cross-flow technology maximizing heat transfer when pulling air through a heat exchanger. Heat is ab-sorbed and dissipated through a high-density heat sink equipped with sheet metal shrouds and fans.

The thermoelectric assemblies are available in convection- and conduc-tion-cooling configurations. The AA-027-12-22 and AA-035-24-22 c o n v e c -t ion-cool-ing devices absorb and d i s s i p a t e heat with exchangers equipped with fans. The DA-033-12-02 and DA-039-12-02 conduction-cooling products ab-sorbed heat through a cold plate, pumping the heat through the ther-moelectric module and dissipating it into the air through a heat sink equipped with a fan. (Contact 888-246-9050 or [email protected] for pricing and avail-ability.)Laird Technologies, St. Louis, MOInformation [email protected]://www.lairdtech.com

Cable assembly enables high-speed a/v appsSuited for a range of high-speed digi-tal video and audio applications, the Q:Active HD line of high-perfor-mance DisplayPort cable assemblies enable resolutions of 2,560 x 1,600 pixels at 60/120 GHz at up to 50 m of copper cable (passive to 3 m). Pow-ered by Intersil’s Q:Active analog sig-nal processing technology, the cable assemblies feature a high-speed CMOS device embedded into the connector.

Packaging & Interconnections

edited by christina d’airo and paul o’shea See our online archive at http://electronicproducts.com/in

The mDP-to-DP ultrathin analog cables use Mini DisplayPort (mDP) connectors, and can support 8.64-Gbit/s bandwidths (HBR) of Display-Port 1.1a and the upcoming Display-Port 1.2 specification (HBR2) that doubles resolution/color depth with an aggregate data rate of 17.28 Gbits/s. (From $89 per cable — available now.)Intersil, Milpitas, CASales 408-432-8888http://www.intersil.com

L

154 Hobart St., Hackensack, NJ 07601TEL: 201-343-8983 FAX: 201-343-2132

www.masterbond.com [email protected]

Quick Curing One Part Epoxy Adhesive/SealantHas Exceptional Thermal Conductivity

Master Bond Supreme 3ANHTThermal conductivity 23-24 BTU•inch/ft2•hr•˚F• Superior electrical insulation properties • Nomixing needed • Cures in 20-30 minutes at250˚F; 5-10 minutes at 400˚F • Resists vibration, shock and thermal cycling • Non-sagging, even on vertical surfaces • 100%reactive – contains no solvents • Thermal stability up to 400˚F • Convenient packaging

Fast.6019 3.25 x 4.5:4389v2 3.375 x 4.875 2/1/10 11:32 AM Page 1

Low-profile connector supports 16 PCB sizesSuited for high-speed edgecard appli-cations, the 0.80-mm pitch EdgeLine CoEdge con-nector is the newest addi-tion to the E d g e L i n e family. The dua l - s ided , one-piece 25-Gbit/s connector sup-ports up to 16 PCB thickness varia-tions with multiple circuit sizes.

Keying and locking features secure the connector to the PCB and ensure

boards are aligned at the centerline during mating. No application tool-ing is required. (Contact company for pricing and availability.)Molex, Lisle, ILInformation [email protected]://www.molex.com

19-way connector suits harsh environmentsRated to IP55 specifications, the 19-way commercial Pogo pin connector and cable assembly suit harsh envi-ronments r e qu i r e d in applica-tions such as medical test and diagnostic equipment and industrial equipment. The connector features proprietary Pogo pin tech-nology, offering contact resistance under 10 mA and a lifespan of more than 5,000 mating cycles.

The connector has stainless-steel shells, snap-on breakaway coupling, and an interfacial seal. The tactile and audible mating system has an er-


NEWPRODUCTS


from denisbul

Mezz connectors now stream 20+ Gbits/sThe TwinMezz mezzanine connector system has been upgrades to now stream 20+ Gbits/s of data. The ultra-high-density connectors are avail-able in configurations with six dif-ferential signal pairs per column, offering 25 h igh- speed signal pairs in a square centimeter.

The self-mating con-nectors have an open-pin field de-sign and can support stack heights from 12 to 40 mm with 200 to 800 contact positions. Options for inte-grated molded, metal guides or the

Mini Cat 5e cables suit Ethernet, xDSL appsOffered in 26 or 28 AWG, the Madi-son Cable Cat 5e miniature trunk cables reduce cable congestion issues

in high-data-rate Ethernet and xDSL ap-p l i c a t ion s . The smaller size also im-

proves cabinet/frame airflow, reduc-es weight, and makes handling and routing easier.

The multipair cables are available in shielded or unshielded configura-tions, and are customizable for spe-cific applications. The cables meet

gonomic grip. The cable assembly in-cludes bulkhead, front mount, recep-tacle, plug with RJ45 and in-line plug options. (Open-ended assembly, from $100 to $200 — 10 to 12 weeks ARO.)ITT Interconnect SolutionsSanta Ana, CAKeith Teichmann [email protected]://www.ittcannon.com

industry standards (TIA/EIA 568, ISO 11801), safety ratings (UL/CSA), and ADSL/VDSL2 and GbE (Category 5e) requirements. (Contact Marc Dupuis for pricing and availability.)Tyco Electronics, Harrisburg, PAMarc Dupuis 508-926-4145http://www.tycoelectronics.com/help


ADVERTISEMENTNEWPRODUCTS


capability to mix signal and power wafers in a single connector are also offered. (Contact Grace S. Showers for pricing and availability.)FCI ElectronicsEtters, PAGrace S. Showers [email protected]://www.fciconnect.com

Mini battery retainers suit SMT appsThe 2994 and 2994TR miniature lithium button-cell retainers suit high-density PCB packaging for SMT applications. The retainers accept all ML414 micro lithium batteries from

all major man-ufacturers and are engineered with reliable spring tension to secure the

battery and low contact resistance.These retainers are manufactured

of phosphor bronze with solder tails and are available with gold plating for both lead-free and low-temperature reflow soldering. Available in bulk or on tape and reel. (Contact company for pricing and availability.)Keystone, Astoria, NYSales [email protected]://www.keyelco.com

Halogen-free cables meet LEED Pilot CreditThe GenSpeed product family now includes a line of halogen-free riser cables, called 17 FREE.

The UL-rated category 6 and 5e cables are based on LEED Pilot Credit 2 and earlier requests for green prod-ucts, and do not contain any chlo-rine, fluorine, bromine, or iodine. (Contact Gina Rittinger for pricing and availability.)General CableHighland Heights, KYGina Rittinger [email protected]://www.generalcable.com

Fiber-optic cables suit space-constrained appsSuited for space-constrained high-density applications such as trunk, LAN, 40/100 GbE, and data centers, the high-density (HD) Bend Tolerant fiber-optic cables are available in di-ameters from 3 to 11.1 mm. Easily

ribbonized for MTP/MPO connec-tors, the cables feature a unique non-ribboned design that eliminates the preferential bend axis and allows a minor decibel loss at a very small bend radius.

The cables are available in fiber counts from 2 through 72; fiber counts greater than 12 fibers will be 3-mm 12-fiber subcables. Individual cables are colored for ease of termi-nation, and are UL listed OFNP in accordance with NEC 770.179(a). (Contact company for pricing and availability.)Optical Cable, Roanoke, VAHeather Johnson [email protected]://www.occfiber.com

NEWPRODUCTS



from denisbul


NEWPRODUCTS

•Over 2500 Std.DC-DC Converters

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Consult Factory

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143 Sparks Ave. Pelham, N.Y. 10803-18889INDUSTRIAL • COTS • MILITARY

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Adapters provide USB 3.0 via PCIe and EC The U3PX2 Atomix PX two-port USB 3.0 adapter card features PCIe inter-

face that works in virtually any desktop PC, and the U3EC2 Ato-

mix EC is a two-port USB 3.0 adapter card with an Express Card interface that works in most laptops. Facilitat-ing the migration to

USB 3.0, the cards support up to 4.8-Gbit/s bandwidth, 10 times faster than USB 2.0. The cards are also fully backward compatible with USB 2.0 devices. Both feature supple-mental power input jacks to support USB peripherals. (PCIe adapter, $35; Express Card adapter, $40.) Active Media Products Fremont , CA OEM Sales 510-440-8263 http://www.activemp.com

ETX module features Atom D450/D510 CPU The MB-80200 ETX system-on-mod-ule comes with an Atom D450 or D510 processor, an AMI SPI BIOS, and a 82801HM chipset I/O control-ler. The card has an HD audio interface, four USB 2.0 ports, and one 10/100 Eth-ernet port.

The 4.5 x 3.7-in. module supports dual displays with VGA and LVDS and has a DDR2 SO-DIMM socket for up to 2 Gbytes of 667/800-MHz memory. It runs on 5 V and takes only 11 to 20 W. (From $226 ea/300 — available now.) WIN Enterprises North Andover , MA Sales 978-688-2000 [email protected] http://www.win-ent.com

Boards & Peripherals

edited by jimharrison

See our online archive at http://electronicproducts.com/bp


Surface Mount Probing Adapters

In-Circuit test Your IC • BGA, QFN, QFP, PLCC, & SOIC• SMT adapters solder to target board• Modular probe boards, controlled Impedance Flex

(plug & test)• High quality ZIF sockets• Gold plated test points• 1000’s of standard products• Quick-Turn Custom Solutions

Ironwood ElectronicsTel: (800) 404-0204Fax: (952) 229-8201www.ironwoodelectronics.com

www.ironwoodelectronics.com

¸RoHS

Panasonic CX & SX SP-Cap®: Cut Cost, Boost PerformancePanasonic’s SP-Caps provide excellent performance as output capacitors for DC-DC converters. SP-Caps do not require voltage derating & using parts with lower voltage ratings can mean cost savings. The CX series has the best price/performance. The SX series has the lowest ESR rating: 4 mΩ to 9 mΩ.• No wear-out mechanism • Stable cap. characteristics vs.

temp., freq.& voltage bias• Use lower rated voltage products

than Tantalum CapacitorsPanasonic Electronic Compts.piccomponentsmarketing@ us.panasonic.comwww.panasonic.com/ ecomponents/cap/

Small Size, High ReliabilityUltra-Miniature Quartz Crystal With a 3.2 mm x 1.5 mm footprint and a 0.97 mm maximum height, the CX11 crystal is one of the smallest crystals available in the industry. It is available in a 32.768 kHz frequency, as well as frequency ranges of 100 kHz to 180 kHz and 20 MHz to 50 MHz. Calibration tolerances down to 30 ppm are available for this crystal. The CX11 is ideal for medical, military and industrial applications where board space is at a premium. To obtain the latest datasheet for the CX11, visit www.statek.com.

Statek [email protected]

Miniature Piezo Chime Tone Alarms are 103 dB @ 2’Floyd Bell’s stylish Turbo Series piezoelectric alarms are twice as loud and half the size of industry counterparts. • The pleasant chime tone can be heard in most loud

environments and has a watertight seal when used with a gasket. • Optional rotary volume control lets the user decide on the

loudness. • Various voltages, terminations

and tones available.

Floyd Bell Inc.888-FLOYD-BELLsales@fl oydbell.comhttp://www.fl oydbell.com

ADVERTISER INDEX Absopulse Electronics Limited …………… 84Acopian Power Supplies ………………… 37Actel Corp …………………………………… 2Agilent Technologies ………………… C2, 19Alpha Wire Corp …………………………… 76Ametek Programmable Power …………… 63Applied Power ……………………………… 86Aries Electronics …………………………… 18Avnet Electronics ………………………9, 46Bel-Fuse, Inc ………………………………… 41Cadsoft Computer Inc. …………………… 60Calex Manufacturing Co. Inc. …………… 72Central Semiconductor …………………… 15Cirrus ………………………………………… 67Clare, Inc. …………………………………… 73Coilcraft …………………………………… 10Cornell Dubilier Electronics ……………… 62CUI Inc. ……………………………………… 38Data Image ………………………………… 85Digi Key Corporation ……………………… 1Electronic Devices Inc. …………………… 42Elma Electronics, Inc. …………………… 93Endicott Research Group (ERG) ………… 48Fairchild Semiconductor Logic ………… 74FCI Electronics ………………………… 26, 27Fischer Connectors Inc. …………………… 20Floyd Bell, Inc. ……………………………… 96Fujipoly America Corporation …………………………… 48Garrett Electronics, Corp. ………………… 75Globtek Inc. ……………………… C1, 49, 79

Harwin ……………………………………… 94Hioki USA Corporation …………………… 16Hittite Microwave Corp. …………… 57, 59Integrated Power Design ………………… 43Intel ………………………………………… 25International Rectifi er …………………… 29Ironwood Electronics ……………………… 96ITW Paktron ………………………………… 88IXYS Corp. …………………………… 50, 54Keystone Electronics Group ……………… 45Lambda Americas ………………………… 81Linear Technology Corp. ………………… 13Linx Technologies ………………………… 92Martek Power ……………………………… 61Master Bond Inc. …………………………… 92Master Distributors ………………………… 66Maxim Integrated Products …… 21, 23, C4Meanwell USA ……………………………… 4METcase ……………………………………… 93Micrel Semiconductor ……………………C3Micro Power Direct ………………………… 83MicroSemi Corporation ………………… 42Minmax Technology Co., Ltd. …………… 95Mornsun America ………………………… 76Mouser Electronics ………………………… 34MS Kennedy Corporation ………………… 84MTM Power ………………………………… 44muRata Power Solutions ………………… 47National Instruments ……………………… 3NEC/Tokin Corporation ………………… 22Ohmcraft …………………………………… 55

OKW Enclosures Inc ……………………… 91Panasonic Industrial Co. ………………… 96Pduke ………………………………………… 82Pelican ……………………………………… 56Phihong USA ……………………………… 68Phihong USA ……………………………… 69Pico Electronics Inc. ………………… 77, 95Positronic Industries ……………………… 32Power Solutions Inc. ……………………… 82Probe Master Inc …………………………… 40Renesas Technology America, Inc ……… 39Rigol Technologies ………………………… 17Rohde & Schwarz …………………… 30 - 31Samtec Inc. ………………………………… 58Schurter, Inc. ……………………………… 8Spectrum Advanced Specialty Products ………………… 64, 65Spectrum Control Inc. …………………… 51State of the Art, Inc. ……………………… 90Statek Corporation …………………… 89, 96Super Bright LED’s ………………………… 85Taiyo Yuden, USA ………………………… 24Techmar Enclosures Corp. ……………… 72Tektronix Inc. ……………………………… 53Tensility International Corp. …………… 63Total Power International Inc. …………… 70TTI Inc. ……………………………………… 6Tyco Electronics - Circuit Protection …… 52Vicor Corp - VI Chip Group ……………… 78Voltage Multipliers Inc. …………………… 70XP Power …………………………………… 71

Turbo Series Alarm with Volume Control

PRODUCT MART Electronic Products Presented BY THE ManufacturerFOR SPECS AND SAMPLES http://epinfo.us

from denisbul

Industry’s first touch-screen controller to integrate haptic feedbackHaptic (tactile) feedback enhances any touch-screen experience by providing mechanical feedback. The MAX11811 integrates a touch-screen controller and haptic driver in one IC to simplify adding haptic feedback to any touch-screen application while saving board space. Target applications include handheld devices, UMPCs, office printers, gaming consoles, digital photo frames, digital still/video cameras, and point-of-sale terminals. Other MAX118xx devices are available for applications not requiring haptic feedback.

The MAX11802/MAX11803 offer a reduced feature set vs. the MAX11800/MAX11801. †1000-up recommended resale. Prices provided are for design guidance and are FOB USA. International prices will differ due to local duties, taxes, and exchange rates. Not all packages are offered in 1k increments, and some may require minimum order quantities.

Feel the touch

MAX11811 advantages• Integrated H-bridge drives DC vibration motors

and supports external piezo actuator drivers• Built-in waveform generator reduces latency

from touch to haptic output• Integrated proximity sensing support turns off

haptic feedback when touch screen is not in use

MAX118xx product family advantages• Reduced bus loading of the system/application

processor saves system power consumption• Internal state machine simplifies host-

processor interpretation of complex touch events





www.maxim-ic.com/MAX11811-info

TM

Part Haptic/Proximity Driver Interface Package

(mm x mm)Price†

($)MAX11811 I2C 20-TQFN (2.1 x 2.1) 1.75

MAX11800/MAX11802 SPI12-TQFN (1.6 x 2.1) 1.55/1.2412-WLP (1.6 x 1.6) 1.51/1.20

MAX11801/MAX11803 I2C12-TQFN (1.6 x 2.1) 1.50/1.2112-WLP (1.6 x 1.6) 1.46/1.16

PROXIMITYSENSOR OUTPUT

INTERRUPT CONTROLTIRQB

IR

A0

SCLSDA

A1

X+Y+X-Y-

MUX

PROXIMITYSENSOR INPUT

I2CDIGITAL

CONTROL

PATTERNLOOK-UP

MOTORCONTROL

MOTORDRIVER

DATA REGISTERSDAC

ADC

APPLICATIONPROCESSOR

TOUCHSENSOR

LRA/ERMMOTOR

OR

MAX11811TSC

TIRQ

SCL

SDA

X+X-Y+Y-

PIEZODRIVER

PIEZOACTUATOR

MAX11811

from denisbul

Electronic Products - March 2010

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