eGRAF Electronics Thermal Solutions · eGRAF ® Thermal Management Solutions Non-Structural...
Transcript of eGRAF Electronics Thermal Solutions · eGRAF ® Thermal Management Solutions Non-Structural...
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eGRAF® Electronics Thermal Solutions
Introduction
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eGRAF® Thermal Management Solutions
Non-Structural Engineered Graphite Foils
Graftech has developed a family of thermal interface materials named eGRAF® based upon
the science of engineered foil graphite.
The graphite foils are engineered to control the thermal conductivity both in the plane of
the material as well as through the plane.
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In-Plane
Thermal Conductivity
Through-Plane
Thermal Conductivity
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eGRAF® Flexible Graphite Interface Materials
RoHS, REACH compliant
– Contains no hazardous materials
UL94V-0 flammability rated
– Non-flammable
Environmentally Friendly
Chemically inert to almost any substance
Easy disposal of waste
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eGRAF® Reliability
eGRAF® Not Affected by Electronics Operating Environment
eGRAF graphite foils retain thermal
performance over time and temperature
extremes
– eGRAF is stable up to 400 C
– Demonstrated over 50 years of graphite
gasket experience
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Weight Loss in eGRAF Flexible Graphite Material due to Oxidation in Air at High Temperatures Report dated May 2012
eGRAF is chemically inert
– Will not react with other material or fluids
Adhesives and coatings need to be
carefully selected to meet environmental
requirements
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eGRAF® HITHERM™
Value Proposition
Carbon Based Material
- Thermal conductivity up to 16W/mK
- No outgassing
- Environmentally Friendly
Differentiating FeatureValue to Customer
and/or End User
Increases reliability of mission critical, long life electronics designs
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Foil Form Factor- Die-cut parts enabling lower cost.
- Pick and place manufacturing.
Material thickness between
125 μm (0.005”) & 500 μm (0.020”)
- Fills thicker bond lines.
- Greases degrade with bond line
thickness over 50 μm (0.002”.)
Increases reliability and manufacturability of
mission critical, long life electronics designs
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eGRAF® HITHERM™ Grades
Product grades to meet design requirements
– Adhesive coating for “peel & stick” manufacturing
– PET coating for electrical isolation
HT-700General purpose- Low intensity LEDs
Design Options
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0 5 10 15 20
HT-2500
HT-1200
Thermal Conductivity (W/m-K)
Improved performance- High Brightness LEDs
- “Under the Hood” Applications
Polymer enhanced performance- Inverters
- Mission critical applications
Business Confidential
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eGRAF® SPREADERSHIELD™
Value Proposition
Carbon Based Material
- Thermal conductivity up to 1500W/mK
- Anisotropic: Spreads heat in-plane
- Environmentally Friendly
Differentiating FeatureValue to Customer
and/or End User
Unique passive thermal shielding and spreading solution
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Flexible Foil Form Factor
- Contours to shaped housings
- Die-cut parts enabling lower cost
- Pick and place manufacturing
Lightweight material with
Thickness as thin as
0.025mm
- Integrates into any existing design
- System weight reduction
- Non-structural
Increases reliability of electronics designs
by eliminating active thermal solutions
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SS300General purpose• Thicker form factors
• Power cooling applications
eGRAF® SPREADERSHIELD™ Grades
Product grades to meet design requirements
– Thermal conductivity grades to match thermal demands
– Multiple adhesive and coating options available
Design Options
0 500 1000 1500
SS1500
SS600
SS500
SS400
Thermal Conductivity (W/m-K)
• Power cooling applications
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CuMg
High Performance• Thin form factors
• High thermal conductivity
Al
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Designing with eGRAF® SPREADERSHIELD™
AluminumAluminum
0.9 g (200% Heavier)
CopperCopper
2.0 g (560% Heavier)
Lig
hte
rLi
gh
ter
eGRAF-SS600eGRAF-SS600
0.3 g
Case study of an 18 cm2 heat spreader
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18 cm2 part. Similar thermal conductance.
Th
inn
er
Th
inn
er
eGRAF-SS600eGRAF-SS600
0.003”
AluminumAluminum CopperCopper
0.005” (50% Thicker)0.007” (100% Thicker)
Same design, SS600 wins. SS600 is lighter and thinner than conventional metal spreadersSame design, SS600 wins. SS600 is lighter and thinner than conventional metal spreaders
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Typical Applications
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Market Application: Lighting
Advantages
– Foil form factor
– Consistent thermal performance over time
Ideal for Indoor and Outdoor Lighting Applications
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Lighting applications include downlights, track lighting, and outdoor spot lights
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Market Application: Inverters
Advantages
– Thermal conductivity up to 16W/m-K
thru-plane (z-plane)
– Consistent performance across entire
temperature range
– Reliable thermal interface for both
Unparalleled through plane thermal conductivity
– Reliable thermal interface for both
switches and capacitors
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Inverter applications include automotive, solar, and industrial motor controllers
Business Confidential
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Designing with eGRAF® HITHERM™
Characteristic Guideline
Thermal ConductivityInterface pressure and additional factors
contribute to performance
Electrical IsolationBalance between electrical and thermal
conductance.
Bond Line Thickness/SurfaceCompromise between ideal surfaces and
manufacturing costs.
When Does HITHERM™ Fit?
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manufacturing costs.
ReliabilityEnvironmental characteristics have
significant impact on most TIMs
Business Confidential
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Market Application: Displays
Advantages
– LED light-bar thermal management.
Heat efficiently spread to chassis
– Corner light mura reduced
– Heat from power supply board
shielded from display
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Advanced displays improved image quality
55” LED LCD TV
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Market Application: Displays
Advantages
– Reduced heat of LEDs bright
enough to enable daytime viewing
of display
– Spread heat from LED lights to
aluminum frame
– Improved overall image quality
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– Improved overall image quality
relative to other thermal designs.
– Enabled operating range between
-20 C and +65 C
Ruggedized aftermarket
LCD monitor
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Market Application: Computing
© 2012 GrafTech International Holdings Inc. All Rights Reserved.
SPREADERSHIELD™ has enabled latest generation of advanced devices
Tablet Devices Smartphones
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Market Application: Computing
Advantages
– Eliminated heat pipes and fans from
thermal solution which improves
system reliability and simplifies FMEA
analysis
– Improves thermal conductivity of full
magnesium alloy chassis
– Outperformed copper solution at
20% of the weight
– Extended battery life by eliminating
fans and heat pipes
– Conducts ~15 W of heat from the
CPU to keyboard underside
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Ruggedized Laptop
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Market Application: LED Lighting
Performance Advantages
– Uniform thermal gradient
resulting in higher
luminance uniformity
– Reduces hotspot temperatures
which extends LED lifetime
over expected life of troffer
© 2012 GrafTech International Holdings Inc. All Rights Reserved.
Ownership Advantages
– Lighter weight by reducing
gauge of aluminum housing
– Enables field replaceable
LED panels
Lighter weight, longer life, better light quality troffer
LED Lighting Troffer
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Market Application: LED Lighting
Advantages
– Spread heat captured on top side of
headlight housing
– Reduced temperature of hot spot
below melting temperature of
plastic housing.
– Lower cost solution relative to
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– Lower cost solution relative to
complete housing replacement
with alternative, higher
temperature housing.
Headlight Retrofit Program
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Advantages
– Thinner section optimizes volumetric constraints
– Lighter weight impacts overall vehicle efficiency
– Higher thermal conductivity moves more heat out of (and in to) the battery
– Flexibility allows for common design configuration
Market Application: Li-Ion Battery CoolingTechnology based on
Prototype Automotive Solutions
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Flexible Graphite Heat Transfer “Plates” enable battery Performance, Durability and Safety
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Designing with eGRAF® SPREADERSHIELD™
Characteristic Guideline
Thermal ConductivityMultiple factors contribute to determine
required performance
WeightProvides weight reduction options to
systems engineering team
ReliabilityThermal requirements can be addressed
with passive cooling solution
When Does SPREADERSHIELD™ Fit?
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with passive cooling solution
Available Thickness Fits into most existing design tolerances.
Business Confidential
© 2012 GrafTech International Holdings Inc. All Rights Reserved.