Effects of Variation on Emerging Devices for Use in SRAM Greg LaCaille and Lucas Calderin.

10
Effects of Variation on Emerging Devices for Use in SRAM Greg LaCaille and Lucas Calderin

Transcript of Effects of Variation on Emerging Devices for Use in SRAM Greg LaCaille and Lucas Calderin.

Effects of Variation on Emerging Devices for Use in SRAMGreg LaCaille and Lucas Calderin

SRAM Power ConsumptionMinimum operating supply voltage (Vmin)

determined by:◦ Minimum acceptable Ion/Ioff ratio◦ Effects of performance variation on read and write

margins

As CMOS is scaled down both these values typically get worse.

Reducing Vmin will lower power consumption

SRAM assist techniques typically target improving variation tolerance contribution.

Device selection can affect the contribution from leakage requirements.

Fully Depleted CMOSUTB-SOI or FinFETSimilar to Bulk CMOSGate control over

entire channel reduces sub-threshold swing

DIBL reduced relative to Bulk but still present

Carbon Nano-tube FETsBallistic transportSaturation determined

by contact resistance Intrinsic channel more

similar to BJT than MOSFET

Little-to-No DIBL

Tunneling FETsn-type

Band to Band tunneling current

Capable of sub-threshold swing < 60mV/dec

Low on current relative to MOS device of similar size

Little-to-No DIBL

SRAM LeakageFor a SRAM with

m rows

where A is the desired marginm=256; A=4There is a

minimum Vdd where this can be satisfied

DeviceVmin (V)

(leakage only)

FD CMOS 0.260

CNFET 0.225

TFET 0.070

Read/Write FailureScript written to

simulate DC sweeps while sweeping variation in each transistor

Automatic detection of read and write failures

Variation Limits

Each point represents a read or write failure X axis is the average Vth of all the devices in the point that failed Y axis is the rms sum of the difference in Vth for each device

from the average Vth for the point Area below the curve represents successful cells

Variation LimitsFor all devices the maximum allowable

variation increased with Vdd as expectedThe allowable deviation at the lowest Vth to

satisfy leakage requirements deviates among the devices substantially

ConclusionImproved Ion/Ioff for the TFET

doesn’t necessarily improve Vmin due to variation

CNFET is comparable to FD CMOSMinimum access time will also

play a key role in design of the SRAM

Any of these devices could be used with SRAM assist circuits to improve variability tolerance