Effects of Variation on Emerging Devices for Use in SRAM Greg LaCaille and Lucas Calderin.
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Transcript of Effects of Variation on Emerging Devices for Use in SRAM Greg LaCaille and Lucas Calderin.
SRAM Power ConsumptionMinimum operating supply voltage (Vmin)
determined by:◦ Minimum acceptable Ion/Ioff ratio◦ Effects of performance variation on read and write
margins
As CMOS is scaled down both these values typically get worse.
Reducing Vmin will lower power consumption
SRAM assist techniques typically target improving variation tolerance contribution.
Device selection can affect the contribution from leakage requirements.
Fully Depleted CMOSUTB-SOI or FinFETSimilar to Bulk CMOSGate control over
entire channel reduces sub-threshold swing
DIBL reduced relative to Bulk but still present
Carbon Nano-tube FETsBallistic transportSaturation determined
by contact resistance Intrinsic channel more
similar to BJT than MOSFET
Little-to-No DIBL
Tunneling FETsn-type
Band to Band tunneling current
Capable of sub-threshold swing < 60mV/dec
Low on current relative to MOS device of similar size
Little-to-No DIBL
SRAM LeakageFor a SRAM with
m rows
where A is the desired marginm=256; A=4There is a
minimum Vdd where this can be satisfied
DeviceVmin (V)
(leakage only)
FD CMOS 0.260
CNFET 0.225
TFET 0.070
Read/Write FailureScript written to
simulate DC sweeps while sweeping variation in each transistor
Automatic detection of read and write failures
Variation Limits
Each point represents a read or write failure X axis is the average Vth of all the devices in the point that failed Y axis is the rms sum of the difference in Vth for each device
from the average Vth for the point Area below the curve represents successful cells
Variation LimitsFor all devices the maximum allowable
variation increased with Vdd as expectedThe allowable deviation at the lowest Vth to
satisfy leakage requirements deviates among the devices substantially