EE105 – Fall 2014 Microelectronic Devices and Circuitsee105/fa14/lectures/Lecture09... · Lecture...

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1 1 Lecture 9: MOSFET (2): Scaling, DC bias EE105 – Fall 2014 Microelectronic Devices and Circuits Prof. Ming C. Wu [email protected] 511 Sutardja Dai Hall (SDH) 2 Lecture 9: MOSFET (2): Scaling, DC bias NMOS Transistor Capacitances: Saturation Region Drain no longer connected to channel C GS = 2 3 C GC + C GSO W C GD = C GDO W

Transcript of EE105 – Fall 2014 Microelectronic Devices and Circuitsee105/fa14/lectures/Lecture09... · Lecture...

Page 1: EE105 – Fall 2014 Microelectronic Devices and Circuitsee105/fa14/lectures/Lecture09... · Lecture 9: MOSFET (2): Scaling, DC bias 1 EE105 – Fall 2014 Microelectronic Devices and

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1 Lecture 9: MOSFET (2): Scaling, DC bias

EE105 – Fall 2014 Microelectronic Devices and Circuits

Prof. Ming C. Wu

[email protected]

511 Sutardja Dai Hall (SDH)

2 Lecture 9: MOSFET (2): Scaling, DC bias

NMOS Transistor Capacitances: Saturation Region

•  Drain no longer connected to channel

CGS =23CGC +CGSOW CGD =CGDOW

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3 Lecture 9: MOSFET (2): Scaling, DC bias

SPICE Model for NMOS Transistor

Typical default values used by SPICE:

KP = 50 or 20 µA/V2

γ = 0

λ = 0

VTO = 1 V

µn or µp = 500 or 200 cm2/V-s

2ΦF = 0.6 V

CGDO = CGSO = CGBO = CJSW = 0

Tox= 100 nm

4 Lecture 9: MOSFET (2): Scaling, DC bias

MOS Transistor Scaling

•  All physical dimensions shrinks by a factor of α

•  All voltages (including threshold voltage) reduced by α also –  Constant field scaling

•  Drain current:

•  Gate Capacitance:

•  Circuit delay in a logic circuit.

iD* = µn

εoxTox α

W αL α

vGSα

−VTNα

−vDS2α

"

#$

%

&'vDS2α

=iDα

CGC* = Cox

"( )*W *L* = εox

Tox αWα

!

"#

$

%&Lα

!

"#

$

%&=

CGC

α

τ * =CGC* ΔV *

iD* =

CGC

αΔV /αiD /α

=τα

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5 Lecture 9: MOSFET (2): Scaling, DC bias

MOS Transistor Scaling Scale Factor α (cont.)

•  Circuit and Power Densities:

•  Power-Delay Product:

•  Cutoff Frequency:

–  fT improves with square of channel length reduction

P* = VDD* iD

* =VDD

αiD

α=

Pα2

P*

A* =P*

W *L* =P α2

W α( ) L α( )=

PA

extremely important result!

PDP* = P*τ* =Pα2

τα

=PDPα3

ωT =gm

CGC

=µn

L2 VGS −VTN( )

6 Lecture 9: MOSFET (2): Scaling, DC bias

Impact of Velocity Saturation

•  At low electric field, electron velocity is proportional to field

•  At high electric field, the velocity reaches a maximum called saturation velocity, vSAT

•  The drain current is proportional to (vGS – VTN) rather than its square

•  There are (many) other corrections to the basic model when the channel become very short

–  Interested, take EE130

iD =Cox" W2

vGS −VTN( )vSAT

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7 Lecture 9: MOSFET (2): Scaling, DC bias

NMOSFET in OFF State

•  We had previously assumed that there is no channel current when vGS < VTN. This is incorrect!

•  As vGS is reduced (toward 0 V) below VTN, the potential barrier to carrier diffusion from the source into the channel is increased.

•  The drain current ID is limited by carrier diffusion into the channel, rather than by carrier drift through the channel.

•  This is similar to the case of a PN junction diode! –  ID varies exponentially with the potential barrier height

at the source, which varies directly with the channel potential.

8 Lecture 9: MOSFET (2): Scaling, DC bias

Sub-Threshold Leakage Current

•  In the depletion (sub-threshold) region of operation, the channel potential is capacitively coupled to the gate potential. A change in gate voltage (ΔvGS) results in a change in channel voltage (ΔvCS):

iD ∝ exp ΔVCSVT

#

$%

&

'( Similar to pn junction diode!

ΔVCS = ΔVGS ×Cox

Cox +Cdep

#

$%%

&

'(( ≡ ΔVGS /m, m =1+

Cdep

Cox

>1

Sub-threshold slope (also called sub-threshold swing):

S ≡ d(log10 IDS )dVGS

#

$%

&

'(

−1

S =mVT ln(10)> 60mV/dec

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9 Lecture 9: MOSFET (2): Scaling, DC bias

MOS Transistor Scaling (cont.)

•  Sub-threshold Conduction: –  iD decreases exponentially for

vGS < VTN.

–  Reciprocal of the slope in mV/decade gives the turn-off rate for the MOSFET.

–  Fundamental limit of MOSFET sub-threshold slope: 60mV/decade

ON state current

VDD

Leakage current

Fixed Subthreshold Slope

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Mask Sequence Polysilicon-Gate Transistor

•  Mask 1: Defines active area or thin oxide region of transistor

•  Mask 2: Defines polysilicon gate of transistor, aligns to mask 1

•  Mask 3: Delineates the contact window, aligns to mask 2.

•  Mask 4: Delineates the metal pattern, aligns to mask 3.

•  Channel region of transistor formed by intersection of first two mask layers. Source and Drain regions formed wherever mask 1 is not covered by mask 2

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11 Lecture 9: MOSFET (2): Scaling, DC bias

Basic Ground Rules for Layout

•  Design of large circuits can be simplified with simple rules

•  Minimum feature size: F = 2 Λ

•  Minimum alignment between different features: T = Λ

•  Λ could be 1, 0.5, 0.25 µm, etc.

•  In this example: –  W/L = 10Λ / 2Λ = 5 –  Transistor Area = 120 Λ2

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MOSFET Biasing

•  ‘Bias’ sets the dc operating point.

•  The ‘signal’ is actually comprised of relatively small changes in the voltages and/or currents.

•  Remember (Total = dc + signal): vGS = VGS + vgs and iD = ID + id

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13 Lecture 9: MOSFET (2): Scaling, DC bias

Bias Analysis - Example 1: Constant Gate-Source Voltage Biasing

•  Check:VDS > VGS-VTN. Hence saturation region assumption is correct.

•  Q-pt: (50.0 mA, 5.00 V) with VGS= 3.00 V

•  Discussion: The Q-point of this circuit is quite sensitive to changes in transistor characteristics, so it is not widely used.

VDD = ID RD +VDS

VDS =10V − 50µA( ) 100K( ) = 5.00 V

Since IG = 0,VEQ = IG REQ +VGS = VGS

ID =Kn

2VGS −VTN( )2

ID =25x10−6

2A

V 2 3 −1( )2V 2 = 50.0 µA

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Bias Analysis Using Load Line

Check: The load line approach agrees with previous calculation. Q-pt: (50.0 mA, 5.00 V) with VGS = 3.00 V

Discussion: Q-pt is clearly in the saturation region. Graphical load line is good visual aid to see device operating region.

For VDS = 0, ID = 100 uA

For ID = 0, VDS = 10 V

Plotting the line on the transistor output characteristic yields Q-pt at intersection with VGS = 3V device curve.

VDD = ID RD +VDS

10 =105 ID +VDS

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Bias Analysis - Constant Gate-Source Voltage Biasing with Channel-Length Modulation

Check: VDS > VGS - VTN. Hence the saturation region assumption is correct.

Q-pt: (54.5 mA, 4.55 V) with VGS = 3.00 V

Discussion: The bias levels have changed by about 10% (54.5 µA vs 50 µA). Typically, component values will vary more than this, so there is little value in including λ effects in most circuits.

ID =Kn

2VGS −VTN( )2

1+ λVDS( )VDS = VDD − ID RD

VDS =10 −25x10−6

2105( ) 3 −1( )2

1+ 0.02VDS( )VDS = 4.55 V

ID =25x10−6

23 −1( )2

1+ 0.02 4.55( )[ ] = 54.5 µA

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Bias Analysis - Example 6: Two-Resistor Feedback Biasing

Assumption: IG = IB = 0, transistor is saturated (since VDS = VGS )

Analysis: VDS = VDD - IDRD

Since VGS < VTN for VGS = -0.769 V, the MOSFET would be cut-off,

VDS > VGS-VTN. Hence saturation region assumption is correct.

Q-pt: (130 µA, 2.00 V)

VGS = VDD −Kn

2VGS −VTN( )2

RD

VGS = 3.3 −2.6x10−4

2104( ) VGS −1( )2

VGS = −0.769 V or + 2.00 V

∴VGS = +2.00 V and ID =130 µA

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17 Lecture 9: MOSFET (2): Scaling, DC bias

Bias Analysis - Example 6: Two-Resistor Feedback Biasing

Assumption: IG = IB = 0, transistor is saturated (since VDS = VGS )

Analysis: VDS = VDD - IDRD

Since VGS < VTN for VGS = -0.769 V, the MOSFET would be cut-off,

VDS > VGS-VTN. Hence saturation region assumption is correct.

Q-pt: (130 µA, 2.00 V)

VGS = VDD −Kn

2VGS −VTN( )2

RD

VGS = 3.3 −2.6x10−4

2104( ) VGS −1( )2

VGS = −0.769 V or + 2.00 V

∴VGS = +2.00 V and ID =130 µA

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Bias Analysis – Two-Resistor biasing for PMOS Transistor

Assumption: IG = IB = 0; transistor is saturated Analysis:

Hence saturation assumption is correct.

Q-pt: (52.5 µA, -3.45 V)

VDS >VGS−VTP

VGS − IGRG −VDS = 0→VDS =VGSVDD +VDS − IDRD = 0

VDD +VGS −Kn

2VGS −VTP( )2 RD = 0

15+VGS − 2.2x105( ) 5x10−5

2VGS + 2( )2

= 0

VGS = −0.369 V or −3.45 VSince VGS = −0.369 >VTP, VGS = −3.45 V

ID = 52.5 µA and VDS = −3.45 V