Dummy and Pad Chips Needed for various activities (interconnection tests, mass tests, assembly,…)...
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Transcript of Dummy and Pad Chips Needed for various activities (interconnection tests, mass tests, assembly,…)...
Dummy and Pad Chips• Needed for various activities (interconnection tests, mass tests, assembly,…)• Production of masks, processing, thinning and dicing of wafers presumably takes about 2-3 months.
Pad chips
• 15 mm x 30 mm• 50 um thick• Metal pads and traces on SiO2/Si• Daisy chain connections
Dummy chips
• 15 mm x 30 mm• 50 um thick• Blank silicon
WP6 meeting 16/01/14 - P. Riedler
Component status
• Some chips left of each type, but not sufficient for the activities in 2014!
• Collect needs from the different activities and start producing dummy + pad chips– WP4,6,7,8,9
Next:• Purchase wafers for dummy and pad chips• Thin and dice wafers for dummy chips• Pad chips: define layout and produce patterned wafers
followed by thinning and dicing
WP6 meeting 16/01/14 - P. Riedler
Pad chips – main parameters tbd
Chip dimension: • Approximately 15 mm x 30 mm (tbc)
– Studies on stave arrangement and new beam-pipe ongoing– Study the possibility to use the full reticle length (32 mm)
Number of pads:• Assume 88 contacts (32 VDDD, 32 VDDA, 8 SUB, 8 DATA, 4 CLK, 4 Conf)
– Feed-back from FPC design needed (e.g. distance of pads from the edge, etc.)
Pad positions:• Should be as close as possible to final layout (TDR version)• File ready soonPad form:• Square or octagonal preferred over round pad form
– Impact of the pad form on soldering needs to be evaluated on dummy chips
Pad diameter:• Has to take into account the alignment precision of the holes on the FPC• Tentative diameters: 250, 300 and 350 um to be evaluated on dummy chips
WP6 meeting 16/01/14 - P. Riedler
Question:
How many components are needed for the activities in WP6:• # of dummy chips• # of pad chips needed
WP6 meeting 16/01/14 - P. Riedler
WP4 Laser soldering Tab bonding Post-processing Mass test
Evaluation Pad form Pad form Test of metallurgy and supplier
PALPIDE-FS for contact tests
Pad size Pad size
Results El. tests+ metallurgical analysis
El. tests+ metallurgical analysis
El. tests+ metallurgical analysis
Single chip assemblies
Single chip assemblies
Single chip assemblies
IB+OB HIC IB+OB HIC IB+OB HIC
# chips needed
WP6 meeting 16/01/14 - P. Riedler