Dual line IPAD , common mode filter with ESD protection ... · Dual line IPAD™, common mode...
Transcript of Dual line IPAD , common mode filter with ESD protection ... · Dual line IPAD™, common mode...
This is information on a product in full production.
March 2014 DocID018656 Rev 2 1/13
ECMF02-2BF3
Dual line IPAD™, common mode filter withESD protection for high speed serial interface
Datasheet - production data
Features
• Very large differential bandwidth above 5 GHz
• High common mode attenuation:
– - 23 dB at 900 MHz.
• High common mode attenuation:
– - 20 dB between 800 MHz and 2.2 GHz.
• Very low PCB space consumption: <1.1mm2
• Thin package: 0.50 mm max. after reflow
• Lead-free package
• High reduction of parasitic elements through integration
Complies with the following standard:
• IEC 61000-4-2 level 4 input and output pins:
– ±15 kV (air discharge)
– ±8 kV (contact discharge)
Application
High speed serial interfaces such as USB 2.0, MIPI D-PHY, MDDI and HDMI.
Description
The ECMF02-2BF3 is a highly integrated common mode filter designed to suppress EMI/RFI common mode noise on high speed differential serial buses like MIPI D-PHY, MDDI, USB 2.0 and HDMI.
The ECMF02-2BF3 can protect and filter one differential lane.
Figure 1. Pin configuration (bump side)
Figure 2. Schematic
TM: IPAD is a trademark of STMicroelectronics.
Flip Chip5 bumps
12
A
B
C
IN1
IN2
GND
OUT1
OUT2
IN1
IN2
OUT1
OUT2
GND
GND
www.st.com
Characteristics ECMF02-2BF3
2/13 DocID018656 Rev 2
1 Characteristics
Figure 3. Electrical characteristics (definitions)
Table 1. Absolute maximum ratings (Tamb = 25 °C)
Symbol Parameter Value Unit
VPP Peak pulse voltage(1)
1. Measurements done on IEC 61000-4-2 test bench. For further details see Application note AN3353.
IEC 61000-4-2 contact discharge
IEC 61000-4-2 air discharge
10
20kV
Tj Maximum junction temperature 125 °C
Top Operating temperature range - 30 to + 85 °C
Tstg Storage temperature range - 55 to 150 °C
Table 2. Electrical characteristics (values, Tamb = 25 °C)
Symbol Test conditions Min. Typ. Max. Unit
VBR IR = 1 mA 6 V
IRM VRM = 3 V per line 100 nA
RDC DC serial resistance 3 4 Ω
Symbol ParameterV = Breakdown voltage
I
I
= Leakage current @
= Leakage current @
V
VV = Stand-off voltage
BR
RM
R
RM
BR
RM
I
VVBRVRM
IRIRM
IRM
IR
VRMVBR
DocID018656 Rev 2 3/13
ECMF02-2BF3 Application schematics
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2 Application schematics
Figure 4. USB2.0 application
Figure 5. MIPI D-PHY application
ECMF02-2BF3
D-
D+
GND
To U
SB
tra
nsc
eive
r
ID
VBUS
IN1
GND
OUT1
OUT2 IN2
D0+
D0-
D1+
D1 -
D2+
D2-
CLK+
CLK-
GND
GND
GND
GND
IN1
GND
OUT1
OUT2 IN2
IN1
GND
OUT1
OUT2 IN2
IN1
GND
OUT1
OUT2 IN2
IN1
GND
OUT1
OUT2 IN2
To d
isp
lay
and
cam
era
MIP
I D-P
HY
Measurement curves ECMF02-2BF3
4/13 DocID018656 Rev 2
3 Measurement curves
Figure 6. SDD21 differential attenuation measurement (Z0 diff = 100 Ω)
Figure 7. SCC21 common mode attenuation measurement (Z0 com = 50 Ω)
100.0k 1.0M 10.0M 100.0M 1.0G-3.00
-2.50
-2.00
-1.50
-1.00
-0.50
0.00SDD21 (dB)
F (Hz)
SCC21 (dB)
100.0k 1.0M 10.0M 100.0M 1.0G-40.00
-35.00
-30.00
-25.00
-20.00
-15.00
-10.00
-5.00
0.00
F (Hz)
DocID018656 Rev 2 5/13
ECMF02-2BF3 Measurement curves
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Figure 8. SDD11 and SDD22 differential return loss measurement (Z0 diff = 100 Ω)
100.0k 1.0M 10.0M 100.0M 1.0G-40.00
-35.00
-30.00
-25.00
-20.00
-15.00
-10.00
-5.00
0.00
SDD11 SDD22
SDD1 and SDD22 (dB)
F (Hz)
Measurement curves ECMF02-2BF3
6/13 DocID018656 Rev 2
Figure 9. ESD response to IEC 61000-4-2 (+8 kV contact discharge)
Figure 10. ESD response to IEC 61000-4-2 (-8 kV contact discharge)
61.2 V
31.8 V
19.6 V 16.4 V
1
2
43
V : ESD peak voltageV :clamping voltage @ 30 nsV :clamping voltage @ 60 ns
PP
CL
CL
V :clamping voltage @ 100 nsCL
1234
-60.6 V
-21.9 V-16.7 V -13.7 V
1
243
V : ESD peak voltageV :clamping voltage @ 30 nsV :clamping voltage @ 60 ns
PP
CL
CL
V :clamping voltage @ 100 nsCL
1234
DocID018656 Rev 2 7/13
ECMF02-2BF3 High speed differential standard compliance tests
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4 High speed differential standard compliance tests
4.1 USB2.0 compliance tests
Figure 11. TDR measurement (loaded by Zdiff = 90 Ω)
Figure 12. Eye diagram with USB2.0 template
70
75
80
85
90
95
100
110
0.5 1.0 1.5 2.0 2.5 3.0 3.5
ZDIFF ( )Ω
t(ns)
0.0
105
tr = 400 ps (10% - 90%)
200 mV/div 200 mV/div
347.2 ps/div347.2 ps/div
Through ISS* Board + ECMF02-2BF3
* Impedance standard substrate
High speed differential standard compliance tests ECMF02-2BF3
8/13 DocID018656 Rev 2
4.2 HDMI1.4 compliance tests
Figure 13. TDR measurement (loaded by Zdiff = 100 Ω), tr = 194 ps (10% - 90%)
DocID018656 Rev 2 9/13
ECMF02-2BF3 PCB layout recommendations
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5 PCB layout recommendations
Figure 14. PCB layout recommendations
90 Ω differential pairs
Pad layout recommendation
GND IN2 IN1
OUT2 OUT1
220 µm recommended
220 µm recommended260 µm maximum
Solder stencil opening:
Copper pad Diameter:
Solder mask opening:300 µm minimum
Package information ECMF02-2BF3
10/13 DocID018656 Rev 2
6 Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.
Figure 15. Package dimensions
Figure 16. Marking
1230
µm
± 4
0 µ
m
830 µm ± 30 µm
255 µm ± 40
400 µm ± 40
400
µm
± 4
0 505 µm ± 55
215 µm
215
µm
xy
xw
zw
DotECOPACK grade
xx = marking
yww = datecode(y = year
z = manufacturing location
DocID018656 Rev 2 11/13
ECMF02-2BF3 Ordering information
13
Figure 17. Flip Chip tape and reel specification
Note: More information is available in the application notes:AN2348, “IPAD™ 400 µm Flip Chip: package description and recommendations for use”AN1751, “EMI filters: recommendations and measurements”
7 Ordering information
Figure 18. Ordering information scheme
Dot identifying Pin A1 location
User direction of unreelingAll dimensions are typical values in mm
4.0
4.0
2.0
8.0
1.75
3.5
Ø 1.55
0.59
0.93
0.22
1.33
ST ST STxxzyww
xxzyww
xxzyww
Table 3. Ordering information
Order code Marking Package Weight Base qty Delivery mode
ECMF02-2BF3 KE Flip Chip 1.15 mg 5000 Tape and reel 7”
ECMF 02 - 2 B F3
Function
Number of lines
Number of ESD protected lines
Version
Package
ESD common mode filter
02 = 2 lines
2 = 2 ESD protected lines
F3 = WLCSP 0.4 mm pirch
Revision history ECMF02-2BF3
12/13 DocID018656 Rev 2
8 Revision history
Table 4. Document revision history
Date Revision Changes
09-Feb-2012 1 Initial release.
07-Mar-2014 2 Updated Figure 13.
DocID018656 Rev 2 13/13
ECMF02-2BF3
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