DSM300 Service Man 83179_1

DSM300Digital Sounder ModuleService ManualDocument Number: 83179-1

Date: May 2005

WARNING:

CE Marking of Equipment/Replacement Parts

If the Raymarine equipment under repair, test, calibration, installation or setting to work carries the European CE mark, only parts andcomponents supplied or approved for such use by Raymarine should be used in order to maintain compliance with the relevant CErequirements.Incorporation, use or attachment, by any means, of parts or components not supplied for or not approved for such use by Raymarineor, if supplied or approved for use by Raymarine, not properly fitted in accordance with instructions published, provided orrecommended by Raymarine, may cause the equipment to malfunction and, in particular, to become unsafe or to no longer meet therelevant CE requirements. In these circumstances, Raymarine excludes liability to the fullest extent permissible in law for any loss ordamage including any liability for its contribution to such loss or damage by its negligent acts or omissions.

DSM300 Digital Sounder Module

2 DSM300 Service Manual 83179-1

Important Information

Intended Use

This Service Manual contains information to assist with maintenance and service of your DSM300Digital Sounder Module. It is intended to be used by qualified Raymarine service representatives.

Safety Notice

This equipment must be installed and operated in accordance with the instructions contained in theInstallation Manual. Failure to do so can result in personal injury and/or navigational inaccuracies.

High Voltage

This unit contains high voltages. The unit should always be turned off and power disconnectedbefore removing the covers. The unit’s high voltage can take up to 1 minute to decay. Only qualifiedservice technicians should perform the specialized service procedures.

Warranty

When a repair is carried out by an authorized Raymarine service representative, some or all of thecost may be covered by the Raymarine warranty. Refer to the Limited Warranty Certificate in thehandbook for your DSM300.

Printing this Document

This service manual is distributed as an electronic document. Pages 1–20 are intended to be printedeither on US Letter size (a.k.a. A size, 8.5 x 11 in) or metric A4 size (210 x 297 mm) sheets. Pages21–36 should be printed on US Tabloid size (a.k.a. B size, 11 x 17 in) or metric A3 size (297 x 420mm) sheets.

Service manual contents © Raymarine, 2005

DSM300 Service Manual 83179-1 3

1.1. Unit Configuration .............................................................................................................................. 51.2. Design Details.................................................................................................................................... 6

ContentsChapter 1: Technical Description ....................................................................................5

System Diagram ................................................................................................................................6Power Supply.....................................................................................................................................6Boost Circuit ......................................................................................................................................8CPU ...................................................................................................................................................8Flash and SDRAM .............................................................................................................................9FPGA.................................................................................................................................................9ARCNET............................................................................................................................................9Ethernet (SeaTalkhs) ........................................................................................................................10Speed, Temperature, Battery Voltage and Transducer Sense ........................................................10

Chapter 2: Service Procedures ......................................................................................11

2.1. Master Reset ................................................................................................................................... 112.2. Status LED....................................................................................................................................... 132.3. Interface Connections...................................................................................................................... 14

Power Cable End Connector ...........................................................................................................14hsb2 Cable End Connector...............................................................................................................14Transducer Connector .....................................................................................................................15Communications Link – J1...............................................................................................................15Transducer Link – J2 .......................................................................................................................16

2.4. Spare Parts List ............................................................................................................................... 162.5. Replacing Parts ............................................................................................................................... 16

Access and Replacement ................................................................................................................16

Chapter 3: Drawings .......................................................................................................21

List of Drawings ...............................................................................................................................21DSM300 Main Board – Top Level .................................................................................................. 22 DSM300 Main Board – CPU Section ............................................................................................. 23DSM300 Main Board – Flash and SDRAM Section ....................................................................... 24DSM300 Main Board – FPGA Section 1 ........................................................................................ 25DSM300 Main Board – FPGA Section 2 ........................................................................................ 26DSM300 Main Board – Ethernet Section ....................................................................................... 27DSM300 Main Board – ARCNET Section ...................................................................................... 28



DSM300 Main Board – Sonar Speed and Temperature ................................................................ 29DSM300 Main Board – Boost and Transmitter Section ................................................................. 30DSM300 Main Board – Sonar Receiver ......................................................................................... 31DSM300 Main Board – Power Supply Unit .................................................................................... 32DSM300 Main Board – USB Section ............................................................................................. 33DSM300 Main Board – PCB Assembly ......................................................................................... 34DSM300 Connector I/O Board – Schematic .................................................................................. 35DSM300 Connector I/O Board – PCB Assembly ........................................................................... 36

Chapter 1: Technical Description



1.1. Unit Configuration

Figure 2-1: DSM300 PC Boards and Interfaces

The DSM300 contains two PC boards, as shown in Figure 2-1.

The Connector I/O board provides connection and filtering from the CPU board to the connectors.The connections provided are Power, Sonar Transducer, hsb2, and SeaTalkhs. The connector I/Oboard also contains the three-color warning LED, which is controlled by the CPU.

The CPU/Sonar (Main) board contains the DSM300’s main circuitry. It is comprised of the CirrusLogic EP9301 processor, the Xilinx XC3S400E Field Programmable Gate Array (FPGA), SMSCCOM20022 ARCNET controller for the hsb2 interface, Broadcom AC101L Ethernet PHY andsupport circuitry such as PROMS, SDRAM, Sonar/Transducer interfaces, RS485 and powercontrol and supervisory circuits. The connections provided are Battery In Positive & Negative, hsb2,Ethernet (SeaTalkhs) and data from the transducer: Transducer Sense, Water Temperature, andPaddlewheel Speed. This board also contains connections to the warning LED on the ConnectorI/O board and a thermistor for sensing the temperatures within the unit.


6

1.2. Design Details

ystem Diagram
S
DSM300 Service Manual 83179-1

Figure 2-1: DSM300 Master Block Diagram

Power SupplyThe Power Supply circuitry provides power outputs of +10V, +5V, +3.3V, +2.5V, +1.8V, +1.2V tothe DSM300. In addition, the +5V line is further divided into a filtered +/-5V for use by the Sonarreceiver circuitry and an isolated +5V for the hsb2 circuitry.

The power supply circuitry begins on the Connector I/O PCB, where the incoming Battery Positiveand Negative pass through LC filters. The shield of the power cable is connected to the conductivecoating on the inside of the plastic housing.

U1 - CPUEP9301

U3 - SDRAM128Mb

U4 - FLASH2MB

U5 - FPGAXC3S400

U9 - ARCNETCOM20022

U7 - ETHERNET PHYAC101L

U6 - SDRAM128Mb

RECEIVER

BOOST &TRANSMITTER

USB & SERIAL(ENG TEST ONLY)

PSU+10 VDC +5 VDC

+5 ISO VDC+5 RX VDC-5 RX VDC+3.3 VDC+2.5 VDC+1.8 VDC+1.2 VDC

CPU DATA (x16)

CPU ADDRESS (x26)

U8 - DRIVER IL485

T1 - TRANSFORMER H1102

ETHERNET CONN

ARCNET CONN

SPEEDTEMP

XDCR SENSE

POW ER IN CONN

XDCR CONN

DSM300 MASTER BLOCK DIAGRAM



Figure 2-2: Power Supply Section

As the Battery Positive and Negative Pass onto the Main PCB, additional filtering and transientprotection is included. The Battery Positive is divided into two power signals, one for Boost Powerand the other for Logic Power. These are isolated from each other by diodes D28 and D29, whichalso provide polarity reversal protection.

Logic Power then provides the various output voltages. First, a Switch Mode Power Supply (SMPS)provides the +5V regulated output via a TI TPS40055 (U20) controller with transformer T6. T6 alsohas windings for generating +10V, +5V ISO, + and – 5VRX. The +5V ISO is used for hsb2. +5Vprovides the different voltages needed for the digital logic components. U21 and U22 are linearvoltage regulators set for +3.3V and +2.5V while U23 is a 1.8V switcher. U24 takes the +1.8V inputand regulates it down to +1.2V.



Boost CircuitA Boost Circuit provides the 120V required for high-power sonar transmission. The input to thisBoost Circuit is the Boost Power mentioned in the preceding Power Supply section. The Boostcircuitry is completely controlled by the FPGA. The Boost circuit is enabled or disabled using aMOSFET configured as a high side switch, Q5. To charge the boost reservoir, the FPGA firstselects the voltage level that it will impress on the voltage reservoir capacitors by outputting a pulsewave through an RC filter to the positive input of the monitoring voltage comparator, U10. U10compares this voltage to that of the reservoir capacitors through the voltage divider formed byR115, R116 and R120. These 3 resistors also provide the slow bleed-off path for the reservoir inthe event that the DSM300 is powered off before it has a chance to discharge the reservoircapacitors.

After the boost level trip point has been set in this manner, the FPGA outputs a variable frequencypulse wave through the FET driver U12A to the gate of the switching MOSFET. The on time of thispulse wave is set by the FPGA depending upon the battery voltage so that the peak currentthrough the Boost Inductor T3 does not exceed its maximum ratings. The off time of this pulsewave is determined by the boost current sense circuit formed by the secondary winding of theboost inductor. When the boost inductor has completely discharged the energy stored in it duringthe on time, the current falls to zero and the FPGA begins another cycle.

During the on time, the current through the inductor ramps up from zero to a maximum currentdetermined by the on time, the battery voltage and the inductance. As a result, energy is stored inthe boost inductor. During the off time, this energy is discharged from the boost inductor in the formof current through the blocking diode, D18, causing the voltage to rise in the reservoir capacitors.As soon as this current falls to zero, another cycle begins.

When the voltage reaches the trip point, the FPGA terminates the boost by ceasing to output thepulse wave.

To discharge the boost reservoir, the FPGA turns on the discharge FET Q6, allowing the reservoircapacitors to discharge through R119 to ground.

CPUThe DSM300 is built around a Cirrus Logic ARM9 SoC (System on a Chip). The reset ICs U28 andU2 ensure that a valid reset is performed during power up or upon power fail. The onboard crystaloscillator is used along with Y1 and Y4. The processor core runs at 129Mhz with a bus speed of66Mhz. The CPU also generates the reset for the ARCNET hsb2 controller. Refer to the schematicon page 23. The Power Fail circuit, consisting of D2 and Q1, enables the processor to detect whenpower has been removed from the unit and forces the processor to stop running and force awatchdog interrupt. This results in a timeout and software reset.



ARM920T CLOCKS &TIMERS

INTERRUPTS& GPIO

BUS BRIDGE

SDRAMI/F

FLASHI/F

BOOT ROM(NOT USED)

ETHERNETMAC

2 USBHost

(NOT USED)

2 UARTS(NOT USED)

SERIALAUDIO

INTERFACE

I-Cache16KB

MMU

D-Cache16KB

Peripheral Bus

Processor Bus

MEMORY INTERFACE

USE

R IN

TER

FAC

E

CO

MM

UN

ICA

TIO

NS

INTE

RFA

CE

Figure 2-3: CPU Block Diagram

Flash and SDRAMThe DSM300 uses an AMD type 16Mb flash ROM for program memory. This allows field softwareupdate if needed. For system memory the unit uses 128MB SDRAM.

FPGAThe FPGA contains the front end for all fishfinder operations, including digital sonar transmitterpulse generation and receiver output signals. It is responsible for sonar filtering, automatic gainadjustments, general I/O and controls the Boost. The FPGA uses its own 128MB SDRAM forprocessing sonar data.

The FPGA also handles information from the transducer and monitoring paddlewheel speed. TheFPGA is programmed on every boot cycle and can be changed via software update.

ARCNETA single chip ARCNET interface (U9) implements the low level protocol of the High Speed Bus(hsb2) to carry fishfinder and control data among units on the hsb2 network. The EP9301 processortransmits and receives data over the hsb2 via this chip. The hardware interface onto the HSB cableis via a single RS485 transceiver chip (U8) moving data at a rate of 7.125 MHz. Refer to theschematic on page 28.



Ethernet (SeaTalkhs)The EP9301 processor uses the standard IEEE 802.3u interface for communication to the AC101LEthernet transceiver (U7). T1 is used to electrically isolate the Ethernet signals. Refer to theschematic on page 27.

SeaTalkhs is a 100Mbit, half-duplex network. The connection status can be seen on LEDs D5, D6,D7 and D8, as follows:

D5: Mode (ON = duplex, OFF = half duplex)

D6: Speed (ON = 100Mbit, OFF = 10Mbit)

D7: Link/Active (Flashes to show link and activity)

D8: Collision (ON indicates collisions on the network)

Speed, Temperature, Battery Voltage andTransducer SenseBOAT SPEED – The boat speed is measured by counting paddle wheel revolutions over a setperiod of time. The paddlewheel is usually contained in the transducer but can also be a stand-alone sensor. The sensor is powered through R107 (which also handles short circuit protection.)The paddle wheel will toggle between 5.1V when closed and 10V when open. D13 is used as a setvoltage drop and U11 provides hysteresis for noise immunity. The output of U11 is read by theFPGA, where the number of edges is counted and stored into a register. This register can then beread every ½ second and calculated as boat speed.

WATER TEMPERTURE – The water temperature is calculated by a thermistor on the transducer(or stand-alone sensor.) The thermistor is used in a simple voltage divider circuit, which is fed backinto the A/D input on the processor. The resolution of this A/D enables measurements showing +/-0.1 degree F.

INTERNAL TEMPERTURE 0 AND 1 – The DSM300 has 2 thermistors placed inside the unit tomonitor internal temperature. The system has been designed to slow down ping rate if internaltemperatures approach high levels. The measurement method is performed the same way as thewater temperature but using a different channel of the A/D.

BATTERY VOLTAGE – The battery voltage measurement is used by the DSM300 to calculate theproper boost charge rate. This ensures that the unit will always have peak boost currents that areindependent of input voltage.

TRANSDUCER SENSE – To calculate the proper power to be used in the sonar transmit, allRaymarine sonar transducers have a sense resistor to identify the maximum power capability. Theresistor used for 600W is 0 ohms while 1KW transducers use 3K ohms. The sense resistor isplaced in a voltage divider circuit built around U11 comparator. The threshold is varied using apulse width modulator (PWM) generated by the FPGA, R102 and C114.

Chapter 2: Service Procedures


Chapter 2: Service ProceduresThis chapter describes service issues for the DSM300. It details how to reset the unit and thenprovides the connector pinots and the Spare Parts List for the DSM300. This is followed byprocedures for opening the unit and removing the PC boards for repair or replacement.

Other Raymarine Service Manuals only provide top level schematic drawings to help you isolatefaults to the PC board level. Because most of the circuitry for the DSM300 is housed on one PCboard, this Service Manual provides full schematics so you can troubleshoot to the component level.

The DSM300 may be powered up with the case open after the rear case screws have been removed.Refer to Access and Replacement on page 16.

2.1. Master ResetBefore servicing the DSM300, you should reset the unit. The Reset function returns the DSM300 toits factory default values. How you perform the reset depends on the type of display the soundermodule is connected to. CAUTION: The factory reset clears the sonar depth offset and speed andtemperature calibrations.

For E Series and C Series Displays...

To perform a factory reset:

1. Make sure that FISHFINDER is the active page on the display.2. Press MENU.3. Scroll to and then select FISHFINDER SETUP.4. Scroll to and select DSM Reset.5. Scroll to Reset DSM?6. To confirm the reset, select YES.

i. The power on the DSM300 cycles OFF and ON.ii. The introductory logo is displayed.iii. After a few seconds an application page and a navigation warning is displayed.

7. To continue, read the warning and then press OK.The reset is complete.



For hsb2 PLUS Series Displays...

To perform a factory reset:

1. Make sure that SONAR is the active page on the display.2. Press MENU.3. Press the SONAR SET UP soft key to display the Sonar Set Up page.4. Press and hold MENU for 5 seconds.

The RESET TO DEFAULTS soft key appears.5. Press RESET TO DEFAULTS.

New soft keys appear: ARE YOU SURE? YES. NO.6. Press YES to confirm the reset.

i. The power on the DSM300 cycles OFF and ON.ii. The message SONAR DATA UNAVAILABLE appears. iii. An audible alarm is sounded. iv. The normal sonar image resumes scrolling across the display.

The reset is complete.

To cancel the reset:

Before pressing YES as described in item 4 above, press any of the following keys: DISPLAY,MULTI, VRM/EBL, MARKS, RANGE, GAIN, or ALARMS.

This action opens up a new menu according to the key pressed.

—or—

Press either the ENTER or CLEAR key. This action returns the unit to the Sonar Set Upmenu.



2.2. Status LEDThe LED on the connector panel provides valuable information on the status of the DSM300. TheLED blinks green while the module is operating normally. If the unit detects a problem, the LEDblinks amber to indicate a warning or red for an error. The number of times the LED blinks is a coderepresenting the nature of the problem. For multiple warnings/errors, the codes are given insequence with a 1.5 second pause between strings.

The following table shows the various LED status codes and their meanings.

After 30 seconds of no hsb2 activity, the DSM300 enters Standby mode:No sonar pings are emitted and no warnings are output on the LED. Instead, the LED blinks greenonce every 10 seconds.

For example, if the Transducer Sense fails and hsb2 is not detected, the unit blinks amber once,pauses 1.5 secs, blinks amber twice 0.5 secs apart, pause 1.5 secs, and then repeats the sequenceuntil the problems are resolved or (for some warnings/errors) up to 10 minutes elapse.

A solid red LED (not blinking) indicates a fatal error condition. If the event of a fatal error, the systemwill power cycle to attempt to self-correct the condition.

ColorNo. ofblinks Meaning

Cleared every10 minutes

Amber 1 Transducer Sense Failure2 hsb2 not detected3 High temperature Warning √4 Reserved5 Reserved6 Reserved7 Reserved8 Watchdog Timeout Reboot √

Red 1 Unknown Error √2 Battery Voltage Error √3 High Temperature Error √4 Flash Memory Error5 Reserved6 Reserved7 Reserved8 Hardware Monitor Failure



2.3. Interface Connections

Figure 3-1: Connector Panel

Power Cable Connector

Figure 3-1: POWER Connector

hsb2 Cable Connector

Figure 3-1: HSB2 Connector

Pin No. Signal Name Function Color1 BATT+ Battery positive Red2 BATT– Battery negative Black3 CGND Chassis ground No insulation

Pin No. Signal Name Function1 SHIELD hsb2 shield2 HSB_B hsb2 signal, side 23 HSB_A hsb2 signal, side 14 HSB_GND hsb2 ground



Transducer Connector

Figure 3-1: T/D Connector

Communications Link – JP1

Pin No. Signal Name Function1 SPEED Paddlewheel speed2 TEMP Thermistor temperature 3 XDCR_SHIELD Transducer shield4 XDCR_SENSE Transducer sense5 SPD_TMP_GND Speed and Temp ground6 XDCR – Transducer Depth negative7 XDCR+ Transducer Depth positive

Pin No. Signal Name Function

JP1-1 BATT_IN_+ Battery positive to CPUJP1-2 BATT_IN_+ Battery positive to CPUJP1-3 BATT_IN_+ Battery positive to CPUJP1-4 CGND Chassis groundJP1-5 BATT_IN_- Battery negativeJP1-6 BATT_IN_- Battery negativeJP1-7 BATT_IN_- Battery negativeJP1-8 SPEED Transducer paddlewheelJP1-9 TEMP Water temperatureJP1-10 XDCR_SENSE Senses transducerJP1-11 DGND Logic GroundJP1-12 DIG_LED_RED_IOPCB Red LED (error) onJP1-13 DIG_LED_GRN_IOPCB Green LED (normal) onJP1-14 HSB_B HSB I/O – Differential side 2JP1-15 HSB_A HSB I/O – Differential side 1JP1-16 HSB_GND HSB I/O –Signal groundJP1-17 ETH TX + Ethernet transmit positiveJP1-18 ETH TX - Ethernet transmit negativeJP1-19 ETH RX + Ethernet receive positiveJP1-20 ETH RX - Ethernet receive negative



Transducer Link – JP2

2.4. Spare Parts ListWhen ordering spares, quote the Spare Description and the Part No.

Spare Description Part No.CPU PCB R69082Connector I/O PCB R69083Perimeter Seal (gasket) R69060Power Cable R69053hsb2 to DSM300 Adapter R69081SeaTalkhs Connector Dust Cover R69084hsb2 Connector Dust Cover R08131

2.5. Replacing PartsThe following describes how to disassemble and reassemble the DSM300 for replacing parts.

Access and ReplacementRefer to the unit Spare Parts List and the photographs as specified.

Opening the unit

1. Ensure all cables are removed from the Connector I/O panel.2. Place the unit upside-down (Raymarine logo down) and loosen the 8 securing screws.3. Flip the unit over (right side up) so the screws fall out; then lift the housing and remove it from the

rear cover.If the housing does not remove easily, turn the unit upside-down again.Insert a screwdriver into the center screw hole on one end and gently pry the rear cover awayfrom the housing assembly. This procedure is demonstrated in the following figure.

Ref. Signal Name Function

JP2-1 XDCR+ Transducer positiveJP2-2 XDCR_SHLD Transducer shieldJP2-3 XDCR- Transducer negative



4. Return the unit right side up.

Removing the CPU board

1. Remove the 7 screws securing the CPU/Sonar board.

2. With the connector panel away from you, slide your index fingers under the two cutouts on eachside of the CPU board. With even pressure, gently pull the PCB away from the Connector I/Oboard until it makes contact with the housing.



3. Use one of the two large capacitors to lift up the PCB until it clears the top of the housing.

4. Continue to pull the main PCB until it disconnects from the Connector I/O board.



Removing the Connector I/O board

1. Using a socket set, rotate the nuts retaining the four connectors counter-clockwise and loosenthem from the housing. Remove the nuts and set aside. Socket sizes are as follows: T/D and SEATALK HS = 1¼" POWER = 1" HSB2 = 13/16"

2. Remove the Connector I/O board from the housing.

Reassembly

1. Reattach and secure the Connector I/O board using the four connector nuts.2. Slide the CPU board in at an angle as shown in the following figure and mate the connectors.

3. Sliding the CPU board along the PCB Guides, press the PCB down onto the housing.



4. Reattach the seven screws securing the PCB, as per the figure on page 17.5. Place a new gasket into the groove in the rear cover and lower the housing assembly onto the

gasket.

Note: To ensure a secure fit, you should always replace the gasket seal with a new one. Do notreuse old gaskets.

6. Check that the housing and cover assemblies are properly located.7. Replace the eight securing screws.

Chapter 3: Drawings


Chapter 3: DrawingsThis chapter contains the schematic and assembly drawings for the DSM300.

List of Drawings DSM300 Main Board – Top Level ............................................................................................................................................... 22 DSM300 Main Board – CPU Section .......................................................................................................................................... 23DSM300 Main Board – Flash and SDRAM Section .................................................................................................................... 24DSM300 Main Board – FPGA Section 1 ..................................................................................................................................... 25DSM300 Main Board – FPGA Section 2 ..................................................................................................................................... 26DSM300 Main Board – Ethernet Section ..................................................................................................................................... 27DSM300 Main Board – ARCNET Section ................................................................................................................................... 28DSM300 Main Board – Sonar Speed and Temperature .............................................................................................................. 29DSM300 Main Board – Boost and Transmitter Section ............................................................................................................... 30DSM300 Main Board – Sonar Receiver ...................................................................................................................................... 31DSM300 Main Board – Power Supply Unit .................................................................................................................................. 32DSM300 Main Board – USB Section ........................................................................................................................................... 33DSM300 Main Board – PCB Assembly ....................................................................................................................................... 34DSM300 Connector I/O Board – Schematic ................................................................................................................................ 35DSM300 Connector I/O Board – PCB Assembly ......................................................................................................................... 36

DSM300 Service Man 83179_1

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