Discrete Power Device Packaging Comparison 2021
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+33 2 40 18 09 16 [email protected] www.systemplus.fr 22 bd Benoni Goullin 44200 NANTES - FRANCE Discrete Power Device Packaging Comparison 2021 Comprehensive technology and cost comparisons of 29 discrete packages of power devices from 12 manufacturers including Infineon, STMicroelectronics, and ROHM. SPR21596 - Power Electronics report by Amine ALLOUCHE Physical analysis by Tom HERVE October 2021 - Sample REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
Transcript of Discrete Power Device Packaging Comparison 2021
©2021 by System Plus Consulting | SPR21596 - Discrete Power Device Packaging Comparison 2021 | Sample 1
+33 2 40 18 09 16 [email protected] www.systemplus.fr22 bd Benoni Goullin
44200 NANTES - FRANCE
Discrete Power Device Packaging Comparison 2021
Comprehensive technology and cost comparisons of 29 discrete packages of power devices from 12 manufacturers including Infineon, STMicroelectronics, and ROHM.
SPR21596 - Power Electronics report by Amine ALLOUCHEPhysical analysis by Tom HERVE
October 2021 - Sample
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
©2021 by System Plus Consulting | SPR21596 - Discrete Power Device Packaging Comparison 2021 | Sample 2
Table of Contents
Overview / Introduction 4
o Executive summary
o Reverse costing methodology
o Glossary
Technology & Market 8
o Market overview
o Technology choices of analyzed packages
Physical Analysis 15
Per Body Size (mm²):
o (1×1): CSP
o (3×1): SOT-23
o (3×2): TSOP-6, TSMT8
o (3×3): SOT1210, SON3x3
o (5×3): SOT-89
o (5×4): SOIC-8
o (5×5): SOP/DSOP Advance
o (5×6): PDFN56U, SSO8, SO-8FL, PowerFLAT™ [5x6, 5x6 Double
Island, 5x6 DSC]
o (7×6): DPAK+,DPAK-5,DPAK
o (7×7): sTOLL
o (8×8): ThinPAK 8x8
o (10×9): TOLG,D²PAK,D²PAK7, H²PAK-6
o (15×6): DDPAK
o (10×10): TOLT, H-PSOF8L
o (20×15): TO-247
Technology and Physical Comparison 77
o Overall molded Package Volume – Breakdown (Wires, Die, Attaches, Leadframe,
Clips, Ribbons, Molding)
o Dies vs. Copper Volume % of Molded Package Volume
o Dies Volume % of Molded Package Volume
Manufacturing Process Flow 82
o Hypotheses
o Process 1: CSP (Unmolded)
o Process 2: Wires
o Process 3: Clips
o Process 4: Wires + Ribbon
o Process 5: Wires + Clips
Cost Analysis 89
o Yields explanation & hypotheses
o For each of the 29 packages:✓ Assembly cost per process step✓ Assembly cost breakdown per equipment, cleanroom, labor, consumable, and
yield losses.✓ Packaging cost breakdown per BOM, assembly, final test and yield losses.
Cost Comparison 123
o Comparisons include packaging cost breakdown (BOM, assembly…)
o Package cost per volume.
Feedback 127
Related Analyses 129
System Plus Consulting Services 131
©2021 by System Plus Consulting | SPR21596 - Discrete Power Device Packaging Comparison 2021 | Sample 3
Overview / Introductiono Executive Summaryo Reverse Costing
Methodologyo Glossary
Technology & Market
Physical Analysis
Technology and Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Related Analyses
About System Plus Consulting
Executive Summary
The discrete power devices market represented US$12.3 billion in 2020 with a 4.9% CAGR between 2020 and 2026according to Yole Intelligence, strongly driven by Automotive and Industrial applications.
Several key aspects drive this industry: a wide selection of products and suppliers, the use of standardized products andtechnologies, lower cost per device, and more.
To succeed in the innovation and efficiency race, discrete power device manufacturers should not rely on thesemiconductor aspect only. In fact, when chasing the optimum configuration for electrical, thermal, and mechanicalperformance, they must battle with the reliability and cost of packaging that are also very important parameters. Morethan a simple “shell”, the packaging can make or break a design, and thus it should be adapted to the dies and notdeteriorate their properties.
Different technology variables are tackled: package type, interconnection method, die attach, miniaturization trend,targeted application, and more.
In this context, System Plus Consulting presents an overview of 29 state-of-the-art discrete packages of power devicesfrom Infineon, STMicroelectronics, ROHM, onsemi, Toshiba, Vishay, Microchip, Nexperia, Littelfuse, Taiwan Semi, TexasInstruments, and Nuvoton.
The 29 devices include 14 automotive-qualified AEC-Q101 MOSFETs, 26 Si MOSFETs, 2 Si Superjunctions, and one SiCMOSFET. They cover 9 voltage classes (from 12V to 1200V).
This report highlights the differences in their technology parameters and design and their impact on production cost,along with providing optical pictures of the device’s opened-package and cross-sections. The focus of the report ispackaging technology, and hence the devices are analyzed and costs are simulated at packaging level. Yet some aspectsof the dies that are linked to their assembly in package are highlighted.
Finally, this report provides a comprehensive physical and technological comparison as well as manufacturing costcomparisons of the analyzed discrete packages.
©2021 by System Plus Consulting | SPR21596 - Discrete Power Device Packaging Comparison 2021 | Sample 4
Overview / Introduction
Technology & Market
Physical Analysis Body Size (mm²):o (1×1): CSPo (3×1): SOT-23o (3×2): TSOP-6, TSMT8o (3×3): SOT1210, SON3x3o (5×3): SOT-89o (5×4): SOIC-8o (5×5): SOP/DSOP Advanceo (5×6): PDFN56U, SSO8, SO-8FL,
PowerFLAT™ [5x6, 5x6 Double Island, 5x6 DSC]
o (7×6): DPAK+,DPAK-5,DPAKo (7×7): sTOLLo (8×8): ThinPAK 8x8o (10×9): TOLG,D²PAK,D²PAK7,
H²PAK-6o (15×6): DDPAKo (10×10): TOLT, H-PSOF8Lo (20×15): TO-247
Technology and Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost ComparisonRelated AnalysesAbout System Plus Consulting
Body Size : (x) mm²
©2021 by System Plus Consulting | SPR21596 - Discrete Power Device Packaging Comparison 2021 | Sample 5
Overview / Introduction
Technology & Market
Physical Analysis Body Size (mm²):o (1×1): CSPo (3×1): SOT-23o (3×2): TSOP-6, TSMT8o (3×3): SOT1210, SON3x3o (5×3): SOT-89o (5×4): SOIC-8o (5×5): SOP/DSOP Advanceo (5×6): PDFN56U, SSO8, SO-8FL,
PowerFLAT™ [5x6, 5x6 Double Island, 5x6 DSC]
o (7×6): DPAK+,DPAK-5,DPAKo (7×7): sTOLLo (8×8): ThinPAK 8x8o (10×9): TOLG,D²PAK,D²PAK7,
H²PAK-6o (15×6): DDPAKo (10×10): TOLT, H-PSOF8Lo (20×15): TO-247
Technology and Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost ComparisonRelated AnalysesAbout System Plus Consulting
Body Size : (x) mm²
©2021 by System Plus Consulting | SPR21596 - Discrete Power Device Packaging Comparison 2021 | Sample 6
Overview / Introduction
Technology & Market
Physical Analysis
Technology and Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Related Analyses
About System Plus Consulting
Breakdown
©2021 by System Plus Consulting | SPR21596 - Discrete Power Device Packaging Comparison 2021 | Sample 7
Overview / Introduction
Technology & Market
Physical Analysis
Technology and Physical Comparison
Manufacturing Process Flow
Cost Analysiso (1×1) : CSPo (3×1) : SOT-23o (3×2): TSOP-6, TSMT8o (3×3): SOT1210, SON3x3o (5×3): SOT-89o (5×4): SOIC-8o (5×5): SOP/DSOP Advanceo (5×6): PDFN56U, SSO8, SO-
8FL, PowerFLAT™ [5x6, 5x6Double Island, 5x6 DSC]
o (7×6): DPAK+,DPAK-5,DPAKo (7×7): sTOLLo (8×8): ThinPAK 8x8o (10×9):
TOLG,D²PAK,D²PAK7, H²PAK-6
o (15×6): DDPAKo (10×10): TOLT, H-PSOF8Lo (20×15): TO-247
Cost ComparisonRelated AnalysesAbout System Plus Consulting
Body Size : (x) mm²
©2021 by System Plus Consulting | SPR21596 - Discrete Power Device Packaging Comparison 2021 | Sample 8
Overview / Introduction
Technology & Market
Physical Analysis
Technology and Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Related Analyses
About System Plus Consulting
Packaging Cost Comparison
©2021 by System Plus Consulting | SPR21596 - Discrete Power Device Packaging Comparison 2021 | Sample 9
R E L A T E DA N A L Y S E S
©2021 by System Plus Consulting | SPR21596 - Discrete Power Device Packaging Comparison 2021 | Sample 10
Overview / Introduction
Technology & Market
Physical Analysis
Technology and Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Related Analyses
About System Plus Consulting
Related Analyses
RELATED TEARDOWN TRACKSRELATED REPORTS
By System Plus Consulting:• GeneSiC 1200V Gen3 and
3300V Gen2 SiC MOSFETs
• Automotive Low-Voltage Si MOSFET Comparison 2021
• Silicon IGBT Comparison 2021
• SiC Transistor Comparison 2020
• Medium Voltage GaN HEMT vs Superjunction MOSFET Comparison 2019
By Yole Développement:• Silicon MOSFET Market and
Technology Trends 2021
• IGBT Market and TechnologyTrends 2021
• Status of the Power ElectronicsIndustry 2020
By System Plus Consulting:• Automotive Teardown Tracks
©2021 by System Plus Consulting | SPR21596 - Discrete Power Device Packaging Comparison 2021 | Sample 11
COMPANYSERVICES
©2021 by System Plus Consulting | SPR21596 - Discrete Power Device Packaging Comparison 2021 | Sample 12
Overview / Introduction
Technology & Market
Physical Analysis
Technology and Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Related Analyses
About System Plus Consultingo Company serviceso Contact
Our Core Activity : Reverse Costing®
A Structure, Process and Cost Analysis
Reverse Costing® consists of disassembling a device or a system in orderto identify its technology and discern its manufacturing processes andthen using in-house models and tools to determine its cost.
©2021 by System Plus Consulting | SPR21596 - Discrete Power Device Packaging Comparison 2021 | Sample 13
Overview / Introduction
Technology & Market
Physical Analysis
Technology and Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Related Analyses
About System Plus Consultingo Company serviceso Contact
Fields Of Expertise
©2021 by System Plus Consulting | SPR21596 - Discrete Power Device Packaging Comparison 2021 | Sample 14
Overview / Introduction
Technology & Market
Physical Analysis
Technology and Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Related Analyses
About System Plus Consultingo Company serviceso Contact
Business Model
Teardown Track
205+ teardowns per
year
Monitor1 per year quarterly updated
Custom Analysis150 custom analyses per
year
Report60+ per year
Costing Tools
5 process-based and 3 parametric
costing tools
Cost MethodsTrainingOn demand
©2021 by System Plus Consulting | SPR21596 - Discrete Power Device Packaging Comparison 2021 | Sample 15
Overview / Introduction
Technology & Market
Physical Analysis
Technology and Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Related Analyses
About System Plus Consultingo Company serviceso Contact
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©2021 by System Plus Consulting | SPR21596 - Discrete Power Device Packaging Comparison 2021 | Sample 16
Overview / Introduction
Technology & Market
Physical Analysis
Technology and Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Related Analyses
About System Plus Consultingo Company serviceso Contact
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