Disassembly Notebo 20091141838
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EL-MF877-00 Page 1 Template Revision A Product End-of-Life Disassembly Instructions Product Category: Notebooks and Tablet PCs Marketing Name / Model [List multiple models if applicable.] Name / Model #1Consumer NB jones / HP Pavilion dv6 Name / Model #2 Name / Model #3 Name / Model #4 Name / Model #5 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU direct ive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE). 1.0 Items Requir ing Selective Treatment 1.1 Items listed below are classifi ed as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. Item Description Notes Quantity of items included in product Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA) With a surface greater than 10 sq cm 5 Batteries All types including standard alkaline and lithium coin or button style batteries 2 Mer cur y- contain ing com ponents For exa mple, m er cury in lamps, display back light s, scanner lamps, switches, batteries 2 Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm Includes background illuminated displays with gas discharge lamps 1 Cathode Ray Tubes (CRT) 0 Capacitors / condensers (Containing PCB/PCT) 0 Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height 1 External electrical cables and cords 0 Gas Discharge Lamps 0 Plastics containing Brominated Flame Retardants 0 Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent chambers, and service stations. 0 Components and waste containing asbestos 0 Components, parts and materials containing refractory ceramic fibers 0 Components, parts and materials containing radioactive substances 0
Transcript of Disassembly Notebo 20091141838
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Product End-of-Life Disassembly InstructionsProduct Category: Notebooks and Tablet PCs
Marketing Name / Model[List multiple models if applicable.]
Name / Model #1Consumer NB jones / HP Pavilion dv6
Name / Model #2
Name / Model #3
Name / Model #4
Name / Model #5
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructionsfor the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EUdirective 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, asapplicable.
Item Description Notes
Quantityof itemsincludedin product
Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)
With a surface greater than 10 sq cm 5
B tt i All t i l di t d d lk li d lithi i 2
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B tt i All t i l di t d d lk li d lithi i 2
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where componentsand materials requiring selective treatment can be removed.
Tool Description Tool Size (if applicable)
Description #1Type-cross
#1 (JIS B4633-1987)
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Get out cell battery.2. Loose two M2.5*5L screws on HDD door then take out HDD .3. Loose one M2*3L screw than take out mini card from HDD door housing4. Loose three M2*5L screw than take out RAM door 5. Loose one M2*3L screw than take out TV tunner board6. loose three M2.5X6.5 screws iin HDD housing and Loose three M2.5*4L screws In battery housing region and two
M2.5*6.5L screws .7. Reverse chassis and take out kb retainer 8. Loose three M2*3L and take out keyboard9. Loose four M2*6.5L and take out lcd module10. Loose one M2.5*4L screws from hinge support R and loose one M2.5*4L from center of speaker and Motherboard11. Loose three M2.5*5L screws from hinge cavity on rear side12. Loose one M2.5*6.5L screws on mini door then take out ODD13.14. Loose eight M2.5*6.5L screws on base and loose two M2.5*6.5L on ram door
15 Reverse chassis and take out top assy
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MODEL
Issued
datePurpose
Standard Operating Procedure
2008.10.27
LCM Disassembly Method
LP156WH1-TLA1Prepared by Checked by
Sumi Chae Rich Kim
Dep. NB Qualification Team
STEP 1
Wire Fixing Tape Bottom Tape (Including AL Tape)
AL Tape
Remove Side Tape &Wire Fixing Tape & Bottom Tape
Left Tape
STEP 2 Remove PCB Cover Shield
PCB Cover Shield
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Separate Metal Chassis from Plastic Frame (From Bottom Hook to Left/Right Hook)STEP 4
Metal Chassis
Plastic Frame
STEP 5 Separate Panel Assembly from Backlight Unit
