Digital Devices. Implementing logic circuits Shorthand notation Electrical characteristics.
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Transcript of Digital Devices. Implementing logic circuits Shorthand notation Electrical characteristics.
Implementing Logic Circuits
There are several varieties of transistors – the building blocks of logic gates – the most important are: BJT (bipolar junction transistors) – one of the first to be
invented. Now largely supplanted by FET (field effect
transistors), in particular Metal-oxide semiconductor types (MOSFET’s). MOSFET’s are of two types: NMOS and PMOS
TTL and CMOS
Connecting BJT’s together gives rise to a family of logic gates known as TTL
Connecting NMOS and PMOS transistors together gives rise to the CMOS family of logic gates.
BJTMOSFET
(NMOS, PMOS)
TTL CMOS
transistor types
logic gate families
Electrical characteristics
TTL faster strong drive capability
CMOS lower power consumption simpler to make greater packing density better noise immunity
•Complex ic’s contain many millions of transistors.
•If constructed entirely from TTL type gates would melt
•A combination of technologies may be used.
•CMOS has become most popular and has had greatest development
Electrical characteristics of logic families
Important characteristics are:
VOHmin min value of output recognised as a ‘1’ VIHmin min value input recognised as a ‘1’
VILmax max value of input recognised as a ‘0’ VOLmax max value of output recognised as a ‘0’
Values outside the given range are not allowed.
logic 1
indeterminate
input voltage
logic 0
Noise Margin
If noise in the circuit is high enough it can push a logic 0 up or drop a logic 1 down into the “illegal” region
This is the magnitude of the voltage required to reach this level is the noise margin
Noise margin for logic high is:
NMH = VOHmin – VIHmin
logic 1
indeterminate
input voltage
logic 0
Vohmin
Vihmin
Vilmax
Volmax
Further Important Characteristics
The propagation delay (tpd) which is the time taken for a change at the input to appear at the output
The fanout, which is the maximum number of inputs that can be driven successfully to either logic level before the output becomes invalid
TTL - Example SN74LS00 Recommended operating conditions
Vcc supply voltage 5V ± 0.5 V input voltages VIH = 2V
VIL = 0.8V Electrical Characteristics
output voltage (worst) VOH = 2.7V
VOL = 0.5V Maximum input currents IIH = 20µA
IIL = -0.4mA propagation delay tpd = 15 nS
noise margins for a logic 0 = 0.3Vfor a logic 1 = 0.7V
Fan-out 20 TTL loads
5 Volt
0 Volt
0.80.5
2.02.7
InputRangefor 1
InputRangefor 0
OutputRangefor 0
OutputRangefor 1
Electronic Combinational LogicWithin each of these families there is a large variety of different
devices We can break these into groups based on the number gates per
device
Acronym Description No Gates Example
SSI Small-scale integration <12 4 NAND gates
MSI Medium-scale 12 – 100 Adder
LSI Large-scale 100 – 1000 6800
VLSI Very large-scale 1000 – 1m 68000
ULSI Ultra large scale > 1m 486/586
For this course we will just look at the first 2: SSI and MSI
SSI Devices
Each package contains a code identifying the package
N74LS00
Manufacturers Code
N = National SemiconductorsSN = Signetics
Specification
FamilyLLSH
Member00 = Quad 2 input NAND02 = Quad 2 input Nor04 = Hex Invertors20 = Dual 4 Input NAND
Connections on 74LS00
Show how a single 74LS00 could be used to implement the function
1 2 3 4 5 6 7
14 13 12 11 10 9 8
P = A.B+A.C
Connections on 74LS00
Can be done in three steps: Draw the equivalent circuit Convert to NAND gates only Work out the pin connections
Pin Connections
One solution, check it! Inputs
A connects to 1,2 and 13 B connects to 12 C connects to 5
Outputs P connects to 8.
Pins 11 to 10 3 to 4 6 to 9
1 2 3 4 5 6 7
14 13 12 11 10 9 8
MSI Devices Commonly used functions such as the adder and the
BCD-to-seven-segment display are implemented as MSI devices
Programmable Logic Devices Programmable devices have their functionality
programmed before they are first used. Range in complexity from 100’s to 10,000’s of
logic gates.
PLD’s Commonly use logic gates based on diodes:
a
b
Vdd – logic 1
Ry
y = a.bboth at logic 1
if either a or b is pulled down to Vss, logic 0, then y is pulled to zero also
eg AND gate
More inputs can be made by adding more diodes.
Source: Bebop to the Boolean Boogie, Clive Maxfield, Technology Publishing, ISBN 1-878707-22-1
Exercise
Consider how an OR gate might be implemented:a
bRy
a and b are at logic ?
output y is on upper or lower line
Vdd – logic 0
Fusible link PLD’s
Each diode has an associated link (fuse) The can be “blown” with a high voltage pulse Thus the arrays of diodes can be programmed
(one-time).
PLD’s
Most of these devices are based on a two level structure (sum of products form). AND
planeOR plane
Inputs
outputs
products
In practice this might be represented as:
A B C D
A.C + B.C D + A
The fusible links are made at the x’s, otherwise blown.
PLD notation
outputs
inputs
PLD’s The main types of PLD include:
PLA’s (programmable logic arrays)
PAL’s (programmable array logic)
PROM’s (programmable read only memory)
PLA’s A B
A programmable logic array (PLA) has all links programmable in both AND and OR arrays.
Very flexible.
Many applications don’t require such flexibility
PALs
AND plane programmable
OR plane fixed Not so flexible Operate faster
because hard-wired OR’s switch quicker than programmed links.
A
B
AABB
F4 F1
F5 F8
P1
2
3
programmable links
PAL’s P = A.notB + notA.B Use gate 1 to implement
the 1st product term and gate 2 to implement the second
First term blow F2 and F3
Second term blow F5 and F8
A
B
AABB
F4 F1
F5 F8
P1
2
3
PROMs
AND array is pre-defined OR array is programmable Output of AND plane contains a
signal for each of the possible input combinations
Memory device where each address applied to inputs returns a programmed value
ROMaddress data
PROMs
Example: The full adder
Cin A B S Cout0 0 0 0 00 0 1 1 00 1 0 1 00 1 1 0 11 0 0 1 01 0 1 0 11 1 0 0 11 1 1 1 1
CinA
B
decoder
000001010011100101110111
sum Cout
Reprogrammable PLD’s
EPROMS are like PROM’s except that they can be re-used.
Ultra-violet light is used to restore the fusible links This is shone through a quartz window on top of the
chip Useful for testing and debugging before PROM’s are
manufactured.
Custom and Semi-custom Integrated Circuits Custom Chips: where the chips are designed
from scratch Very time consuming and expensive (Need to
manufacture >105 to be economic) Semi-custom Chips: where most of the design is
already done and designer only has to make the final connections