Digital design chap 5

51
DIGITAL ELECTRONICS DEE 204

description

digital design for diploma students

Transcript of Digital design chap 5

Page 1: Digital design   chap 5

DIGITAL ELECTRONICS

DEE 204

Page 2: Digital design   chap 5

DIGITAL ELECTRONICS

• Memory organisationPrinciples of storage, RAM, ROM, PROM,

EPROM.Dynamic theory, logic diagram of a single

bit within a RAM and its operation.Coincident address selection.Block diagram of a single bit within a RAM

and its operation.

Page 3: Digital design   chap 5

MEMORY ORGANISATION

Principles of storage, RAM, ROM, PROM, EPROM

Storage or memory: - A portion of a system for storing binary data

in large quantities- Consist of arrays of elements generally

either latches or capacitors- Made up of registers where each register

holds one storage location or address

Page 4: Digital design   chap 5

MEMORY ORGANISATIONPrinciples of storage, RAM, ROM, PROM, EPROMUnits of Binary Data: Bits, Bytes, Nibbles, WordsBits – smallest unit of binary dataByte – 8-bit unit dataNibble – 4-bit unit that could be split from a byteWord – complete unit of information consisting one

or more bytes

* For historical reasons, assembly language defines a word as exactly two bytes. In assembly language, a 32 bit entity is called a double-word and 64 bits is defined as a quad-word.

Page 5: Digital design   chap 5

MEMORY ORGANISATIONPrinciples of storage, RAM, ROM, PROM,

EPROMBasic Semiconductor Memory Array- Each storage element can retain either 0 or 1

and is called a cell- Memories are made of array of cells where

each block represents one storage cell with location determined by its row and column

- Identified by the number of words times the word size e.g. 16k X 8 memory can store 16,384 words of eight bits each

Page 6: Digital design   chap 5

MEMORY ORGANISATIONPrinciples of storage,

RAM, ROM, PROM, EPROM

Basic Semiconductor Memory Array

- shown is a 8 X 8 array

Page 7: Digital design   chap 5

MEMORY ORGANISATIONPrinciples of storage,

RAM, ROM, PROM, EPROM

Basic Semiconductor Memory Array

- shown is a 16 X 4 array

Page 8: Digital design   chap 5

MEMORY ORGANISATIONPrinciples of storage,

RAM, ROM, PROM, EPROM

Basic Semiconductor Memory Array

- shown is a 64 X 1 array

Page 9: Digital design   chap 5

MEMORY ORGANISATIONPrinciples of storage,

RAM, ROM, PROM, EPROM

Memory Address and Capacity

- Location of a unit of data is called address specified by the row and column

- Shown is the address row 5 column 4

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MEMORY ORGANISATION

Principles of storage, RAM, ROM, PROM, EPROM

Memory Address and Capacity

- Shown is the address row 3

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MEMORY ORGANISATION

Principles of storage, RAM, ROM, PROM, EPROM

Memory Address and Capacity

- Address as in 3-dimensional array is shown for address row 5, column 8

123

4567

81 2 3 4 5 6 7 8

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MEMORY ORGANISATION

Principles of storage, RAM, ROM, PROM, EPROM

Memory Address and Capacity

Capacity – the total number of data units that can be stored e.g. for figure shown the capacity is 64 bytes

123

4567

81 2 3 4 5 6 7 8

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MEMORY ORGANISATION

Principles of storage, RAM, ROM, PROM, EPROM

Basic Memory Operations: write and read

Write – puts data in a specified address in the memory

Read – copies data out of the specified address in the memory

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MEMORY ORGANISATION

Principles of storage, RAM, ROM, PROM, EPROM

Basic Memory Operations: write operation

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6

5

4

3

2

1

0

0 0 0 0 1 1 1 1

1 1 1 1 1 1 1 1

1 0 0 0 1 1 0 1

0 0 0 0 0 1 1 0

1 1 1 1 1 1 0 0

1 0 0 0 0 0 0 1

0

1

0

0

1

1

0

0

1

1

0

1

0

1

1

1

1 0 1

1

0 0 1

2

01 1 0 1

3

1. The address is placed on the address bus.

2. Data is placed on the data bus.

3. A write command is issued.

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MEMORY ORGANISATION

Principles of storage, RAM, ROM, PROM, EPROM

Basic Memory Operations: read operation

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5

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3

2

1

0

0 0 0 0 1 1 1 1

1 1 1 1 1 1 1 1

1 0 0 0 1 1 0 1

0 0 0 0 0 1 1 0

1 1 0 0 0 0 0 1

1 0 0 0 0 0 0 1

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0

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1

0

0

1

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0 1 1

1

0 0 0

3

11 0 0 1

2

1. The address is placed on the address bus.

2. A read command is issued.

3. A copy of the data is placed in the data bus and shifted into the data register.

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MEMORY ORGANISATION

Principles of storage, RAM, ROM, PROM, EPROM

Basic Memory Operations- Communication between

a memory and its environment is achieved through data lines, address selection lines, and control lines specifying transfer direction

Page 17: Digital design   chap 5

MEMORY ORGANISATION

Principles of storage, RAM, ROM, PROM, EPROM

Random Access Memory (RAM)- A type of memory in which all addresses are

accessible in an equal amount of time - Have both read and write capability- Write operation replaces previously stored

data with new data unit- Read operation does not erase data unit in

the given address

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MEMORY ORGANISATION

Principles of storage, RAM, ROM, PROM, EPROM

Random Access Memory (RAM)

Page 19: Digital design   chap 5

MEMORY ORGANISATIONPrinciples of storage, RAM, ROM,

PROM, EPROMRandom Access Memory (RAM):

Static RAM (SRAM)

- uses semiconductor latch memory cells organized into an array of rows and columns

- faster than DRAM but is more complex, takes up more space, and is more expensive

- available in many configurations – a typical large SRAM is organized as 512 k X 8 bits

Row Select 1

Row Select 2

Row Select n

Row Select 0

Memory cell

Data Input/OutputBuffers and Control

Data I/OBit 0

Data I/OBit 1

Data I/OBit 2

Data I/OBit 3

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MEMORY ORGANISATION

Principles of storage, RAM, ROM, PROM, EPROM

Random Access Memory (RAM): Asynchronous SRAM

The basic organization of an asynchronous SRAM is shown: G2

G1

Address lines

Address lines

I/O0

I/O7

Output data

CS

OEWE

Rowdecoder

Memory array

Column I/O

Column decoder

256 rows x128 columns x

8 bits

Input data control

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MEMORY ORGANISATIONPrinciples of storage, RAM, ROM, PROM, EPROMRandom Access Memory (RAM): Asynchronous SRAMRead cycle sequence:• A valid address is put on the address bus• Chip select is LOW• Output enable is LOW• Data is placed on the data busWrite cycle sequence:• A valid address is put on the address bus• Chip select is LOW• Write enable is LOW• Data is placed on the data bus

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MEMORY ORGANISATION

Principles of storage, RAM, ROM, PROM, EPROM

Static RAM: write operation timing waveform

Page 23: Digital design   chap 5

MEMORY ORGANISATIONPrinciples of storage, RAM, ROM, PROM, EPROMStatic RAM: write operation timing waveform

Page 24: Digital design   chap 5

MEMORY ORGANISATION

Principles of storage, RAM, ROM, PROM, EPROM

Static RAM: read operation timing waveforms

Page 25: Digital design   chap 5

MEMORY ORGANISATIONPrinciples of storage, RAM, ROM, PROM, EPROM Static RAM: read operation timing waveforms

Page 26: Digital design   chap 5

MEMORY ORGANISATIONPrinciples of storage, RAM, ROM,

PROM, EPROMRandom Access Memory (RAM):

Dynamic RAM

- store data bits as a charge on a capacitor.

- are simple and cost effective, but require refresh circuitry to prevent losing data

- the address lines are multiplexed to reduce the number of address lines

A DRAM cell is made up of a transistor and a capacitor

Page 27: Digital design   chap 5

MEMORY ORGANISATIONPrinciples of storage, RAM, ROM, PROM, EPROMRandom Access Memory (RAM): Dynamic RAM

Page 28: Digital design   chap 5

MEMORY ORGANISATIONPrinciples of storage, RAM, ROM, PROM, EPROMRandom Access Memory (RAM): Dynamic RAM

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MEMORY ORGANISATION

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MEMORY ORGANISATION

Principles of storage, RAM, ROM, PROM, EPROMRead Only Memory (ROM)- Contains permanent or semi-permanent stored

data- Can be read from the memory; either not

changed at all or changed using special equipments

- Stores data repeatedly used in system applications

- Non-volatile memories which retain stored data when power off

Page 31: Digital design   chap 5

MEMORY ORGANISATIONPrinciples of storage, RAM, ROM,

PROM, EPROMRead Only Memory (ROM)

- ROM symbol is shown with typical inputs and outputs. the triangles on the outputs indicate it is a tri-stated device

- to read a value from the ROM, an address is placed on the address bus, the chip is enabled, and a short time later (called the access time), data appears on the data bus

ROM 256́ 4

0

&EN

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A0

255

D

D

D

D

Address input lines

A0

A1

A2

A3

A4

A5

A6

A7

E0

E1

O0

O1

O2

O3

Data output lines

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MEMORY ORGANISATIONPrinciples of storage, RAM, ROM, PROM, EPROMRead Only Memory (ROM): timing waveforms

Address input lines

Data outputs

Address transition

Data output transition

ta

Chip select

Valid data on output lines

Valid address on input lines

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MEMORY ORGANISATION

Principles of storage, RAM, ROM, PROM, EPROM

Programmable ROM (PROM)- Are similar to mask ROMs, only it is custom

programmed by user- Uses fusing process to store bits memory

link is burned open or left intact- Fusing process is irreversible (not to be

changed once programmed)

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MEMORY ORGANISATIONPrinciples of storage, RAM, ROM,

PROM, EPROMErasable Programmable ROM (EPROM)- can be programmed if an existing

program in the memory array is erased first

- an erasable PROM and can be erased by exposure to UV light through a window, to program it, a high voltage is applied to VPP and OE is brought LOW

- another type of erasable PROM is the EEPROM, which can be erased and programmed with electrical pulses

EPROM2048 ́ 8

&EN

0

10

02047A

D

D

D

D

D

D

D

D

O0

O1

O2

O3

O4

O5

O6

O7

A0

A1

A2

A3

A4

A5

A6

A7

A8

A9

A10

CE/PGM

OE

VPP

UV EPROM package

EPROM logic symbol

Page 35: Digital design   chap 5

MEMORY ORGANISATIONPrinciples of storage, RAM, ROM,

PROM, EPROMDynamic theory- Stores the data as charge on the

capacitor- When COLUMN (Sense) and ROW

(Control) line goes HIGH, MOSFET conducts and charges capacitor

- When COLUMN and ROW line goes LOW, MOSFET opens and capacitor retain its charge, stores 1 bit

Page 36: Digital design   chap 5

MEMORY ORGANISATION

Principles of storage, RAM, ROM, PROM, EPROM

Logic diagram of a single bit (cell) within a RAM

-Shown is the logic diagram of a single bit

(cell) within a RAM

Page 37: Digital design   chap 5

MEMORY ORGANISATION

Dynamic theory, logic diagram of a single bit (cell) within a RAM and its operation

Page 38: Digital design   chap 5

MEMORY ORGANISATION

Dynamic theory, logic diagram of a single bit (cell) within a RAM and its operation

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MEMORY ORGANISATION

Coincident address selection

- Two k/2 input decoders used

- One performs the row selection and the other performs column selection in two-dimensional matrix configuration

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MEMORY ORGANISATION

Dynamic theory, logic diagram of a single bit within a RAM and its operation

Coincident address selection: address multiplexing

- A technique to reduce number of address lines

- The basic timing waveform of the multiplexing operation will be shown

Page 41: Digital design   chap 5

MEMORY ORGANISATION

Dynamic theory, logic diagram of a single bit within a RAM and its operation

Coincident address selection: address multiplexing timing waveform

Row address is latched when RAS is LOW

Column address is latched when CAS is LOW

Addresses

RAS

CAS

Page 42: Digital design   chap 5

MEMORY ORGANISATIONBlock diagram of a single bit within a RAM and

its operationAddress multiplexing: - The ten address lines are multiplexed at the

beginning of a memory cycle by the row address select (RAS) and the column address select (CAS) into two separate 10-bit address

- The 10-bit row address is latched into the row address latch, the 10-bit column address is latched into the column address latch

- Row address and column address is decoded in the memory array, one address is selected

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MEMORY ORGANISATION

Block diagram of a single bit within a RAM and its operation

Figure shown is a simplified block diagram of DRAM using a generic 1M X 1 bit DRAM

1 2

Dataselector

Rowdecoder

Memory array

1024 rows´1024 columns

12

Columndecoder

Input/Output buffersand

Sense amplifier

12

Columnaddress

latch

Rowaddresslatch

Refresh counter

Refreshcontrol

andtiming

A0/A1 0A1/A11

A2/A1 2A3/A1 3A4/A1 4A5/A1 5A6/A1 6A7/A1 7A8/A1 8A9/A1 9

CAS

RAS

Addresslines

DOUTDIN

R/W E

1024

1024

1024

Page 44: Digital design   chap 5

MEMORY ORGANISATIONBlock diagram of a single bit within a RAM and

its operationAddress multiplexing: (as discussed previously)Read and write cycle: (as discussed previously)Fast Page Mode:

- allows successive read or write operations from a series of columns address that are all on the same row

Refresh Cycles- required every 8ms to 12ms since DRAM is based on

capacitor charge storage for each bit in the memory array, which leaks with temperature and time

Page 45: Digital design   chap 5

MEMORY ORGANISATIONBlock diagram of a single bit within a RAM and

its operationFast Page Mode:- The timing waveform of a fast page mode for a read

operation is shown

Rowaddress

Column 1address

Column 2address

Column 3address

Column naddress

Validdata

Validdata

Validdata

Validdata

Addresses

RAS

CAS

R/W

DOUT

Page 46: Digital design   chap 5

MEMORY ORGANISATIONBlock diagram of a single bit within a RAM and

its operation

Fast Page Mode:- A ‘page’ is a section of memory available at a

single row address consisting all columns in the row

- It allows fast successive read or write operations at each column address in a selected row

Page 47: Digital design   chap 5

MEMORY ORGANISATIONBlock diagram of a single bit within a RAM and

its operationFast Page Mode:

latchedbeen has data dafter valionly HIGH is CAS

disabled isoutput data HIGH is CASwhen -

row selected in thecolumn another selects CASeach -

LOW is RAS as long

as selected remains and selected is address row single a-

LOW and HIGHbetween toggle willCAS meanwhile-

LOW remains andLOW being RAS with loaded is adress row-

Page 48: Digital design   chap 5

MEMORY ORGANISATIONBlock diagram of a single bit within a RAM and

its operationRefresh cycles: - Read operation automatically refreshes all

addresses in a selected row- Frequency of read cycle is unpredictable, thus

special refresh cycles are required in DRAM systems

- Categorized into1. Burst refresh2. Distributed refresh

Page 49: Digital design   chap 5

MEMORY ORGANISATIONBlock diagram of a single bit within a RAM and its

operationRefresh cycles:Burst refresh - All rows refreshed consecutively each refresh period- Normal read and write operations are suspended during

burst refreshDistributed refresh- Each row is refreshed at intervals interspersed between

normal read and write cycles- E.g. for a 1024 row memory , an 8ms refresh period

requires each row to be refreshed every 8ms/1024=7.8µs

Page 50: Digital design   chap 5

MEMORY ORGANISATIONBlock diagram of a single bit within a RAM and

its operationRefresh cycles: Refresh operations

decoder row intoselector databy switched is address -

refreshed be toaddress row generates -

counterrefresh internalan activates -

LOW going RAS beforeLOW going CAS -

:refresh RAS before CAS

addresses row provide toused iscounter external -

HIGH remains CAS -

refreshed be torow

theof address thelatches andLOW n to transitioRAS -

:refreshonly -RAS

Page 51: Digital design   chap 5

MEMORY ORGANISATIONBlock diagram of a single bit within a RAM and

its operationRefresh cycles: - A refresh cycle of a DRAM is shown