Deposition of thin lms - physics.muni.czdorian/Schmidtova_Depositions.pdf · vapour, oxygen or...
Transcript of Deposition of thin lms - physics.muni.czdorian/Schmidtova_Depositions.pdf · vapour, oxygen or...
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IntroductionApplications
PVDCVD
Deposition of thin films
Tereza Schmidtova
16th March 2011
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
I The act of applying a thin film to a surface is thin-filmdeposition - any technique for depositing a thin film ofmaterial onto a substrate or onto previously deposited layers.
I ”Thin” is a relative term, but most deposition techniquescontrol layer thickness within a few tens of nanometres.Molecular beam epitaxy allows a single layer of atoms to bedeposited at a time.
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Optical appl.Microelectronics appl.Biomedical appl.Automotive industryOthers
I Mirrors (metal-coated in first century AD); nowadays - Au, Alwith additives as Tin(II) chloride and others; one/two-waymirrors, semitransparent, ...
I Anti-reflective coatings (glasses, telescopes, lenses, ...);complex thin film structures with alternating layers ofcontrasting refractive index (destructive interference); oftenadditional coating repelling water and grease
I interference layers, polarization layers, ...
I in general any transparent layer
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Optical appl.Microelectronics appl.Biomedical appl.Automotive industryOthers
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Optical appl.Microelectronics appl.Biomedical appl.Automotive industryOthers
I transistors, diodes, capacitor, inductors, resistors andconductors and isolators in general
I CMOS (Complementary Metal-Oxide-Semiconductors)
I MOSFET (Metal-Oxide-Semiconductor field-effect transistors)
I Integrated circuit
I GaAs/Si growth on Si/GaAs, dopants B or P
I oxides - SiO2 or nitride - Si3N4
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Optical appl.Microelectronics appl.Biomedical appl.Automotive industryOthers
MOS and MOSFET
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Optical appl.Microelectronics appl.Biomedical appl.Automotive industryOthers
I implants (hip or other joints replacements)
I adsorb bandages or yarns, stitches
I needles, scalpels, tools in general
I wires, stents
I eye lenses
I pills
I polymer tubes (IV tube, ...)
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Optical appl.Microelectronics appl.Biomedical appl.Automotive industryOthers
Medicine (hip replacement)
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Optical appl.Microelectronics appl.Biomedical appl.Automotive industryOthers
Medicine (stents)
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Optical appl.Microelectronics appl.Biomedical appl.Automotive industryOthers
I Surface modification: passivation, tribologicalappl., decorative appl., hydrophobic/hydrophilicappl.
I Microelectronics: passive (dielectric, resistor,capacitor, conductor, ... films), active (thin-filmtransistors, diodes), interconnections, integratedciscuits
I Anti-corrosive layers
I Optics: anti-reflection, reflection, intereference,polarization, ...
I Sensors: pressure, acceleration, gas, ...
I basic hard layers improving liveability of partincluding the engine
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Optical appl.Microelectronics appl.Biomedical appl.Automotive industryOthers
I Photovoltaic cells
I Thin-film batteries
I Sensors (pressure, gas - toxins, heavy metals, acceleration)
I Tool manufacturing and coating
I wrappings
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Optical appl.Microelectronics appl.Biomedical appl.Automotive industryOthers
Photovoltaics
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Optical appl.Microelectronics appl.Biomedical appl.Automotive industryOthers
Thin film batteries
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Optical appl.Microelectronics appl.Biomedical appl.Automotive industryOthers
Sensors
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Optical appl.Microelectronics appl.Biomedical appl.Automotive industryOthers
Cutting tools (Tribological appl.)
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Optical appl.Microelectronics appl.Biomedical appl.Automotive industryOthers
Coated Al foils, wrapping foils, bottles
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Vacuum EvaporationCathodic Arc DepositionElectron beam physical vapour depositionPulsed laser depositionSputter depositionSpraying
Vacuum Evaporation
I reduction of pressure in liquid-filledcontainer → liquid evaporation atlower temperature than normal
I history - process invented by HenriNestle in 1866 (condensed milk -water evaporation)
I as deposition technique forsemiconductor, microelectronicsand optical industry
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Vacuum EvaporationCathodic Arc DepositionElectron beam physical vapour depositionPulsed laser depositionSputter depositionSpraying
I evaporation by flash, arc (high contamination), laser ablation(clean), exploding wire (only metal films, clean), electron gun(SiO2)
I can be used in reactive mode (oxides)
Advantages and Disadvantages
I higher deposition rate than CVD or sputtering
I evaporation has Maxwellian energy distribution given bysource temperature, sputtering uses plasma (high-speed atoms- non Maxwellian distribution)
Application
I aluminized PET film, other packing - isolation from watervapour, oxygen or light - often transparent (thin is cheaperthan thick opaque)
I metal filmsTereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Vacuum EvaporationCathodic Arc DepositionElectron beam physical vapour depositionPulsed laser depositionSputter depositionSpraying
MBE - Molecular Beam Epitaxy
I low deposition rate (1 µm per hour); monolayer film
I Knudsen cells (heated to different temperatures)
I other configurations (ALE - Atomic Line Epitaxy, CBE -Chemical Beam Epitaxy, HWE - Hot wall epitaxy, LPE -Liquid Phase Epitaxy
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Vacuum EvaporationCathodic Arc DepositionElectron beam physical vapour depositionPulsed laser depositionSputter depositionSpraying
a) MOCVD, b) MBE c) CBE
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Vacuum EvaporationCathodic Arc DepositionElectron beam physical vapour depositionPulsed laser depositionSputter depositionSpraying
Cathodic Arc Deposition or Arc-PVD
I electric arc → vaporization of cathode target material →condensation on a substrate = formation of thin film
I technology origin in Soviet Union around 1960-1970
I strike of high current, low voltage gives rise to a small”cathode spot” (highly energetic emitting area), localizedtemperature around 15000◦C → high velocity (10 km/s) jetof vapourised cathode material
I presence of electromagnetic field influence the arc to rapidlymove over entire cathode surface
I arc is extremely dense, high level of ionization, clusters evenmacro-particles or droplets
I can be used in reactive mode
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Vacuum EvaporationCathodic Arc DepositionElectron beam physical vapour depositionPulsed laser depositionSputter depositionSpraying
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Vacuum EvaporationCathodic Arc DepositionElectron beam physical vapour depositionPulsed laser depositionSputter depositionSpraying
DisadvantagesI cathode spot stays too long → macro-particles or droplets are
poorly adherent, distort the coatingsI worse case - cathode material has low melting point (Al),
cathode spot can evaporate through target to baking plate orinto the cooling system
I to prevent this the magnetic field is widely used, even forcylindrical configuration the cathode rotates
I some companies also use filtered arcs that use magnetic fieldsto separate the droplets from the coating flux
Advantages - fast, highly dependableApplications
I cutting tools, hard films, nanocomposites (TiN, TiAlN, CrN,ZrN, AlCrTiN, TiAlSiN)
I DLC; filtering of macro-particles required, high percetengae ofsp3 bonds
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Vacuum EvaporationCathodic Arc DepositionElectron beam physical vapour depositionPulsed laser depositionSputter depositionSpraying
Electron beam physical vapour deposition - EBPVD
I target anode is bombarded with an electron beam (chargedtungsten filament under high vacuum) → electron beamcauses atoms from the target to transform into gaseous phase→ atoms precipitates into solid form on every surface
I high deposition rate (0.1 µm to 100 µm per minute) atrelatively low substrate temperatures
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Vacuum EvaporationCathodic Arc DepositionElectron beam physical vapour depositionPulsed laser depositionSputter depositionSpraying
Ion beam assisted deposition
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Vacuum EvaporationCathodic Arc DepositionElectron beam physical vapour depositionPulsed laser depositionSputter depositionSpraying
Disadvantages
I simple geometries, coating is line-of-sight (rotation andtranslation of the shaft helps)
I non-uniform evaporation rate as a result in filamentdegradation in electron gun
Advantages
I accessible low and high deposition rates, high materialutilization efficiency
I possible structural and morphological control of films
Application - hard coatings (cutting tools), electronic and opticalfilms
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Vacuum EvaporationCathodic Arc DepositionElectron beam physical vapour depositionPulsed laser depositionSputter depositionSpraying
Pulsed laser deposition - PLD
I high power pulsed laser beam is focused to strike the targetmaterial → target material is vapourised and deposited onsubstrate
I 1965 Smith and Turner utilized ruby laser for thin filmdeposition
I reactive mode possible
I energy is converted to electronic excitation and then intothermal, chemical and mechanical energy resulting inevaporation, ablation, plasma formation and even exfoliation
I ejected species contain also clusters, molten globules, ...
I penetration depth of laser beam 10 nm for most materials(type of material and laser wavelenght)
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Vacuum EvaporationCathodic Arc DepositionElectron beam physical vapour depositionPulsed laser depositionSputter depositionSpraying
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Vacuum EvaporationCathodic Arc DepositionElectron beam physical vapour depositionPulsed laser depositionSputter depositionSpraying
Disadvantages
I resputtering of deposited film → decrease in deposition rate
Advantages
I versatility (changing distances, laser wavelength, ...)
I small target size
Application - SiO2, SiC, TiN, semiconductors, metallic systems,polymers, ferrroelectric materials, ...
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Vacuum EvaporationCathodic Arc DepositionElectron beam physical vapour depositionPulsed laser depositionSputter depositionSpraying
Sputter Deposition
I ejecting of target material towards the substrate (momentumtransfer)
I various geometry (diode, triode, planar, asymmetrical, ionbeam)
I reactive mode possible
I presence of magnetic field enhanced sputtering and can guidesputtered ion flux towards substrate - magnetron sputtering
I HIPIMS
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Vacuum EvaporationCathodic Arc DepositionElectron beam physical vapour depositionPulsed laser depositionSputter depositionSpraying
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Vacuum EvaporationCathodic Arc DepositionElectron beam physical vapour depositionPulsed laser depositionSputter depositionSpraying
Thermal spraying; Plasma spraying
I metled or heated materials is sprayed onto surface
I coating precursor is heated by plasma/arc or combustion flame
I large area, high deposition rate, thick layers (metals, alloys,ceramics, plastics, composites)
I history 1910s (flame spraying, wire arc spraying); plasmaspraying 1970s
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Vacuum EvaporationCathodic Arc DepositionElectron beam physical vapour depositionPulsed laser depositionSputter depositionSpraying
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Chemical vapour deposition
I from atmospheric pressure to ultra-high CVD
I PECVD (MPCVD - microwave plasma, RPCVD - remoteplasma)
I uses chemical reactions
I electroplating
I ion plating
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Advantages
I Large size deposition
I good covering of complex surface structures
Dissadvantages
I CVD - high temperature (not in PECVD)
I chemical byproducts (chemical waste)
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
taken from [Bunshah,1994]
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
References
R. F. Bunshah. Handbook of deposition technologies for films andcoatings: Science, Technology and Applications, 2nd, editionNoyesPublications, 1994, ISBN 0-8155-1337-2
en.wikipedia.orgwww.google.com
Tereza Schmidtova Deposition of thin films
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IntroductionApplications
PVDCVD
Thank you for your attention!
Tereza Schmidtova Deposition of thin films