Dataweek Electronics & Communications Technology | 16

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16 SEPTEMBER 2009

Featuring: Industrial electronics & automation • Industrial & embedded computing & networking • Interconnection, switches, relays, cables & keypads

Dataweek, 16 September 2009 IBC* denotes advertisement

This list is provided as a service to readers.While every attempt is made to maintain

its currency prior to going to print,certain changes maysubsequently have

come intoeffect.QUICKFIND

Company Telephone Pagese-mail Website

Actum Electronics +27 (0)11 608 3001 [email protected] www.actum.co.za 24,25*,31,33

Arrow Altech Distribution +27 (0)11 923 9600 [email protected] www.arrow.altech.co.za OFC*,10,21,24,29,32,33,36

ASIC Design Services +27 (0)11 315 8316 [email protected] www.asic.co.za 10,11*

Associated Technology +27 (0)11 802 3320 [email protected] www.associated-technology.co.za 19,21*

Avnet Kopp +27 (0)11 809 6100 [email protected] www.avnet.co.za 6,7,8,9*,21,22,26,33,35

BMG +27 (0)11 620 1500 [email protected] www.bmgworld.net 20

Centurion Micro Electronics +27 (0)12 666 9066 [email protected] www.cme.co.za 12,15*,21

Connector & Wire Services +27 (0)11 918 0011 29

CST Electronics +27 (0)11 608 0070 [email protected] www.cstelectronics.co.za 17,22,35,36

Current Automation +27 (0)11 462 4253 [email protected] www.rectifier.co.za 23,stitched insert*

CZ Electronics +27 (0)11 914 5240 [email protected] www.czelectronics.co.za 10*

Denver Technical Products +27 (0)11 626 2023 [email protected] www.denvertech.co.za 19*

EBV Electrolink +27 (0)21 402 1940 [email protected] www.ebv.com 9,34,36,32

Electrocomp +27 (0)11 458 9000 [email protected] www.electrocomp.co.za 35,36

Electronic Industry Supplies +27 (0)11 726 6758 [email protected] www.eispty.co.za 33,35*

Electronic Products Design +27 (0)12 665 9700 [email protected] www.epd.co.za 17,18*

Electronic Touch Systems +27 (0)11 782 3346 [email protected] www.electouch.co.za 26*

Future Electronics +27 (0)21 421 8292 marian.ledgerwood@

futureelectronics.com www.futureelectronics.com 23,24,34

Gemtek +27 (0)12 664 1771 [email protected] www.gemtek.co.za 4,7*

Hiconnex 086 111 1289 [email protected] www.hiconnex.co.za 26,28,OBC*

K Measure +27 (0)72 799 8588 [email protected] www.kmeasure.co.za 20*,21

Lapp Kabel 0861 CABLES [email protected] www.lappcable.co.za 23*

Legrand +27 (0)11 444 7971 [email protected] www.legrand.co.za 29

MB Silicon Systems +27 (0)11 728 4757 [email protected] www.mbsiliconsystems.co.za 36

Membrane Switch Technologies +27 (0)11 887 1227 [email protected] www.membraneflexi.com 28*

Microtronix +27 (0)11 792 5322 [email protected] www.microtronix.co.za 34*

National Instruments SA 0800 203 199 [email protected] www.ni.com/southafrica 16,17,22

Osiris Technical Systems 0861 674 747 [email protected] www.osiris.co.za 14,15

Otto Marketing +27 (0)11 791 1033 [email protected] www.otto.co.za IFC*,11,35

Panasonic +27 (0)11 313 1618 www.pbssa.co.za 13*

Phoenix Contact +27 (0)11 801 8200 [email protected] www.phoenixcontact.co.za 12,17*,20,26,30

ProMicro +27 (0)11 706 7913 [email protected] www.promicro.co.za 12

Samtec SA +27 (0)11 452 8112 [email protected] www.samtec.com 27*,29,30

Sivan Electronic Supplies (SES) +27 (0)11 887 7879 [email protected] 24*,33*

Suntronika +27 (0)11 403 3420 [email protected] www.suntronika.com 26,28,31*

Telkom Business 10217 [email protected] www.telkom.co.za 5*

Tempe Technologies +27 (0)11 452 0530 [email protected] 11,36

Trinity Telecomms +27 (0)11 465 7377 [email protected] www.trintel.co.za 4

Vepac Electronics +27 (0)11 453 1910 [email protected] www.vepac.co.za 20,34

Webb Industries +27 (0)11 444 2299 [email protected] www.webb.co.za 12,30*

16 September 2009 Vol. 32 No. 18

DisclaimerEditorial contributions relevant to the focus of this publication are welcome but the publishers cannot accept responsibility for unsolicited material. While every effort has been made to ensure the accuracy of the information contained herein, the pub-lisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication.

contents News, appointments .............................................................. 2

Events.................................................................................... 3

Literature Showcase ............................................................ 32

Hot Chips ............................................................................. 36

QuickFind Index................................................................... 37

Systems, components, design................................................... 6

General .................................................................................... 32

Industrial & embedded computing & networking ................. 12

Industrial electronics & automation...................................... 19

Interconnection, switches, relays, cables & keypads .......... 24

Dataweek, 5 March 2008

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The Sierra Wireless AirLink line of intelligent Mobile and M2M gateways is now available in South Africa through Arrow Altech Distribution. The broad line-up of AirLink intelligent, rugged gateways has consis-tently been on the leading edge of network technology and is ideally suited for various fixed, portable and mobile data applications, such as those found in public safety, law enforcement, emergency services, field service, energy manufacturing, distribution and metering, security surveillance and industrial network-ing. Find out more about the product range by turning to page 10.

For more information contact Gyula Wendler, Arrow Altech Distribution, +27 (0)11 923 9600.

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ElECTRONICS NEWS DIGEST

South Africat Altech, through its subsidiary Kenya Data Networks (KDN), announced the acquisition of an 8,5% stake in The East Africa Marine System (TEAMS) cable for an amount of US$11 million. The investment will give KDN a 10% voting right in TEAMS. Altech will fund its portion of the purchase price from cash reserves. KDN, a Kenyan company 60,8% held by Altech, is a ‘carrier-of-carriers’ telecommunications operator and Internet service provider, with fibre and radio infra-structure throughout East Africa.

OverseasBusinesst Revenue for Analog Devices’ third quarter of fiscal 2009 was $492 million, an increase of 4% from the immediately prior quarter and a decrease of 25% from the same period one year ago. Diluted earnings per share (EPS) from continuing opera-tions was $0,22, compared to $0,18 in the immediately prior quarter, and $0,44 in the year-ago period.

t Cree announced record revenue of $148,1 million for its fourth quarter of fiscal 2009. This represents a 9% increase compared to revenue of $135,9 million reported for the fourth fiscal quarter last year and a 13% increase compared to the fiscal third quarter of 2009. GAAP net income for the fourth quarter was $9,7 million, or $0,11 per diluted share, com-pared to GAAP net income of $8,4 million, or $0,09 per diluted share, for the fourth quarter of fiscal 2008. For fiscal year 2009, Cree reported revenue of $567,3 million, which represents a 15% increase compared to revenue of $493,3 million for fiscal 2008. GAAP net income was $30,3 million, or $0,34 per diluted share, com-pared to $33,4 million, or $0,38 per diluted share for fiscal 2008.

t Mentor Graphics announced results for the fiscal second quarter of 2010, ending 31 July 2009. For the quarter, the company reported revenues of $182,6 million, non-GAAP earnings per share of $0,02, and a GAAP loss per share of $0,22. For its third fiscal quarter, the company expects similar results with revenue of about $183 million, non-GAAP earnings per share of around $0,01 and a GAAP loss per share of about $0,19.

Companiest Fluke Networks signed an agreement to acquire AirMagnet, a leader in performance, security and compliance solutions for wire-less LANs. The acquisition is expected to create a global leader in the fast growing area of Wi-Fi testing and further strengthen

Fluke Networks’ worldwide leadership in test and analysis for networks, regardless of media type. Terms of the agreement have not been disclosed.

t Abilis Systems, an RF semiconduc-tor company, announced the acquisition of Freescale Semiconductor’s CMOS Modulators and Silicon Tuner product lines. The acquisition of these assets will allow Abilis to expand its portfolio of silicon-based digital TV (DTV) and tuner solutions and better address the needs of the growing digital TV market, and in particular of Digital Terrestrial Television (DTT) and cable platforms.

t Bosch has agreed to acquire Akustica, an innovator in the application of CMOS MEMS technology in the consumer electron-ics market. Terms of the agreement were not disclosed. Akustica’s technology allows the integration of transducer elements and associated integrated circuits on a single silicon chip.

Industryt austriamicrosystems announced the shipment of its one billionth high per-formance analog IC for the successful SiSonic series of MEMS microphones. Built on Knowles Acoustics’ CMOS/ MEMS technology platform, which was originally launched in 2002, the SiSonic silicon-based microphone series is entering its fifth generation of development, with the overall product family shipping in excess of 1 billion units to date. The proven, and evolving, design series supports high-performance, high-density innovation in applications such as cell phones, note-books, digital still cameras, portable music players and other portable electronic devices.

t Databeans predicts that the semiconduc-tor market serving the automotive industry is on the verge of recovery in the third quarter

of this year in a U-shaped model with several months of near flat revenue, before a gradual increase in 2010. This is fuelled primarily by the Asia Pacific region with significant momentum during June and July. After hitting bottom in February 2009, where auto-motive semiconductor revenue came in at $931 million, there have since been several consecutive months of flat or slightly positive growth. June marked a turning point where momentum begun to gather, while in August, Databeans predicts some nominal growth fol-lowed by an even stronger September, after which strong recovery is expected moving forward into the first quarter of 2010. Overall by the end of 2009, Databeans expects the automotive semiconductor total available market to be just over $15 billion, thanks to emerging markets in Asia and recovery in established regions such as the US and Western Europe.

t European sales for semiconductors grew on a three month rolling average basis by 5,3% in July compared with the previous month, according to a World Semiconductor Trade Statistics (WSTS) report. This is the third month of consecutive growth in Europe. This positive performance is in line with the developments observed in the other regions in July, with in particular Japan growing by 7,9 % and leading, for this month, the market rebound. Overall, European semiconductor sales in July 2009 amounted to $2,317 billion. This corre-sponds to a decline of 31,7% compared to the same month last year. On a year-to-date basis, semiconductor sales declined by 33,1% in 2009 versus the same period in the year 2008.

t Worldwide semiconductor revenue is on track to total $212 billion in 2009, a 17,1% decline from 2008 revenue of $255 billion, according to the latest outlook by Gartner. This forecast is better than the second quarter projections when Gartner projected semiconductor revenue to decline 22,4% this year. While the outlook for 2009 has improved, Gartner analysts point out that all major segments of the semiconductor market are expected to experience double-digit declines in rev-enue this year. The largest segment of the semiconductor market, application-specific standard product (ASSP), will reach $57,2 billion in 2009, but this is a 16,5% decline from 2008 revenue. The memory market, the No. 2 segment, is forecast to total $41 billion, a 13,5% decline from last year. The microcomponents segment (micro-processors, microcontroller units, digital signal processors) is on pace to reach $39,4 billion in 2009, a 19,2% decline from 2008.

Worldwide monthly automotive semiconductor sales.

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ElECTRONICS NEWS DIGEST

EventsOrganic Semiconductor Conference 200928–30 September 2009London, EnglandConference covering organic semi-conductor technologies, organic electronics, printed electronics, flexible electronics.Contact: www.osc-europe.com

European Microwave Week 200928 September – 2 October 2009Rome, ItalyIncorporates four conferences covering microwave ICs and technology, wire-less technology and radar. Includes workshops and short courses.Contact: www.eumweek.com

Microchip Embedded Designer Forum12 October 2009 – Cape Town14 October 2009 – Johannesburg15 October 2009 – DurbanTechnical seminars covering topics such as designing low-power appli-cations, adding USB to designs and migrating to 32-bit.Contact: www.avnet.co.za

electronicAsia13-16 October 2009Hong Kong, ChinaEvent for sourcing of electronic com-ponents, assemblies, production and display technologies. Co-located with the Hong Kong Electronics Fair featur-ing consumer electronics.Contact: electronicasia.hktdc.com

grow to 1,8 billion units and $9,6 billion in revenues in 2018, from 22 million units and $431 million in revenues in 2009, for a CAGR (compound annual growth rate) of 41% for revenues and 64% for units. The market for e-paper displays—which are found in e-books, e-textbooks, e-newspapers, e-magazines, mobile phones, electronic shelf labels, point–of-purchase and public signage displays, displays in smart and credit cards, clothes and other wearable items, and other applications—has taken off this past year, becoming one of the few shining stars in the economic downturn.

Technologyt Atmel and Cryptography Research (CR) announced an agreement regarding

the use of CR's patents to enhance the security of Atmel's tamper-resistant chips against Differential Power Analysis (DPA) and related attacks. Under the agreement, Atmel receives the freedom to use CR's patents as part of its strategy to develop and enhance its security chips used in smart cards and other applications. The licence also covers software executing on Atmel chips, allowing Atmel's customers to develop their own security counter-measures without a separate licence from Cryptography Research. DPA is a form of attack that involves monitoring the fluc-tuating electrical power consumption of a target device and then using advanced statistical methods to derive cryptographic keys and other secrets. E-paper display forecast.

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The research team made an advance in combining lithographic patterning with self assembly – a method to arrange DNA origami structures on surfaces compatible with today’s semiconductor manufacturing equipment.

Today, the semiconductor industry is faced with the challenges of developing litho-graphic technology for feature sizes smaller than 22 nm and exploring new classes of transistors that employ carbon nanotubes or silicon nanowires. IBM’s approach of using DNA molecules as scaffolding – where millions of carbon nanotubes could be deposited and self-assembled into precise patterns by sticking to the DNA molecules – may provide a way to reach sub-22 nm lithography.

The utility of this approach lies in the fact that the positioned DNA nanostruc-tures can serve as scaffolds, or miniature circuit boards, for the precise assembly of components – such as carbon nano-tubes, nanowires and nanoparticles – at dimensions significantly smaller than possible with conventional semiconduc-tor fabrication techniques. This opens up the possibility of creating functional devices that can be integrated into larger structures, as well as enabling studies

DNA used for building tiny circuitsof arrays of nanostructures with known coordinates.

“The cost involved in shrinking features to improve performance is a limiting factor in keeping pace with Moore’s Law and a concern across the semiconductor industry,” said Spike Narayan, manager, Science & Technology, IBM Research – Almaden. “The combination of this directed self-assembly with today’s fabrication technology could eventually lead to substantial savings in the most expensive and challenging part of the chip-making process.”

The techniques for preparing DNA origami, developed at Caltech, cause single DNA molecules to self assemble in solution via a reaction between a long single strand of viral DNA and a mixture of different short synthetic oligonucleotide strands. These short segments act as staples – effectively folding the viral DNA into the desired 2D shape through complementary base pair binding. The short staples can be modified to provide attachment sites for nanoscale components at resolutions (separation between sites) as small as 6 nanometres. In this way, DNA nanostructures such as squares, triangles and stars can be prepared with dimensions of 100 to 150 nm on an edge and a thickness of the width of the DNA double helix.

IBM uses traditional semiconductor techniques, the same used to make the chips found in today’s computers, to etch out pat-terns, creating the lithographic templates for this new approach. Either electron beam or optical lithography are used to create arrays of binding sites of the proper size and shape to match those of individual origami struc-tures. The template materials are chosen to have high selectivity so that origami binds only to the patterns of ‘sticky patches’ and nowhere else.

Scientists at IBM and the California Institute of Technology recently announced a scientific advancement that could be a major breakthrough in enabling the semiconductor industry to pack more power and speed into tiny computer chips, while making them more energy efficient and less expen-sive to manufacture.

t In a recent report, DisplaySearch forecast that the total e-paper display market will


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NEWS

Fidelity Security Services, the largest secu-rity provider in South Africa, is rolling out the ActiveGuard routing and monitoring solution nationwide to its 52 branches, in a project that will promote real-time monitoring of guarding activities, thereby ensuring proactive guarding and comprehensive reporting for all its clients.

Kevin Whateley, General Manager Electronics Services, explains, “Initially, we ran a pilot project with Trinity Telecomms, suppli-ers of the ActiveGuard solution. The success of the system in-field then prompted the decision to roll out the system countrywide.”

He explains, “The GSM-enabled ActiveGuard batons are used by the guards to scan tags placed at security checkpoints, and this information is sent to our control room in real-time. This means that we can ensure that all guards are active on their required routes. If no signal is received in the allotted time, then we can call the guard on the ActiveGuard baton to ensure that all is in order.”

According to Whateley, this dial-up feature to the guard is a key advantage. Although the guard cannot dial out, there is a ‘call me’ button, as well as a panic button on the unit, both of which immediately alert the control room, who can then return the call. This eliminates the potential for cellphone abuse, while still enabling the guards with 2-way communications in real-time.

Other features include the ability of the baton to send SMS messages to a number of pre-defined cell numbers, including the control room, the security manager, and perhaps even client management. This ensures that everyone is notified immediately should any emergency occur, enabling rapid response and minimising negative consequences.

Says Whateley, “The fact that we can get real-time information about the time and location of each check point scan is the

Fidelity rolls out wireless guard monitoring solution

biggest advantage of the system. We can be proactive in managing our guards, and in responding to any emergencies. We have increased our active patrolling dramatically as a result of the ActiveGuard roll out.”

Because the system uses GSM-based communications, the need for any infra-structure to be implemented is eliminated, making the roll-out relatively quick. All that is required is the installation of the software in the control room, the equipping of each of the guards with the baton, and some fairly simple training on the 3-button device.

Although the ActiveGuard system is supplied with its own Kronos control room software, Fidelity will be integrating the signals from the system into its in-house developed ExecuGuard control room software, to provide a solution that is totally integrated into all its other control room functions.

“The backup and support on a technol-ogy installation such as this is critical, and the partnership with Trinity has really worked for us. They have the technical skills to be able to assist us with the training, as well as the customising of the solution to meet our particular requirements,” says Whateley.

Fidelity’s customers will benefit significantly from the ActiveGuard roll out, through guaran-teed active patrolling. If there is no real-time monitoring system in place, there is no way to ensure that the guards are patrolling at any point in time. The ActiveGuard solution drives proactive guarding, and also provides regular statistics and reports to Fidelity’s management and to the customer, so trends can be moni-tored and information provided for improved guard and routing management.

“We have over 35 000 guards, and once the roll-out is complete, we will be able to monitor our guards countrywide through any of our 52 branches,” says Whateley. “Once

the integration is complete, the ActiveGuard solution will add a new dimension to the way we report on our guard patrolling. With better statistics, we can provide value added services to our customers. We are ahead of the market, and so anticipate that this will give us a significant competitive advantage into the future.”

For more information contact Trinity Telecomms, +27 (0)11 465 7377.

The control room monitors show every scan instantly.

On Monday the 1st of June 2009, Gemtek celebrated the occasion of its fifth year in operation.

The company has come a long way since it started manufacturing as MA Electronic Manufacturing in 2001. After trading success-fully for four years it changed to a (Pty) Ltd and started trading as Gemtek in 2004. The company used the occasion of its fifth birthday as a celebration for its loyal staff members, most of whom have been with the company for more than four years, as thanks for their dedication and hard work.

For more information contact Gemtek, +27 (0)12 664 1771.

Gemtek celebrates fifth birthday

A Fidelity guard scanning an ActiveGuard tag on his guarding route.



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SySTEmS, COmPONENTS, DESIGN

Standardisation, cost and the availability of software and development tools have made the PC very attractive as a host processor platform for medical and industrial applications, but the safety and reliability requirements of these growing markets – especially regarding electrical isolation – are very different from the office environment that has historically driven the design of the personal computer.

In the early days, personal computers were provided with serial and parallel ports as standard interfaces to the outside world. These legacy standards had been inherited from the earliest mainframe computers. Another available communication standard, RS-232, though slow, fit well into medi-cal and industrial environments because it allowed easy implementation of the required robust isolation. Its low speed and point-to-point nature were tolerated because it was universally available and well supported.

USB, which has come to replace RS-232 as a standard port in personal computers and their peripherals, has features that are far superior to the older serial port in nearly every respect. It has been difficult and costly to provide the necessary isolation for medical and industrial applications, however, so USB has been principally used for diagnostic ports and temporary connections.

This article discusses various ways of applying isolation with USB. In particular, a new device, the ADuM4160 USB isolator, is now available from Analog Devices. This product allows simple, inexpensive isolation of peripheral devices – especially including the D+ and D – lines – increasing the usefulness of USB in medical and industrial applications.

About the Universal Serial Bus (USB)USB is the serial interface of choice for the PC. Supported by all common commercial operating systems, it enables on-the-fly connection of hardware and drivers. Up to 127 devices can exist on the same hub-and-spoke-style network. Many data transfer modes handle everything from large bulk data transfers for memory devices, to isochronous transfers for streaming media, to interrupt-driven transfers for time-critical data such as mouse movements. USB oper-ates at three data transfer rates: low speed (1,5 Mbps), full speed (12 Mbps) and high speed (480 Mbps). When this system was created, consumer applications were empha-sised; connections had to be simple and

Digital isolator simplifies USB isolation Mark Cantrell, Analog Devices

robust, with controllers and physical-layer signalling absorbing the complexity.

The USB physical layer consists of only four wires: two provide 5 V power and ground to the peripheral device; the other two, D+ and D–, form a twisted pair that can carry differential data (Figure 1). These lines can also carry single-ended data, as well as idle states that are implemented with pas-sive resistors. When a device is attached to the bus, currents in the passive resistor configuration negotiate for speed, as well as establish a non-driven idle state. The data is organised into data frames or packets. Each frame can contain bits for clock synchronisa-tion, data type identifier, device address, data payload and an end-of-packet sequence.

Control of this complex data structure is handled at each end of the cable by a serial interface engine (SIE). This specialised controller – or portion of a larger controller, which usually includes the USB transceiver hardware – takes care of the USB protocol. During enumeration, when a peripheral is first connected to the cable, the SIE provides the host with the configuration information and power requirements. During operation, the SIE formats all data according to the required transfer type, as well as providing error checking and automatic fault handling. The SIE handles all flow of control on the bus, enabling and disabling the line drivers

and receivers as required. The host initi-ates all transactions, which then follow a well defined sequence of data exchanges between host and peripheral, including provi-sions for when data is corrupted and other fault conditions. The SIE may be built into a microprocessor, so it may provide only the D+ and D– lines to the peripheral.

Isolating this bus presents several challenges:1. Isolators are nearly always unidirectional devices, while the D+ and D– lines are bidirectional.2. The SIE does not provide an external means to determine data transmission direction.3. Isolators must be compatible with the pull-up and pull-down functions of passive resistors, making them match across the barrier.

Typical approaches to isolate the USB largely seek to sidestep the above challenges.

A first approach: Move the USB interface completely out of the device that requires isola-tion (Figure 2). Many devices interface generic serial buses to USB; an RS-232-to-USB inter-face is shown in this example. The SIE provides a generic serial-interface function; isolation is implemented in the low-speed serial lines.

This approach does not capitalise on the advantages of USB, however. All that has been created is a serial port that can be loaded on-the-fly. The interface IC could be customised

The personal computer (PC), currently the standard informa-tion processing device for office and home use, communicates with most peripherals using the universal serial bus (USB).

Figure 2. Isolating through RS-232.

Figure 1. Standard elements of USB.



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through firmware changes to identify the peripheral, allowing a custom driver to be created, but each peripheral would require a custom adapter. Unless the adapter was per-manently affixed to the peripheral, it would be a servicing nightmare. In addition, the speed of the interface would be limited to that of stan-dard RS-232 – not close to the throughput of even low-speed USB.

A second approach: Use a standalone SIE that has an easily isolated interface (Figure 3). Several products on the market use fast unidi-rectional interfaces, such as SPI, to connect an SIE to a microprocessor. Digital isolators, such

as the ADuM1401C four-channel digital isolator, will allow full isolation of an SPI bus.

The SIE contains buffer memory that can be filled by the SPI bus, so the operating speed of the SPI can be largely independent of the speed of the USB. The SIE will negoti-ate with the USB host for its highest possible connection speed and will dispense data at the negotiated bus speed until it runs out of buffered data. The SIE will then tell the host to retry if more data is expected, allowing time for the SPI interface to refill the buffers for another transfer cycle. Though very effective, this scheme usually requires modifications to

peripheral drivers, as well as bypassing exist-ing USB facilities built into the peripheral’s microprocessor. This solution is expensive in terms of components and board space.

A third approach: If the microprocessor’s SIE uses an external transceiver, the data and control lines to the transceiver can be isolated (Figure 4). But USB requires as many as nine unidirectional data lines between an SIE and its transceiver. This represents a significant expense in high-speed digital isolators.

In addition, the fastest available digital iso-lator works at about 150 Mbps. Though much faster than low- and full-speed USB, it can’t handle high-speed data, limiting the speed range of the USB interface. This solution is fully compatible with the USB drivers provided for the microprocessor’s SIE, lowering devel-opment costs, but the many isolation channels required make it expensive to implement. Market trends toward increased integration will obsolete this type of transceiver interface.

A fourth approach: Insert the isolation directly into the D+ and D– lines (Figure 5). This allows D+/D– isolation to be added to existing USB applications without rewriting drivers or adding a redundant SIE, a signifi-cant advantage over the other approaches.

Isolating the D+ and D– lines complicates the situation, however, as the device must be able to handle flow of control like an SIE, as well as permit application of pull-up resistors and speed determination across its isolation barrier. It should also operate without calling for the overhead of additional device drivers.

These challenges have been met with the ADuM4160 USB isolator (Figure 6), a new chip-scale device that supports direct isolation of low- and full-speed USB D+ and D– lines.

Analog Devices iCoupler technology is particularly well suited to construction of a USB isolator. The primary challenges in developing a USB isolator are properly determining the direction of data transmis-sion, and when to disable drivers to allow an idle bus state. The packet-oriented nature of USB data allows a simple method of deter-mining data direction without the overhead of a complete SIE. When the bus is idle, pull-up and pull-down resistors hold the USB in an idle state with no buffers driving the bus.

The ADuM4160 monitors the upstream and downstream segments of the bus, waiting for a transition from either direction.

Figure 3. Isolated SIE through an SPI interface.

Figure 4. Isolated external USB transceiver.

Continued on page 8



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When a transition is detected, it is encoded and transmitted across the barrier. The data is decoded, and the output drivers are enabled to transmit on the other cable segment. From this first transition, the direction of data flow is identified, and the reverse direction isolation channels are disabled. The isolator continues to transmit data in the same direction as long as data continues to be received.

When the USB packet is complete, spe-cial data, the end-of-packet (EOP) sequence, is transmitted. The EOP contains a non-differential signal that should not be included in any data structure. The isolator can distinguish an EOP marker from valid data. This signals that the bus should be returned to the idle state. The output drivers are dis-abled, and the isolator begins to monitor its upstream and downstream inputs for the next transition – which will set the next direction for data transmission.

In addition, watchdog timers return the isolator to its idle state when a bus error occurs. The ADuM4160 takes advantage of the transition-based isolation scheme, one of the core capabilities of iCoupler technology.

The isolator must also provide support for pull-up and pull-down resistors. Each side of the isolator supports an independent USB bus segment, with all of the bias resistors present in the idle state. The pull-up resistor signals that a new device on the bus needs to go through the initialisation sequence, called enumeration. Knowing the operating speed of the peripheral and the time when the pull-up should be connected allows enu-meration to begin in a controlled manner.

Several factors can affect the status of the upstream pull-up resistor. Different combina-tions of available upstream and downstream power-supply voltage are possible. The isola-tor is designed to give predictable operation in all specified combinations of available power. A peripheral would want to delay application of the upstream pull-up resistor at times – if it needs to complete its own local initialisation prior to starting the USB enumeration, for example. The ADuM4160 provides a control pin on the downstream side of the part to allow the peripheral to determine when enumeration occurs.

Other features available in the device include the ability to run from either a 5 V or 3,3 V power source. So only one power supply is required in the peripheral; it can be

either voltage. The ADuM4160 has also been designed with rugged ESD protection to allow hot plugging of D+ and D– pins to con-nectors without external protective circuitry in most cases.

The ADuM4160 will likely be used in one of three ways:1. It will be installed in a peripheral to isolate

its upstream port. The ADuM4160 was designed with this configuration as the base application. It leads to the simplest power and control configurations (Figure 7).

2. It can be used to isolate a hub and there-fore all of the peripherals downstream of the hub (Figure 8).

3. It can be used in an isolated cable configu-ration (Figure 9).The following illustrations show how the

ADuM4160 will be connected in each of these applications.

In the peripheral application (Figure 7), where the peripheral has its own source of power, almost no power is required from the USB cable – about 10 mW to run the isolator’s upstream side and the pull-up resistor. Since the peripheral operates at a single speed, the isola-tor is hardwired for the desired speed setting, either full speed or low speed. If the peripheral port happens to be high-speed capable, then it sends a high-speed ‘chirp’ pattern during

Continued from page 7

Figure 5. Isolating the D+/D– lines. Figure 6. ADuM4160 block diagram.

Figure 7. Isolated peripheral port.

Figure 8. Isolated hub.



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Texas Instruments has introduced a small 2,25 MHz DC-DC converter for USB-powered portable applications and wireless modems. The TPS62750 is a high-performance, 92% power-efficient, syn-chronous step-down converter, which can provide up to 1 A typical input current. The device supports an input voltage from 2,9 V to 6 V, allowing it to support batteries with an extended voltage range and USB-compliant power requirements.

The device’s unique power save mode operates at light load currents over the entire load current range. In addition, the converter can discharge during shutdown. It features programmable average current limiting for USB applications – 50 mA to 300 mA for low current; 0,3 A to 1,3 A for high current. Input voltage moni-toring prevents the USB host from crashing, and the device also features hot plug, load disconnect and short circuit (Vin/Vout) protection.

For more information contact EBV Electrolink, +27 (0)21 402 1940.

DC-DC converter for USB-powered devices

enumeration. This would normally initiate negotiations for high-speed operation, but the ADuM4160 blocks the chirp signal and auto-matically forces the high-speed peripheral to operate at full speed. For low-power peripherals that don’t have their own supply, an isolated DC-DC converter can be used to supply the peripheral and the ADuM4160, drawing power from the USB cable.

Used as a hub isolator (Figure 8), the ADuM4160 treats the hub as its peripheral. The device is set to full speed; the rest of the application is similar to the standard periph-eral case discussed above. The hub will be forced to operate at full speed by the isolator’s intervention in its chirp function. The hub IC will allow connection to combinations of low- and full-speed devices, even though the isolator runs at a fixed speed. The hub provides power to the isolator’s downstream port, and enu-meration can begin either at power-up or on a delayed basis. The hub usually requires more power than can be supplied by the upstream

cable via an isolated DC-DC converter.Driving an isolated USB cable (Figure 9)

requires use of a DC-DC converter to supply power to the downstream port and cable. To satisfy the requirements of the USB specifi-cation, the downstream segment of the cable must provide 5 V power to the pull-up of the peripheral device. An isolated DC-DC con-verter can provide this power with enough left over to provide power for downstream devices with low power requirements.

Figure 9 shows the use of an ADuM5000 isoPower device. In this application, the hard-wired speed pins of the ADuM4160 become somewhat inconvenient. The cable will only operate at one USB speed at a time; it must be rewired to switch speed modes, either manually, by simple switches, or with more elaborate circuits, depending on the end user’s requirements.

For more information contact Avnet Kopp, +27 (0)11 809 6100.

Figure 9. Isolated cable interface including isoPower.


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The XR21V1410/V1412/V1414 have differentiated features which include small packaging options, optimised software drivers, and support for large FIFO sizes.

The devices target a large cross-section of embedded and consumer applications. Examples of embedded applications are gaming systems, ATM machines, industrial automation systems amongst others. For consumer applications, the series is suitable for smart phones, personal digital assistants (PDAs), GPS sys-tems, DVD players/recorders, gaming systems and other portable applications.

All devices in the series support USB suspend, resume and remote wakeup operations. They share a common set of features including large FIFO sizes of 128 Byte TX and 384 Byte RX for high overall data throughput, automatic hardware (RTS/CTS or DTR/DSR) flow control, automatic software (Xon/Xoff) flow control, and multi-drop mode with auto half-duplex transceiver control. In addition, none of the devices require an external crystal/oscillator which saves on board real estate. These devices also have Sleep and PowerSave modes to minimise power consumption. Software drivers are available for Windows 2000, XP, Vista and CE, as well as Mac and Linux. The chips operate from a single 2,97 to 3,63 V power supply with the core operating at 1,2 V to minimise overall power consumption.

For more information contact ASIC Design Services, +27 (0)11 315 8316.

Full-speed USB UARTs

The Sierra Wireless AirLink line of intelligent mobile and M2M gateways is now avail-able in South Africa through Arrow Altech Distribution. The broad line-up of AirLink intelligent, rugged gateways is well suited for various fixed, portable and mobile data appli-cations, such as those found in public safety, law enforcement, emergency services, field service, energy manufacturing, distribution and metering, security surveillance and industrial networking.

The Raven range is built on a robust processing environment and features embedded ALEOS intelligence and various forms of connectivity such as RS-232, USB and 10/100 Ethernet, depending on the model, in a compact and rugged enclosure. The Raven range is targeted at applications requiring unmanned access to high-speed wireless data, including digital signage and video surveillance.

The PinPoint range is a rugged, intelligent and fully-featured mobile communications platform with multiple peripheral connections including serial, Ethernet and USB. Expanded I/O functionality in a separate connector includes four digital inputs, four analog inputs and two relay outputs, providing extensive remote instrumentation and events reporting possibilities. Equipped with a high precision GPS receiver and advanced remote manage-ment capabilities, the PinPoint range is well suited for a wide variety of mobile data and location applications requiring real-time and continual data access. By leveraging ALEOS,

Mobile and M2M gatewaysthird-party loca-tion application providers can integrate with the PinPoint range to enable a broad set of mobile data and field ser-vice solutions. Furthermore, the events reporting engine embed-ded in ALEOS allows custom-ers to monitor sensors and trig-ger notifications via e-Mail, SMS or to a third-party application.

All AirLink devices are powered by ALEOS embedded intelligence. ALEOS, which has been deployed on hundreds of thousands of devices worldwide, is a robust, reliable environ-ment that simplifies installation, deployment and management of any wireless solution. Compatible with numerous machine and GPS protocols, it streamlines integration with a broad set of legacy equipment and third-party applications. ALEOS ensures a highly reliable persistent network connection and enables extensive remote management and diag- nostics, all of which are vital in remote, unmanned and mobile operations where physical access is difficult and expensive.

AirLink devices are supported by

AceWare, the remote management software offered by Sierra Wireless. Deeply integrated with ALEOS, AceWare applications simplify deployment and management of wireless solutions by providing extensive device setup and provisioning, as well as remote control, configuration and management of deployed communications platforms. One of the key components of AceWare is the ability to upgrade ALEOS firmware over-the-air.

All Sierra Wireless mobile and M2M HSUPA devices are fully backward compat-ible to HSDPA, UMTS, EDGE and GPRS networks.

For more information contact Gyula Wendler, Arrow Altech Distribution, +27 (0)11 923 9600.

Exar has rolled out a Full-Speed USB UART with up to 12 Mbps serial data rate. The series is composed of three

devices which are compliant to the USB 2.0 specification.




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SimCom’s SIM340DZ is a complete quad-band GSM/GPRS solution in an SMT module ready to be embedded in a customer’s application. Featuring an industry-stan-dard interface, the device delivers GSM/GPRS 850/900/1800/1900 MHz performance for voice, SMS, data and fax in a form factor measuring 33 x 33 x 3 mm.

The SIM340DZ is con-trolled via AT commands (GSM 07.07, 07.05 and SIMCOM enhanced AT com-mands). It operates from a supply of 3,4 to 4,5 V over the temperature range of -40°C to +85°C. The modem interfaces to an external SIM at 3 V or 1,8 V. Other interfaces include two analog audio interfaces, RTC backup, SPI, serial and debug interface, antenna pad, charge interface and general-purpose I/Os. The devices carry GCF, CE, RoHS and FCC approvals.

For more information contact Barry Culligan, Otto Marketing, +27 (0)11 791 1033.

GSM/GPRS modem

This reference design demonstrates how digital-power techniques – when applied to UPS applications – enable easy modifications through software, the use of small magnetics, intelligent battery charging, high efficiency, compact designs, low audible and electrical noise via a pure sine-wave output, USB communication and a lower overall bill-of-materials cost.

Though not available for purchase, all of the documentation, software and Gerber files needed to build this reference design can be obtained for free from Microchip’s website at www.microchip.com/offlineups.

The reference design utilises high-frequency switching techniques to implement three optimised digital power conversion stages. The push-pull DC-DC converter stage boosts the battery voltage to drive the inverter stage. The full-bridge inverter stage creates pure sine wave AC power to the load. Finally, the flyback switch-mode charger charges the battery from the AC line power.

The dsPIC33F controls all critical operations of the system, as well as the housekeeping operations. Fast and reliable switchover from mains to inverter, and vice-versa, is done intelligently to ensure that power to the load is transferred without surges and sags. The refer-ence design also features USB connectivity and an LCD panel, for communication with the external world.

For more information contact Tempe Technologies, +27 (0)11 452 0530.

Digital UPS reference designMicrochip has released its Pure Sine Wave Uninterruptible Power Supply (UPS) reference design, which is based on the dsPIC33F “GS” series of digital-power digital signal controllers (DSCs).

http://www.microchip.com/


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INDUSTRIAL & EMBEDDED COMPUTING & NETWORKING

Advantech has introduced two new PoE switches, the EKI-2525PA and EKI-2526PI, expanding its Industrial Ethernet solutions. The EKI-2525PA is a 5-port switch with 24/48 V d.c. power input designed for typical factory appli-cations. The EKI-2526PI is a 6-port switch with a wide operating temperature range designed for harsh environment applications.

Most industrial PoE switches support 48 V d.c. power input, however users will need to have a power adaptor ready for any field device usage. The EKI-2525PA offers 24 V d.c. power input that not only gets around these power supply issues, but can still support PoE to connected devices.

The EKI-2526PI is highly rugged, and its additional Ethernet port allows users to set up a daisy chain topology, providing versatile network architectures for industrial applica-tions. The wide operating temperature (-40°C to 75°C) allows it to operate reliably even in extreme environments.

Both PoE switches provide up to 15,4 W of power per port, and can be used to power IEEE802.3af compliant powered devices (PDs).

For more information contact ProMicro, +27 (0)11 706 7913.

Industrial PoE switches

A new industrial server from Centurion Micro Electronics combines industrial reli-ability and Intel Core 2 Quad processing power in a 1U 19-inch rack mount unit. The design employs advanced fan cooling techniques to enable the high-end system to run in a compact form factor at standard PC temperatures.

Testing of the system has shown that it is capable of continuously running a Core 2 Quad 3 GHz CPU with space for a 2 tera-byte 3,5” SATA hard drive. The motherboard allows space for memory up to 8 GB, so the PC is also capable of functioning as a server. Other features include a DVD-RW drive, dual Gigabit LAN, seven USB ports, two RS-232 serial ports, 8-bit onboard digital I/O and a built-in watchdog timer.

For more information contact Centurion Micro Electronics, +27 (0)12 666 9066.

Industrial Core 2 Quad computer

This forms a connection between the arriv-ing installation lines and the wiring inside the control cabinet.

The STX mounting rail distributors are available for either loose-tube, mini-breakout or breakout cables of up to 12 fibres using splice techniques or for fibre optic adapters using preassembled fibre optic links. Fibre optic adaptor types including ST, SC Duplex, SC-RJ, LC Duplex, E2000 and E2000 Compact can be installed in the interchange-able front panel. Installers can flexibly feed the cable from three directions while maintaining minimum bending radii using a storage reserve with additional cable retain-ers. For loose-tube cables, the distributors are supplied with ready-to-supply, coloured pigtails and cable strain relief.

Ethernet cabling solutions

The Fibre Optic Din Mount Rail Distribution Box. The coloured pigtails for

loose-tube cables are clearly visible.

The Cat6A AMJ 10 Gigabit Ethernet System jack is inversely orientated with right angled IDC contacts and has a tool-

less jack termination.

The Cat6A AMJ 10 Gigabit Ethernet System is a tuned system of structured cabling components designed to work together, delivering standards-compliant 10 Gigabit Ethernet/category 6A channel transmission over 100 metres. The system provides headroom beyond 500 MHz and adds protection against ANEXT and EMI.

The Telegärtner cable for this system is round with a small outside diameter. These features allow increased pathway inside standard conduits, raceways and cable organisers. The round construction and smaller outside diameter provide an advantage over Category 6A STP when retrofitting or pulling new runs. The AMJ 10 Gigabit Ethernet S/FTP system has been third party verified for category 6A channel requirements and ostensibly tested to sup-port existing PoE applications and exceeds proposed PoE +.

For more information contact Webb Industries, +27 (0)11 444 2299.

With the new PSI-Bluetooth-Profibus set from Phoenix Contact, Bluetooth technology is used for wireless fieldbus communication with Profibus. The Bluetooth frequency-hopping technique is particularly beneficial in metallic environments and also shows its strengths when coexisting with other wireless systems.

The system enables devices to be started quickly, as there is absolutely no configuring to be done when establishing a Bluetooth connection. The Bluetooth converters are pre-configured for a transparent, password-protected point-to-point connection. After installation, the devices automatically connect themselves, therefore permitting a wireless Profibus connection with data transfer rates of 187,5 Kbps. By using a high-performance transceiver based on Bluetooth 2.0 technology, ranges in excess of 150 m can be achieved.

With the set, complex Profibus connections to moving devices, which were previously only

Fieldbus communication via Bluetooth

possible using costly drag chains, slip rings or other cable-based solutions, can now be quickly implemented at a favourable price.

For more information contact Andre Kemp, Phoenix Contact, +27 (0)11 801 8200.

For generic cabling in control cabinets, the Fibre Optic Din Mount Rail Distribution Box from Telegärtner offers outlets and distributors which can be mounted directly next to one another on a conventional TH35 rail by simply clicking them into place.


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Increasingly, developers of SFF devices are looking for off-the-shelf products that minimise development costs and time, con-sequently guaranteeing fast time-to-market. With the new 2,5” Pico-ITX form factor, a mini single board computer (SBC) form factor has become available which enables imme-diate application. This means that custom developments on such a small form factor (10 x 7,2 cm) are no longer compulsory.

To the embedded computer technology market, which is characterised by the need for long-term availability, Pico-ITX offers independent support via SFF-SIG (the SFF special interest group). In terms of hardware, the Pico-ITX form factor is equipped, for example, with Intel ’s Atom processors and the highly-integrated Intel System Controller Hub in the smallest of spaces.

In order to exploit the full potential of the Intel Atom processors, the most crucial thing was to find an ideal balance between embed-ded connectors and interfaces available on the enclosure. Due to these reasons, for example, on Kontron’s Pico-ITX SBC pITX-SP, GBit Ethernet, 2 x USB 2.0 and DVI are placed externally, as these are the interfaces which are in most common use in applica-tions. Further interfaces are provided via embedded connectors.

In spite of the fact that the Pico-ITX form factor is no larger than the connector panel of an ATX conform motherboard, the new embedded motherboard offers room for 1 DDR2 SODIMM module, 4 further USB 2.0 interfaces, up to 2x SATA II, 1x PATA44 and a socket for microSD cards, along with a Jili30 LVDS interface for simple monitor con-nection. Additionally, a backlight inverter can be connected and controlled. Audio devices can be connected via Line In, Line Out, MIC In and SPDIF Out to the integrated HDA controller. Customer specific extensions are possible via 1x SDIO (Secure Digital Input/Output) pin header or digital I/O (4-bit).

The 2,5” form factor is ideal for combining congruent 2,5” hard disks in a space-saving way. System designs including CPU heat-sinks of approximately 10 mm in height can be integrated into a construction of around

Designing mini x86 devices efficiently Norbert Hauser, Kontron

40 mm. Without a heatsink and with a micro SD card instead of a 2,5” hard disk, the result is even flatter.

The right board for every applicationDepending on the solution required, a stan-dard board doesn’t always fit the bill. With the COM Express compatible computer-on-modules (COM) form factor nanoETXexpress (55 x 84 mm), compact solutions similar to Pico-ITX can be developed. However, the concepts of both solutions meet different requirements. With COMs, for example, it is possible to implement any external interfaces that are required and this – from a certain production quantity – can have a positive effect on costs. This is realised on a customer-specific carrier board which is fitted directly into the enclosure; cables are not necessary. A Pico-ITX board can do without this design effort, if existing interfaces suit the requirements. So both solutions target different fields of application.

Especially in this class of small boards, COMs are gaining significance, as for example, customer-specific interfaces con-nected via PCIe in small spaces are more and more in demand. For this reason, it is important to choose the right COM. Market researchers VDC have already announced their prognosis, which promises best growth rates for nanoETXexpress – COMs with COM Express Type 1 connectors are expected to achieve an annual growth rate of 70% and attain a market share of 21% in 2010.

This confirms the high acceptance of the credit-card sized form factor nanoETXex-press, as this COM form factor is the most dominant representative of its class. Hence,

it is not surprising that Aaeon, Adlink and Advantech have joined this specification and have – together with Kontron – passed revision 1.0 of the nanoETXexpress speci-fication, which now also supports SDVO. Furthermore, together with the PICMG consortium they will jointly present the nanoETXexpress form factor under the proposed neutral name of ‘Ultra’, so that it can be included in the next COM Express specifications.

Revision 1.0 of the nanoETXexpress COM specification sees, by the way, SDVO becoming available via a separate flat foil connector. This enables continued LVDS support via the COM Express connector and DVI can still be used, which gives the green light for solutions with two independent moni-tors. Revision 1.0 of the nanoETXexpress specification is available for download at www.nanoetxexpress.com.

ODM services for tailor-made embedded solutionsWhen larger production quantities are required, employing individual semi- and full-custom single board solutions is recom-mended. Companies like Kontron also offer – along with a wide range of standard COTS products – ODM (original design and manu-facturing) services for tailor-made platform solutions.

Instead of splitting different stages of development and/or production of embedded computer technology between several part-ners, OEMs have the opportunity to switch to just one ODM service provider and in doing so profit from a higher level of project effi-ciency with simpler, overall management.

Assuming that in the past in-house

With Pico-ITX, small form fac-tor (SFF) designers can benefit from a standard solution, with which they can develop the smallest embedded devices quickly and without having to make customer-specific adap-tations. There are, however, alternatives.

The Pico-ITX form factor.

http://www.nanoetxexpress.com


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projects and new custom designs were essentially a matter of large production quantities, not every company comes into ques-tion as a partner for ODM outsourcing projects. A certain size and financial strength of the potential ODM service provider are important factors which serve to guarantee long-term availability and competitiveness. Additionally, an extensive standard product portfolio can have cost-saving effects, as the ODM has already carried out designs for its own range, and these can be easily transferred to customer-specific products.

Inexpensive purchasing is also guaranteed due to scaling effects, as the ODM service provider has purchased accord-ing to his own needs and quantities are consequently larger. Manufacturers who can provide a large product range are also in a much better position to balance out up- and down-turns in demand. The choice of ODM partner therefore should fall on a manufacturer of embedded computer technology which ideally would have its own production facility in Asia, to ensure produc-tion costs keep to a minimum.

A further real benefit is the fact that the ODM project manager liaises and coordinates all aspects of the project locally with the customer, meaning that the customer will be spared any control and coordination work regarding the Asian manufacturing and moreover released from any possible risks connected with this. Beside the importance of the hardware portfolio, software is increasingly becoming a competitive and differentiating feature, so the software range of the ODM service provider should be taken into consideration. The more dedicated software an ODM offers for its embedded solutions, the better it will fit into the particular application in question.

For more information contact Osiris Technical Systems, 0861 674 747.

Demand for smaller form fac-tors is not only met with SBCs but also via established COM Express specifications of the PICMG. A turn-over of over $61 million is expected to be achieved in 2010 with these COM Express modules. The smallest form factor with a COM Express compatible connector is the credit card-sized nanoETXexpress (55 mm x 84 mm). COM designs with nanoETXexpress bring the benefits of especially small enclosures and energy-efficient designs and are therefore ideal for SFF and ultra-mobile devices. For applications that require more graphic performance and a wider range of interfaces, COMs in the microETXexpress format (95 x 95 mm) are the answer. Boards with this form factor support, for example, high 3D graphic performance and dual-display support via SDVO, LVDS, VGA and TV Out. Depending on the application, all COM modules are easily interchangeable. The precondition for this is the use of Type 1 or type 2 COM Express connectors, which VDC sees in a leading position within the COM Express conform modules (93% in 2010) and consequently as the de facto standard. Therefore, alternative modules should only be used if no satisfactory technical solution can be found with COM Express, as the significance and the long-term availability of alternative modules are in no way guaranteed.

The compact alternative: nanoETXexpress


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In addition, field programmable gate arrays (FPGAs) have grown in capability and gone down in cost, providing high-speed functionality that could once only be achieved with applica-tion specific integrated circuits (ASICs). Finally, virtualisation is blurring the connection between hardware and software by enabling multiple operating systems to run on a single processor. With the rapid evolution of these technolo-gies, how can embedded developers possibly keep up? This article explains what these technologies mean for embedded designs, and how developers can take advantage of these changes now while keeping development time to a minimum.

It goes without saying that multicore processing represents an enormous shift in embedded design. With the presence of just one processor core on a chip, embedded designers traditionally have been able to use sequential programming languages such as C even for the most complex of applications. However, the presence of multiple processing cores on one physical chip complicates the design process considerably.

Because most commercial compilers have not advanced to automatically analysing which sections of code can run in parallel, embed-ded designers looking to take advantage of multicore processors must make use of parallel programming APIs that add overhead to code and are difficult to debug. In addition, tradi-tional sequential programs make it very difficult to visualise parallel routines, creating a big problem for designers inheriting legacy code (or struggling with their own complex applications). If today’s parallel programming is difficult for designers, how will they fare when challenged with the next generation of (16 or more core) processors?

The most obvious solution to this challenge is using better programming tools and methods to abstract away the complexity of multicore hardware. While APIs such as OpenMP and POSIX have become commonplace in parallel applications, newer APIs such as the Multicore Communications API (MCAPI) promise to be more scalable and support a wide variety of parallel hardware architectures (both SMP and AMP). In addition, new tool suites such as Intel Parallel Studio aim to provide better

Embedded technology, multicore and virtualisation Casey Weltzin, National Instruments

Figure 1. Using a dataflow language such as LabVIEW can speed development of

parallel embedded applications.

Figure 2. Installing a hypervisor enables asymmetric multiprocessing on a set of

homogeneous processor cores.

The embedded design world has changed markedly over the last decade, and the progress shows no sign of slowing. Multicore processing – in the form of both symmetric multiprocessing (SMP) and asymmetric multiprocessing (AMP) – is becoming commonplace, with embedded multicore CPU revenue expected to grow sixfold from 2007 to 2011, according to VDC.

debugging tools than previously available. Finally, graphical dataflow languages

such as NI LabVIEW provide an inherently parallel programming model for SMP that can greatly reduce time to market. The question is, why program serially when the application is supposed to run in parallel? By automati-cally analysing parallel sections of code and mapping those sections onto multiple threads, dataflow languages allow designers to focus on their main task: developing code quickly and concisely.

Envisioning a typical embedded software design process, a large embedded application likely starts with a flow chart, and then individual pieces of the flow chart are translated into code and implemented. With dataflow programming, a step can be skipped; code can be imple-mented in parallel as laid out on the flow chart without translation into a sequential language. In this way, investing in parallel programming tools (including new APIs and IDEs that support dataflow languages) will help users make the most of advances in multicore technology for their embedded designs.

Next, FPGAs have changed the way that high-speed and massively parallel embed-ded designs are implemented, and will no doubt continue to evolve in the future. In the past, implementing custom signal processing routines such as digital filtering in hardware meant designing an ASIC with significant initial design expense. While this may have been cost-effective for high-volume applications, low-volume embedded designs were forced to use a combination of existing ASICs, or run signal processing code on a considerably slower pro-cessor in software. FPGAs have been a game changer. Now, embedded designers can simply download custom signal processing applica-tions to an FPGA and run in hardware, at a cost of only tens or hundreds of Rands. In addi-tion, because FPGAs implement embedded

applications in hardware, they are by nature massively parallel.

One major challenge embedded develop-ers face is the difference in design tools used to program FPGAs and microprocessors. While many developers are comfortable writing high-level C code (at least for sequential micro-processor applications), FPGA programming is typically done in a hardware description lan-guage (HDL) such as VHDL. This fundamental gap in communication between developers can add a major hurdle in the development cycle, especially when FPGAs and processors are both used in a single design.

To solve this problem, a number of tools have been developed to translate C appli-cations into HDL code (such as Impulse CoDeveloper), which enable you to specify applications at a high level and then target those applications to FPGAs. In addition, graph-ical dataflow languages such as LabVIEW allow users to develop for FPGAs without specific HDL knowledge. Because dataflow provides an inherently parallel approach to programming, it also allows users to take advantage of the mas-sively parallel nature of FPGAs automatically. The message here is simple: using high-level FPGA design strategies (such as dataflow languages and C to HDL translators) can maxi-mise the efficiency of a design team and reduce time to market.

Finally, one of the most recent technologies to enter the embedded scene is virtualisa-tion. The main idea behind this technology is to make better use of processing hardware by abstracting away the details of the specific hardware platform from operating systems and applications. Specifically, one way to use virtualisation in embedded designs is to install a piece of software called a hypervisor, which will allow multiple operating systems to run in parallel simultaneously. This ends up having positive implications on both the overall capa-bility of an embedded system and its use of multicore hardware. In a system with multiple homogeneous processor cores, a hypervisor makes it easy to construct an AMP software architecture where individual operating systems are assigned one or more cores. At a high level, virtualisation technology can be thought of as making multicore hardware multitalented.

Though designers often program entire


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embedded systems from the ground up, pressure to reduce development time (and therefore cost) has led to higher usage of operating systems in the embedded domain. This, however, presents a problem: how do engi-neers balance the need for the services and UI provided by a commercial OS with the real-time performance needed for an embedded application? Imagine, for example, designing a medical imaging machine. How can one take advantage of the built-in UI capabilities of an OS such as Linux while processing imaging data in real-time? Using a hypervisor can meet these challenges. By running both a feature-rich commercial OS and a real-time OS in parallel, development time for the embedded applications can be reduced while maintaining determinism.

In conclusion, though trends in embedded technology including mul-ticore processing, FPGAs and virtualisation present a big departure from traditional development techniques, there are some clear steps that can be taken to harness them and stay competitive. First, by adopting programming tools that abstract away hardware features such as multiple processing cores or FPGA gates. By concentrating on implementing a design while spending minimal time making adjustments for the underlying hardware architecture, designers can bring embedded products to market faster.

For more information contact National Instruments, 0800 203 199.

Lantronix’ XPress-DR and XPress-DR-IAP device servers allow virtually any serial device to be connected to a new or existing Ethernet network. By encapsulating serial data and transporting it over Ethernet, the modules allow virtual serial links to be established over Ethernet. By using these units, limited-distance, point-to-point, direct serial connections can be extended within a plant, throughout a facility, or across a global enterprise.

When used in conjunction with an OPC server, most Windows based HMI, scada and PC-based control applications have full access to infor-mation in the connected device. Existing COM-port based Windows applications can access network-enabled devices using the COM Port Redirector software, which allows the creation of virtual serial ports that can be mapped to the remote device servers over Ethernet and connected to the XPress-DR and XPress-DR-IAP.

The installable communication drivers allow specific support for various industrial communication protocols. With native support for these protocols, devices that previously allowed only one connection can now support multiple connections simultaneously. Flexible configuration options allow the unit to be set up locally using the serial port, or remotely over Ethernet using Telnet or a common web browser. Included Windows based configuration software simplifies the process of installing communication drivers and configuring them for use with attached devices. Flash memory provides for maintenance-free, non-volatile storage and allows future system upgrades.

Packaged in a rugged DIN-rail mount case and featuring 2000 V galvanic isolation, 1500 V Ethernet isolation, a 0°C to 60°C operating range and a 9 – 30 V d.c./9 – 24 V a.c. power input, the devices are suitable for many industrial applications.

For more information contact Lambert Colyn, CST Electronics, +27 (0)11 608 0070.

Serial device servers

Diamond Systems announced the newest member of its PC/104 I/O offering, the Diamond-MM-32DX-AT. The analog I/O module provides a superset of the features and performance of the company’s flagship DMM-32X-AT module.

The DMM-32DX-AT features a true 16-bit D-A converter, hardware configu-ration via software control or hardware jumpers, a buffered PC/104 bus and an extended Universal Driver interface. Fully backward compatible with the DMM-32X-AT, the new module is also available with a 12-bit D-A option.

Additionally, the DMM-32DX-XT is designed to reduce the A-D noise levels by more than 25% at maximum gain settings as compared to previous models and boasts a quieter and fully regulated power supply for the analog section.

For more information contact Electronic Products Design, +27 (0)12 665 9700.

PC/104 analog I/O module


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The new work, described in the 6 August 2009 issue of Science Express, overcomes significant hurdles in scaling up ion-trapping technology from small demonstrations to larger quantum processors.

In the new demonstration, NIST research-ers repeatedly performed a combined sequence of five quantum logic operations and 10 transport operations while reliably maintaining the 0s and 1s of the binary data stored in the ions, which serve as quantum bits (qubits) for a hypothetical quantum computer, and retaining the ability to subsequently manipulate this information. Previously, scientists at NIST and elsewhere have been unable to coax any qubit tech-nology into performing a complete set of quantum logic operations while transporting information without disturbances degrading the later processes.

The NIST group performed some of the

Sustained quantum computation processing demonstrated

earliest experiments on quantum information processing and has previously demonstrated many basic components needed for com-puting with trapped ions. The new research combines previous advances with two crucial solutions to previously chronic vulnerabili-ties: cooling of ions after transport so their fragile quantum properties can be used for subsequent logic operations and storing data values in special states of ions that are resistant to unwanted alterations by stray magnetic fields.

The NIST experiments stored the qubits in two beryllium ions held in a trap with six distinct zones. Electric fields are used to move the ions from one zone to another in the trap, and ultraviolet laser pulses of specific frequencies and duration are used to manipulate the ions’ energy states. The scientists demonstrated repeated rounds of a sequence of logic operations (four single-qubit operations and a two-qubit operation) on the ions and found that operational error rates did not increase as they progressed through the series, despite transporting qubits across macroscopic distances (960 micrometres, or almost a millimetre) while carrying out the operations.

The NIST researchers applied two key innovations to quantum information process-ing. First, they used two partner magnesium ions as ‘refrigerants’ for cooling the beryllium ions after transporting them, thereby allow-ing logic operations to continue without any additional errors due to heating incurred during transport. The strong electric forces between the ions enabled the laser-cooled magnesium to cool down the beryllium ions, and thereby remove heat associated with their motion, without disturbing the stored quantum information. The new experiment is the first to apply this ‘sympathetic cooling’ in preparation for successful two-qubit logic operations.

The other significant innovation was the use of three different pairs of energy states within the beryllium ions to hold informa-tion during different processing steps. This allowed information to be held in ion states that were not altered by magnetic field fluctuations during ion storage and transport, eliminating another source of processing errors. Information was transferred to differ-ent energy levels in the beryllium ions for performing logic operations or reading out their data values.

Physicists at the National Institute of Standards and Technology (NIST) in the US have demonstrated sustained, reli-able information processing operations on electrically charged atoms (ions).



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Different measurement principles have been applied to every conceivable measurement task, resulting in numer-ous sensor variations for similar applications. But each measurement principle has its own strengths and weak-nesses, thereby naturally limiting the success with which a measurement can be taken for a particular application. For example, a laser sensor cannot be used for distance measurement (to determine thickness, for example) through rubber due to the optical limitation, whereas this same measurement can be accomplished quite simply with an eddy current sensor.

The novel ‘dual sensor’ approach from Micro-Epsilon is conceptually very simple: combine the strengths of two different measuring principles to benefit from the capabili-ties of both, thereby mitigating their inherent weaknesses. By evaluating the output signals of two different sensor types simultaneously, measurements which would other-wise be impossible can be attempted.

A typical application example for such an approach can be found in the automotive manufacturing sector where the plastic skin thickness inside a production mould for some of the plastic components of vehicles needs to be inspected during the manufacturing process in order to maintain the tight tolerance limits required. Preferably, this should take place during production in order to avoid possible scraping costs.

Automated thickness measurement during productionTo produce plastic parts using modern techniques, poly-urethane material is sprayed into a mould which shapes the material. The nozzle for the spray process is located on a robot arm, which moves precisely along the various contours of the mould. The dual sensors which measure the thickness of the sprayed part are also positioned on this robot arm. Immediately after the spray process, the robot arm moves to previously defined points where the sensors measure the thickness. If an error occurs anywhere, it can be rectified immediately.

The thickness measurement of the sprayed skin presented the developers at Micro-Epsilon with a few problems. The texture of the surface, the complicated geometric shape and the materials used – polyurethane and metal – place rigorous demands on measurement technology. Specialists from Micro-Epsilon were able to develop an elegant solution for this measurement application – two sensors were used based on different measurement principles (Figure 1).

A combination of laser triangulation and eddy current sensorsThe fundamental principle underlying the measurement setup is that the distance to both surfaces is measured simultaneously. Through subtraction, the difference of both values gives the thickness of the layer. In order to measure the distance to the metal surface of the mould, an eddy current sensor is used, which is suitable for precise distance measurement to electrically conduct-ing surfaces. Here, a high frequency alternating current flows through a coil cast into the sensor housing. The electromagnetic field produced by the coil induces eddy currents in the conducting measurement target, which in turn also produces an electromagnetic field (Figure 2). As a result, the impedance of the coil changes. This change of impedance provides an electrical signal which is proportional to the distance of the mould from the sensor. Since eddy currents can only be induced in ferromagnetic

Dual-sensor technology for plastics manufacturing

Figure 3. Using laser triangulation, distances to surfaces can be measured

very precisely.

materials, the signal is not influenced by the thickness of the plastic skin.

The distance to the surface of the plastic foam, on the other hand, is measured using a laser triangulation technique. This requires that a laser projects a spot of light, which is monitored by a camera, onto the surface to be measured. If the distance between the sensor and the surface varies, the angle of incidence which the camera records changes. This allows for the distance to be determined very accurately using simple trigonometric calculations (Figure 3). The resolution using this method is down to a few micrometres.

A modified type EU15(05) sensor from Micro-Epsilon is used as the eddy current sensor, being specifically optimised for this application with two holes for the laser beams. In this way, any axial offset between the two sen-sors is avoided. The resolution of the eddy current sensor is 0,75 mm. The laser triangulation sensor optoNCDT 1700-20 – also from Micro-Epsilon – has a resolution of 1,5 µm. A CCD array is used as the receiver element in this sensor. The sensor is also able to handle difficult surfaces, such as a shiny black or plastic surface.

For more information contact Associated Technology, +27 (0)11 802 3320.

Figure 1. Structure of Micro Epsilon’s dual sensor.

Figure 2. The eddy current measurement principle.

INDUSTRIAL ELECTRONICS & AUTOMATION


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The mini controller ILC 170 ETH 2TX is the latest addition to the modular Inline range of controllers from Phoenix Contact. This control-ler extends the scope of applications for inline controllers to include smaller applications requiring complex Ethernet infrastructures and pluggable parameter memories.

With their integrated Ethernet interface, these controllers can be programmed and parameterised using the IEC-61131-compliant PC WorX automation software. Parallel data exchange with OPC servers and communica-tion with TCP/IP-capable control systems are also possible. Furthermore, the integrated

Ethernet interfaces in the devices make it possible to establish linear network structures at the machine level without the need for addi-tional switches or hubs, reducing the amount of cabling required. Another feature is the pluggable parameter memory, which makes it easy to switch system applications or recipe data. Since it is directly integrated into the Inline automation system, the mini controller is highly modular and can be customised according to the given requirements.

For more information contact Andre Kemp, Phoenix Contact, +27 (0)11 801 8200.

Ethernet PLC with pluggable memory

Panasonic Electric Works KR20 wireless units enable process data to be transmitted fast and securely without cable installations. The units are equipped with an RS232 interface and can be configured as master or slave. An RS485 interface or digital I/Os (NPN or PNP) are optional. With free Configurator KR software, complex wireless networks can be configured easily.

The modules employ highly secure 2,4 GHz transmission and allow for flexible network integration with a variety of terminal station devices. Six digital I/Os are available for the PNP I/O unit and eight for the NPN I/O unit. Via RS485, up to 99 KR20 slaves can be con-nected to each master, and 31 terminal stations can be connected to each slave. In total, 254 terminal stations can be connected to a single master. Range extension can be accomplished through a repeater function.

For more information contact Edwin Brown, Vepac Electronics, +27 (0)11 453 1910.

Wireless I/O modules

BMG’s technical resources division has extended its range of SPM condition monitoring systems to include the new VibChecker por-table instrument, designed for reliable on-site vibration measurement and assessment.

The maintenance tool supports BMG’s BearingChecker, which is used to assess the condition of rolling element bearings during operation in equipment like motors, fan, pumps and gearboxes. The VibChecker gives early warning signs of developing machine problems in order to prevent premature replacement of machine parts. The lightweight tester has an ergonomic design, an easy button operation and user-friendly interface.

Handheld vibration testerThe VibChecker is designed for simple

vibration checks and with built in FFT (Fast Fourier Transform) capabilities, it is also an efficient device for troubleshooting. Readings are immediately and automatically evaluated according to established ISO standards. The instrument has an internal probe and connector for external ICP transducers. It is capable of displacement, velocity and acceleration RMS and ISO 2372/10816 measurement between the 10 and 1000 Hz frequency range.

Accessories include a comfort grip pro-tective sleeve and a small portable MEMS transducer with magnetic foot, convenient for measurement in narrow spaces.

For more information contact Dave Russell, BMG, +27 (0)11 620 1500.


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Allegro MicroSystems has introduced a Hall-effect sensing integrated circuit and magnet combination that provides a solution for true zero-speed, digital gear-tooth sensing in two-wire applications. This small package, with a two-wire lead frame, can be easily assembled and used in conjunction with a wide variety of gear shapes and sizes. The ATS682LSH is a magnetic solution for fer-rous target applications.

The IC incorporates a dual-element, Hall-effect sensor and signal processing that switches in response to differential magnetic signals created by a ferrous target. The device contains sophisticated circuitry that reduces magnet and system offsets, calibrates the gain for air gap independent switch points and provides true zero-speed operation.

Signal optimisation occurs at power-up through the combination of offset and gain-adjust and is maintained throughout operation with the use of a running-mode calibration scheme. Running-mode calibra-tion allows immunity to environmental effects such as micro-oscillations of the sensed target at startup or sudden air gap changes. The regulated current output is configured for two-wire interface circuitry and is ideally suited for obtaining speed information in wheel speed applications. The Hall element spacing is optimised for high-resolution, small-diameter targets.

For more information contact Arrow Altech Distribution, +27 (0)11 923 9600.

Digital gear-tooth sensorK Measure has added Zeroplus’ LAP16128

16-channel logic analyser to its product range. The unit supports a total of 54 protocol interpreters, including popular ones such as UART (RS232/RS485), CAN, USB, I2C, SPI, Modbus, IrDA and Dallas 1-Wire. It also sup-ports less well-known protocols like Wiegand, Manchester, AC97 digital audio and several LCD controller interfaces. The product also comes with a software development kit (SDK) which enables engineers to develop software to analyse their own protocols or signals.

The LAP16128 features enough memory to analyse and record high-speed busses like CAN continuously. It has a sampling speed of 75 MHz, with configurable input voltage levels of -30 V to +30 V. It offers advanced trigger options and statistics logging, and is USB bus-

16-channel logic analyser

powered, making it suitable for field analysis. The system comes with all required cables, software, 16 test probes and a travel bag.

For more information contact Johann, K Measure, +27 (0)72 799 8588.

Diodes Incorporated has introduced a single-chip solution providing all the functionality required for driving low-power single coil brush-less DC fans and motors. The AH5792 integrates a Hall sensor and amplifier, complete digital control circuitry and a full bridge output driver in the low profile SOT553 package and is particularly suited to low-voltage micro-motors and ultra thin cooling fan applications.

With its bi-directional, H-bridge output stage, the device suits single-phase full wave brush-less DC motor control, by offering a pair of push-pull output drivers to source and sink cur-rent. The operating voltage range of 1,8 V to 5 V also caters for low operating voltage miniature

DC fans requiring low-voltage start-up.To protect motor windings from damage, the

new motor controller includes integrated locked rotor detection and automatic self restart functions which serve to shutdown the output driver in the event of a locked rotor and then restart the motor when the rotor is freed. In addition, a frequency generator output provides users with tachometer-like feedback for external speed monitoring.

The AH5792 has an operating temperature range of -40°C to 100°C and is fully RoHs complaint.


Single-chip motor controller

ICP DAS ’ PET-7000 is a range of Ethernet-based I/O modules featuring digital and analog voltage, current and temperature variants. They can be powered by Power over Ethernet (PoE) and feature a built-in web server and web HMI function. This allows basic setting configuration, I/O monitoring and I/O control through the use of a regular web browser. The web HMI func-tion requires no programming or HTML skills in order to create dynamic web pages for both monitoring and control. PET-7000 also sup-ports the Modbus/TCP protocol for integration to scada software.

The modules feature both a module watch-dog and a host watchdog. The module watchdog is a built-in hardware circuit that can be used to monitor the operation of the module and will reset the CPU module if a failure occurs in the hardware or the software. The host watchdog is a software function that can be used to monitor the operating status of the host, and is used to prevent network communication problems or host failures.

For more information contact Centurion Micro Electronics, +27 (0)12 666 9066.

Ethernet-based I/O modules


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National Instruments has announced the new LabVIEW NI SoftMotion Module, which simpli-fies the development of advanced single- and multi-axis motion applications, and new NI C Series modules, which expand the connectivity of the NI CompactRIO programmable automa-tion controller (PAC) platform to hundreds of servo and stepper drives from NI and third-party vendors. These two additions to the NI family of motion products combine the ease of use and I/O capabilities of NI LabVIEW graphical programming with the customisation and syn-chronisation benefits of field-programmable gate array (FPGA)-based CompactRIO hardware to deliver an advanced platform for developing motion applications.

LabVIEW NI SoftMotion offers the conve-nience of programming motion profiles with a high-level, function block API based on the Motion Control Library defined by PLCopen. It includes function blocks for straight line, arc and contoured move types as well as function blocks for advanced operations such as electronic gearing and camming. The module also features advanced functions for designing custom motion applications including trajectory generation, spline interpolation, position and velocity con-trol and encoder implementation. Because the module is an extension of LabVIEW, engineers and scientists can synchronise their motion applications with I/O and measurements in a single development environment.

LabVIEW NI SoftMotion seamlessly inte-grates with CompactRIO to deliver a solution for advanced motion control applications. Using the new C Series drive interface modules, users can take advantage of a CompactRIO feature that automates FPGA programming to integrate FPGA benefits such as reliable, high-speed con-trol and synchronisation into their applications. Additionally, LabVIEW NI SoftMotion works with customised axes for engineers and scientists who want to use third-party hardware.

With direct connectivity to hundreds of servo and stepper drives, the new C Series drive interface modules make it easy to incorporate new or existing motors and drives into motion systems. The NI 9512 module connects to stepper drives and motors, while the NI 9514 and NI 9516 modules feature single- and dual-encoder feedback, respectively, and interface with servo drives and motors. Because motion applications tend to be processing-intensive, the drive interface modules perform onboard processing to free up processing power and increase performance. Additionally, the drive interface modules work with the NI 9144 deterministic Ethernet expansion chassis, which features two Ethernet ports that make it possible to daisy-chain multiple chassis from a CompactRIO, the NI 3100 industrial controller or a real-time PXI controller to create distrib-uted motion applications.

For more information contact National Instruments, 0800 203 199.

NI simplifies advanced motion control

New from Maxim are the MAX15500 and MAX15501 industrial analog-output signal conditioners. These devices offer the indus-trial market a combination of high functionality, great integration and small total solution size. They integrate a programmable voltage-output ampli-fier and a current-output amplifier; ±10 V and 4 - 20 mA outputs operat-ing directly from a 24 V field supply; ±35 V circuit protection; extensive error reporting capabil-ity; and daisy-chain flexibility.

The devices are suitable for PLC (pro-grammable logic controller) analog outputs, distributed I/O, embedded systems, and industrial control and automation. A single device can be used for channel-isolated applications or multiple devices for group-isolated applications.

Typical signal conditioners need pre-cision-matched resistors to track voltages well over temperature. The MAX15500/MAX15501s' integrated voltage amplifier and voltage-to-current converter eliminate the need for those additional resistors. Only the current gain-setting resistor is external to the device. They offer extensive fault detec-tion, including open-circuit load in current mode, short-circuit load in voltage mode, over-temperature and supply brownout. Both

Industrial-output signal conditioners

intermittent and permanent load faults can be detected. If a fault occurs, the open-drain fault-interrupt pin will be pulled low. The status of the fault bits is available through the SPI interface.

The analog output conditioners give a +5% and +20% over-range, providing a programmable current up to ±24 mA or voltage up to ±12 V proportional to a control-voltage signal. The control voltage is typically supplied by an external DAC with an output voltage range of 0 to 4,096 V for the MAX15500, and 0 to 2,5 V for the MAX15501. The output current and voltage are selectable as either unipolar or bipolar. Additionally, a HART signal may be added to the input signal.

For more information contact Larry Gordon, CST Electronics, +27 (0)11 608 0070.

Bulgin's latest addition to its range of IP68 waterproof connectors is a unique new design for USB connections. Based around the stan-dard USB interface, these 4-pole hot-pluggable connectors have USB Ver 2 performance offer-ing high-speed data transfer up to 480 Mbps.

Robustly housed in an over-moulded body using UL94V-0 rated PVC, the connectors are environmentally sealed to IP68. Shielded USB connectors, combined with continuous screen-ing, produce a high degree of noise immunity and EMI protection – an important consideration in electrically noisy industrial environments.

Three formats of single- and double-ended cables offer a number of options for environ-mentally sealed connections between PC and peripherals; these are: IP68 sealed A type USB to standard B type USB, IP68 sealed B type USB to standard A type USB and IP68 sealed A type USB to IP68 sealed B type USB. Each is available in 2, 3 and 5 metre lengths.

The cable connector is based on Bulgin's proven Buccaneer design but features over-moulding technology where the connector body is moulded directly over the cable. This gives both a tough outer body and reliable cable seal. The screw coupling provides a secure and proven locking system allowing quick and easy connections.

USB connectors for industrial conditions

The mating panel mount connectors have either A or B type USB IP68 connection to the front of panel and a standard USB connection to the rear. Shielded USB adapters are used to maintain screening throughout the system and adapter leads are available to provide a direct connection to PCBs via 0,1" pitch headers. This design also maintains complete compatibility with standard USB connectors, a useful feature to allow standard USB cables or USB memory sticks to be utilised. Sealing caps are also available to maintain the IP rating of unmated connectors.




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The new HRP-75 series power supply from Mean Well is designed to fit 1U low-profile (38 mm) rack chassis in applications such as factory automation, test and measurement equipment, electrical and mechanical sys-tems, and LED displays.

The 75 W a.c. – d.c. enclosed type power supply features low no-load power consump-tion (<0,5 W) and high operating efficiency. Compared to the manufacturer’s previous 75 W model, the new series is 17,9% smaller, 9 – 11% more efficient and has vibration withstand upgraded from 2 G to 5 G and the warranty extended from 3 years to 5 years.

75 W power supplies

International Rectifier has launched a series of 150 V and 200 V HEXFET power MOSFETs with ultra low gate charge for industrial appli-cations including switch mode power supplies (SMPS), uninterruptable power supplies (UPS), inverters and DC motor drives.

As DC-DC power converter applications advance and switching frequencies increase, input capacitance and gate charge play a sig-nificant role in overall efficiency. These new MOSFETs are optimised for fast switching circuits where switching losses are critical, and, therefore, are well suited as a primary switch

Power MOSFETs for industrial systems


for isolated DC-DC converters for telecom applications or driving light load efficiency in any advanced DC-DC application.

The new MOSFETs are qualified to industrial grade and are moisture sensitivity level 1 (MSL1). The devices are available in TO220, D2PAK, TO262, DPAK and IPAK packages, offered lead-free and are RoHS compliant.

For more information contact Marian Ledgerwood, Future Electronics, +27 (0)21 421 8292.

With up to 89% efficiency, the new power supply can be cooled by free air convection from -30°C to +70°C ambient temperature. With a built-in active PFC function, they can fulfil the requirement of EN61000-3-2 for harmonic current and also withstand a 300 V a.c. input surge for 5 seconds, which can reduce the damage caused by unstable AC mains. Other standard functions include remote ON/OFF control, protection from short circuit, overload (constant current mode), over-voltage and over-temperature (optional).

For more information contact Current Automation, +27 (0)11 462 4253.


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C&K Components has developed a new se-ries of micro-miniature, side-actuated detect switches. Designated the GDS Series, the low-profile switches can be actuated from either the X or Y axes, providing versatility in a variety of applications. They sit just 0,9 mm off the printed circuit board and are designed for a broad range of applica-tions including consumer electronics, computers, medical equipment, mobile communications devices, and ATCA and MicroTCA equipment.

The GDS series features a low maximum actuation force of only 30 grams. Contact rating is 1 mA at 5 V d.c., with a maximum initial contact resistance of 1 Ω and a minimum insulation resistance of 100 MΩ be-tween adjacent contacts. Minimum mechanical and electrical life is to 100 000 cycles and operating temperature ranges from -20°C to +70°C. The switches are RoHS compliant and pick-and-place compatible, and are available in tape and reel packaging.


Side-actuated detect switches

interconnection, switches, relays, cables & keypads

The header assemblies come with pre-loaded contacts and may be installed on the printed circuit board manually or automatically using robotic equipment. All housings are polarised for easier mating, and locking latches help main-tain reliable connections.

The VAL-U-LOK connector system

Single-row board-mount headers

knitter-switch has announces a new series of pushbutton switches targeted at manufacturers of test and measurement instruments, multime-dia devices and industrial automation systems.

Because the MPLS 12 series has a long travel of more than 5 mm, users get a noticeable tactile response when using the new switch, which can be very useful in noisy environ-ments such as factories and control rooms. The switches are offered in white, red, amber, green, blue and with amber/green or red/green

LED illuminated pushbutton switches

Tyco Electronics has expanded its popular VAL-U-LOK con-nector family with single-row, board-mount headers in both vertical and right angle con-figurations.

is a low-cost, wire-to-wire and wire-to-board connector system with 4,2 x 4,2 mm centreline. This connector system can be used in a variety of applications, including the HVAC, vending, gaming and appliance industries.

The single-row headers are avail-able in 3, 4 and 5 positions. This system is available in UL 94 V-2 or UL 94 V-0 flammability rated nylon with contacts in brass or phosphor bronze with tin or gold plating. The connector system is UL component recognised, CSA certified and RoHS compliant.


dual-LEDs. Thanks to the use of gold-plated contacts and terminals, switching current is a minimum of 10 µA.

The MPLS 12 series switches are surface mount products suitable for 260°C reflow solder-ing and feature a mechanical lifetime of at least 30 000 operations. Both latching and momentary types are offered.

For more information contact Actum Electronics, +27 (0)11 608 3001.


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Side-actuated detect switches


26 F E A T U R E



Fischer Connectors announced that all its prod-ucts engineered to withstand extreme operational environments as well as standard products, are now tested to strict norms comparable to MIL-Specs. The company performs 15 environmental, mechanical and electrical tests for each product according to IEC standards. A cross-references table viewable at www.fischerconnectors.com/Mil-Specs compares IEC testing standards to MIL-Specs standards.

“The changing role of the military market to that of a worldwide policing posture has resulted in greater interest in environmentally durable, lightweight and portable equipment,” says Daniel

Connectors tested for military compliance

Using the new PIT range of terminal blocks in the ‘Clipline complete’ system from Phoenix Contact, small, flexible wires with cross sections as small as 0,34 mm² and fitted with end sleeves can now be connected directly and without the need for extra tools. As soon as the wire is inserted, the contact springs open automatically. The high contacting forces exceed those stipulated by the relevant standards and ensure that the contacts between conductors are both reliable and high in quality.

To remove a conductor requires simply press-ing a button with a suitable tool. This pressure is

Terminal blocks with push-in connection technology

The latest addition to Bulgin’s Polysnap range of mains inlet modules now incorporates a miniature circuit breaker. Polysnap modules have previously used conventional fused inlets but this circuit breaker version now provides an alternative where resettable circuit protection is required.

Two styles are available, one with IEC60320 C14 or C16 (hot condition) inlets and one with C20 inlets. The C14/C16 versions snap-fit into a rectangular panel cut-out measuring 34 x 40 mm. Stepped fixings suit 1,0, 1,5, 2,0 and 3,0 mm

Mains inlet with circuit breaker

FCT now supplies a wide range of D-Sub con-nectors to meet customer requirements for versions with stamped signal contacts. These contacts are manufactured and assembled using sophisticated automated equipment into D-Sub connectors to achieve high levels of precision for coplanarity ≤0,1 mm.

The SMT and through-hole D-Sub connec-

D-Sub connectors with stamped signal contacts

Spycher, International Sales Director for Fischer Connectors. “Suppliers to the military sector must evolve with the ever-changing needs of the agile, self-contained war fighter. Sophisticated electronic C41 systems such as soldier harnesses, personal role radios and other handheld devices must be rugged, sealed and compact. So we thoroughly test our products to withstand extreme operational en-vironments such as vibration, shock, rain, humidity, salt fog, sand/dust and temperature fluctuations”.

Military testing requirements are especially important when dealing with sub-assemblies and items that have been modified. A high degree of reliability is required especially in life-saving appli-

cations such as aircraft ejector seats and aircrew radio locator beacons.

For more information contact Suntronika, +27 (0)11 403 3420.

transmitted to the interior contact springs, which open the terminal to its maximum range. The or-ange colour of the button marks it as an actuating element to prevent mistakes from being made.

The new series includes a wide range of termi-nal types for wire cross sections of up to 2,5 mm². This includes feed-through, multi-level and multi-conductor terminals. The product range is rounded out to include component terminals, base terminals and disconnect terminals. The PIT range of terminal blocks offers interchangeable connecting technolo-gies and standardised accessories such as plug-in bridges, marking systems and testers.

For more information contact Bruce Patton, Phoenix Contact, +27 (0)11 801 8200.

thickness panels. The circuit breakers are avail-able with 5, 8, 10 or 15 A trip currents and have a typical trip speed of 0,3 to 1,8 seconds with a 600% overload at 25°C. The higher-current C20 version fits a 34 x 56 mm panel cut out and the circuit breaker can be specified with 5, 8, 10, 15, 16 or 20 A trip currents.

Rocker options include red and green illumina-tion with 125 or 250 V neons and non-illuminated types, both with RESET and OFF legends. The circuit breaker and mains inlet carry UL and CSA approvals.


tors were specifically developed to be used in fully automatic assembly and soldering operations by pick and place technology. The connectors have a suction area above their centre of gravity and thus are designed in a way that the vacuum clam of the pick and place machine can lift them up safely and position them precisely.

These connectors are delivered as stan-dard in tape and reel packaging. They are RoHS compliant and have a temperature rating of 260°C for 10 seconds during reflow soldering operations.

For more information contact Hiconnex, +27 (0)11 315 1909.

http://www.fischerconnectors.com/


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28 F E A T U R E interconnection, switches, relays, cables & keypads

W i t h h i g h l y flexible configu-rations, Fischer Electronics’ range of fibre-optic in-terconnect ions is designed for state-of-the-art electronic equip-men t such as medical apparatus, scientific and instru-mentation devices, defence and security systems. The reliable, rugged, sealed, compact connector solutions are designed to resist very tough conditions.

Buildings, bridges, dams, ships, float-ing rigs and aircraft can benefit from being equipped with a ruggedised fibre-based data transmission system. Fischer caters to customers developing solutions for these environments by offering custom-made connectors, originally built rugged, as well as by ruggedising standard connec-tors with a protective housing.

The connectors employ a circular push-pull system, and are shock and cor-rosion resistant, as well as offering IP68 sealing.


Rugged fibre-optic connectors

WQMA connectors are an alternative to traditional SMA connectors for appli-cations up to 6 GHz and provide high density and quick connections within and to RF modules. In addition, they are fully intermateable and backward compat-ible with any QLF certified standard QMA jack and they provide for excellent ingress protection that is IP68 rated when mated. They are RoHS compliant, have enhanced corrosion resistance and feature 100 matings minimum for dura-bility, a full range of straight and right angle options, a wide temperature range of -40°C to +105°C and a power rating

Waterproof RF coaxial connectorsRadiall has expanded its QMA product line with new high density RF coaxial Waterproof QMA (WQMA) connector solutions with fast and easy snap-on Quick Lock technology. They offer good electrical performance and have environmental characteristics that pro-vide for long lasting durability needed for demanding outdoor applications, eliminating the need for costly and bulky watertight enclosures or cable entries.

200 W at 1 GHz, 75°C. They are available for most popular cables as well as for a broad range of panel sealed QMA jacks in different configurations.

WQMA connectors support numerous outdoor applications such as portable test and GPS equipment, RFID, wire-less surveillance cameras, base stations, handhelds as well as interconnections between modules and antennas needed for Wi-Fi, WiMax, 3G, 4G and more.

For more information contact Hiconnex, +27 (0)11 315 1909.


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The unique feature of this tool is that it efficiently performs four functions, offering claimed time savings of more than 50% compared with traditional tools that com-plete the same tasks. The Starfix crimping tool cuts, strips (with a side thrust), twists and automatically crimps each Starfix fer-rule onto the cable.

This easy to operate tool has a fully adjustable wheel which is set to the cross section of the cable. The cable is then cut to the required length, automatically stripped and then twisted by tightening the tool and pulling the cable to remove the insulation. Ferrules, with an insulating flange, are then dispensed and crimped.

For immediate recognition of the ap-propriate cross-section of ferrules, they are colour matched with applicators which have a transparent, removable protective cover. Ferrules are manufactured in strips for simultaneous separating and crimp-

Cable crimping tool

To meet the needs of high-tech test instru-ments, military equipment and medical tools requiring custom cable interconnects, Omnet-ics offers military quality Micro-D connectors at 1,35 mm pitch connected with custom cabling to the Mil-32139 connectors at 0,635 mm. This allows custom routing of the cables as well as ideally measured lengths that will not take up too much space in the system. The mating Nano connectors are often panel mounted into miniature modules or sometimes horizontal SMT connectors soldered directly to printed circuit boards.

Cable with pin counts from 9 to 65 positions can be interconnected in most any manner to meet the custom design layout. One large-count Micro-D connector can be connected to multiple lower count Nano-connectors to offer drop-down and multiple interface harnesses.

For more information contact Connector & Wire Services, +27 (0)11 918 0011.

Micro-D connectors and cables


ing; for easy handling and convenience on-site, they are supplied in boxes. Accessories include cutting and crimping blades, as well as fixing components.

Starfix ferrules can accommodate wire in the single format from 0,5 mm² to 50 mm² and in double format from 2 x 0,75 mm² to 2 x 2,5 mm². The crimping system consists of five empty colour coded applicators for dispensing strips from 0,5 mm² to 6 mm².

Legrand also supplies this cable mar-keting system in a kit which consists of a crimping tool for crimping up to a 6 mm² ferrule and various individual ferrules between 10 mm² and 50 mm². A tool box for on site use, containing Starfix, Cab 3 and Duplix marking systems, is also available.

For more information contact Legrand, +27 (0)11 444 7971.

Legrand ’s Starfix ferrules and cable crimping tool form part of the company’s cable manage-ment system, designed for new installations and renovations in commercial installations, offices and domestic environments.

Harwin has extended the range of high power contacts available within its Mix-Tek mixed technology Datamate connector series, with the introduction of two new crimp style contacts, together with the associated crimp tooling. These contacts are aimed at those users wishing to ter-minate to cables in sensitive areas where the use of solder joints are not permitted, for example in certain restricted aerospace applications.

High-power crimp contacts

Samtec has expanded its SEARAY high-density open pin field interconnect family with a new line of right angle sockets for perpendicular and high-speed micro back-plane applications.

The new sockets (SEAF-RA series) have a 1,27 x 1,27 mm grid array for maximum grounding and routing flexibility and are optimised to reduce skew and impedance mismatch. They feature Samtec’s rugged Edge Rate contacts which are designed for enhanced signal integrity, reduced broadside coupling and crosstalk, and high cycles.

SEARAY right angle sockets are currently

Right angle SEARAY socketsavailable in four-row (up to 200 contacts) and six-row (up to 300 contacts) configurations. Eight-row (up to 400 contacts) and ten-row designs (up to 500 contacts) along with a right angle terminal (SEAM-RA series) are in the final stages of development.

This system mates with SEARAY surface mount terminals (SEAM series), which has optional guide posts for blind mating, and a choice of tin-lead or lead-free solder charged termination. SEARAY surface mount sys-tems with up to 500 single-ended or 125 differential I/Os, coax cable assemblies with 180 or 240 I/Os, and high density flex jump-ers are also available.

For more information contact Samtec, +27 (0)11 452 8112.

The new crimp male power contacts can accommodate cable sizes of between 18 to 20 AWG with current ratings of between 5 and 8 A achievable, depending on wire size. The new contacts facilitate simple, fast and secure termination to cables, and are fully interchangeable with solder contacts.



30 F E A T U R E



Samtec recently added polytetrafluoro-ethylene (PTFE) cable options for several of its discrete wire interconnect systems. This material’s ability to withstand a wide range of temperatures, along with its low rate of outgassing, resistance to flame, abrasion and corrosion, long lifespan, and excellent dielectric properties, make PTFE cables ideally suited for avionics, military and other harsh-environment industries and applications.

Selection of PTFE cable for the following Samtec products can widen the operating

PTFE cable options from Samtec

The four-pole, fast IDC connection system is specified for 690 V and 20 A, and can accept wire and cable cross-sections of 1,0 up to 2,5 mm².

The Quickon plug connectors are plug-

Plug connector with fast IDC connectioncompatible with the Quickon connection on the front and also have a Quickon connection on the back. The socket contacts are protected from finger contact and polarised to prevent incorrect insertion. The long insertion depth and the rugged screw locking ensure a high cable strain relief in the longitudinal and transverse directions of over 500 N. The rugged plug connectors are equipped for various voltage circuits with different polarity identification, can be coded, and are available in black and grey to provide visual differentiation.

For more information contact Sean Hadley, Phoenix Contact, +27 (0)11 801 8200.

temperature (compared to PVC cable) by as much as 45°C, depending on wire gauge and system: • Tiger Eye discrete wire 1,27 mm micro pitch

system with Samtec’s high reliability Tiger Eye three-finger BeCu contacts and rugged latching system (SFSD/TFSD series).

• Power Mate discrete wire system with 5,5 A per power contact on 4,19 mm pitch (PMSD/PMSS/IPBD series).

• Mini Mate discrete wire system on 2,54 mm pitch, with 3,6 A per contact (MMSD/MMSS/IPD1 series).

For more information contact Samtec, +27 (0)11 452 8112.

Quickon Power Distribution from Phoenix Contact is an industrial-grade installation technology in IP68 protection and is resistant to hammer blows according to IK 07.


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Low in profile, the new DBPLU/E receptacles and SFPU/E panel plugs from Fischer Connectors suit por-table devices where compactness and lightness are required. The rear-mounted body style simplifies connector termina-tion and the rugged components are engi-neered to withstand arduous field condi-tions. Even unmated, the IP68 (2m/24h) or full hermetic sealing prevents moisture ingress.

The parts are tested to endure more than 5000 mating cycles within a temperature range of -50°C to +150°C. High integrity signal transmis-sion is guaranteed with 360° EMC shielding. Non-magnetic options are available for magnetic sensitive applications. Available in matt chrome or non-reflective matt black finish, the DBPLU/E and SFPU/E series are compatible with all standard Fischer high-performance push-pull connectors.

The components are targeted at portable communication equip-ment, handheld instrumentation devices, probes and sensors, medical tooling and battery systems.


Low-profile rear-mounting connectors

New from knitter-switch is a series of rotary coding switches for designers of industrial and building automation systems and measuring instruments. They are washable, rated to IP67 and provide a contact breaking capacity of 100 mA at 42 V.

The DRS/SMR 15000/16000 series is available with a PCB space-saving body of just 7 x 7 mm and offers surface mount and through-hole mounting versions; both designs can be reflow soldered. A surface mount version is supplied in T/R packing for pick and place assembly systems and also available with a shaft. Operating temperature range is -50°C to +125°C. Coding options include BCD 10-position and hexadecimal 16-position, each available with both real and inverse (complement) coding.


IP67 rated rotary coding switches



32

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GENERAL

New from Vishay is a series of low-profile surface-mount rectifiers with ESD protection to 25 kV. The new MSE1Px devices are offered in an eSMP series MicroSMP package with footprint dimensions of just 2,5 mm by 1,3 mm with a height profile of 0,65 mm. In addition to their ESD capabilities, the new devices feature a maximum junction temperature of 175°C and an MSL moisture sensitivity level of 1.

Aimed at automotive and industrial control and sensor units, as well as lighting systems, the new devices offer designers a choice of 100 V (MSE1PB), 200 V (MSE1PD), 400 V (MSE1PG) and 600 V (MSE1PJ) reverse voltage ratings. All feature an average forward current capability of 1 A and a forward surge capability of 20 A.


Rectifiers feature ESD protection

Vishay has unveiled two new series of high-precision Accutrim trimming potentiometers. The 3/4-inch rectilinear devices offer low end-to-end TCR of ±5 ppm/°C (1285G) and ±15 ppm/°C (1280G) from –55°C to +125°C, + 25°C reference, and ±25 ppm/°C through the wiper, load life stability of 0,1% under full rated power at +25°C for 2000 hours, and less than 0,05% typical settability.

The 1280G and 1285G trimmers feature a bulk metal foil resistive element that possesses a unique inherent temperature and load life stability. Their advanced, virtually backlash-free (less than 0,05%) adjustment mechanism makes them easy to set quickly and accurately, and maintains that setting through temperature cycling and vibration, as well as thermal and mechanical shock. The devices offer a multifingered, noble metal wiper engaging a planar surface of etched foil for low TCR end-to-end and through the wiper.

The devices feature a 0,1% typical setting stability, a wide resistance range from 10 Ω to 20 kΩ, and resistance tolerances of ±5% (1285G) and ±10% (1280G). They offer a 0,75 W power rating at +25°C and 26 ±2 turn adjustments. For increased reliability, they can withstand electrostatic discharges up to 25 kV.


Trimming pots cover 10 Ω to 20 kΩ



33

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GENERAL

The new 1200RS and 1200LRS series of inductors from Murata Power Solutions are well suited for providing power line filtering in low- to medium-current applications such as switching power supply circuits. An integral ferrite shield makes them especially useful in designs that are susceptible to electromagnetic interference (EMI).

The through-hole, radial leaded devices have compact overall dimensions of 10,5 mm diameter x 8,5 mm height to support their inclu-sion in designs where PCB space is limited. The 1200LRS series is available with induc-tance values ranging from 6,8 µH to 22 mH and DC current ratings up to 4,7 A. The 1200RS series offers higher current versions with the same footprint; Inductance values extend from 10 µH to 1 mH and maximum current ratings to 4,6 A. All parts have a low DC resistance to help maximise efficiency.

Inductors for power line filtering

Operating temperature range of the 1200RS and LRS series is -40°C to +85°C. The new devices use UL 94V-0 approved materials, are fully RoHS compliant, and have backward compatibility with Sn/Pb soldering systems.


Spectrum Advanced Specialty Products recently introduced a family of planar capacitor arrays that are low in profile, compact and feature high-voltage and capacitance values, making them well suited for multi-line EMI filtering in circular, D-sub and custom connectors.

The arrays have a dielectric with-stand voltage rating up to 3000 V d.c., capacitance values up to 1 µF and can be produced in a wide range of geometries with multiple capacitance values, feed-through holes and ground holes available. These arrays receive 100% electrical and dimensional testing of critical parameters. Custom designs are also possible.

Planar capacitor arrays

Target applications include medical, industrial, communications, military aircraft and engine system applications.

For more information contact Electronic Industry Supplies, +27 (0)11 726 6758.

Littelfuse has introduced the 808 series 250 V a.c./450 V d.c. rated fast-acting TE5 subminiature fuse. Offered with current rat-ings ranging from 1 A to 5 A and a variety of lead configurations, the 808 series features a high breaking capacity, and is halogen- and lead-free.

Designed to serve the requirements of emerging energy-saving higher voltage DC applications, the 808 series offers a flexible alternative in a small size. Targeted applica-tions include power supplies and adapters, battery chargers, industrial controllers and a

Fuse for high voltage DC

wide range of consumer electronics.


EBG Resistors’ SGT series is designed to meet stringent requirements regarding temperature coefficient for high-stability performance at high operating voltages. The low temperature coefficient of the resistors minimises the self-drift generated through warm-up due to power dissipation.

The resistors are produced with EBG’s patented non-inductive design, with typi-cal applications being medical systems like X-rays and nucleus spin tomographs, as well

as power supplies and instruments. The parts feature resistances ranging from 100 kΩ to 1 GΩ, with tolerances from ±0,1% to ±10%. Temperature coefficient is 25 ppm/°C from -15°C to +85°C, while load life stabil-ity is 0,25% per 1000 hours at +125°C. The resistors can be operated continuously at temperatures as high as 225°C.


Resistors with low temperature coefficient



34

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GENERAL

Both conducted and radiated emissions are below Class B limits as defined by EN55011, an important consideration in achieving type approval for medical equipment.

The power supply delivers full output with convection cooling over input voltages from 90 to 275 V a.c., and 200 W from 80 V a.c., in ambient temperatures of -10°C to +50°C. It measures only 152,4 x 101,6 x 39,1 mm, meaning that it fits in 1U enclosures. Where short-term peak power is needed, for exam-ple for motor start-up, the power supply will deliver up to 300 W for 500 milliseconds.

The units have a full feature set for controlling the supply and external monitor-ing and control equipment. This includes a 5 V standby rail, remote on/off switching and power fail signals. A 3-stage converter using an interleaved, resonant, half-bridge, means that two relatively small transformers can replace one large one, saving board space. A zero current, virtually lossless switching topology for the main converter ensures high efficiency over a wide load range and contributes to enhanced EMI performance.

250 W AC-DC power supply

The new NUC2401MN combines high bandwidth differential filtering, solid common mode stop band attenuation and enhanced ESD pro-tection. Enabling designers to achieve filtering and protection while realising space and cost savings, it is suitable for a wide variety of applications based on high-speed differential data lines including USB 2.0, IEEE1394, LVDS, MIPI and MDDI.

Integrating the equivalent of five discrete components into a DFN package measuring just 2 x 2,2 mm, the device combines common mode EMI filtering with ESD protection to ±12 – in accordance with the IEC61000-4-2 industry standard for contact discharge. Machine Model (MM) and Human Body Model (HBM) ESD ratings are 1,6 kV and 16 kV respectively. The device is rated to MSL 1 and will operate at temperatures from -40°C to 85°C.

Because the NUC2401MN is an integrated solution, it helps reduce parasitic inductance, resulting in more ideal common mode filtering. The cutoff frequency for common mode noise reduction is 40 MHz and typical common mode impedance at 100 MHz and 500 MHz is 200 Ω and 500 Ω respectively. The device also offers a low maximum clamp voltage of 10 V at a peak current of 5 A. Maximum peak pulse current rating is 19 A.


Integrated data line protection IC

International Rectifier has introduced the IRF6718 DirectFET MOSFET. The new 25 V device offers low on-state resistance and is optimised for DC switch applications such as active ORing, hot swap and electronic fuse (E-fuse).

Featuring IR’s latest generation silicon technology, the IRF6718 is the company’s first device hosted in a large can DirectFET pack-age. Delivering RDS(on) of only 0,5 mΩ at 10 V VGS in a 60% smaller footprint and 85% lower profile than a D2PAK, the new device reduces conduction losses associated with the pass element to improve the efficiency of the entire system. The device also provides an improved safe operating area (SOA) capability for E-fuse and hot swap circuits. It is offered lead-free and is RoHS compliant.


MOSFET delivers low on-state resistance

ON Semiconductor has introduced an electro-static discharge (ESD) protection IC with integrated common mode choke for high-speed data line applications.

XP Power’s CCM250 is a new 250 W AC-DC power supply that achieves up to 95% efficiency, cutting the heat generated in medical, IT and industrial systems, and reducing or eliminating the requirement for heatsinks or fans for forced-air cooling.

A crystal-controlled clock and digitally generated drive signals are used to ensure accurate, fixed-frequency timing for switch-ing transistors. Heat-generating parts are bonded directly to the U-channel chassis, and magnetic components are conduction cooled, enabling the use of smaller parts.

For more information contact Edwin Brown, Vepac Electronics, +27 (0)11 453 1910.


35

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general

Otto Marketing is offering an assortment of small form factor GSM/GPS antennas to developers of small modern tracking products.

The internal active ceramic GPS patch antenna features a ceramic patch mounted on a printed circuit board with an LNA. It is available in sizes ranging from 13 x 13 x 7,5 mm to 35 x 29 x 6,0 mm. Internal passive bare GPS ceramic patch antennas range in size from 20 x 20 x 4 mm to 25 x 25 x 4 mm and can be supplied with a length of cable and connector. Otto Marketing is able to help customers with board layout to optimise performance and to make sure the antenna is best tuned for the application environment.

Integrated planar antennas for GSM mobile terminals are available in SMD ceramic PIFA format measuring 35 x 6 x 5 mm, and are tested on an evaluation board to have a working frequency of 824 – 960 MHz and 1710 – 2170 MHz. These are also available with microcable and any desired connector. Finally, internal 3G PCB antennas feature a cost effective dipole design on an FR4 substrate measuring 35,8 x 7 x 0,5 mm, tested as a bare PCB to work in 890 – 960 MHz, 824 – 894 MHz and 1710 – 1990 MHz bands with a gain of at least 1 dBi.

For more information contact Pokes Mashao, Otto Marketing, +27 (0)11 791 1033.

Internal antennas for mobile trackingFischer Elektronik has extended the range

of colours for its Frame range of cases for housing PCBs and non-standard electronic components. The cases feature shock-proof plastic coatings which, together with an integral seal, ensure safe use as a table case.

In addition to the standard colour, the cases are available in beige, ivory, sulphur yellow, vermilion, pure orange, flame red, traffic red, red violet, signal blue, pigeon blue, sky blue, moss green, traffic green, chocolate brown and signal black. Other colours for the plastic coatings or seals, surface treatments, imprints and other forms of mechanical processing, as

Cases feature broad colour range

The new range of SAW resonators from Epcos features greatly reduced tolerance around the centre frequency. Compared to predecessor types, it was narrowed down by 50% and is now only ±25 kHz at 433,92 MHz. The com-ponents are mounted on a quartz substrate in hermetically sealed packages and have a footprint of 3 x 3 mm. The permissible operating temperature lies between -45°C and +125°C.

The first types of the R990 (433,92 MHz) and R991 (315 MHz) series are suitable for high-precision wireless transmitters operat-ing in the ISM bands, including automotive electronic applications such as remote keyless entry and tyre pressure monitoring systems. This allows transmitters to be configured with very narrow bands, which both increases the

Highly sensitive SAW resonators

Skyworks has intro-duced two new varactor diodes for low phase-noise ultra-wideband voltage-controlled oscillators and low-cost mobile phone TV tuners. The new diodes offer high breakdown voltage, enabling tuning as high as 28 V.

The SMV1800-079LF and SMV1801-079LF are silicon hyperabrupt junction varactor diodes specifically designed for battery operation. The specified high capacitance ratio and low resolution of these varactors make them appropriate for low-noise VCOs used in wire-less systems to frequencies beyond 2,5 GHz. Additional applications include low-noise and wideband UHF and VHF VCO for GSM, PCS, CDMA and analog phones. In addition, these new diodes provide tight control of the critical diode capacitance versus voltage specifications, enabling repeatable tuning sensitivity in VCO applications.

For more information contact Larry Gordon, CST Electronics, +27 (0)11 608 0070.

Hyperabrupt junction tuning varactor

well as special designs, are produced to meet customers’ specifications.

For more information contact Electrocomp, +27 (0)11 458 9000.

sensitivity of the receivers and reduces their susceptibility to interference. It also enables greater transmission ranges. The resonators satisfy the requirements of AEC-Q200.



36



ChipsHot

Infineon’s BGB 707L7ESD is a wideband, gen-eral-purpose silicon-germanium carbon (SiGe:C) MMIC LNA (low noise amplifier) with integrated ESD protection and active biasing in a very small TSLP-7-1 package. The device is as flexible as a discrete transistor and offers numerous integrated features for compact designs. Integrated ESD protection of 4 kV at RF input, a maximum device transition frequency of 45 GHz, a high input gain compression point (-8 dBm) and excellent noise figure (1 dB at 6 GHz) make it a suitable choice for a broad range of RF circuit designs. Circuit designers can also take advantage of the flexibility and stability of an integrated power-off function for longer battery life, active biasing, a wide operating voltage range and current adjust-able between 3 and 30 mA.

EBV Electrolink, +27 (0)21 402 1940Electrocomp, +27 (0)11 458 9000

Maxim has introduced the MAX16055, a hex-volt-age microprocessor supervisor with integrated reset timing, which eliminates the need for an external capacitor. Whenever one of the six monitored volt-ages falls below its threshold, the open-drain reset output asserts and remains asserted for at least 140 ms after all six voltages exceed their respective thresholds. The reset output is internally pulled up to VCC to eliminate the need for an external resistor, but can be overdriven to accommodate other logic devices. A manual reset is also provided. There are ten versions of the MAX16055, which provide dif-ferent thresholds and supply tolerances to meet all low-voltage system requirements. Preset thresholds for monitoring 3,3; 3; 2,5; 1,8; 1,5; 1,2; 1,1; 1,0; and 0,9 V supplies with -5% and -10% tolerance are available. Additionally, adjustable versions are avail-able to accommodate most standard logic devices.

CST Electronics, +27 (0)11 608 0070

Microchip has released new mTouch AR1000 resistive touch-screen controllers, providing built-in decoding and advanced filtering, as well as controller-driven calibration. Popular due to its low cost, acceptance of finger, glove or stylus-pen inputs, and overall ease of manufacturing and integration, resistive touch-sensing technol-ogy is suitable for applications such as mobile phones, industrial automation, retail point-of-sale, gaming/entertainment and automobile naviga-tion systems. The AR1000 controllers provide universal 4-, 5- and 8-wire support, as well as support for SPI, I2C and UART communication interfaces and are available in 20-pin QFN, SOIC and SSOP packages. Microchip also announced the mTouch AR1000 Development Kit, which includes the AR1000 development board, a 7-inch four-wire resistive overlay, a PICkit serial analyser and all necessary interface cables, as well as a CD containing technical documentation, GUI and all necessary software.

Tempe Technologies, +27 (0)11 452 0530

Ramtron has launched its second parallel device in a family of new parallel and serial F-RAM products that offer high-speed read/write per-formance and low-voltage operation. The latest device in the V-Family is the FM28V020, a 256 Kb, 2,0 to 3,6 V, parallel non-volatile RAM in an industry standard 28-pin SOIC package. It is a 32 K x 8 device that reads and writes like a standard SRAM and retains data for over 10 years after power is removed. In-system operation of the FM28V020 is similar to other RAM devices, allowing it to be used as a drop-in replacement for standard SRAM. Read and write cycles may be triggered by toggling a chip enable pin or by simply changing the address. F-RAM memory is non-volatile due to its unique ferroelectric memory process, making it ideal for non-volatile memory applications that require frequent or rapid writes. The device operates over the full industrial temperature range of -40°C to +85°C.

MB Silicon Systems, +27 (0)11 728 4757

New from Texas Instruments is a family of 16-bit analog-to-digital converters (ADCs) packaged in a leadless QFN measuring 2,0 x 1,5 x 0,4 mm. The devices support battery monitoring, portable instrumentation, industrial process control, smart transmitters, medical instrumentation and other industrial and consumer systems. Designed for precision, power efficiency and ease of implementation, the ADS1115 family performs conversions at programmable data rates up to 860 samples per second, consuming just 150 µA of supply current and operating down to 2 V. The ADS1115 incorporates an oscillator, low-drift reference, programmable gain amplifier, comparator and four-channel input multiplexer. This family also includes 12-bit versions for increased flexibility.

Arrow Altech Distribution, +27 (0)11 923 9600

Vishay announced two new devices in the microBuck family of integrated synchronous buck regulators. The 4 A SiC413 and 10 A SiC417 are DC-DC converter solutions featur-ing an advanced controller IC with gate drivers, two PWM-optimised n-channel MOSFETs (high and low side), and a bootstrap diode in a standalone buck regulator configuration. The devices offer a wide input voltage range of 4,75 V to 26 V for the SiC413 and 3 V to 28 V for the SiC417, with minimum output voltages down to 0,6 V and 0,5 V, respectively. The regulators minimise EMI by eliminating PCB traces, while the devices’ high- and low-side MOSFETs provide low on-resistance for reduced power losses and better performance. For reliable operation and easy system integra-tion, both devices feature cycle-by-cycle current limiting, enable pin, internal soft start, under-voltage lockout, over-voltage protection, and thermal shutdown at +150°C.

EBV Electrolink, +27 (0)21 402 1940

Wideband LNA for embedded antennas Hex-voltage microprocessor

supervisor

Resistive touch-screen controllers

256 Kb parallel F-RAM

Tiny 16-bit ADC family

Synchronous buck regulators


Dataweek, 16 September 2009 IBC* denotes advertisement

This list is provided as a service to readers.While every attempt is made to maintain

its currency prior to going to print,certain changes maysubsequently have

come intoeffect.QUICKFIND

Company Telephone Pagese-mail Website

Actum Electronics +27 (0)11 608 3001 [email protected] www.actum.co.za 24,25*,31,33

Arrow Altech Distribution +27 (0)11 923 9600 [email protected] www.arrow.altech.co.za OFC*,10,21,24,29,32,33,36

ASIC Design Services +27 (0)11 315 8316 [email protected] www.asic.co.za 10,11*

Associated Technology +27 (0)11 802 3320 [email protected] www.associated-technology.co.za 19,21*

Avnet Kopp +27 (0)11 809 6100 [email protected] www.avnet.co.za 6,7,8,9*,21,22,26,33,35

BMG +27 (0)11 620 1500 [email protected] www.bmgworld.net 20

Centurion Micro Electronics +27 (0)12 666 9066 [email protected] www.cme.co.za 12,15*,21

Connector & Wire Services +27 (0)11 918 0011 29

CST Electronics +27 (0)11 608 0070 [email protected] www.cstelectronics.co.za 17,22,35,36

Current Automation +27 (0)11 462 4253 [email protected] www.rectifier.co.za 23,stitched insert*

CZ Electronics +27 (0)11 914 5240 [email protected] www.czelectronics.co.za 10*

Denver Technical Products +27 (0)11 626 2023 [email protected] www.denvertech.co.za 19*

EBV Electrolink +27 (0)21 402 1940 [email protected] www.ebv.com 9,34,36,32

Electrocomp +27 (0)11 458 9000 [email protected] www.electrocomp.co.za 35,36

Electronic Industry Supplies +27 (0)11 726 6758 [email protected] www.eispty.co.za 33,35*

Electronic Products Design +27 (0)12 665 9700 [email protected] www.epd.co.za 17,18*

Electronic Touch Systems +27 (0)11 782 3346 [email protected] www.electouch.co.za 26*

Future Electronics +27 (0)21 421 8292 marian.ledgerwood@

futureelectronics.com www.futureelectronics.com 23,24,34

Gemtek +27 (0)12 664 1771 [email protected] www.gemtek.co.za 4,7*

Hiconnex 086 111 1289 [email protected] www.hiconnex.co.za 26,28,OBC*

K Measure +27 (0)72 799 8588 [email protected] www.kmeasure.co.za 20*,21

Lapp Kabel 0861 CABLES [email protected] www.lappcable.co.za 23*

Legrand +27 (0)11 444 7971 [email protected] www.legrand.co.za 29

MB Silicon Systems +27 (0)11 728 4757 [email protected] www.mbsiliconsystems.co.za 36

Membrane Switch Technologies +27 (0)11 887 1227 [email protected] www.membraneflexi.com 28*

Microtronix +27 (0)11 792 5322 [email protected] www.microtronix.co.za 34*

National Instruments SA 0800 203 199 [email protected] www.ni.com/southafrica 16,17,22

Osiris Technical Systems 0861 674 747 [email protected] www.osiris.co.za 14,15

Otto Marketing +27 (0)11 791 1033 [email protected] www.otto.co.za IFC*,11,35

Panasonic +27 (0)11 313 1618 www.pbssa.co.za 13*

Phoenix Contact +27 (0)11 801 8200 [email protected] www.phoenixcontact.co.za 12,17*,20,26,30

ProMicro +27 (0)11 706 7913 [email protected] www.promicro.co.za 12

Samtec SA +27 (0)11 452 8112 [email protected] www.samtec.com 27*,29,30

Sivan Electronic Supplies (SES) +27 (0)11 887 7879 [email protected] 24*,33*

Suntronika +27 (0)11 403 3420 [email protected] www.suntronika.com 26,28,31*

Telkom Business 10217 [email protected] www.telkom.co.za 5*

Tempe Technologies +27 (0)11 452 0530 [email protected] 11,36

Trinity Telecomms +27 (0)11 465 7377 [email protected] www.trintel.co.za 4

Vepac Electronics +27 (0)11 453 1910 [email protected] www.vepac.co.za 20,34

Webb Industries +27 (0)11 444 2299 [email protected] www.webb.co.za 12,30*


http://www.actum.co.za


http://www.arrow.altech.co.za


http://www.asic.co.za


http://www.associated-technology.co.za


http://www.avnet.co.za


http://www.bmgworld.net


http://www.cme.co.za


http://www.cstelectronics.co.za


http://www.rectifier.co.za


http://www.czelectronics.co.za


http://www.denvertech.co.za


http://www.ebv.com


http://www.electrocomp.co.za


http://www.eispty.co.za


http://www.epd.co.za


http://www.electouch.co.za

http://www.futureelectronics.com


http://www.gemtek.co.za


http://www.hiconnex.co.za


http://www.kmeasure.co.za


http://www.lappcable.co.za


http://www.legrand.co.za


http://www.mbsiliconsystems.co.za


http://www.membraneflexi.com


http://www.microtronix.co.za


http://www.ni.com/southafrica


http://www.osiris.co.za


http://www.otto.co.za

http://www.pbssa.co.za


http://www.phoenixcontact.co.za


http://www.promicro.co.za


http://www.samtec.com



http://www.suntronika.com


http://www.telkom.co.za



http://www.trintel.co.za


http://www.vepac.co.za


http://www.webb.co.za

R16.50 (incl VAT)

16 SEPTEMBER 2009

Featuring: Industrial electronics & automation • Industrial & embedded computing & networking • Interconnection, switches, relays, cables & keypads

Dataweek Electronics & Communications Technology | 16

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Transcript of Dataweek Electronics & Communications Technology | 16