Data Sheet No. PD60251 - Infineon Technologies
Transcript of Data Sheet No. PD60251 - Infineon Technologies
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Features• Floating channel designed for bootstrap operation• Fully operational to +600 V• Tolerant to negative transient voltage, dV/dt
immune• Gate drive supply range from 10 V to 20 V• Undervoltage lockout for both channels• 3.3 V logic compatible• Separate logic supply range from 3.3 V to 20 V• Logic and power ground +/- 5 V offset• CMOS Schmitt-triggered inputs with pull-down• Cycle by cycle edge-triggered shutdown logic• Matched propagation delay for both channels• Outputs in phase with inputs
Product SummaryVOFFSET 600 V max.
IO+/- 200 mA / 440 mA
VOUT 10 V - 20 V
ton/off (typ.) 135 ns & 105 ns
Delay Matching 30 ns
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Data Sheet No. PD60251
IRS2112(-1,-2,S)PbF
DescriptionThe IRS2112 is a high voltage, high speed powerMOSFET and IGBT driver with independent high- andlow-side referenced output channels. Proprietary HVICand latch immune CMOS technologies enable rug-gedized monolithic construction. Logic inputs are com-patible with standard CMOS or LSTTL outputs, downto 3.3 V logic. The output drivers feature a high pulsecurrent buffer stage designed for minimum drivercross-conduction. Propagation delays are matchedto simplify use in high frequency applications. Thefloating channel can be used to drive an N-channel power MOSFET or IGBT in the high-side configurationwhich operates up to 600 V.
(Refer to Lead Assignments for correct pin configuration). This diagram shows electrical connections only. Pleaserefer to our Application Notes and DesignTips for proper circuit board layout.
Typical Connection
HIN
up to 600 V
TOLOAD
VDD VB
VS
HO
LO
COM
HIN
LIN
VSS
SD
VCCLIN
VDD
SD
VSS
VCC
Packages
16-Lead SOICIRS2112S
14-Lead PDIP(w/o lead 4)IRS2112-1
14-Lead PDIPIRS2112
16-Lead PDIP(w/o leads 4 & 5)
IRS2112-2
HIGH AND LOW SIDE DRIVER
• RoHS compliant
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Note 1: Logic operational for VS of -5 V to +600 V. Logic state held for VS of -5 V to -VBS. (Please refer to the DesignTip DT97-3 for more details).Note 2: When VDD < 5 V, the minimum VSS offset is limited to -VDD.
Symbol Definition Min. Max. UnitsVB
High-side floating supply voltage -0.3 625
VS High-side floating supply offset voltage VB - 25 VB + 0.3
VHO High-side floating output voltage VS - 0.3 VB + 0.3
VCC Low-side fixed supply voltage -0.3 25
VLO Low-side output voltage -0.3 VCC + 0.3
VDD Logic supply voltage -0.3 VSS + 25
VSS Logic supply offset voltage VCC - 25 VCC + 0.3
VIN Logic input voltage (HIN, LIN & SD) VSS - 0.3 VDD + 0.3
dVs/dt Allowable offset supply voltage transient (Fig. 2) — 50 V/ns
PD Package power dissipation @ TA ≤ +25 °C (14 Lead DIP) — 1.6
(16 Lead SOIC) — 1.25
RTHJA Thermal resistance, junction to ambient(14 Lead DIP) — 75
(16 Lead SOIC) — 100
TJ Junction temperature — 150
TS Storage temperature -55 150
TL Lead temperature (soldering, 10 seconds) — 300
Absolute Maximum RatingsAbsolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-eters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measuredunder board mounted and still air conditions. Additional information is shown in Figs. 28 through 35.
°C/W
W
V
°C
Symbol Definition Min. Max. UnitsVB
High-side floating supply absolute voltage VS + 10 VS + 20
VS High-side floating supply offset voltage Note 1 600
VHO High-side floating output voltage VS
VB
VCC Low-side fixed supply voltage 10 20
VLO Low-side output voltage 0 VCC
VDD Logic supply voltage VSS + 3 VSS + 20
VSS Logic supply offset voltage -5 (Note 2) 5
VIN Logic input voltage (HIN, LIN & SD) VSS VDD
TA Ambient temperature -40 125 °C
Recommended Operating ConditionsThe input/output logic timing diagram is shown in Fig. 1. For proper operation the device should be used within therecommended conditions. The VS and VSS offset ratings are tested with all supplies biased at 15 V differential. Typicalratings at other bias conditions are shown in Figs. 36 and 37.
V
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IRS2112(-1,-2,S)PbF
Symbol Definition Min. Typ. Max. Units Test Conditionston
Turn-on propagation delay VS = 0 V
toff Turn-off propagation delay
tsd Shutdown propagation delay — 130 160
tr Turn-on rise time
tf Turn-off fall time
MT Delay matching, HS & LS Turn-on/off
ns
Dynamic Electrical CharacteristicsVBIAS (VCC, VBS, VDD) = 15 V, CL = 1000 pF, TA = 25 °C and VSS = COM unless otherwise specified. The dynamicelectrical characteristics are measured using the test circuit shown in Fig. 3.
Symbol Definition Min. Typ. Max. Units Test ConditionsVIH Logic “1” input voltage 9.5 — —
VIL Logic “0” input voltage — — 6.0
VOH High level output voltage, VBIAS - VO
— 0.05 0.2
VOL Low level output voltage, VO — 0.02 0.1
ILK Offset supply leakage current — — 50 VB = VS = 600 V
IQBS Quiescent VBS supply current — 25 100
IQCC Quiescent VCC supply current — 80 180
IQDD Quiescent VDD supply current — 2.0 30
IIN+ Logic “1” input bias current — 20 40 VIN = VDD
IIN- Logic “0” input bias current — — 1.0 VIN = 0 V
VBSUV+VBS supply undervoltage positive going
7.4 8.5 9.6threshold
VBSUV-VBS supply undervoltage negative going
7.0 8.1 9.2threshold
VCCUV+VCC supply undervoltage positive going
7.6 8.6 9.6threshold
VCCUV-VCC supply undervoltage negative going
7.2 8.2 9.2threshold
IO+ Output high short circuit pulsed current 200 290 —VO = 0 V, VIN = VDD
PW ≤ 10 µs
IO- Output low short circuit pulsed current 420 600 —VO = 15 V, VIN = 0 V
PW ≤ 10 µs
Static Electrical CharacteristicsVBIAS (VCC, VBS, VDD) = 15 V, TA = 25 °C and VSS = COM unless otherwise specified. The VIN, VTH, and IIN parametersare referenced to VSS and are applicable to all three logic input leads: HIN, LIN, and SD. The VO and IO parameters arereferenced to COM and are applicable to the respective output leads: HO or LO.
µA
V
mA
V
VIN = 0 V or VDD
IO = 2 mA
VS = 600 V
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— 135 180— 130 160
— 75 130
— 35 65
— — 30
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Functional Block Diagram
SD
LIN
VDD
PULSEGEN
RS
Q
VSS
UVDETECT
DELAY
HVLEVELSHIFT
PULSEFILTER
UVDETECT
VDD/VCCLEVELSHIFT
VDD/VCCLEVELSHIFT
RS
Q RS
R Q
HIN
COM
HO
VS
VCC
LO
VB
Lead Definitions Symbol Description
VDD Logic supplyHIN Logic input for high-side gate driver output (HO), in phaseSD Logic input for shutdownLIN Logic input for low-side gate driver output (LO), in phaseVSS Logic groundVB
High-side floating supplyHO High-side gate drive outputVS
High-side floating supply returnVCC
Low-side supplyLO Low-side gate drive outputCOM Low-side return
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IRS2112(-1,-2,S)PbF
Lead Assignments
Part Number
14 Lead PDIP
IRS211216 Lead SOIC (Wide Body)
IRS2112S
14 Lead PDIP w/o lead 4
IRS2112-1 16 Lead PDIP w/o leads 4 & 5
IRS2112-2
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Figure 1. Input/Output Timing Diagram Figure 2. Floating Supply Voltage Transient TestCircuit
Figure 3. Switching Time Test Circuit Figure 4. Switching Time Waveform Definition
Figure 6. Delay Matching Waveform DefinitionsFigure 5. Shutdown Waveform Definitions
HINLIN
trton tftoff
HOLO
50% 50%
90% 90%
10% 10%
HINLIN
HO
50% 50%
10%
LO
90%
MT
HOLO
MT
SD
tsd
HOLO
50%
90%
HV = 10 V to 600 VVCC = 15 V
10µF
0.1µF
10 k F6
0.1µF
100µF
200µH 10 k
F6
1
213
12
11
10
7
5639
HO
OUTPUTMONITOR
10 k F6
IRF820
dVs
ct
HV = 10 V to 600 VVCC = 15 V
10µF
0.1µF 0.1
µF
10µF
10µF 15 V
1
213
12
11
10
7
5639
HO
LOCL
CL(0 V to 600 V)
VS-
+VB
HIN
LIN
SD
HINLIN
HOLO
SD
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IRS2112(-1,-2,S)PbF
Figure 7B. Turn-On Propagation Delay Timevs. VCC /VBS Supply Voltage
Figure 7C. Turn-On Propagation Delay Time vs. VDD Supply Voltage
Figure 8B. Turn-Off Propagation Delay Timevs. VCC /VBS Supply Voltage
Figure 8C. Turn-Off Propagation Delay Timevs. VDD Supply Voltage
0
50
100
150
200
250
-50 -25 0 25 50 75 100 125
Temperature(oC)
Tu rn
- On
Del
ay T
im e
( ns)
.
Typ.
M ax.
Figure 7A. Turn-On Propagation Delay Timevs. Temperature
0
50
100
150
200
250
10 12 14 16 18 20
V CC / V BS Supply Voltage (V )
Tu rn
- On
Del
ay T
im e
( ns )
.
Typ.
M ax
M ax.
Typ.
0
100
200
300
400
0 2 4 6 8 10 12 14 16 18 20
VDD Supply Voltage (V)
Turn
-On
Del
ay T
ime
(ns)
.
Typ .
Max.
0
50
100
150
200
250
-50 -25 0 25 50 75 100 125
Temperature(oC)
Turn
-Off
Tim
e (n
s)
Figure 8A. Turn-Off Propagation Delay Timevs. Temperature
M ax.
Typ.
0
50
100
150
200
250
10 12 14 16 18 20
VCC/V BS Supply Voltage (V )
Tu rn
- O ff
T im
e (n
s )
Typ.
M ax .
0
100
200
300
400
0 2 4 6 8 10 12 14 16 18 20
V DD Supply Voltage (V )
Tur n
-O ff
Del
ay T
im e
( ns )
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Figure 10A. Turn-On Rise Time vs. Temperature
Figure 10B. Turn-On Rise Time vs. Voltage Figure 11A. Turn-Off Fall Time vs. Temperature
Figure 9B. Shutdown Delay Timevs. VCC/VBS Supply Voltage
Figure 9C. Shutdown Time vs. VDD Supply Voltage
Typ .
Max.
0
50
100
150
200
250
-50 -25 0 25 50 75 100 125
Temperature(oC)
Shut
dow
n D
elay
Tim
e (n
s)
Figure 9A. Shutdown Delay Timevs. Temperature
M ax.
Typ.
0
50
100
150
200
250
10 12 14 16 18 20
VC C/V BS Supply V oltage (V )
Sh u
td ow
n
D el
a y T
im
e ( n
s )
Typ.
M ax .
0
100
200
300
400
0 2 4 6 8 10 12 14 16 18 20
V DD Supply Voltage (V )
Shut
dow
n D
ela
y T
ime
(ns)
Typ.
M ax.
0
50
100
150
200
250
-50 -25 0 25 50 75 100 125
Temperature (oC)
Turn
-On
Ris
e T
ime
(ns)
.
Typ
M ax
0
50
100
150
200
250
10 12 14 16 18 20
V BIAS Supply Voltage (V )
Tur
n-O
n R
ise
Tim
e (n
s) .
Typ.
M ax.
0
25
50
75
100
125
-50 -25 0 25 50 75 100 125
Temperature (oC)
T ur n
- O ff
F al l
T im
e
( ns )
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IRS2112(-1,-2,S)PbF
Figure 11B. Turn-Off Fall Time vs. Supply Voltage Figure 12A. Logic “I” Input Thresholdvs. Temperature
0
3
6
9
12
15
-50 -25 0 25 50 75 100 125Logi
c "1
" Inp
ut T
hres
hold
(V)
Temperature (°C)
Min.
03
69
1215
2.5 5 7.5 10 12.5 15 17.5 20
Logi
c "
1 "
Inpu
t Tre
shol
d (V
)
VDD Logic Supply Voltage (V)
Figure 12B. Logic “I” Input Thresholdvs. Voltage
Min.
0
3
6
9
12
15
-5 0 -25 0 2 5 50 7 5 10 0 1 25
Logi
c "0
" Inp
ut T
hres
hold
(V)
Temperature (°C)
Figure 13A. Logic “0” Input Thresholdvs. Temperature
Max.
03
69
1215
2.5 5 7.5 10 12.5 15 17.5 20
Logi
c "
0 "
Inpu
t Tre
shol
d (V
)
VDD Logic Supply Voltage (V)
Figure 13B. Logic “0” Input Thresholdvs. Voltage
Max.
Figure 14A. High Level Output Voltagevs. Temperature (Io = 2 mA)
Typ
M ax
0
25
50
75
100
125
10 12 14 16 18 20
V BIAS Supply Voltage (V )
Tur n
- O ff
Fal l
Tim
e
( ns)
M ax.
0.0
0.2
0.4
0.6
0.8
1.0
-50 -25 0 25 50 75 100 125
Temperature (oC)
Hig
h Le
vel O
utpu
t Vol
tag
e (V
)
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Figure 14B. High Level Output Voltagevs. Supply Voltage (Io = 2 mA)
Figure 15A. Low Level Output Voltagevs. Temperature (Io = 2 mA)
Figure 15B. Low Level Output Voltage vs.Supply Voltage (Io = 2 mA)
Figure 17A. VBS Supply Current vs. Temperature
M ax
0.0
0.2
0.4
0.6
0.8
1.0
10 12 14 16 18 20
V BAIS Supply V oltage (V )
Hig
h Le
vel O
utpu
t Vol
tage
(V)
Max
0.0
0.2
0.4
0.6
0.8
1.0
-50 -25 0 25 50 75 100 125
Temperature (oC)
L o w
L e v e
l O
u t
p u
t V
o l t a
g e
( V )
M ax
0.0
0.2
0.4
0.6
0.8
1.0
10 12 14 16 18 20
V BAIS Supply Voltage (V)
Low
Lev
el O
utpu
t Vol
tage
(V)
Figure 16B. VBS Supply Current vs. Voltage
0
20
40
60
80
100
-50 -25 0 25 50 75 100 125Tem perature (°C)
Max.
Typ.
Max.
Typ.
0
50
100
150
200
-50 -25 0 25 50 75 100 125
Temperature ( oC)
Figure 16A. VBS Supply Current vs. Temperatur e
Typ.
Max.
0
50
100
150
200
10 12 14 16 18 20
VBS Supply Voltage (V)
VB
S S
uppl
y C
urre
nt (µ
A)
VB
S S
uppl
y C
urre
nt (µ
A)
VB
S S
uppl
y C
urre
nt (µ
A)
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IRS2112(-1,-2,S)PbF
Figure 20A. Logic “I” Input Current vs. Temperature
Figure 17B. VBS Supply Current vs. Voltage
0
20
40
60
80
100
10 12 14 16 18 20
VB
S S
uppl
y C
urre
nt (µ
A)
Max.
Typ.
VB S Floating Supply Voltage (V )
0
5 0
1 0 0
1 5 0
2 0 0
2 5 0
3 0 0
-5 0 -2 5 0 2 5 5 0 7 5 1 0 0 1 2 5
VC
C S
uppl
y C
urre
nt (µ
A)
Temperature (°C)
Max.
Typ.
Figure 18A. VCC Supply Current vs. Temperature
Figure 18B. VCC Supply Current vs. Voltage
0
50
100
150
200
250
300
10 12 14 16 18 20
Vcc
Sup
ply
Cur
rent
(µA)
Vcc Fixed Supply Voltage (V)
Max.
Typ.
0
2
4
6
8
10
12
-50 -25 0 25 50 75 100 125
VD
D S
uppl
y C
urre
nt (µ
A)
Temperature (°C)
Max.
Typ.
Figure 19A. VDD Supply Current vs. Temperature
Figure 19B. VDD Supply Current vs. VDD Voltage
0
2
4
6
8
10
12
0 2 4 6 8 10 12 14 16 18 20
V D
D S u
p p ly
C u r
r e n
t ( µ A
)
VDD Logic Supply Voltage (V)
Max.
Typ.0
20
40
60
80
100
-50 -25 0 25 50 75 100 125
L o g i
c " 1
" I n
p u t B
i a s
C u r
r e n t
( µ A
)
Temperature (°C)
Max.
Typ.
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Figure 20B. Logic “1” Input Current vs. VDD Voltage
0
20
40
60
80
100
0 2 4 6 8 10 12 14 16 18 20VDD Logic Supply Voltage (V)
Cur
rent
(uA
)
Max.
Typ.
Figure 22. VBS Undervoltage (+) vs. Temperature
Max.
Typ.
Min.
6
7
8
9
10
11
-50 -25 0 25 50 75 100 125
V B S
Und
ervo
ltage
Loc
kout
-(V
)
Temperature (°C)
Figure 23. VBS Undervoltage (-) vs. Temperature
Max.
Typ.
Min.
6
7
8
9
10
11
-50 -25 0 25 50 75 100 125VC
C U
nder
volta
ge L
ocko
ut +
(V)
Temperature
Max.
Typ.
Min.
Figure 24. VCC Undervoltage (-) vs. Temperature
6
7
8
9
10
11
-50 -25 0 25 50 75 100 125
VB
S U
nder
volta
ge L
ocko
ut +
(V)
Temperature (°C)
(oC)
Max
0
1
2
3
4
5
6
-50 -25 0 25 50 75 100 125
Temperature (°C)
Logic
"0" I
nput
Bia
s Cu
rrent
(µA
)
Figure 21A. Logic "0" Input Bias Current vs. Temperature
Max
0
1
2
3
4
5
6
10 12 14 16 18 20
Supply Voltage (V)
Logi
c "0
" Inp
ut B
ias
Cur
rent
(µA
)
Figure 21B. Logic "0" Input Bias Current vs. Voltage
Logi
c "1
" Inp
ut B
ias
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IRS2112(-1,-2,S)PbF
6
7
8
9
10
11
-50 -25 0 25 50 75 100 125
VC
C U
nder
volta
ge L
ocko
ut -
(V)
Temperature (°C)
Figure 25. VCC Undervoltage (-) vs. Temperature
Max.
Typ.
Min.
Figure 26A. Output Source Current vs.Temperature
Figure 26B. Output Source Currentvs. Supply Voltage
Figure 27B. Output Sink Current vs. Supply Voltage
M in.
T yp.
0
100
200
300
400
500
-50 -25 0 25 50 75 100 125
Temperature (
o C)
O u
t pu
t S o u
r c e
C u
r r e n
t ( m
A )
M in.
Typ .
0
100
200
300
400
500
10 12 14 16 18 20
VBIA S
Supply Voltage (V)
O u
t p u
t So
u r c
e C
u r r
e n t (
m A
)
M in.
T yp.
0
150
300
450
600
750
-50 -25 0 25 50 75 100 125
Temperature (oC)
O u
t pu t
S in
k C
u r r e
n t
( m
A )
Figure 27A. Output Sink Currentvs. Temperature
M in.
Typ.
0
150
300
450
600
750
10 12 14 16 18 20
V BIA S Supply Voltage (V )
O u
t p u t
S i n
k C
u r r e
n t ( m
A
)
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Figure 28. IRS2112 TJ vs. Frequency (IRFBC20)RGATE = 33 Ω , VCC = 15 V
Figure 29. IRS2112 TJ vs. Frequency (IRFBC30)RGATE = 22 Ω , VCC = 15 V
0
25
50
75
100
125
150
1E+2 1E+3 1E+4 1E+5 1E+6
Frequency (Hz)
Junc
tion T
empe
ratur
e (°C
)
320 V
140 V
10 V
0
25
50
75
100
125
150
1E+2 1E+3 1E+4 1E+5 1E+6
Frequency (Hz)
Junc
tion T
empe
ratur
e (°C
)
320 V
140 V
10 V
Figure 33. IRS2112S TJ vs. Frequency (IRFBC30)RGATE = 22 Ω , VCC = 15 V
Figure 32. IRS2112S TJ vs. Frequency (IRFBC20)RGATE = 33 Ω , VCC = 15 V
0
25
50
75
100
125
150
1E+2 1E+3 1E+4 1E+5 1E+6
Frequency (Hz)
Junc
tion T
empe
ratur
e (°C
)
320 V
140 V
10 V
0
25
50
75
100
125
150
1E+2 1E+3 1E+4 1E+5 1E+6
Frequency (Hz)
Junc
tion T
empe
ratur
e (°C
)
320 V 140 V
10 V
Figure 31. IRS2112 TJ vs. Frequency (IRFPE50)RGATE = 10 Ω , VCC = 15 V
Figure 30. IRS2112 TJ vs. Frequency (IRFBC40)RGATE = 15 Ω , VCC = 15 V
0
25
50
75
100
125
150
1E+2 1E+3 1E+4 1E+5 1E+6
Frequency (Hz)
Junc
tion T
empe
ratur
e (°C
)
320 V
140 V
10 V
0
25
50
75
100
125
150
1E+2 1E+3 1E+4 1E+5 1E+6
Frequency (Hz)
Junc
tion T
empe
ratur
e (°C
)
320 V 140 V 10 V
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IRS2112(-1,-2,S)PbF
Figure 34. IRS2112S TJ vs. Frequency (IRFBC40)RGATE = 15 Ω , VCC = 15 V
Figure 35. IRS2112S TJ vs. Frequency (IRFPE50)RGATE = 10 Ω , VCC = 15 V
0
25
50
75
100
125
150
1E+2 1E+3 1E+4 1E+5 1E+6
Frequency (Hz)
Junc
tion T
empe
ratur
e (°C
)
320 V
140 V10 V
0
25
50
75
100
125
150
1E+2 1E+3 1E+4 1E+5 1E+6
Frequency (Hz)Ju
nctio
n Tem
pera
ture (
°C)
320 V 140 V 10 V
Figure 36. Maximum VS Negative Offset vs.VBS Supply Voltage
Figure 37. Maximum VSS Positive Offset vs.VCC Supply Voltage
-15.0
-12.0
-9.0
-6.0
-3.0
0.0
10 12 14 16 18 20
VBS Floating Supply Voltage (V)
VS
Offs
et S
uppl
y V
olta
ge (V
)
Typ.
0.0
4.0
8.0
12.0
16.0
20.0
10 12 14 16 18 20
VCC Fixed Supply Voltage (V)
V SS
Logic
Sup
ply O
ffset
Volt
age (
V)
Typ.
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IRS2112(-1,-2,S)PbF
www.irf.com 16
01-601001-3002 03 (MS-001AC)14-Lead PDIP
Case outline
14-Lead PDIP w/o Lead 4 01-601001-3008 02 (MS-001AC)
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IRS2112(-1,-2,S)PbF
16-Lead SOIC (wide body) 01 601501-3014 03 (MS-013AA)
16 Lead PDIP w/o Leads 4 & 5 01-601501-3010 02
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IRS2112(-1,-2,S)PbF
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C A R R I E R T A P E D IM E NS I O N FO R 1 6 S O IC W
C o d e M in M ax M in M axA 11 .9 0 1 2. 10 0. 46 8 0 .4 76B 3 .9 0 4.1 0 0. 15 3 0 .1 61C 15 .7 0 1 6. 30 0. 61 8 0 .6 41D 7 .4 0 7.6 0 0. 29 1 0 .2 99E 10 .8 0 1 1. 00 0. 42 5 0 .4 33F 10 .6 0 1 0. 80 0. 41 7 0 .4 25G 1 .5 0 n/ a 0. 05 9 n/ aH 1 .5 0 1.6 0 0. 05 9 0 .0 62
M etr ic Im p eria l
R E E L D IM E NS I O N S FO R 1 6 SO IC W
C o d e M in M ax M in M axA 32 9. 60 3 30 .2 5 1 2 .9 76 13 .0 0 1B 20 .9 5 2 1. 45 0. 82 4 0 .8 44C 12 .8 0 1 3. 20 0. 50 3 0 .5 19D 1 .9 5 2.4 5 0. 76 7 0 .0 96E 98 .0 0 1 02 .0 0 3. 85 8 4 .0 15F n /a 2 2. 40 n /a 0 .8 81G 18 .5 0 2 1. 10 0. 72 8 0 .8 30H 16 .4 0 1 8. 40 0. 64 5 0 .7 24
M etr ic Im p eria l
E
F
A
C
D
G
AB H
N OTE : CONTROLLING D IMENSION IN MM
LOADED TAPE FEED DIRECTION
A
H
F
E
G
D
BC
Tape & Reel16-Lead SOIC
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IRS2112(-1,-2,S)PbF
LEADFREE PART MARKING INFORMATION
ORDER INFORMATION14-Lead PDIP IRS2112PbF
14-Lead PDIP IRS2112-1PbF16-Lead PDIP IRS2112-2PbF16-Lead SOIC IRS2112SPbF
16-Lead SOIC Tape & Reel IRS2112STRPbF
Lead Free ReleasedNon-Lead FreeReleased
Part number
Date code
IRSxxxx
YWW?
?XXXXPin 1Identifier
IR logo
Lot Code(Prod mode - 4 digit SPN code)
Assembly site codePer SCOP 200-002
P
? MARKING CODE
The SOIC-16 is MSL3 qualified.This product has been designed and qualified for the industrial level.
Qualification standards can be found at www.irf.com IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245 Tel: (310) 252-7105
Data and specifications subject to change without notice. 11/27/2006
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