Daily Output OEE Tracker 10 July'2015_Rev01

BN Process OEE Trend

Daily Output Tracker 30-May31-May1-Jun2-Jun3-Jun4-Jun5-Jun6-Jun7-Jun8-Jun9-Jun10-Jun11-Jun12-Jun13-Jun14-Jun15-Jun16-Jun17-Jun18-Jun19-Jun20-Jun21-Jun22-Jun23-Jun24-Jun25-Jun26-Jun27-Jun28-Jun29-Jun30-Jun1-Jul2-Jul3-Jul4-Jul5-Jul6-Jul7-Jul8-Jul9-Jul10-Jul11-Jul6-inch LoadingPlan75757575757575757575757575757575757575757575757575757575757575757575757575757575757575Actual0175014901550150017090100100100999710060404059404060594040114
UAT-Sree: 4" 114 Wafer4040803940403940606055120107Cum Delta(75)25(50)24(51)29(46)29(46)4964891141391631852101951601251097439248(27)(62)(23)(58)(93)(88)(124)(159)(194)(230)(265)(280)(295)(315)(270)(238)

8-inch LoadingPlan125125125125125125125125125125125125125125125125125125125125125125125125125125125125125125125125125125125125125125125125125125125Actual17502327319945150016401319611010489100100143145143145144199118100158150148122192126152144136176198172167251150150Cum Delta50(75)32(20)54(26)(1)(126)(87)(212)(206)(235)(250)(271)(307)(332)(357)(339)(319)(301)(281)(262)(188)(195)(220)(187)(162)(139)(142)(75)(74)(47)(28)(17)34107154196322347372

6-inch Posi-CoatPlan100100100100100100100200200200200200200200200200200200200200200200200200200200200200200200200200200200200200200200200200200200200Actual18017972003601864252254461722952672702546215932630440343130612227838215922887344339280204
UAT-Sree: 4" 200 Wafer450123224383152166152160126Cum Delta8015913131(69)19127750252777374584090797780210641023114912531456168717931715179319751934196218491993213222122216246623892413259625482514246624262352

8-inch Posi-CoatPlan300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300Actual54132235639156435717818135493255311532752603835062624872051220272421357327714244294426220281299356166386498318377347417356Cum Delta241263319410674731609490544337292303535310270353559521708613153315051626168317102124206820622188210820892088214420102096229423122389243625532609

6-inch Posi-DevelopPlan120120120120120120120120120120120120120120120120120120120120120120120120120120120120120120120120120120120120120Actual2164265833725886129170228019422816624911330689512128490364190292313215951722729119115420016626647Cum Delta9640286511171585152616971647175516351709181718631992198521712140253225402910315432243396358936843659371138633834390539394019406542114138

8-inch Posi-DevelopPlan300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300Actual47758958072435627928740016024231742251128906748260808346514866293447322404140260287379395361399349205454Cum Delta17746674611701226120511921292115210941111123314441172177822262186269427402954352035133660368237863626358635733652374738083907395638614015

6-inch Align(1st)Plan Orig100100100100100100100100100100100100100100100100100100100100100100100100100100100100100100100100100100100100100100100100100100100Plan as of 6/51001001001001001001220200120120120120150150150150150150150150150150150150150150150150150150150150150150150150150150150150150150Plan as of 6/101201204000208150150150150150150150150150150150150150150150150150150150150150150150150150150150Actual080300
UAT-Sree: Running 8inch Wafer0
UAT-Sree: Running 4inch Wafer77727812476173621251139601546510128190017359144201031341211632097165338758628047675Cum Delta(100)(120)(190)(290)(390)(413)(463)(385)(461)(505)(452)(510)(505)(792)(696)(904)(900)(985)(1034)(1156)(1116)(1266)(1243)(1334)(1340)(1470)(1517)(1533)(1562)(1549)(1679)(1732)(1717)(1834)(1897)(1989)(2077)(2147)(2250)(2333)(2478)

8-inch Align(1st)Plan300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300Actual27219617912125516013315918289191135262172729124724724023589147163218138175973930410722714982217259229236200145252207Cum Delta(28)(132)(253)(432)(477)(617)(784)(925)(1043)(1254)(1363)(1528)(1566)(1694)(1922)(2131)(2184)(2237)(2297)(2362)(2573)(2726)(2863)(2945)(3107)(3232)(3435)(3696)(3692)(3885)(3958)(4109)(4327)(4410)(4451)(4522)(4586)(4686)(4841)(4889)(4982)

6-inch Align(2nd)Plan Orig100100100100100100100100100100100100100100100100100100100100100100100100100100100100100100100100100100100100100100100100100100100Plan as of 6/51941220200120120120150150150150150150150150150150150150150150150150150150150150150150150150150150150150150150Plan as of 6/101201200400150217150150150150150150150150150150150150150150150150150150150150150150150150150150Actual401211000
UAT-Sree: Running 4" wafer SSI1158921481471274212669027109190587917319116019217884193502164056594556Cum Delta(60)(39)(39)(139)(239)(236)(351)(309)(234)(337)(381)(448)(453)(364)(743)(845)(915)(938)(1046)(1070)(1151)(1301)(1424)(1465)(1425)(1517)(1588)(1565)(1524)(1514)(1472)(1444)(1510)(1467)(1567)(1501)(1611)(1705)(1796)(1901)(1995)

8-inch Align(2nd)Plan300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300300Actual18612126339120617010859501036319130112981531722112661511972251601791421692101871242161831511784515224189243152146203Cum Delta(114)(293)(330)(239)(333)(463)(655)(896)(1146)(1343)(1580)(1861)(2031)(2219)(2421)(2568)(2696)(2785)(2819)(2968)(3071)(3146)(3286)(3407)(3565)(3696)(3786)(3899)(4075)(4159)(4276)(4425)(4547)(4802)(4950)(5009)(5220)(5277)(5425)(5579)(5676)

Cu Plate 6"+ 8" (Plater #3, #4 & #5)Plan150150150150150150150150150150150150150150150150150150150150150150150150150150150150150150150150150150150150150150150150150150150Plan (6/5)185185185185185185185185185185185185185185185185185185185185185185185185185185185185185185185185185185185185185Plan (6/13)295295295295295295295295295295295295295295295295295295295295295295295295295295295295Actual11512211518611380112158153161190139100015092801191391631251831888111810121423120323910832211244134213228196236223254Cum Delta(35)(63)(98)(62)(99)(169)(452)(479)(511)(535)(530)(576)(661)(846)(881)(1084)(1299)(1475)(1631)(1763)(1933)(2045)(2152)(2366)(2543)(2737)(2818)(2882)(2974)(3030)(3217)(3480)(3564)(3615)(3776)(3858)(3925)(4024)(4083)(4155)(4196)8" Ball Drop RDL/RPPlan75757575757575757575454545454545454545454545454545454545454545454545454545454545454545Plan (6/13)50505050505050505050505050505050505050505050505050505050Actual6772658068609817695382500123254710151139116334950207100757210025317599004810007310010075Cum Delta(8)(11)(21)(16)(23)(38)(15)8610669494(41)37171465661552212042032033604104354575074824634885374874374354854354585085585834+6+8 inch SnAg PlatePlan150150150150150150150150150150150150150150150150150150150150150150150150150150150150150150150150150150150150150150150150150150150Plan (6/5)185185185185185185185185185185185185185185185185185185185185185185185185185185185185185185185185185185185185185Plan (6/13)300300300300300300300300300300300300300300300300300300300300300300300300300300300Actual97128113163142861601721761741439311610610521010512611686144914226021313311422426630616556200256239302183193214202188Cum Delta(53)(75)(112)(99)(107)(171)(406)(419)(428)(439)(481)(573)(642)(721)(801)(776)(971)(1145)(1329)(1543)(1829)(2080)(2238)(2278)(2365)(2532)(2718)(2794)(2828)(2822)(2957)(3201)(3301)(3345)(3406)(3404)(3521)(3628)(3714)(3812)(3924)

Ball Drop ShippingPlan45454545454545454545454545454545454545454545454545454545454545454545454545454545454545Actual567537025002405035002073227715212125740502001815425437525252531149254812500123Cum Delta(242)(212)(220)(265)(285)(330)(375)(396)(441)(436)(446)(491)(536)(579)(624)(596)(619)(587)(617)(450)(370)(341)(386)(381)(226)(90)(81)(101)(103)(73)(93)(113)(133)(147)(43)(63)(60)20(25)(70)8

Plated Bump ShippingPlan181181181181181181181181181181181181181181181181181181181181181181181181181181181181181181181181181181181181181181181181181181181Actual114933219576150251778913668101311137610057471509017713688791238987190253115761071186920114299165252314185Cum Delta(912)(1000)(1149)(1135)(1240)(1271)(1427)(1431)(1523)(1568)(1681)(1761)(1911)(1979)(2084)(2165)(2289)(2423)(2454)(2545)(2549)(2594)(2687)(2789)(2847)(2939)(3033)(3024)(2952)(3018)(3123)(3197)(3260)(3372)(3352)(3391)(3473)(3489)(3418)(3285)(3281)

2961901011321432502502502502502502502252252252252257136-88-181-263Loading projection56%6" is 13000GDPW & 28000 by Dec-22,914,372-21,361,153-22,365,528-23,071,501-22,365,528-22,045,292-22,663,929-22,743,988-22,234,522-22,496,533-23,406,292-24,090,432-24,694,512-25,611,549-24,709,068-25,138,475-25,713,443-25,247,64644%Mastic is 19000GDPW with $0.09 & 22000 by Dec-14,357,789-15,138,398-16,288,334-1,563,287

Graph Source

PLT02W17W18W19W20W21W22W23W24W25W2627-Jun28-Jun29-Jun30-Jun1-Jul2-Jul3-Jul4-Jul5-Jul6-Jul7-Jul8-Jul9-Jul10-JulActual output (SWKS)575513611817921419913090115747325324973802951242032232172180Actual output (Others)%OEE 34%26%52%44%61%62%63%62%30%35%56%72%33%42%25%58%60%80%38%57%66%59%59%ERROR:#DIV/0!OEE Target70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%Daily Cap (WPD)2702672852982933463162322793233253253253253253253253703253553403703700PLT03W17W18W19W20W21W22W23W24W25W2627-Jun28-Jun29-Jun30-Jun1-Jul2-Jul3-Jul4-Jul5-Jul6-Jul7-Jul8-Jul9-Jul10-JulActual output (SWKS)85838666626165657182706950508860307960868780760Actual output (Others)95901241471198110613710100000000000000%OEE 80%69%73%73%60%86%82%50%71%73%70%69%50%50%88%60%30%79%60%66%87%80%76%ERROR:#DIV/0!OEE Target70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%Daily Cap (WPD)2252542842642101812081331001131001001001001001001001001001301001001000PLT04W17W18W19W20W21W22W23W24W25W2627-Jun28-Jun29-Jun30-Jun1-Jul2-Jul3-Jul4-Jul5-Jul6-Jul7-Jul8-Jul9-Jul10-JulActual output (SWKS)4980706034865974840751787280123701101341170Actual output (Others)9493108990.0000000000000280%OEE 64%78%86%60%34%66%59%74%84%0%30%71%72%80%77%70%76%84%81%ERROR:#DIV/0!OEE Target70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%Daily Cap (WPD)2252232081001001291001001001002502501001001601001451601450PLT05W17W18W19W20W21W22W23W24W25W2627-Jun28-Jun29-Jun30-Jun1-Jul2-Jul3-Jul4-Jul5-Jul6-Jul7-Jul8-Jul9-Jul10-JulActual output (SWKS)56124140182199106016874123161104103130941060Actual output (Others)20200000000000460%OEE 20%36%40%56%61%33%0%52%23%38%50%32%32%31%25%31%ERROR:#DIV/0!OEE Target70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%Daily Cap (WPD)2243323523253253253253253253253253253254153703430

OverallW17W18W19W20W21W22W23W24W25W2627-Jun28-Jun29-Jun30-Jun1-Jul2-Jul3-Jul4-Jul5-Jul6-Jul7-Jul8-Jul9-Jul10-JulActual output (SWKS)141138223184269356333311319423385415265823803853056154114625505255170PLT03Actual output (Others)1291051351391221742142670.0000000000000740PLT TypeWPDWafer in%%OEE 55%47%63%57%62%72%74%44%43%54%45%49%31%10%38%39%36%69%45%51%55%53%54%ERROR:#DIV/0!I,iiCuNiSnAg & CU_PLT (Cu Pillar)225140100%OEE Target70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%I,iiiCuNiSnAg & CU_PLT (RDL)3280%Daily Cap (WPD)49552156956263175074368981191785085085085010001000850895910910100010009580ivSN ( 1 metal )175Total140100%-109-161-83-105-31-115-116000000Weighted WPD225

Plating RecipeBD25aWPD (PLT02)MinMaxAveRecipePlatedERROR:#REF!cNiSnAg ( 1 Ni 4 SNAG metals )2002252131Target295dCU_PLT (Cu Pillar) ( 4 Cu metals )75100882eCU_PLT ( RDL ) ( 4 Cu metals )2502503fCuNiSnAg ( 1 Ni 1 Cu 4 SNAG metals )1251501384CU_PLT (Cu Pillar) ( 3 Cu metals )6080705CU_PLT ( RDL ) ( 3 Cu metals )1901906

WPD (PLT03)MinMaxAveiCuNiSnAg ( 1 Ni 1 Cu 4 SNAG metals )1251501381iiCU_PLT (Cu Pillar) ( 3 Cu metals )75100882iiiCU_PLT (RDL) ( 3 Cu metals )1901903ivSN ( 1 metal )1751754

ALG02Actual output (SWKS)WPD (PLT04)MinMaxAveActual output (Others)CU_PLT (Cu Pillar) ( 3 Cu metals )75100882%OEE CU_PLT (RDL) ( 3 Cu metals )1901903OEE TargetDaily Cap (WPD)ALG03Actual output (SWKS)Actual output (Others)%OEE OEE TargetDaily Cap (WPD)OverallActual output (SWKS)Actual output (Others)%OEE OEE TargetDaily Cap (WPD)

Plater Output SourcePlating Recipe103768913910916183aWPD (PLT02)MinMaxAveRecipePLT027-Apr8-Apr9-Apr10-Apr11-Apr12-Apr13-Apr14-Apr15-Apr16-Apr17-Apr18-Apr19-Apr20-Apr21-Apr22-Apr23-Apr24-Apr25-Apr26-Apr27-Apr28-Apr29-Apr30-Apr1-May2-May3-May4-May5-May6-May7-May8-May9-May10-May11-May12-May13-May14-May15-MayW17W17W18W19W2016-May17-May18-May19-May20-May21-May22-May23-May24-May25-May26-May27-May28-May29-May30-May31-May1-Jun2-Jun3-Jun4-Jun5-Jun6-Jun7-Jun8-Jun9-Jun10-Jun11-Jun12-Jun13-Jun14-Jun15-Jun16-Jun17-Jun18-Jun19-Jun20-Jun21-Jun22-Jun23-Jun24-Jun25-Jun26-Jun27-Jun28-Jun29-Jun30-Jun1-Jul2-Jul3-Jul4-Jul5-Jul6-Jul7-Jul8-Jul9-Jul10-Jul163
JH Park: JH Park:6" SnAgNiSnAg ( 1 Ni 4 SNAG metals )2002252131Actual RDL20020020020022520022522520020020000008956000100048255050143176
JH Park: JH Park:6" CopperCU_PLT (Cu Pillar) ( 4 Cu metals )75100882Actual output (Cu)63584984113128981399910543658558432110025120000014512373123180133133159154127103191132
Gsree: 1 SnAg bath and 2 Cu bath Down43
Gsree: 1 SnAg bath and 2 Cu bath Down891431045755136118246208230180162116
Gsree: Ni bath Down 108189137242302241244146
UAT-Sree: 2 Cu Bath down170
UAT-Sree: Machine Down for 8hrs25819220414814650848610614075901290000608125547374732532497380496054634854eCU_PLT ( RDL ) ( 4 Cu metals )2502503Actual output (NiSnAg)40416646755558406968225527430670492500039240382500021226019252000553415111300000000000000000000000070030000000000081103762313910916183493111511614664101
JH Park: JH Park:20 wafers on transaction key-in 112w over the past 12 hrs as of 7/071351191140fCuNiSnAg ( 1 Ni 1 Cu 4 SNAG metals )1251501384Actual output (SWKS + Others)10399115130188183156179168173651201121014388100741450003914716311114818013313316116615310321015763891431599171147131246208230180162116108189137242302241244146170168194279184139258192204148216501148610614075901290000141184101166212183234108137801881962951242032232172180CU_PLT (Cu Pillar) ( 3 Cu metals )6080705Daily Cap (WPD)328300300300300300300300300300300300300300283213213283283283283283138300300283283300283283283283300283300300300300300300270267285298300300300300283283283300300463463300300300300300300463283283283283283283283702132132132133053053053053053053053503253253253253253253253253253253253703253553403703700.754601227CU_PLT ( RDL ) ( 3 Cu metals )1901906%OEE 31%33%38%43%63%61%52%60%56%58%22%40%37%34%15%41%47%26%51%0%0%0%28%49%54%39%52%60%47%47%57%59%51%36%70%52%21%30%48%53%34%26%52%44%82%69%77%60%57%41%38%63%46%52%65%80%81%49%57%56%65%60%65%49%91%68%72%52%76%71%54%40%50%66%25%30%42%0%0%0%0%40%57%31%51%65%56%72%33%42%25%58%60%80%38%57%66%59%59%ERROR:#DIV/0!1&61&21&21&2&51&51&21&21&21&21&21&21&21&21&21&5111&51&541&21&21&51&51&21&51&51&51&51&21&51&21&21&21&21&21&21&21&21&21&51&51&51&21&21&31&31&21&21&21&21&21&21&31&51&51&51&51&51&51&551111111&51&51&51&51&51&51157.5176.4705882353OEE Target70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%(67)(134)(175)(221)(319)(416)(450)(543)(700)(811)(868)(622)(414)(184)(4)1582743825717089501252149317371883205322212415269428783017327534673671381939654015409941854291443145064596472547254725472547254785486648914856492950035076510150775126519952%65%28%45%60%53%51%WPD (PLT03)MinMaxAvePLT037-Apr8-Apr9-Apr10-Apr11-Apr12-Apr13-Apr14-Apr15-Apr16-Apr17-Apr18-Apr19-Apr20-Apr21-Apr22-Apr23-Apr24-Apr25-Apr26-Apr27-Apr28-Apr29-Apr30-Apr1-May2-May3-May4-May5-May6-May7-May8-May9-May10-May11-May12-May13-May14-May15-MayW17W17W18W19W2016-May17-May18-May19-May20-May21-May22-May23-May24-May25-May26-May27-May28-May29-May30-May31-May1-Jun2-Jun3-Jun4-Jun5-Jun6-Jun7-Jun8-Jun9-Jun10-Jun11-Jun12-Jun13-Jun14-Jun15-Jun16-Jun17-Jun18-Jun19-Jun20-Jun21-Jun22-Jun23-Jun24-Jun25-Jun26-Jun27-Jun28-Jun29-Jun30-Jun1-Jul2-Jul3-Jul4-Jul5-Jul6-Jul7-Jul8-Jul9-Jul10-JuliCuNiSnAg ( 1 Ni 1 Cu 4 SNAG metals )1251501381Actual RDL757575150150150150150150150150000000132
Gsree: 1 Snag bath Down and Machine 2.5hrs down109
Gsree: 1 SnAg bath down for 8 Hrs11796
Gsree: 1 Ni and 4 SnAg bath Down 818583866685
Gsree: 2cu bath Down 500
Gsree: 1 Cu bath Down 68
UAT-Sree: Ni Bath Down55
UAT-Sree: Ni Bath Down7775
UAT-Sree: Machine down for 5 hrs765075376215450756315752373777572667560627173689986118706950508860307960628780760iiiCU_PLT (RDL) ( 3 Cu metals )1901903Actual output (NiSnAg)142146125109152129801301309612116673130646071100899484146477597136759614914958202119151248179851001209590124147906815915811013011410073162583838899120160110351291301431192121941111181621521273400000000000000000240000ivSN ( 1 metal )1751754Actual output (SWKS + Others)21222117718322521518120522018317716913620218820517118518123520216814310018419018016824127810930313720126822919421796201179173210192857557208117209158178180164159148858016015816414919519717218917920520613428721718419523722419310960627173689986118706950508860307960868780760Daily Cap (WPD)2252252252253282253282252252252252252252252252252252252253282252253282252253282252253283282253282252253283283282251902542252542842641901901902252252252252252252252252257070250250250250250250250328100100100100100100100100100100100100100100100100100140100150100100100100100100100100100130100100100%OEE 94%98%79%81%69%96%55%91%98%81%79%75%60%90%84%91%76%82%80%72%90%75%44%44%82%58%80%75%74%85%48%93%61%89%82%70%59%96%51%81%80%69%73%73%45%39%30%92%52%93%70%79%80%73%71%66%121%114%64%63%66%60%78%79%69%58%50%75%63%15%75%23%73%77%75%72%66%75%60%62%71%73%68%71%86%79%70%69%50%50%88%60%30%79%60%66%87%80%76%ERROR:#DIV/0!1&21&21&21&21&31&21&31&21&21&21&21&21&21&21&21&21&21&21&21&31&21&21&31&21&21&31&21&21&31&31&21&31&21&21&31&31&31&233331&21&21&21&21&21&21&21&21&2221&21&21&21&21&21&21&21&21&21&31&31&21&31&31&31&31&31&31&31&21&21&21&21&2OEE Target70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%177147(2)(134)(234)(364)(464)(505)(538)(592)(507)(432)(375)(257)(208)(158)(158)(90)(40)106914421326834542049654662165872087492499910621077115211751248132514001472153816131673173518061879194720462132225023202389243924892577263726672746280628682955303531113111WPD (PLT04)MinMaxAvePLT04W17W17W18W19W2016-May17-May18-May19-May20-May21-May22-May23-May24-May25-May26-May27-May28-May29-May30-May31-May1-Jun2-Jun3-Jun4-Jun5-Jun6-Jun7-Jun8-Jun9-Jun10-Jun11-Jun12-Jun13-Jun14-Jun15-Jun16-Jun17-Jun18-Jun19-Jun20-Jun21-Jun22-Jun23-Jun24-Jun25-Jun26-Jun27-Jun28-Jun29-Jun30-Jun1-Jul2-Jul3-Jul4-Jul5-Jul6-Jul7-Jul8-Jul9-Jul10-JulCuNiSnAg ( 1 Ni 1 Cu 4 SNAG metals )1251501381Actual RDL000000132
Gsree: machine Down for 9 hrs3915137757774717875509910064505075724873735725354747025562578731251155850100597484075178728080708680890CU_PLT (RDL) ( 3 Cu metals )1901903Actual output (NiSnAg)8012040136251001016880143135821181231159011011698901304556127146881108814610913600000000000000004302454280CU_PLT (Cu Pillar) ( 3 Cu metals )75100704Actual output (SWKS + Others)1511707717517613717614515421421315716822221515416016617316217811812918417112315713514613419225787312511558501005974840751787280123701101341170Daily Cap (WPD)225225225225225225225225225225100100100100100100100100100100100100100100100100100100100100100100100100175175100100150100100100100250250100100160100145160145%OEE 67%76%34%78%78%61%78%64%68%95%78%75%50%99%100%64%50%50%75%72%48%73%73%57%25%35%47%47%0%25%56%25%78%73%71%66%58%50%67%59%74%84%0%30%71%72%80%77%70%76%84%81%ERROR:#DIV/0!OEE Target70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%Recipe1&21&21&21&21&21&21&21&21&21&21&21&21&21&21&21&21&21&21&21&21&21&21&21&21&21&21&21&21&21&21&21&21&21&21&2WPD (PLT05)MinMaxAvePLT0529-May30-May31-May1-Jun2-Jun3-Jun4-Jun5-Jun6-Jun7-Jun8-Jun9-Jun10-Jun11-Jun12-Jun13-Jun14-Jun15-Jun16-Jun17-Jun18-Jun19-Jun20-Jun21-Jun22-Jun23-Jun24-Jun25-Jun26-Jun27-Jun28-Jun29-Jun30-Jun1-Jul2-Jul3-Jul4-Jul5-Jul6-Jul7-Jul8-Jul9-Jul10-Jul0.9079754601148
JH Park: JH Park:8" SnAgCuNiSnAg ( 1 Ni 4 SNAG metals )2002252131Actual RDL0025755025179
JH Park: JH Park:8" CopperCU_PLT (Cu Pillar) ( 5 Cu metals )75100882Actual output (Cu)085989715009566421311341742249716523620964859812518219910601687412352810015350CU_PLT (RDL) ( 4 Cu metals )1901903Actual output (NiSnAg)000326212120001200000000000000000015676685529460CU_PLT (Cu Pillar) ( 3 Cu metals )6080704Actual output (SWKS + Others)0859812977121295664214313417422497165236209648598125182199106016874123161104103130941060Daily Cap (WPD)883013013013017070225225225375375375375375375375325325325325415325325325325325325325325325325415370343%OEE 0%28%33%43%26%17%17%42%29%19%38%36%46%60%26%44%63%64%20%26%30%30%56%61%33%0%52%23%38%50%32%32%31%25%31%ERROR:#DIV/0!OEE Target70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%Recipe21&21&21&21&2441111&21&21&41&41&41&41&41&40.1111111111Power Supplu IssueOverall7-Apr8-Apr9-Apr10-Apr11-Apr12-Apr13-Apr14-Apr15-Apr16-Apr17-Apr18-Apr19-Apr20-Apr21-Apr22-Apr23-Apr24-Apr25-Apr26-Apr27-Apr28-Apr29-Apr30-Apr1-May2-May3-May4-May5-May6-May7-May8-May9-May10-May11-May12-May13-May14-May15-MayW17W17W18W19W2016-May17-May18-May19-May20-May21-May22-May23-May24-May25-May26-May27-May28-May29-May30-May31-May1-Jun2-Jun3-Jun4-Jun5-Jun6-Jun7-Jun8-Jun9-Jun10-Jun11-Jun12-Jun13-Jun14-Jun15-Jun16-Jun17-Jun18-Jun19-Jun20-Jun21-Jun22-Jun23-Jun24-Jun25-Jun26-Jun27-Jun28-Jun29-Jun30-Jun1-Jul2-Jul3-Jul4-Jul5-Jul6-Jul7-Jul8-Jul9-Jul10-JulPLT02Actual RDL275275275350375350375375350350350000000000000000000000000000000000000000089000056000100073100100750abActual output (Cu)13313310115818621419921418919299681481301671662001102121411182296170210127228252225262210255145153211182152206239185141138223184331283287369261203147408224367438390384279322293369429323226370506424368297138216229280306328296394355182305380467328267288416385415265823803853052132281962362232540acPLT TypeWPDWafer in%Actual output (NiSnAg)182187191155227184138170199164143221100173641277114911494841468677137174100961491496021414515126720410510001751291051351390001701881992941352302151681531591601652012112142102702261332192923201873813401992282622982361700008110376231391091618349311151163021831932142021880dfNiSnAg & CU_PLT ( Cu Pillar )30012371%Actual output (SWKS + Others)3153202923134133983373843883562422892483032312932712593262352021681822473473013283483744112704692903044783862573062393602712443573233312832875394494024415434545826065435434394874945806435334965966396436606173255975694795345905946305251823053805484313433115554945763481314115004215154114625505255170deNiSnAg & CU_PLT ( RDL)4635029%Daily Cap (WPD)5535255255256285256285255255255255255255255084384385085086115085084655255256105085256116105086105255086286286285254905544955215695624904904907507337337337507509139137505954706506506508136336337201011783783783340483638638638880880880880880880880950925890850104085085085085010001000850895910910100010009580CuNiSnAg & CU_PLT ( RDL )3280%%OEE 57%61%56%60%66%76%54%73%74%68%46%55%47%58%46%67%62%51%64%38%40%33%39%47%66%49%65%66%61%67%53%77%55%60%76%61%41%58%49%65%55%47%63%57%68%58%59%72%61%55%60%72%61%64%66%72%91%93%75%76%89%79%84%78%83%63%82%84%79%96%124%89%75%84%67%68%72%60%21%35%43%49%47%39%37%53%58%68%41%15%41%50%50%58%45%51%55%53%54%ERROR:#DIV/0!OEE Target70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%70%CuNiSnAg & CU_PLT ( Cu Pillar )2080%19%19%16%28%38%43%33%46%33%35%14%22%28%19%15%10%47%9%42%0%0%0%0%48%41%26%44%(50)(63)(128)(223)(453)(650)(814)(1007)(1205)(1349)(1460)(1129)(846)(559)(190)7127442182910531420185822482632291132333526389543244647487352435749617365416838697671927421770180078335863190259380956298671024710714110421130911508119241230912724129891301513395137801408514198144261454914685148081498714987Total173100%Weighted WPD34764334925157121820.337777777805249100257824

PLT03PLT TypeWPDWafer in%I,iiCuNiSnAg & CU_PLT (Cu Pillar)208140100%I,iiiCuNiSnAg & CU_PLT (RDL)3280%ivSN ( 1 metal )175Total140100%Weighted WPD208

ALG028-Jun9-Jun10-Jun11-Jun12-Jun13-Jun14-Jun15-Jun16-Jun17-Jun18-Jun19-Jun20-Jun21-Jun22-Jun23-JunPlan (Input wafer)450450450500500500500500500500500Actual output (SWKS)
Gsree: 1 SnAg bath and 2 Cu bath Down
Gsree: 1 SnAg bath and 2 Cu bath Down
Gsree: Ni bath Down
UAT-Sree: 2 Cu Bath down
UAT-Sree: Machine Down for 8hrs21725513230028910119237634229638900000Actual output (Others)167181207100144250231685013513900000Actual output (SWKS + Others)38443633940043335142344439243152800000Daily Cap (WPD)550550550550550550550550550550550550550550550550%OEE 70%79%62%73%79%64%77%81%71%78%96%0%0%0%0%0%OEE Target80%80%80%80%80%80%80%80%80%80%80%80%80%80%80%80%

ALG038-Jun9-Jun10-Jun11-Jun12-Jun13-Jun14-Jun15-Jun16-Jun17-Jun18-Jun19-Jun20-Jun21-Jun22-Jun23-JunPlan (Input wafer)650650650650650650650650650650650Actual output (SWKS)
Gsree: 1 Snag bath Down and Machine 2.5hrs down
Gsree: 1 SnAg bath down for 8 Hrs
Gsree: 1 Ni and 4 SnAg bath Down
Gsree: 2cu bath Down
Gsree: 1 Cu bath Down
UAT-Sree: Ni Bath Down
UAT-Sree: Ni Bath Down
UAT-Sree: Machine down for 5 hrs14824819033219716510034430835314600000Actual output (Others)36640044230322143639723634123940400000Actual output (SWKS + Others)51464863263541860149758064959255000000Daily Cap (WPD)650650650650650650650650650650650650650650650650%OEE 79%100%97%98%64%92%76%89%100%91%85%0%0%0%0%0%OEE Target80%80%80%80%80%80%80%80%80%80%80%80%80%80%80%80%

Overall8-Jun9-Jun10-Jun11-Jun12-Jun13-Jun14-Jun15-Jun16-Jun17-Jun18-Jun19-Jun20-Jun21-Jun22-Jun23-JunPlan (Input wafer)1100110011001150115011501150115011501150115000000Actual output (SWKS)36550332263248626629272065064953500000Actual output (Others)53358164940336568662830439137454300000Actual output (SWKS + Others)89810849711035851952920102410411023107800000Daily Cap (WPD)1200120012001200120012001200120012001200120012001200120012001200%OEE 75%90%81%86%71%79%77%85%87%85%90%0%0%0%0%0%OEE Target80%80%80%80%80%80%80%80%80%80%80%80%80%80%80%80%

Plate Log DateWWDown TimeMC #Issue / CauseActionRespECDStatusPM Doc ? (Y/N)Spare Part List (Y/N)Categorize6-JunW242nd 2QDR Down for PLT02 ( Unable to control N2 pressure in QDR Cell )- Temporarily modify the tubing in order to regulate N2 pressure. - Corrective measure is to replace the speed controller.MugilanTBDOpen ( Waiting for the quotation of speed controller)OPenNA for now but to be updated (TBD)PMRow LabelsCount of Categorize7-JunW242nd NA3.30pm to 7pm Air Cond Down ( Chiller system auto stop by chilled water flow safety switch due to heat exchanger pipe broken )1. Stop the vacuum pump and switch over to stand-by unit and isolated the system. 2. Refill the chilled water and release the air that trapped inside the pipe line.Facility20-JunReplace the chilled water pipe direct metal coupling with rubber flexible join to mitigate the vibration effect during pump operationYNA since the spare part is enoughFaci' PMProcess Optimization2Proc' Optimization38-JunW241stNA7pm to 10.10pm Air Cond Down ( Chiller system auto stop by chilled water flow safety switch due to heat exchanger pipe broken ) Facility20-JunYFaci' PMPM11Equip PM129-JunW242nd NA8" Skywork lot's disconnect due to No MapSWKS to proceed & manual Download thru IT contactSK Sitt10-JunDoneNANAOperationSpare Part Failure3Spare Part Failure310-JunW241st / 2nd2Cu bath was down for 8 hrs due to the checmical concentration issue. The Root cause was the worn out O-Ring in the Pump Turbine. Change the O-Ring of Pump Turbine.Process Eng (PS Lee) / Manf tech / Mugilan10-JunDoneClosed (Doc #)NAPMFaci' PM2Faci' PM210-JunW241st / 2nd51Ni / 2Cu Bath have been down since 6/09 9:25pm due to the abnormal Bump Height. - Different design was employeed for 8" Anode Holder(Original Design allegedly obsoleted in the market), which is suspected to cause the low chemical activation level & the abnormally layered bubble at Anode plate. TEL/NEXX service engineer recommended to raise up the chemical level of Anode in order to ensure the full coverage of Anode by chemical and its efficacy is to be verified by 10:00PM.See Thoh / Rashpal17-JunN/AOpenNAOptimizationOther1Other110-JunW241st / 2nd51Ni / 2Cu Bath have been down for ~48 hrs due to the incorrectly wrought assembly of 8" Anode Holder by UAT technician.- Retrain the technician & publish the OPL for this issue - Obtain the complete set of PM Procedure from TEL/NEXX Rashpal / CW ChaiTBDOPL#?OpenNAPMGrand Total1910-JunW241st / 2ndNASince 6/10, SAT has been down due to power supply contorl board failure, further affecting the entire plating line's daily output.- Replace the new Power Supply IC board (Vendor Name:OEM Group)Rashpal / CW Chai22-JunDoneOpenOpenSP12-JunW241st / 2nd2Thermo-exchanger unit of Cu cell is down indefinitely not to properly control the bath temp.- Best Arrival time of replacement Temp Controller is alleged to be 06Aug. - UAT to keep on pulling in the delivery date.Rashpal / CW Chai6-AugOpenClosed (Doc #)OpenSP13-JunW251st / 2nd4New Shield from local "MMTSB" triggerd the abnormal bump issue due to the quality of Teflon screen.- Reinforce the piece part incoming procedure / PM check list.- Request the relevant 8D report.RashpalOpenOPL #OpenOpenPM15-JunW25244Incompletely cleansed Anode (by UAT technician) created Nodule defect to later cause the abnormal bump.- Retrain the technician & publish the OPL for this issue RashpalOpenOPL #OpenOpenPM17-JunW25244Low Bump Height due to Anode contamination caused by the existing dosing methodology- Collectively address thru the historical data summary & mutual risk-mitigating review on low bump wafersSee ThohOPenOpenPM17-JunW25932Transporter Motor down presiding the whole moving mechanism of Plater#2 then after replacing with the spare motor, this one was down at 10:00PM 6/17.- Replace with the spare motor - During test run the spare motor was also down. - Motor to be shipped from Hermes(Agent) SNP W/H to arrive 4:00PM 6/19 and production to resume 05:00AM 6/20.Rashpal21-JunDoneOpenYPM18-JunW25124Clogged filter caused the low Chemical flow at Metal#8- Change the chemical flow filter.- Mugi to revisit the filter changing Freq in consideration of Anode Burning factor.Mugilan6/197/12DoneOpenYPM18-JunW25245Metal#6 & 7 were down by Engineering but Metal#7 was released at 9:00am 6/19Process optimization for Newly designed Anode Holder & Anode Bag/ShieldProcess Eng19-JunDoneOpenOpenOptimization19-JunW25NANAUpstream Mastic Wafer's unexpected Oxidization Issue affecting 56 Wafers in total.HW related action is not required but the timely 'Engineering Decision' for the downstream WIP is required.MK & See Thoh20-JunDoneNANASP19-JunW25NA5270ea of wafers are pending for Post_Cu_PLT Oxidization wafers' treament at Plater#2's Cleansing stage that is also pending for fixing Plater#2's transport Motor assy.- Engieering to take the feasibility study of utilizing Plater#5 for 6 inch. See Thoh6-AugCovered thru the separate actionNANAPM20-JunW26292Plater#2 has been down not for the Motor problem but later turned out to be from the Sensor misalignment issue - Problem was fixed by TEL/NEXX Service Agent Engineer MugilanDoneDoneOpenOpenPM21-JunW262Still intermittent malfunction of Motor due to the Sensor Alignment issue. As of 12:00PM 6/22, Plater#2 is working but not sure the intermittent issue is addressed.- TEL/NEXX Service Agent Engineer is to revisit the sensor alignment status.22-JunW2624NASAT(Oxidation cleansing machine mainly for 6" GaAs wafers) machine has been down from 6/18 due to Power Supply Unit failure- Mugi to work to fix the PS unit thru the conf call'- Semitool SE agent to come UAT by 6/23AM Mugilan23-JunDoneOpenOpenPM23-JunW26242One Cu cell(#6) have been down for rough surface bump. - Process engineering have been working on to fix it thru the additive optimization.- Arrival of new Temp Controller Unit by 7/02See Thoh23-Jun02-JulNANANAProc23-JunW26124One Cu cell have been down for high bump Height. Process engineering to perform the mapping study per Wafer Holders in order to identify the specific wafer holders so that the culprit holders can be excluded from the production ultimately.See Thoh24-JanDoneNANAProc23-JunW26125Four Cu cell have been down : 2 Cells for Bump Height and other 2 cells for regular monthly PM (Anode Cleaning). Applied Current is to be examined by TEL/NEXX team for the stability check for Cu cells. See Thoh24-JanDoneNANAPM23-JunW26245Four Ni Snag cell have been down : 5 Cells for chemical flow not stable- TEL/NEXX Service Agent Engineer halted the machine and look into the chemical flow issue on 06/24 .Mugilan / PS Lee24-JanNANANAPM24-JunW2682Activation related low efficinecy due to SAT machine was down for AM of 6/23- SAT Machine has been up and running from the afternoon of 6/23Mugilan 23-JunDoneNANAOverlap6/25/2015 to 6/26/15W26365Two Cu_Cells have been down for recurring Bump Height issue while all SnAg cells have been on Dry Running.- Address thru the best expertise of senior TEL/NEXX engieering for the repeated Cu-Cell Bump Height Issue.CW Chai29-JunNANANAproc26-JunW26??272w of ZH043 were on hold due to the Solder Height issue - Engineering review for Solder Plating condition optimizationSee Thoh29-JunNANANAProc26-JunW2664Found the backside contamination from the standby wafers, not to be loaded on time- Process engineering to modify the Post-Descum inspection log for adding the backside contamination check MK Foo29-JunNANANAOperation29-JunW27103Machine down for check Transporter Motor sensor cableChange the sensor cable Mugilan29-JunDoneOpenYPM29-JunW2782Down for checking the hair line crack of all 6" GaAs wafersStart mapping of wafer holders ,CRS and machine auto loader not just for the plating process but also upstream process of Plating.CH Goh / Mugilan / Rashpal29-JunCovered thru the separate actionNANAPM30-JunW27245Machine down for vendorNASee Thoh30-JunNANANAPM30-JunW271236" can run due to wafer breakage issue to convert to 8" not enoutht WH and CRS . 8" N WH used on PLT02 Cu / PLT05 for skywork1. Take WH from PLT05 and PLT04 8" N WH used for Skywork which alocated for other customer. 2.To keep more WH and CRS inventorry . Will have another 5 WH and 6 CRS end next week. Mugilan30-JunDoneNANASP30-JunW272446" can run due to wafer breakage issue to convert to 8" not enoutht WH and CRS . 8" N WH used on PLT02 Cu / PLT05 for skyworkDoneNANASP6/30 to 7/1W27242 NiSnAg Cell : Down since 6/30 early afternoon due to the N2 Regulator malfuction that triggered the adjacent Ni bath dillutedCu Cell : Hold for loading 6" over 26w of wafer broken after Cap-SnAg plating- Drain out chemical and pour new chemical Status : Began to run from 09:00AM 7/1- Locating the culprit tool is not viable as of 7/01 after checking the equipment / zig / wafer holder. Ch Goh3-JulDoneOpenOpenPM1-JulW2764DI Water pipe leaking Get vendor in to replace the leaking pipeMugilan1-JulDoneNANAFaci' PM7/1/2015 to 7/2/2015W272451 Snag_Cell ( Metal 1 ) and 3 Cu_Cell ( Metal 6,8 and 9 ) down.1.Metal 8 already release run 2 life wafer2.Metal 6 burn anode until 12.30pm than measure bump hieght. 3.Metal 1 and 9 still verifying dataSee Thoh2-JulDoneOpenOpenProc1-JulW27NA2Low Cu Plate output due to Wafer feeding disconnection from the prior Descum processProduction supervisor to investigate & provide the corrective action report for the recurrence preventionAmir2-JulOpenNANAOperation1-JulW2767512SnAg cells being used for Top-Up over the low SnAG Bump Height of ZH043 - Collectively address thru the historical data summary & mutual risk-mitigating review on low bump wafersSee ThohOn-goingOpenNANAproc1-JulW27NA4Low Cu Output at Plater#4 due to the insufficient inventory of 8" Notch Wafer Holder- 10ea of 8" Wafer Holder will be ready with 5ea by W29 & 5ea by W30. - Perform the inventory check of existing Wafer Holder for both 6" & 8" and assess the suitability against 4 Plater's same wafer size running scenarioSree24-Jul

03-JulDonesp1-JulW27145Low SnAg output for Plater#5 due to the low SnAg Bump height due to Cu Bump Uniformity issue - Collectively address thru the historical data summary & mutual risk-mitigating review on low bump wafersSee ThohOn-goingOpenProc2-JulW27NA4Belated transaction of one wafer lots(25 w) to be added to the following day output. NANANANANANAOperation2-JulW272451.All Cu cells have benn down for Chemical Dump evaluation2.Low SnAg output as the capacity was consumed by Top-up rework for Low SnAg Bump Height wafers (52 wafers)1. Proceed the Chemical Dump evaluation by 7/04 AM2. Collectively address thru the historical data summary & mutual risk-mitigating review for the low bump wafersSee Thoh / PMOn-going1. Done

2. OpenProc3-JulW27203- Two Cu_Cell Metal 8 & 10 down for Anode cleaning regular PM.Burn anode & Buy-off and measure bump hieght. Why 20 hrs ?Process Eng / AmirOn-goingOpenNAPM3-JulW2745- Four SnAg cells were down for 4 hours to check the Bump Height of 6" cells.Not Available - Engineering review activity on the chemical & parametric condition checkSee thohNADoneNAProc5-JulW28421.Power supply failure ( Fuse burn out )2.Transporter Tubing leak3. 30 ea of 6" wafers on hold due to low Bump Height 1. Replace with the new fuse.2. Change with the new tubing and update the relevant PM check list. 3. Confirm the measurement data and Check thru 3D inspection if necessary Line tech / MugilanDoneDoneNANAPM5-JulW28125NiSnAg feeding disconnection due to Low 8" Post_Cu_Plated_WIP while Plater#5 Cu cell has been down for daysRelease #7 & #8 Cu_Cells for production after Chemical Dump & LeachingSee Thoh8-JulClosedOperation5-JulW28203One Cu Metal#9 was down for Anode cleaning regular PM.Burn anode & Buy-off and measure bump hieght. Why 20 hrs ?Process Eng / AmirDoneOpenNAPM6-JulW2872QDR was down during CRS cleaning- Change "O" ring and service valve- Any update on installing the speed controller ?Line tech / HadiDoneDoneOpenOpen6-JulW28631. CRS cleaning was taken 3 hrs.2. Air Leakage issue due to CDA (Compressed Dry Air) tubing SC Ooi and Mugi to look in the root cause of tubing leakage and take the preventive action or reflect in PM document SC Ooi / MugilanDoneOpen7-JulW2895Plater#5's SnAg cells were used for Topping-up rework in order to process the aged Low Bump Height wafers- Collectively address thru the historical data summary & mutual risk-mitigating review on low bump wafersSee ThohOn-goingOpen8-JulW28195SnAg cells were mostly used for 75wafers' Top-Up processing, which could not be logged as production output- Collectively address thru the historical data summary & mutual risk-mitigating review on low bump wafersSee ThohOn-goingOpen8-JulW2852SnAg cells were mostly used for 23wafers' Top-Up processing, which could not be logged as production output- Collectively address thru the historical data summary & mutual risk-mitigating review on low bump wafersSee ThohOn-goingOpen9-JulW2852Regular PM (CRS cleaning + 18 wafers of Top Up on low bump wafers)- Collectively address thru the historical data summary & mutual risk-mitigating review on low bump wafersSee ThohOn-goingOpen9-JulW281651.Cu cell Metal 7 release on 3pm / cu cell metal 8 release on 10am / Cu cell Metal 9 / 10 release on 5pm2. Top up 18 wafer for NiSnag + Less Nisnag supply from PLT02

212:15 ~ 03:00313:30 ~ 16:50Bump Ht + Build up on CRS

Align LogDateShift (1st / 2nd)Issue / CauseActionRespECDStatusPM Doc ? (Y/N)Spare Part List (Y/N)7-Jun-152nd 3.30pm to 7pm Air Cond Down ( Chiller system auto stop by chilled water flow safety switch due to heat exchanger pipe broken )1. Stop the vacuum pump and switch over to stand-by unit and isolated the system. 2. Refill the chilled water and release the air that trapped inside the pipe line.Facility20-JunReplace the chilled water pipe direct metal coupling with rubber flexible join to mitigate the vibration effect during pump operationYNA8-Jun-151st7pm to 10.10pm Air Cond Down ( Chiller system auto stop by chilled water flow safety switch due to heat exchanger pipe broken ) Facility20-JunYNA6/7 ~ 6/8Allocation Balance + Mask contamination of 8"Spare Mask Fabrication for Mastic & RaqutteNL Loh11-Jun6/8 ~ 6/9Allocation Issue to be recovered thru replanningReplanningSree / Rashpal

Plater JournalDate17-JunOEEERROR:#REF!Overall Except for Plater#3, overall output performance of Plating machines has been marred by the series of specific issue at 3 sets of Platers ;Plater#2On 6/12 & 6/17, Temp Controller malfunction affecting the Cu cell performance(since 6/12 ~ now) while not affecting Ni-SnAg cells at all. But Today(6/17 Morning), its transporting motor unit was down to be replaced with the spare one but to cause the low output. Plater#3No significant issuePlater#4For 6/13 ~ 6/15, Defective Shield with the burred Teflon screen / Incompletely cleansed Anode spawning the Nodule defect & abnormal bumpPlater#5From 6/10AM ~ Now, Combined impact of incorrectly assembled Anode Holder(by UAT PM team) whose design was also changed from the previous version, which prompted TEL/NEXX engineers re-defining the chemical level optimization with Anode.Date18-JunOEEERROR:#REF!Overall New Problems arose with Plater#2 Plater#2The whole system has been down since 6/17 11:00AM due to the initial failure of Transporter Motor followed by the spare motor's failure as well. Though another spare was located in SNP W/H of agency company, considering the logistic arrangement & defined Buy-Off, the estimated production commencement time would be 05:00AM 6/20. Plater#3No significant issuePlater#4Down for 24 hrs on 6/17 due to the controversial PM & subsequent Buy-Off of Cu Cell Plater#5Cu_Cell Anode Holder verification dry run has been going from 6/17PM to be finished by 11:00PM 6/18 for the mass production run. Its NiSnAg output met the target output.Date19-JunOEEERROR:#REF!Plater#2Waiting for the arrival of Transport Motor by 04:00PM 6/19. Estimated Production start is from 05:00AM 6/20 after installation/Dry Run/Buy-Off for the newly arrival motor setPlater#3No significant issuePlater#4One Cu cell is down(#8) due to low chemical flow caused by clogged filiter which was replaced but, resulting in 16% of Efficiency loss. UAT equipment engineeing is to revisit the existing filter change frequency for correctve actionPlater#5One Cu Cell (#6) has the higher Bump Height in the Opposite area of notch side. Being suspected of newly designed Anode Holder & Shield combination eroding 20% OEE, continuous process monitoring/optimization is required by 6/26. Date20-JunOEE35%Plater#2Newly arrived Motor could not be successfully installed for 6/19 17:00 ~ 23:00 due to sensor align issue. With presence of TEL/NEXX engineer in place from 13:00 6/20, the installation has been done by 16:00 to be on the subsequent Anode burning by 23:00 6/20 for the production run start. 3.875Plater#3No significant HW issue for both machines itself but due to the upstream 8" WIP disconnection : With the unexpected Oxidization found from 56ea of Mastic wafers even prior to Cu Plating process, these wafers have been on engineering hold into Plater#2's activization step until its Motor is fixed, which could have been proceeded thru the manual loading though. CW Chai vowed to proceed them thru the manual loading at Plater#2's activization step from 6/20.Plater#4Plater#5Not related to HW issue but due to Less SnAG output by insufficient 8"-Post-Cu-Plate-WIP since Plater#5 is capable of 8" wafer only while the abundance of 6" wafer Post-Cu-Plate-WIP(270 wafers) is waiting for Plater#2. UAT engineering agrees on 6" convertibility study for Plater#5 with ECD to be determined.Date21-JunOEE43%Plater#2After going thru the Bump thickness / Shear test / Void ckeck thru X-Ray, the production started from 14:30 6/21 finally after ~4 days of complete machine downPlater#3No significant issue with 6" Cu_PlatePlater#4No significant issue with 8" Cu_PlatePlater#5Though the output of Cu_Plate was on target with 73w@6/20, SnAg_Plate output could not meet the target due to the insufficent upstream Post_Cu_Plate_WIP primarily caused by the unexpected 8" Mastic Oxicidization issue and ripple effect of previous HW issue of Plater#4 & Plater#5 over 6/17~6/19Date22-JunOEE58%Plater#2After undergoing some intermittent issue by the sensor alignment of Transporter Motor, the machine has been running from 6/22 07:00AM without major issue thus its half-day output is expected to be moderately OK, while its NiSnAg output can be impacted by SAT machine issue(temporary slow down of 6" wafers' Oxidization Cleansing) Plater#3No significant HW issue is reported / observedPlater#4No significant issue and its NiSnAg cells are specially arranged for SWKS 6" wafers for one day to make up for the past shortfallPlater#5No significant HW issue is reported / observedDate23-JunOEE47%Plater#2One Cu Metal(#6) has been down for 12 hrs due to the chronic Rough Bump issue which is to be permanantly addressed thru replacing the new Temp Controller Unit in Cu Cell.Plater#3No significant HW issue is reported / observedPlater#4One Cu cell have been down ~ 12 hrs for high Bump Height. Process engineering mapping analysis for culprit Wafer Holder causing the chronic Bump Height issue has commenced while the Gap anaysis between 'Good Performing #3' has started for the subsequent internal machine-benchmark.Plater#5Four out of four Cu_Cell have been down for 18 hrs due to the Bump Height issue suspected from the Current(Amp) instability among Cu_Cells. Tel/NEXX engineer has been working on to assess the current stability and will stay until the issue is fixed.Date24-Jun

Plater#2One Cu_Cell(#6) has been down for 24 hrs to go thru the cycle of Anode Cleansing, Anode Burn, Dummy verification buy-off , which should have been finished within 12 hrs but extended due to the manpower shortfall of technicians. Plater#3No significant HW issue is reported / observed for 11 days in a row.Plater#4One Cu_Cell(#7) has been down for 24 hrs - longer than the desired cycle time due to the stretched manpower shortfall.Plater#5- In the wake of Cu Bump Height related HW Down since Yesterday, All five Cu_Cell have been down for 24 hrs due to TEL/NEXX engineer's thorough review though his finding ending up with typical 'Dirt Anode'. Now all five Cu_Cells are in final stage of Buy-Off to be released for production by 07:00PM 6/24. - For SnAG cells that have been down for 18 hrs due to the intermittent sensor malfuction causing the low 'Chemical flow' in bath, TEL/NEXX engineer is still working on to find the root cause. Date25-JunPlater#2No major HW issue for both Cu & NiSnAg cells as #6 Cu cell was fixed on 6/24 to be on production.Plater#3No significant HW issue is reported / observedPlater#4No major HW issue as #7 Cu Cell was fixed on 6/24.Plater#5- Three Cu-Cells out of 5 cells are running for Cu_plate but the other two cells are suspected of the recurring Bump.- Two SnAg cells were running during night shift with other two SnAg cells down due to Sensor maifucntion issue, but from 10:00AM, those two working cells were down as well in order to check the chemical level. By 08:00PM, all SnAg cells are expected to up & running.Date26-JunPlater#2No major HW issue is reported / observed. But 72 wafers could not be logged on 6/25 as production output due to the low SnAg Bump Height issue.Plater#3No major HW issue is reported / observedPlater#4No major HW issue is reported / observed. Meanwhile, 25 wafers could not be loaded on 6/25 to cause machine idling of ~ 3 hrs due to the contamination found on wafer backside at the preceding process (Descum). Corrective action was taken to reinforce 100% inspection (from the existing sample base plan : One out of 25 Wafers) after Descum. Plater#5- For 2 days in a row, Two Cu_Cells(#6 & #8) have been down for the recurring 'Uneven Bump Height' issue while other Three Cu-Cells have been OK. Until arrival of senior TEL/NEXX engineer on 6/29, the propsect of fixing #6 & #8 Cu_Cell is not positive.- Two SnAg cells have been partially running but other two SnAg cells were down until 04:00PM due to the chemical level check. After subsequent check & buy-off, UAT expects all SnAG cells would be running from 06:00PM 6/26.Date27-JunPlater#2No major HW issue is reported / observed with 65% OEE markedPlater#3No major HW issue is reported / observed with 79% OEE markedPlater#4No major HW issue is reported / observed with 67% OEE markedPlater#5- For 3 days in a row, Two Cu_Cells(#6 & #8) have been down for the recurring 'Uneven Bump Height' issue with 3 Cu-Cells(#7, 9, 10) have been OK. Team expects the senior TEL/NEXX engineer's arrival on 6/29 to fix them.- Due to the consecutive check on the chemical flow level & lengthy buy-off, SnAg cell's uptime was limited to have only 11% OEE 6/26. In the meantime, no major HW is reported on 6/27 to let team expect moderate SnAg output on 6/27.Date30-JunPlater#2- Cu Cell : Switched to 8 inch loading while 6 inch loading was halted due to wafer crack issue found after SnAg plating.- NiSnAg Cell : Down since 6/30 early afternoon due to the N2 Regulator malfuction that triggered the adjacent Ni bath dilluted. The expected recovery time is by early Morning of 7/1 Plater#3No major HW issue is reported since Plater#3's Transporter Motor cable was replaced on 6/29 after 10 hrs down.Plater#4No major HW issue is reported / observed. On top of Cu_Cell allotment, SnAg plating is added with daily 110w output plan for both Solder_Bump(8 inch) & Cap_Solder_Bump(6 inch).Plater#5- Cu Cell : While two Cu_Cells(6 & 8) have been down for days due to the unrecoverable 'Bump Uniformity' issue, other 3 cells were down for more than 12 hrs due to the recoverable 'Bump Uniformity' issue to be running after Anode cleansing & buy-off from 6/30 evening. - NiSnAg cell : HW swapping study(with Plater#4) is underway for one SnAg cell but the rest three SnAg cell are being used for 8" Cap_SnAg plating.Date1-JulPlater#2Machine is running without no significant issue in its all Cu cells & NiSnAg cells but the source of '6-inch Wafer Crack' could not uncovered yet thru UAT's mapping study, meaning the potential of another event of '6-inch Wafer Crack' still exists. Plater#3OEE was affected by 6" wafer crack and 8" wafer holder shortage on 6/30, No major HW issue is reported as of 7/01.Plater#4In the wake of Yesterday's loading disconnection due to 6" wafer crack & 8" wafer holder shortage, Entire cell have been down for 7 hrs due to DI water inlet T-Joint leakage on 11:00AM ~ 06:00PM 7/01. Plater#5- Cu Cell : Still only two cells (#7 & #10) are OK while the other two cells (#6 & #8) needs further verification thru runnning the dummy wafer running by 10:00PM 7/01. - NiSnAg cell : Three cells are running for 8" as one cell is used for the engineering study.Date2-JulPlater#2No major HW issue is reported / observed.Plater#3No specific HW issue but two Cu cells were in the regular PM(Anode cleansing) for ~8 hrs Plater#4No major HW issue is reported / observed.Plater#5-Cu cell : From 0400PM, all 4 cells are down due to the chronic Bump Uniformity issue inspite of following TEL/NEXX team's guidance of reinforcing the biweekly Anode cleansing frequency incorporated with the existing M hour based Anode cleansing frequency. - NiSnAg : Three out of four cells have been running while one cell is reserved for the engineering study.Date3-JulPlater#2No major HW issue is reported / observed.Plater#3Two Cu cells have been down for 20hrs while addressing the Uniformity issue after the regular Anode cleasing activity.Plater#4No major HW issue is reported / observed.Plater#5-Cu cell : All 4 cells have been completely down while UAT/TELNEXX conducts the chemical dump, leaching & Anode Burning to assess the bath chemical deterioration on the root cause of chronic Bump Uniformity issue. - NiSnAg : Three out of four cells have been running while one cell is reserved for the engineering study.Date4-JulPlater#2No major HW issue is reported / observed but for engineer's 4hrs-checking SnAg cells on Bump Height Plater#3No major HW issue is reported / observed after finishing the regular Anode cleansing Yesterday(7/03)Plater#4No major HW issue is reported / observed.Plater#5-Cu cell : All Cu cells have been completely down while UAT/TELNEXX conducts the chemical dump, leaching & Anode Burning to assess the bath chemical deterioration on the root cause of chronic Bump Uniformity issue. With the initial evaluation result on #6 Cell promising, the live wafer running will follow by 7/04 09:00PM~10:00PM, whereas fanning-out to the other 4 cells will hinge on.- NiSnAg : No major HW issue is reported / observed but SnAg cells as of 7/04Date5-JulPlater#2Power controller unit of #9 Cu_Cell has been down for 2 hrs 7/05 Morning to be recovered after fixing the fuse.Plater#3As of 12:00PM Noon 7/05, One Cu cell(#9) has been down for 18 hrs for Anode cleansing=>Burning=>1st Dummy Wafer Test=>Fail=>Voltage&Current Check=>2nd Dummay Wafer Test OK=>Two Live wafer plating & test. Other than #9 Cu_Cells, two other Cu Cells have been OK.Plater#4No major HW issue is reported / observed.Plater#5-Cu cell : Preceding trial of the chemical dump / leaching / Anode Cleansing, appears to take hold with #6 Cu_Cell , enabling the #6 for the production mode from 03:00 PM 7/05. Meanwhile, fanning-out the same approach for the rest of four Cu_Cells will limited to #7 & #8 which can be ready for the production by Wed 7/08 ~12:00PM. Since the bump appearance & uniformity record of #9 & #10 has been within UATs own control band, after a round of Anode cleansing + Burning + Dummy Wafer Check + Live Wafer confirmation Cu-Cells, the production of #9 & #10 will resume from 7:00AM 7/06.- NiSnAg : No major HW issue is reported / observed.Date6-JulPlater#2No major HW issue is reported / observed.Plater#3No major HW issue is reported / observed.Plater#4No major HW issue is reported / observed.Plater#5-Cu cell : #6 Cells has been running for the production over past 24 hrs and #7 & #8 will be released into production if ongoing dummy test wafer & live wafer verification is confirmed to be acceptable. Pending the result of #7 & #8 with the forthcoming chemical analysis result, the prospect of releasing #9 & #10 can be no later than the early Next week(7/13) based on the promising estimation.- NiSnAg : No major HW issue is reported / observed except for the unexpected Low Bump Height related holdDate7-JulPlater#2No major HW issue is reported / observed except for 3 hrs of regulat CRS cleaningPlater#3No major HW issue is reported / observed except for 3 hrs of regulat CRS cleaningPlater#4No major HW issue is reported / observed Plater#5-Cu cell : In the aftermath of #6 Cell's production release since 7/05, #7 & #8 cells will be released no later than 7/08 09:00AM after Dummy & Live wafers' sample running result. For #9 & #10 cells, 6 hrs of Anode burning is underway preceded by chemical dump & leaching.- NiSnAg : No major HW issue is reported / observed except for the insufficient upstream Cu_Plated WIP feeding gated by Cu_plating shorftfall.Date8-JulPlater#2No major HW issue is reported / observed Plater#3No major HW issue is reported / observed Plater#4No major HW issue is reported / observed Plater#5-Cu cell : #7 & #8 cells are released for production fro 03:00PM after successful buy-off. Regarding #9 & #10 cells, 6 hrs of Anode burning has been repeated as the first trial of Anode burning could not pass the visual criteria of Anode surface due to the black film peel-off.- NiSnAg : No major HW issue is reported / observed except for the insufficient upstream Cu_Plated WIP feeding gated by Cu_plating shorftfall.Date9-JulPlater#2No major HW issue is reported / observed except for the daily CRS cleaning(3 hrs) Plater#3No major HW issue is reported / observed except for the daily CRS cleaning(3 hrs) Plater#4No major HW issue is reported / observed except for the daily CRS cleaning(3 hrs) Plater#5- Cu cell : As of 04:00PM, All five Cu_Cells are allegedly up and running for the produciton after #9 & 10 Cu_Cells were released after all. - NiSnAg : No major HW issue is reported / observed except for the insufficient upstream Cu_Plated WIP feeding gated by Cu_plating shorftfall.Date10-JulPlater#2There is more than 12 hrs of SnAg Anode Cleaning & subsequent buy-off to impact the production output. Plater#3No major HW issue is reported / observed except for the daily CRS cleaning(3 hrs) Plater#4No major HW issue is reported / observed except for the daily CRS cleaning(3 hrs) Plater#5No major HW issue is reported / observed except for the daily CRS cleaning(3 hrs)

Running OKCritical HW Fail/PMRunning ~50% OEERunning OKCritical HW Fail/PMRunning

Daily Output OEE Tracker 10 July'2015_Rev01

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