Cutting Out the Cracks: Advantages of Thermal Stress Cutting
Transcript of Cutting Out the Cracks: Advantages of Thermal Stress Cutting
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3D-Micromac – Micromachining Excellence
Our mission:
• Development and production of unique
process and machine solutions for various
high-tech markets
• Customer support from product
development to high-volume production
• Enabling laser micromachining techniques
for new devices
• Superior production efficiency and reliable
process stability “Our international customers place great value on future-oriented and user-friendly
processes. Our solutions help them increase production efficiency and lower cost”.
Uwe Wagner, CEO
We are the leading specialist in laser micromachining.
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3D-Micromac – The Specialist in Laser Micromachining
» Founded in 2002
» 180 employees
» Based in Chemnitz, Germany
» Branch offices in US, Taiwan,
China
» Feasibility studies & process
development in house
» Production of limited lots and
ramp up production
» Worldwide sales & service network
ServicesKey Facts Machine Base
» > 600 installations worldwide
» > 100 systems in PV industry
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Content
1. Motivation
2. Thermal Laser Separation explained
3. Mechanical Strength Advantage
4. „Cutting out the Cracks“
5. Economic Impact
6. microCELL next Generation Cutting Tools
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Motivation
Standard industry process:
• Laser ablation "scribe and break"
• Trench 40 – 60 % of the cell's thickness
• Subsequent mechanical breaking
• Limitations in:
• Throughput
• Process quality
• Particle generation
• Electrical and mechanical performance
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Thermal Laser Separation (TLS)
• Starting point (and optional
straightness) defined by scribe
• TLS is a cleaving process, initiated by
heat and cooling
CoolingLaser
Initial scribe
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TLS-Cutting Technology
Cracking zone
Dicing direction
Tensile stress
Compressivestress
Guided crack
Wafer/cell
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TLS-Cutting vs. Scribe and Break – Results Breaking Edge
→ Extensive chipping
→ Very rough structure
→ Very smooth structure
→ No chipping visible
ResultsMechanical Strength
Laser Scribe and Cleaving (LSC)
Mechanical strength:cell (-35%)
module (-23%)
Cell vs Module
Thermal Laser Separation (TLS)
No damage visible on cells and modules
→ Cell and module results in good agreement
Solar cells Module laminates
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→ Courtesy Fraunhofer CSP
Cutting Outthe Cracks
610N
610N
650N
600N
610N
650N
650N
650N
740N
820N
830N
690N
750N
890N
840N 590N
810N
870N
630N
220N
Fracture Origin: Surface Edge
EL pictures after testing | brightness and contrast adjusted
Laser Scribe and Cleaving (LSC)Thermal Laser Separation (TLS)Full Cells (reference)
surface defects → pads surface defects → pads mostly edge defects → cutting process
EL images from module laminate test
→ Courtesy Fraunhofer CSP
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TLS and Economic Benefit for Module Manufacturing
Cell cutting with Thermal Laser Separation
Additional module
power output
Low cost of ownership
and fast RoI
Less module power
degradation
Ability to passivate
cutting edge
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microCELL – Next Generation Cell Cutting
• Worldwide install base > 10 GW
• > 6,000 wph for 1/2 to 1/6 cut cells
• Contactless and ablation-free
cutting
• Improved module performance/
less power degradation
TLS-Cutting provides excellent cleaving results in combination with higher
yield and throughput.
Capabilities:
• Evaluation of new processes and technologies on customer’s demands
• Production of limited lots, batches and ramp up production
• Offered at Chemnitz headquarters
Customer Benefits:
• Reduced overhead and flexible capex model
• No need for machine budget at beginning of product development
• Tool investment can be made once product design is finalized
• Speeds development and optimization of new product designs
• Reduced risk
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Process Development & Contract Manufacturing Services
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Thank you for your attention!
Thomas Kießling
+49 371 40043 222
+49 371 400 43 0 [email protected] www.3d-micromac.com
Headquarters 3D-Micromac AG
Technologie-Campus 8
09126 Chemnitz
Germany
Financial support from theEuropean Union’s Horizon2020Programme for research,technological development anddemonstration (Grant Agreementno. 857793) is acknowledged.