Customized equipment for Printed circuit board industry Microelectronic industry Solar cell...
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Customized equipment for • Printed circuit board industry • Microelectronic industry • Solar cell industry
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15-Jan-2016 -
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Transcript of Customized equipment for Printed circuit board industry Microelectronic industry Solar cell...
Customized equipment for
• Printed circuit board industry
• Microelectronic industry
• Solar cell industry
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Application
Types of vias
Squeegee System
Function
Advantages Vacuum Plugging
Technical Data
Operating Panel
Micro section
Power Squeegee and Plane Raze Device
Contents
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1. Electric function and/or plating connection under a SMD-Pad, main application.
2. Sealing of via-holes for the vacuum test of printed circuit assemblies with mainly using the screen printing process.
3. Sealing of holes in ML-internal layers in order to get in high-dens holes a homogeneous resin flow of the prepreg when bonding the ML-circuitry. In America it is called “Sublam”.
4. Filling of gaps between conductors, for the time being only at low CU-xxxx< 35µm. For the time being application in Korea, for cosmetical reasons, PSR4000 solder mask.
5. Patent from the USA, production of trough-hole platings in ML-internal layers with specially formulated silver paste, which more or less solders when bonding the internal layer.
6. Coating of metal core panel for the production of new “Power LED´s” under vacuum.
Application of the MASS Via Hole Filling
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Through holes can be filled trouble free
Blind via-holes allow to be plugged double-sided in one cycle
Application
min. 2 mil after metallizing Aspect Ratio max. 80:1
pcb: 3 – 360 mil
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Process flow
drilling
metallizing
plugging
brushing, grinding
next build up layer(s)
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Button plating
drilling
metallizing
plugging
brushing, grinding
next build up layer(s)
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Squeegee System
• Filling with Filling head and Receiver
pcb
ReceiverFilling head
pressure sideback side
paste
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Squeegee System
• Filling with two Filling heads (for through holes)
pastepaste
Filling head Filling head
• Paste pressure separat adjustable
• Option: heatable heads
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Squeegee System
• Filling with two Filling heads (for blind vias)
pastepaste
Filling head Filling head
• Paste pressure separat adjustable
•Option: heatable heads
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Boards are vertically suspended by the clamping system.
Door is automatically closed and the chamber is made vacuous (about 20 sec.).
The filling process starts with the paste by piston being pressed out of a cartridge into the bores by compressed air and the squeegee moved all over the pcb.
The Contact pressure, filling pressure and squeegee speed are adjustable.
An adjustable servomotor allows for the vertical movement.
Function
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The vacuum technique allows the blind-via holes and vias to be filled reliably without any air bubbles.
All widths are covered by using different squeegees . The squeegee width to be adapted to the pcb-size. (see following „Pluggingarea“).
The new cartouche systems allows the lacquer- manufacturer to fill the paste on vacuumconditions.
Cartouches not used up can be put into the refrigerator.
Very high aspect ratio possible, for the time being 1:80 for non-conductive pastes. With heated filling head, for the time being 1:20 possible for conductive pastes.
Double-sided closing of blind-via holes in one single operation.
Advantages Vacuum Plugging
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Dimensions (d x w x h): 25“ x 99“ x 83“
Pcb width max 24“ min 10“
Pcb height max 30“ min 8“
Pcb thickness : 0.003” to 0.36”
Amount of filling cartouche ca. 300 ml
Large container system ca. 2000 ml
Compressed air: 88 psi 6 bar
Weight: 1900 lbs
Exhaust: ca. 600 m³/h
Power Requirements:
480 V 3P/PE, 60 Hz, 5,0 kW
or 400 V 3P/N/PE, 50 Hz, 5,0 kW
Technical Data VCP 5000-1
Mic
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Holefilling Process with Vacuum Plugging Machine VCP
Holefilling with holefiller PP 2795, Lackwerke Peters
Surfaces grinded with MASS Plane Raze DeviceSV 100
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Pictures after plating
Holefilling with holefiller PP 2795, Lackwerke Peters
Surfaces grinded with MASS Plane Raze DeviceSV 100
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Function
The paste is stored inside this tool and is pressed through the holes of the PCB’s with compressed air, which is controlled by a foot switch. You simply control the compressed air as you slowly fill the holes.
Advantages
•cost saving
• easy to use
• partial plugging of holes
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Diaphragm
Non-return valve
Reservoir for paste
Cover
Compressed air
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Advantages
• Partial Plugging of Holes • No more waste from the very valuable Silver Paste
• No clean up or change from the paste to storage containers
• No direct contact between the compressed air and the paste
• Using of up to 44 psi pressure to push the paste through very high aspect ratio (1:30) boards
Pla
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Function
The Plane Raze Device removes the cured plugging paste excess after the hole plugging process from pcbs, thus receiving a very plane and flat surface. In the same time the copper is sanded down to a specified thickness all over the board.
SV
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Advantages
Due to the special arrangement of the diamond spots the grinding disk does not load.
The grinding dust allows to be well suctioned.
The grinding disk remains „ sharp“
Therefore, nearly no material heating
