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RELATIONSHIP BETWEEN THE PHYSICAL PROPERTIES
AND CURING SYSTEM OF AN EPOXY MATRIX MATERIAL
by
Robert Rainer Pittroff
Submitted in partial fulfilment of the requirements for the degree
MAGISTER TECHNOLOGIAE: ENGINEERING: MECHANICAL
in the
Department of Mechanical Engineering
FACULTY OF ENGINEERING AND THE BUILT ENVIRONMENT
TSHWANE UNIVERSITY OF TECHNOLOGY
Supervisor: Prof O.C. Vorster
Co-Supervisor: Mr. D Louwrens
December 2007
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DECLARATION BY CANDIDATE
I hereby declare that the dissertation submitted for the degree M Tech:
Engineering: Mechanical, at Tshwane University of Technology, is my own
original work and has not previously been submitted to any other institution of
higher education. I further declare that all sources cited or quoted are
indicated and acknowledged by means of a comprehensive list of
references.
Robert R Pittroff
Copyright Tshwane University of Technology 2007
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Acknowledgement
I would like to express my sincere gratitude and appreciation to the following:
My supervisor, Prof. O.C. Vorster for his patience and guidance.
My co-supervisor, Mr. D. Louwrens for his positive attitude and guidance.
Tshwane University of Technology for financial assistance.
National Research Foundation for financial assistance.
Plastomax Supplies for supplying the material at no cost for this study.
Members of the Tshwane University of Technology, specifically the
Department of Polymer Technology and Department of Mechanical
Engineering for their assistance.
My family for their continued support
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Abstract
The effect of curing conditions such as time and temperature on the physical
properties of an epichlorohydrin-derived, aliphatic amine cured epoxy system
has been investigated.
The cure kinetics and thermal behaviour of a setting system was monitored
experimentally. The effect of the reaction temperature on gelation (tgel) and
vitrification times (tvit) were determined using parallel plate rheology and
Differential Scanning Calorometry (DSC) respectively. Rheology was used to
determine tgel, by monitoring the complex viscosity, complex modulus and tan
against time, whereas the effect of the curing temperature (Tcure) on the glass
transition temperature (Tg) of the system was determined from DSC.
The cure kinetics and thermal behaviour as determined were used to calculate atime-temperature-transformation (TTT) isothermal cure diagram. The TTT
isothermal cure diagram was used as a framework to monitor and characterize
changes during the curing process of a thermosetting system.
The gelation contour corresponds to the point where viscosity tends to infinity,
while the vitrification contour represents Tg rising to Tcure. Rheology
measurements under isothermal conditions indicate that Tgel decreases with an
increase in Tcure.The effect of the curing temperature (Tcure) and curing time (tc) on Tg, dynamic
mechanical properties, and indentation hardness of the system was determined
on cured samples characterized with the TTT isothermal cure diagram. Values
for Tg, and information on the dynamic mechanical properties of the epoxy
system was determined by means of dynamic mechanical thermal analysis
(DMTA). Indentation hardness of the cured epoxy system was determined by
means of measurements on samples using a Hand-Held Portable Hardness
Tester (Barcol Impressor, Model No. 934-1).
It is shown that there is a relationship between the cure conditions and the
mechanical properties of an epoxy matrix material.
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Samevatting
Die effek van die verharding kondisies soos tyd en temperatuur op die fisiese
einskappe van n epichlorohydrin-derived, aliphatic amine verhardingsreaksie
epoksie systeem word in hierdie studie pepaal.
Die verhardingreaksiekinetika en termiese verloop verharding systeem word
deur eksperimente bepaal. Die effek op jelpunt (tjel) en vitrifikasie (tvit) punt word
deur parallelplaatspanningsreometrie en differensiele skanderingskalorimetrie
eksperimente bepaal. Die komplekse viskositeit asook komplekse modulus wat
deur spanningsreometrie pebaal is, word gebruik om tjel te definer, terwyl
differensile skandeerkalorimetrie gebruik word om glas transformasie
temeratuur uitg te werk, deur bepaling van verhardingstye en verhardings
temperature.
Die verhardingsreaksiekinetika en termiese verloop wat bepaal is was gebruik
om n tyd-temperatuur-transformasie (TTT) isotermiese verharding diagram te op
te trek. Die TTT diagram is gebruik as n raamwerk om die verharding reaksie
van n reaktiewe systeem te beskryf.
Die effek op die verharding temperatuur en verhading tyd op die
glastransformasie temperatuur (Tg) sowel as dinamiese meganiese einskappe is
deur dinamiese meganiese termiese analise (DMTA) bepaal. Die hardheid van
verharde stelsels is bepaal deur hardheid analise met n Hand-Held Portable
Hardness Tester (Barcol Impressor, Model No. 934-1).
Daar is bewys dat daar wel n verhouding tussen die verharding kondisies en
meganiese einskappe van n epoksie system bestaan.
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CONTENTS
PAGE
ACKNOWLEDGEMENTS. iii
ABSTRACT. ivEKSERP.. v
LIST OF TABLES vi
LIST OF FIGURES. vii
GLOSSARY. viii
CHAPTER 1
1.1 INTRODUCTION ................................................................. 1
1.2 BACKGROUND INFORMATION.................................................... 21.3 OBJECTIVES.. 3
CHAPTER 2
2.0 LITERATURE SURVEY................................................................... 4
2.1 EPOXY RESIN................................................................................. 4
2.2 KINETICS OF CURE......................................................... 5
2.2.1 FACTORS INFLUENCING CURE................................................... 8
2.2.1.1 FUNCTIONALITY............................................................................ 9
2.2.1.2 MOLECULAR MASS....................................................................... 9
2.2.2 COMPETITION BETWEEN CURE AND DEGRADATION.. 10
2.3 GEL POINT..................................................................................... 10
2.3.1 MICROSCOPIC GELATION........................................................... 11
2.3.2 MACROSCOPIC GELATION.......................................................... 12
2.3.3 GELATION STUDY.................................................................. 12
2.3.3.1 CURING ANALYSIS: RHEOLOGICAL ANALYSIS......................... 13
2.4 VITRIFICATION.............................................................................. 15
2.4.1 CURE TEMPERATURE.................................................................. 16
2.4.2 GLASS TRANSITION TEMPERATURE......................................... 16
2.4.3 VITRIFICATION STUDY................................................................. 17
2.4.3.1 CURING ANALYSIS: DIFFERENTIAL SCANNING
CALORIMETRY............................................................................... 17
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2.5 CHARACTERIZATION OF THE CURE PROCESS......................... 18
2.6 MECHANICAL PROPERTIES.......................................................... 19
2.6.1 MECHANICAL PROPERTIES: MOLECULAR INFLUENCES.. 20
2.6.1.1 MOLECULAR WEIGHT.................................................................... 20
2.6.1.2 CROSS-LINKING DENSITY............................................................. 20
2.6.2 MECHANICAL PROPERTY ANALYSIS TECHNIQUES.................. 21
2.6.2.1 DYNAMIC MECHANICAL ANALYSIS.............................................. 21
2.6.2.1.1 INSTRUMENTATION....................................................................... 22
2.6.2.1.2 DMA AND DMTA ANALYSIS........................................................... 23
2.6.2.2 INDENTATION HARDNESS............................................................ 24
CHAPTER 3
3.0 RESEARCH METHODOLOGY....................................................... 25
3.1 MATERIALS USED AND THEIR PREPARATION......................... 25
3.2 GELATION SYUDY........................................................................ 25
3.3 VITRIFICATION STUDY................................................................ 27
3.3.1 SAMPLE PREPARATION.............................................................. 27
3.4 DYNAMIC MECHANICAL THERMAL ANALYSIS......................... 28
3.4.1 SAMPLE PREPARATION............................................................. 28
3.5 INDENTATION HARDNESS......................................................... 313.4.2 SAMPLE PREPARATION............................................................. 31
3.4.3 EXPERIMENTAL PROCEDURE 31
CHAPTER 4
4.0 RESULTS AND DISCUSSION........................................................ 32
4.1 INTRODUCTION............................................................................. 32
4.2 GELATION STUDY......................................................................... 324.3 VITRIFICATION STUDY................................................................. 34
4.3.1 DETERMINING Tg.......................................................................... 35
4.3.1.1 TgVERSUS TCure............................................................................ 36
4.3.1.2 TgVERSUS tCure............................................................................. 37
4.3.1.3 ISO- TgCONTOURS ...................................................................... 39
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4.3.1.4 PREDICTION OF tvit........................................................................ 40
4.4 TIME TEMPERATURE TRANSFORMATION DIAGRAM 45
4.5 MECHANICAL PROPERTY VS. CURE RELATIONSHIP.............. 46
4.5.1 AREAS FOR ANALYSIS................................................................. 46
4.5.2 DYNAMIC MECHANICAL THERMAL ANALYSIS (DMTA)............. 48
4.5.2.1 STORAGE MODULUS..................................................................... 49
4.5.2.2 GLASS TRANSITION TEMPERATURE (Tg)................................... 51
4.5.2.3 STORAGE MODULUS (E') RELATED TO STIFFNESS 52
4.5.2.4 LOSS MODUDLUS RELATED TO IMPACT RESISTANCE. 53
4.5.3 HARDNESS ANALYSIS............................................................... 56
CHAPTER 5
5.0 CONCLUSIONS AND RECOMMENDATIONS............................... 58
5.1 CONCLUSIONS.. 58
5.2 RECOMMENDATIONS.. 60
BIBLIOGRAPHY. 61
APPENDIX A: Material data sheet for Epon Resin 826.
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LIST OF FIGURES
PAGE
2.1 A generalized time-temperature-transformation (TTT) cure
diagram. Times to gelation and vitrification during isothermal cure
against temperature demarks the boundaries of the four
distinct regions states of matter: liquid, gelled rubber, gelled glass,
and ungelled glass. (Taken from Prime (1997:1384)).......................... 7
3.1 Rheometric Dynamic Stress Rheometer (RS-500)............................... 26
3.2 Typical plot of the loss and storage moduli, tan and complex
viscosity (*) against time for Rheological measurements................... 26
3.3 Typical plot of a DSC scan of endothermic heat flow (mW) against
temperature(C)................................................................................... 28
3.4 Perkin-Elmer Differential Scanning Calorimeter (DSC-7).................... 28
3.5 Typical plot of the storage modulus (E') and tan against
temperature. (Taken from Laza et al. (1998:43)) ................................ 30
3.6 Rheometric Scientific Solid Analyzer RSA II (DMTA) in dual
cantilever mode................................................................................... 30
3.7 The Impressor: A Hand-Held Portable Hardness Tester
(Barcol Impressor, Model No. 934-1)................................................... 31
4.1 Time-temperature-transformation (TTT) diagram: Gelation contour.... 34
4.2 Tg (C) vs. Tcure (C) for different isothermal heating times (1 hour
through to 72 hours). The reference line of Tg = Tcure is also
included............................................................................................... 36
4.3 Tg (C) vs. Log Time (min) for different isothermal temperatures
(Tcure).................................................................................................... 37
4.4 Limiting Tg (C) vs. Tcure(C),............................................................... 38
4.5 Time-temperature-transformation (TTT) diagram: Iso-Tgcontours...... 39
4.6 Ln time (min) to fixed Tgvalues (from Figure 4.5) vs. 1/Tcure(K)......... 41
4.7 Ln time (min) to macroscopic gelation vs. 1/Tcure(K)........................... 44
4.8 Summary time-temperature-transformation (TTT) diagram................. 46
4.9 Detailed TTT-Isothermal cure diagram showing areas for DTMA
analysis................................................................................................ 47
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4.10 DMTAscans. Tan and storage modulus (E') vs. temperature (C)
for samples cured for different cure times (tcure, min) at different cure
temperatures (Tc).
4.10-a: DMTA scans forTcure= 70C.......................................... 494.10-b: DMTA scans forTcure= 90C.......................................... 494.10-c: DMTA scans forTcure= 110C.......................................... 50
4.11 Trends in Tg values for samples cured at different temperatures (Tc)
and for different times (tcure)................................................................. 51
4.12 Trends in E' values for samples cured at different temperatures (Tc)
and for different times (tcure)................................................................. 53
4.13 Determination of the area under the storage modulus curve............... 54
4.14 Trends in impact strength values for samples cured at different
temperatures (Tc) for different cure times (tcure)................................... 55
4.15 Trends in Barcol Hardness values for samples cured at different
temperatures (Tc) and for different times (tcure).................................... 56
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LIST OF TABLES
PAGE
2.1 Outline and classification of epoxy reactive groups, constituents, and
ammonia and amine reaction groups. Taken from Ellis
(1993:1,3&12) 5
2.2 Glossary of curing terms and characteristic curing parameters.
Taken from Prime (1997:1386)............................................................ 8
4.1 Average gel times (Log Time) for different frequencies at the
respective cure temperatures.............................................................. 33
4.2 Average glass transition temperatures for samples cured for
different times at different cure temperatures...................................... 35
4.3 Numerical relationship between Ln time to a fixed Tg and thereciprocal ofTcure(1/K)......................................................................... 40
4.4 Calculated times to vitrification for Tcure = Tg corresponding to
isothermal cure temperatures from Figure 4.2..................................... 43
4.5 Results from DMTA............................................................................. 50
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CHAPTER 1
1.1 Introduction
Thermoset systems possess good dimensional stability, thermal stability,
chemical resistance, and electrical properties. Prime (1997:1381) believes that
the increasing use of thermoset material as adhesives, matrix material in
reinforced composites, and protective coatings in aeronautical, automotive,
construction, electrical and medical application is consequence to thermosets
possessing these properties.
Using composite materials technology in design and manufacture in engineering
fields, as explained by Jones (1993:256), exploits the high specific moduli and
strength of reinforcing fibres, supported and held together by epoxy matrices to
produce low density high performing structures. According to Morgan
(1997:2097), epoxy resin systems are generally used for composite matrices,
due to the suitability in composite fabrication.
Optimal component design requires an in-depth knowledge of the properties and
mechanical capabilities and limitations of constituent materials of composites,
and their correct application. The reinforcing fibers provide strength and stiffness,while the epoxy accounts for the desired shape and load distribution between the
reinforcing fibers.
Morgan (1997:2198), Yasmin and Daniel (2004:8211), and Nicholson et al. (1)
are in general agreement that the failure or degradation of composite component
performance can be linked to matrix dominated properties. The weak link in the
composite is the structural integrity, mechanical, and physical response of this
interfacial region. Favorable response of composite structures to applied loads
requires competent structural design based on knowledge of the mechanical
properties of the constituent parts of the composite.
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1.2 Background information
Epoxy is a title given to the class of material that has an epoxide group or oxirane
ring in its chemical structure. Epoxies exist either as liquids with low viscosity or
as solids. Curing of an epoxy system as explained by Sun (2002:11), is through
the ring opening reaction of epoxides where addition of molecules produces a
higher molecular mass and finally resulting in a three-dimensional structure. The
active epoxide groups in uncured epoxy resins react with various curing agents
or hardeners that contain, amongst other, hydroxyl, carboxyl, amine, and amino
groups.
Epoxy resins can be divided into two major groups: epichlorohydrin-derived
resins and cycloaliphatic resins. This particular study will focus on the former
group, where there is a reaction with a common polyhydroxy compound, such as
bisphenol A, which is cured by means of an aliphatic amine curing agent.
Processing of thermosetting based composite structures involve curing cycles of
the epoxy systems at different isothermal curing temperatures. The degree of
cure of thermosetting systems is determined by these curing cycles and has an
important effect on the mechanical properties of the final product. To determine,
or to a certain extent predict, the mechanical properties through optimized curing
cycles requires thorough understanding of cure kinetics and characteristics of
epoxy systems. The kinetics of the curing process was studied by means of
parallel plate rheology (Halsz and Vorster (2000, 2004), Lange et al. (1996),
Sun (2002)) and differential scanning calorimetry (DSC) (Gan et al. (1989),
Gillham (1993), Gumen et al. (2000) and Nez et al. (2000)).
Information gained from the rheology and DSC analysis was then used to
generate additional information on the physical state of the epoxy resin. The
information was used to develop an isothermal time-temperature-transformation
(TTT) cure diagram (Gillham (1979, 1982, 1990 and 1993), Gan et al.(1989),
Jiawu et al. (2000), Nez et al. (2000), Sun (2002), and Reghunadhan Nair
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(2004:38)). The TTT cure diagram facilitates characterizing the thermosetting
system.
By making use of the isothermal TTT cure diagram epoxy samples were
characterized and cured according to specific cure temperatures (Tcure) and
curing times (tcure). These samples were then subjected to dynamic mechanical
thermal analysis (DMTA) scans as well as Barcol hardness test to determine
mechanical properties of the cured samples under different curing conditions.
1.3 Objectives
This study focuses on gaining insight into the properties and mechanical
capabilities by determining the relationship between the curing conditions and
physical properties of an epoxy matrix. It aims to:
Establish the kinetics of cure of the epoxy thermosetting system
through the use of rheology and differential scanning calorimetry.
Use the kinetics of cure to develop and construct an isothermal
time-temperature-transformation (TTT) cure diagram.
To ascertain the mechanical properties of the cured samplesthrough dynamic mechanical thermal analysis (DMTA) and Barcol
hardness indentation measurements.
Using the TTT diagram and mechanical properties from DMTA
scans and Barcol indentation tests to establish a relationship
between the curing conditions and physical properties of the epoxy
thermosetting system.
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CHAPTER 2
2.0 Literature Survey
2.1 Epoxy Resin
Commercial epoxy resins were first marketed in the 1940s as result of
independent work by Pierre Castan in Switzerland, and Sylvan Greenlee in the
United States. Even though patents for similar resins had been in existence since
the 1930s, Ellis (1993:1) explains that products that would be called epoxy resins
in modern times, were synthesized as early as 1891. It is interesting to note that
early epoxy resins were reaction products of bisphenol A and epichlorohydrin,
and although various other types of resins are available, this is still the major
manufacturing route for most resins available today.
Epoxy resin is generally found in the form of liquids with low viscosities or as
solids. Prime (1997:1716) and Sun (2002:11) report that epoxy resins form part
of a class of material classified and characterized according to the reactive
epoxide group, or oxirane ring that forms part of the chemical structure. Ellis
(1993:1) points out that the term epoxy resin is generally applied to both the un-
reacted prepolymers and cured resins, even thought all the reactive groups may
have reacted in the cured resins.
Epoxy resins can be divided into two major groups: epichlorohydrin-derived
resins and cycloaliphatic resins. This particular study will focus on the former
group, where there is a reaction with a common polyhydroxy compound, such as
bisphenol A, which is cured by means of an aliphatic amine curing agent. The
reactive epoxy group, bisphenol A and epichlorohydrin reagents, as well as the
aliphatic amine group reaction is outlined and classified in Table 2.1.
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Table 2.1 Outline and classification of epoxy reactive groups, constituents, and ammonia and
amine reaction groups. Taken from Ellis (1993:1,3&12)
Ellis (1993:72) asserts that the cure of an epoxy resin involves reaction between
epoxy and hardener reactive groups, and that during cure, a liquid or fluid resin-
hardener mixture is converted to a solid.
2.2. Kinetics of cure
Thermosetting resin is an appropriate title in that it describes the final infusible
and insoluble state of a set, or cured system. Liquid resin is mixed with a
hardener or catalyst according to a prescribed ratio in order to initiate the curing
process. This process is known as polymerization, curing or cross-linking, and is
a permanent change from a viscous liquid to a viscoelastic fluid, to an elastic gel
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(or rubber), and finally to a glassy state. Heat or another form of energy is often
required to initiate cure. Proper formulation and complete processing will result in
a polymer with a highly cross-linked, infinite three-dimensional network structure,
a consequence of the chemical reactions that accompany cure. It is the
polymerization or curing process that separates thermosets from other polymer
materials such as thermoplastic materials.
According to Ellis (1993:72-74) and Prime (1997:1380-1388) the complexity of
the curing process of a thermoset is due to steps that are necessary during the
handling and storage of the material, prior to cure, and situational factors that
influence the process, and state or phase changes that the material undergoes
during cure.
The major changes to the properties of thermosetting resins from being a viscous
fluid to a glassy solid are a result of the cure process. These changes as cure
proceeds can be represented in a time-temperature-transformation (TTT)
diagram as represented in Figure 2.1 below.
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Figure 2.1.A generalized time-temperature-transformation (TTT) cure
diagram. Times to gelation and vitrification during isothermal cure against
temperature demarks the boundaries of the four distinct regions states of
matter: liquid, gelled rubber, gelled glass, and ungelled glass. (Taken from
Prime (1997:1384))
The first phase transformation from a viscoelastic fluid to an elastic gel is known
as the gel point, and occurs at the gel time (or gelation times), tgel. A distinction
must be made between molecular gelation and macroscopic gelation. Molecular
gelation occurs at a specific stage during the chemical reaction, and marks the
start of the formation of a cross-linked network, whereas the macroscopic
consequence of gelation shows a rapid increase in viscosity, and development of
elastic properties.
The next phase transition from a gel to a glassy solid is vitrification, with glass
transition measurements of Tg and times to vitrification, tvit. Prime (1997:1383)
points out that vitrification occurs as a result of the chemical reaction that
accompanies cure, and is independent of gelation. Vitrification of the system can
occur without gelation.
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Table 2.2 Glossary of curing terms and characteristic curing parameters. Taken from Prime
(1997:1386)
Chemical conversion (e.g., of epoxide groups), fraction reacted, degree ofcure
gel at gel pointult Maximum achievable extent of conversion 1
tgel Time to gelation (gel time)
tvit Time to vitrification
Tcure Cure temperature, a process parameter
Tcure,0Temperature below which no significant reaction of uncured resin mixtureoccurs in a reasonable time period (cf. storage temperature for uncured resinmixture)
gelTcure Lowest temperature at which gelation occurs in the liquid state
Tcure, Minimum temperature at which ultimate conversion occurs in a reasonabletime
Tg Glass transition temperature, a material property
Tg0 Tg for thermoset with degree of conversion = 0
gelTg Tg for thermoset with degree of conversion gel
Tg, Tg for thermoset with degree of conversion = 1
Prime (1997:1383) and Gillham (1989:804, 1993) repeatedly point out that the
onset of vitrification marks a decrease in the rate of reaction. This decrease is a
result of the change in reaction mechanism from being kinetically controlled to
diffusion control.
2.2.1. Factors influencing cure
Manufacturing and processing of composite parts destined for commercial
applications calls for the least amount of cycle/process time, yielding improved
properties. It is therefore imperative that the finished product demand set by themarket be met; Production and cost effective manufacture therefore compels the
use of additives such as catalysts, accelerators, initiators, hardeners, or fillers.
According to Prime (1997:1662), catalysts, accelerators, and initiators catalyze
the cure process, and in doing so reduce the processing times. Hardeners are
incorporated in the network structure of the polymer chains; thereby having an
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effect on the reaction rate, as well as the ultimate properties of the material, such
as the network structure, glass transition temperature, and dynamic mechanical
properties. Fillers are generally incorporated to provide or enhance physical
properties such as modulus, thermal expansion and dimensional stability.
2.2.1.1 Functionality
According to Odian (1991:40, 106-108), polymerization of bi-functional
monomers (f=2) will form linear polymers, whereas polymerization of monomers
with more than two functional groups per molecule (f>2) will result in the polymer
being cross-linked.
With certain monomers, cross-linking will take place, resulting in a network
structure in which one or more branches from one molecule become attached to
surrounding molecules.
2.2.1.2 Molecular Mass
Odian (1991:19-20) emphasises the importance of the molecular mass of a
polymer in its synthesis and application. Also that, the useful mechanical
properties uniquely associated with polymeric materials are a consequence of
their high molecular weight. It can generally be said that the use of polymer
material in practical applications require high molecular weights to obtain high
strengths. It should be noted that polymer chains with strong intermolecular
forces develop sufficient strength to be useful at lower molecular weights than
polymers having weaker intermolecular forces (with higher molecular weights).
There is a significant dependency of the properties (other than strength) of a
polymer on its molecular weight, albeit different quantities for different properties.
Optimum or maximum values of properties will be reached at different molecular
weights and can decrease with a further increase.
It is therefore necessary for the polymerization process to result in a compromise
molecular weight, where sufficient strength is obtained without sacrificing other
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properties. The control of the molecular weight of a cross-linking process is
essential for the practical application.
2.2.2 Competition between Cure and Degradation.
Prime (1997:1505) explains that the cure process can often become complicated
as a result of competition between degradation and chemical cross-linking
reactions. This can often occur as a result of the high cure temperatures required
to achieve high glass transition temperatures of high performance systems. Yuan
and Mazeika (1991) as reported by Prime (1997:1431), found that isothermal
degradation occurs in three stages; during the first stage, there is a decrease in
modulus and glass transition temperature (Tg), a probable result due to scission
in the epoxy network. The second stage marks the formation of char, and duringthe third stage char stabilizes, and shows an increase in modulus and Tg. The
increase may be caused by an increase in the cross-linking density of the
degraded network. The char region can be seen on Figure 2.1.
2.3 Gel point
Gelation is the first noticeable change that is encountered during the cure
process. Prime (1997:1496) describes gelation as an irreversible change from a
liquid to a rubber, and that this change marks the start of the formation of the
cross linked network. Malkin and Kulichikhin (1996:277) used gelation to denote
the process of fluidity loss, which is a result of the formation of a network of
chemical bonds.
Prime further defines gelation on a molecular basis, but states that the
phenomenon is measured as a macroscopic phenomenon. A distinction between
molecular gelation and macroscopic gelation may be drawn; macroscopic
gelation is the consequence of the microscopic gelation. Gelation will be
discussed on a microscopic and macroscopic level.
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2.3.1 Microscopic gelation
Microscopic gelation marks the start of the formation of the three dimensional
network structures that is typical of thermosetting systems, and will have a direct
influence on the final structure of the cured resin. It is vital to understand the
influence of the occurring changes, and their effect on the final properties of the
cured resin. Microscopic analysis of gelation focuses on molecular and chemical
changes that take place during polymerization.
Ellis (1993:4&72-74), Malkin and Kulichikhin (1996:277), and Prime (1997:1380-
1383, 1496) are in agreement that the cure of thermoset material on a
microscopic level is the formation and linear growth of molecular chains. These
linear chains form branches, cross-links with other branched chains, and result in
the formation of a rigid three dimensional molecular network, all due to the
chemical reaction between the epoxy and hardener reactive groups. Malkin and
Kulichikhin (1996:277) add that the microcrystals formed act as stable points of
the three-dimensional network. These strong physical bonds will cause fluidity
loss.
Flory (as quoted by Gillham (1989:804)) and Winter (as quoted by Prime
(1997:1381)) defines the microscopic gel point of a cross-linked system, as the
point where the weight average molecular weight of the network of chains
approaches infinity.
Molecular gelation is therefore a point that may be measured by the initial
identification of an insoluble gel.
Flory and Miller et al. (taken from Prime (1997:1382)) are in agreement that
molecular gelation generally occur during a well-defined and calculable stage in
the course of the chemical reaction. The only requirements are that the reaction
mechanism is not dependent on temperature and that there are no non-cross-
linking side reactions. Molecular gelation is dependent on the functionality,
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reactivity, and stoichiometry of the reactants, therefore the theoretical gel point
can be calculated if the chemistry of the reactants is known.
2.3.2 Macroscopic gelation
Ellis (1993:5&72) points out that the first critical feature of a curing system is
gelation and can be macroscopically described as the point where the resins
viscosity rapidly approaches infinity. This happens as a consequence of
microscopic gelation, which is also defined as such by Prime. Gan et al
(1989:804) explain that the transformation is from a viscous fluid to a state of
infinite viscosity, or a change from a fluid liquid to a rubbery state. Gillham
(1990:1) adds that there is a transformation of liquids with low molecular weight
to an amorphous solid with a high molecular weight by means of chemical
reactions.
This irreversible transformation from a fluid to a rubber means that beyond the
gel point a thermosetting resin loses all ability to flow. This marks a very
important stage, especially for manufacturing and processing.
2.3.3 Gelation Study
The measurements of isothermal times to gelation are important to cure studies
and will be used to form the basis of a cure diagram and is discussed in later
chapters of the study.
The progressive macroscopic change from the liquid state to the rubbery state
and/or glassy state which occurs during the setting of reactive systems has been
described on both a molecular and macroscopic level. Prime (1997:1496)
explains that the detection of an insoluble material, i.e. a cross-linked material
(gel) that forms from a reacting soluble material (sol), may be taken as the
starting point of measure of gelation.
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According to Winter, Holly et al., Feve, Boiteux et al. (as quoted by Prime
(1997:1496)), the point where the mechanical loss tangent becomes independent
of frequency can be used as an alternative measurement starting point.
Molecular gelation is taken as the point where the loss modulus (G') and storage
modulus (G'') cross each other, i.e., tan =1. The approximation of gelation
macroscopically is based on rheological and mechanical changes that occur
during the transition from liquid to rubber. The rheological aspect accounts for the
changing viscosity, while the mechanical aspect accounts for the evidence of an
equilibrium modulus.
Initial work by Gan et al. (1989) reported on the use of the torsional braid analysis
(TBA) technique to monitor and study gelation and vitrification of a setting
system. TBA is a resonant instrument, which according to Gallagher (1997:137),
was widely used in the past. The detailed mechanics of the system will not be
discussed here, but it is important to understand that the frequency of oscillation
is related to the modulus, and that the logarithmic decrement (ratio of the
amplitude of successive cycles) is related to tan .
Nez et al. (2000) proposed three methods to experimentally determine the time
at which gelation occurs (tgel), namely; solubility test, gel-timer and dynamic
mechanical analysis (DMA). The solubility test, as described by Hagnaver (1983),
is used to determine the time taken for the setting material to reach a fibriform
structure in tetrahydrofurane. The DMA measures the dynamic mechanical
properties of the epoxy.
2.3.3.1 Curing analysis: Rheological analysis
Malkin and Kulichikhin (1996:142), Lange et al. (1996), Kulichikin (1997), Halsz
et al. (2001), Vorster (1995), Vorster et al. (2004), and Sun (2002) used
rheology, the study of the change of viscosity, as a mean to determine the point
of gel formation. Ellis (193:87-89) explains that even though the initial rate of
reaction may be high, the molecular growth is slow. There is a relationship
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between the degree of cure and viscosity; this allows for cure monitoring by
measuring the change in shear viscosity of the setting system. The shear
viscosity of a resin increases during cure as a result of gelation and/or the onset
of vitrification.
According to Halsz et al. (2001:898), rheological analysis of the viscosity of
curing systems may be carried out using a small strain (5%) at different
frequencies and temperatures. The components of complex modulus, complex
viscosity and tan should be measured and recorded against frequency and
therefore as a function of time, as depicted in work performed by Halsz et al.
(2001:898). It is interesting to note that prior to gelation the behaviour of the liquid
resin can be characterized by the zero shear viscosity.
Vorsteret al. (2004) quoted Flory (1941 & 1959) and Stockmayer (1943 & 1944)
who predicted theoretical gel point values using the following equation;
( )( )
2
1
11
1
=
gfRg [2.1]
where Ris the molar ratio between the epoxy and hardener, fis the functionality
of epoxy and gthe functionality of the hardener.
From the data obtained from experimental rheological measurements the
gelation times (tg) can be determined using three methods:
Extrapolating the inverse of zero viscosity
Equilibrium (intersection) of G and G curves of the dynamic modulus
Intersection of the tan curves.
Halsz et al. (2001:899) obtained and compared gel times according to the three
methods discussed above. The time differences were found to be insignificant,
thereby permitting single test validity.
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Times to gelation (Log time in minutes) as described by Gan et al. (1989:807)
can be plotted against isothermal cure temperatures to obtain time temperature
transformation (TTT) diagrams with gelation contours. Gelation contours on a
TTT diagram shows the relationship between tgeland Tcure. The relationship that
exists between tgel(Ln time in minutes) to macroscopic gelation versus the
reciprocal temperature (1/K) is linear. The slope of the linear relationship
represents the apparent activation energy (Ea) for the system.
2.4 Vitrification
Wunderlich (1997:460) defines vitrification of a setting system as the transition
from a viscous liquid or rubber to an amorphous solid or glass. Gan et al.
(1989:803) describes vitrification as the point where the system solidifies. This
phase transition is a consequence of the cure reactions, and as Prime
(1997:1383 & 1569) explains, vitrification can occur at any stage during
polymerization. Glass formation (vitrification) is as a result of the glass transition
temperature (Tg) increasing with conversion. It is accepted that vitrification occurs
at times to vitrification, tvit, when Tgrises to the cure temperature (Tcure).
The measurements of the times to vitrification, similar to times to gelation, are
important and will be used in cure studies. It forms the basis of cure diagrams.
With reference to Figure 2.1, Malkin and Kulichikhin (1996:120), and Prime
(1997:1384) explain that in the glassy state beyond the vitrification line, the cure
reaction rate significantly drops. Wisanrakkit and Gillham (as quoted by Nezet
al. (2001:3581), Adabbo and Williams, Dillman and Seferis, and Wisanrakkit and
Gillham (taken from Prime (1997:1623)) explain that isothermal curing of
thermosets occur in two distinct stages; the first stage reaction mechanism is
kinetically controlled, but changes to diffusion controlled soon after vitrification.
There is an increase in the diffusion time scale, whereas segmental mobility, and
reacting groups decrease.
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According to Prime (1997:179), gel conversion is dependent on functionality and
stoichiometry, whereas the glass transition is dependent on the frequency of
measurements. Therefore indicating the dependence on the dynamic mechanical
technique used for monitoring it.
2.4.1 Cure temperature
According to Prime (1997:1381), most thermosetting formulations require heat or
irradiation to cure. Energy in the form of heat can be supplied to the reaction and
will be elevating the cure temperature of the system. The cure temperature (Tcure)
is a processing parameter and is the temperature at which the polymerisation or
cure process takes place.
2.4.2 Glass transition temperature
Scherer, Rekhson and Elliott (from Ellis, 1993:81) point out that glass-forming
systems exhibit a glass transition phenomenon. Prime (1997:1401) further
defines the point as a transition from a supercooled liquid or rubbery state to a
metastable glassy state.
According to Wunderlich (1997:226 & 380), there is a definite link between the
liquid state and glassy state of a thermosetting resin. The glass transition
temperature (Tg) is the main characteristic temperature of the two states, and is
the process where the molecular orientation of the liquid state is frozen in
position as a glass. Because there is no change in molecular order at Tg, the
macroconformation of the molecules in the glass state correspond to that of the
liquid.
Odian (1991:24 & 29) defines the glass transition temperature, Tg, of a polymeric
system, as the temperature where the amorphous or unordered regions of a
polymer take on the characteristic properties of the glassy state, typically
brittleness, stiffness, and rigidity that is associated with the solid phase.
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According to Gan et al. (1989:803), Gillham (1990, 1993), and Wang (1992), the
sensitivity and one-to-one relationship between Tg and the conversion for
thermosetting resins, implies that Tg can be used as an index to measure
conversion during cure. The glass transition temperature is a useful, sensitive,
easily measured macroscopic parameter for monitoring the cure process of
thermosetting systems.
Prime (1997:1506&1414) points out that softening of a thermoset is affiliated with
Tg, defines the upper use temperature of the system. This information is critical
when designing and manufacturing composite structures to be used at elevated
temperatures.
2.4.3 Vitrification study
As stated before, onset of vitrification of a thermosetting system is when there is
a change from a liquid to a glassy solid. This transition is further defined as the
point where Tgrises to Tcure. It is therefore important to be able to determine Tg.
Ellis (1993:72) points out that when Tcure is too low, vitrification may occur before
gelation and inhibit further reaction.
2.4.3.1 Curing analysis: Differential scanning calorimetry
Differential scanning calorimetry (DSC) has been used in work by various groups
such as Gillham (1990 & 1993), Nez et al. (2001) and Mafi et al. (2005) to
determine the glass transition temperature (Tg) of setting systems. According to
Turi (1981) and Wunderlich (1990) as quoted by Prime (1997:1388-1390), DSC
forms part of a family of measuring techniques that record the response of a
material to temperature scans. This is achieved by measuring and recording the
heat flow into a material (endothermic) or out of a material (exothermic). DSC
can therefore be used to determine Tg for thermosets; by assuming that the
measured heat flow (dH/dt) is proportional to the reaction rate (d/dt), or after
integration, the total heat detected is identical to the heat evolved by the curing
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reaction. Other characteristics that can be determined through the use of DSC
are cure, and physical ageing of systems.
This technique monitors the setting system during the change from a liquid to
rubbery state and finally glass state. According to Gan et al(1989:804) Tgcan be
measured in three types of experiments:-
1 Times to vitrification are obtained when Tgrises to Tcure
2 The progress of setting before vitrification at Tcure can be obtained
from measurements ofTgobtained during intermitted cooling
3 Temperature scans first to a temperature below and then to
temperatures above Tcure, give Tg values which reflect the state of
cure obtained at Tcure, and the stability of the material to
temperatures higher than Tcure.
Tg values for samples cured at Tcure fortcure determined from DSC scans can be
used to monitor cure conversion simply by plotting Tg against Tcure for isothermal
heating times. The relationship is linear at lower isothermal cure temperatures.
All Tcure
versus Tg
curves features a maximum. Gan et al. (1989:807) explain that
this inflection is due to the competition between cure (which raises Tg) and
thermal degradation (which decreases Tg).
2.5 Characterization of the cure process
Gillham (taken from Prime (1997:1568)) provides a useful frameworks for the
understanding and conceptualization of the changes that occur during the curing
process of a thermosetting resin. This is through the development of the
isothermal time-temperature-transformation (TTT) cure diagram as depicted in
Figure 2.1. The diagram depicts the various physical states of a thermoset (liquid,
rubber, and glass) in relation to the two critical phenomena: gelation and
vitrification. Sun (2002:91) proposes that the characteristics of the cure process
can be understood by combining and describing the rheological analysis and
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DSC thermal analysis by a time-temperature-transformation (TTT) isothermal
cure diagram.
Construction of a TTT isothermal cure diagram requires that the relationship
between degree of cure and cure time at isothermal cure temperatures be
established.
The relationship between gel times (tgel), defined as the elapsed time to achieve
equal storage and loss moduli, and isothermal cure temperature is represented
by the gelation contour. Earlier discussions verify that Tg is a function of degree
of cure and dependent on cure temperature. The relationship between Tgand the
isothermal cure time can be determined. This allows that the time taken for
isothermal cure, or vitrification (tvit), when Tg rises to the cure temperature (Tcure),
can be determined. The relationship between tvit and Tcure is represented by the
vitrification curve. By plotting the gelation and vitrification curves on the same
graph, the isothermal TTT cure diagram for epoxy resin system is constructed.
2.6 Mechanical properties
Proper application of epoxy resins requires that the material be a rigid solid at the
use temperature Tuse
. The use temperature in all these applications is below the
glass transition temperature of the cured resin, TuseTg.
Work by various authors (Nielsen (1969:69-103), Ellis (1993:159) Paul
(1989:187), Gillham (1993), Lange et al. (1996), Morgan (1997:2103), Fabrice
and Redford (2002:340), Ahamed et al. (2004), and Mafi et al. (2005)) confirm
the influence of molecular weight and cross-linking density on the final
mechanical properties of thermosetting systems. Ellis explains that epoxies with
higher cross-linking densities have higher Tgs, which often succumbs to brittle
failures, whereas epoxies with low cross-linking densities exhibit structures with
more mobility that allows for greater plastic deformation. Higher levels of
deformation often result in higher fracture toughness. Misev (1991:196-197)
substantiates that the mechanical properties are directly proportional to the
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molecular weight. But only to a point, as the molecular weight is dependent on
the resin and cross-linker stoichiometry.
Bell as well as Misra et al. (as reported by Ellis (1993:159)) found significant
increases in impact strength with an increase in molecular mass between cross-
links. A higher molecular masss between cross-links denotes a lower cross-link
density.
2.6.1 Mechanical properties: Molecular influences
2.6.1.1 Molecular weight
According to Misev (1991:176), the molecular weight of a thermoset influences
the following mechanical properties; tensile strength, impact resistance and melt
viscosity. This was confirmed through studies performed by Nielsen, Matsuoka,
Walsh and Termonia (taken from Nicholson et al. (date:1)), the molecular weight
distribution effects fracture toughness, and impact strength of the polymer.
The critically molecular weight dependent property is the glass transition
temperature (Tg), which represents the temperature region where there is a
phase change, either form a glass to a rubber, or from a rubber to a glass. Tg
generally increases with the extend of cure, which denotes molecular growth, and
confirms the relationship.
Good mechanical properties after curing requires that the molecular weight be
high. There is however a constraint; thermosetting systems with higher molecular
weights consequently have high viscosities, which causes production problems.
2.6.1.2 Cross-linking density
The cross-linking density is representative of the number of bonds or cross-links
that has formed as result of the chemical reaction between the constituents
reagents during the cure. Ellis (1993:159), Nielsen (1969:69-103), Paul
(1989:187) and Morgan (1997:2103) are in agreement that the fundamental
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physical and mechanical properties of epoxy resins are determined by the nature
and density of its cross-linked network. There is influence on Tg of the polymer,
the ability to undergo plastic deformation, therefore its toughness characteristics
at a given temperature. Gillham (1993) explains that the maximum cross-linking
density for a fully-cured material will yield the minimum internal stress, and
maximum modulus.
There is of course a limit to the cross-linking density, explained by Reghunadhan
Nair (2004:406) and Mimura and Ito (2002:7559), as epoxies with high cross-
linking densities tend to have high Tgs, but often exhibit brittle structures.
Almeida and Monteiro (1996:330) add that higher cross-linking densities
generally result in stiffer structures with higher ultimate strengths.
Excessive cross-linking reactions result in a rigid, brittle network structure with a
diminished load bearing capacity.
2.6.2 Mechanical property analysis techniques
2.6.2.1 Dynamic mechanical analysis
Methods such as torsional braid analysis (TBA), dynamic mechanical analysis
(DMA), and dynamic thermal mechanical analysis (DMTA) are methods of
measuring changes in complex modulus, compliance, and viscosity of samples
during oscillatory deformation of material samples. The different modes of
deformation that a sample material can be subjected to are as follows; flexure,
tensile, shear, bending, and compression deformations. Principal applications of
DMA for thermosetting material is the measurement of Tg, analysis of cross-
linking, mechanical properties developed during the curing process and
characterizing cured or partially cured materials.
Prime (1997:1464-1465) states that Tg for thermosetting materials can be defined
to occur at the maximum value of the loss modulus (E'), the loss compliance, or
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tan . Mechanical properties such as storage and loss moduli or compliances for
samples during or after cure can be measured.
The dynamic mechanical modulus, E*, is defined as the ratio of the stress, *, to
the strain, *, in the material being tested. The strain is a response to the stress
applied, or the stress is a response to the applied strain. E*is a complex quantity
and is defined as:
'''**
*
iEEE +==
[2.2]
'
''tan
E
E= [2.3]
where E' is the storage modulus, a measure of the stress stored in the sample
as mechanical energy; E''is the loss modulus, a measure of stress dissipated as
heat; tan is the phase lag between the stress and strain.
2.6.2.1.1 Instrumentation
o Torsional braid analysis (TBA)
TBA is a dynamic mechanical technique where the specimen for a freelyoscillating torsion pendulum experiment consists of an inert substrate or braid
coated with the reactive system. The changes from the liquid or rubbery state to
the glassy state can be monitored during cure. Gan et al. (1989) and Jiawu et
al.(2000) used the TBA to study the cure behaviour and measure macroscopic
gelation times tgel and glass transition measurements such as Tg and times to
vitrification (tvit) to characterize reactive coatings.
o Dynamic mechanical analysis (DMA)
DMA is a thermal analysis system module that is designed for four modes of
oscillation: fixed frequency oscillation, resonant frequency oscillation, stress
relaxation, and creep. Direct measurements of frequency, temperature, time,
stress, stain, and phase angles are taken during scans. Measurements can be
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made in the following modes; three-point bending, dual cantilever, fiber
extension, film extension, and parallel plate.
Yasmin and Daniel (2004:8213) determined thermomechanical properties such
as storage modulus (E), loss modulus (E), damping factor tan, and Tg of
samples through DMA scans. Park et al. (2004) used DMA purely to determine
the temperature dependence of the loss factor tan for samples modified through
synthesis of epoxidized soybean oil. Ahamed et al. (2004) used DMTA to study
the effect of stoichiometry on the dynamic mechanical properties of resins
systems. Cain et al. (2004:3) performed DMA in dual-cantilever mode on
samples.
o Dynamic mechanical thermal analysis (DMTA)
The DMTA is a fixed frequency thermal analysis module that measures time,
temperature, frequency, sample, and suspension stiffness (in-phase and out-of-
phase) directly. Three measurement modes are possible: bending mode, single-
cantilever (and double cantilever), and shear sandwich geometry.
Dynamic mechanical thermal analysis (DMTA) can be used to measure the
complex modulus, compliance, and viscosity of materials as functions of
temperature in several different modes of oscillatory deformation.
Mafi et al. (2005) and Remiro et al. (2001) used DMTA to gauge the effect of
curing conditions such as time and temperature on dynamic mechanical
behaviour (adhesion, viscoelasticity, and stiffness) of a thermoset system. Laza
et al. (1998) used DMTA to study the effect of amine concentrations on the
dynamic mechanical properties of resins systems.
2.6.2.1.2 DMA and DMTA analysis
DMA according to Prime (1997:1581-1597), is commonly used in characterization
of polymeric materials. This is due to the viscoelastic behaviour of the material
which changes with time. A reacting system therefore requires a description of
the kinetics of the system and the effect of the changing system on the
viscoelastic model. The non-isothermal dynamic mechanical characterization of
cured or partially cured systems will include effects of additional cure. The
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viscoelastic model is described by the dynamic mechanical behaviour shown
when the measured storage (E), and loss (E) moduli are plotted against
temperature.
2.6.2.2 Indentation hardness
The indentation hardness of cured epoxy samples can be measured by means of
a Barcol Impressor.
Pharr (1998) reviewed and discussed ultra-low load indentation (or
nanoindentation) techniques commonly used for measuring mechanical
properties of thin films and small volumes of material. The different indentation
techniques vary and can be classified according to the type of indenter used in
the measurement. Although the above mentioned work deals with small
quantities of material on a sub-micron scale, it still bears justice to this study as
mechanical properties can be determined by analysis of the indentation load-
displacement data.
According to Reghunadhan Nair (2004:89), enhanced modulus, compressive
strength and hardness are desirable improvements in epoxy resins. Good
mechanical performance offer immediate solutions for challenging problems.
Zhang et al. (2004) investigated the enhancement of wear resistance of epoxies
and found that the friction and wear behaviour can be improved through
enhancement of hardness, stiffness and compressive strength.
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CHAPTER 3
3.0 Research Methodology
3.1 Materials used and their preparation
The base resin used in this study was prepared from the reaction between
epichlorohydrin and bisphenol-A (Epon Resin 826 (ARH)) manufactured by
Resolution Performance Products, and supplied by Plastomax. The curing agent
used in this study was an aliphatic amine (Ancamine) also from Plastomax. Data
sheets representing the materials are presented in Annexure A.
The components of the system, the epoxy resin and hardener (curing agent),
were carefully weighed on an electronic scale and homogeneously mixed to a
ratio of 100:25 by mass (as per instruction from the supplier).
3.2 Gelation Study
A Rheometric Dynamic Stress Rheometer (RS-500) (Figure 3.1) equipped with
Orchestrator software was used under oscillatory dynamic mode to obtain the
experimental data reported in this study.
A parallel 25 mm diameter plate measuring head with a 0,2 mm gap was
employed. The measurements were carried out by using a small strain (5%) at
four frequency values (50, 15, 10 and 1 rad/s) and nine temperatures for each
frequency (30, 40, 50, 60, 70, 80, 90, 100 and 110C). The components of
complex modulus, complex viscosity and tan were measured and plotted
against frequency and therefore as a function of time.
The gel point was taken as the crossover value of the two components of the
complex modulus curves, namely the storage and loss modulus. (See Figure
3.2). Gelation occurs at time tgel=196 s, indicated by the crossover of the
components of complex modulus.
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Figure 3.1. Rheometric Dynamic Stress Rheometer (RS-500)
Figure 3.2. Typical plot of the loss and storage moduli, tan and
complex viscosity * against time for Rheological measurements
G'/G ' Crossover Point: 196
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The average time for the system to reaction to reach gelation, time Tgel,
was calculated from the data and plotted in Figure 3.2. This shows the
relationship between the time to gelation (tgel) and curing temperature
(Tcure) of the system.
3.3 Vitrification Study
3.3.1 Sample preparation
Small amounts of the initial reactive mixture as per section 3.1 (approximately 10
mg) were transferred into small DSC aluminium pans. These samples were
grouped in batches of 10 and sealed in plastic zip lock bags. The plastic bags
were stored in a freezer, at approximately -15C to prevent any cure taking place.
Sample pans were removed from the sealed plastic bags, and were allowed at
least 20 minutes to reach room temperature before placing in an oven for
isothermal curing at 60, 80, 100,120 and 140C for periods up to 4320 minutes.
A Perkin Elmer differential scanning calorimeter, Model DSC 7 (see Figure 3.4),
equipped with Pyris software was employed to determine the glass transition
temperatures. The heating profile consisted of a heating run from 25C to 150C
at 10C/min. The test was carried out in a nitrogen atmosphere with a flow rate of
20 5 ml/min. The parameters measured were the glass transition temperature
(Tg) and residual exotherm (Hr) of the reaction after the material had been
subjected to isothermal curing at the different curing temperatures.
Tgappears as an endothermic shift over a temperature interval in the DSC scan
as shown in Figure 3.3. In this study, Tg was taken as the mid-point of the step-
transition, while Hr of the remaining reaction appears as an exothermic peak in
the temperature range of the rubbery state of the material.
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Figure 3.3. Typical plot of a DSC scan of endothermic heat flow (mW) against temperature(C).
Figure 3.4 Perkin-Elmer Differential Scanning Calorimeter (DSC-7)
3.4 Dynamic Mechanical Thermal Analysis
3.4.1 Sample preparation
The reactive mixture (prepared as described in section 3.1) was poured into
specially created flat moulds made from impression material (Zetalabor Platinum
Laboratory High Precision Addition Silicone. Manufactured by Zhermack).
These samples were stored in a freezer, at approximately -15C to prevent any
cure taking place.
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Samples were removed from the freezer, and were allowed at least 20 minutes to
reach room temperature before moving to an oven for isothermal curing.
The cured samples were cut to approximately 5mm x 25mm x 1.5 mm, carefully
measured and mounted in the DMTA.
A Rheometric Scientific Solid Analyzer RSA II (DMTA), equipped with
Orchestrator software was used to obtain the experimental data (see Figure 3.6).
A Dynamic Temperature Ramp using the dual cantilever mode was employed
and measurements of the storage modulus (E'), loss modulus (E) and loss
tangent (tan ) of fully cured samples were carried out using a small strain (0.01
%) at a frequency of=6.28 rad/s.
The cured samples were subjected to temperature scans from 40 to 160C at a
rate of 10C/min.
DMTA analyses were performed on samples cured at three different
temperatures (70, 90 and 110C) for three different periods (30, 60 and 120
minutes). A typical DMTA scan is shown in Figure 3.5
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Figure 3.5. Typical plot of the storage modulus (E') and tan against temperature. (Taken from
Laza et al. (1998:43))
Figure 3.6. Rheometric Scientific Solid Analyzer RSA II (DMTA) in dual cantilever mode
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3.5 Indentation hardness
3.5.1 Sample preparation
The samples were prepared as described in Section 3.4 under Dynamic
Mechanical Thermal Analysis
3.5.2 Experimental procedure
A Hand-Held Portable Hardness Tester (Barcol Impressor, Model No. 934-1) was
used to obtain the experimental data (see Figure 3.7). The indentor consisted of
a hardened steel truncated cone with an angle of 26 with a flat tip of 0.157 mm
in diameter.
The test method used to determine the indentation hardness was performed in
accordance with Standard Test Method for Indentation Hardness of Rigid Plastics
by Means of a Barcol Impressor, ASTM Designation: D 2583 87.
Barcol indentation analyses were performed on samples cured at three different
temperatures (70, 90 and 110C) for three different times (30, 60 and 120
minutes). It must be noted that the impression hardness tests were carried out on
samples at room temperature.
Figure 3.7. The Impressor: A Hand-Held Portable Hardness Tester(Barcol Impressor, Model No. 934-1)
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CHAPTER 4
4.0 Results and discussion
4.1 Introduction
The results obtained from the experimental work will be dealt with individually in
this chapter. Results from gelation and glass transition temperature studies are
used to monitor the extent of cure of the thermoset system, and forms the basis
of characterizing the material. The results will be summarized in the form of an
isothermal time-temperature-transformation (TTT) diagram.
The results obtained from dynamic mechanical thermal analysis (DMTA) and
hardness tests will be used to illustrate the relationship between mechanical
properties and the molecular structure of the cured material as the molecular
structure of the system is dependent on curing conditions.
4.2 GelationStudy
The aim of the gelation study is to determine at what point during the curing
process of the thermosetting system gelation (Tgel) occurs. The experimental
results obtained from parallel plate rheology tests, as per Section 3.1., were
used to obtain crossover values of the storage and loss modulus curves as a
function of time. A derived summary of the average gel times (Log Time) for
tests performed at the four frequencies (50, 15, 10 and1 rad/s) and seven cure
temperatures (30, 40, 50, 60, 70, 80, 90, 100 and 110C) are shown in Table
4.1. Times to gelation for samples tested at low curing temperatures (30, 40
and 50C) are extrapolated from storage and loss modulus curves, as the
system solidified prior to reaching gelation. We can classify these as having
vitrified before the curing system could form a gel. The greyed out cells
represent measurements that could not be recorded due to premature
solidification of the resin system. The values of pre-gelation and premature
solidification will not form part of the calculations.
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Table 4.1.Average gel times (Log Time) for different frequencies
at the respective cure temperatures
Frequency (rad/s)
Gelation
Times
(Log t) 50.00 15.00 10.00 1.00
Average
(s)
Average
(min)
Log
Time
(min)
30 8326.95 8273.35 8973.95 10009.80 8896.01 148.27 2.17
40 4628.70 4830.05 4597.20 5722.45 4944.60 82.41 1.92
50 3007.05 3107.15 3273.30 3615.80 3250.83 54.18 1.73
60 1504.70 1677.15 1727.45 1661.25 1642.64 27.38 1.44
70 1020.21 1126.38 893.51 1008.60 1012.18 16.87 1.23
80 663.49 688.20 650.42 680.04 670.54 11.18 1.05
90 443.39 435.13 416.90 409.87 358.65 5.98 0.78
100 344.07 297.42 312.99 318.16 5.30 0.72
110 224.10 243.00 289.00 252.03 4.20 0.62
Further analysis of data from Table 4.1 presented in Figure 4.1 shows the
decrease in gelation times (Tg) for samples cured at higher cure temperatures
(Tcure). This indicates that there is a definite relationship between the time taken
for the polymer system to react and form a three dimensional network structure
and the temperature at which the system is cured. It is obvious that the time
taken for the system to form a gel decreases as the cure temperature
increases. The oscillation frequency at which the tests were conducted does
not have a real effect on gel times.
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20
30
40
50
60
70
80
90
100
110
120
0.40 0.60 0.80 1.00 1.20 1.40 1.60
Log Time (min)
Tcure
(C)
Figure 4.1. Time-temperature-transformation (TTT) diagram: Gelation contour.
4.3 Vitrification Study
The aim of the vitrification study is to determine at which point the
thermosetting system vitrifies during the curing process. Vitrification is a
transition from a viscous liquid or rubber to a glass and according to Gan et al.
(1989:803), vitrification is the point where the system solidifies. According to
Prime (1997:1383 &1569), vitrification can occur at any stage during
polymerization, either as a consequence of solvent evaporation or chemical
reaction. It is therefore important to be able to track and monitor the cure
reaction and define the phase changes that occur during cure and in doing so,
demonstrate the conditions where vitrification takes place.
Work by Gan et al. (1989:803), Gillham (1990, 1993), and Wang (1992),
illustrated that there is a sensitive one-to-one relationship between the glass
transition temperature, Tg, and the conversion in thermosetting resins. This
implies that Tg can be used as an index for measuring conversion during cure.
The glass transition temperature is a useful, sensitive, easily measured
macroscopic parameter for monitoring the cure process of thermosetting
systems. Measurements taken on samples cured at different cure
temperatures, Tcure, for different periods, tcure, were measured by differential
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4.3.1.1 Tg versus Tcure
Values ofTg determined by DSC and the corresponding Tcure values for cure
times tcure (1 to 72 h) are plotted in Figure 4.2. The contours show the
relationship between Tg, and Tcure.
Figure 4.2.Tg (C) vs. Tcure (C) for different isothermal heating times (1 hour through to72 hours). The reference line ofTg= Tcure is also included.
The reference lines included are ofTcure = Tg, and Tg= 107.6C. The value for
Tg is determined in Section 4.3.1.2.
By examining Figure 4.2, especially Tgvs. Tcure for the tcure=10 hours contour,
we note a definite increase in glass transition temperature with an increase in
cure temperature. It is important to note that samples cured at a constant Tcure
for increased time increments, show continuous increases in Tg values.Keeping in mind that Tg is used to monitor cure, we can see from the positive
contour slopes ofTgvs. Tcure at lower curing temperatures, that the cure is not
complete. Contours at higher curing temperatures, for longer curing times,
exhibit a flexure point in the slope of the plot and a definite maximum is
observed. This is a result of the competition between cure (which increases Tg)
Tg=107,6C
Tg=Tcure
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and thermal degradation (which decreases Tg) and is indicative of a
deteriorating molecular structure. The change is possibly due to de-vitrification,
and molecular breakdown as a result of thermal influences on the molecular
structures.
According to Gan et al. (1989:807), a system that exhibits contrasting values of
Tg>Tcure forTcure >Tg, even for prolonged cure times (tcure = 72 hours) indicates
that the system is highly reactive.
4.3.1.2 Tgversus tcure
The variation of Tg with log time at different isothermal temperatures is
illustrated in Figure 4.3. It shows that samples cured at constant temperaturesfor increasing cure times exhibit a general increase in Tgwhich is a result of the
curing reaction taking place and, is in accordance with that reported by Gan et
al. (1989:808).
Figure 4.3.Tg (C) vs. Log Time (min) for different isothermal temperatures (Tcure).
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4.3.1.3 Iso-Tgcontours
The data derived from Figure 4.3 was used to develop iso-Tg contours in the
format of a time-temperature-transformation (TTT) diagram and is shown in
Figure 4.5.
Figure 4.5. Time-temperature-transformation (TTT) diagram: Iso-Tgcontours.
As previously stated, the glass transition temperature is a useful tool to monitor
the reactions that occur during cure. The iso-Tgcontours can therefore be seen
as an extention of conversion curves. Vitrification of the system occurs when Tg
rises to Tcure. Vitrification will be discussed in the next paragraph.
Tcure (C)against LogTime (min)
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4.3.1.4 Prediction oftvit
Data from Figure 4.5 was used to compile Table 4.3, which, in turn, was used
to compile Figure 4.6. This illustrates the relationship between Ln time to a
fixed Tgand the reciprocal ofTcure (1/K).
The apparent activation energies, E, can be obtained from the slopes of the
linear relationships in Figure 4.6 (as in Section 4.1.2): E values are 18.19,
16.90, 26.80, and 46.82 kJ/mol, for the iso-Tg values 95, 98, 100, and 102C,
respectively.
Table 4.3 Numerical relationship between Ln time to a
fixed Tgand the reciprocal ofTcure (1/K).
Ln Time (min) Iso-Tg
Tcure
(C)
Tcure
(K) 1000/Tcure 93 95 98 100 102 104 105
60 333 3.00 5.73 8.01
80 353 2.83 3.73 4.14 5.00 6.26 7.71
100 373 2.68 2.58 2.95 3.82 4.49 4.79 5.66 7.44
120 393 2.54 2.30 3.09 3.73 3.89 4.37 5.07
140 413 2.42 2.60 3.89 4.31 4.81 5.04
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1.00
2.00
3.00
4.00
5.00
6.00
7.00
8.00
2.30 2.40 2.50 2.60 2.70 2.80 2.90
1000/Tcure (K)
Ln
Time
(min)
Tg: 95C
Tg: 98C
Tg: 100C
Tg: 102C
Figure 4.6. Ln time (min) to fixed Tgvalues (from Figure 4.5) vs. 1/Tcure (K).
According to Gan et al. (1989:810) and Prime (1997:1616-1617) (Arrhenius
Reference) the slope of the linear part of the Arrhenius plot, Figure 4.6,
represents the apparent activation energies, E, of an epoxy (thermoset)
system. Prime further explains that the activation energy may be viewed as a
time-temperature shift factor where the cure process can be described by a
single overall activation energy. The activation energies, E, as determined
from the slopes of curves from Figure 4.6 were used to determine vitrification
times as illustrated below in equations 4.1 to 4.4.
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The linear equations for the iso-Tgplots emanating from Figure 4.6 are listed
below:
186.181000.8827.7)(
=Tcure
tLn (r = 1) for iso-Tg= 95C [4.1]
904.161000
.7311.7)(
=
TcuretLn (r = 1) for iso-Tg= 98C [4.2]
803.261000
.672.11)(
=
TcuretLn (r = 1) for iso-Tg= 100C [4.3]
824.461000
.252.19)(
=
TcuretLn (r = 1) for iso-Tg= 102C [4.4]
The times to vitrification, tvit, were calculated by setting Tg = Tcure in the iso-Tg
equations, since vitrification is define to occur at Tg = Tcure. ForTcure = 95, 98,
100 and 102C, the logarithm10 of times to vitrification are 1.447, 1.750, 2.077,
and 2.26 minutes respectively.
The calculated values were used to construct the isothermal TTT cure diagram
simply because of the long experimental times for the system to vitrify.
The method used by Gan et al. (1989) to calculate vitrification times for a
thermosetting system, assumes the absence of diffusion control, solvent
evaporation, and thermal degradation. Their method describes the relationship
between the rate of reaction (-dx/dt), reactant concentration (x), activation
energy (E), temperature (T,K) and time (t) with the Arrhenius equation:
( ) )(/exp xfRTEAdt
dxa = [4.5]
or by integrating
( ) ( ) tRTEAxF a = /exp [4.6]
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A being the Arrhenius pre-exponential factor, E the activation energy, R the
gas constant (8,314 J/(mol.K)), and F(x), f(x) functions of x.
The analysis of thermal data obtained in this study, with support from work
performed by other researchers is summarized in an isothermal time-
temperature-transformation (TTT) cure diagram. The vitrification curve in a TTT
system cure diagram corresponds to a stage in the reaction at temperature Tg,
for time tvit.
The iso-Tgcontour for any corresponding pair of values ofTgand tvit is given by
the following equation;
( ) )vitgacurecureatRTEtRTE = /exp/exp [4.7]
Or
( ) curegcure
avit tTT
REt ln11
/ln +
= [4.8]
The use of equation [4.8], in conjunction with data fortcure = 3 hours from Figure
4.2, and E/R= 7882.7, obtained from time temperature conversion behaviour
forTg = 95C (assumed to be constant for lower conversions), indicates thatcure at 60C for 3 hours gives Tg = 92.5C, with log tvit = 1.88 min forTcure =
92.5C. Vitrification times were calculated for isothermal cure and presented in
Table 4.4.
Table 4.4 Calculated times to vitrification forTcure = Tg
corresponding to isothermal cure temperatures from Figure 4.2.
Tcure(C,
From Fig 4.2)Tg (C)
Tcure
(C)
tvit (Log
min)
60 92.5 92.5 1.88
70 95.2 95.2 1.95
80 97.7 97.7 2.02
90 99.1 99.1 2.05
100 101.4 101.4 2.11
110 103.2 103.2 2.15
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Figure 4.7 indicates the relationship between Ln time to gelation and the
reciprocal temperature (K);
583,111000.9374,4)(
=Tcure
tLn (r = 0.986) [4.9]
for which the apparent activation energy is 11.583 kJ/mol. The value of Tg at
gelation is expected to vary with Tcure since the measurement of gelation in this
study was carried out by means of parallel plate rheology.
0.00
0.50
1.00
1.50
2.00
2.50
3.00
3.50
2.5 2.6 2.7 2.8 2.9 3 3.1
1000/Tcure (K)
Ln
Time
(min)
Figure 4.7. Ln time (min) to macroscopic gelation vs. 1/Tcure (K).
The isothermal temperature at which the time to vitrification equals the time to
macroscopic gelation (extrapolated) is indicated as gelTg. This is calculated
using Eq. (8), where tvit corresponds to reaction temperature gelTg, equation
[4.9], and equation [4.10] which summarizes isochronal Tg versus Tcure data for
tcure= 3 hours of Figure 4.2.
5,77.25,0 += gcure TT (Tg
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The relevant expression becomes:
193.5
5,77'.25,0
1
'
17.7882583,11
'
4,4937+
+
=ggelggelggel TTT
[4.11]
Solving the expression, gelTg = 40.204C, log tvit = 1.82 min for Tcure =
40.204C.
4.4 Time-Temperature-Transformation Diagram
The results of the work done in the first two parts of this chapter can be
summarized in the form of a time-temperature-transformation (TTT) isothermal
cure diagram, as in Figure 4.8 where the progress of transformation of liquid to
glass or to rubber is shown by the gelation, vitrification and iso-Tgcontours.
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Figure 4.8. Summary time-temperature-transformation (TTT) diagram.
4.5 Mechanical property Vs. cure relationship
4.5.1 Areas for Analysis
The present investigation is aimed at indicating the relationship between cure
and mechanical properties. To facilitate this, a TTT isothermal cure diagram
(Figure 4.8) was used to determine regions or zones to illustrate the
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relationship and is presented in Figure 4.9 below. Figure 4.9 is a detailed
version of Figure 4.8.
Zone 1 through to zone 3 represents samples cured at Tcure = 70C for cure
times (tcure) of 30, 60, and 120 minutes, zones 4 to 6 are representative of
samples subjected to Tcure = 90C, and zones 7 to 9 to Tcure = 110C, for cure
times of 30, 60, and 120 minutes respectively.
Figure 4.9. Detailed TTT-Isothermal cure diagram showing areas
for DTMA analysis.
With reference to the generalised time-temperature-transformation (TTT) cure
diagram (taken from Prime (1997:1384)), Figure 2.1, zones 1 and 2 fall into a
conversion area beyond gelation but ahead of vitrification, zone 3 is after
vitrification.
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4.5.2 Dynamic Mechanical Thermal Analysis (DMTA)
As it would have been very time and material consuming, DMTA was chosen
as method of determining mechanical properties instead of tensile, impact and
bending tests. The results for storage modulus, E', and loss modulus, E as
obtained from DMTA scans in this study are dealt with separately for samples
cured isothermally at differentcure times (tc). The values forTcure and tc were
determined by means of the time-temperature-transformation (TTT) diagram
constructed in the previous section of this chapter.
The DMTA temperature scans were performed at a rate of 10C/minute, for
temperatures between 25 and 160C.
4.5.2.1 Storage Modulus
The scans show that systems cured at different temperatures (Tcure) display
different moduli but broadly similar dynamic mechanical behaviour.
Distinct changes in log(E') are evident and coincide with the glass transition
temperature (Tg) which is represented by the peak tan values.
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DMTA Graphs : 70C
0
0.2
0.4
0.6
0.8
1
1.2
20 40 60 80 100 120 140 160
Temperature (C)
TanDelta
6.0
6.5
7.0
7.5
8.0
8.5
9.0
9.5
10.0
StorageModulusLogE'
Tan Delta 30 min
Tan Delta 60 min
Tan Delts 120 min
30 min @ 70C
60 min @ 70C
120 min @ 70C
Figure 4.10-a. DMTA scans forTcure = 70C
DMTA Graphs for 90C
0
0.2
0.4
0.6
0.8
1
1.2
1.4
20 40 60 80 100 120 140 160
Temperature C
TanDelta
6.0
6.5
7.0
7.5
8.0
8.5
9.0
9.5
10.0
StorageModulusL
ogE'
Tan Delta 30 min
Tan Delta 60 min
Tan Delta 120 min
30 min @ 90C
60 min @ 90C
120 min @ 90C
Figure 4.10-b. DMTA scans forTcure = 90C
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DMTA Graphs for 110C
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
20 40 60 80 100 120 140 160
Temperature (C)
TanDelta
6.0
6.5
7.0
7.5
8.0
8.5
9.0
9.5
10.0
StorageModulusLogE'
Tan Delta 30 min
Tan Delta 60 min
Tan Delta 120 min
30 min @ 110C
60 min @ 110C
120 min 110C
Figure 4.10-c. DMTAscans forTcure=110C. Tan and storage modulus (E') vs. temperature
(C) for samples cured for different cure times (tcure, min) at different cure temperatures (Tc).
The results from Figure 4.10 are tabulated in Table 4.4 below. Subsequent
Tables and Figures were derived from this Table.
Table 4.4. Results from DMTA
Tan E' (Pa) Tg (C) Time (min) Tan E' (Pa) Tg (C) Time (min) Tan E' (Pa) Tg (C) Time (min)
70 0.74 1.69E+08 91.30 7.95 1.10 7.12E+07 96.06 8.45 0.83 8.45E+07 98.14 8.65
90 0.99 6.01E+07 109.82 9.75 0.83 5.65E+07 111.13 9.93 1.15 8.60E+07 113.37 10.27
110 0.75 1.08E+08 110.71 9.83 0.95 1.05E+08 114.84 10.42 0.79 5.51E+07 112.39 10.05
Cure
Temperatures
(Tcure,
C)
30 min 60 min 120 min
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4.5.2.2 Glass transition temperature (Tg)
A dynamic mechanical thermal analyser (DMTA) was used to determine the
modulus and tan as a function of temperature and/or frequency. The samples
were tested under three-point bending mode, known as dual cantilever. According to Laza et al. (1998), and Mafi et al. (2005), the glass transition
temperature, Tg, is generally defined as the maximum in the tan curve.
The contours of Tg values against tc (log time) as in Figure 4.11 below,
indicates the relationship between Tg, Tcure, and tcas determined by DMTA.
80
90
100
110
120
0 20 40 60 80 100 120 140
Cure Time (min)
Tg
(C)
Tcure : 70C
Tcure : 90C
Tcure : 110C
Figure 4.11. T