CSC Upgrade

04/22/23 1Petr Levchenko NEC 2011, Varna

CMS Endcap Region

CSC Upgrade

Scope Original design unfinished – ME4/2 not built 72(67) ME4/2 chambers to complete system

Increase redundancy of system – 3 year run without access to do repairs

Efficient triggering at high luminosities New digital CFEB boards for ME1/1 (part of M&O)

Increased capacity for data rate Ungang the ME1/1 strips – 7 CFEBs per chamber instead of 5 72 New Datamother (DMB) boards

Replace of 72 ME1/1 Trigger Mother Boards (M&O) Improve triggering for = 2.1 to 2.4

04/22/23 3Petr Levchenko NEC 2011, Varna

ME1/1 Upgrade Overview ME1/1 Electronics replacement is designed to

Eliminate ME1/1a strip ganging Provide deadtimeless readout (including at SLHC rates) Improve triggering for ||>2.1 Liberate CFEBs for ME4/2

Major components New Digital Cathode Front End Boards (DCFEBs), 7/ME11 chamber New Trigger Mother Board (TMB) Mezzanine card New Optical Data Motherboard (ODMB) Optical transmission of signals from DFEB to ODMB and TMB New Low Voltage Distribution Boards (LVDB) and Low Voltage

Mother Boards (LVMB)

04/22/23 4Petr Levchenko NEC 2011, Varna

Strip Ganging in ME1/1a

66 77

Channel 16

…ElectronicsChannel 1

… …

Strips: 1 16 17 32 33 48

…

48 strips of ME1/1a are ganged 3:1 into 16 readout channels: 1+17+33 strips into the 1st channel 2+18+34 strips into the 2nd channel etcThis feature leads to triple ambiguity (ghost segments) and compromises trigger efficiency at high ratesSolution: use of 3 CFEB boards instead of one for ME1/1a

04/22/23 5Petr Levchenko NEC 2011, Varna

Overview of CSC readout

Trigger Motherboard

● Need to implement more complex algorithms to increase trigger stub finding efficiency for high eta 2.1 < I η I < 2.4 with unganged ME1/1a● Compatibility with seven new DCFEBs which provide comparator outputs for the CLCT processorNew components of TMB Mezzanine => extra optical transceivers, EPROM are the platform for radiation tests of these components at the Texas A&M cyclotron (60 MeV protons)04/22/23 7Petr Levchenko NEC 2011, Varna

TMB Mezzanine prototype

DAQ Motherboard

● Replace 5 copper cables to CFEB with 7 optical links to DCFEB● Developing radiation tolerant FF-EMU ASIC (IBM CMOS 130 nm) for the integrated distribution of TTC signals and for the data readout ● Implement all FIFO buffers inside the Virtex-6 FPGA● Custom backplane connections remain unchanged

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Present CFEB

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Present Cathode Front-End Board

● 4..5 CFEBs per chamber● 6 planes x 16 strips = 96 strips per CFEB● 96 switch capacitors per channel, or 96 x 50 ns = 4.8 us

04/22/23 10Petr Levchenko NEC 2011, Varna

New DCFEB

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DCFEB Prototype

● Same size as old CFEB board● Same input connections and 6 BUCKEYE amplifier-shaper ASICs● 12 Texas Instruments ADS5281 ADC (8-channel, 12-bit, 50 MSPS, serial LVDS output) ● 4 options for preamp/ADC interface to evaluate ● 2 legacy skewclear connectors compatible with old TMB and DMB● 3.2Gbps optical links to new TMB and new DMB● Xilinx XC6VLX130T-FFG1156 FPGA (~$1,200)● 20-layer PCB

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DCFEB R&D prototype Two cards received in mid-

March Fab: Compunetics assembly: Dynalab

Prototype tests at OSU: many initial problems

(odd/even pedestal differences, some FADC’s not working, PROM not working, bad voltage regulators, but all working now

analog part tested and input coupling scheme decided

One board currently at CERN for testing with real CSC chamber in Bat 904

(see following slides from Stan Durkin)

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Channel

AD

C c

ount

s

Channel

RM

S(A

DC

cou

nts)

CFEB 1DCFEB

DCFEB Pedestals – Typical Chip DCFEB and CFEB1 Noise

DCFEB Prototype Quieter than Old CFEBNo SCA so noise reduces by 1.3 ADC counts in quadrature

Stan Durkin

DCFEB Prototype Channel Noise

04/22/23 14Petr Levchenko NEC 2011, Varna

LVDB and LVMB boards New Low Voltage Distribution

Boards for ME1/1 Changes

7 DCFEBs additional temperature sensors additional DAC reference voltage new connector types Latch-up protection diodes

JINR/NCpHEP responsibility Prototypes set up for production Test setup in ISR

New Low Voltage Mother Board

New interface to ODMB Support for additional voltage

controls Under study by UC Davis (Britt

Holbrook)

Old LVDB

Section of layout of new LVDB prototype

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Mockup of the new LVDB and DCFEBs on ME1/1CSC

Physical Installation Mockup

Vladimir Karjavine

Chambers Build 72 chambers to

complete the 4th station

Build & operate a new factory in B904

Use some on-chamber electronics from ME1/1

Construct/build infrastructure (electronics, power, cooling, etc.) to operate these chambers

Scope of ME4/2 Project

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pa

ne

l s

tora

ge

Incoming parts

5m

Loadingarea20

m

Gas

Panel cleaning/gluing

Str

ip g

luin

g

25m

hand soldering Kit preparation

10m

10mL

on

g t

erm

gas

&

HVElectronics

assemblyFast site testing

10m 10m15m 15m

7m

6m

7mPacking

Chamber storage

area6m

C

ham

ber

rac

k

clean Lab 1 clean Lab 2 platform

• Incoming parts

• Kit preparation

• Panel bar gluing

• Wire wiring, gluing, soldering (Lab 1)

• Electrical components hand soldering

• Chamber assembly & test (Lab 2)

• Long term gas, HV tests

• Electronics assembly & Fast site test

• Final inspection packing, storing

Chamber production workflow

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Panel gluing

Anode wire fixation bars

Cathode gap bars

Glue dispenser

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Clean room 1: Winding

• About 1000 50μm thick AuW wires are winded on the anode panel with a ~3.16mm pitch. Total wire length ~2600 m per panel. Winding time: ~4h per panel. 200 μm thick field-shaping CuBe wires are tensioned (500g) and soldered beforehand

• Then, mylar fixation strips are glued onto the wire-end before wire soldering

04/22/23 20Petr Levchenko NEC 2011, Varna

Clean room 1: Automatic wire soldering

• Automatic wire soldering is done using the Panasonic machine. Re-commissioning of the machine was successfully done (O. Prokofiev FNAL)

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Component soldering area

• 2 fully equipped soldering stations with local smoke extractors

Hand soldering of components (R, C), connectors, ground strip on panels

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Completed anode panel

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Clean room 2: Panel assembly

• 4 Cathode and 3 anode panels are cleaned, tested, assembled and sealed using two assembly tables (surveyed to better than 1mm flatness)• Chamber is tested for leaks and HV (1 day)

Ionized air gun

Assembly tables

HV rackgas

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TMB Mezzanine

Chamber assembly

• Assembly operations:• cathode panels continuity check• anode panels electrical tests (wire capacitance, HV, • prepare for chamber assembly • clean panels using ionized air knife• position chamber frames and dry assembly• continue electrical tests• chamber RTV sealing• install HV cables and ground foil• assembly chamber frames • short term HV training and leak test (with Ar)

• Benchmark ~28h chamber for assembly + ~1day for testing.

FNAL factory !

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Long term test area

• Assembled chambers will be placed on a 8 chamber rack to undergo long term (~2 months) HV training (3.6-3.8 KV) and leak test

• Standard ArCO2CF4 gas mixture is used. Anticipated gas costs are ~12 KCHF/year

PSL design

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June 30, 2011 ME4/2 Project Progress Review (AL UW) 27

• On-chamber electronics integration and full (fast-site) testing will be part of the production workflow:

• mount/test cooling plate• strip/wire r/o electronics and cables• LV distribution & monitoring boards

• For chamber testing we will use upgraded test stand with the new h/w and s/w

Electronics integration & chamber testing

AFEB Test Stand has been revised:● Measure basic characteristics of AFEB amplifier-discriminator chip (CMP16) and board (AD16)● Tabletop setup● Developed at Carnegie Mellon University ~10 years ago

Present FTEs 1 FTE from UW (Factory Manager) 1 FTE from CERN (Floor Manager) 3 FTE from PNPI (Production Eng. + 2 production Eng/Tech)

Should become 4 FTE from September (+1 prod. Tech) 2 FTE from IHEP (Production Tech + Student/Supervisor) 1 FTE from UCSB (Production Tech) ~2 FTE from UCLA+PNPI (Physicists, Prod. Eng, Prod. Tech)

Tot: ~11 FTE

Expected FTEs:

Tot: ~ 13 FTE

Caveat: Some of the people are key experts within CMS TC and will be required to intervene during extended technical stops for detector and infrastructure maintenance [S. Kreyer (tracker cooling), S. Di Vincenzo (beam pipe, infra), AL(CSC)]

inventory/kits 1FTE long term test 0.5 FTE

panel gluing 2 FTE integration+test 2 FTE

winding/soldering 1.5 FTE packing/storage 0.5 FTE

Component soldering 2 FTE QC/QA 0.5 FTE

Tension+assembly+test 2FTE Factory Manager 1 FTE

Factory labor

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people

The golden team

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Summary

CSC Upgrade will be essential as luminosity increases.

ME1/1 electronics design, prototyping etc.. In progress.

ME4/2 Factory site available & operational in 2011.

Delays will make it difficult to install CSC according to CMS plans

04/22/23 30Petr Levchenko NEC 2011, Varna