Creating Greater Capacity on Smaller Spaces · Test1 Test 2 Original Intermediate Polymer Stamp •...

Creating Greater Capacity

on Smaller Spaces

Manufacturability of Pattern MediaBabak Heidari, Obducat, Sweden

2008-Copy Right -Obducat

Company Background

Founded in 1989

Facilities in Sweden (HQ) and in Cambridge UK

Obducat Overview

2008-Copy Right -Obducat

Business Concept

Obducat´s business concept is to develop and supply

lithography solutions for production and replication of advanced

micro- and nano structures for mass production as well as for

R&D purposes.

The company’s sales encompass equipment, stampers and

process know-how.

Obducat Overview

IDEMA ASIA PACIFIC 2009 © Obducat

Toshiba: DTR drive level demo 333 Gb/in2

400 Gb/in2

150 Gb/in2

1 T/in2

6,25 T/in2

TDK: DTR 602 Gb/in2

Blu Ray (25 GB/disk)

ResearchRoadmap

Manufacturing

Optical disk1996: DVD (4.7 GB)

1982: CD (700 MB)

Perpendicular Pattern media + HAMRLongitudinal

Near field

(>100 GB/disk)

Dat

a D

ensi

ty (T

bits

/in2 )


Intermediate polymer stamp (IPS®)

Mother Stamp

IPS® (Intermediate Polymer Stamp)

IPS® (UV-transparent film)

IPS ®STU ® -polymer

Constant working temperature

UV-radiation

STU ® -polymerSubstrate

IPS®UV monomer

UV-radiation

UV-polymerSubstrate

STU® UV

Nano Imprint Lithography Process, High volume manufacturing


OutlineOutline– Background technology

– Nano Imprint lithography for DTR

– Quality Control

– Electron Beam Recorder

– Stamp manufacturing

DTR implementation

……Sputter Cleaning Coating Imprint Etch Strip Overcoat ……

Process adds for DTR manufacturing

Applied Material,Canon Anelva,Intervac,Trion Technologies,Veeco


Background technology DTR manufacturing compare to Optical disk Manufacturing

Stamp fabrication Final imprints on HDD substrates

- Producing One Master stamp

- Producing multiple copies from the master called Mother-stamp

- Producing multiple copies from each Mother-stamp called Intermediate polymer stamps (IPS)

- Use IPS for final imprints

Mother stamp

Intermediate stamp

Final disk

1st stamp

Mother stamps


Replicated IPS from Ni-stamp

0

5

10

15

20

25

30

35

40

250 500 1000 1500 2000 2500 3000 3250

Replication

Test1Test 2Original

Intermediate Polymer Stamp

• Surface modification– Apply anti adhesive coating

on the Nickel stamp

• Improving the IPS material– Optimum mechanical

stability.

• Best compatible match between IPS and Substrate resist.– Easy de-molding

• Short cycle time (<10 sec.)

• High density pattern compatibility

In collaboration with Prodisc


•• Nano Imprint Lithography for DTRNano Imprint Lithography for DTR

DTR implementation


IPS #1Constant working temperature

UV-radiation

STU-polymer

HDD disk

STU

IPS #2

STU-polymer

HDD disk

IPS #1

STU-polymer

IPS #2

STU-polymer

HDD disk

Double side imprint (IPS®-Disk-IPS®)

Etching Ion implantation

Process time: 2-8 second

Depending on material


Double side imprint (IPS-Disk-IPS)

2,5” HDD disk

Test structure for developmentDTR structure

Side A

Side B

Side A

Side B


NIL - Uniformity

DTR Pattern replication in resistDTR Pattern replication in resist

5x5x

DTR implementation


NIL - Uniformity

Residual layer analysisResidual layer analysis

003.011

003.008

003.014

Residual layer: 12nmResidual layer: 12nm

DTR implementation


•• Quality ControlQuality Control

DTR implementation


Technologies for DTR implementation

Requirements for quality control:- Measurement time: 1-10 s/disk- Automatic Quality Rating

Cleaning Coating Imprint Etch Strip

Production line for DTR manufacturing including Quality Control

QC QC QC QC

HVM and Pre-production Inspection items1. Defect inspection

• Rating dependant on location and type of defect in different steps of manufacturing process

2. Imprint properties;

• Resist thickness control, coating homogeneity, substrate defects

• Residual Layer, Imprint depth

• Critical Dimension (LW …), land/groove ratings

3. Pattern transfer quality: Fly-test, Servo-following test, …


The Fully Automated n&k Gemini

The Manual-Load 1900-CDRT Disk

• Spot Size: 50µm • Automated X-Y-Z Stage• Automated θ Stage • Modular Design – Easy to

Maintain and Service• Analysis Based on Combined

– Forouhi-Bloomer Dispersion Equations

– Rigorous Coupled Wave Analysis (RCWA)

Automated System for DTR & BPM Disks

Serves as the engine of the n&k Gemini configured for disks

www.nandk.com

Fully Automated or Manual for Production or R&D

Pattern Inspection system for process control


Nickel, Quartz or other materials Substrate

SUL

MagDLC

DLC

ResistRLT

DLCMag

SULSubstrate

Final processed diskImprinted diskStamp

Pattern Inspection system for process control

- Focus spot: 50 µm

- Speed: 1s/point

- 190 – 1000 nm spectrum in 1 nm

- CD measurement: sub 20nm


ETA-IS Inline Scanner

www.audiodev.com

Defect Inspection system for process control



New system for DTR quality control

www.audiodev.com

- Defect measurement and analyze

- Speed: 1s/disk


Detection, measurement and classification in scanner equipment

User settings:

Limit of number of the different kind of defects for approval in production process



•• Electron Beam Recorder (EBR)Electron Beam Recorder (EBR)

DTR implementation


Electron Beam Recorder, EBR

EBR

Final output data is calculated on the fly during exposure

• System (EBR)– Linear and Rotation Stage (θ-x)

– Thermal Field Emission (TFE)

– 30KV and 50 kV

Software for On Fly Pattern generation• HDD pattern writer

– DTR, BPM, Concentric patterns

• Optical disc writer– BluRay, HD-DVD, Next generation

optical disc, Spiral patterns


E-Beam exposed resist (70 nm pitch)


•• Nickel Stamp ReplicationNickel Stamp Replication–– Father stampFather stamp

–– Mother stampMother stamp

DTR implementation


• Sputter Metal seed-layer

• Electroplate 300um thick Nickel layer

• Separate the Nickel metal from the Master

This nickel stamp is calledFather-Stamp

Nickel Father-Stamp

Nickel Stamp Fabrication for HVM


• Apply a mono-layer Oxide on the Father-stamp, serving as separation-layer

• Electroplate new Nickel-stamp (Mother-stamp) from the father

• Repeat the last electroplating process to produce several Mother-Stamps

Nickel Stamp Fabrication for HVM

Nickel Mother-Stamp


Roadmap Stamp – HDD

20081st Half 2nd Half

Current status:Down track 3σ: 4nmCross track 3σ: 8nm

Tp: 80 nm limited area Tp: 120 nm full area

Tp: 60 nm limited areaTp: 80 nm full area Tp: 60 nm full area

2007 2009

Targets 2008:Down track 3σ 3nmCross track 3σ 6nm

1st Half 2nd Half 2010

Targets 2010:Down track 3σ 2nmCross track 3σ 4nm

Tp: 40 nm full area


Conclusions

Manufacturing:Manufacturing:•• Learn from comparable technologies e.g. optical disc manufacturiLearn from comparable technologies e.g. optical disc manufacturingng•• Electron Beam Recorder and Imprint lithography for DTR Electron Beam Recorder and Imprint lithography for DTR •• Quality control technologies are under developmentQuality control technologies are under development

Beyond 1 Tb/inBeyond 1 Tb/in22 : : •• Develop SelfDevelop Self--assembly technology in BPM or DTR to increase areal assembly technology in BPM or DTR to increase areal

density above 5 Tb/indensity above 5 Tb/in22

•• Combine DTR/BPM with HAMR to increase areal density hopefully Combine DTR/BPM with HAMR to increase areal density hopefully up to 50 Tb/inup to 50 Tb/in22


Thank you for your valuable time

www.obducat.com

Creating Greater Capacity on Smaller Spaces · Test1 Test 2 Original Intermediate Polymer Stamp •...

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