Conference Schedule at a Glance

November l2 (Mon) November l3 (Tue) November l4 (Wed) November l5 (Thu)

Registration8:30-9:20 Keynote Lecture 3

Zeng-Yuan Guo8:50-9:40

Keynote Lecture 5

Takemi Chikahisa8:50-9:40

Opening

Keynote Lecture I

Gang Chen9:40- I 0:30

Keynote Lecture 4

Mamoru Tanahashi

9:40- l0:30

Keynote Lecture 6

Peng Zhang9:40-10:30

Break Break Break

Short Presentation I

l0:40-l l:30Short Presentation 4

l0:40-l l:30

Short Presentation 6

l0:40-ll:10

Poster Session 6

I l:10-12:00

Poster Session I

I I:30-l2:30Poster Session 4

I l :30-12:30

Lunch BreakI 2:00- I 3:00

Lunch Breakl 2:30- I 3:30

Lunch Breakl2:30-13:30

Short Presentation 7

l3:00-13:40

Keynote Lecture 2Sung Jin Kiml3:30- l4:20

Short Presentation 5

l3:30- 14:20 Poster Session 7

I 3:40- 14:40

Coffee BreakPoster Session 5

l4:20-15:.20Closing l4:40-14:50

Short Presentation 2

l4:50- l5:40

Technical Tour

Mitsubishi Historical Museum

l5:00-16: t 0

Departure time of shuttle bus:

l5:00

Break

Poster Sessiorr 2

l5:40-16:40

fukivama Award l5:50-16:0(

Award LecturePeter Stephan

| 6:00-16:50

Registrationl6:00-18:00

ReceptionI 7:30- l 9:00

Break

Short Presentation 3

l6:50-17:40PickuP to banquet

Departure time of shuttle bus:

l7:00 - 17:50

Poster Session 3

l7:40- l8:40

Banquet@lnasa-Yamal8:30-20:30

1-

Dear IFHTZD 12 P articipants,

On behalf of the Organizing Committee and Executive Committee, we would like to welcomeyou to the 3rd International Forum on Heat Transfer, IFHT2O12.

The IFHT is an international forum organized by Heat Transfer Society of Japan. It started inSeptember 2004 in Kyoto (Professor Maruyama was the forum Chair then), followed by the secondforum held in Tokyo in 2008 (Professor Sato was the Chair). This year, the third IFHT takes place

in the resort city, Nagasaki. The IFHT encompasses a broad range of heat and mass transfer,thermophysical propereties and combustion sciences from nanoscale to macroscale.

In accordance with the custom established through the last two conferences, a general session

consists of short oral presentations, followed by a poster session. All speakers are asked to give a

short oral presentation about their research within one and a half minutes, and then move onto.aposter presentation for more detailed information. In this style, speakers need to put together theirresearch into one or two slides, whereas audiences can take note of the research of their interest inthe short oral presentation and ask the speakers to explain their research more in detail later in the

poster presentation. We believe this is an ideal style for us participants, in that rve can understand

the whole picture of the session and also learn details of the research that we are interested in.

In the third IFHI besides nearly 140 presentations, six keynote speakers from China, Korea,

the United States, and Japan, and one Nukiyama Memorial Award recipient from Germany are

invited to deliver lectures. The keynote speakers are the world's top level scholars in the areas ofenergy conversion, fuel cell system, combustion science and electronic cooling.

The Nukiyama Memorial Award was an international award established by the Heat Transfer

Society of Japan on its 50th anniversary to commemorate outstanding contributions by Professor

Shiro Nukiyama at Tohoku University. Professor Nukiyama was an excellent heat transfer scientist

who found the boiling curve. The Nukiyama Memorial Award shall be bestowed biennially to ascientist around 50 years of age or younger. The first prestigious Award is bestowed to Dr. Peter

Stephan, a professor of Technical Termodynanics at the Technische Universitiit Darmstadt in

Germany. The Award ceremony and lecture are scheduled on the second day of the forum.

On the final day of the Forum, Technical Tour to visit Nagasaki Shipyard & Machinery Works

and Nagasaki Research & Development Center is planned. In addition, selected papers of the

IFHT2Ol2 will be published in a special issue of the Journal of Thermal Science and Technology.

With the holding of the lFHT20l2, we would like to express our sincere appreciation for all the

cooperation and support from our cooperating societies, including ASME International Japan

Section, Combustion Society of Japan, French Heat Transfer Society, International Centre for Heat

and Mass Transfer (ICHMT), Japan Institute of Energy, Japan Society of Fluid Mechanics, Japan

Society of Mechanical Engineers, Japan Society for Multiphase Flow Japan Society ofThermophysical Properties, Korean Society of Mechanical Engineers, Society of Chemical

Engineers, Japan, The Chemical Society of Japan, Turbomachinery Society of Japan, and

Visualization Society of Japan

Finally, we all hope you enjoy presentations and lively discussions in the Forum and have a

wonderful time in this attractive resort city, Nagasaki.

Yasuyuki Taknta, Kyushu University, Organizing Committee Chair

Koji Miyazafri, Kyushu Institute of Technology, Executive Committee Chair

2-

General Information

Meeting Area Floor PIan

Technical sessions consist of short oral presentations and poster presentations. All oral

presentations and Keynote Lectures will be held in the International Conference Hallon the third floor. Poster presentations will be held in the Lounge on the third floor ofthe Brick Hall.

Registration

The registration desk will open at 16:00 on Monday, November 12,2012, in the Lobby

on the third floor of the Brick Hall. Registration will be available from Tuesday to

Thursday at the same place. Only cash (Japanese Yen) is accepted for on-site

registration.

Welcome Reception

There will be a welcome reception on the evening of November 12,2012. All attendees

are invited. The reception will start at I 7:30 (and end at l9:00) at the Lounge on the

third floor of the Brick Hall.

Lunch and Banquet

There are many restaurants for lunch within walking distance of the Brick Hall. The

Conference Banquet will be held in Garden Terrace Nagasaki (http://www.st-

naeasaki jpA from l8:30 to 20:30 on Wednesday, November 14, 2012. A full course

dinner will be served. All registered attendees are invited to the Conference banquet.

Banquet tickets for accompanying persons are available at the registration desk.

Keynote Lectures and Audio-Visual Aids

Keynote Lectures will take place in the International Conference Hall. A full-color

projector equipped with a connection cable with D-sub mini l5-pin male connector for

RGB-video is available. Also, a Windows PC with MS PowerPoint and Adobe Acrobat

Reader installed is available for use if you bring your presentation data on your USB

flush memory or CD-ROM.

All Technical Presentations except Keynote Lectures

Alltechnical sessions consist of short oralpresentations and poster presentations.

3-

General Information

Meeting Area Floor Plan

Technical sessions consist of short oral presentations and poster presentations. All oral

presentations and Keynote Lectures will be held in the International Conference Hall

on the third floor. Poster presentations will be held in the Lounge on the third floor ofthe Brick Hall.

Registration

The registration desk will open at 16:00 on Monday, November 12,2012, in the Lobby

on the third floor of the Brick Hall. Registration will be available from Tuesday to

Thursday at the same place. Only cash (Japanese Yen) is accepted for on-site

registration.

Welcome Reception

There will be a welcome reception on the evening of November 12,2012. All attendees

are invited. The reception will start at l7:30 (and end at 19:00) at the Lounge on the

third floor of the Brick Hall.

Lunch and Banquet

There are many restaurants for lunch within walking distance of the Brick Hall. The

Conference Banquet will be held in Garden Terrace Nagasaki (http://www.et-

naeasaki.ipl) from 18:30 to 20:30 on Wednesday, November 14, 2012. A full course

dinner will be served. All registered attendees are invited to the Conference banquet.

Banquet tickets for accompanying persons are available at the registration desk.

Keynote Lectures and Audio-Visual Aids

Keynote Lectures will take place in the International Conference Hall. A full-color

projector equipped with a connection cable with D-sub mini l5-pin male connector for

RGB-video is available. Also. a Windows PC with MS PowerPoint and Adobe Acrobat

Reader installed is available for use if you bring your presentation data on your USB

flush memory or CD-ROM.

All Technical Presentations except Keynote Lectures

All technical sessions consist of short oral presentations and poster presentations.

3-

Short Oral Presentation

The presentation is limited to 90 seconds and the entire slideshow should be set up

in landscape orientation and not exceeded two slides. Animations (visual effects

and movie) cannot be used. The slideshow file should be submitted by e-mail at

ifht2O I 2c@celcius.mech.nagasaki-u.acjp by October 3 l, 2Ol2 (Wed.). Files

created in PDF and Microsoft PowerPoint (.ppt) are accepted but PPT file will be

converted to PDF.

Poster Presentation

Each poster will have an assigned space in the Lounge. The size of the poster board

is 90cm in width x 200cm in height with thumb tacks. It is strongly recommended

that posters be printed on a single sheet (e.g., an A0-size sheet with the shorter side

at the top). Each poster station will have an identification number on your paper.

It is the author's responsibility to remove all the posters and clean the area at the

end of the session.

Banquet@Inasa-yama

The 5 pickup shuttle buses for the Conference Banquet venue (Inasa-yama) will be

readied at l7:00 behind the building of the Brick Hall.

The bus will start as soon as the number of the passenger reaches the capacity of the

bus. and the last bus will start at l7:50.

4-

Organizing

ChairYasuy:ki Takata, I(yuhu LiniaersiA, JaPan

Comrnittee MembersPradeep Bansal

Uniaersiry oJAackland, Neu Zealand

Chin-Hsiang Cheng

National Chezg Kttng U niaersi!, Taiwan

I{atsunori Hanamura

To@o Institate of Tecbnology' JEanMoohwan Kim

Po bang U niuersig of S cience and Techno logy,

Korea

Ivlasamichi KohnoI(ya s ha (J xiuers i q, J E an

Joon Sik Lee

Seoal National (jniaersiry, Korea

Josua P. Nleyer

Uniaeniry of Pretoia, Sotth AJnca

I{oji N'Iiyazaki

fu^ho lnstitate of Tecbnology' JapanI{azuhiro Nakabe

Iloto Uniursilt, JaPan

Taku Ohara

To ho ku U niue rsi !', J aPan

Fliroto Sakashita

Ho kkaido U niuersiry, J aPan

Naoki Shikazono

Uniuersiq of Tokyo, JaPan

Yutaka Tabe

Ho kkaido U niaersiy, J EanTostrio Tomimura

Ksmamoto Uniuersil, J @anSebastian Volz

Ecole Cextrale Pait, Frann

Tomohiko YamaguchiN agas a ki U niuersi 9, J Ean

Hideo YoshidaI(yo to U niaersi ry, J aP an

Tianshou ZhaoHongKongUdwrsiry of Scienn and

Technobgy, China

Gommittee

JuergenJ. BrandnerKarlsrube Institate of Technokg, Cermany

Masayuki Fukagawa

Mitvtbishi Hearl lndustiu, Lsd., JapanTassos G. Karayiannis

BnmelUriuersij, U.KSungJin Kim

Korea Adaanced lutinrtu of Science and

Techno/ogy, Kona

Yoshihiro KondoHitachi Ltd., Japan

Iiaoru Nlaruta

Tobokr Uniaeniry, JaPan

Sushanta Nlitraliniwrsil of Albena, Canada

Satoru ivlomokiN agn a ki U n iue rsi Y, J aPan

Iiim Choon NgNational Uniuersig of Singapon, Sing@ore

Alfonso Ortegal/illanoaa U niuersigt, U.S A

Khellil Sefiane

Uniaeniry of Edinburgh, U.KYuji Sr:zuki

Uriaersig of Toklo, JaPan

Hiroshi TakamatsuI(y s hr U niuersi ry, J aP an

Takaharu Tsuruta

I(1ushu Institite oJ Techno logt, J apat

Akira Yamada

Mitsubisbi Heary lndzutiu Ltd.' Japan

Atsumasa Yoshida

Osaka Prefeaun Uxiuersi4t, JaPan

Xing ZhaogTsinghu a U niae rs i E, C h i n a

5-

Executive Gommittee

ChairK<rii Miyazaki,I(ynsha Instituh of Technology, Japaz

Comrnittee MembersHirofumi Arima Masayuki Fukagawa

Saga Udwrsiry, JEan Mitsubirhi Heatjt Indrstries, I-td., JapatYoshinori Flamamoto N{asaru Ishizuka

b^h, Uiluersig, Japan Tolama Pnfearral Uniaersig, JEanKeishi Kariya Masamichi Kohno

I9^ho Udaersiry, Japan l(yasbu Uniaersij, JapatSatoru Momoki Fliroto Sakashita

Nagasaki Uniursiry, Japan Hokkaido Uniuersi!, JapaxNaoya Sakoda Soichi Sasaki

b^ho Uniuersij, Japax Nagasaki Ltniwrsig, JapanNaoki Shikazono Yutaka Tabe

Uilaersij of Tok1o, Japar Hokkaido Llniaersil' JapanYasuyrrki Takata Tomohiko Yamaguchi

I(1usha Uniaersig, Japan Nagasaki Uniwrsii' JapanAtsumasa Yoshida

Osaka Pn-fectan Ltnitwsig, Japnt

Gooperating Societies

ASNIE International Japan Section

Combustion Socieq' of JapanFrench Heat Transfel Socieq'

Intemational Centre for Heat and Mass Transfer (ICHMD

Japan Institute of Energy

Japan Society of Fluid Machanics

Japan Society of Mechanical Engineers

Japan Society for Multiphase Flow

Japan Society of Thermophysical Properties

Korean Society of Mechanical Engineers

Society of Chemical Engineers, JapanThe Chemical Society of JapanTurbomachinery Society of JapanVisualization Society of Japan

6-

t00

201

r6l

Experimental studS on the thermal performance ofa pulsating heat pipeJungseok Lee' Young Jik Youn, Sung Jin Kim (Korea Advanid Inttitut" of Science and Technologlt)

A flow modeling for a piezoelectric heat sinkHeeseung Park, sung Jin Kim (Korea Advanced Institute ofscience and rechnologlt)

Performance of heat pump c-r cle using zeotropic mirrures of R r 234ze(E) and R32shotaro Yamamoto, Sho Fukuda, Shigeru Koyama (K.vusyu University)

Prediction of flow boiling heat transfer coefficient of binary mi.rture (HFol2341f +R32) in a horizontal smooth rubeMinxia Li (Tianjin (Iniversityl, Chaobin Dang, Eiji Hihari (t/niversity of rokyctl

Effect of lubricating oil on flow boiling heat transt'er of low GWP refrigerant HFo- 12341 f in a horizontal small-diametertubeShizuo Saitoh, Chaobin Dang, Eiji Hihara (Universitl,of Totcyo.l

Speed of sound measurement in HFo- l 2341'f liquid phase using a sound velocitr sensorLei Gao, Takuro shibasaki, Tomohiro Honda, riiroyuki Asou (Fukuoka IJniverstry,l

t

084

November

8:50-9:40

9:40-10:30

l0:40-l l:30I l:30-12:30

020

In

204

144

14, Wednesday MorningKeynote Lecture 3"Entropy and Entransy"Ze n g- Yu an Guo (Ts in g h u a IJ niv ers i ry* )Chai: Shigenao Maruyama (Tohoku [jniversity)

Keynote Lecture 4"Multi-Dimensional/Multi-Variable Laser Diagnostics and DNS in Turbulent Combustion Research',M a m o r u Tana has hi (To ky o Ins t i tu t e oJ' T e c h n o I o pt )Chair: sangmin choi (Korea Advanced Institute of science and rechnologt)

Break

Short Presentation 4Poster Session 4Session Chair Katsunori Hanamura (Totgto Institute of Technologt)

lErperimental studl'of fuel-lean rebuming/sNcR s)stem for No. reduction in LpG flameJung Min Yu, seung wook Baek (Korea Advanced Institure o.f Science and rechnologtl

Buovancl effect on microflameYusuke Kakizaki, Yuto onodera, Kazunori Kuwana (yamagata university)

Studl on the N2O formation under low temperature condition in pulverized biomass combustionYukihika okumura (Maizuru National Coilige of Technologt), Hirotatsu l4/atanabe, Ken okazaki Ookyo Instinte ofTechnolog,)

Stabili6 linrits and behaviors of micro flames for methane, hrdrogen and diluted fuel with nitrogenKentaro Talcatera, Ryuii Takashima, Kentaro Sakamoto. Takamitiu Yoshimoto (Kobe City Coile'ge of Technotogt), ToshimiTakagi (Former Osaka IJniversity)

Large- and fine-scale vortical structures in turbulent premixed V_flameTaltayuki Kadowaki, Naoya Fukushima, Masayasu S-himura, Mamoru Tanahashi, Tashio Miyauchi ffokyo Institute ofTechnology)

Behaviors and characteristics of combuslion on radial horizontaljet diffirsion flame for methane, h1'drogen and fuel gasdiluted with nitrogenRyuii Talashima, Hiroki Hara, Talamitu Yoshimoto (Kobe City Cotlege of Technologtl, Toshimi Talcagi (Former OsapnUniversitlt)

Flame behavior and stabilitl. on radial horizontal jet premixed flameHiroki Hara. Shin-nosuke Watanabe, Takamitsu yoihimoto (Kobe City College of Technologt), Toshimi Takagi (FormerOsala Universityl

030

046

t39

140

SESSION 4Combustion / Visualization and Measurement T

t45

-14-

I 53 Using 3D modeling technologies in research of heal l arm transfer processes in combustion chamber of acting energlobjectsAliya Askarova, Sj'mbat Bolegenova, Valery Marimov, Ai$tn gtlr^ufUamet (Al-Farabi Kazakh Nationat L'niversitl'.t

165 Effect of fuel-N concentration on NO. emission during air and O2/CO2 coal combustionDejudom Kiatpanachart, Fumiya Arai, Hirotatsu Watanabe, Ken Okazaki (To$,o Jrtr,,ur, of Technologt')

016 Measurement of void fraction of ammonia boiling florv in plaie evaporatorHirofumi Arima, Fumiy'a Mishima, Kohei Koyama, Toru Fukunami, Yasuyuki lkegami (Saga Universitl')

028 Development of simultaneous imaging method of temperature and water concentration of aqueous solutions based on thenear-infrared absorption characteristics of waterNaoto Kalwta (Tokyo Metopotitan University), Katsut'a Kondo (Tottori University), Hidenobu Arimolo (National Instituteqf Advanced Industrial Science and Technologt), Yukio Yamada (University of Electro-Communications)

029 Simultaneous measurement of bubble behavior and emissions of Balmer series in radio-frequencl plasma in water br a

high-speed carneraShinobu Mukasa, Atsushi Kamada. Shinfuku Nonrura, Hiromichi Tqtota (Ehime University)

058 Effect ofnanoscale wall roughness on zeta potential in microchannel flowTasuku Tabei, Shun Yoshikawa, Yuta Mizumoto, Jakob Born, Hiromi Jitsukawa, Taka:yuki lkebe, Kota Ozawa, YasuhiroKakinuma, Yohei Sato (Keio University)

063 Quantitative visualization of temperature distribution rvith micron resolution bl spontaneous Raman imagingReiko Kuriyama, Yohei Sato (Keio University)

073 Visualization and measurement of laminar natural convection in square enclosureEita Shoji, Shion Kon, Atsuki Komiya, Junnosuke Okajima, Shigenao Maruylama Cohoku universiO')

081 Esperimental studl on natural convection heat transfer in water with microbubble injectionTakuya Ozato, Atsuhide Kitagawa, Yoshimichi Hugiwara (K.,-oto Institute of Technology), Yuichi Murai (HokkaidoUniversity)

082 Studl'of flow rate measurement on bent pipe flou'using ultrasonic velocit) profile method and computational fluiddlnamicsWeerachon Treenuson, Nobuyoshi Tsuzuki, Hiroshige Kikura. Masanori Aritomi (Tokyo Instilute ofTechnology), SanehiroWada, Kenichi Tezuka (Tokyo Electric Power Company)

089 A stsmp senor for mcasurement of thermal conductiviq'and therrnal diffirsivitl'of solid nuterialsSyansul H4, Mamoru Nishitani, Takanobu Fukunaga, Kosaku Kurata, Hiroshi Takamatsu (Kyushu University)

lO7 Development of sensitive detection method using tunable diode laser absorption specroscop) with optical hollow fiberAkira Adachi, Yoshihiro Deguchi /University of Tokushimal

109 Development of realtime 2D temperature measurement method using CT tunable diode laser absorption spectroscop)Yoshihiro Deguchi, Daisuke Yasui. Akira Adachi lUniversitl, of Tokushina)

I I 8 In-plane thermal and electrical conductiviq' of Si thin film with periodic microporousYosuke Kawahara (Kyushu Institute of Technologyl, Harutoshi Hagino (BEANS Laboratory), Hisashi lwata lKltushuInstitute of Technologltl, Koji Miyazaki (BEANS Laboratory)

130 Measurement of radiative transmission through a diffuse surface using fluorescent materialKae Nakamura, Hirokazu Kawai (Shibaura Institute ofTechnologt), Masaya Koshino, Sadaki Takata (Shiseido Co., Ltd.),Jun Yamada (Shibaura Insfinrc of Technologtl

| 47 Stud) the thermoelectric properties of the ultralong double-walled carbon nanotube bundles b1 using a novel T-qpe methodTingting Miao, Weigang Ma, Xing Zhang, Jialin Sun (Tsinghua University)

157 Studl' on SThM with multifunctional thermal cantilever probeMasayuki Shinya, Osamu Nakabeppu lMeiji Universityl

166 Thermal diffusivitl and thermal conductir itl of r r'rticalll -aligned multi-walled carbon nanotube arrall{eigang Ma, Xing Zhang (Tsinghua Unirersin ,. I.iping Yang. An Cai (Shanghai Institute of Ceramics, Chinese Academy ofSciences), Zhenzhong Yong, Qingw,en Li rSu:ltou lnsrilute qf ,Yano-Tech and Nano-Bionicsl

187 Measurementsof h1'drogen viscositr uith capillarr tuhe method up to 7?3K and l00MPaTemujin Uehara, Kousuke Yoshimura lK.r'ushu Iirlersil,,. Elin Yusibani r$'iah Kuala Liniversitl't. Kan'ei Shinzato(National Instilute of Advanced IndustrialSclerrr't' dnti Tethnolofltr. Masanit'hi Kohno. l'asuyuki Takara (KtashuUniversity)

188 PVT prope4 measuremen$ of hldrogen in the range tierm -i:-i K tr ".1 K rnd up 1ir ]{d-i \{p6 br rhe iiochoric method

I

I

-15-

Proceedings of the

3rd International Forum on Heat Transfer

November 13-15, 2012, Nagasaki, Japan

Paper No.

A STAMP SENSOR FOR MEASUREMENT OF THERMAL CONDUCTIVITY

AND THERMAL DIFFUSIVITY OF SOLID MATERIALS

Syamsul HADI*, Mamoru NISHITANI*, Takanobu FUKUNAGA*, Kosaku KURATA*

and Hiroshi TAKAMATSU*

* Department of Mechanical Engineering, Kyushu University

744 Motooka, Nishi-ku, Fukuoka 819-0395, Japan

E-mail : takamatsu@mech.kyushu-u.ac.jp

Keywords : measurement technique, thermal conductivity, thermal diffusivity, in-situ measurement, contact measurement

ABSTRACT

We have proposed a convenient method that uses a stamp-type

sensor for measuring thermal transport properties of solids including

soft materials. A unique feature of this method is to press a small film

sensor/heater against the surface of a sample with spreading a gel of

known thermal properties on the sensor to avoid thermal contact

resistance. The sensor is fabricated on the bottom of a shallow cavity

to make a uniform gel layer of roughly fixed thickness independent of

contact pressures. The objective of the present study was to

demonstrate feasibility of the method using a prototype sensor. A

thin platinum sensor with a circular pattern of 3-mm diameter that

was deposited on the surface of 0.16-mm thick glass substrate was

used with a 50-m thick silicon rubber sheet as a spacer. The

transient temperature rise of the sensor was obtained from measured

electrical resistance after heating the sensor at a constant current.

Experiments were conducted with four different materials. The

thermal conductivity and the thermal diffusivity of a sample as well

as the thickness of the gel were determined simultaneously by a

Gauss-Newton algorithm within five to eight iterations. The

calculated temperature agreed well with the measured temperature

rise of the sensor.

1. INTRODUCTION

The thermal conductivity and the thermal diffusivity of solid

materials are measured with several methods. One of the most

reliable and popular methods is the laser flash method, which heats

the front side of a precisely prepared disk sample by laser irradiation

and measures the temperature rise at its back side (Akoshima et al,

2009, Baba et al, 2001). The other methods include the transient

plane method which heats the sensor that was put between two

samples (He, 2005), and the point contact-probe method that presses

a small heated spherical sensor to the surface of a sample (Takahashi

et al, 1999a, 1999b, Komiya et al, 2010). Application of these

methods depends on the sample material, required accuracy, and

restriction for measurement. The laser flash method has an

advantage in terms of the accuracy, but it requires preparation of a

sample with precise thickness. The other two methods have an

advantage in easier measurement including sample preparation.

However, none of these methods is appropriate for soft materials

including biological materials. Preparation of soft samples with

precise dimension is difficult in the laser flash method. Clamping a

thin heater/sensor between two identical samples is difficult for soft

materials in the transient plane method, although clamping is crucial

for reducing the thermal contact resistance between the sensor and

the sample. Pressing a bead sensor on a soft sample would alter the

contact area in the point contact-probe method, although the method

assumes point contact between the sensor and the sample. Hence to

develop a convenient measurement method for solid particularly soft

materials, we have proposed a new method using a 'stamp sensor'

(Hadi et al, 2012). It is a sort of contact method that works for

non-destructive in-situ measurement. The uniqueness of this method

is to put a gel between a film heater/sensor and a sample to

eliminate the thermal contact resistance. In addition, a shallow

cavity with given dimensions is prepared around the sensor for the

gel. As the first step to develop the method, we have carried out a

numerical study (Hadi et al, 2012). The protocol to determining the

thermal conductivity and the thermal diffusivity was checked using

virtual experimental data that have been generated by adding an

artificial scattering to a theoretical temperature change of the sensor.

The results indicated that the measurement error was less than ~2 %

for the thermal conductivity and ~5 % for the thermal diffusivity.

Since the feasibility of the method has been examined by the

numerical analysis, the next step is to demonstrate the measurement

by experiments. In this paper, we present preliminary results

obtained with a prototype sensor and find the problems for further

development of the proposed method.

2. SENSOR AND METHODS

2.1 Stamp Sensor

A conceptual design and the detail of the prototype stamp

sensor, which is named by ourselves, is shown in Fig. 1. A thin

metallic film heater/sensor that also works as a resistance

thermometer is deposited on the top of a glass substrate. A circular

sensor is used so that the system could be described by an

axisymmetric 2-D model. The sensor is pressed against the surface

of a sample with a gel spread on the sensor to eliminate the contact

thermal resistance between the sensor and the sample. The important

feature of the sensor is that the sensor is placed at the bottom of a

shallow cavity made by a spacer between the substrate and the

sample, which ensures the approximately constant thickness of the

gel layer independent of the contact pressure and gives us an

estimate of its thickness.

Fig. 1 Schematic and a detail of stamp sensor

The final design of the sensor would be a stamp-type device

where a sensor is fabricated on the bottom of a cylindrical holder

(Fig. 1, right). However, as a preliminary study, a sensor pattern

with electrodes was fabricated on a 0.16-mm thick 22 mm x 40 mm

glass substrate by the physical vapor deposition (PVD) of platinum

(Fig. 2). A circular pattern of 3 mm in diameter was drawn with a

single stroke of a 125 m wide line. An annular silicone rubber

sheet, 50-m thick and 15 mm in the inner diameter, was used as the

spacer. The glass substrate was held with a hollow cylinder. A

sample was heated not directly from the heater/sensor but through

the substrate to avoid the sensor from being peeled off during

cleaning after experiments, even though the sensor was coated by a

glass layer.

Fig. 2 Pattern of the sensor deposited on the glass substrate

2.2 Equipment and Measurement

The electrical resistance of the sensor was measured by the

four-terminal method; the voltage drops in the sensor and a standard

resistor connected to the power line were measured at every 0.18 s

(Fig. 3). Prior to the experiments, the electrical resistance of the

sensor was calibrated as a function of temperature by applying small

currents to the sensor that was held in a temperature-controlled

dielectric liquid, FC-84.

The gel for the ultrasonic echo was used in the experiment. The

sensor was pressed against a sample after spreading a small amount

of gel in a shallow cavity. After waiting for the system to become

thermal equilibrium, the sensor was heated stepwise by applying a

constant current. The measured voltage was recorded by a data

acquisition system controlled by a computer.

Four kinds of materials, acrylic resin (Kaviani, 2002), agar gel,

machinable ceramic, and stainless steel, were used as samples (see

Table 1 for thermal transport properties from the literature). For

each sample, the heating power was determined so as to obtain ~5 K

in the increase of the average temperature of the sensor within 5 s.

Table 1 Thermal transport properties of samples from literature

Material

(W/mK)

(10-7

m2/s)

Acrylic Resin 0.21 1.20

Agar Gel 0.58 1.32

Machinable Ceramic 1.61 7.84

SUS304 16.3 36.2

Fig. 3 Schematic of measurements system

2.3 Theoretical analysis

The physical model for the theoretical analysis is shown in Fig.

4. The system was defined by the cylindrical coordinate system with

the origin at the center of the heater on the substrate surface.

Fig. 4 Physical model and boundary conditions

The heat conduction equation is generally described by

vqz

T

rr

T

r

T

t

T

2

2

2

2

(1)

Gel

Substrate

Sample

T = T0

T/r = 0 T = T0

T/z = 0

r z0

z

-z

with the thermal diffusivity of each region. The heat generation

rate per unit volume vq was incorporated only in the equation for

the heater, and was assumed to be uniform and constant. The initial

condition was

0T T= at 0t = (2)

and the boundary conditions were described as follows:

0T T= at r→∞ or z→∞ (3)

T/r = 0 at 0r = (4)

T/z = 0 at 0z z (5)

The sensor side of the glass substrate, z = z0, that was exposed to

the air inside the hollow cylinder was assumed to be adiabatic. The

continuity of heat flux was also taken into account at the interfaces

between different regions.

Numerical solution to Eq. (1) was obtained by a finite volume

method with central difference for conduction terms and fully

implicit formulation for unsteady terms. The solution domain was

divided into 330 1000 meshes with variable sizes after

examination of the effect of mesh size on the calculated result.

Physical properties of water was used for the gel layer.

2.4 Protocol to Determine Thermal Transport Properties

Measurement of Thermal transport properties includes a

process to find the theoretical temperature rise that fits the

experimental data, i.e. a process to determine the thermal

conductivity , the thermal diffusivity and the thickness of the

gel layer which minimize the cumulative squared difference in the

average temperature of the sensor between the theory and

experiment:

N

ii,theoiexp, ,,TTS

1

2 (6)

where N is the total number of experimental measurements, ,exp iT is

the i-th measured temperature, and ,theo iT is the temperature

obtained from the numerical solution at the time of measurement.

The Gauss-Newton algorithm with a numerical approximation to the

Jacobian was used for this nonlinear least-squares problems. The

method that used by Woodfields et al.(2008) for determination of

and in a short-hot-wire method was extended to a

three-parameters problem. The algorithm is as follows:

(1) Guess , and .

(2) Solve Eq. (1) numerically to obtain transient average

temperature , ( , , )theo iT (i=1~N).

(3) Solve Eq. (1) numerically to obtain three sets of temperatures for

different combinations of , and , i.e. , ( , , )theo iT ,

, ( , , )theo iT and , ( , , )theo iT (i=1~N).

(4) Find x, x and x that satisfy the following equation :

min2

1

i,theoi,theoi,theoi,theo

N

ii,theoi,theoi,theoiexp,linear

TTxTTx

TTxTTS

(7)

(5) Set new values for , and such that

new x , new x , new x (8)

(6) Repeat steps (2)-(5).

The values of , and were taken to be 1 % of the

current estimates , and The step (4) was carried out with the

linear least-square method using Gram-Schmidt ortho-normalization

and Q-R factorization.

The first guess was taken by comparing the experimental data

with a prepared data set of calculated temperature rise. The average

temperature rise of the sensor has been calculated as a function of

time assuming a gel layer of the cavity depth, 50m, for various

combinations of andwhich are given in increments of 20 %.

The values of and that yield minimum difference from the

experimental data were chosen from the prepared set as the first

guess.

The standard deviation of the difference between the

experimental data and calculated temperatures, i.e.

N

ii,theoiexp,T ,,TT

NN

SSD

1

21 (9)

was evaluated after step (4) of each iteration, and used as an index to

convergence.

3. RESULTS AND DISCUSSIONS

The process for determining the thermal conductivity and the

thermal diffusivity for acrylic resin was demonstrated in Fig. 5, Fig.

6 and Table 2.

Fig. 5 Measured and calculated temperature rise for acrylic resin

In this case, ~5-K increase in the temperature of the sensor

within 5 s was obtained by heating at ~20 mW (Fig. 5). The

temperature change calculated with the first assumption, 1= 0.244

W/mK, 1= 1.50x10-7 m2/s and 1 = 50 m, was lower than the

measured temperature. The thickness of the gel, , was fixed at 50

m for the following iteration steps as long as the difference

between the calculated and measured temperature, SDT, was larger

than 0.03 K. In the case shown in Figs. 5 and 6, was incorporated

as a variable at the third step, since SDT reduced to 0.015 at the

second iteration (Table 2). While the difference between the

measured and calculated temperature increased once by

incorporation of , it decreased again with further iteration (Fig. 6

and Table 2). The iteration was continued six times and the final so-

Fig. 6 Difference between measured and calculated temperature

rise for acrylic resin

lution was obtained by the values of , and that was used at the

6th iteration because there was no change in SDT from the 5th trial.

Figure 6 indicates that the temperature calculated with the final ,

and agreed well with the measured temperature. The difference

from the literature values were5.2% for 21.9% for and

33.4% for .

Table 2 Values of , , and of iteration steps

i

(W/mK)

(10-7

m2/s)

(m)

error

(%)

error

(%)

error

(%)

SDT

(K)

1st 0.244 1.50 50.0 16.2 25.0 0.0 0.131

2nd 0.242 1.74 50.0 15.0 45.0 0.0 0.015

3rd 0.200 0.69 33.0 -4.73 -42.5 -33.9 0.262

4th 0.201 0.92 34.0 -4.23 -23.0 -31.9 0.038

5th 0.199 0.94 33.3 -5.26 -21.9 -33.4 0.003

6th 0.199 0.94 33.3 -5.24 -21.9 -33.4 0.003

Table 3 shows the summary of finally obtained results with four

different materials: acrylic resin, agar gel, machinable ceramic and

SUS304. Figures 7-9 also show the measured temperature rise and

some of temperature rises obtained during iteration process. Because

of the wide range of thermal transport properties, the heating power

that gave appropriate temperature rise was considerably different

each other depending on the samples. In addition, the increasing

manner was also different particularly for SUS304; the temperature

increased quickly and slowed down immediately (Fig. 9). Even

though the experimental data showed variations in the transient tem-

Table 3 Measured values of thermal conductivity and thermal

diffusivity

Material

Q

(mW)

Number

of

iteration

(W/mK)

(10-7

m2/s)

(m)

error

(%)

error

(%)

SDT

(K)

Acrylic

Resin 19.9 6 0.20 0.94 33.3 -5.2 -21.9 0.003

Agar gel 36.2 5 0.60 1.19 98.7 4.3 -9.9 0.003

Machinable

Ceramic 50.8 6 1.81 7.71 85.1 13.3 -1.6 0.002

SUS304 117.5 8 14.8 40.8 69.1 -9.3 12.7 0.005

perature rise, the calculated temperature rises at the final iteration

agreed well with the experimental data in all cases. However, this

does not imply that the finally determined transport properties also

agreed well with literature values. The differences in the thermal

conductivity from literature values of four tested materials were

5.2%, 4.3%, 13.3% and 9.3%. Those in the thermal diffusivity

were 21.9%, 9.9%, 1.6% and 12.7%. In general the error was

larger for the thermal diffusivity than the thermal conductivity as

has been demonstrated in our previous study (Hadi et al, 2012)

based on the numerical simulation.

This was probably because the temperature rise was more sensitive

to the thermal conductivity than the thermal diffusivity. It is

interesting that only the result for machinable ceramic showed

smaller error in the thermal diffusivity, of which reason is not clear

to date. The estimated thickness of the gel layer was between ~33

m and ~99 m. The gel layers of ~33 m that is ~34% smaller than

the thickness of the silicone spacer and ~99 m, almost double of

the spacer, are both unfeasible. This indicates the difficulty in

determining the thickness of the gel layer correctly. However, it

conversely implies the lower sensitivity of the temperature rise to

the thickness of the gel layer. This is desirable for our method

because the targets to be determined are not the gel thickness but the

thermal transport properties of samples.

Fig. 7 Measured and calculated temperature rise for agar gel

Fig. 8 Measured and calculated temperature rise for machinable

ceramics

Fig. 9 Measured and calculated temperature rise for SUS304

The number of iteration that was required to obtain final solution

was 5 to 8 depending on the experiments. It depends in part on the

initial guess; the smaller difference between the calculated and the

measured temperature rise at the first trial would result in smaller

number of iteration. Hence preparation of larger numbers of pairs of

thermal conductivity and thermal diffusivity for the initial guess

could reduce the iteration. Acceleration of the solution process

would be one of the next subjects.

The results shown in this paper include only one measurement

for each material. The measured thermal transport properties are

likely dependent on the experimental runs. The errors could be

therefore different for different measurement. Hence the accuracy of

the present method will be discussed after checking the

reproducibility of the experimental data and evaluating the error for

each of a number of measurements. However, the results obtained in

the present paper demonstrated the feasibility of our convenient

method for measuring thermal conductivity and thermal diffusivity

of solid materials.

CONCLUSIONS

The final goal of our research is to develop a method for

measuring thermal transport properties using a novel stamp sensor.

We have demonstrated the feasibility of the proposed method by

preliminary measurement of different kinds of samples with a wide

range of thermal transport properties using a prototype sensor. The

conclusions are as follows:

1. The thermal conductivity, the thermal diffusivity and the

thickness of gel layer were determined successfully by the

Gauss-Newton algorithm within five to eight iterations. The

calculated temperature agreed well with the measured temperature

rise of the sensor.

2. Finally obtained thermal conductivity for four different materials

was different from literature value by ~4 to ~13% depending on the

material. The difference in the thermal diffusivity ranged from ~2 to

~22%.

More experiments are needed for evaluation of the accuracy of

the present method. In addition, there are several points to be

improved: preparation of the lists for the initial assumption, more

effective iteration procedure, and estimation of the starting time of

heating, which was not discussed in the present paper.

REFERENCES

Akoshima, M., Hata, K., Futaba, D.N., Mizuno, K., Baba, T.,

and Yumura, M., Thermal Diffusivity of Single-Walled Carbon

Nanotube Forest Measured by Laser Flash Method, Japanese

Journal of Applied Physics 48 (2009) 05EC07.

Baba, T., and Ono, A., Improvement of the Laser Flash Method

to Reduce Uncertainty in Thermal Diffusivity Measurements,

Measurement Science and Technology 12 (2001) 2046-2057.

Hadi, S., Nishitani, M., Wijayanta, A.T., Kurata, K., and

Takamatsu, H., Measurement of Thermal Conductivity and Thermal

Diffusivity of Solid Materials Using a Novel Stamp Sensor: A

Feasibility Study with Numerical Analysis, Journal of Thermal

Science and Technology, JSME 7 [4] (2012).

He, Y., Rapid Thermal Conductivity Measurements with a Hot

Disk Sensor, Part 1. Theoretical Considerations, Thermochimica

Acta 436 (2005) 122-129.

Kaviany, M., Principles of Heat Transfer, John Wiley & Sons,

2002.

Komiya, A., Mashimo, H., Okajima, J., Takahashi, I., and

Maruyama, S., Measurement of Thermophysical Properties of Soft

Materials and Liquids Using Point-Contact Method of Measuring

Thermophysical Properties (in Japanese), The 31st Japan

Symposium of Thermophysical Properties, Nov 2010, 158-160.

Takahashi, I., and Emori, M., Measuring Method of Three

Thermophysical Parameters of Solids by Thermal Probe with

Instantaneous Point Contact (Measuring Principle)(in Japanese),

Netsu Bussei 13 [4] (1999a) 246-251.

Takahashi, I., and Emori, M., Measuring Method of Three

Thermophysical Parameters of Solids by Thermal Probe with

Instantaneous Point Contact (Discussion about Applicability and

Measuring Conditions)(in Japanese), Netsu Bussei 13 [4] (1999b)

252-257.

Woodfield, P.L., Fukai, J., Fujii, M., Takata, and Y., Shinzato, K.,

Determining Thermal Conductivity and Thermal Diffusivity of

Low-Density Gases Using the Transient Short-Hot-Wire Method, Int.

J. Thermophysic 29 (2008) 1299-1320.

NOMENCLATURE

Thermal conductivity (W/m K)

Thermal diffusivity (m2/s)

Thickness of gel layer (m)

T : Temperature (K)

Ttheo : Calculated temperature (K)

Texp : Measured temperature (K)

t : Time (s)

Q : Heating power (W)

SDT : Standard deviation of difference between the calculated and

the measured temperature (K)

H. Takamatsu received the B.E. (1980),

M.E. (1982), and D.E. (1985) in Kyushu

University.

Professor of Department of Mechanical

Engineering, Kyushu University.

His current interests include heat and mass

transfer associated with medicine and

biology.

Syamsul Hadi received the B.E. (1996) in

Sepuluh Nopember Institut of Technology

(ITS), Master (2005) in Gadjah Mada

University (UGM).

Lecturer and researcher of Department

of Mechanical Engineering, Sebelas Maret

University (UNS), Indonesia and a doctor

course student in Kyushu University.

M. Nishitani received the (2010) and M.E.

(2012) in Kyushu University.

Engineer in Production Engineering and

Development Center, Research and

Development Management Headquarters of

FUJIFILM Corporation.

T. Fukunaga received the B.E. (2004),

M.E. (2006), and D.E. (2009) in Kyushu

Sangyo University.

Technical staff of Department of Mechanical

Engineering, Kyushu University.

His current interests include developing

technique and strategies for lithography

technique and thin film fabrication.

.

K. Kurata received the B.E. (1996), M.E.

(1998), and D.E. (2001) in Kyushu

University.

Associate Professor of Department

of Mechanical Engineering, Kyushu

University.

His current interests include biomechanical

engineering associated with hard and soft

tissues.