Concept DCP of NEXCOM Distributed IO PL_20160404_Eric Lo

NPP of NEXCOM Distributed I/O Solutions

IAS, IAM2 Eric Lo

Confidential – Driving Intelligence

Table of Content

Executive Summary

Opportunity and Market Share

Competitive Analysis

Value Proposition and User Scenarios

Offering Content & Roadmap

Key Component Planning

Cost Evaluation

Schedule & Key Milestones

Risks, Dependencies and other Issues

Go-To-Market Strategy

Financial Business

Summary and Recommendation


Executive Summary

*Product Offerings: NEXCOM EtherCAT Distributed I/O Solutions – NEIO EB-1000 Series - Positioning: - Real-time and high performance I/O solutions - Entry level spec and functionality - Cost-effective price - 4 models of Distributed DI - EB-1101-32 - EB-1102-32 - 2 models of Distributed DO - EB-1201-32, EB-1202-32

*Target Schedule: - C1: 2015/1/9 - C2: 2015/3/13

- C3: 2015/5/15, 5.5 Months for Samples

- C4: 2015/7/15 - MP: 2015/8/12

*Financial Goal: - Time to Market: 2015-Aug-12 - Time to Profit: 2016-Q3 - Forecast turnover: - 1st Year, 2015: USD 79,833 (646 pcs) - 2nd Year, 2016: USD 616,417 (4,988 pcs) - 3rd Year, 2017: USD 776,824 (6,286 pcs)

*Target Cost - EB-1101-32, EB-1102-32 - Est. Std. Cost: USD 74.4916 - BTM: USD 105 (GP: 29.06%) - EB-1101-64, EB-1102-64 - Est. Std. Cost: USD 94.1861 - BTM: USD 160 (GP: 41.13%) - EB-1201-32, EB-1202-32 - Est. Std. Cost: USD 70.4861 - BTM: USD 145 (GP: 51.39%)


OPPORTUNITY AND MARKET SHARE

EtherCAT I/O in OEM market


Library – Protocol Library – Motion Control

The Building Blocks of NEXCOM Automation Solutions


NISE NIFE

IPPC APPC

On-board/FPGA LAN Ports

Add-on Motion Cards

CNC Controller - NControl 3rd-Party Software Automation Core

CORE VALUE

Electrical Signals

Communication Interfaces

SoftMotion

CNC

SoftPLC

Target Visue

Nex ECM

Visualization

PC-Based Automation Industry 4.0

http://www.google.com/url?sa=i&rct=j&q=&esrc=s&frm=1&source=images&cd=&cad=rja&docid=LcdgsXCfT7dzXM&tbnid=akLcG9vATbkhIM:&ved=0CAUQjRw&url=http://www.molex.com/molex/products/family?channel=products&chanName=family&key=devicenet_industrial_networks&ei=IxUgUsWDCI3VkwW-kYHgCg&psig=AFQjCNFh7WLRGaI94p-xMnqlPR33HTuSbA&ust=1377920669941205

http://www.google.com/url?sa=i&rct=j&q=&esrc=s&frm=1&source=images&cd=&cad=rja&docid=J2B2Gh97djo5OM&tbnid=Cp3cKjAqcWWW-M:&ved=0CAUQjRw&url=http://www.interempresas.net/Mechanical-Components/Articles/105895-Vipa-SLIO-And-S-with-precision-of-S-via-bus-of-field.html&ei=DjJVUoWFG8GFkAWemoGoDw&psig=AFQjCNGDr42zjcOsoSA0L9GlhyvigsFObg&ust=1381401479343991

Services (ERP, MES, CRM, SCM…)

Digitize and Connect Everything Through Intelligent I/O Systems

Keys to the Industry 4.0


BIG

DA

TA

Ubiquitous Sensor Infrastructure

The next step is to create a NEXCOM I/O System.


NEXCOM Extreme I/O system

NEIO B-1000 Series (Block I/O – EtherCAT)

NEIO M-5000 Series (Modular I/O – EtherNet/IP)

NEIO M-6000 Series (Modular I/O – Modbus/TCP)

NEIO M-9000 Series (Modular I/O – PROFINET)

The Market Status of the Remote I/O


Source: 2013 IHS, I/O Modules Report – 2014

Source: ADI Solution for Industrial Communications – June 2012

US$ 5,110M

Remote I/O

PLC

Ethernet Technology is practically applied in industrial applications due to the maturity of Industrial Ethernet Protocols.


Source: ADI Solution for Industrial Communications – June 2012

9% increasing in 2016

Source: 2013 IHS, The World Market for Industrial Ethernet & Fieldbus Technologies – 2013 Edition

Two major players cover the 60% of market share.


9% increasing in 2016

Source: 2013 IHS, The World Market for Industrial Ethernet & Fieldbus Technologies – 2013 Edition

60%

The Machine Builder in Germany is shifting to industrial Ethernet solutions.


Source: QUEST TREND MAGZINE, Nov, 2013

http://www.quest-trendmagazine.com/en/machinery-industry/automation/ethernet-field-buses/market-shares-of-ethernet-and-real-time-ethernet-in-the-german-machinery-industry-2005-2015.html

is potential for machine applications due to very high-performance communication characteristic.


Advantage of Performance Factor


Unify the Network for Manufacturing Business


Semiconductor & i Electronics i

Target Markets


Food & Beverage

Metal Handling

Robotic i OEM SIs &

Machine Builders

Target Application F&B Packaging Machine


DO: Tower Light

HMI

DI: Emergency Stop

AO: VFD DI:

Photoelectric Sensor

DI: Light Screens

AO: Heater Portion Valve

DO/Relay: Actuator

AI: Scale Meter

AI: Flow Sensor Pressure Sensor Temperature Sensor

DI: Push Buttons

DO: Indicator

DI: Interlocking Switches

Target Application Plate/Pipe Bending Machine


DO: Tower Light

HMI DI: Emergency Stop

DI: Photoelectric Sensor

DI: Light Screens

DO/Relay: Actuator/

DO: Indicator

DI: Interlocking Switches

DI: Push Buttons

DI: Control Panel

Target Application Semiconductor Equipment


Pulse, Encoder, DI and Serial

Target Application Robotic Control


Multi-Axes Motion Control

COMPETITIVE ANALYSIS


1. Brand

2. Solutions

1. Comprehensive Products

Coverage

2. Component Systems

Position of Distributed I/O Players


Tier 1

Tier 2

…

…

﹋﹋﹋﹋﹋﹋

Market Position

IA Design Oriented

IT/Measurement Design Oriented

…

0369

BrandReputation

Technology

Portfolio

Solution

Service

Market

80% Market Share

I/O Players


IA Design Oriented

Market Position

Comprehensive Portfolio & Certified by ETG

IT/Measurement Design Oriented

Potential Competitor

Full PC-Based Solution +

EtherCAT Master

Target Positioning

Source: EtherCAT Technology Group

Total: 41 Vendors

http://www.ethercat.org/en/products.html

Product Development Strategy


Block+IP

Modular

Modular Modular Modular

Modular Block+IP

Block

Product Development Strategy


Block+IP

Modular

Modular Modular Modular

Modular Block+IP

Block

STAGE 1 Block I/O & Modular Expansion

New ID for NEXCOM Image CIS)

STAGE 2 Block I/O

IoT Enabling

STAGE 3 Block I/O + IP

Advance Product Line

BLUE SEA

Stage 3

Stage 2 Stage 1

Product Positioning and Differentiation


For Hash Operations

IA Features IoT Features

Cloud Services Capabilities

Market Breaker

ARM Cortex

(Aggressive Pricing Strategy)

VALUE PROPOSITION AND USER SCENARIO

STAGE 1 Product Lines – Block I/O and Modular I/O


The Differentiation and Competence The results of SWOT Analysis


Modular I/O Block I/O

Advantage: - Less engineering effort - Cost-effective per channel Disadvantage: - Lack of I/O expansion - Limit tags by PLC performance

Advantage: - Flexible I/O Expansion - Comprehensive Combination Disadvantage: - Cost high per channel and System - Limit tags by PLC Performance

NEXCOM NEIO Hybrid Design: Block I/O + Modular I/O Expansion High Performance PC-Based Automation Platform

Value Proposition and User Scenario


NEXCOM NEIO EB-1000 series is a block design,

- High Density I/O Points,

- Comprehensive I/O combinations,

- Easy Configuration, - Flexible Network Expansion and

- Cost-Effective remote I/O solutions with

- Real-Time EtherCAT Protocol for the industrial applications requiring distributed, - Time-Critical and Bulk I/O Data Exchange.

Naming Convention

Block I/O: NEIO EB-1000 Series

NEIO EB - X XX X - XX - XX


Interface: E: Ethernet

B: Block

(Reserve: W/C/B; M/P)

Protocol: 1: EtherCAT

5: EtherNet/IP

9: PROFINET

I/O Types: 1: DI - 0: DI - 5: Counter - 9: Mix Func

2: DO - 0: DO - 5: PWM - 5: Frequency - 6: Relay

3: AI - 0: AI/12bits - 1: AI/16bits - 2: RTD - 3: TC

4: AO - 0: AO/12bits - 1: AO/16bits

6: Comm - 0: Serial

8: Mix Signal - 1: DI/DO - 2: DI/AI - 3: AI/AO - 4: AI/DO

Sequence Number

Channels: 32: 32Ch

64: 64Ch

Characteristics: T: Wide Temperature I: Isolation Protection MG: Modbus Gateway

DP: Dual Power RN: Redundant Network EX: C1D2/ATEX

BECKHOFF-liked naming

Product Name

OFFERING CONTENT & ROADMAP

STAGE 1 Product Lines – Block I/O


Development Strategy and Roadmap of NEIO I/O Product Lines


Basic I/O Offerings

2015/Q2

Comprehensive I/O Offerings

IoT I/O Solution Advanced I/O

Solution

NEIO EB-1000 NEIO EB-1000

Software

Embedded OS & Firmware

Hardware

Cloud Service (Phase 3)

Mobile APP (Phase 2)

Offering Content


Integrated

NARI Portal

Selection, Configuration & Layout (Phase 1) Utility for

NEXCOM Automation

Remote Intelligence

NEIO EB-1000

Block I/O (Hybrid)


Product Exterior Concept ID Concept of 32/64ch Block I/O

Communication Interfaces

Power Connectors

5mm Spring Terminal Blocks

LED Signals

Patent Avoiding by Phoenix Contact housing base

Block I/O – NEXCOM NEIO


Product Exterior Concept ID Concept of 4/8ch Block I/O

5mm Spring Terminal Blocks

LED Signals

Patent Avoiding by Phoenix Contact housing base

Block I/O – NEXCOM NEIO


Block + Modular Hybrid Design ID Concept of Modular I/O Extension

Series & Modularized Design

Start from 8ch to 64ch

64ch Block I/O & Communication

Interfaces

16ch Modular I/O

Power Module


User Scenario ID Concept of Modular I/O Extension

Flexible Combinations for

Distributed Applications

High Density I/Os for

Centralized Applications

NEXCOM PAC with Motion Control

Brief SPEC

General Nominal Voltage Supply: DC 24V

Power Input: DC 18V~31.2V

Isolation Protection: 3KV

Operation Temp.: -25…+60 °C

Relative Humidity: 5~95%

Vibration: EN 60068-2-6

Shock: EN 60068-2-27

EMC: EN 61000-6-2/61000-6-4

Mounting: DIN-Rail/Wall

Enclosure Type Rating: IP20

Approval: CE, FCC

Terminal: 5mm screw type

Communication Protocol:

Data Transfer Rate: 100Mb

Bus Interface: 100BASE-TX(2x RJ-45)

Number of Slave: 65,535

Modbus RTU/(TCP) Gateway Support

I/O Functions DI: 32/64ch, 24VDC, Sink/Source

DO: 32/64ch, 24VDC, Sink/Source

Relay: 8ch, Form A/C

AI: 16ch, 16bits, ±0.1%, 250u sec, 1K Samples/sec, 0~10/±10VDC

AO: 8ch, 16bits, ±0.1%, 250u sec, 250 Samples/sec, 0~10/±10VDC,

Counter: 2ch, 32bits

Encoder: 2ch, 32bits , Incremental

TC: 4ch, 0.1℃, 10Samples/sec, ±0.1%, K/J/T/B/R/S/E/N/L/U/C/D

RTD: 4ch, 0.1℃/F, 10Samples/sec, ±0.1%, PT/NI/JP


Key Features

Key Features Benefits

Block I/O and Extension Module Portfolio

Cost-effective per channel and flexible expansion for high-density I/O applications.

High-speed and Real-time Ethernet/ Backplane

Low delay and massive data transferring for time-critical application and motor/motion control.

Efficient and Reliable Network Topology

Lower installation and maintain fee.

Comprehensive I/O Combinations

Fulfill variety of industrial applications and user scenarios.

Offering Content Block I/O – NEIO EB-1000 Series


DI Block I/O

EB-1102-32 DI

32ch, 24VDC, sourcing

EB-1101-64 DI

64ch, 24VDC, sinking

EB-1102-64 DI


EB-1151-2/8 Encoder(Counter)/DI

2ch, 32bits, Increment/ 8ch, 24VDC, sinking


2ch, 32bits, Increment/ 8ch, 24VDC, sourcing

DO Block I/O

EB-1201-32 DO

500mA/ch 32ch, 24VDC, sinking

EB-1202-32 DO

500mA/ch 32ch, 24VDC, sourcing

EB-1211-8 Relay

2A/ch, 50 ops/sec 8ch, Form A

EB-1212-8 Relay

2A/ch, 50 ops/sec 8ch, Form C

EB-1251-2/16 Pulse(PWM)/DI

2ch, 24VDC, 4MHz 16ch, 24VDC, sourcing

EB-1831-4/2 AI/AO

AI: 2ch, 16bits, 10K Samples/sec, AR: ±0.1%, 0~10VDC/ ±10VDC

AI: 2ch, 16bits, 10K Samples/sec, AR: ±0.1%, 4~20mA AO: 2ch, 16bits, 10K Samples/sec, AR: ±0.1%, 0~10VDC/ ±10VDC

AI/AO Block I/O

EB-1101-32 DI


Serial Module

EB-1603-2 Communication

2ch, RS232/422/485 to EtherCAT Slave

Offering Content Block I/O – NEIO EB-1000 Series


DI Block I/O

EB-1102-32 DI


EB-1101-64 DI


EB-1102-64 DI



2ch, 32bits, Increment/ 8ch, 24VDC, sinking


2ch, 32bits, Increment/ 8ch, 24VDC, sourcing

DO Block I/O

EB-1201-32 DO

500mA/ch 32ch, 24VDC, sinking

EB-1202-32 DO

500mA/ch 32ch, 24VDC, sourcing

EB-1211-8 Relay

2A/ch, 50 ops/sec 8ch, Form A

EB-1212-8 Relay

2A/ch, 50 ops/sec 8ch, Form C


2ch, 24VDC, 4MHz 16ch, 24VDC, sourcing

EB-1101-32 DI


Serial Module

Total: 13 Models


2ch, RS232/422/485 to EtherCAT Slave

EB-1831-4/2 AI/AO

AI: 2ch, 16bits, 10K Samples/sec, AR: ±0.1%, 0~10VDC/ ±10VDC

AI: 2ch, 16bits, 10K Samples/sec, AR: ±0.1%, 4~20mA AO: 2ch, 16bits, 10K Samples/sec, AR: ±0.1%, 0~10VDC/ ±10VDC

AI/AO Block I/O

Offering Roadmap Block I/O – NEIO EB-1000 Series


EB-1102-32 DI

EB-1101-64 DI

EB-1102-64 DI

EB-1201-32 DO

EB-1202-32 DO



EB-1212-8 Relay

EB-1831-4/2 AI/AO

EB-1101-32 DI


2015/Q3 2015/Q3 2015/Q4

Basic Models

Advanced Models

EB-1211-8 Relay


Offering Content Software Utility – Integrated NARI Portal


Selection

Configuration

Layout

Integrated NARI Portal Stage 1- Windows XP and above

Development Plan The Functional Blocks of Integrated NARI Portal


Configuration Selection Layout Models Category

Device Container

Communication Interface

Channel Numbers

I/O Type

Property

Selected List

Check & Add

Export List

Network Scanning

Device List

Device Node

Description Status

I/O Functions & Parameters

Comm. Address &

Parameters

Check & Apply

Network Scanning

Device List

Import Geographic Images

Firmware Upgrade

Catalog Update

Layout Manager

Layout Container

Location Marking

Import/Export Layout File

Device Node

Monitor Label

Controller

User Interface

Cloud Services Update – Catalog/Utility/Firmware Backup – Configuration/Layout

Stage 3 - Microsoft Azure

Data Stream

P

roto

col C

on

trol

Data Stream

Mid

dlew

are Pro

toco

l/HTM

L5

View

Device

Integrated NARI Portal

Utility Integration and UI Alignment


API

IEC61131-3 SoftPLC + SoftMotion + CNC

Controller System Solution The System Architecture of NEIO EB-1000, Block I/O Solution


Configuration

Master Controller

Integrated NARI Portal

KEY COMPONENT PLANNING


Key Components of NEIO EB-1000 DI/O Modules


Key Component New/ Existed

Component Description

Lead Time (Days)

MOQ (PCS)

Price (USD)

TR ARRAY TI:ULN2003ADR

Existing Current AMP, 8ch - - 0.1174

(C)PHOTOTRANSISTOR AVAGO:ACPL-247-560E

Existing Photo Transistor, DO, 4ch - - 0.6672

PHOTOTRANSISTOR TOSHIBA:TLP290-4(GB-TP,E

Existing Photo Transistor, DI, 4ch - - 0.8368

TTL IC TI:SN74LV245ADBR

Existing LED Buffer, 8ch - - 0.5793

(H)GAL CPLD XILINX:XC3S200AN-4FTG256C BLANK

Existing FPGA, BGA 256pin, 200K Gates, 4032cells

- - 5.4368

10/100M ETHERNET PHYCEIVER TI:TLK110PT

Existing PHY, 1ch - - 2.5345

ISOLATED POWER SWITCH LINEAR:LT8302ES8E#TRPBF

Existing 3KV Isolation Switching Power

- - 3.3682

13SEP-0901CPNL New Isolation Trasfomer, 4:1 - 100 1.2089

Key Components of NEIO EB-1000 DI/O Modules


Key Component New/ Existed

Component Description

Lead Time (Days)

MOQ (PCS)

Price (USD)

2278500 BC 161.6 UTHBUS BK New Housing Base 30 100 5.0646

Customized Housing for BC 161.6

New NEIO Housing TBC TBC 6.5324 (Estimated)

1704563 PST 1.3 / 10 - LV - 5.0 New Pin, 5mm, 10 poles 40 100 0.6045

1704246 PT 2.5 / 10 - PVH -5.0 New Terminal Block, 5mm, 10 poles

40 100 1.5030

Body cover molding & tooling BC 161.6 UTHBUS BK

New NEIO Housing – ME 60 Working days at least

One shot NRE

6861 (Estimated)

Top cover molding & tooling BC161.6 UTHBUS BK

New NEIO Housing – ME 60 Working days at least

One shot NRE

6208 (Estimated)

Suppliers under evaluation: MAXIM, TI, ADI

COST EVALUATION


Comparison Table of MSRP And Pricing Strategy


(USD) 32DI 64DI 32DO

BECKHOFF German MSRP/CH $8.48 $6.57 $13.15

BECKHOFF TW Disti Price/CH $10.56 $8.18 $17.46

WAGO TW Disti Price/CH $11.52 $8.66 $12.31

Phoenix Contact TW Disti Price/CH - $12.51 $27.72

VIPA sell to NEXCOM Disti Price mark up as MSRP/CH $30.61 $26.09 $32.19

NEXCOM Global MSRP/CH $7.19 $5.55 $11.09

DR(%) NEXCOM Global VS BECKHOFF German 15.21% 15.53% 15.67%

Cost Evaluation and Pricing Strategy of NEIO EB-1000 DI/O Modules


Items/ DI EB-1101-32 EB-1101-64 EB-1102-32 EB-1102-64

Target Cost (USD)

74.4919 94.1861 74.4919 94.1861

ITP (USD) 105 160 105 160

GP 29.06% 41.13% 29.06% 41.13%

DR 54.35% 54.93% 54.35% 54.93%

MSRP (USD) 230 (7.19/ch) 355 (5.55/ch) 230 (7.19/ch) 355 (5.55/ch)

Items/ DO EB-1201-32 EB-1202-32

Target Cost (USD)

70.4861 70.4861

ITP (USD) 145 145

GP 51.39% 51.39%

DR 59.15% 59.15%

MSRP (USD) 355 (11.09/ch) 355 (11.09/ch)

Cost Evaluation of NEIO EB-1000 DI/O Modules


Item Description Unit

Cost/Week Required Units Sub-Total

RD manpower overhead

Hardware

NT$ 35,000

18 NT$ 630,000

ME 17 NT$ 595,000

SW/FW 11 NT$ 385,000

Layout 4 NT$ 140,000

Testing (QT&IRT) 14 NT$ 490,000

System (SE) 15 NT$ 525,000

PM 6 NT$ 210,000

Certification

FCC/CE NT$ 105,000 1 NT$ 105,000

Vibration / Shock NT$ 10,000 1 NT$ 10,000

Housing Tooling NT$ 500,000 1 NT$ 500,000

Prototype Cost

Samples (32Ch, DI) NT$ 2,286 40 NT$ 91,440

Samples (64Ch, DI) NT$ 2,891 40 NT$ 115,640

Samples (32Ch, DO) NT$ 2,163 40 NT$ 86,520

Total NT$ 3,883,600 (USD 126,000)

SCHEDULE & KEY MILESTONES


Schedule


P1 P2 P3 P4 P5 C0 C1 C2 C3 C4 C5

35 Working Days 57 Working Days 40 Working Days 20 Working Days

12/2 1/9 3/13 5/15 7/15 8/12 26 Working Days

5.5Months

Sample Release

1. Housing Design 2. FW Design 3. Software Design

1. SW Implement 2. FW Implement 3. EVT Planning

1. EVT with FW/SW 2. EVT Fixture 3. DVT Planning 4. DVT with FW/SW 5. DVT Fixture 6. PVT/MP Planning

1. PVT with FW/SW 2. PVT Fixture 3. Golden Sample

1. MP with FW/SW 2. MP Fixture

Pilot Run

Key Milestones


Critical Task / Milestones

Q4,2014 Q1,2015 Q2,2015 Q3,2015

Pro

du

ct

1. 12/2, Kick off 2. 11/24, Housing Design

1. 1/9, C1 Meeting - HW BOM Review - Cost Review - FW Design Review 2. 1/12, Outsource the Housing Molding 3. 3/6, C2 Meeting - FW Review - EVT Plan Review - Housing Review 4. 3/17 PCBA Sample + FW Integration

1. 4/9, EVT 2. 4/23, DVT 3. 5/15, C3 Meeting - Sample Review - DVT Review - PVT/MP Plan Review

1. 6/1, PVT 2. 7/15, C4 Meeting - Golden Sample Review - PVT Review - MP SOP, Fixture and Program Review.

Marketin

g

1. Draft User Manual 2. Draft Proposal of EtherCAT SoftMotion Solution Pack

1. Draft of Sales Kits 2. Implementation of Solution Kit 3. Revise User Manual

1. Finalize User Manual 2. Sales Kits 3. NPI and Promotion Program

RISKS, DEPENDENCIES AND OTHER ISSUES




No. Category Risk Level Critical

Date Implication Mitigation Owner

1. Process Customized NPP flow for FW/SW development and verification

Mid C2~C4 QT, IRT, PE, SW/FW/HW RD, Schedule

PM Eric

2. Technical Build up standardized SOP and Program for EVT from scratch

High P2, C2 QT, Schedule

Recruit QT for automation product or get support from FAE Manager Ss

QT Alan

3. Technical Build up standardized SOP and Program for DVT from scratch

High P3, C3 IRT/SVE, Schedule

IRT Alan, SVE Mason

4. Production Build up standardized SOP and Program for PVT from scratch

High P4, C4 PE, Schedule PE Frank

5. Production Build up standardized SOP and Program for MP from scratch

Low P5, C5 PE Base on PVT PE Frank

6. Technical EtherCAT FPGA Compatibility High P3, C3 FW Certify by ETG or Compatible with TWIN CAT 3

FW Joey

7. Technical DI/O Signal SPEC and Functionality

Low P3, C3 HW/FW Verify with 3rd Party DI/O products

HW Simon



No. Category Risk Level Critical

Date Implication Mitigation Owner

8. Technical Lack of SW/FW design documentation and version control

Mid P2, C2 SW/FW/HW/QT/IRT/PE

1. Agile SW Development Flow 2. SW Design template 3. Force to upload SW design documents to PLM

SW/FW Joey

10. Product New user manual and marketing materials from scratch

Mid Launch PM, Marketing, Technical Writer, HW, FW, SW

PM Eric

12. Marketing &

Business

New to the I/O market with low automation brand awareness

Low Launch Marketing Programs

PM Eric

12. Marketing &

Business Business Promotion Low Launch

PM, Marketing, Sales

Roadshow with solution selling kits and suite

PM Eric

GO-TO-MARKET STRATEGY Aiming BECKHOFF


NEXCOM offers the High Performance PC-based EtherCAT SoftMotion Solution


NEXCOM PAC System (SoftMotion & CNC Enabling)

NIFE Series + NEIO

NCN, NIT, ICS Channel – Asia, ICS Channel – EMEA

OEM SIs, Machine Builders

Vertical End Users: F&B, Metal Handling, Semiconductor, Robotics

MA PM Automation FAE RSM, MA PM

MA BDM, Automation FAE

Branding Activities: Tradeshows, Solution Days, Co-op Campaigns, Design Award Online Automation Media, FACEBOOK Page – NISE Automation

Sales Activities: Roadshows, SPEC in, KAs and Opportunities Management

Run-Rate Biz

Project Based Biz by IBM SME

Demand Generation (Aim: PLC-based Motion Control)

Customized, Large and Distributed Machinery

Support:

Sales & Channel:

Target Customers:

Target Markets:

Lead:

Solution Pack to Go and SPEC-in Service

KA Evaluation Program, NIFE System Promotion Program

Solution Pack to Go, FAE to your site, SPEC in Service PC-based EtherCAT SoftMotion Solution Pack with PAC Controller + HMI + Drive + Motor


Pipe Bending Machine

System Architecture

SoftMotion Features & Functions

FINANCIAL BUSINESS


Financial Business


Offering Name NEXCOM NEIO EB-1000 DI/O modules Type X PM Eric Lo

Schedule C1 C2

C3, Sample (EVT + DVT Finishes)

C4, Pilot Run (PVT Finishes)

MP

2015/1/9 2015/3/13 2015/5/15 2015/7/15 2015/8/12

Financial Aspect

USD

Financial Data M-BOM Cost Est.ITP Est.GP% Tooling Exp. (ME) Certification Exp. RD Man-M &Exp.

$84.3389 (DI) $70.4861 (DO)

$132.50 (DI) $145.00 (DO)

35.10% (DI) 51.39% (DO)

$16,5000 $3,742 21 $96,835

Kick-Off date Dec-2-2014 Time to Market Date Aug-12-2015 Time to Profit

Date 2016-Q3

3-Year Forecast

2015 2016 2017

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

Shipment Qty Total

- 75 199 372 4,988 6,286

Channel – EMEA

- 30 80 150 2,050 2,460

Channel – AP - 17 45 84 1,148 1,492

NCN - 19 51 96 1,216 1,702 NJP - - - - - - NEU - 5 13 24 328 361 NIT - 4 10 18 246 271

NUS - - - - - -

FOB (USD) Sales(ITP*Qty)

- 9,268 24, 593 45,972 616,417 776,824

Summary and Recommendation

To penetrate the IA Market, I/O is the entry ticket. And most of the biz model is run-rate biz. Therefore, Trustworthy Quality and Rugged Reliability are the basis accumulated by time.

Target and Compete BECKHOFF with NEXCOM EtherCAT turnkey

solution. Market Breaker Strategy with - basic models - entry level SPEC - cost-effective and aggressive price - and yet QUALITY orientated products.


Plan DCP Position Sheet


Decision

(Go/No

Go/Re-direct)

Approval Item Management Committee

Comment

Product

Plan

Financial

Goal

Risk

Assessment

Name: ____________

Concept DCP of NEXCOM Distributed IO PL_20160404_Eric Lo

Documents

Transcript of Concept DCP of NEXCOM Distributed IO PL_20160404_Eric Lo