Computing Platforms for the XXIc - DSD/SEAA Keynote
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Computing Platforms for the XXI Century Abstract:
Wikipedia defines Platform as "A raised level surface on which people or things can stand". A more familiar technical interpretation applies to the hardware and OS configuration applicable to the execution of software; most frequently applicable to highly stable PC or Mainframe architectures. But the world has changed a lot since serious computing power moved into the embedded consumer arena. Now, with runs of many millions for single products, the argument for customisation is much more justifiable; so the traditional view of platforms is struggling against a tide of individuality. Can the ARM architecture bring stability back into this chaos, or is something else needed? Isaac Newton realised the reality of platforms when he talked of standing on the shoulders of giants. A platform is a stable place where engineers and scientists can stand to achieve more than they would otherwise have done. So our XXI Century Platforms are the shape to deliver improved Productivity, Reuse, Quality, TTM, Cost, etc. for the System Products we are now charged to deliver. Its business, stupid!
Context Keynote at the Euromicro conference
The series (est1973) is known worldwide for its scientific quality. Its main event in 2013 is the collocated Digital System Design (DSD) and Software Engineering and Advanced Applications (SEAA) conference in Santander, Spain.
http://www.teisa.unican.es/dsd-seaa-2013/
45min Keynote, 60min Slot. 4sep13
Pdf and Tube available at http://ianp24.blogspot.co.uk/
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Prof. Ian Phillips Principal Staff Eng’r,
ARM Ltd [email protected]
Visiting Prof. at ...
Contribution to Industry Award 2008
Euromicro DSD/SEAA Keynote Santander, Spain
04sep13
1v0
Pdf and Tube available at http://ianp24.blogspot.co.uk/
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Classic Computing Platforms General Purpose Compute Platforms PC – Dominated by x86 architecture (Intel + AMD + Windows)
Windows ‘N’
DOS
Linux
OpenBSD
FreeVMS
But also Apple ... MacOS ‘N’ – Universal Binaries (PowerPC/x86)
Mainframe - IBM, EMC, Hitachi, Unysis, HP, NEC, Fujitsu Fortran C/C++ Cobol - One of first languages (1959). In 1997, 80% of the world's business ran on COBOL with >200
billion lines of code in existence and >5 billion lines of new code annually (Gartner).
Portable Computing – Pocketable GP Compute Platforms iOS (iPad/iPhone/iPod) Android Windows 8
... We all have our personal favourites!
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But What About Embedded?
BeagleBone Black (TI)
Computers, but without General Programmability The Chip as a Platform? MCU and CPU chips from many vendors?
The PCB Platform? ARM IP a Platform?
∘ The CPUs? ∘ The GPUs? ∘ AMBA? ∘ CoreLink Cells? ∘ SoC Methods?
What about the RTOS’s? There are 45 listed on ARM’s web-site
Or the Design Tools? Verilog/VHDL and Synthesis?
Digital Logic : Based on Boolean Mathematics?
Software Kernels/RTOs Debuggers? Lots of form-factors, targeting different markets
... By-Far the Biggest Footprint of Computers Today!
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The Face of Computing Today
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The Face of Computing Today
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A Machine for Computing ... Computing: A general term for algebraic manipulation of data ...
... State and Time are normally factors in this.
It can include phenomena ranging from human thinking to calculations with a narrower meaning. Wikipedia
Usually used it to exercise analogies (models) of real-world situations; Frequently in real-time (Fast enough to be a stabilising factor in a loop).
... Not prescriptive about Implementation Technology! ... Not prescriptive about ease of (re)Programmability!
y=F(x,t,s) Numerated Phenomena
IN (x)
Processed Data/ Information
OUT (y)
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Electronic Systems1: the KET for 21c! Fundamental to the solutions to all of Societies Challenges Dependent on them today; we will
become ever more so in the future National Independence is not an option:
but Mutual Co-Dependence is!
Though Animated by Electronics; ES are much more than that ...
... They Include all the Technologies and Methods to make them ‘work’ as a Product. The most important technology is
the one that doesn’t work!
... ES Technologies will literally be the Platform on which the 21c will be constructed.
1: aka; Cyber-Physical Systems (Geek-Talk!)
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Putting Technology into Context 21c Businesses have to be Selling things that People (End-Customers) want to buy. Globalisation makes Them Focus on Their Core Competencies Objective: (World) Best at That; Outsource ‘everything else’
Customers, Competition, Operations and Investors are Global Nationality: Has little meaning (Loyalty, Tradition, etc)
Business needs End-Customers buy Functionality not Technology Technologies enable Product Options ..but..
Business-Models make Money
New Products are Technology (HW, SW, Mechanics, Optics, etc) is just a
way to enable Product Options (Create Differentiation)! New Technology always increases Cost/Risk ... But not always Value Design is a Cost/Risk to be Minimised
... Technology is never a Product in its own right!
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Moore’s Law is a Technology Opportunity 10nm
100nm
1um
10um
100um
Appr
oxim
ate
Proc
ess
Geo
met
ry
ITRS’99
Tran
sist
ors/
Chi
p (M
)
Tran
sist
or/P
M (K
)
X
http://en.wikipedia.org/wiki/Moore’s_law
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Markets provide the Growth Drivers
1960 1970 1980 1990 2000 2010 2020
Milli
ons
of U
nits
1st Era Select work
tasks
2nd Era Broad-based computing
for specific tasks
3rd Era Computing as part
of our lives
... Yesterdays Markets are still valuable; just not the Biggest!
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The Productivity Gap? 10nm
100nm
1um
10um
100um
Appr
oxim
ate
Proc
ess
Geo
met
ry
ITRS’99
Tran
sist
ors/
Chi
p (M
)
Tran
sist
or/P
M (K
)
http://en.wikipedia.org/wiki/Moore’s_law
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... With Supporting
Methodology!
(Incl. Software)
Pre.1990 chip design was entire ... Moore’s Law was handled by ever Bigger Teams and ever Faster Tools With Improved Productivity through HDL and Synthesis ... I was a chip designer in 1975; and did it all, myself, in 3mth (1k gates!)
Post 1995 reuse silently entered the picture ... Circuit Blocks CPUs (and Software) External IP Up-Integration Chip Reuse (ASSP) ... Delivering Productivity, Quality and Reliability
... Birth of HW/SW IP Companies (eg ARM c1991)
... But it also brought the Commoditisation of Silicon (and FABs) !
What Happened to the Productivity Gap?
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How Much Reuse Today? Mobile Products have ~500m gate SoCs / ~500m lines of code Doubling every 18mth Designer Productivity: is just 100-1000 Gates(Lines)/day That is tested, verified, incorporated gates(lines) That’s 2,500-25,000 p.yrs to clean-sheet design! (Un-Resourceable)
Typically ‘Product Designs’ have 50-200 p.yr available ... That’s just ~0.5% New ... >99.5% Reuse already! Not Viable to do clean-sheet product design ... nor has it been since ~1995
The core HW/SW is only a part of a Product ... There’s all of the other Components and Sub-Systems There’s the IO systems (RF, Audio, Optical, Geo-spatial, Temporal) There’s the Mechanical There’s the Reproduction (Factory) There's the Business Model (Cash-flow, Distribution, Legal) There’s the Support (Repair, Installation, Maintenance, Replacement)
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How do we Reuse? Design Tools (across all Product Disciplines) underpin this ... Reuse of Modules and Components Reuse of Existing Code and Circuits Sharing Methodology Sharing Architecture Creating Tools to Accelerate Methodology and Repeatability Design For “x” (DFx) is Design For Up-Stream (Re)Deployment
A significant part is (and will remain) Knowledge based ... The Designer has done similar work before The Team has Collective experience The Company has experience and a customer base
The Design Engineering Role is ... To create Order out of Chaos To apply state-of-the-art and knowledge; to create a Viable Product
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Platforms Mean Productivity Reusing rather than Re-Developing Allows Focus on your value-add; and less on stuff that you can acquire
competitively (which has become commoditised).
Globalisation has changed the meaning of Local... ∘ English as the lingua-franca ∘ International Contract Law ∘ Instant global telecoms (ICT) ∘ The World-Trade Organisation (WTO) ∘ IT and the Internet ∘ Standardisation of GP-Compute Architecture
Platforms have changed scope of Reuse ... ∘ Actual Business-2-Business cooperation (Partnering, not just Out-Sourcing). ∘ In all aspects of business: Technical and Administrative ∘ Irrespective of geographic location ∘ Irrespective of tangibility of ‘product’. ... Just like does.
... And these businesses avoid Commoditisation ... By Differentiating their Platform Products
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Good Platforms ‘Fit’ Many Niches...
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Growing opinion that 14 or 7nm will be the smallest yieldable node ... Ever!
All Exponentials Must End ... 130nm
90nm
30nm
14nm
7nm
Just 3-4 gen. (5-8yr) to the end of Planar Scaling
... can get into the last of the of planar chips! Its also the end-of-the-road for
‘promising technologies’ ! Clean-Sheet Synthesis Scalable Processor Arrays Formal Design Top-Down Design
Only things on the drawing board today ...
...And the end for Moore’s Law?
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Electronic era:
1975-2005 System era:
2003-2030
Cascade of Technologies supporting Functional growth ...
... The ‘Law’ started with Wood ⇒ Stone ⇒ Bronze ⇒ Iron
Moore's Real Law: x2 Functionality Every 18mth! Fu
nctio
nal D
ensi
ty (u
nits
)
1960 1980 2000 2020
102
1010
106
1012
100
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… System-Scaling Maintains Momentum!
... A disconnect for Moore’s Planar-Scaling Law, ... but not for ‘his’ System-Scaling Law.
Interposer today
Die-Integration ..and.. Genuine 3D-Process very soon
10 Layer Interposer
4x Transfer to Production
8x Sampling
10 stack 1.6 mm Active Carrier
DRAM - 20nm Si FIN-MOS CPU- 90nm Si CMOS RF - 300nm GaAs PV - 500nm Ge
Die-Stack Mixed-Technology
300nm Si CMOS
Die-Stack
13aug13
24-Layers 3D NAND-Flash
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Packing Technology in an iConic Product
Analogue and Digital Design Embedded Software Mechanics, Plastics and Glass Micro-Machines (MEMs) Displays and Transducers Robotics and Test Knowledge and Know-How Research, Education and Training Components, Sub-Systems and Systems;
Design, Assembly and Manufacture Metrology, Methodology and Tools ... Involving Many Specialist Businesses
... Round and Round the World ...Not-Least from Europe
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A lot of Technologies in a Smart Phone
... And more than 99%+ is Reused!
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Take a Look Inside...
http://www.ifixit.com
The Control Board.
Level-1: Modules
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Inside The Control Board (a-side)
http://www.ifixit.com
Level-2: Sub-Assemblies Visible Computing Contributors ...
Samsung: Flash Memory - NV-MOS (ARM Partner) Cirrus Logic: Audio Codec - Bi-CMOS (ARM Partner) AKM: Magnetic Sensor - MEM-CMOS Texas Instruments:Touch Screen Controller and mobile DDR - Analogue-CMOS (ARM Partner) RF Filters - SAW Filter Technology
Invisible Computing Contributors ... OS, Drivers, Stacks, Applications, GSM, Security, Graphics, Video, Sound, etc Software Tools, Debug Tools, etc
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Inside The Control Board (b-side)
GPS Bluetooth, EDR &FM
http://www.ifixit.com
Level-2: Sub-Assemblies More Visible Computing Contributors ... A4 Processor. Spec:Apple, Design & Mfr: Samsung Digital-CMOS (nm) ...
Provides the iPhone 4 with its GP computing power. (Said to contain ARM A8 600 MHz CPU and other ARM IP)
ST-Micro: 3 axis Gyroscope - MEM-CMOS (ARM Partner) Broadcom: Wi-Fi, Bluetooth, and GPS - Analogue-CMOS (ARM Ptr) Skyworks: GSM Analogue-Bipolar Triquint: GSM PA Analogue-GaAs Infineon: GSM Transceiver - Anal/Digi-CMOS (ARM Partner)
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The A4 SIP Package (Cross-section)
Down 3-Levels: IC Packaging The processor is the centre rectangle. The silver circles beneath it are solder balls. Two rectangles above are RAM die, offset to make room for the wirebonds.
Putting the RAM close to the processor reduces latency, making RAM faster and cuts power. Unknown Mfr (Memory) Samsung/ARM (Processor) Unknown (SIP Technology)
Source ... http://www.ifixit.com
Processor SOC Die
2 Memory Dies
Glue
Memory ‘Package’
4-Layer Platform Package’
27
The Processor Unit (Nvidea Tegra 3, Around 1B transistors)
NB: The Tegra 3 is similar to the A4/5, but is not used in the iPhone
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Lots and Lots of Designers ...
159 Tier-1 Suppliers ... Thousands of Design Engineers 10’s of thousands of Engineers Globally
... Hundreds more Tier-2 suppliers (Including ARM)
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So What Does ARM Really Do? “ARM designs processor technology that lies at
the heart of advanced consumer products”
30
Multiplier
Instruction Decoder
Address Incrementer
nRESET ABORT
nIRQ nFIQ
WRITE SIZE[1:0]
LOCK
CPnCPI CPA CPB
CLKEN CLK
CPnOPC
CFGBIGEND
TRANS
RDATA[31:0]
Barrel Shifter
32 Bit ALU Write Data Register
Address Register
Register Bank
ADDR[31:0]
and
Control Logic
A B u s
A L U B u s
P C
PC Update
Decode Stage
Instruction Decompression
Incrementer
Read Data Register
WDATA[31:0]
PROT
Scan Debug Control
B B u s
1991: ARM a RISC-Processor Core …
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The ‘Lego-Brick’ Chip-Design Concept
ARM7 Core
DMA
Par. Port
PCMCIA UART (2)
Int’t. Contr.
Memory Interface
Timers W’Dog Arb’tr. Misc.
32
Today, users require a pocket ‘Super-Computer’ ... Silicon Technology Provides a few-Billion transistors ...
ARM’s Technology (still) makes it Practical to utilise them ...
But Systems Got Ever-More Complex!
• 10 Processors • 4 x A9 Processors (2x2): • 4 x MALI 400 Fragment Proc: • 1 x MALI 400 Vertex Proc. • 1 x MALI Video CoDec • Software Stacks, OS’s and Design
Tools/ • ARM Technology gives
chip/system designers ... • Improved Productivity • Improved TTM • Improved Quality/Certainty
ARM
ARM
ARM
ARM
ARM
ARM
nVidea Tegra3
... So By Definition ARM is (≥1) Platform!
33
Making Systems out of Transistors ARM Technology drives efficient
Electronic System solutions: Software increasing system efficiency
with optimized software solutions Diverse components, including CPU
and GPU processors designed for specific tasks Interconnect System IP delivering
coherency and the quality of service required for lowest memory bandwidth Physical IP for a highly optimized
processor implementation
Backed by >900 Global Partners ... >800 Licences Millions of Developers
34
C/C++ Development
Middleware
Debug & Trace
Methodology As Well As Hardware
Energy Trace Modules
35
The Right Horse for The Course ...
... Delivering ~5x speed (Architecture + Process + Clock)
About 50MTr
About 50KTr
36
... Means 24 Processors in 6 Families
37
Power-Efficiency Watts don’t just Happen; they are Caused! In the Chip Matching the processor to the application Minimise voltage/frequency (P=CV2f) Variable/Gated clock domains Variable/Switched voltage domains Maximises ‘Activity Power’ dependence (Counter Intuitive)
In the Software Give the OS and the Application SW
Information and Controls Methodology and Utilities
In the System Architecture Extend control beyond the chip
` ... HW Dissipates; but SW Makes It!
38
Parallel is More Power-Efficient
Processor
f
Input Output
Processor
f/2
Processor
f/2
f
Input Output
Capacitance = 2.2C Voltage = 0.6V
Frequency = 0.5f Power = 0.4CV2f
Capacitance = C Voltage = V
Frequency = f Power = CV2f
... By a factor determined by Amdahl or Gustafson?
39
CoreLink Supports Multi-Processing
ACE
ACE
NIC-400 Network Interconnect
Flash GPIO
NIC-400
USBQuad Cortex-
A15
L2 cache
Interrupt Control
CoreLink™DMC-520
x72DDR4-3200
PHY
AHB
Snoop Filter
Quad Cortex-
A15
L2 cache
Quad Cortex-
A15
L2 cache
Quad Cortex-
A15
L2 cache
CoreLink™DMC-520
x72DDR4-3200
8-16MB L3 cache
PCIe10-40GbE
DPI Crypto
CoreLink™ CCN-504 Cache Coherent Network
IO Virtualisation with System MMU
DSPDSP
DSP
SATA
Dual channel DDR3/4 x72
Up to 4 cores per cluster
Up to 4 coherent clusters
Integrated L3 cache
Up to 18 AMBA
interfaces for I/O coherent accelerators
and IO
Peripheral address space
Heterogeneous processors – CPU, GPU, DSP and accelerators
Virtualized Interrupts
Uniform System
memory
40
big.LITTLE Processing For High-Performance systems...
Tightly coupled combination of two ARM CPU clusters: Cortex-A15 (big Performance) and Cortex-A7 (LITTLE Power) - functionally identical Same programmers view, looks the same to OS and applications
big.LITTLE combines high-performance and low power Automatically selects the right processor for the right job Redefines the efficiency/performance trade-off
big
“Demanding tasks”
LITTLE
“Always on, always connected tasks”
30% of the Power (select use cases)
Current smartphone
big.LITTLE Current smartphone
big.LITTLE
>2x Performance
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Fine-Tuned to Different Performance Points
Simple, in-order, 8 stage pipelines
Performance better than mainstream, high-volume smartphones (Cortex-A8 and Cortex-A9)
Most energy-efficient applications processor from ARM
Complex, out-of-order, multi-issue pipelines
Up to 2x the performance of today’s high-end smartphones
Highest performance in mobile power envelope
Cortex-A7 Cortex-A53
Cortex-A15 Cortex-A57
LIT
TLE
bi
g
Queue
Issue
Integer
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CPU Migration Migrate a single processor workload to the appropriate CPU Migration = save context then resume on another core Also known as Linaro “In Kernel Switcher”
DVFS driver modifications and kernel modifications Based on standard power management routines Small modification to OS and DVFS, ~600 lines of code
big.LITTLE MP OS scheduler moves threads/tasks to appropriate CPU Based on CPU workload Based on dynamic thread performance requirements
Enables highest peak performance by using all cores at once
big.LITTLE Software Model
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Businesses Within The Global Life-Cycle
De- Commission Upgrade Maintain Install Reproduce Qualify Integrate Design
Company A, Product-X
De- Commission Upgrade Maintain Install Reproduce Qualify Integrate Design
Company-B, Product-J,K,L
De- Commission Upgrade Maintain Install Reproduce Qualify Integrate Design
Company-C, Product-M,N,O
Design Tools Training Education ICT Conferences Patents Know-How Tool-Libraries Models Software Research Methods
Tools Technologies Prototypes FABs Components Know-How Methods
Equipment Know-How Standards Procedures ICT Methods Training
Big Finance Equipment Know-How Components Out-Sourcing JIT Factory Auto’n Methods TQM Training
Equipment Know-How Standards Methods Supply Logistics Training
Equipment Know-How Supply Logistics Training
Equipment Know-How Supply Logistics Training
Equipment Know-How Standards Logistics Training
Companies B & C Provide Their Valued Product(s) to Other Customers As Well (Efficiency of Reuse)...
... Enabled By Globalisation: ICT, WTO, English Language, Containers and Int’l Contract Law
... All Platforms are Valued in Product Life-Cycles
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Conclusions ... Business is about Making Money for Investors ... Technology just enables Product Options, not all of which are Valuable “Optimality” is seldom a Product Differentiator; “Better” is! ... Most Tech. Enterprises provide Components into Product Life-Cycles
Platforms are just Productivity Aids ... A way of creating new Products as quickly and cheaply as possible Valued is not the same as Valuable ARM is a Productivity Aid to the biggest market for Computers today ... So by definition ARM’s Products are (key) Computing Platforms (plural)
Electronic Systems will be the foundation of our future ... They will be fundamental to whatever Society makes of the 21C (+ and -) And Society will be increasingly unaware of them! Requirements for ever more Sophisticated Functionality will require ever
more sophisticated Technology-Platforms throughout their Life-Cycles
... But Electronic Systems will be The Product-Platform for the XXIc
45
Prof. Ian Phillips Principal Staff Eng’r,
ARM Ltd [email protected]
Visiting Prof. at ...
Contribution to Industry Award 2008
Pdf and Tube available at http://ianp24.blogspot.co.uk/