Comparison of Singulation Techniques - IEEEewh.ieee.org/soc/cpmt/presentations/cpmt1709a.pdf ·...
Transcript of Comparison of Singulation Techniques - IEEEewh.ieee.org/soc/cpmt/presentations/cpmt1709a.pdf ·...
IEEE Electronics Packaging Society, SCV Chapter September 28, 2017
www.cpmt.org/scv 1
Comparison of Singulation TechniquesElectronic Packaging Society, Silicon Valley ChapterSept. 28, 2017
ANNETTE TENG
Sept 28, 2017 1
Definition of Singulation
9/28/2017 [email protected] 2
IEEE Electronics Packaging Society, SCV Chapter September 28, 2017
www.cpmt.org/scv 2
Wafer Wash wafer
Assembly Flow for Singulation
(>0.70mm) waferApply front side tape Rough grind Fine grind
9/28/2017 [email protected] 3
Mount dicing tape on backside of wafer
Remove front side tapeBackend
assembly
Singulate/dicing
Wafer Singulation Techniques
Plasma dicingPlasma dicingThermal Laser Separation
Stealth Laser Dicing
Laser Dicing
Saw with BladeScribe & Break
1950 1960 1970 1980 1990 2000 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017
IEEE Electronics Packaging Society, SCV Chapter September 28, 2017
www.cpmt.org/scv 3
•SAW• LASER
• Ablation• Stealth• TLS
Sept 28, 2017 [email protected] 5
• TLS
• Plasma
Saw Machines
• Cut Precision: 0.1um• Blade height control:0.1um
A t bl d dj t
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• Auto blade wear adjust• Broken blade detect
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www.cpmt.org/scv 4
Saw Blades-18um and up
Resin bond blade
Saw Tape
UV-TAPE
High
SawDiepick
Ad
hes
ive
Str
eng
th
Non UV-TAPE
UV
irra
dia
tio
n
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ANon UV TAPE
Low
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Dice Before Grind allows for ultrathin dies
groo
ve
groo
ve
groo
ve
Wafer Frontside
Groove
Dicing tape
Backgrind tape
Wash
Backgrind tape
BackGrind + stress relief
10um Si dies10um Si dies
10/24/2017 [email protected]
Wafer Frontside
Tape and frame
Tape Flip10um Si dies10um Si dies
20-40um dies well established i DRAM d Fl h d iin DRAM and Flash drives(Micron, Sandisk, Samsung)
25um copper pillars25-40um die thickness6-7um TSV diameter
Sept 28, 2017 [email protected] 10
IEEE Electronics Packaging Society, SCV Chapter September 28, 2017
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VERSATILITY of SAW
Profile cuts
DAF Multilayer material
Metallized wafer
Making needles
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g
Metallized street
Multilayer materials
WAFER THICKNESS CUTOFF FOR LASER AND PLASMAWAFER THICKNESS CUTOFF FOR LASER AND PLASMAWAFER THICKNESS CUTOFF FOR LASER AND PLASMAWAFER THICKNESS CUTOFF FOR LASER AND PLASMA
SAW5000um
Sept 28, 2017 [email protected] 12
IEEE Electronics Packaging Society, SCV Chapter September 28, 2017
www.cpmt.org/scv 7
Problems with Saw-Water issues; chipouts;
Saw dustSedimentation on bond pads
InP chipout
GaAs chipout Sapphire chipout
bond pads
Galvanic corrosion InP chipoutGalvanic corrosion of Aluminum pads
of Aluminum pads
1. SAW
2. LASER• 2a. Ablation• 2b. Stealth• 2c. Thermal Laser Separation
Sept 28, 2017 [email protected] 14
3. Plasma
IEEE Electronics Packaging Society, SCV Chapter September 28, 2017
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Laser Singulation
Thermal shock
Laser ablation / stealth
CleaveSaw
Removal of
CoatingCoating
Tape stretch
shock
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Roller break
Tape stretch
TechnologyAblation
(requires coating & washing)
Stealth
(coating not required)
Ablation vs Stealth
Method
Sublimation by irradiating short pulse laser Creating SD (modified) layer by focusing laser inside material
Collecting lens
Workpiece
Short pulse laser
Workpiece
Collecting lens
Short pulse laser
10/24/2017 [email protected] 16
Process
Grooving
Scribing
Full cut
DAF cut
Chip separation by
SD layer creation + Breaking/Expand
IEEE Electronics Packaging Society, SCV Chapter September 28, 2017
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STEALTH DICING on GaAsExample on GaAs mirror wafer
Wafer Thickness: 100um(DP finish), Chip size 5x5mm, Feed speed 240mm/sec
Top side Back side CH1 CH2 Chip Separation Method
1 pass
Tape expand+
3 point breaking
2 pass
Tape expand only
SD Irradiation Side
SD Irradiation Side
SD Irradiation Side
SD Irradiation Side
© 2014 Disco Corporation. 17
3 pass
Tape expand only
SD Irradiation Side SD Irradiation Side
InP Laser scribe & Break vs Through CutApply Protective film
InPWash off protective film
LASER
InP
Protective film
110m
Laser Grooving
Dicing tape
Breaking process
Slit
Expand on stretchable dicing tape
Dicing tape
Dicing tape
Dicing tapeMetal film
Protective filmMetal film
LASER110m
© 2015 Disco Corporation.18
Laser Full CutShipping format
Dicing tape
InP InP
Clean
Expand on stretchable dicing tape
IEEE Electronics Packaging Society, SCV Chapter September 28, 2017
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Disco DDS2010
Tape Expanding + Breaking
Expanding
Die separation will be performed by following the curve on breaking bar
Expanding-stretchable tape
© 2013 Disco Corporation. 19
Direction of separation
Vacuum
Breaking-stretchable tape
InP Ablation Fullcut vs. Scribing + BreakingThickness 100um, Index 0.25 x 0.25mm, street width 20um
MachinePass
Power[W]
Frequency[kHz]
Feed speed[mm/s]
Kerf width[µm]
Laser full cut Photographs*
Front side Cross section
DFL7160Type-DF-1, BSS3
1 4.0 30 150 10.5
*Photographs were taken with the parameter setting sample.
MachinePas
sPower
[W]
Frequency
[kHz]
Feed speed[mm/s]
Kerfwidth[µm]
Laser scribing Photographs*
Front side Cross section
© 2015 Disco Corporation.20
[ ][kHz] [mm/s] [µm] Front side Cross section
DAL7020Type-S1No. 3-50
1 0.6 100 180 8.5
Processed depth: 49.8 µm
IEEE Electronics Packaging Society, SCV Chapter September 28, 2017
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Stealth Dicing on InPThickness: 200um, Index: 2mm x 2mm
Top side Back sideCross-section
X side Y side
Detape topside
1st 2nd 3rd 4th 5th
Feed speed [mm/s] 280
CH1
CH2
Power [W] 0 0.2 0.15 0.1 0.05
DF [m] 0 -38 -27 -15 -7
Mapping pass
SD Condition
© 2015 Disco Corporation.21
Laser backside
Flip & Expand
Grip ring
DC tape mount Front side
UV frontside
[ ]
Process
Flow
UVTape mount on back side
Laser grooving+ blade full cut
Low-k CPU & Logic
Process Material DeviceLaser Dicing Technologies vs. materials/applications
Laserfull cut
Laser scribe+ Break
Si, Ge, SiC, GaAsMetal Substrate, DAF
SapphireAlumina Ceramics
LED, Sensors
Solar Cells/Power DeviceLED, Power Device
RF Device, NAND Flash
MEMS/RFID/Linear Sensor
© 2015 Disco Corporation. 22
Stealth dicingSilicon, Sapphire, SiCGlass, FuSi, InP, GaAs
MEMS/RFID/Linear SensorLED, Power Device
Medical, etc
Via Hole LitaO3, LiNb, SOI Wafer SAW Device, MEMS
IEEE Electronics Packaging Society, SCV Chapter September 28, 2017
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Disco Laser Systems (Head + Optics)Wafer Type Ablation Laser Stealth Dicing
Low-K GroovingType-F + Standard OpticsType-FX + BSS6 Optics SDE01 / SDE03
SDE03R / SDE05/ SDE06Si Full cut
Type-D + BSS3Type M BSS5 (Ultra thin)Type-M BSS5 (Ultra thin)
GaAs / InP Full cutType-G + BSS3GType-D + BSS3
SDE21
Ge Type-K + BSS4 SDE03
Sapphire Full cut Type-F + Sapphire Optics SDE31
SiC Full cut Type-D + BSS3 SDE41
DAF Cut Type-A + DAF Optics ( Use DDS2300 )
© 2013 Disco Corporation. 23
Glass / LT LN / GaN
Under R&D (see below) SDE33/ SDE12
OthersFeasibility for most of Laser process
available in Japan. Such as VIA, glass dicing, curved shape dicing, LLO etc.
Some SD engine are under R&D phase. To be released
Sept 28, 2017 [email protected] 24
IEEE Electronics Packaging Society, SCV Chapter September 28, 2017
www.cpmt.org/scv 13
Sept 28, 2017 [email protected] 25
Sept 28, 2017 [email protected] 26
IEEE Electronics Packaging Society, SCV Chapter September 28, 2017
www.cpmt.org/scv 14
Sept 28, 2017 [email protected] 27
2513280
5654880
4760000
4062414
3507990
30600002692800
3000000
4000000
5000000
6000000
ies
per
waf
er
NUMBER OF DIES/8" WAFER
NUMBER OF DIES/12" WAFER
REDUCING KERF ON REDUCING COST & INCREASING PRODUCTIVITY
25132802115556
18055171559107
1360000 1196800
0
1000000
2000000
0.000 0.020 0.040 0.060 0.080 0.100 0.120
Tot
al d
Street width (mm) added to a 0.250mmx0.200mm die
Street width reduction vs yield
10000
12000
14000
of c
uts
DiodeL x W0 250
Sept 28, 2017 [email protected] 28
0
2000
4000
6000
8000
0 0.02 0.04 0.06 0.08 0.1 0.12
Tot
al n
umbe
r
Street widtrh (mm) added to diode
Singulation /wafer cost high for smaller dies
0.250 x0.200mm KERF/street width
IEEE Electronics Packaging Society, SCV Chapter September 28, 2017
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SMALL DIES MAKERS OF RFID & DIODES ARE TO PLASMA
Sept 28, 2017 [email protected] 29
1. SAW $0.2m
2. LASER Ablation >$1m
3. Stealth Dicing >$1m
4.Plasma >$5m
Sept 28, 2017 [email protected]
IEEE Electronics Packaging Society, SCV Chapter September 28, 2017
www.cpmt.org/scv 16
© 2014, ON Semiconductor, All Rights Reserved
31/11
IssuesRemoval of FlourinatedresiduesPlasma resistant carrier tape
32/11
IEEE Electronics Packaging Society, SCV Chapter September 28, 2017
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Laser
PLASMA DICING PROCESS FLOW
Plasma singulation
Saw
Removal
of PR
Removal of F
residues
Photo
lithographygrooving
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Sawgrooving
carrier
Silicon waferPRPR
IR and Stepper pattern PR
Si wafer FEOL Redistribution Solder bump
ESTABLISHED PLASMA SINGULATION FROM ONSEMI (courtesy of Harry Gee)
IR Image of underlying metal from top foralignment of the street
PR pattern of the street after exposure
carrier
Silicon waferPRPR
pattern PR
carrier
diedie
After Plasma etchPRPR
FEOL
Plasma singulation
Wafer Backgrind
Bond to carrier wafer
Encapsulatiearound dies
Carrier removal Wafer probe
Sept 28, 2017 [email protected] 34
carrier
diedie
Remove PR
Laser mark CSP singulation
IEEE Electronics Packaging Society, SCV Chapter September 28, 2017
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$1. SAW $0.2m2. LASER Ablation >$1m3. Stealth Dicing >$1m4. Plasma >$5m
Comparison
Sept 28, 2017 [email protected]
Plasma dicing
TLS
Sidewall Comparison of Saw Techniques
PlasmaTLS
Stealth Laser
Ablation Laser
Saw with Blade
Laser ablate and stretch
Sept 28, 2017 [email protected] 36
Saw with Blade
Scribe and BreakSaw
IEEE Electronics Packaging Society, SCV Chapter September 28, 2017
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Sept 28, 2017 [email protected] 37/11
• Batch process• High UPH for tiny dies• Narrow Kerf yields more die
Advantages of Plasma
per wafer• Accuracy of die defined on
passivation• Improvement in Die Strength• Rounded corner at each die
Sh th th t l
Sept 28, 2017 [email protected] 38/11
• Shape other than rectangular• Multi Project Wafer(MPW)
Pizza cut
IEEE Electronics Packaging Society, SCV Chapter September 28, 2017
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Foundry Plasma Dicing
Foundry equipment suppliers to assembly.
y gSuppliers includesPlasmaTherm has partnered with
Disco
Panasonic
Sept 28, 2017 [email protected] 39
SPTS
Sept 28, 2017 [email protected] 40
Acknowledgement:
Disco Hi-Tec America, Inc.
www.discousa.com