850

750

min 2000696

546

2160

1410

875

150

Operator's table

Electronics Vega

Microscopecolumn

Forevacuum pump(with silencer box)

ResolutionIn high-vacuum mode (SE)In medium-low-vacuum mode (BSE)

Working vacuumHigh-vacuum modeMedium-vacuum modeLow-vacuum mode

Accelerating voltage

Electron gun

Probe current

Image size

Microscope control

Remote control

Electron optics working modes

3.0 nm at 30 kV / 2.0 nm at 30 kV (LaB6)–

3.0 nm at 30 kV / 2.0 nm at 30 kV (LaB6)3.5 nm at 30 kV / 2.5 nm at 30 kV (LaB6)

< 9 x 10–3 Pa––

< 9 x 10–3 Pa (5 x 10-4 reachable)3 – 150 Pa (not available with LaB6)3 – 500 Pa (optionally 2000 Pa)

200 V to 30 kV

Tungsten heated cathode / optionally LaB6 filament

1 pA to 2 µA

Scanning speed From 20 ns to 10 ms per pixel adjustable in steps or continuously

Focus window Shape, size and position continuously adjustable

Scanning features Dynamic focus, Point & Line scan, Tilt correction, 3D Beam, other shapes accessible using optional DrawBeamSoftware Tool

Up to 8,192 x 8,192 pixels in 16-bit quality, size is adjustable separately for live images (in 3 steps)and for saved images (in 10 steps), for square and rectangular 4:3 or 2:1 aspect ratios.

All microscope functions are PC controlled by means of the trackball, the mouse and the keyboard viathe VegaTC program using WindowsTM platforms. Control panel and touchscreen optionally available.

Via TCP / IP

Automatic procedures In-Flight Beam Tracing™ beam optimization, BI OptiMag (Spot Size optimization for Magnification),WD (Focus) & Stigmator, Contrast & Brightness, Scanning Speed (according to Signal - Noise Ratio),Gun Heating, Gun Centering, Column Centering, Vacuum Control, Compensation for kV, Look Up Table,Auto-diagnostics

Installation requirements Power 230 V/50 Hz or 120 V/60 Hz, 1300 VANo water coolingCompressed dry nitrogen is recommended: 150 — 500 kPaCompressed air for suspension: 500 — 700 kPa

Environmental requirements Temperature of environment: 17 – 28 ˚CRelative humidity: < 80 %Vibrations: Pneumatic suspension: < 6 µm/s below 30 Hz

< 12 µm/s above 30 HzMechanical suspension (option): < 4 µm/s below 30 Hz

< 8 µm/s above 30 HzActive isolation (option): < 12 µm/s below 30 Hz

< 24 µm/s above 30 HzBackground magnetic field: synchronous < 3 x 10-7 T

asynchronous < 1 x 10-7 T

Resolution, Depth, Field, Wide Field,Channelling

High VacuumResolution, Depth,Field, Wide Field,Channelling

Medium VacuumResolution, Depth,Field, Wide Field,Channelling

Requirements

Low VacuumResolutionDepth

Magnification Continuous from 2.5x to 1,000,000x 13x - 1,000,000x

Maximum field of view 70.0 mm 15.0 mm

Wide Field Optics™, In-Flight Beam Tracing™ and EasySEM™ are trademarks of TESCAN, a.s.Windows™ is a trademark of the Microsoft Corporation.We are constantly improving the performance of our products, so all specifications and external designs of instruments are subject to change without notice.

System dimensions: 2.160 m x 1.025 mRoom for installation: min. 3 m x 3 m

C M KYC

MK

Y

LMHVEGA3 LM LMU

Distributor

©TE

SCAN

2011

.7

PERFORMANCE IN NANOSPACE

TESCAN, a.s.Libušina třída 21, 623 00 BrnoCzech Republic, EUtel. +420 547 130 414fax +420 547 130 415e-mail: info@tescan.cz

www.tescan.com

Common Applications

Materials Science

Materials characterization of metals, ceramics, polymers,composites, coatings, metallurgy, metallography, fractureanalysis, degradation processes, morphological analysis,steel cleanliness analysis, microanalysis, texture analysis,ferromagnetic materials, etc.

Research

Mineralogy, geology, paleontology, archeology, chemistry,environmental studies, particle analysis, applied physics,nanotechnology, nanoprototyping, etc.

Live Sciences

Botany, parasitology, pharmaceutics, STEM histology, dentalimplants, etc.

Forensic Investigations

Gun shot residue analysis, bullets and cartridge investigation,tool mark comparison, analysis of hairs, fibers, textiles andpapers, paints, ink and print characterization, line crossings,investigation of counterfeit documents, etc.

Electrotechnical Engineering

Solar cells inspection, microelectronics inspection,PN junction visualization, lithography, etc.

Modern Optics

� A unique four-lensWide Field Optics™ design offeringa variety of working and displaying modes

� The proprietary Intermediate Lens (IML) that works as an´aperture changer´ changes the effective final apertureelectromagnetically.

� The use of premium materials for the lenses and coilsenables an ultra-fast imaging rate down to 20 ns/pixel withminimized dynamic distortion effects.

� Newly implemented In-Flight Beam Tracing™ for highprecision real-time computation of optical parameters

� Column design without any mechanical centeringelements enables fully automated column set-up andalignment.

� Unique live stereoscopic imaging using advanced3D Beam Technology opens up the micro and nano-worldfor amazing 3D experience and 3D navigation.

Analytical Potential

� The LM chamber label indicates a large analytical chamberwith a fully 5-axis motorized stage.

� 11 chamber interface ports with optimized analyticalgeometry for EDX, WDX and EBSD

� First-class YAG scintillator based detectors

� Selection of optional detectors and accessories

� Full operating vacuum can be reached within a few minuteswith powerful turbomolecular and rotary fore vacuumpumps.

� Investigation of non-conductive samples in the variablepressure mode (LMU) version

� Several options of chamber suspension type ensure effectivereduction of ambient vibrations in the laboratory.

� 3D measurements on a reconstructed surface utilizing 3Dmetrology software

Rapid Maintenance

Keeping the microscope in peak conditions is now easy andrequires a minimum of microscope downtime. Every detailhas been carefully designed to maximize the microscopeperformance and minimize operator effort.

3rd Generation of VEGA SEMs

The VEGA series was designed with respect to a wide rangeof SEM applications and needs in today’s research and industry.After 10 years of continuous development VEGA has maturedto its 3rd generation. This new generation provides userswith the advantages of the latest technology, such as newimproved high-performance electronics for faster imageacquisition, ultra-fast scanning system with compensationof static and dynamic image aberrations or built-in scripting foruser-defined applications, all while maintaining the best price toperformance ratio.

Specimen Stage

* - Option: X x Y movement ranges: 40 x 40 mm, 60 x 60 mm

LM ChamberInternal size

Door width

Type

Movements *

∅ 230 mm

148 mm

Number of ports 11+

Chamber suspension pneumatic or optionally mechanical oractive vibration isolation

Specimen height maximum 81 mm

compucentric, 5-axis fully motorized

X = 80 mm, Y = 60 mm, Z = 47 mmRotation: 360˚ continuousTilt: -80° to +80 (WD dependent)

Software Tools

Image Processing and OperationsMeasurementObject AreaHardnessToleranceMulti Image CalibratorSwitch-Off Timer3D ScanningPositionerEasySEM™ScriptorLive Video

EasyEDX Integration SoftwareDrawBeamEBIC ControlMorphologyParticle AnalysisImage SnapperSample Observer3D Metrology (MeX) *

�

�

�

�

�

�

�

�

�

�

�

�

��

��

��

��

��

��

��

��

PERFORMANCE IN NANOSPACE

� standard, �� option, * third party dedicated software

60°

WD

10

55°

WD

1522

WDX TOA 35°EDX TOA 35°

EBSD

EDX TOA 30°

WDX TOA 30°

LVSTD

SE position #3

EBSD

EDX TOA 35°

SE position #2

SE position #1

BSE / CL

WDX TOA 35°/30°

EDX TOA 35°/30°

IR Camera

148Door

∅ 230

60°

WD

10

55°

WD

1522

WDX TOA 35°EDX TOA 35°

EBSD

EDX TOA 30°

WDX TOA 30°

LVSTD

SE position #3

EBSD

EDX TOA 35°

SE position #2

SE position #1

BSE / CL

WDX TOA 35°/30°

EDX TOA 35°/30°

IR Camera

148Door

∅ 230

60°

WD

10

55°

WD

1522

WDX TOA 35°EDX TOA 35°

EBSD

EDX TOA 30°

WDX TOA 30°

LVSTD

SE position #3

EBSD

EDX TOA 35°

SE position #2

SE position #1

BSE / CL

WDX TOA 35°/30°

EDX TOA 35°/30°

IR Camera

148Door

∅ 230

side view – variant 1

side view – variant 2

top view – full configuration

VEGA3 LM configurations

VEGA3 LMHA large chamber model with extended motorized manipulatoroperating at high vacuum suitable for wide range of applica-tions where conductive materials are investigated.

VEGA3 LMUA variable pressure SEM that supplements all the advantages of the high vacuum model with an extended facility for low-vacuum operations, enabling the investigation of noncon-ductive specimens in their natural, uncoated state.

Detectors LMH LMUSE – ET type detectorRetractable BSE detectorMotorized R-BSE detectorLVSTDEasyEDXTE detectorEBICCL detectorEDX *WDX *EBSD *

�

��

��

——

��

��

��

��

��

��

��

�

�

��

��

��

��

��

��

��

��

��

* fully integrated third party products

AccessoriesProbe current measurementTouch alarmChamber view cameraActive vibration isolationPassive vibration isolationPeltier cooling stageBeam blankerControl panelLoad lockWater vapor inlet

�

�

�

��

��

��

��

��

��

——

�

�

�

��

��

��

��

��

��

��

� standard, �� option, —— not available

C M KYC

MK

Y

3D Surface reconstruction of a dental implant screw was used for a surface roughness evaluation.(MeX – 3D Metrology software)

Automated Procedures

Filament heating and alignment of the gun for optimal beam performance is done automatically with just one click. There are many others which reduce the operator’s tune-up time significantly, enable automated manipulator navigation and automated analyses. Built-in scripting language (Python) enables access to most of software features, including complete microscope control, stage control, image acquisition,processing and analysis. Scripting enables users defining their own automatic procedures.

User-Friendly Software

� Multi-user environment is localized in many languages.

� Four levels of user expertise/rights, including an EasySEM™ mode forquick routine investigations

� Image management and report creation

� Built-in self-diagnostics for system readiness checks

� Network operations and remote access/diagnostics

Software Tools

� Modular software architecture enables several extensions to be attached.

� Basic set of plug-ins, such as Measurement, Image Processing, Object Area available as standard

� Several optional modules or dedicated applications optimized for automatic sample examination procedures, such as Morphology and Particle Analysis or 3D surface reconstruction, etc.