COM SBCs

Applications:

AAEON’s Computer On Module Service (COMS(

COM Design Service

Thermal Design Service

Carrier Board Design Service

Reduce Business Investment

Less Design Effort and Less Risk

Time-to-Market Solution within 30 Days

Retail & Advertising•

Medical•

Test & Measurement•

Gaming & Entertainment•

Industrial Automation•

Military & Government•

Security•

What is Q Service ?Q Service is a new service model providing Quick service to customers.

Target:

Quick carrier board circuit review(((

Quick BIOS service(((

Quick compatibly and reliability debugging(((

Q Service includes Three support phases:

Phase 1 H/W Design review service

Phase 2: S/W bring up BIOS service

Phase 3: On-Site support service

AAEON’s Q Service Overview

Sales or FAE help customer

complete request form and

gather data for RD

Check for Spec. and all

document is ready?

Assign H/W and

S/W Engineer

Release solution

(bring up BIOS)

to customer

Request Submitted to AAEON

Sales Sends request form to PM

YESPass

No

BIOS Engineer

Porting bring up BIOS

3 Working days

5 Working days

H/W review

Customer

Customization

Request

Flow Chart

COM (Computer On Module) is a compact CPU board that integrates primary functions into a small form factor module. Simply design your carrier board with I/O ports and enjoy the following benefits:

Easy installation, maintenance and upgrade(((

Faster time to market(((

Cost savings(((

Lower design risks(((

Long-term support(((

Phase 1: H/W Design review servicePhase 2: S/W

bring up BIOS service Phase 3:

On-

Site

sup

port

ser

vice

QService

COM Design Service

Heat Spreader

Carrier Board Design Service

Heatsink

What does the customer need to provide?

Ideal:

Complete carrier board circuit(((

Detailed BIOS Specifications(((

Provide customized carrier board/related devices(((

Requirements:

Key part circuit of carrier board circuit ((( (Super I/O, PCI Routing or special design)

Simple description for BIOS request ((( (ex. BIOS setup default setting……)

On-site Support ServiceCo-Design/Debugging with Customers(((

Shortened development schedule(((

Main Differences - COM ExpressConnector Pin-Out – COM Express

Type 6 & (0: No IDE, PCI support(((

Type 6: ( x USB (.0 support(((

Function Of Connector

Row AB is basic: ((( Provides PCI-E x( / SATA / LAN / USB / LVDS / VGA / TV-out / Express Card / HDA / LPC Bus / WDT / GPO / GPI / SMBus / Power & Ground signals

Row CD is optional: ((( Provides PCI-E x(6 / PCI / IDE / SDVO option / Power & Ground signals

What is COMS (Computer On Module Service)?COMS (Computer On Module Service) is a service for customers who use AAEON’s COM modules. There are three phases for COMS:

Phase 1: Document Support

AAEON provides:

Reference Schematics (((

Design Rules(((

Layout Guidelines(((

Check List(((

Phase 2: Technical Support

AAEON provides:

Professional consultation for carrier board or system design(((

Schematics review of carrier board (upon customer request((((

Phase 3: DTD Services

DTD (Design to Delivery) for custom carrier boards:

The web-enabled DTD services allow you to list all of the requirements you need for your carrier board. AAEON’s DTD team will review the information you provide and offer consultation.

DTD is designed to shorten time to market and ((( minimize loading on your resources.

AAEON will work closely with you to determine detailed ((( specifications of your custom carrier board.

After the specifications are approved, AAEON will deliver ((( a prototype carrier board within (0 working days.

You can focus on your own applications and ((( maximize your resource allocations.

Shorter time to market can lead to higher ((( success rate and larger market share.

You can select different phases and support options based on your needs.

Phase 1: Document Support

Phase 2: Technical Support

Phase

3: D

TD S

ervi

ces

COMS

TypesConnector

Rows

PCI Express Lanes

PEG/SDVO

PCI IDE SATA LANUSB 2.0/ USB 3.0

Display Interfaces

Type 1 A-B Up to 6 — — — 4 1 8 / 0 VGA, LVDS

Type 2 A-B C-D Up to 22 1 / 2 32-bit 1 4 1 8 / 0VGA, LVDS, PEG/ SDVO

Type 6 A-B C-D Up to 24 1 / — — — 4 1 8 / 4 VGA, LVDS, PEG, 3 x DDI

Type 10 A-B Up to 4 — / 1 — — 2 1 8 / 0 LVDS, 1 x DDI

Type 2

Type 1

Type 10

Type 6

Display Interface I/O Interface

SATA

LCD

CRT

DP

GbE

HDA

GPIO

USB

PCI Express

Display InterfaceI/O Interface

PCI

USB3.0

IDE

C D

Display Interface I/O Interface

SATALCD

CRT Type 6

Type 10DDI

DP

GbE

HDA

USB2.0

TX/RX

GPIO

PCI Express

A B

Display InterfaceI/O Interface

PCI Express[x16]

SDVO

PCI Express[x16]

3x DDI

C D

A B

COM.0.R20 Type 1 & Type 2

COM.0.R20 Type 6 & Type 10

AAEON’s Computer On Module Service (COMS) Overview

Comparison Table of ETX/ XTX/ Qseven/ COM Express Modules

Form Factor ETX XTX Qseven COM Express

Size 114 mm x 95 mm 114 mm x 95 mm 70 mm x 70 mm

Ultra (Nano) module: 84 mm x 55 mm Compact module: 95 mm x 95 mm Basic module: 125 mm x 95 mm Extended module: 155 mm x 110 mm

PCB Thickness 1.6mm 1.6mm 1.2mm 2.0mm

Mounting Hole (Default) x 4 x 4 x 4x 4: Ultra (Nano) module, Compact module x 5: Basic module x 7: Extended module

Connector100-pin connector x 4 Supplier: Hirose

100-pin connector x 4 Supplier: Hirose

Module: Edge connector Carrier board: 230-pin MXM connector

220-pin connector x 1 or 2 Supplier: AMP (Tyco)/ Foxconn

Pin-outOne Type, except 1. LVDS/TTL 2. FDD/Parallel Port

One Type, except 1. LVDS/TTL 2. FDD/Parallel Port

One Type Type 1 to Type 10

No. of Vcc 21 24 (X1: 6, X2: 7, x 3 : 5, x 4 : 6) 20 33 (Max.)

Operating Voltage +5V +5V+5V +5VSBY (Optional) Vcc_RTC for RTC battery (Optional, +2.0V~+3.3V)

+12V +5VSBY (Optional) Vcc_RTC for RTC battery (Optional, +2.0V~+3.3V)

Rating Current/Pin 0.4A @ 25°C 0.4A @ 25°C 0.5A @ 25°C 0.5A @ 25°C

Input Power (Max.) Spec: N/A Reference: 42W (21 x 5 x 0.4 = 42)

Spec: N/A Reference: 48W (24 x 5 x 0.4 = 48)

Spec: 12WSpec: 188W (Pin-out Type 2 to 6) (33 x 12 x 0.5 = 198)

PCI Express Lane (Max.) — x 4 x 4 x 22 (Pin-out Type 2) (x 16 for Graphics included)

LVDS (Max.) 24-bit dual-channel 24-bit dual-channel 24-bit dual-channel 24-bit dual-channel

SDVO Channel (Max.) — — x 1 x 2 (Pin-out Type 2)

TMDS/ DVI/ HDMI — — x 1 Being discussed in PICMG

DisplayPort — — x 1 Being discussed in PICMG

PATA Channel (Max.) x 2 x 2 — x 1 (Pin-out Type 2)

SATA Channel (Max.) ETX 3.0 or above: x 2 x 4 x 2 x 4

Audio2-ch audio (Line-in, Line-out, MIC in) (Codec on the module)

2-ch audio on x 1 connector (Line-in, Line-out, MIC in, Codec on the module) AC'97 digital audio interface on X2 connector (One additional signal to disable on-module Codec)

High definition audio interface (Codec on the carrier board)

AC'97 digital audio interface or High definition audio interface (Codec on the carrier board)

LPC Interface — x 1 x 1 x 1

USB 2.0 Port (Max.) x 4 x 6 x 8 (USB Port #1 can be used as USB client port) x 8

LAN (Max.) 10/100 Base-TX x 1 only 10/100 Base-TX x 1 only GbE x 1 10/100 Base-TX or GbE x 1 (Pin-out Type 1/2)

ExpressCard Support (Max.) — x 2 x 2 x 2

Secure Digital I/O — — x 1, 8-bit 4-bit (Multiplexed with GPIO pins)

Low-speed I/O

Signals from the ETX module (Super I/O on the module) ==> COM x 2 ==> FDD or Parallel port x 1 ==> IrDA x 1 ==> K/B and Mouse x 1

Signals from the XTX module (Super I/O on the module) ==> COM x 2 ==> FDD or Parallel port x 1 ==> IrDA x 1 ==> K/B and Mouse x 1

Signals from carrier board (Super I/O on the carrier board)

Signals from carrier board (Super I/O on the carrier board)

SM Bus x 1 x 1 x 1 x 1

I2C Bus x 1 x 1 x 1 x 1

ISA Bus Yes — — —

WDT x 1 x 1 x 1 x 1

Overall Module Height (Recommended)

9.6 mm (From the bottom surface of module to the top surface of heatspreader)



13 mm (From the bottom surface of module to the top surface of heatspreader)

Platform Cost Lower Lower Lower

Higher 1. High-speed signals 2. Power conversion 3. Cost of connectors

Advantage

1. Lower platform cost (but module cost may be higher than COM Express module)

2. Easier design for carrier board3. Well-known specification

1. Lower platform cost (but module cost may be higher than COM Express module)

2. Easier design for carrier board3. Compatible with ETX 2.7 except ISA bus4. Limited to implement serial technologies5. More USB 2.0 ports than ETX6. AC’97 digital audio interface available (Compared

with ETX)7. LPC interface available (Compared with ETX)

1. Lower platform cost (Connectors)2. Introduce serial technologies3. Support new video interfaces4. Suitable for ultra mobile applications5. Standard software API (Application Program

Interface)

1. Introduce serial technologies2. Suitable for the platform with higher power

consumption, ex. GM45 platform3. CPUs with higher TDP and better performance

available4. PICMG defined open standard

Comparison Table of ETX/ XTX/ Qseven/ COM Express Modules

Model Connector

Qseven NanoCOM

Power Consumption Low (Max. ((W( High (Max. in spec.: ((0W(

VGA — Yes

IDE — —

SDVO Down through edge connector SDVO connector on the module

Connector Cost Low High

PCB Cost Almost the same Qseven, (900 mm² vs NanoCOM, (6(0 mm²

Platform Cost Low High

Ruggedized Normal Better

Carrier Board

ECB-916M Rev. A1.0

Type 1, COM.0 Rev. 1.0

ECB-916M Rev. A

2.1Type 1/2, COM

.0 Rev. 1.0

ECB-916M Rev. B1.1

Type 2, COM.0 Rev. 2.0

ECB-951DType 1/2, COM

.0 Rev. 1.0

ECB-917TType 6/10, COM

.0 Rev. 2.0

Module

COM-((SP

COM-((GS

COM-9((

COM-9((GSE

COM-LN A(.0

NanoCOM-LN

COM-QM(7 A(.(

COM-CV A(.0

COM-LN B(.0

NanoCOM-CV A(.0

COM-U((

NanocOM-U((

COM-QM77 B(.0

COM-CV B(.0

NanoCOM-CV B(.0

NanoCOM-TC

Carrier Board ECB-910M ECB-902M ECB-930G

ModuleXTX-CV XTX-9(( XTX-9((GSE

ETX-LN ETX-9((GSE ETX-70( ETX-700"

AQ7-LN

Mechanical Drawings of ETX/ XTX/ Qseven/ COM Express Modules

Support Matrix of AAEON’s ETX/ XTX/ Qseven/ COM Express Carrier Boards

Comparison Table of NanoCOM and Qseven

ETX/ XTX/ Qseven Module

ETX/ XTX/ Qseven Module

COM Express Module

COM Express Module

ColorForm

FactorSize

(Unit: mm)A B C D E F G H

Basic ((( x 9( √ √ √ √ √ — — —

Compact 9( x 9( √ √ — — √ √ — —

Ultra (Nano( 8( x (( — √ — — √ — √ √

Model COM-QM77 Rev.B COM-QM57 COM-CV Rev.A COM-CV Rev.B COM-LN Rev.B

Form FactorCOM Express, Basic Module,

Pin-out Type 6COM Express, Basic Module,

Pin-out Type IICOM Express, Compact Module,

Pin-out Type IICOM Express, Compact Module,

Pin-out Type 6COM Express, Compact Module,

Pin-out Type II

CPUOn board 3rd Gen. Intel® Core™ i7/

i5/i3/Celeron® (FCBGA1023)On board Intel® Core™ i7/ i5/

Celeron® (FCBGA1288)On board Intel® Atom™ N2600/D2550 On board Intel® Atom™ N2600/D2550 On board Intel® Atom™ D525

Chipset Intel® QM77 Intel® QM57 Intel® NM10 Intel® NM10 Intel® ICH8M

Memory Type Non-ECC DDR3 1333/1600 Non-ECC DDR3 800/1066 Non-ECC DDR3 1066 Non-ECC DDR3 1066 Non-ECC DDR3 800

Max. Memory Capacity16GB, DDR3 SODIMM x2

Supports Dual-Channel function8GB, DDR3 SODIMM x 2

Supports Dual-Channel function4GB, DDR3 SODIMM x1 4GB, DDR3 SODIMM x1

4GB, DDR3 SODIMM x 2 Supports Dual-Channel function

Watchdog Timer 255 Levels 255 Levels 255 Levels 255 Levels 255 Levels

Ethernet Intel® 82579LM Intel® 82577LM Intel® 82583V Intel® 82583V Intel® 82567V

VGA/LCD ControllerIntel® Core™ i7/ i5/i3/Celeron®

processor integratedIntel® Core™ i7/ i5/ Celeron®

processor integratedIntel® Atom™ N2600/D2550

processor integratedIntel® Atom™ N2600/D2550

processor integratedIntel® Atom™ D525 integrated

Video Output CRT, LVDS, 2x DDI CRT, LVDS, LCD, DP, DVI, HDMI, SDVO CRT, LVDS, DP CRT, LVDS, DDI CRT, LCD, LVDS

Audio High definition audio interface High definition audio interface High definition audio interface High definition audio interface High definition audio interface

USB Port USB 2.0 x 8, USB 3.0 x4 USB 2.0 x 8 USB 2.0 x8, USB 3.0 x2 USB 2.0 x8, USB 3.0 x2 USB 2.0 x 8

HDD Interface SATA x 4 PATA x 1 (one device), SATA x 4 PATA x1 (One device), SATA x2 SATA x 2 PATA x 1 (Two device), SATA x 3

Expansion SlotPCI-Express [x16] x1 PCI-Express [1] x 7

LPC bus x1, SMBus x 1, COM x 2 (TX/RX)

PCI-Express [x16] x 1PCI-Express [1] x 6

32-bit PCI x 4, LPC bus x 1, SMBus x 1

PCI-Express [1] x 2 LPC bus x1, SMBus x 1

PCI-Express [1] x 4 LPC bus x 1, SMBus x 1, COM x 2 (TX/RX)

PCI-Express [1] x 5 32-bit PCI x 4, LPC bus x 1, SMBus x 1

Power Requirement Nominal: +12V, +8.5V ~ +19V (Optional) Nominal: +12V, +8.5V ~ +19V (Optional) +12V +12V Nominal: +12V, +8.5V ~ +19V (Optional)

Operating Temperature 32°F ~ 140°F (0°C ~ 60°C) 32°F ~ 140°F (0°C ~ 60°C) 32°F ~ 140°F (0°C ~ 60°C) 32°F ~ 140°F (0°C ~ 60°C) 32°F ~ 140°F (0°C ~ 60°C)

Dimension (L x W( 4.92" x 3.74" (125mm x 95mm) 4.92" x 3.74" (125mm x 95mm) 3.74" x 3.74" (95mm x 95mm) 3.74" x 3.74" (95mm x 95mm) 3.74" x 3.74" (95mm x 95mm)

Model COM-TC COM-45SP COM-LN COM-945 COM-945GSE COM-45GS

Form FactorCOM Express, Compact Module,

Pin-out Type IICOM Express, Basic

Module, Pin-out Type IICOM Express, Compact Module, Pin-out Type II

COM Express, Basic Module, Pin-out Type II

COM Express, Compact Module, Pin-out Type II

COM Express, Basic Module,Pin-out Type II

CPUOn board Intel® Atom™

E620/E680Intel® Core™ 2 Duo/ Celeron® M

(Socket-P)Onboard Intel® Atom™

N450/ D410/ D510Intel® Core™ 2 Duo/ Core™ Duo/

Celeron® M (Socket-M)Onboard Intel® Atom™ N270

Intel® Core™ 2 Duo/ Celeron® M(SFF, 22x22 mm)

Chipset Intel® EG20T Intel® GM45 + ICH9M ICH8M Intel® 945GME + ICH7M Intel® 945GSE + ICH7M Intel® GS45 + ICH9M SFF

Memory Type Non-ECC DDR2 667/800 Non-ECC DDR3 800/1066 Non-ECC DDR2 533/667 Non-ECC DDR2 400/533/667 Non-ECC DDR2 400/533 Non-ECC DDR3 800/1066

Max. Memory Capacity 1GB on board8GB, DDR3 SODIMM x 2

Supports dual-channel function4 GB, DDR2 SODIMM x 2 2GB, DDR2 SODIMM x 1 2GB, DDR2 SODIMM x 1

8 GB, DDR3 SODIMM x 2 Supports dual-channel function

Watchdog Timer 255 Levels 255 levels 255 Levels 255 levels 255 levels 255 Levels

Ethernet Realtek RTL8211CL Intel® 82567LM, Gigabit Ethernet Intel® 82567V, Gigabit Ethernet Intel® 82573L, Gigabit Ethernet Intel® 82574L, Gigabit Ethernet Intel® 82567LM, Gigabit Ethernet

VGA/LCD ControllerIntel® Atom™ E6xx processor integrated

Intel® GM45 integrated Intel® N450/ D410/ D510 integrated Intel® 945GME integrated Intel® 945GSE integrated Intel® GS45 integrated

Video Output LVDS, SDVO CRT, LVDS LCD, DisplayPort, HDMI, DVI CRT, LVDS LCD CRT, LVDS LCD CRT, LVDS LCD CRT, LVDS LCD, DisplayPort, HDMI, DVI

Audio High definition audio interface High definition audio interface High definition audio interface High definition audio interface High definition audio interface High definition audio interface

USB Port USB 2.0 x 7 USB2.0 x 8 USB2.0 x 8 USB2.0 x 8 USB2.0 x 8 USB2.0 x 8

HDD InterfacePATA x 1 (One device), SATA x 2 (1)

SATA SSD on board (Master device), Max. 4GB

SATA 2 x 4 PATA x 1 (Two devices), SATA 2 x 3 PATA x 1 (Two devices), SATA x 2 PATA x 1 (Two devices), SATA x 2 PATA x 1 (One device), SATA 2 x 3

Expansion SlotPCI-Express [1] x 2, LPC

bus x 1, SMBus x 1

PCI-Express [x16] x 1, PCI-Express [x1] x 5

32-bit PCI x 4, LPC bus x 1, SMBus x 1, I2C x 1

PCI-Express [x1] x 5 (x 6: Optional) 32-bit PCI x 4,

LPC bus x 1, SMBus x 1, I2C x 1

PCI-Express [x16] x 1PCI-Express [x1] x 3 (Rev. A2.0)PCI-Express [x1] x 5 (Rev. A3.0)


PCI-Express [x1] x 3 (82801GBM) PCI-Express [x1] x 5 (82801GHM) (Optional),


PCI-Express [x16] x 1, PCI-Express [x1] x 5, 32-bit PCI x 4, LPC bus x 1, SMBus x 1, I2C x 1

Power RequirementNominal: +12V,

+8.5V ~ +19V (Optional)Nominal: +12V,


+8.5V ~ +19V (Optional)Nominal: +12V

+8.5V ~ +19V (Optional)Nominal: +12V


+8.5V ~ +19V (Optional)

Operating Temperature 32°F ~ 140°F (0°C ~ 60°C) 32ºF ~ 140ºF (0ºC ~ 60ºC) 32ºF ~ 140ºF (0ºC ~ 60ºC) 32°F ~ 140°F (0°C ~ 60°C) 32ºF ~ 140ºF (0ºC ~ 60ºC) 32°F ~ 140°F (0°C ~ 60°C)

Dimension (L x W( 3.74" x 3.74" (95mm x 95mm) 4.92” x 3.74” (125mm x 95mm) 3.74” x 3.74” (95mm x 95mm) 4.92” x 3.74” (125mm x 95mm) 3.74” x 3.74” (95mm x 95mm) 4.92" x 3.74" (125mm x 95mm)

COM Express Modules

Selection Guide of AAEON’s COM Express Modules

Selection Guide of AAEON’s Qseven/ XTX/ COM Express Modules

Qseven/ XTX CPU Modules

Model AQ7-LN XTX-CV Rev.A XTX-945 XTX-945GSE XTX-U15B Form Factor Qseven Module XTX XTX XTX XTX

CPU On board Intel® Atom™ N450 On board Intel® Atom™ N2600/D2550Intel® Core™ 2 Duo/ Core™ Duo/

Celeron® M (Socket-M)Onboard Intel® Atom™ N270 Onboard Intel® Atom™ Z5x0P(T)

Chipset ICH8M Intel® NM10 Intel® 945GME + ICH7M Intel® 945GSE + ICH7M Intel® System Controller Hub US15WP(T)

Memory Type Non-ECC DDR2 667/800 Non-ECC DDR3 1066 Non-ECC DDR2 400/533/667 Non-ECC DDR2 400/533 Non-ECC DDR2 400/533

Max. Memory Capacity 1GB on board 4GB, DDR3 SODIMM x1 2GB, DDR2 SODIMM x 1 2GB, DDR2 SODIMM x 1 2GB, DDR2 SODIMM x 1

Watchdog Timer 255 Levels 255 Levels 255 Levels 255 Levels 255 Levels

Ethernet Intel® 82567V Realtek RTL8105L Intel® EP82562ET, 10/100Base-TX Intel® EP82562ET, 10/100Base-TX Intel® 82551IT (Default)/ Realtek RTL8139D

VGA/LCD Controller Intel® Atom™ D525 integratedIntel® Atom™ N2600/D2550

processor integratedIntel® 945GME integrated Intel® 945GSE integrated Intel® System Controller Hub US15W integrated

Video Output CRT,LVDS,LCD CRT, LVDS CRT, LVDS LCD CRT, LVDS LCD LVDS LCD, SDVO

Audio High definition audio interface High definition audio interface Realtek ALC655 Realtek ALC655 Realtek AD1819B

USB Port USB 2.0 x 8 USB 2.0 x 6 USB2.0 x 6 USB2.0 x 6 USB2.0 x 6

Serial Port — COM x 2 COM x 2 COM x 2 COM x 2

Parallel Port — — 1 1 1

HDD InterfaceSATA x 2, SATA SSD on board (Master

device), Max. 4GBPATA x 1 (One device)

SATA x 4PATA x 1 (Two devices), SATA x 2 PATA x 1 (Two devices), SATA x 2 PATA x 1 (One device) or SATA 2 x 1

Expansion SlotPCI-Express [1] x 4

LPC bus x 1, SMBus x 1PCI-Express [1] x 4, 32-bit PCI x 2

LPC bus x1, SMBus x 1

PCI-Express [x1] x 4 32-bit PCI x 4, LPC interface x 1

SMBus x 1, I2C x 1

PCI-Express [x1] x 4 32-bit PCI x 4, LPC interface x 1

SMBus x 1, I2C x 1

4-bit SDIO, PCI Express [x1] x 1 (x 4 optional) 32-bit PCI x 4, LPC Interface x 1

SMBus x 1, I2C x 1

Power Requirement + 5V +5V +5V +5V +5 V

Operating Temperature 32°F ~ 140°F (0°C ~ 60°C) 32°F ~ 140°F (0°C ~ 60°C) 32ºF ~ 140ºF (0ºC ~ 60ºC) 32ºF ~ 140ºF (0ºC ~ 60ºC) 32°F ~ 140°F (0°C ~ 60°C)

Dimension (L x W(3.35” x 2.75” (85mm x 70mm) with SSD

2.75” x 2.75” (70mm x 70mm) without SSD4.5” x 3.74” (114mm x 95mm ) 4.5” x 3.74” (114mm x 95mm ) 4.5” x 3.74” (114mm x 95mm) 4.5 x 3.74 (114mm x 95mm)

Model COM-U15 NanoCOM-TC NanoCOM-LN NanoCOM-CV Rev.A NanoCOM-CV Rev.B NanoCOM-U15

Form FactorCOM Express, Compact Module, Pin-out Type II

COM Express, NANO Module, Pin-out Type 10




COM Express, Ultra Nano Module, Pin-out Type I

CPU Onboard Intel® Atom™ Z530/Z510On board Intel® Atom™

E620/E680On board Intel® Atom™ N455 On board Intel® Atom™ N2600 On board Intel® Atom™ N2600 Onboard Intel® Atom™ Z530/Z510

Chipset Intel® System Controller Hub US15W Intel® EG20T Intel® ICH8M Intel® NM10 Intel® NM10 Intel® System Controller Hub US15W

Memory Type Non-ECC DDR2 400/533 Non-ECC DDR2 667/800 Non-ECC DDR3 667 Non-ECC DDR3 1066 Non-ECC DDR3 1066 Non-ECC DDR2 533

Max. Memory Capacity 2GB, DDR2 SODIMM x 1 1GB on board 1GB on board 2GB on board 2GB on board 1GB, on board

Watchdog Timer 255 levels 255 Levels 255 Levels 255 Levels 255 Levels 255 levels

Ethernet Intel® 82574L, Gigabit Ethernet Realtek RTL8211CL Intel® 82567V Intel® 82583V Intel® 82583V Intel® 82574L, Gigabit Ethernet

VGA/LCD ControllerIntel® System Controller Hub US15W integrated

Intel® Atom™ E6xx processor integrated

Intel® Atom™ N455 integratedIntel® Atom™ N2600 processor integrated

Intel® Atom™ N2600 processor integrated

Intel® System Controller Hub US15W integrated

Video Output LVDS LCD, SDVO LVDS, SDVO, LCD CRT, LCD, LVDS CRT, LVDS LVDS, DDI LVDS LCD, SDVO

Audio High definition audio interface High definition audio interface High definition audio interface High definition audio interface High definition audio interface High definition audio interface

USB Port USB2.0 x 8 USB 2.0 x 7 USB 2.0 x 8 USB 2.0 x 8 USB 2.0 x 8 USB2.0 x 8

HDD InterfacePATA SSD on board (Master device),

Max. 4GB, PATA x 1 (One device) or SATA 2 x 1

SATA x 1 SATA SSD on board (Master

device), Max. 4GBPATA x SSD, SATA x 3

SATA x 2 (1), SATA SSD on board (Master device), Max. 16GB

SATA x 2 (1), SATA SSD on board (Master device), Max. 16GB

PATA SSD on board (Master device), Max. 4GB, SATA 2 x 1

Expansion Slot4-bit SDIO: Multiplexed with GPIO pins

PCI-Express [x1] x 1, LPC bus x 1 SMBus x 1

PCI-Express [1] x 2, LPC bus x 1, SMBus x 1

PCI-Express [1] x 5, LPC bus x 1 SMBus x 1, I2C x 1

PCI-Express [1] x 3 LPC bus x1, SMBus x 1

PCI-Express [1] x 3, LPC bus x1, SMBus x 1, COM x 2(TX/RX)

4-bit SDIO: Multiplexed with GPIO pins PCI-Express [x1] x 1, LPC bus x 1

SMBus x 1

Power RequirementNominal: +12V


+4.75V ~ +14.7V (Optional)Nominal: +12V,

+4.75V ~ +14.7V (Optional)Nominal: +12V, +4.75V ~ +14.7V (Optional) Nominal: +12V, +4.75V ~ +14.7V (Optional)

Nominal: +12V+4.75V ~ +14.7V (Optional)

Operating Temperature 32ºF ~ 140ºF (0ºC ~ 60ºC) 32°F ~ 140°F (0°C ~ 60°C) 32°F ~ 140°F (0°C ~ 60°C) 32°F ~ 140°F (0°C ~ 60°C) 32°F ~ 140°F (0°C ~ 60°C) 32ºF ~ 140ºF (0ºC ~ 60ºC)

Dimension (L x W( 3.74” x 3.74” (95mm x 95mm) 3.31" x 2.17" (84mm x 55mm) 3.31" x 2.17" (84mm x 55mm) 3.31" x 2.17" (84mm x 55mm) 3.31" x 2.17" (84mm x 55mm) 3.31” x 2.17” (84mm x 55mm)

COM Express Modules

ETX CPU Modules

Model ETX-LN ETX-945GSE ETX-701 ETX-700Form Factor ETX ETX ETX ETX

CPU Onboard Intel® Atom™ D525/N455/D425 Processors Onboard Intel® Atom™ N270 Onboard AMD Geode™ LX series Onboard AMD Geode™ LX series

Chipset Intel® ICH8M Intel® 945GSE + ICH7M AMD Geode™ LX + CS5536 AMD Geode™ LX + CS5536

Memory Type Non-ECC DDR3 800 Non-ECC DDR2 400/533, Non-ECC DDR 333/400 Non-ECC DDR 333/400

Max. Memory Capacity 2GB, DDR3 SODIMM x1 2 GB, DDR2 SODIMM x 11GB, DDR SODIMM x 1

DDR 333: 1GB, DDR 400: 512MB1GB, DDR SODIMM x 1

DDR 333: 1GB, DDR 400: 512MB

Watchdog Timer 255 Levels 255 Levels 255 Levels 255 Levels

Ethernet Intel® 82567V Intel® EP82562ET, 10/100Base-TX Realtek RTL8139DL, 10/100Base-TX Realtek RTL8139DL, 10/100Base-TX

VGA/LCD Controller Intel® Atom™ D525/N455/D425 integrated Intel® 945GSE integrated AMD LX processor integrated AMD LX processor integrated

Video Output CRT, LCD, LVDS CRT, LVDS LCD, SDVO CRT, LVDS LCD, TTL LCD CRT, LVDS LCD, TTL LCD

Audio Mic-in, Line-in, Line-out Realtek ALC655 Realtek ALC203 Realtek ALC203

USB Port USB 2.0 x 4 USB2.0 x 4 USB2.0 x 4 USB2.0 x 4

Serial Port — COM x 2 COM x 2 COM x 2

Parallel Port — SPP/EPP/ECP x 1 SPP/EPP/ECP x 1 SPP/EPP/ECP x 1

HDD InterfacePATA x1 (two device) or PATA SSD on board, Max 16GB

SATA x2PATA x 1 (Two devices), SATA x 2

CompactFlash™ Type I Slot x 1, PATA x 2 (Four devices), SATA x 2

CompactFlash™ Type I Slot x 1, PATA x 1 (Two devices)

Expansion Slot32-bit PCI x 4, 8/16-bit ISA

SMBus x 1, I2C x 18-bit/ 16-bit ISA, 32-bit PCI x 4

SMBus x 1, I2C x 18-bit/16-bit ISA, 32-bit PCI x 4

SMBus x 1, I2C x 18-bit/16-bit ISA, 32-bit PCI x 4

SMBus x 1 ,I2C x 1

Power Requirement +5V only +5 V +5V +5V

Operating Temperature 32°F ~ 140°F (0°C ~ 60°C) 32°F ~ 140°F (0°C ~ 60°C) 32ºF ~ 140ºF (0ºC ~ 60ºC) 32ºF ~ 140ºF (0ºC ~ 60ºC)

Dimension (L x W( 4.5” x 3.74” (114mm x 95mm) 4.5” x 3.74” (114mm x 95mm) 4.5” x 3.74” (114mm x 95mm) 4.5” x 3.74” (114 mm x 95 mm )

Selection Guide of AAEON’s ETX CPU Modules

AAEON Headquarters AAEON Technology Inc.

5F, No. 135, Lane 235, Pao Chiao Rd., Hsin-Tien Dist, New Taipei City, 231, Taiwan, R.O.C.Tel: +886-2-8919-1234Fax: +886-2-8919-1056E-mail: [email protected] URL: http://www.aaeon.com

LITERATURE ORDERING

Contact local office for literature requests.

Worldwide OfficesAmericas

USA, Hazlet OfficeAAEON Electronics, Inc.3 Crown Plaza, Hazlet, NJ 07730-2441, USATel: 1-732-203-9300 Toll Free No.: 1-888-AAEON-US (1-888-223-6687)Fax: 1-732-203-9311 Sales E-mail: [email protected] Tech Support E-mail: [email protected] Tel: 1-732-203-9300 x-125URL: http://www.aaeonusa.com

USA, Brea OfficeAAEON Electronics, Inc.2663 Saturn Street, Brea, CA 92821, USATel: 714-996-1800Toll Free No.: 877-TO-AAEON (877-862-2366)Fax: 714-996-1811Sales E-mail: [email protected] Tech Support E-mail: [email protected] Tel: 1-732-203-9300 x-125URL: http://www.aaeonusa.com

Europe

Netherlands AAEON EUROPEEkkersrijt 4002, 5692 DA Son, The NetherlandsTel: +31-(0)499-462020Fax: +31-(0)499-462010E-mail: [email protected]

Germany AAEON Technology GmbHAn der Trift 65d, D-63303 Dreieich, GermanyTel: +49(0)61033 74 79 00 Fax: +49(0)61033 74 79 49 E-mail: [email protected]

Asia

SingaporeAAEON Technology Singapore PTE LTD.57 Genting Lane, #07-00, Singapore 349564Tel: +65-6749-8749Fax: +65-6746-1595E-mail: [email protected]

Asia

ChinaShanghai Branch Office20F, Unit D, GEM Building, No.487 Tianlin Road, Xuhui District, Shanghai, China Tel: +86-021-3367-5511 Fax: +86-021-3367-4238 E-mail: [email protected]

Beijing Branch OfficeRM. 606-608 Block D, Jiahua Building, No.9, Shang Di San Street, Hai Dian District, Beijing, ChinaTel: +86-10-8278-0904Fax: +86-10-8278-0214 E-mail: [email protected]

Shenzhen Branch OfficeRoom 1806, Block C, Huangdu Square, No.3008 Yitian Road, Futian District, Shenzhen, ChinaTel: +86-755-8304-7277 Fax: +86-755-8304-7272 E-mail: [email protected]

AAEON Technology (Su Zhou) Inc.Room 12, 2F, Building B, No.5 Xing Han Street, Suzhou Industrial Park, Jiang Su Province, China Tel: +86-512-6762-5700 Fax: +86-512-6761-7337E-mail: [email protected]

MKT-((0((0(

www.aaeon.com

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