CMOS LDO Regulators for Automotive Equipments 1ch …

Product structure：Silicon monolithic integrated circuit This product is not designed protection against radioactive rays .

1/35 TSZ02201-0RBR0A300020-1-2© 2012 ROHM Co., Ltd. All rights reserved.

2014.02.17 Rev.003TSZ22111・14・001

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Datasheet

CMOS LDO Regulators for Automotive Equipments

1ch 200mA CMOS LDO Regulators BUxxSD2-M series

General Description

BUxxSD2-M series are high-performance CMOS LDO regulators with output current ability of up to 200-mA. These devices have excellent noise and load response characteristics despite of its low circuit current consumption of 33µA. They are most appropriate for various applications such as power supplies for logic IC, RF, and camera modules.

Features

High Output Voltage Accuracy: ±2.0% (In all recommended conditions)

High Ripple Rejection: 68 dB (Typ, 1 kHz,) Compatible with small ceramic capacitor

(Cin=Cout=0.47 µF) Low Current Consumption: 33 µA Output Voltage ON/OFF control Built-in Over Current Protection Circuit (OCP) Built-in Thermal Shutdown Circuit (TSD) Package SSOP5 is similar to SOT23-5(JEDEC)

Applications Automotive equipments. Portable devices Camera modules Other electronic devices using microcontrollers or

logic circuits AEC-Q100 qualified

Key Specifications Input Power Supply Voltage Range: 1.7V to 6.0V Output Current Range: 0 to 200mA Operating Temperature Range: -40 to +105 Output Voltage Lineup: 1.2V,1.5V,1.8V,2.5V

2.8V,3.0V,3.3V Output Voltage Accuracy: ±2.0% Circuit Current: 33µA(Typ.) Standby Current: 0μA (Typ.)

Package W(Typ.) x D(Typ.) x H(Max.)

SSOP5 2.90mm x 2.80mm x 1.25mm

Typical Application Circuit

Figure 1. Typical Application Circuit

Vin

Cin Cout

VoutVIN VOUT

STBYGND

On

Off

BUxxSD2MG-M

Vin

Cin Cout

VoutVIN VOUT

STBYGND

On

Off

BUxxSD2MG-M

Vin

Cin Cout

VoutVIN VOUT

STBYGND

On

Off

BUxxSD2MG-MBUxxSD2-M

DatasheetDatasheet


2014.02.17 Rev.003

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TSZ22111・15・001

BUxxSD2-M series

Figure 2. Block diagram

Cin(min)=0.47µF (Ceramic)

Cout(min)=0.47µF (Ceramic)

Pin Configuration Pin Description

Pin No. Symbol Function

1 VIN Input Pin

2 GND GND Pin

3 STBY Output Control Pin (High:ON, Low:OFF)

4 N.C. No Connect

5 VOUT Output Pin

Block Diagram

Lot. No Marking

VOUT N.C.

VIN GND STBY

1

3

5

2

Cin

VIN

GND

STBY VSTBY

VOUT VOUT

Cout

VREF

STBY

TSD

VIN

N.C. 4

OCP

DatasheetDatasheet


2014.02.17 Rev.003

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TSZ22111・15・001

BUxxSD2-M series

Absolute Maximum Ratings

Parameter Symbol Rating Unit

Maximum Power Supply Voltage Range VMAX -0.3 to +6.5 V

Power Dissipation Pd 540(*1) mW

Maximum Junction Temperature Tjmax +125

Operating Temperature Range Topr -40 to +105

Storage Temperature Range Tstg -55 to +125

(*1) Derate by 5.6mW/ when operating above Ta=25.(When mounted on a board 70mm×70mm×1.6mm glass-epoxy board, two layer) Recommended Operating Ratings

Parameter Symbol Limit Unit

Input Power Supply Voltage Range VIN 1.7 to 6.0 V

Maximum Output Current IMAX 200 mA

Recommended Operating Conditions

Parameter Symbol Rating

Unit Conditions Min. Typ. Max.

Input capacitor Cin 0.47(*2) 1.0 － µF A ceramic capacitor is recommended.

Output capacitor Cout 0.47(*2) 1.0 － µF A ceramic capacitor is recommended.

(*2) Set the value of the capacitor so that it does not fall below the minimum value. Take into consideration the temperature characteristics, DC device characteristics, and degradation with time.

DatasheetDatasheet


2014.02.17 Rev.003

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TSZ22111・15・001

BUxxSD2-M series

Electrical Characteristics (Unless otherwise noted, Ta=-40 to 105, VIN=VOUT+1.0V(*3), VSTBY=1.5V, Cin=1μF, Cout=1μF.)

PARAMETER Symbol Limit Unit Conditions MIN. TYP. MAX.

Output Voltage VOUT VOUT ×0.98 VOUT VOUT

×1.02 V

IOUT=0 to 200mA, VOUT≧2.5V, VIN=VOUT+0.5 to 6.0V VOUT＜2.5V, VIN=3.0 to 6.0V Ta=-40 to +105 (*4,5,6)

Line Regulation VDLI - 4 10 mV IOUT=10mA

VOUT≦2.5V, VIN=3.0 to 6.0V

6 15 mV IOUT=10mA VOUT＞2.5V, VIN=VOUT+0.5 to 6.0V

Load Regulation1 VDLO1 - 0.5 5 mV IOUT=1 to 100mA Load Regulation2 VDLO2 - 1 10 mV IOUT=1 to 200mA

Dropout Voltage VDROP

- 400 700 mV 1.0V≦VOUT＜1.2V, IOUT=100mA - 280 550 mV 1.2V≦VOUT＜1.5V, IOUT=100mA - 180 370 mV 1.5V≦VOUT＜1.7V, IOUT=100mA - 150 290 mV 1.7V≦VOUT＜2.1V, IOUT=100mA - 110 220 mV 2.1V≦VOUT＜2.5V, IOUT=100mA - 100 180 mV 2.5V≦VOUT＜2.8V, IOUT=100mA - 85 150 mV 2.8V≦VOUT, IOUT=100mA

Maximum Output Current IOMAX 200 - - mA VIN=VOUT+1.0V (*3) Limit Current ILMAX 250 400 - mA Vo=VOUT×0.98, Ta=25 Short Current ISHORT - 100 200 mA Vo=0V, Ta=25 Circuit Current IGND - 33 80 µA IOUT=0mA Circuit Current (STBY) ICCST - - 2.0 µA VSTBY=0V Ripple Rejection Ratio R.R. - 68 - dB VRR=-20dBv,fRR=1kHz,IOUT=10mA

Load Transient Response VLOT - ±65 - mV IOUT=1 to 150mA,Trise=Tfall=1µs, VIN=VOUT+1.0V (*5)

Line Transient Response VLIT - ±5 - mV VIN=VOUT+0.5 to VOUT+1.0V, Trise=Tfall =10µs

Output Noise Voltage VNOIS - 30 - µVrms Bandwidth 10 to 100kHz

Startup Time TST - 100 300 µsec Output Voltage settled within tolerances (*7)

STBY Control Voltage

ON VSTBH 1.1 - VIN V Ta=25 OFF VSTBL -0.2 - 0.5 V

STBY Pin Current ISTBY - - 4.0 µA

(*3) VIN=3.5V for VOUT＜2.5V.

(*4) Operating Conditions are limited by Pd.

(*5) Typical values apply for Ta=25.

(*6) VIN=3.0V to 6.0V for VOUT＜2.5V.

(*7) Startup time=time from EN assertion to VOUT×0.98

DatasheetDatasheet


2014.02.17 Rev.003

www.rohm.com

TSZ22111・15・001

BUxxSD2-M series

Reference data BU12SD2MG-M (Unless otherwise specified, Ta=25.)

0

5

10

15

20

25

30

35

40

45

50

0.0 1.0 2.0 3.0 4.0 5.0 6.0Input Voltage VIN (V)

Circ

uit C

urre

nt IG

ND

(μA

)

1.15

1.16

1.17

1.18

1.19

1.20

1.21

1.22

1.23

1.24

1.25

0 50 100 150 200

Output Current IOUT (mA)

Out

put V

olta

ge V

OU

T (V

)1.15

1.16

1.17

1.18

1.19

1.20

1.21

1.22

1.23

1.24

1.25


Out

put V

olta

ge V

OU

T (V

)0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4


Out

put V

olta

ge V

OU

T (V

)

Figure 3. Output Voltage vs. Input Voltage Figure 4. Line Regulation

Figure 5. Circuit Current vs. Input Voltage Figure 6. Load Regulation

Ta=25 VIN=VSTBY Ta=25

VIN=VSTBY

VIN=VSTBY IOUT=0mA

VIN=3.5V VSTBY=1.5V

Ta=105Ta=25Ta=-40

Ta=25Ta=105Ta=-40

IOUT=0mAIOUT=50mAIOUT=200mA


DatasheetDatasheet


2014.02.17 Rev.003

www.rohm.com

TSZ22111・15・001

BUxxSD2-M series


0

10

20

30

40

50

60

70

80

90

100

-40 -20 0 20 40 60 80 100Temperature Ta ()

Circ

uit C

urre

nt IG

ND

(μA

)0

10

20

30

40

50

60

70

80

90

100

0 50 100 150 200Output Current IOUT (mA)

Circ

uit C

urre

nt IG

ND

(μA

)

1.15

1.16

1.17

1.18

1.19

1.20

1.21

1.22

1.23

1.24

1.25

-40 -20 0 20 40 60 80 100Temperature Ta ()

Out

put V

olta

ge V

OU

T (V

)

0.00

0.20

0.40

0.60

0.80

1.00

1.20

1.40

0 100 200 300 400 500Output Current IOUT (mA)

Out

put V

olta

ge V

OU

T (V

)

Figure 7. Circuit Current vs. Output Current Figure 8. OCP Threshold

Figure 9. Output Voltage vs. Temperature Figure 10. Circuit Current vs. Temperature

VIN=3.5V VSTBY=1.5V

Ta=25 VSTBY=1.5V

VIN=3.5V VSTBY=1.5V IOUT=0.1mA


Ta=105Ta=25Ta=-40

VIN=6.0VVIN=3.5VVIN=3.0V

DatasheetDatasheet


2014.02.17 Rev.003

www.rohm.com

TSZ22111・15・001

BUxxSD2-M series


0

10

20

30

40

50

60

70

80

90

100

-40 -20 0 20 40 60 80 100Temperature Ta ()

Circ

uit C

urre

nt a

t STB

Y IC

CS

T (n

A)

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

0.0 1.0 2.0 3.0 4.0 5.0 6.0STBY Pin Voltage VSTBY (V)

STB

Y P

in C

urre

nt IS

TBY (μ

A)

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4


Out

put V

olta

ge V

OU

T (V

)

Figure 11. STBY Threshold Figure 12. Circuit Current ( at STBY) vs. Temperature

Figure 13. STBY Pin Current vs. STBY Pin Voltage

VIN=3.5V IOUT=0.1mA

VIN=6.0V VSTBY=0V

Ta=105Ta=25Ta=-40

Ta=105Ta=25Ta=-40

DatasheetDatasheet


2014.02.17 Rev.003

www.rohm.com

TSZ22111・15・001

BUxxSD2-M series


0

10

20

30

40

50

60

70

80

90

100

100 1000 10000 100000Frequency (Hz)

Rip

ple

Rej

ectio

n R

atio

R.R

. (dB

)

0

5

10

15

20

25

30

35

40

45

50


Out

put N

oise

Vol

tage

VN

OIS

(μV

rms )

Figure 14. Ripple Rejection Ratio vs. Frequency

Ta=25 VIN=3.5V VRR=-20dBv VSTBY=1.5V IOUT=10mA Cin=Cout=1µF

Figure 15. Output Noise Voltage vs. Output Current

0.01

0.1

1

10

10 100 1000 10000 100000Frequency (Hz)

Out

put S

pect

ral N

oise

Den

sity

(μV

/√

Hz )

Figure 16.Output Spectral Noise Density vs. Frequency

Ta=25 VIN=3.5V VSTBY=1.5V Cin=Cout=1µF Bndwidth 10 to 100kHz

Ta=25 VIN=3.5V VSTBY=1.5V IOUT=10mA Cin=Cout=1µF

DatasheetDatasheet


2014.02.17 Rev.003

www.rohm.com

TSZ22111・15・001

BUxxSD2-M series


VOUT

IOUT=10mA1.18

1.22

1.20

Out

put V

olat

age(

V)

1ms/div

VIN=VSTBY

20mV/div

2.0V/div

0.0

4.0

2.0

6.0

Input Voltage(V

)3.0V

6.0V

Slew Rate＝1V/μs

Cout=1.0μF

VOUT

IOUT=10mA1.18

1.22

1.20

Out

put V

olat

age(

V)

1ms/div

VIN=VSTBY

20mV/div

2.0V/div

0.0

4.0

2.0

6.0

Input Voltage(V

)3.0V

3.5V

Slew Rate＝1V/μs

Cout=1.0μF

VIN=3.5V,VSTBY=1.5V

VOUT

IOUT 1mA

150mA

Trise＝Tfall=1μs,Cin=Cout=1μF

100mA/div

100mV/div

20μs/div

0

200

100

Output C

urrent(mA

)

1.10

1.30

1.20

Out

put V

olat

age(

V)

VIN=3.5V,VSTBY=1.5V

VOUT

IOUT 1mA

100mA

100mA/div

100mV/div1.10

1.30

1.20

Out

put V

olat

age(

V) 20μs/div


0

200

100

Output C

urrent(mA

)

Figure 19. Line Transient Response (3.0 to 3.5V)


Figure 18. Load Response (1mA to 150mA)


DatasheetDatasheet


2014.02.17 Rev.003

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TSZ22111・15・001

BUxxSD2-M series


VSTBY

VOUT

Cout=0.47μFCout=1.0μFCout=2.2μF

1.0V/div

0.0

2.0

1.0

Out

put V

olat

age(

V) 20μs/div

VIN=3.5V

0V

1.5V

0.0

2.0

1.0

STB

Y Pin V

oltage(V)

1.0V/div

VSTBY

VOUT


1.0V/div

0.0

2.0

1.0

Out

put V

olat

age(

V) 400ms/div

VIN=3.5V

0V

1.5V

0.0

2.0

1.0

STB

Y Pin V

oltage(V)

1.0V/div

VSTBY

VOUT Cout=0.47μFCout=1.0μFCout=2.2μF

0.0

2.0

1.0

Out

put V

olat

age(

V)

VIN=3.5V

0V

1.5V

0.0

2.0

1.0

STB

Y Pin V

oltage(V)

1.0V/div

20μs/div

1.0V/div

VSTBY


0.0

2.0

1.0

Out

put V

olat

age(

V)

VIN=3.5V

0V

1.5V

0.0

2.0

1.0

STB

Y Pin V

oltage(V)

1.0V/div

20μs/div

1.0V/div

Figure 21. Startup Time (ROUT=none)

Figure 22. Startup Time (ROUT=6Ω)

Figure 23. Discharge Time (ROUT=none)

Figure 24. Discharge Time (ROUT=6Ω)

DatasheetDatasheet


2014.02.17 Rev.003

www.rohm.com

TSZ22111・15・001

BUxxSD2-M series


0

10

20

30

40

50

60


Circ

uit C

urre

nt IG

ND

(μA

)

1.75

1.76

1.77

1.78

1.79

1.80

1.81

1.82

1.83

1.84

1.85

0 50 100 150 200


Out

put V

olta

ge V

OU

T (V

)1.75

1.76

1.77

1.78

1.79

1.80

1.81

1.82

1.83

1.84

1.85


Out

put V

olta

ge V

OU

T (V

)0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0


Out

put V

olta

ge V

OU

T (V

)



Ta=25 VIN=VSTBY

Ta=25 VIN=VSTBY

VIN=VSTBY IOUT=0mA

VIN=3.5V VSTBY=1.5V

Ta=105Ta=25Ta=-40

Ta=25Ta=-40Ta=105



DatasheetDatasheet


2014.02.17 Rev.003

www.rohm.com

TSZ22111・15・001

BUxxSD2-M series


0

10

20

30

40

50

60

70

80

90

100

-40 -20 0 20 40 60 80 100Temperature Ta ()

Circ

uit C

urre

nt IG

ND

(μA

)0

10

20

30

40

50

60

70

80

90

100

0 50 100 150 200Outut Current IOUT (mA)

Circ

uit C

urre

nt IG

ND

(μA

)

1.75

1.76

1.77

1.78

1.79

1.80

1.81

1.82

1.83

1.84

1.85

-40 -20 0 20 40 60 80 100Temperature Ta ()

Out

put V

olta

ge V

OU

T (V

)

0.00

0.20

0.40

0.60

0.80

1.00

1.20

1.40

1.60

1.80

2.00


Out

put V

olta

ge V

OU

T (V

)



VIN=3.5V VSTBY=1.5V

Ta=25 VSTBY=1.5V



Ta=105Ta=25Ta=-40 VIN=6.0V

VIN=3.5VVIN=3.0V

DatasheetDatasheet


2014.02.17 Rev.003

www.rohm.com

TSZ22111・15・001

BUxxSD2-M series


0

10

20

30

40

50

60

70

80

90

100

-40 -20 0 20 40 60 80 100Temperature Ta ()

Circ

uit C

urre

nt a

t STB

Y IC

CS

T (n

A)

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0


STB

Y P

in C

urre

nt IS

TBY (μ

A)

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0


Out

put V

olta

ge V

OU

T (V

)

Figure 33. STBY Threshold Figure 34. Circuit Current (at STBY) vs. Temperature


VIN=3.5V IOUT=0.1mA

VIN=6.0V VSTBY=0V

Ta=105Ta=25Ta=-40

Ta=105Ta=25Ta=-40

DatasheetDatasheet


2014.02.17 Rev.003

www.rohm.com

TSZ22111・15・001

BUxxSD2-M series


0

10

20

30

40

50

60

70

80

90

100

100 1000 10000 100000Frequency (Hz)

Rip

ple

Rej

ectio

n R

atio

R.R

. (dB

)

0

5

10

15

20

25

30

35

40

45

50


Out

put N

oise

Vol

tage

VN

OIS

(μV

rms )


Ta=25 VIN=3.5V VRR=-20dBv VSTBY=1.5V IOUT=10mA Cin=Cout=1μF


Ta=25 VIN=3.5V VSTBY=1.5V Cin=Cout=1μF Bndwidth 10 to 100kHz


0.01

0.1

1

10

10 100 1000 10000 100000Frequency (Hz)

Out

put S

pect

ral N

oise

Den

sity

(μV

/√

Hz )

Ta=25 VIN=3.5V VSTBY=1.5V IOUT=10mA Cin=Cout=1μF

DatasheetDatasheet


2014.02.17 Rev.003

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TSZ22111・15・001

BUxxSD2-M series


VOUT

IOUT=10mA1.78

1.82

1.80

Out

put V

olat

age(

V) 1ms/div

VIN=VSTBY

20mV/div

2.0V/div

0.0

4.0

2.0

6.0

Input Voltage(V)3.0V

6.0V

Slew Rate＝1V/μs

Cout=1.0μF

VOUT

IOUT=10mA1.78

1.82

1.80

Out

put V

olat

age(

V)

1ms/div

VIN=VSTBY

20mV/div

2.0V/div

0.0

4.0

2.0

6.0

Input Voltage(V

)3.0V

3.5V

Slew Rate＝1V/μs

Cout=1.0μF

VIN=3.5V,VSTBY=1.5V

VOUT

IOUT 1mA

150mA


100mA/div

100mV/div

20μs/div

0

200

100

Output C

urrent(mA

)

1.70

1.90

1.80

Out

put V

olat

age(

V)

VIN=3.5V,VSTBY=1.5V

VOUT

IOUT 1mA

100mA

100mA/div

100mV/div1.70

1.90

1.80

Out

put V

olat

age(

V) 20μs/div


0

200

100

Output C

urrent(mA

)





DatasheetDatasheet


2014.02.17 Rev.003

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TSZ22111・15・001

BUxxSD2-M series


VSTBY

VOUT


1.0V/div

0.0

2.0

1.0

Out

put V

olat

age(

V) 20μs/div

VIN=3.5V

0V

1.5V

0.0

2.0

1.0

STB

Y Pin V

oltage(V)

1.0V/div

VSTBY

VOUTCout=0.47μFCout=1.0μFCout=2.2μF

1.0V/div

0.0

2.0

1.0

Out

put V

olat

age(

V) 400ms/div

VIN=3.5V

0V

1.5V

0.0

2.0

1.0

STB

Y Pin V

oltage(V)

1.0V/div

VSTBY


0.0

2.0

1.0

Out

put V

olat

age(

V)

VIN=3.5V

0V

1.5V

0.0

2.0

1.0

STB

Y Pin V

oltage(V)

1.0V/div

20μs/div

1.0V/div

VSTBY


0.0

2.0

1.0

Out

put V

olat

age(

V)

VIN=3.5V

0V

1.5V

0.0

2.0

1.0

STB

Y Pin V

oltage(V)

1.0V/div

20μs/div

1.0V/div


Figure 44. Startup Time (ROUT=9Ω)


Figure 46. Discharge Time (ROUT=9Ω)

DatasheetDatasheet


2014.02.17 Rev.003

www.rohm.com

TSZ22111・15・001

BUxxSD2-M series


0

10

20

30

40

50

60


Circ

uit C

urre

nt IG

ND

(μA

)

2.45

2.46

2.47

2.48

2.49

2.50

2.51

2.52

2.53

2.54

2.55

0 50 100 150 200


Out

put V

olta

ge V

OU

T (V

)2.45

2.46

2.47

2.48

2.49

2.50

2.51

2.52

2.53

2.54

2.55


Out

put V

olta

ge V

OU

T (V

)0.0

0.5

1.0

1.5

2.0

2.5

3.0


Out

put V

olta

ge V

OU

T (V

)



Ta=25 VIN=VSTBY

Ta=25 VIN=VSTBY

VIN=VSTBY IOUT=0mA

VIN=3.5V VSTBY=1.5V

Ta=105Ta=25Ta=-40 Ta=25

Ta=-40Ta=105



DatasheetDatasheet


2014.02.17 Rev.003

www.rohm.com

TSZ22111・15・001

BUxxSD2-M series


0

10

20

30

40

50

60

70

80

90

100

-40 -20 0 20 40 60 80 100Temperature Ta ()

Circ

uit C

urre

nt IG

ND

(μA

)0

10

20

30

40

50

60

70

80

90

100


Circ

uit C

urre

nt IG

ND

(μA

)

2.45

2.46

2.47

2.48

2.49

2.50

2.51

2.52

2.53

2.54

2.55

-40 -20 0 20 40 60 80 100Temperature Ta ()

Out

put V

olta

ge V

OU

T (V

)

0.00

0.50

1.00

1.50

2.00

2.50

3.00


Out

put V

olta

ge V

OU

T (V

)



VIN=3.5V VSTBY=1.5V

Ta=25 VSTBY=1.5V



Ta=105Ta=25Ta=-40 VIN=3.0V

VIN=6.0VVIN=3.5V

DatasheetDatasheet


2014.02.17 Rev.003

www.rohm.com

TSZ22111・15・001

BUxxSD2-M series


0

10

20

30

40

50

60

70

80

90

100

-40 -20 0 20 40 60 80 100Temperature Ta ()

Circ

uit C

urre

nt a

t STB

Y IC

CS

T (n

A)

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0


STB

Y P

in C

urre

nt IS

TBY (μ

A)

0

50

100

150

200

250

300

350

400

450

500


Dro

pout

Vol

tage

VD

RO

P (m

V)

0.0

0.5

1.0

1.5

2.0

2.5

3.0


Out

put V

olta

ge V

OU

T (V

)


Figure 57. STBY Pin Current vs. STBY Pin Voltage Figure 58. Dropout Voltage vs. Output Current

VIN=3.5V IOUT=0.1mA

VIN=6.0V VSTBY=0V

VIN=0.98*VOUT VSTBY=1.5V

Ta=105Ta=25Ta=-40

Ta=105Ta=25Ta=-40

Ta=105Ta=25Ta=-40

DatasheetDatasheet


2014.02.17 Rev.003

www.rohm.com

TSZ22111・15・001

BUxxSD2-M series


0

5

10

15

20

25

30

35

40

45

50


Out

put N

oise

Vol

tage

VN

OIS

(μV

rms )

0

10

20

30

40

50

60

70

80

90

100

100 1000 10000 100000Frequency (Hz)

Rip

ple

Rej

ectio

n R

atio

R.R

. (dB

)




0.01

0.1

1

10

10 100 1000 10000 100000Frequency (Hz)

Out

put S

pect

ral N

oise

Den

sity

(μV

/√

Hz )




DatasheetDatasheet


2014.02.17 Rev.003

www.rohm.com

TSZ22111・15・001

BUxxSD2-M series


VOUT

IOUT=10mA2.48

2.52

2.50

Out

put V

olat

age(

V)

1ms/div

VIN=VSTBY

20mV/div

2.0V/div

0.0

4.0

2.0

6.0

Input Voltage(V

)3.0V

6.0V

Slew Rate＝1V/μs

Cout=1.0μF

VOUT

IOUT=10mA2.48

2.52

2.50

Out

put V

olat

age(

V)

1ms/div

VIN=VSTBY

20mV/div

2.0V/div

0.0

4.0

2.0

6.0

Input Voltage(V

)3.0V

3.5V

Slew Rate＝1V/μs

Cout=1.0μF

VIN=3.5V,VSTBY=1.5V

VOUT

IOUT 1mA

150mA


100mA/div

100mV/div

20μs/div

0

200

100

Output C

urrent(mA

)

2.40

2.60

2.50

Out

put V

olat

age(

V)

VIN=3.5V,VSTBY=1.5V

VOUT

IOUT 1mA

100mA

100mA/div

100mV/div2.40

2.60

2.50

Out

put V

olat

age(

V) 20μs/div


0

200

100

Output C

urrent(mA

)





DatasheetDatasheet


2014.02.17 Rev.003

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TSZ22111・15・001

BUxxSD2-M series


VSTBY


1.0V/div

0.0

2.0

1.0

Out

put V

olat

age(

V) 20μs/div

VIN=3.5V

0V

1.5V

0.0

2.0

1.0

STB

Y Pin Voltage(V

)

1.0V/div

VSTBY


1.0V/div

0.0

2.0

1.0

Out

put V

olat

age(

V) 400ms/div

VIN=3.5V

0V

1.5V

0.0

2.0

1.0

STB

Y Pin V

oltage(V)

1.0V/div

VSTBY

VOUT

Cout=0.47μFCout=1.0μFCout=2.2μF0.0

2.0

1.0

Out

put V

olat

age(

V)

VIN=3.5V

0V

1.5V

0.0

2.0

1.0

STB

Y Pin V

oltage(V)

1.0V/div

20μs/div

1.0V/div

VSTBY

VOUT

Cout=0.47μFCout=1.0μFCout=2.2μF0.0

2.0

1.0

Out

put V

olat

age(

V)

VIN=3.5V

0V

1.5V

0.0

2.0

1.0

STB

Y Pin V

oltage(V)

1.0V/div

20μs/div

1.0V/div


Figure 67. Startup Time (ROUT=12.5Ω)


Figure 69. Discharge Time (ROUT=12.5Ω)

DatasheetDatasheet


2014.02.17 Rev.003

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TSZ22111・15・001

BUxxSD2-M series


3.25

3.26

3.27

3.28

3.29

3.30

3.31

3.32

3.33

3.34

3.35

0 50 100 150 200


Out

put V

olta

ge V

OU

T (V

)

0

10

20

30

40

50

60

70


Circ

uit C

urre

nt IG

ND

(μA

)

3.25

3.26

3.27

3.28

3.29

3.30

3.31

3.32

3.33

3.34

3.35


Out

put V

olta

ge V

OU

T (V

)0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5


Out

put V

olta

ge V

OU

T (V

)



Ta=25 VIN=VSTBY

Ta=25 VIN=VSTBY

VIN=VSTBY IOUT=0mA

VIN=4.3V VSTBY=1.5V

IOUT=0m AIOUT=50m AIOUT=200m A

IOUT=0m AIOUT=50m AIOUT=200m A

Ta=105Ta=25Ta=-40

Ta=25Ta=-40Ta=105

DatasheetDatasheet


2014.02.17 Rev.003

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TSZ22111・15・001

BUxxSD2-M series


0.00

0.50

1.00

1.50

2.00

2.50

3.00

3.50


Out

put V

olta

ge V

OU

T (V

)

0

10

20

30

40

50

60

70

80

90

100

-40 -20 0 20 40 60 80 100Temperature Ta ()

Circ

uit C

urre

nt IG

ND

(μA

)

3.25

3.26

3.27

3.28

3.29

3.30

3.31

3.32

3.33

3.34

3.35

-40 -20 0 20 40 60 80 100Temperature Ta ()

Out

put V

olta

ge V

OU

T (V

)

0

10

20

30

40

50

60

70

80

90

100


Circ

uit C

urre

nt IG

ND

(μA

)



VIN=4.3V VSTBY=1.5V

Ta=25 VSTBY=1.5V



Ta=105Ta=25Ta=-40

VIN=3.0VVIN=3.5VVIN=6.0V

DatasheetDatasheet


2014.02.17 Rev.003

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TSZ22111・15・001

BUxxSD2-M series

Reference data BU33SD2MG-M (Unless otherwise specified, Ta=25.) 0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0


STB

Y P

in C

urre

nt IS

TBY (μ

A)

0

10

20

30

40

50

60

70

80

90

100

-40 -20 0 20 40 60 80 100Temperature Ta ()

Circ

uit C

urre

nt a

t STB

Y IC

CS

T (n

A)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5


Out

put V

olta

ge V

OU

T (V

)



VIN=4.3V IOUT=0.1mA

VIN=6.0V VSTBY=0V

Ta=105Ta=25Ta=-40

Ta=105Ta=25Ta=-40

0

50

100

150

200

250

300

350

400

450

500


Dro

pout

Vol

tage

VD

RO

P (m

V)

Ta=105Ta=25Ta=-40

Figure 81. Dropout Voltage vs. Output Current

VIN=0.98*VOUT VSTBY=1.5V

DatasheetDatasheet


2014.02.17 Rev.003

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TSZ22111・15・001

BUxxSD2-M series


0

5

10

15

20

25

30

35

40

45

50

0 50 100 150 200


Out

put N

oise

Vol

tage

VN

OIS

(μV

rms )

0.01

0.1

1

10

10 100 1000 10000 100000Frequency (Hz)

Out

put S

pect

ral N

oise

Den

sity

(μV

/√

Hz )

0

10

20

30

40

50

60

70

80

90

100

100 1000 10000 100000Frequency (Hz)

Rip

ple

Rej

ectio

n R

atio

R.R

. (dB

)







DatasheetDatasheet


2014.02.17 Rev.003

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TSZ22111・15・001

BUxxSD2-M series


VIN=4.3V,VSTBY=1.5V

VOUT

IOUT 1mA

150mA


100mA/div

100mV/div

20μs/div

0

200

100

Output C

urrent(mA

)

3.20

3.40

3.30

Out

put V

olat

age(

V)

VIN=4.3V,VSTBY=1.5V

VOUT

IOUT 1mA

100mA

100mA/div

100mV/div3.20

3.40

3.30

Out

put V

olat

age(

V) 20μs/div


0

200

100

Output C

urrent(mA)

VOUT

IOUT=10mA3.28

3.32

3.30

Out

put V

olat

age(

V) 1ms/div

VIN=VSTBY

20mV/div

2.0V/div

0.0

4.0

2.0

6.0

Input Voltage(V)

3.8V

6.0V

Slew Rate＝1V/μs

Cout=1.0μF

VOUT

IOUT=10mA3.28

3.32

3.30

Out

put V

olat

age(

V)

1ms/div

VIN=VSTBY

20mV/div

2.0V/div

0.0

4.0

2.0

6.0

Input Voltage(V

)

3.8V

4.3V

Slew Rate＝1V/μs

Cout=1.0μF





DatasheetDatasheet


2014.02.17 Rev.003

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TSZ22111・15・001

BUxxSD2-M series


VSTBY


1.0V/div

0.0

2.0

1.0

Out

put V

olat

age(

V) 40μs/div

VIN=3.5V

0V

1.5V

0.0

2.0

1.0

STB

Y Pin V

oltage(V)

1.0V/div

3.0

VSTBY


1.0V/div

0.0

2.0

1.0

Out

put V

olat

age(

V) 1.0s/div

VIN=3.5V

0V

1.5V

0.0

2.0

1.0

STB

Y Pin V

oltage(V)

1.0V/div

3.0

VSTBY

VOUT


VIN=4.3V

0V

1.5V

0.0

2.0

1.0

STB

Y Pin V

oltage(V)

1.0V/div

20μs/div

1.0V/div

0.0

2.0

1.0

Out

put V

olat

age(

V) 3.0

VSTBY

VOUT


VIN=4.3V

0V

1.5V

0.0

2.0

1.0

STB

Y Pin V

oltage(V)

1.0V/div

20μs/div

1.0V/div

0.0

2.0

1.0

Out

put V

olat

age(

V) 3.0


Figure 90. Startup Time (ROUT=16.5Ω)


Figure 92. Discharge Time (ROUT=16.5Ω)

DatasheetDatasheet


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TSZ22111・15・001

BUxxSD2-M series

Figure 94. Stability area characteristics (Example)

Input/Output Capacitor

It is recommended that an input capacitor is placed near pins between the VCC pin and GND as well as an output capacitor between the output pin and GND. The input is valid when the power supply impedance is high or when the PCB trace has significant length. For the output capacitor, the greater the capacitance, the more stable the output will be depending on the load and line voltage variations. However, please check the actual functionality of this capacitor by mounting it on a board for the actual application. Ceramic capacitors usually have different, thermal and equivalent series resistance characteristics, and may degrade gradually over continued use. For additional details, please check with the manufacturer, and select the best ceramic capacitor for your application

Equivalent Series Resistance (ESR) of a Ceramic Capacitor

Capacitors generally have ESR (equivalent series resistance) and it operates stably in the ESR-IOUT area shown on the right. Since ceramic capacitors, tantalum capacitors, electrolytic capacitors, etc. generally have different ESR, please check the ESR of the capacitor to be used and use it within the stability area range shown in the right graph for evaluation of the actual application.

Capacity value of ceramic capacitor - DC bias characteristics(Example)

-100

-90

-80

-70

-60

-50

-40

-30

-20

-10

0

10

0 0.5 1 1.5 2 2.5 3 3.5 4

DC Bias Voltage [V]

Cap

acita

nce

Cha

nge

[%]

10-V withstand voltageB1characteristicsGRM188B11A105KA61D

10-V withstand voltageB characteristics

6.3-V withstand voltageB characteristics

4-V withstand voltageX6S characteristics

10-V withstand voltageF characteristics

10-V withstand voltageF characteristics

Figure 93. Capacity-bias characteristics

0.01

0.1

1

10

100

0 50 100 150 200IOUT[mA]

ES

R[Ω

]

Stable regionCin=Cout=0.47μF　Ta=-40 to 105

Stable region

Unstable region

DatasheetDatasheet


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TSZ22111・15・001

BUxxSD2-M series

Power Dissipation (Pd) As for power dissipation, an estimate of heat reduction characteristics and internal power consumption of IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original IC performance, such as causing the operation of the thermal shutdown circuit or reduction in current capability. Therefore, be sure to prepare sufficient margin within power dissipation for usage. Calculation of the maximum internal power consumption of IC (PMAX) PMAX=(VIN-VOUT)×IOMAX Where : VIN=Input voltage VOUT= Output voltage IOMAX: Maximum output current) Measurement conditions

Standard ROHM Board

Layout of Board for Measurement

IC Implementation Position

Top Layer (Top View)

Bottom Layer (Top View) Measurement State With board implemented (Wind speed 0 m/s)

Board Material Glass epoxy resin (Double-side board)

Board Size 70 mm x 70 mm x 1.6 mm

Wiring Rate Top layer Metal (GND) wiring rate: Approx. 0%

Bottom layer Metal (GND) wiring rate: Approx. 50%

Through Hole Diameter 0.5mm x 6 holes

Power Dissipation 0.54W

Thermal Resistance θja=185.2/W

* Please design the margin so that PMAX is less than Pd (PMAX<Pd) within the usage temperature range

Figure 95. SSOP5 Power dissipation heat reduction characteristics (Reference)

0

0.1

0.2

0.3

0.4

0.5

0.6

0 25 50 75 100 125

Ta ()

Pd (

W)

0.54W

105

Standard ROHMboard

DatasheetDatasheet


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TSZ22111・15・001

BUxxSD2-M series

I/O Equivalence Circuits

5pin (VOUT) 2pin (GND) 3pin (STBY) 1pin (VIN)

Figure 96. Input / Output equivalent circuit

VOUT

VIN

VOUT

VIN

DatasheetDatasheet


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TSZ22111・15・001

BUxxSD2-M series

Operational Notes 1) Absolute maximum ratings

This product is produced with strict quality control, however it may be destroyed if operated beyond its absolute maximum ratings. In addition, it is impossible to predict all destructive situations such as short-circuit modes, open circuit modes, etc. Therefore, i t is impor tant to cons ider c i rcu i t protect ion measures, l ike adding a fuse, in case the IC is operated in a spec ia l mode exceeding the absolute maximum rat ings.

2) GND Potential GND potential must be the lowest potential of all pins of the IC at all operating conditions. Ensure that no pins are at a voltage below the ground pin at any time, even during transient condition.

3) Setting of Heat Carry out the heat design that have adequate margin considering Pd of actual working states.

4) Pin Short and Mistake Fitting When mounting the IC on the PCB, pay attention to the orientation of the IC. If there is mistake in the placement, the IC may be burned up.

5) Actions in Strong Magnetic Field

Using the IC within a strong magnetic field may cause the IC to malfunction. 6) Mutual Impedance

Use short and wide wiring tracks for the power supply and ground to keep the mutual impedance as small as possible. Use a capacitor to keep ripple to a minimum.

7) STBY Pin Voltage

To enable standby mode for all channels, set the STBY pin to 0.5 V or less, and for normal operation, to 1.1 V or more. Setting STBY to a voltage between 0.5 and 1.1 V may cause malfunction and should be avoided. Keep transition time between high and low (or vice versa) to a minimum. Additionally, if STBY is shorted to VIN, the IC will switch to standby mode and disable the output discharge circuit, causing a temporary voltage to remain on the output pin. If the IC is switched on again while this voltage is present, overshoot may occur on the output. Therefore, in applications where these pins are shorted, the output should always be completely discharged before turning the IC on.

8) Over Current Protection Circuit Over current and short circuit protection is built-in at the output, and IC destruction is prevented at the time of load short circuit. These protection circuits are effective in the destructive prevention by sudden accidents, please avoid applications to where the over current protection circuit operates continuously.

9) Thermal Shutdown This IC has Thermal Shutdown Circuit (TSD Circuit). When the temperature of IC Chip is higher than 175, the output is turned off by TSD Circuit. TSD Circuit is only designed for protecting IC from thermal over load. Therefore it is not recommended that you design application where TSD will work in normal condition.

10) Actions under Strong light A strong light like a halogen lamp may be caused malfunction. In our testing, fluorescence light and white LED causes little effects for the IC, but infrared light causes strong effects on the IC. The IC should be shielded from light like sunrays or halogen lamps.

11) Output capacitor To prevent oscillation at output, it is recommended that the IC be operated at the stable region shown in Figure 94. It operates at the capacitance of more than 0.47μF. As capacitance is larger, stability becomes more stable and characteristic of output load fluctuation is also improved.

DatasheetDatasheet


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TSZ22111・15・001

BUxxSD2-M series

Ordering Information Marking Diagram

xx Output Voltage Marking12 1.2V typ. M315 1.5V typ. NV18 1.8V typ. M425 2.5V typ. M528 2.8V typ. NW30 3.0V typ. NX33 3.3V typ. NY

Part Number Marking

SSOP5(TOP VIEW)

LOT Number

ｘｘ

ROHM

Part No.

Output voltagexx=12:1.2Vxx=15:1.5Vxx=18:1.8Vxx=25:2.5Vxx=28:2.8Vxx=30:3.0Vxx=33:3.3V

2B U x

GradeM;Automotive Accessories

PackageG: SSOP5

Series nameSD2M:High-speed load response　 Low noise

　 Shutdown SW

Packaging and forming specificationsTR:Embossed tape and reel (SSOP5)

x S R- M TM GD

DatasheetDatasheet


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TSZ22111・15・001

BUxxSD2-M series

Physical Dimension Tape and Reel Information Package Name SSOP5

DatasheetDatasheet


2014.02.17 Rev.003

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TSZ22111・15・001

BUxxSD2-M series

Revision History

Date Revision Changes

21.Dec.2012 001 New Release

19.Mar.2013 002 1) 4 devices (1.5V,2.8V,3.0V,3.3V) are added to the Output Voltage Lineup. 2) Some graphs are added to the Reference data.

17.Feb.2014 003 Graphs about BU33SD2 are added to the Reference data.

DatasheetDatasheet

Notice - SS Rev.002© 2014 ROHM Co., Ltd. All rights reserved.

Notice Precaution on using ROHM Products

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA

CLASSⅢ CLASSⅢ

CLASSⅡb CLASSⅢ

CLASSⅣ CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance. For details, please refer to ROHM Mounting specification

DatasheetDatasheet

Notice - SS Rev.002© 2014 ROHM Co., Ltd. All rights reserved.

Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

DatasheetDatasheet

Notice – WE Rev.001© 2014 ROHM Co., Ltd. All rights reserved.

General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information.

CMOS LDO Regulators for Automotive Equipments 1ch …

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